JP7256561B2 - Card and its manufacturing method - Google Patents

Description

The present invention relates to a card and its manufacturing method.

Conventionally, various cards such as bank cash cards, credit cards, point cards, etc. include IC cards having an IC module such as a semiconductor memory inside a base material made of synthetic resin, magnetic cards having a magnetic stripe on the surface of the base material, and the like. card is known (see, for example, Patent Document 1).

However, since the synthetic resin used for the card is not decomposed in the natural world, there is a problem that the environmental load is large when the card is discarded.

On the other hand, lacquer products are known which are obtained by forming a laminate by coating a non-permeable and flexible base material with lacquer paint or the like, and releasing the laminate from the base material. (See Patent Document 2, for example). Since the lacquer product is made of a natural material called lacquer paint, it can be decomposed in the natural world, and it is considered that the environmental load can be reduced when discarded. Therefore, it is conceivable to manufacture the IC card or the magnetic card using the lacquer product as a base material.

JP 2017-41272 A Japanese Patent No. 6239388

However, since the lacquer product described in Patent Document 2 is formed by repeatedly coating the lacquer paint, there is a problem that sufficient strength cannot be obtained when used as the IC card or the magnetic card.

SUMMARY OF THE INVENTION An object of the present invention is to provide a card having a sufficient strength as the IC card or the magnetic card and being decomposable in the natural world, and a method of manufacturing the same.

The present inventors have investigated means for imparting sufficient strength to a lacquer product consisting of a layered body in which lacquer paints and the like are repeatedly applied. As a result, the present inventor has developed at least one woven fabric-containing cured paste lacquer layer consisting of a woven fabric and hardened paste lacquer that has been infiltrated into the woven fabric, and a hardened paste lacquer layer containing the woven fabric that is composed of a cured lacquer paint. A lacquer product consisting of a lacquer coating layer adhered to the layer has a tensile stress in the range of, for example, 15 to 17 N/mm ² , and the tensile stress is strong enough for the IC card or the magnetic card. I found out that.

Therefore, the card of the first aspect of the present invention comprises at least one woven fabric-containing cured paste lacquer layer consisting of a woven fabric and a hardened paste lacquer that has been infiltrated into the woven fabric, and a hardened lacquer paint. a lacquer coating film layer adhered to the cloth-containing cured paste-lacquer layer, and an electronic element exposed on the surface of either one or both of the lacquer coating film layer and the woven fabric-containing cured paste-lacquer layer. characterized by In the card of the first aspect of the present invention, the electronic element is a magnetic stripe or an IC chip.

According to the card of the first aspect of the present invention, the at least one woven cloth-containing hardened glue-lacquer layer and a lacquer coating film layer made of cured lacquer paint and adhered to the woven-cloth-containing cured glue-lacquer layer By providing the electronic element, it is possible to obtain sufficient strength as the IC card or the magnetic card, and the electronic element is exposed on the surface of either one or both of the lacquer coating layer and the woven cloth-containing cured paste lacquer layer. When the electronic element is a magnetic stripe, it can be used as a magnetic card, and when the electronic element is an IC chip, it can be used as a contact type IC card.

In addition, the card of the second aspect of the present invention comprises a plurality of woven fabric-containing cured paste lacquer layers which are composed of a woven fabric and hardened paste lacquer that has been infiltrated into the woven fabric and hardened lacquer paint, and a hardened lacquer coating. and a lacquer coating film layer adhered to the woven fabric-containing cured paste lacquer layer, and electronic elements are provided between the plurality of woven fabric-containing cured paste lacquer layers. In the card of the second aspect of the present invention, the electronic element is an IC module or an antenna sheet.

According to the card of the second aspect of the present invention, the card comprises a plurality of overlapping woven fabric-containing hardened paste lacquer layers each made of a woven fabric and hardened paste lacquer that has soaked into the fabric and hardened paste lacquer, and the hardened lacquer paint. By providing a lacquer coating film layer adhered to the woven cloth-containing hard paste lacquer layer, it is possible to obtain sufficient strength as the IC card, and an electronic element is provided between the plurality of woven cloth-containing hard paste lacquer layers. It can be used as a non-contact type IC card by providing an IC module or an antenna sheet.

In addition, according to the card of the first or second aspect of the present invention, the components other than the electronic element are all composed of natural products, and can be decomposed in the natural world when discarded. can be reduced.

Further, in the card of the first or second aspect of the present invention, the lacquer coating film layer is exposed on the surface opposite to the woven fabric-containing cured paste lacquer layer, and comprises a lacquer coating film layer containing a pigment, a metal powder, It preferably contains at least one material selected from the group consisting of metal pieces and shells. In the first or second card of the present invention, the lacquer coating film layer has the at least one material exposed on the surface opposite to the woven cloth-containing cured paste lacquer layer, so that various Can be decorated.

The card of the first aspect of the present invention comprises the steps of placing an electronic element at a predetermined position on a substrate surface from which a lacquer coating film layer can be peeled off, and applying lacquer paint to the substrate surface on which the electronic element is placed. a step of drying and curing the lacquer paint to form a lacquer coating layer containing the electronic element; laminating a woven fabric on the surface of the lacquer coating layer opposite to the substrate; a step of forming at least one cured paste-lacquer layer containing a woven fabric by performing at least one operation of infiltrating paste-lacquer and drying and curing the paste-lacquer; from the substrate to obtain a card having an electronic element exposed on the surface of the lacquer coating film layer opposite to the woven cloth-containing cured paste lacquer layer. can be done.

Further, when manufacturing the card of the first aspect of the present invention, prior to the step of arranging the electronic element at a predetermined position on the substrate surface from which the lacquer coating film layer can be peeled off, a predetermined It is preferable to include a step of disposing at least one material selected from the group consisting of a pigment-containing lacquer coating layer, metal powder, metal pieces, and shells at the position. Prior to the step of arranging the electronic element at a predetermined position on the substrate surface, at least one selected from the group consisting of a pigment-containing lacquer coating layer, metal powder, metal pieces, and shells is placed at a predetermined position on the substrate surface. The lacquer coating film layer having at least one woven fabric-containing hardened paste lacquer layer formed thereon is separated from the substrate by the step of disposing one kind of material so that when the lacquer coating film layer is peeled off from the substrate, the lacquer coating film layer It is possible to obtain the card of the first aspect in which the surface opposite to the contained hardened glue lacquer layer is decorated with various decorations of the material.

Further, the card of the second aspect of the present invention comprises the steps of: applying lacquer paint to a substrate surface from which a lacquer coating layer can be peeled off; and drying and curing the lacquer coating to form a lacquer coating layer; A woven fabric is laminated on the surface of the lacquer coating film layer opposite to the substrate, the woven fabric is impregnated with paste lacquer, and the operation of drying and curing is performed at least once to form at least one hardened paste lacquer layer containing the woven fabric. placing an electronic element at a predetermined position on the woven fabric-containing cured paste layer; and laminating a woven fabric on the woven fabric-containing cured paste layer on which the electronic element is placed. and forming at least one woven fabric-containing hardened paste lacquer layer by performing an operation of infiltrating the woven fabric with paste lacquer and drying and curing at least once; and a step of peeling the lacquer coating film layer from the substrate to obtain a lacquer coating card having electronic elements between a plurality of woven fabric-containing cured paste lacquer layers.

Further, when manufacturing the card of the second aspect of the present invention, prior to the step of applying lacquer paint to the substrate surface from which the lacquer coating film layer can be peeled off, a pigment is added to a predetermined position on the substrate surface Lacquer coating film layer containing, metal powder, metal pieces, it is preferable to provide a step of arranging at least one material selected from the group consisting of shells. At least one material selected from the group consisting of a pigment-containing lacquer coating film layer, metal powder, metal pieces, and shells, prior to the step of applying lacquer paint to the substrate surface. so that when the lacquer coating film layer on which at least one woven fabric containing cured paste lacquer layer is formed is peeled off from the substrate, the woven fabric containing cured paste lacquer of the lacquer coating film layer It is possible to obtain a card of the second aspect, in which the surface opposite to the layer is decorated with various decorations of the material.

An explanatory cross-sectional view showing one configuration example of the card of the first aspect of the present invention. 4A to 4G are explanatory cross-sectional views showing the method of manufacturing the card according to the first embodiment of the present invention; FIG. An explanatory cross-sectional view showing one configuration example of a card according to the second aspect of the present invention. 8A to 8H are explanatory cross-sectional views showing the card manufacturing method according to the second embodiment of the present invention;

Embodiments of the present invention will now be described in more detail with reference to the accompanying drawings.

First, referring to FIG. 1, the card 1 of the first aspect of this embodiment will be described. The card 1 consists of a lacquer coating layer 2 and four layers of woven fabric-containing hardened glue lacquer layers 3 . The lacquer coating film layer 2 is made of cured lacquer paint and is adhered to the woven cloth-containing cured paste lacquer layer 3 . The woven cloth-containing hardened paste lacquer layer 3 is composed of the woven cloth 4 and the paste lacquer that is soaked in the woven cloth 4 and hardened. As a result, the card 1 has a tensile stress in the range of 15-17 N/mm ² .

Moreover, the lacquer coating layer 2 is exposed on the surface opposite to the woven cloth-containing hard paste lacquer layer 3, and the magnetic stripe 5 as an electronic element is exposed on the surface opposite to the woven cloth-containing hard paste lacquer layer 3. It has a lacquer film layer 6 containing a pigment as a material, a metal piece 7 and a shell 8.

The card 1 may have an IC chip instead of the magnetic stripe 5. FIG. The card 1 is a magnetic card when equipped with a magnetic stripe 5, and a contact type IC card when equipped with an IC chip. In the card 1, the magnetic stripe 5 extends in a direction perpendicular to the plane of the paper.

In addition, the card 1 is decorated with a lacquer coating layer 6 containing a pigment as a material exposed on the surface of the lacquer coating layer 2 opposite to the woven fabric-containing cured paste lacquer layer 3, a metal piece 7, and a shell 8. can be done. The lacquer coating film layer 6 containing the pigment is generally made of what is called colored lacquer, and examples of the pigment contained in the colored lacquer include ferric oxide (red oxide) and titanium dioxide (titanium white). can be done. The colored lacquer can be obtained, for example, from Tsutsumi Asakichi Lacquer Store (Kyoto Prefecture).

As the metal piece 7, metal powder such as gold powder and silver powder, or metal foil such as gold foil and silver foil can be used. Further, as the shell 8, the mother-of-pearl portion of the inner surface of the shell or the like can be used.

The card 1 is provided with all of a lacquer coating layer 6 containing the pigment, a metal piece 7, and a shell 8 as materials exposed on the surface of the lacquer coating layer 2 opposite to the woven cloth-containing cured paste lacquer layer 3. It does not have to contain any one or two materials. Moreover, if no decoration is required, the card 1 may be completely free of the pigment-containing lacquer coating layer 6, the metal piece 7, and the shell 8.

Next, a method for manufacturing the card 1 of this embodiment will be described with reference to FIG. When manufacturing the card 1, first, as shown in FIG. Place pieces 7 and shells 8 . In the manufacturing method of the card 1, an IC chip (not shown) may be used in place of the magnetic stripe 5, and one or more of the pigment-containing lacquer coating layer 6, the metal piece 7, and the shell 8 may be used. Alternatively, all of the pigment-containing lacquer coating layer 6, the metal piece 7, and the shell 8 may not be used.

A flat plate made of a synthetic resin other than polyethylene terephthalate (PET) can be used for the substrate 9 . Examples of the synthetic resin forming the substrate 9 include polyvinyl chloride (PVC), polyethylene (PE), and polypropylene (PP). It is preferably PVC from

After the magnetic stripe 5, the pigment-containing lacquer coating layer 6, the metal pieces 7, and the shells 8 are arranged at predetermined positions on the surface of the substrate 9, the magnetic stripe 5, Lacquer paint 2a is applied to the surface of a substrate 9 on which a lacquer coating film layer 6 containing a pigment, a metal piece 7, and a shell 8 are arranged, dried and cured, and the lacquer coating film layer composed of the lacquer coating 2a cured on the substrate 9. 2 is formed.

As the lacquer paint 2a, one containing purified lacquer obtained by refining unrefined lacquer can be used. The unrefined lacquer is obtained by filtering the sap obtained from the Urushi tree. On the other hand, the purified lacquer is obtained by kneading and stirring the raw lacquer to disperse the emulsion, followed by heating and dehydration to reduce the water content to 3 to 5% by mass of the total amount. is. In addition, in the process of obtaining the refined lacquer, the kneading and stirring is sometimes referred to as "nayashi" and the heat dehydration is referred to as "kurome".

The quality of the unrefined lacquer and the purified lacquer is specified by Japanese Industrial Standards (JIS K 5950), and the lacquer paint 2a containing such purified lacquer can be obtained from, for example, Tsutsumi Asakichi Lacquer Shop (Kyoto Prefecture). can be done.

The lacquer paint 2a is, for example, applied to the substrate 9 so as to have a thickness of 50 μm or less, and then kept in a constant temperature and humidity environment (for example, temperature 20 to 25° C., relative humidity 70%) for a predetermined time (for example, 24 hours). Then, the lacquer coating film layer 2 can be formed by drying and curing. The lacquer paint 2a can be applied by a method such as brush coating, spraying, or roller coating.

In addition, the drying and curing of the lacquer paint 2a may be performed using a constant temperature and humidity dryer. You can use a device called

The lacquer coating 2a is applied so as to have a thickness of 50 μm or less, and is dried and cured in the constant temperature and humidity environment to obtain the lacquer coating film layer 2 that is reliably cured to the inside. It may be applied to a thickness of 100 μm or less, for example, in the range of 60 to 70 μm, as long as it can be reliably cured up to.

Although FIG. 2B shows a state in which a single lacquer coating film layer 2 is formed, a plurality of lacquer coating film layers 2 may be formed as necessary.

After the lacquer coating layer 2 is formed, a woven fabric 4 is laid on the lacquer coating layer 2 as shown in FIG. 2C. As the woven fabric 4, a plain weave of natural fibers such as cotton and hemp, for example, cheesecloth can be used.

Next, as shown in FIG. 2D, paste lacquer 3a is applied over the woven fabric 4. Next, as shown in FIG. The paste lacquer 3a can be applied to a thickness of 40 to 80 μm by a method such as spatula coating, spraying, or roller coating. Paste lacquer 3a is obtained by kneading rice flour into the raw lacquer, and can be produced, for example, as follows.

First, 22.5 parts by mass of water and 5 parts by mass of rice flour are mixed and stirred at normal temperature (20 to 25° C.). When the water and rice flour are thoroughly mixed, the resulting mixture is heated with stirring at a temperature of 80-90° C. for 1-1.5 minutes to gelatinize the rice flour. When the rice flour is gelatinized, the heating is stopped after 80 to 100 seconds (for example, 90 seconds), stirring is continued while cooling, and when the temperature returns to normal temperature (20 to 25°C), 15 parts by mass of unrefined lacquer is mixed and paste. Lacquer 3a is obtained.

When the paste lacquer 3a is applied on the fabric 4, the paste lacquer 3a infiltrates the fabric 4 and reaches the lacquer coating film layer 2 on the substrate 9 side of the fabric 4, as shown in FIG. 2E. Therefore, next, the paste lacquer 3a is dried and cured to form the hardened paste lacquer layer 3 containing the woven fabric. The paste lacquer 3a can be dried and cured in the same manner as the lacquer paint 2a. As a result, the woven cloth-containing hardened paste lacquer layer 3 and the lacquer coating film layer 2 can be bonded together.

In this embodiment, in the steps shown in FIGS. 2C and 2D, a woven cloth 4 is placed on the lacquer coating film layer 2, and the paste lacquer 3a is applied over the woven cloth 4. As shown in FIG. However, after applying paste lacquer 3a onto lacquer coating film layer 2, woven cloth 4 may be placed on paste lacquer 3a, and paste lacquer 3a may be further applied on woven cloth 4, as shown in FIG. 2E. Thus, the paste lacquer 3a can be infiltrated into the woven cloth 4 and reach the lacquer coating film layer 2 on the substrate 9 side of the woven cloth 4.

Next, a woven cloth 4 is further overlaid on the formed woven cloth-containing hardened paste lacquer layer 3, and the steps shown in FIGS. A cured paste lacquer layer 3 is formed. In this case, the newly formed woven fabric-containing cured paste lacquer layer 3 adheres to the adjacent woven fabric-containing cured paste lacquer layer 3 on the substrate 9 side of the woven fabric 4 . Therefore, after forming the first woven fabric-containing hardened paste lacquer layer 3 on the lacquer coating layer 2, the steps shown in FIGS. A laminate can be formed comprising four layers of woven fabric-containing cured paste lacquer layers 3 on the coating layer 2 .

Next, a laminate comprising four layers of woven cloth-containing cured paste lacquer layers 3 on the lacquer coating layer 2 shown in FIG. 2F is peeled off from the substrate 9 as shown in FIG. You can get 1 card.

Incidentally, the card 1 of the first aspect of the present embodiment, as shown in FIG. A magnetic stripe 5 as an electronic element exposed on the surface of the cured glue-lacquer layer 3 may be provided, and electrons exposed on both the surface of the lacquer coating film layer 2 and the surface of the woven fabric-containing cured glue-lacquer layer 3 may be provided. A magnetic stripe 5 as an element may be provided.

The card 1 provided with the magnetic stripe 5 as an electronic element exposed on the surface of the woven cloth-containing cured paste lacquer layer 3 is manufactured by the manufacturing method shown in FIG. After forming a laminate comprising the film layer 2 and the woven cloth-containing hard paste lacquer layer 3, the magnetic stripe 5 is attached to the surface of the woven cloth-containing hard paste lacquer layer 3, and the laminate is peeled off from the substrate 9. can be manufactured. The operation of attaching the magnetic stripe 5 to the surface of the woven cloth-containing hardened paste lacquer layer 3 may be performed after the laminate is peeled off from the substrate 9 .

Moreover, the card 1 provided with the magnetic stripe 5 as an electronic element exposed on both the surface of the lacquer coating film layer 2 and the surface of the woven cloth-containing cured paste lacquer layer 3 is produced by the manufacturing method shown in FIG. After attaching the magnetic stripe 5 to the surface of the woven fabric-containing hard paste lacquer layer 3 of the laminate comprising the woven fabric-containing hard paste lacquer layer 3 on the layer 2, the laminate is peeled off from the substrate 9 or the lacquer coating is applied. It can be produced by peeling a laminate comprising a woven cloth-containing hard paste lacquer layer 3 on a layer 2 from a substrate 9 and then attaching a magnetic stripe 5 to the surface of the woven cloth-containing hard paste lacquer layer 3 .

In addition, the card 1 provided with the magnetic stripe 5 as an electronic element exposed on either one or both of the surface of the lacquer coating layer 2 and the surface of the woven fabric-containing cured paste lacquer layer 3 is produced by the manufacturing method shown in FIG. , without arranging the magnetic stripe 5 on the surface of the substrate 9, a laminate comprising the lacquer coating film layer 2 and the woven cloth-containing cured paste lacquer layer 3 is formed, and after peeling the laminate from the substrate 9, the lacquer It can also be produced by attaching the magnetic stripe 5 to either one or both of the surface of the coating layer 2 and the surface of the woven fabric-containing hardened paste lacquer layer 3 . Any of the cards 1 described above may have an IC chip instead of the magnetic stripe 5 .

Next, referring to FIG. 3, the card 11 of the second aspect of this embodiment will be described. The card 11 consists of a lacquer coating layer 2 and four layers of woven cloth-containing hardened glue lacquer layers 3 . As a result, card 11 has a tensile stress in the range of 15-17 N/mm ² . In the card 11, the same components as those of the card 1 shown in FIG.

In the card 11, the lacquer coating layer 2 comprises a lacquer coating layer 6 containing a pigment as a material exposed on the surface opposite to the woven cloth-containing cured paste lacquer layer 3, a metal piece 7, and a shell 8, The four layers of woven cloth-containing cured paste lacquer layer 3 comprise IC modules 12 and antenna sheets 13 between the layers, for example between the second and third layers as shown in FIG. As a result, the card 11 communicates with an external device such as a card reader through the antenna sheet 13, and constitutes a non-contact type IC card in which the IC module 12 performs required calculations.

In the card 11, the lacquer coating layer 6 containing the pigment, the metal piece 7, and the shell 8 are all exposed on the surface of the lacquer coating layer 2 opposite to the woven fabric-containing hardened paste lacquer layer 3. It does not have to be provided, and may be provided with either one or two materials. Also, if no decoration is required, the card 11 may be completely free of the pigment-containing lacquer coating layer 6, the metal piece 7, and the shell 8.

Next, a method for manufacturing the card 11 of this embodiment will be described with reference to FIG. In the method of manufacturing the card 11, the same components as those of the method of manufacturing the card 1 shown in FIG.

When manufacturing the card 11, first, as shown in FIG. 4A, the pigment-containing lacquer coating layer 6, the metal piece 7, and the shell 8 are placed at predetermined positions on the surface of the substrate 9 from which the lacquer coating layer 2 can be peeled off. to place In the method of manufacturing the card 11, any one or more of the pigment-containing lacquer coating layer 6, the metal piece 7, and the shell 8 may be used, or the pigment-containing lacquer coating layer 6 and the metal piece may be used. 7. It is not necessary to use all of the shells 8. As the substrate 9, the same substrate as used in the method of manufacturing the card 1 can be used.

Once the pigment-containing lacquer coating layer 6, the metal pieces 7, and the shells 8 have been arranged at predetermined positions on the surface of the substrate 9, next, as shown in FIG. 4B, the pigment-containing lacquer coating layer 6, the metal A lacquer coating 2a is applied to the surface of a substrate 9 on which pieces 7 and shells 8 are arranged, and dried and cured to form a lacquer coating film layer 2 composed of the cured lacquer coating 2a on the substrate 9. - 特許庁

The lacquer coating 2a is applied so as to have a thickness of 50 μm or less, and is dried and cured in the constant temperature and humidity environment to obtain the lacquer coating film layer 2 that is reliably cured to the inside. It may be applied to a thickness of 100 μm or less, for example, in the range of 60 to 70 μm, as long as it can be reliably cured up to.

Although FIG. 4B shows a state in which a single lacquer coating film layer 2 is formed, a plurality of lacquer coating film layers 2 may be formed as necessary.

After the lacquer coating film layer 2 is formed, a woven cloth 4 is placed on the lacquer coating film layer 2 as shown in FIG. 4C. apply. The paste lacquer 3a can be applied to a thickness of 40 to 80 μm by a method such as spatula coating, spraying, or roller coating.

When the paste lacquer 3a is applied from above the fabric 4, the paste lacquer 3a infiltrates the fabric 4 and reaches the lacquer coating film layer 2 on the substrate 9 side of the fabric 4, as shown in FIG. 4E. Therefore, next, the paste lacquer 3a is dried and cured to form the hardened paste lacquer layer 3 containing the woven fabric. The paste lacquer 3a can be dried and cured in the same manner as the lacquer paint 2a. As a result, the woven cloth-containing hardened paste lacquer layer 3 and the lacquer coating film layer 2 can be bonded together.

In this embodiment, in the steps shown in FIGS. 4C and 4D, a woven cloth 4 is placed on the lacquer coating film layer 2, and the paste lacquer 3a is applied from above the woven cloth 4. As shown in FIG. However, after applying paste lacquer 3a onto lacquer coating film layer 2, woven cloth 4 may be placed on paste lacquer 3a, and paste lacquer 3a may be further applied on woven cloth 4, as shown in FIG. 4E. Thus, the paste lacquer 3a can be infiltrated into the woven cloth 4 and reach the lacquer coating film layer 2 on the substrate 9 side of the woven cloth 4.

Next, a woven cloth 4 is further overlaid on the formed woven cloth-containing cured paste-lacquer layer 3, and the steps shown in FIGS. A cured paste lacquer layer 3 is formed. In this case, the newly formed woven fabric-containing cured paste layer 3 adheres to the adjacent woven fabric-containing cured paste layer 3 on the substrate 9 side.

Thus, as shown in FIG. 4F, it is possible to form a laminate comprising two layers of woven cloth-containing hardened paste lacquer layers 3 on the lacquer coating layer 2 . In the method for manufacturing the card 11, next, the IC module 12 and the antenna sheet 13 are placed at predetermined positions on the surface of the second woven cloth-containing cured paste lacquer layer 3 opposite to the lacquer coating layer 2. .

Next, by repeating the steps shown in FIGS. 4C to 4E two more times on the laminate shown in FIG. 4F, a woven fabric containing IC module 12 and antenna sheet 13 are arranged as shown in FIG. 4G. Two more woven cloth-containing hardened paste lacquer layers 3 are formed on the hardened paste lacquer layer 3 . As a result, it is possible to obtain a laminate having the IC module 12 and the antenna sheet 13 between the second and third layers of the four woven cloth-containing hardened paste lacquer layers 3 .

Next, four layers of woven fabric-containing cured paste lacquer layers 3 are provided on the lacquer coating layer 2 shown in FIG. By peeling the laminate including the module 12 and the antenna sheet 13 from the substrate 9 as shown in FIG. 4H, the card 11 shown in FIG. 3 can be obtained.

In this embodiment, the IC module 12 and the antenna sheet 13 are arranged between the second layer and the third layer of the four woven-cloth-containing cured paste lacquer layers 3. The antenna sheet 13 may be arranged between the first and second layers, or may be arranged between the third and fourth layers.

Further, in the manufacturing method shown in FIG. 4, a laminate having the IC module 12 and the antenna sheet 13 between the second layer and the third layer of the four layers of the woven cloth-containing hardened paste lacquer layer 3 is obtained. However, two cards 11 having exactly the same configuration as the card 11 shown in FIG. The IC module 12 and the antenna sheet 13 may be sandwiched at a predetermined position between the layers 3 and bonded together using paste lacquer or the like. A card comprising 12 and an antenna sheet 13 can be manufactured.

Further, in this embodiment, a contact type IC card having an IC chip instead of the magnetic stripe 5 in the card 1 shown in FIG. 1 and a non-contact type IC card such as the card 11 shown in FIG. 3 are described. However, the IC chip exposed on the surface of the lacquer coating film layer 2 opposite to the woven cloth-containing cured paste lacquer layer 3 and the IC module 12 or antenna sheet disposed between the plurality of woven cloth-containing cured paste lacquer layers 3 13 may be used as a composite type (hybrid) IC card. In the composite IC card, the IC chip is electrically connected to the IC module 12 or the antenna sheet 13 by interlayer connection or the like.

REFERENCE SIGNS LIST 1, 11: card, 2: lacquer coating layer, 3: woven fabric-containing cured paste lacquer layer, 5, 12, 13: electronic element.

Claims (11)

At least one woven fabric-containing hardened paste lacquer layer consisting of a woven fabric and a hardened paste lacquer that has been soaked into the woven fabric, and a lacquer coating composed of a hardened lacquer paint and adhering to the woven fabric-containing hardened paste lacquer layer. a membrane layer;
A card comprising an electronic element exposed on one or both surfaces of the lacquer coating film layer and the woven cloth-containing cured paste lacquer layer. 2. The card according to claim 1, wherein said electronic element is a magnetic stripe or an IC chip. A plurality of woven fabric-containing hardened paste lacquer layers, which are composed of a woven fabric and hardened paste lacquer soaked into the woven fabric, and which are composed of a plurality of mutually overlapping cured paste lacquer layers, and a lacquer composed of a hardened lacquer coating and adhered to the woven fabric-containing hardened paste lacquer layer. and a coating layer,
A card comprising an electronic element between layers of said woven fabric-containing hardened paste lacquer layers. 4. The card according to claim 3, wherein said electronic element is an IC module or an antenna sheet. 5. The card according to any one of claims 1 to 4, wherein the lacquer coating film layer is exposed on the surface opposite to the woven cloth-containing hardened paste lacquer layer, the lacquer coating film layer containing a pigment, metal powder , metal pieces, and shells. A step of arranging an electronic element at a predetermined position on the substrate surface from which the lacquer coating film layer can be peeled off;
a step of applying lacquer paint to the surface of the substrate on which the electronic elements are arranged;
a step of drying and curing the lacquer coating to form a lacquer coating layer containing the electronic element;
A woven fabric is laminated on the surface of the lacquer coating film layer opposite to the substrate, the woven fabric is impregnated with paste lacquer, and the operation of drying and curing is performed at least once to form at least one hardened paste lacquer layer containing the woven fabric. forming;
When the lacquer coating film layer on which at least one woven fabric-containing cured paste lacquer layer is formed is peeled from the substrate, electrons exposed on the surface of the lacquer coating film layer opposite to the woven fabric-containing cured paste lacquer layer. obtaining a card comprising elements;
A method of manufacturing a card, comprising: 7. The method of manufacturing a card according to claim 6, wherein said electronic element is a magnetic stripe or an IC chip. In the method for producing a lacquered film card according to claim 6 or 7,
Prior to the step of arranging the electronic element at a predetermined position on the substrate surface from which the lacquer coating film layer can be peeled off,
Manufacture of a card characterized by comprising a step of disposing at least one material selected from the group consisting of a pigment-containing lacquer coating layer, metal powder, metal pieces, and shells at a predetermined position on the substrate surface. Method. A step of applying lacquer paint to the substrate surface from which the lacquer coating film layer can be peeled off;
a step of drying and curing the lacquer paint to form a lacquer coating film layer;
A woven fabric is laminated on the surface of the lacquer coating film layer opposite to the substrate, the woven fabric is impregnated with paste lacquer, and the operation of drying and curing is performed at least once to form at least one hardened paste lacquer layer containing the woven fabric. forming;
placing an electronic device at a predetermined location on the woven cloth-containing hardened glue lacquer layer;
A woven fabric is laminated on the woven fabric-containing cured paste lacquer layer on which the electronic element is arranged, the woven fabric is impregnated with paste lacquer, and the operation of drying and curing is performed at least once to perform at least one woven fabric-containing curing. A step of forming a paste lacquer layer;
a step of peeling the lacquered film layer on which a plurality of woven cloth-containing cured paste-lacquer layers are formed from the substrate to obtain a lacquered film card having an electronic element between the plurality of woven-cloth-containing cured paste-lacquer layers;
A method of manufacturing a card, comprising: 10. The method of manufacturing a card according to claim 9, wherein said electronic element is an IC module or an antenna sheet. In the method for manufacturing a card according to claim 9 or 10,
Prior to the step of applying lacquer paint to the substrate surface from which the lacquer coating film layer can be peeled off, at a predetermined position on the substrate surface, a lacquer coating film layer containing a pigment, a metal powder, a metal piece, and a shell from the group consisting of A method of manufacturing a card, comprising the step of placing at least one selected material.

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