JP2003007780A - Mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device where load resistance to tracking force improves, the elastic deformation of a top plate and the distortion of a bottom plate are prevented, the air tightness of a mounting object is improved and highly reliable inspection can be performed. SOLUTION: Mounting device 1 has a mounting body 2 which has a space formed between the top plate 2A and the bottom plate 2B having an outer peripheral wall 2D, and mounts a wafer W on the top plate 2A and with a temperature control mechanism controlling the temperature of the wafer W on the mounting body 2. When the electric characteristic of the wafer W is inspected, the temperature of the wafer W on the mounting body 2 is controlled through the temperature control mechanism. A case 2C storing the bottom plate 2B is placed and a plurality of support bodies 2E are diffusively arranged for the whole space. The top plate 2A is supported through the support bodies 2E.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device used in, for example, a probe device, and more particularly to a mounting device capable of improving load resistance during probe inspection.

[0002]

2. Description of the Related Art A probe apparatus is provided with a mounting apparatus for mounting an object to be inspected such as a wafer and performing predetermined electric characteristics. Since the test object heats up as it is inspected, the test object is cooled via the mounting device, or depending on the type of the test object, the test device is set to a high temperature or a low temperature. May be inspected.

A conventional mounting apparatus includes, for example, a mounting body that also serves as a cooling jacket, a heater, and an elevating / lowering body. When cooling, a cooling medium is supplied to the cooling jacket to cool the upper surface of the mounting body. When the inspection body is cooled to a predetermined temperature and heated, the mounting body is heated by using a heater to heat the inspection body on the mounting body to the predetermined temperature.

Further, a plurality of lifting pins are provided inside the mounting body so that the lifting pins can be moved up and down, and the object to be inspected is delivered through these lifting pins. When inspecting an object to be inspected, the mounting body is raised to overdrive the object to be inspected, and the electrode pad of the object to be inspected is brought into contact with the probe arranged above the electrode pad with a predetermined needle pressure to make the object to be inspected. We are inspecting the electrical characteristics of the inspection body.

[0005]

However, in the case of the conventional mounting apparatus, since the mounting body is formed in a hollow shape by the top plate and the bottom plate having the outer peripheral wall, the mounting body is overdriven. When needle pressure is applied to the electrode pad of the device under test from the probe, the top plate of the mounting body is elastically deformed and sunk by the needle pressure, causing the probe to shift from the electrode pad and the bottom plate to some extent. However, there is a risk of distortion and deterioration of inspection reliability. In particular, a slight misalignment may become a serious problem as the inspected body becomes ultra-fine.

The present invention has been made in order to solve the above-mentioned problems, and has improved load resistance against stylus pressure, and prevents elastic deformation of the top plate and distortion of the bottom plate.
Moreover, it is an object of the present invention to provide a mounting apparatus that can perform highly reliable inspection by increasing the airtightness of the mounting body.

[0007]

According to a first aspect of the present invention, there is provided a mounting apparatus in which a top plate and a bottom plate having an outer peripheral wall are overlapped with each other to form a space therein, and an object to be inspected is placed on the top plate. A mounting body to be mounted and a temperature adjusting mechanism for adjusting the temperature of the object to be inspected on the mounting body are provided, and when performing the electrical characteristic inspection of the object to be inspected, the temperature adjusting mechanism is used. In the mounting device for adjusting the temperature of the object to be inspected on the mounting body, a case for accommodating the bottom plate is provided, and a plurality of supporting bodies are dispersed and arranged in the entire space, and the supporting body is interposed via these supporting bodies. It is characterized by supporting a top plate.

Further, the mounting device according to a second aspect of the present invention is characterized in that, in the invention according to the first aspect, the plurality of supports are integrally formed with the bottom plate. is there.

Further, the mounting device according to claim 3 of the present invention is characterized in that, in the invention according to claim 1 or 2, the case is formed of a material having a higher elastic modulus than the bottom plate. It is what

Further, according to a fourth aspect of the present invention, in the mounting device according to the first to third aspects, a plurality of heat medium supply ports are dispersed in each of the bottom plate and the case. It is characterized in that a smaller number of heat medium discharge ports than the heat medium supply ports are dispersed and provided.

Further, a mounting device according to a fifth aspect of the present invention is characterized in that, in the invention according to the fourth aspect, a supply nozzle is replaceably attached to each of the heat medium supply ports. Is.

Further, the mounting apparatus according to claim 6 of the present invention is the mounting apparatus according to any one of claims 1 to 5, wherein the top plate and the support are each inspected. It is characterized in that an exhaust path for sucking a body is provided in series.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on the embodiments shown in FIGS. Placement device 1 of the present embodiment
For example, as shown in FIG. 1, a mounting body 2 on which an object to be inspected (for example, a wafer) W is mounted, a temperature adjusting mechanism for adjusting the temperature of the mounting body 2, and a mounting body 2 are supported. Base 3 to
An elevating body 4 for elevating and lowering the mounting body 2 in the Z direction via the base 3 is provided, and the temperature of the wafer W on the mounting body 2 is adjusted via a temperature adjusting mechanism to control the temperature of the wafer W at a predetermined temperature. It is configured to perform an electrical characteristic inspection of the inspection body. The mounting device 1 is configured to be movable in the X and Y directions via an XY drive mechanism in an inspection chamber (not shown) of the probe device, and is moved up and down in the Z direction via an elevating body 4. It is configured to be possible. Further, the mounting body 2 itself is configured to be rotatable in the θ direction in the predetermined direction through a θ drive mechanism (not shown). A probe card (not shown) is arranged above the placement device 1, and the placement device 1 cooperates with an alignment mechanism (not shown), as is well known in the art, at the time of inspection on the placement body 2. After aligning the wafer W with the probe of the probe card, the wafer W is index-fed to electrically contact the electrode pad of the wafer W and the probe, and the electrical characteristic inspection of the wafer W is repeated.

As shown in FIGS. 1 to 3, the mounting body 2 has a circular top plate 2A having a ceramic heater (not shown) made of, for example, aluminum nitride.
A bottom plate 2B having a slightly smaller diameter for supporting the top plate 2A, and a case 2C having the same outer diameter as the top plate 2A in which the bottom plate 2B is housed. A space is formed between 2B. As shown in FIGS. 1 to 3, the bottom plate 2B has an outer peripheral wall 2D formed along the outer peripheral edge thereof, and is made of ceramic such as machinable ceramic. On the inner surface of the bottom plate 2B, a large number of prismatic supports 2E are formed integrally with the bottom plate 2B by ceramics. As shown in FIG. 3, these supports 2E are dispersed and arranged in a matrix on the entire surface of the bottom plate 2B, and cooperate with the outer peripheral wall 2D to support the top plate 2A as shown in FIG. Therefore, no matter where the stylus pressure acts on the wafer W on the top plate 2A, the support body 2E exists immediately below or in the vicinity of the stylus pressure, so that the top plate 2A does not bend and has a high load resistance. It has become. The outer peripheral wall 2F of the case 2C is in contact with the top plate 2A together with the outer peripheral wall 2D of the bottom plate 2B by a metal such as aluminum having a higher elastic modulus than the bottom plate 2B.
The airtightness with Therefore, the bottom plate 2B
Is strongly reinforced by the case 2C to prevent distortion.

As shown in FIG. 2A, the bottom plate 2B and the case 2C have, for example, eight heat medium supply ports (hereinafter simply referred to as "supply ports") 2G and two heat mediums. Each of the discharge ports 2H is provided, and a refrigerant as a heat medium is supplied from each of the supply ports 2G to directly cool the top plate 2A, and the endothermic refrigerant is discharged from the discharge port 2H. A gas such as air can be used as the refrigerant. In this embodiment, for example, air is used as the refrigerant. Of the eight supply ports 2G, the four first supply ports 2G are arranged at vertically and horizontally symmetrical positions, and a regular quadrangle is formed by connecting the supply ports 2G. Further, the other four second supply ports 2G are arranged outside the midpoint of each side of the regular quadrangle. The two outlets 2H are arranged on the diameter of the bottom plate 2B as shown in FIGS. 2 (a) and 2 (b). Two second supply ports 2G are also located on this straight line. Further, a supply nozzle 5 (see (a) of FIG. 4) is attached to each of the eight supply ports 2G, and a refrigerant is ejected from each supply nozzle 5. As shown by the arrow in FIG. 1, the injected refrigerant sews the gap between the supports 2E in the mounting body 2 and instantly spreads throughout the internal space. Since the refrigerant forms a turbulent flow through the support 2E, the top plate 2A can be efficiently cooled. The refrigerant that has spread all over the mounting body 2 is
As indicated by the arrow in FIG. 1, the light is focused on two discharge ports 2H near the center of the mounting body 2 and discharged from these discharge ports 2H. A discharge nozzle (not shown) formed similarly to the supply nozzle 5 is attached to the discharge port 2H, and is discharged to the outside through the discharge nozzle. The area of the opening 5A of the supply nozzle 5 is set smaller than the opening area of the discharge nozzle, so that the refrigerant can be supplied from the supply nozzle 5 at a higher speed.
It is designed to spread more quickly within the mounting body 2.

Further, a plurality of supply nozzles 5 (see FIG. 4A) and discharge nozzles are embedded in the base 3 in a replaceable manner, and these supply nozzles 5 and discharge nozzles are shown in FIG. Also, it is attached to the supply port 2G and the discharge port 2H of the mounting body 2 shown in FIG. 3 to form a flow path as shown in FIG. The supply nozzle 5 and the discharge nozzle are connected to a supply source and a discharge means via an air supply pipe (not shown) and a discharge pipe (not shown), respectively. All of these supply nozzles 5 branch from the air supply pipe to communicate with the eight supply ports 2G of the mounting body 2, and the discharge nozzles 3B also branch from the discharge pipe to discharge two places of the mounting body 2. Exit 2
It communicates with H. Since the supply nozzle 5 and the discharge nozzle are configured to be replaceable as described above, they can be replaced appropriately according to the specifications of the mounting apparatus 1.
It is also possible to prepare a plurality of different diameters and shapes.

Further, as shown in FIG. 3, a vacuum exhaust passage 2I used for vacuum suction of the wafer W is formed in the plurality of supports 2E arranged in a straight line in the radial direction in the mounting body 2. Each of these vacuum exhaust passages 2I is open at a plurality of circular grooves 2J formed concentrically on the surface of the top plate 2A. As shown in FIG. 3, a long hole 2K is formed in the case 2C in accordance with the range in which the plurality of vacuum exhaust passages 2I are arranged, and the vacuum exhaust nozzle 6 (see FIG. 4B) is mounted in the long hole 2K. Has been done. The vacuum exhaust nozzle 6 is integrally formed with a plurality of nozzles 6A corresponding to the vacuum exhaust passage 2I. Then, the exhaust passages (not shown) of the plurality of nozzles merge in the vacuum exhaust nozzle 6, and the vacuum exhaust device is connected to the opening of the merge passage. Vacuum exhaust nozzle 6
Are embedded in the base 3 like the supply nozzle 5 and the discharge nozzle. Further, in the vicinity of the center of the mounting body 2, holes 2L for raising and lowering a plurality of (for example, three) raising and lowering pins (not shown) are formed on the same circumference at equal intervals in the circumferential direction. The lift pins project from the top plate 2 </ b> A when the wafer W is transferred, and retract within the mounting body 2 after the wafer W is transferred.

Further, as shown in FIG. 1, the temperature adjusting mechanism comprises a heater built in the top plate 2A, a coolant supply nozzle 2G and a discharge nozzle 2H, and is controlled by a controller (not shown). When heating the wafer W, the heater operates, and when cooling the wafer W, the coolant is supplied and discharged through the supply nozzle 2G in the mounting body 2. Since the heater is built in the top plate 2A, the wafer W is directly heated, so that the wafer W can be heated to a predetermined set temperature in a short time. Further, the coolant forms a turbulent flow from the supply port 2G to the entire space inside the mounting body 2 and spreads in a short time, and moreover, the top plate 2A is directly cooled by the coolant, so that the wafer W is cooled in a short time. You can

Next, the operation will be described. First, when the wafer W is transferred to the mounting body 2 via a transfer mechanism (not shown), the wafer W is received via the lift pins and mounted on the top plate 2A. Next, after the air is exhausted from the vacuum exhaust nozzle 6 and the wafer W is vacuum-adsorbed and fixed onto the top plate 2A, the mounting apparatus 1 moves in the X, Y, Z and θ directions and cooperates with the alignment mechanism. Then, the wafer W and the probe are aligned with each other. Then, for example, the wafer W
When the high temperature inspection is performed, the heater operates to heat the wafer W to a predetermined temperature during the alignment.

Subsequently, the mounting table 1 index-feeds the wafer W to move it directly below the probe, and then overdrives the wafer W via the elevating body 4 to electrically contact the wafer W with the probe. At this time, although the needle pressure acts on the wafer W, the top plate 2A is not supported by the support member 2.
Since the top plate 2A is supported by E, there is no risk of elastic deformation of the top plate 2A, the probe is not displaced from the electrode pad of the wafer W, and the high temperature inspection of the wafer W can be reliably performed. When the index W is repeated and the high temperature inspection of the wafer W is completed, the temperature control mechanism turns off the power of the heater, and the air is cooled by the refrigerant from the eight supply ports 2G through the respective supply nozzles 5 into the mounting body 2. Supply as. When air is ejected from each supply nozzle 5 as indicated by an arrow in FIG. 1, as shown in FIG. The temperature of the top plate 2A is lowered by cooling the top plate 2A in a short time. The heat absorbing air is discharged from the discharge port 2H as shown by the arrow in FIG.

As described above, according to this embodiment,
A plurality of supports 2E are dispersed and arranged in a matrix in the entire space inside the mounting body 2, and the top plate 2A is supported via these supports 2E, and the bottom plate 2B is the case 2C.
Since it is reinforced by the needle W, even if stylus pressure acts on the wafer W when inspecting the wafer W, the point of action of stylus pressure is directly above or in the vicinity of the support 2E.
In combination with the reinforcing action of No. 2, it is possible to prevent the top plate 2A from sinking (elastically deforming), and by eliminating the positional deviation between the electrode of the wafer W and the probe, it is possible to perform highly reliable inspection. Further, when the mounting body 2 is cooled using the refrigerant, the cooling medium spreads throughout the space inside the mounting body 2 while forming a turbulent flow through the support body 2E, so that the cooling capacity of the refrigerant should be maximized. You can

Further, according to this embodiment, since the plurality of supports 2E are integrally formed with the bottom plate 2B, they can be formed with high precision by using a mold or the like. Further, since the plurality of supply ports 2G are provided in the bottom plate 2B in a dispersed manner, and the discharge ports 2H, which are smaller in number than the supply ports 2G, are provided in a dispersed manner, and the supply ports 2G are provided in a larger number than the discharge ports 2H, the supply nozzle 5 is used. And fresh refrigerant (air in this embodiment)
Can be supplied vigorously to bring them into uniform contact with all areas of the top plate 2A at high speed, and at the same time, the endothermic refrigerant can be focused to extend the residence time of the refrigerant, which in turn cools the top plate 2A. You can

Further, according to this embodiment, since the case 2C is made of a material having a higher elastic modulus than the bottom plate 2B, the outer peripheral wall 2F of the case 2C has the bottom plate 2B.
B is more accustomed to contact with the top plate 2A than the outer peripheral wall 2D, and the outer peripheral walls 2F, 2D are both sealed.
At the same time, the contact area with the top plate 2A increases, and the airtightness of the mounting body 2 can be further increased. Further, since the supply nozzle 5 is mounted so as to be replaceable, if the supply nozzle 5 having different diameters of the air supply holes is prepared according to the flow rate of the air, the supply nozzle 5 can be adjusted according to the air flow rate at that time.
Can be replaced as appropriate. Further, since the vacuum discharge passage 2I for sucking the wafer W is continuously provided to each of the top plate 2A and the support body 2E, it is not necessary to provide a unique pipe for the vacuum exhaust in the mounting body 2, and the structure is It can be simplified.

The present invention is not limited to the above embodiment, and the design of each constituent element of the present invention can be changed as necessary. For example, although the support is integrally formed with the bottom plate in this embodiment, the support may be integrally formed with the top plate.

[0025]

According to the invention described in claim 1 of the present invention, the load resistance with respect to the stylus pressure is improved, the elastic deformation of the top plate and the distortion of the bottom plate are prevented, and moreover, the mounting also serves as a cooling jacket. It is possible to provide a mounting device capable of increasing the airtightness of the body and performing highly reliable inspection.

Further, according to the invention described in claim 2 of the present invention, it is possible to provide a mounting device which can be molded with high precision by a mold or the like in the invention described in claim 1.

Further, according to the invention of claim 3 of the present invention, in the invention of claim 1 or 2,
It is possible to provide a mounting device in which the case is more adapted to contact with the top plate than the bottom plate, and the airtightness is enhanced, and the airtightness of the mounting body is enhanced.

Further, according to the invention described in claim 4 of the present invention, in the invention described in any one of claims 1 to 3, fresh refrigerant is supplied through a plurality of heat medium supply ports. It can be supplied vigorously and can be brought into uniform contact with all areas of the top plate at high speed, and the endothermic refrigerant can be focused to prolong the residence time of the refrigerant, which in turn can cool the top plate in a short time. A mounting device can be provided.

According to the invention of claim 5 of the present invention, in the invention of claim 4, if plural kinds of supply nozzles having different diameters and shapes of the air supply holes are prepared, It is possible to provide a mounting device in which the supply nozzle can be appropriately replaced according to the specifications such as the flow rate of the heat medium at that time.

According to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, for vacuum exhaust when sucking the object to be inspected. It is not necessary to provide a unique pipe in the mounting body, and it is possible to provide a mounting device that can simplify the structure.

[Brief description of drawings]

FIG. 1 is a schematic diagram for explaining a main part of an embodiment of a mounting device of the present invention.

2A and 2B are enlarged views of the bottom plate shown in FIG. 1, in which FIG. 2A is a plan view thereof, and FIG. 2B is a sectional view taken along line BB thereof.

FIG. 3 is an exploded perspective view showing a main part of the mounting body shown in FIG.

4A and 4B are views showing nozzles used in the mounting body shown in FIG. 1, FIG. 4A is a perspective view showing a supply nozzle, and FIG. 4B is a perspective view showing a vacuum exhaust nozzle.

[Explanation of symbols]

1 Placement device 2 Placement 2A top plate 2B bottom plate 2C case 2E support 2G supply port (heat medium supply port) 5 supply nozzles 2I Vacuum exhaust path (exhaust path)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yasuji Hiramatsu             1-1 Ibiden Co., Ltd., Ibikawa-cho, Ibi-gun, Gifu Prefecture             Inside the company F-term (reference) 4M106 AA01 BA01 DJ02

Claims (6)

[Claims] 1. A mounting body for stacking a top plate and a bottom plate having an outer peripheral wall to form a space therein and mounting the inspection object on the top plate, and an inspection object on the mounting object. In a mounting device having a temperature adjusting mechanism for adjusting a temperature, when performing an electrical characteristic inspection of the inspected object, the temperature of the inspected object on the above-mentioned object is adjusted via the temperature adjusting mechanism. A mounting device, characterized in that a case for accommodating the bottom plate is provided, a plurality of supports are dispersedly arranged in the entire space, and the top plate is supported through these supports. 2. The mounting device according to claim 1, wherein the plurality of supports are integrally formed with the bottom plate. 3. The mounting device according to claim 1, wherein the case is made of a material having a higher elastic modulus than the bottom plate. 4. The bottom plate and the case are each provided with a plurality of heat medium supply ports in a dispersed manner, and at the same time, a plurality of heat medium discharge ports are provided in a dispersed manner less than the heat medium supply ports. The mounting device according to claim 1. 5. A supply nozzle is replaceably attached to each of the heat medium supply ports.
The mounting device according to. 6. The exhaust passage for sucking the object to be inspected is connected to each of the top plate and the support body, and the exhaust gas passage according to any one of claims 1 to 5, wherein: Placement device.