JP7258098B2 - フォトニック結晶面発光レーザ構造 - Google Patents
フォトニック結晶面発光レーザ構造 Download PDFInfo
- Publication number
- JP7258098B2 JP7258098B2 JP2021165412A JP2021165412A JP7258098B2 JP 7258098 B2 JP7258098 B2 JP 7258098B2 JP 2021165412 A JP2021165412 A JP 2021165412A JP 2021165412 A JP2021165412 A JP 2021165412A JP 7258098 B2 JP7258098 B2 JP 7258098B2
- Authority
- JP
- Japan
- Prior art keywords
- photonic crystal
- semiconductor layer
- type semiconductor
- emitting laser
- surface emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004038 photonic crystal Substances 0.000 title claims description 94
- 239000004065 semiconductor Substances 0.000 claims description 140
- 238000005253 cladding Methods 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 37
- 230000000737 periodic effect Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 7
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 6
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- IHGSAQHSAGRWNI-UHFFFAOYSA-N 1-(4-bromophenyl)-2,2,2-trifluoroethanone Chemical compound FC(F)(F)C(=O)C1=CC=C(Br)C=C1 IHGSAQHSAGRWNI-UHFFFAOYSA-N 0.000 description 4
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 4
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 2
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- DLISVFCFLGSHAB-UHFFFAOYSA-N antimony arsenic Chemical compound [As].[Sb] DLISVFCFLGSHAB-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 2
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 2
- -1 indium gallium arsenide nitride Chemical class 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- HOHAQBNFPZHTJB-UHFFFAOYSA-N beryllium gold Chemical compound [Be].[Au] HOHAQBNFPZHTJB-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- SAOPTAQUONRHEV-UHFFFAOYSA-N gold zinc Chemical compound [Zn].[Au] SAOPTAQUONRHEV-UHFFFAOYSA-N 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18322—Position of the structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/11—Comprising a photonic bandgap structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18377—Structure of the reflectors, e.g. hybrid mirrors comprising layers of different kind of materials, e.g. combinations of semiconducting with dielectric or metallic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
- H01S5/18391—Aperiodic structuring to influence the near- or far-field distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/185—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3095—Tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3415—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers containing details related to carrier capture times into wells or barriers
- H01S5/3416—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers containing details related to carrier capture times into wells or barriers tunneling through barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Description
101 第1の電極
102 第2の電極
103 第1のP型半導体層
110 基板
120 N型クラッド層
130 活性層
140 メタサーフェス構造
150 フォトニック結晶構造
150A 半導体層
151 ベース
152 周期的なホール
160 P型クラッド層
170 第1のN型半導体層
180 電子閉じ込め層
190 トンネル接合
191 第2のP型半導体層
192 第2のN型半導体層
LB レーザビーム
M 領域
W1、W2、W3 幅
X 第2の方向
Y 第1の方向
θ 夾角
Claims (18)
- 基板と、
前記基板の上に設けられるN型クラッド層と、
前記N型クラッド層の上に設けられる活性層と、
前記活性層の上に設けられるフォトニック結晶構造と、
前記フォトニック結晶構造の上に設けられるP型クラッド層と、
前記P型クラッド層の上に設けられる第1のN型半導体層と、
前記第1のN型半導体層内に設けられるトンネル接合と、
前記第1のN型半導体層の前記P型クラッド層と反対側の表面に位置するメタサーフェス構造と、
を備え、
前記メタサーフェス構造は、前記第1のN型半導体層と一体的に成形される微細構造を含む、フォトニック結晶面発光レーザ構造。 - 前記基板、前記N型クラッド層及び前記活性層は、1つの方向に沿って配列され、前記メタサーフェス構造は、レーザビームが前記方向に対して傾斜して出射するように配置される請求項1に記載のフォトニック結晶面発光レーザ構造。
- 前記レーザビームと前記方向との間の最大夾角は90度である請求項2に記載のフォトニック結晶面発光レーザ構造。
- 前記メタサーフェス構造は、レーザビームが同時に複数の異なる方向へ出射するように配置される請求項1に記載のフォトニック結晶面発光レーザ構造。
- 前記メタサーフェス構造は、前記第1のN型半導体層の前記P型クラッド層と反対側の前記表面を局所的に覆うとともに、前記第1のN型半導体層に接触する請求項1~4のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記第1のN型半導体層の前記P型クラッド層と反対側の前記表面の上に設けられるとともに、前記メタサーフェス構造を取り囲む金属電極を更に備える請求項1~5のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記トンネル接合の断面積は、前記メタサーフェス構造の面積よりも小さい請求項1~6のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記トンネル接合の前記基板への垂直投影領域は、前記メタサーフェス構造の前記基板への垂直投影領域内にある請求項1~7のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記基板、前記N型クラッド層及び前記活性層は、第1の方向に沿って配列され、前記第1の方向に垂直である第2の方向において、前記トンネル接合の幅は、前記メタサーフェス構造の幅よりも小さい請求項1~8のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記トンネル接合の断面積は、前記フォトニック結晶構造の断面積よりも小さい請求項1~9のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記トンネル接合の前記基板への垂直投影領域は、前記フォトニック結晶構造の前記基板への垂直投影領域内にある請求項1~10のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記基板、前記N型クラッド層及び前記活性層は、第1の方向に沿って配列され、前記第1の方向に垂直である第2の方向において、前記トンネル接合の幅は、前記フォトニック結晶構造の幅よりも小さい請求項1~11のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記P型クラッド層の上に設けられるとともに、前記第1のN型半導体層により取り囲まれる第1のP型半導体層を更に備え、前記トンネル接合は、前記第1のP型半導体層と前記第1のN型半導体層との間に位置する請求項1~12のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記トンネル接合は、第2のP型半導体層及び第2のN型半導体層を含み、前記第2のP型半導体層は、前記第1のP型半導体層と前記第2のN型半導体層との間に位置し、前記第2のP型半導体層のドーピング濃度は、前記第1のP型半導体層よりも大きく、前記第2のN型半導体層のドーピング濃度は、前記第1のN型半導体層よりも大きい請求項13に記載のフォトニック結晶面発光レーザ構造。
- 前記トンネル接合の厚みは、5ナノメートルから100ナノメートルまでの範囲内にある請求項1~14のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記活性層と前記フォトニック結晶構造との間に位置する電子閉じ込め層を更に備える請求項1~15のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記フォトニック結晶構造は、複数の周期的なホールを含む請求項1~16のいずれか一項に記載のフォトニック結晶面発光レーザ構造。
- 前記周期的なホールの断面形状は、円形、四角形又は六角形である請求項17に記載のフォトニック結晶面発光レーザ構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110948096.4A CN113644548B (zh) | 2021-08-18 | 2021-08-18 | 光子晶体面射型激光结构 |
CN202110948096.4 | 2021-08-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023029161A JP2023029161A (ja) | 2023-03-03 |
JP7258098B2 true JP7258098B2 (ja) | 2023-04-14 |
Family
ID=78087081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021165412A Active JP7258098B2 (ja) | 2021-08-18 | 2021-10-07 | フォトニック結晶面発光レーザ構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230055037A1 (ja) |
EP (1) | EP4138236A1 (ja) |
JP (1) | JP7258098B2 (ja) |
CN (1) | CN113644548B (ja) |
TW (1) | TWI793730B (ja) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009188258A (ja) | 2008-02-07 | 2009-08-20 | Canon Inc | 3次元フォトニック結晶発光素子 |
US20100208763A1 (en) | 2007-05-04 | 2010-08-19 | Karl Engl | Semiconductor Chip and Method for Manufacturing a Semiconductor Chip |
US20100265979A1 (en) | 2005-12-02 | 2010-10-21 | The Regents Of The University Of California | Horizontal emitting, vertical emitting, beam shaped, distributed feedback (dfb) lasers fabricated by growth over a patterned substrate with multiple overgrowth |
JP2017092158A (ja) | 2015-11-06 | 2017-05-25 | 学校法人 名城大学 | 窒化物半導体発光素子及びその製造方法 |
CN109038219A (zh) | 2018-09-07 | 2018-12-18 | 中国科学院半导体研究所 | 窄垂直远场发散角的隧道结光子晶体激光器 |
JP2019016750A (ja) | 2017-07-10 | 2019-01-31 | 浜松ホトニクス株式会社 | 半導体レーザ素子 |
JP2019047023A (ja) | 2017-09-05 | 2019-03-22 | 株式会社東芝 | 面発光量子カスケードレーザ |
JP2019201065A (ja) | 2018-05-15 | 2019-11-21 | 浜松ホトニクス株式会社 | 発光デバイス |
JP2019200251A (ja) | 2018-05-15 | 2019-11-21 | 浜松ホトニクス株式会社 | 反射型動的メタサーフェス |
CN110535033A (zh) | 2018-05-24 | 2019-12-03 | 智林企业股份有限公司 | 电激发光子晶体面射型雷射元件 |
US20190369458A1 (en) | 2018-05-30 | 2019-12-05 | Samsung Electronics Co., Ltd. | Apparatus and method for controlling laser light propagation direction |
US20200335663A1 (en) | 2016-02-05 | 2020-10-22 | The Regents Of The University Of California | Iii-nitride light emitting diodes with tunnel junctions wafer bonded to a conductive oxide and having optically pumped layers |
CN112117641A (zh) | 2019-06-21 | 2020-12-22 | 山东华光光电子股份有限公司 | 一种GaAs基多结红光激光器及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6542531B2 (en) * | 2001-03-15 | 2003-04-01 | Ecole Polytechnique Federale De Lausanne | Vertical cavity surface emitting laser and a method of fabrication thereof |
US20050063440A1 (en) * | 2003-09-18 | 2005-03-24 | Deppe Dennis G. | Epitaxial mode-confined vertical cavity surface emitting laser (VCSEL) and method of manufacturing same |
US20070242715A1 (en) * | 2006-04-18 | 2007-10-18 | Johan Gustavsson | Mode and polarization control in vcsels using sub-wavelength structure |
CN102714395B (zh) * | 2010-01-29 | 2015-06-10 | 惠普发展公司,有限责任合伙企业 | 具有非周期性光栅的垂直腔表面发射激光器 |
JP5794687B2 (ja) * | 2011-08-12 | 2015-10-14 | 国立大学法人京都大学 | フォトニック結晶面発光レーザ |
JP6213915B2 (ja) * | 2013-03-04 | 2017-10-18 | 国立大学法人京都大学 | 半導体レーザ素子 |
US11118981B2 (en) * | 2018-04-17 | 2021-09-14 | The Curators Of The University Of Missouri | Frequency-selective metasurface integrated uncooled microbolometers |
CN112331753B (zh) * | 2020-11-06 | 2022-11-11 | 业成科技(成都)有限公司 | 发光二极管结构 |
-
2021
- 2021-08-18 CN CN202110948096.4A patent/CN113644548B/zh active Active
- 2021-08-20 TW TW110130926A patent/TWI793730B/zh active
- 2021-09-24 US US17/448,706 patent/US20230055037A1/en active Pending
- 2021-10-07 JP JP2021165412A patent/JP7258098B2/ja active Active
- 2021-10-08 EP EP21201732.1A patent/EP4138236A1/en active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100265979A1 (en) | 2005-12-02 | 2010-10-21 | The Regents Of The University Of California | Horizontal emitting, vertical emitting, beam shaped, distributed feedback (dfb) lasers fabricated by growth over a patterned substrate with multiple overgrowth |
US20100208763A1 (en) | 2007-05-04 | 2010-08-19 | Karl Engl | Semiconductor Chip and Method for Manufacturing a Semiconductor Chip |
JP2009188258A (ja) | 2008-02-07 | 2009-08-20 | Canon Inc | 3次元フォトニック結晶発光素子 |
JP2017092158A (ja) | 2015-11-06 | 2017-05-25 | 学校法人 名城大学 | 窒化物半導体発光素子及びその製造方法 |
US20200335663A1 (en) | 2016-02-05 | 2020-10-22 | The Regents Of The University Of California | Iii-nitride light emitting diodes with tunnel junctions wafer bonded to a conductive oxide and having optically pumped layers |
JP2019016750A (ja) | 2017-07-10 | 2019-01-31 | 浜松ホトニクス株式会社 | 半導体レーザ素子 |
JP2019047023A (ja) | 2017-09-05 | 2019-03-22 | 株式会社東芝 | 面発光量子カスケードレーザ |
JP2019201065A (ja) | 2018-05-15 | 2019-11-21 | 浜松ホトニクス株式会社 | 発光デバイス |
JP2019200251A (ja) | 2018-05-15 | 2019-11-21 | 浜松ホトニクス株式会社 | 反射型動的メタサーフェス |
CN110535033A (zh) | 2018-05-24 | 2019-12-03 | 智林企业股份有限公司 | 电激发光子晶体面射型雷射元件 |
US20190369458A1 (en) | 2018-05-30 | 2019-12-05 | Samsung Electronics Co., Ltd. | Apparatus and method for controlling laser light propagation direction |
CN109038219A (zh) | 2018-09-07 | 2018-12-18 | 中国科学院半导体研究所 | 窄垂直远场发散角的隧道结光子晶体激光器 |
CN112117641A (zh) | 2019-06-21 | 2020-12-22 | 山东华光光电子股份有限公司 | 一种GaAs基多结红光激光器及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP4138236A1 (en) | 2023-02-22 |
CN113644548B (zh) | 2023-11-07 |
JP2023029161A (ja) | 2023-03-03 |
TW202310525A (zh) | 2023-03-01 |
CN113644548A (zh) | 2021-11-12 |
US20230055037A1 (en) | 2023-02-23 |
TWI793730B (zh) | 2023-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7042014B2 (en) | Semiconductor device | |
US10340659B1 (en) | Electronically pumped surface-emitting photonic crystal laser | |
US7983319B2 (en) | Surface-emitting type semiconductor laser that controls polarization directions of laser light and method for manufacturing the same | |
US11482835B2 (en) | VCSEL device with multiple stacked active regions | |
US10404036B1 (en) | Two-dimensional photonic crystal surface-emitting laser with transparent conductive cladding layer | |
JP6216785B2 (ja) | キャビティ内コンタクトを有するvcsel | |
US20200127442A1 (en) | Low impedance vcsels | |
JP5198793B2 (ja) | 半導体素子およびその製造方法 | |
US20210336422A1 (en) | Integrated vertical emitter structure having controlled wavelength | |
US20230067254A1 (en) | Semiconductor device | |
US11979001B2 (en) | Surface-emitting semiconductor laser | |
CN109427937B (zh) | 半导体元件及其制造方法 | |
JP7258098B2 (ja) | フォトニック結晶面発光レーザ構造 | |
JP7216786B1 (ja) | フォトニック結晶面発光レーザ構造 | |
CN112186503B (zh) | 一种垂直腔面发射激光器及其制作方法 | |
US11509115B2 (en) | Electrically pumped photonic-crystal surface-emitting laser | |
CN115967008A (zh) | 垂直腔面射型半导体激光二极体 | |
WO2019107273A1 (ja) | 面発光半導体レーザ | |
US20230420483A1 (en) | Etch protection and quantum mechanical isolation in light emitting diodes | |
CN115173223A (zh) | 一种激光器外延结构和垂直腔面发射激光器制备方法 | |
JP5454323B2 (ja) | 面発光型半導体レーザ素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211007 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221107 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230207 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230313 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230404 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7258098 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |