JP7252378B2 - sample holder - Google Patents

Description

The present disclosure relates to a sample holder for holding a sample such as a semiconductor wafer, which is used in a manufacturing process of semiconductor integrated circuits, a manufacturing process of liquid crystal display devices, or the like.

An example of the prior art is described in US Pat.

JP 2019-153708

A sample holder according to the present disclosure includes a plate-shaped insulating substrate having a first surface serving as a sample holding surface and a second surface opposite to the first surface, and a heat generator provided on the second surface of the insulating substrate. A resistor and an internal wiring provided inside the insulating base are provided. The second surface is divided into a plurality of regions, and the plurality of regions are, in plan view, a first region including a portion of the internal wiring and a portion of the heating resistor, and a first region including the internal wiring. and a second region that does not include the heating resistor and includes another part of the heating resistor. The electrical resistance value of the portion of the heating resistor included in the first region is lower than the electrical resistance value of the portion of the heating resistor included in the second region.

Objects, features and advantages of the present disclosure will become more apparent from the following detailed description and drawings.

2 is a cross-sectional view of the sample holder of the first embodiment; FIG. FIG. 4 is a plan view showing internal wiring of the sample holder; 4 is a plan view showing a heating resistor of the sample holder; FIG. FIG. 4 is a partially enlarged view of the sample holder; FIG. 4 is a partially enlarged view of the sample holder; FIG. 4 is a partially enlarged view of the sample holder; FIG. 10 is a cross-sectional view of the sample holder of the second embodiment; FIG. 4 is a partially enlarged view of the sample holder; FIG. 3C is a cross-sectional view of the sample holder along section line VI-VI of FIG. 3B; FIG. 3D is a cross-sectional view of the sample holder on section line VII-VII of FIG. 3C;

BACKGROUND ART For example, a holding device described in Patent Document 1 is known as a sample holder used in a semiconductor manufacturing apparatus or the like, which is a configuration that forms the basis of the sample holder of the present disclosure. In the holding device described in Patent Literature 1, a driver electrode for connecting the heater electrode and the power supply portion is embedded in the ceramic member.

A driver electrode (inner layer wiring) embedded in a ceramic member may generate heat when energized, and this heat generation may cause uneven temperature distribution on the surface of the sample holder.

The sample holder 100 will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing the sample holder of the first embodiment. FIG. 2A is a plan view showing the internal wiring of the sample holder. FIG. 2B is a plan view showing the heating resistor of the sample holder. The sample holder 100 includes an insulating substrate 10 , a heating resistor 11 and internal wiring 12 . The sample holder 100 may further include a support 20 and a bonding material 30 .

The insulating substrate 10 is a ceramic body having a first surface 10a and a second surface 10b opposite to the first surface 10a. The first surface 10a is a sample holding surface for holding a sample. The insulating base 10 is a plate-like member, and its outer shape is not limited, and may be, for example, a disk-like shape or a rectangular plate-like shape.

The insulating base 10 is made of, for example, a ceramic material. The ceramic material may be, for example, alumina, aluminum nitride, silicon nitride, yttria, or the like. The outer dimensions of the insulating substrate 10 can be, for example, a diameter (or side length) of 200-500 mm and a thickness of 2-15 mm.

As shown in FIG. 2B, the sample holder 100 is provided with a heating resistor 11 on the second surface 10b of the insulating substrate 10, and internally provided with an internal wiring 12 as shown in FIG. 2A. there is The heating resistor 11 and the internal wiring 12 are electrically connected by the first through conductor 13 . Further, the internal wiring 12 is connected to an external wiring 21 for connecting to an external power source or the like by a second through conductor 14 for energization. In this embodiment, the first through conductor 13 is positioned outward on the outer peripheral side, and the second through conductor 14 is positioned on the central side. The second through conductors 14 are gathered at the central side to facilitate connection with the outside. The heating resistor 11 is provided over the entire second surface 10b, and the heating of the heating resistor 11 heats the entire first surface 10a, which is the sample holding surface. The heating resistor 11 and the internal wiring 12 have, for example, a metal material. Metal materials include, for example, platinum, tungsten, molybdenum, and the like.

The sample holder 100 is used, for example, by generating plasma above the first surface 10a of the insulating substrate 10, which is the sample holding surface. Plasma can be generated by, for example, applying high frequency waves between a plurality of externally provided electrodes to excite the gas positioned between the electrodes.

The support 20 is made of metal and is a member for supporting the insulating base 10 . Aluminum, for example, can be used as the metal material. The outer shape of the support 20 is not particularly limited, and may be circular or rectangular. The outer dimensions of the support 20 can be, for example, a diameter (or side length) of 200-500 mm and a thickness of 10-100 mm. The support 20 may have the same external shape as the insulating base 10, may have a different external shape, may have the same external dimensions, or may have different external dimensions.

The support 20 and the insulating base 10 are bonded via a bonding material 30 . Specifically, the first surface 20 a of the support 20 and the second surface 10 b of the insulating base 10 are bonded together by the bonding material 30 . As the bonding material 30, for example, an adhesive made of a resin material can be used. For example, a silicone resin or the like can be used as the resin material.

As shown in FIG. 1, the insulating substrate 10 may have a first through-hole 15 which is a through-hole penetrating from the first surface 10a to the second surface 10b. Further, the support 20 may have a second through hole 16 penetrating from the first surface 20a to the second surface 20b opposite to the first surface 20a. The second through-hole 16 and the first through-hole 15 communicate with each other, and form a continuous hole from the first surface 10a of the insulating substrate 10 through the bonding material 30 to the second surface 20b of the support 20. there is The second through-hole 16 and the first through-hole 15 allow plasma generation gas such as helium to flow from the second surface 20b side of the support 20 to the first surface 10a side of the insulating substrate 10, which is the sample holding surface. It is provided as a gas inflow hole for A through hole 22 is provided in the central portion of the support 20 for leading out the external wiring 21 connected to the second through conductor 14 of the insulating base 10 to the outside.

As shown in FIG. 2B, the second surface 10b of the insulating substrate 10 is circular, for example, and is divided into a plurality of regions S by imaginary boundary lines L. As shown in FIG. In this embodiment, the second surface 10b is divided into eight equal parts by linear boundary lines L radially extending from the center of the second surface 10b, and further divided by concentric boundary lines L having a radius of 1/2 of the second surface 10b. . As a result, the central portion of the second surface 10b is equally divided into eight fan-shaped regions S, and the outer peripheral portion is equally divided into eight circular regions S, and the second surface 10b is It is divided into 16 areas S. The shape and the number of the regions S in the present embodiment are merely examples, and can be set as appropriate without being limited thereto. Note that the equal division here does not have to be equal division in a strict sense, and may be, for example, as long as the difference in the area of each region S is within 20% of the area of each region S.

FIG. 3A is a partially enlarged view of the sample holder. In FIG. 3A, the internal wiring 12 and the heating resistor 11 are represented by solid lines so that the positional relationship between the region S, the internal wiring 12, and the heating resistor 11 can be easily understood in plan view. In a plan view of the sample holder 100, the plurality of regions S on the second surface 10b include a first region S1 including both a portion of the internal wiring 12 and a portion of the heating resistor 11, and the internal wiring 12. and a second region S2 including another part of the heat generating resistor 11 . The heating resistor 11 is provided over the entire second surface 10b in order to heat the entire second surface 10b. It may be partially provided in a place. In this case, as described above, the first region S1 including both the internal wiring 12 and the heating resistor 11 and the second region S2 not including the internal wiring 12 but including only the heating resistor 11 are provided. be.

The internal wiring 12 does not intentionally generate heat like the heating resistor 11. For example, the wiring width is made wider than the heating resistor 11 to make the electrical resistance relatively low. It may generate heat when energized. Although the amount of heat generated by the internal wiring 12 is smaller than the amount of heat generated by the heating resistor 11, the heat generated by the internal wiring 12 causes the first surface 10a of the insulating substrate 10 to become the first surface 10a including the internal wiring 12. In the area corresponding to one area S1, the amount of heat generated by the internal wiring 12 is added to the amount of heat generated by the heating resistor 11 . The region corresponding to the first region S1 generates a larger amount of heat than the region corresponding to the second region S2, which does not include the internal wiring 12, of the first surface 10a, and the temperature of the sample holding surface (first surface 10a) increases. Uneven distribution. In this embodiment, the electrical resistance value of the heating resistor 11 in the portion included in the first region S1 is made lower than the electrical resistance value of the heating resistor 11 in the portion included in the second region S2.

As described above, the non-uniform temperature distribution on the sample holding surface (first surface 10a) is caused by the amount of heat generated by the internal wiring 12 in the first region S1. Difference is the reason. In this embodiment, the amount of heat generated by the heating resistor 11 can be relatively reduced by relatively reducing the electrical resistance value of the heating resistor 11 in the portion included in the first region S1. As a result, it is possible to reduce the difference in the amount of heat generated between the first region S1 and the second region S2 and prevent the temperature distribution of the sample holding surface from becoming non-uniform. Note that, in the present embodiment, the phrase “the region S includes a part of the internal wiring 12” can be defined as including even a small portion of the internal wiring 12 . For example, when the ratio of the area occupied by the internal wiring 12 to the area of the region S in plan view is 20% or more, it is possible to further suppress the non-uniformity of the temperature distribution.

In order to make the electrical resistance value of the heating resistor 11 in the portion included in the first region S1 lower than the electrical resistance value of the heating resistor 11 in the portion included in the second region S2, for example, The wiring thickness of the heating resistor 11 in the portion included in the first region S1 is made larger than the wiring width of the heating resistor 11 in the portion included in the second region S2 can be made larger than the wiring thickness of the heating resistor 11 in the portion included in the second region S2. Both the wiring width and the wiring thickness may be varied as described above, or either one may be varied as described above. Further, while the wiring width and wiring thickness remain the same, the material of the heating resistor 11 in the portion included in the first region S1 is made to have a higher resistivity (for example, , volume resistivity) may be used. When the material of the heating resistor 11 is a combination of a plurality of materials, a material with a low resistivity may be used by changing the mixing ratio of the plurality of materials. Furthermore, in addition to both the wiring width and wiring thickness, the resistivity of the material may also be varied.

A plurality of regions S of the second surface 10b may include a plurality of regions corresponding to the first region S1. When a plurality of heat generating resistors 11 are included, the electric resistance value of the heating resistor 11 may be reduced to the same extent in each first region S1, or may be different for each first region S1. For example, it may be varied according to the ratio of the internal wirings 12 included in the first region S1. In plan view, the ratio of the area of the internal wiring 12 to the area of the first region S1 is obtained for each first region S1, and the electric resistance of the heating resistor 11 included in the first region S1 is calculated according to the obtained ratio. The amount of decrease in value may be varied. The amount of decrease in the electrical resistance value can be adjusted by the amount of change in the wiring width, the amount of change in the thickness of the wiring, and the selection of the material of the heating resistor 11 (including the mixing ratio of a plurality of materials).

Also, part of the internal wiring 12 may have a branched portion as shown in FIG. 3B. The first region S1 including the internal wiring 12 has a first A region S1A including this branched portion and a first B region S1B not including the branched portion. The branched portion of the internal wiring 12 generates more heat than the portion of the internal wiring 12 that does not include the branched portion due to current concentration at the corner and an increase in electrical resistance due to the corner. That is, the first A region S1A including the branched portion generates a larger amount of heat than the first B region S1B not including the branched portion. Due to this difference in the amount of heat generated, the temperature distribution on the sample holding surface (first surface 10a) becomes uneven. In this embodiment, the electrical resistance value of the heating resistor 11 in the portion included in the first A region S1A is made lower than the electrical resistance value of the heating resistor 11 in the portion included in the first B region S1B.

The uneven temperature distribution on the sample holding surface (first surface 10a) is caused by the difference in the amount of heat generated between the first A region S1A and the first B region S1B caused by the branched portion of the first A region S1A. In this embodiment, the amount of heat generated by the heating resistor 11 can be relatively reduced by relatively reducing the electrical resistance value of the heating resistor 11 in the portion included in the first A region S1A. As a result, it is possible to reduce the difference in the amount of heat generated between the first A region S1A and the first B region S1B, thereby suppressing uneven temperature distribution on the sample holding surface. The electric resistance value of the heating resistor 11 in the portion included in the 1A region S1A can be lowered in the same manner as described above.

The first region S1 may include a plurality of regions corresponding to the first A region S1A. When a plurality of heat generating resistors 11 are included, the electric resistance value of the heating resistor 11 may be similarly low in each 1A region S1A, or may be different for each 1A region S1A. For example, it may be varied according to the ratio of branched portions included in the first A region S1A. In plan view, the ratio of the area of the branched portion to the area of the first A region S1A is obtained for each first A region S1A, and the electric resistance value of the heating resistor 11 included in the first A region S1A is calculated according to the obtained ratio. may be reduced by different amounts.

Further, the sample holder 100 includes a first through conductor 13 electrically connecting the internal wiring 12 and the heating resistor 11, and a second through conductor 14 electrically connecting the internal wiring 12 and the external wiring. may be The first region S1 including the internal wiring 12 includes a first E region S1E including at least one of the first penetrating conductor 13 or the second penetrating conductor 14, and a first F region S1E not including the first penetrating conductor 13 and the second penetrating conductor 14. and a region S1F. FIG. 3C shows the 1E region including the first penetrating conductor 13 . A connection portion between the internal wiring 12 and the first through conductor 13 or the second through conductor 14 is a bent or branched portion in the thickness direction of the insulating base 10 . Due to the current concentration at the corners of the connecting portion, the increase in electrical resistance due to the corners, and the like, the amount of heat generated is greater than that of the internal wiring 12 that does not include the connecting portion. That is, the first E region S1E including the connecting portion generates more heat than the first F region S1F not including the connecting portion. Due to this difference in the amount of heat generated, the temperature distribution on the sample holding surface (first surface 10a) becomes uneven. In this embodiment, the electrical resistance value of the heating resistor 11 in the portion included in the 1E region S1E is made lower than the electrical resistance value of the heating resistor 11 in the portion included in the 1F region S1F.

The uneven temperature distribution on the sample holding surface (first surface 10a) is caused by the difference in the amount of heat generated between the first E region S1E and the first F region S1F, which is caused by the connecting portion of the first E region S1E. In this embodiment, the amount of heat generated by the heating resistor 11 can be relatively reduced by relatively lowering the electrical resistance value of the heating resistor 11 in the portion included in the first E region S1E. As a result, the difference in the amount of heat generated between the first E region S1E and the first F region S1F can be reduced, and non-uniform temperature distribution of the sample holding surface can be suppressed. The electric resistance value of the heating resistor 11 in the portion included in the 1E region S1E can be reduced in the same manner as described above.

The first region S1 may include a plurality of regions corresponding to the first E region S1E. When a plurality of heat generating resistors 11 are included, the electric resistance value of the heating resistor 11 may be similarly low in each 1E region S1E, or may be different for each 1E region S1E. For example, it may be varied according to the number of first through conductors 13 and second through conductors 14 included in the first E region S1E.

Next, a second embodiment will be described. As shown in the cross-sectional view of FIG. 4, in the sample holder 101 of the present embodiment, the internal wiring 12 includes a first internal wiring 121 and a second internal wiring 122 located in a layer different from the first internal wiring 121. It is different from the sample holder 100 of the first embodiment in that it has. As shown in FIG. 5, the first region S1 includes a first C region S1C in which the first internal wiring 121 and the second internal wiring 122 overlap each other in the vertical direction, and a first C region S1C in which the first internal wiring 121 and the second internal wiring 122 overlap each other. and a first D region S1D that does not The first C region S1C is a region in which the first internal wiring 121 in the first C region S1C and the second internal wiring 122 in the first C region S1C at least partially overlap each other in plan view. The overlapping portion of the first internal wiring 121 and the second internal wiring 122 generates more heat than when they do not overlap. That is, the first C region S1C including the overlapping portion generates more heat than the first D region S1D not including the overlapping portion. Due to this difference in the amount of heat generated, the temperature distribution on the sample holding surface (first surface 10a) becomes uneven. In this embodiment, the electrical resistance value of the heating resistor 11 in the portion included in the first C region S1C is made lower than the electrical resistance value of the heating resistor 11 in the portion included in the first D region S1D.

The uneven temperature distribution on the sample holding surface (first surface 10a) is caused by the difference in the amount of heat generated between the first C region S1C and the first D region S1D caused by the overlapping portion included in the first C region S1C. there is In this embodiment, the amount of heat generated by the heating resistor 11 can be relatively reduced by relatively reducing the electrical resistance value of the heating resistor 11 in the portion included in the first C region S1C. As a result, the difference in the amount of heat generated between the first C region S1C and the first D region S1D can be reduced, and non-uniform temperature distribution of the sample holding surface can be suppressed. The electric resistance value of the heating resistor 11 in the portion included in the first C region S1C can be lowered in the same manner as described above.

The first region S1 may include a plurality of regions corresponding to the first C region S1C. When a plurality of heat generating resistors 11 are included, the electric resistance value of the heating resistor 11 may be similarly low in each first C region S1C, or may be different for each first C region S1C. For example, it may be varied according to the ratio of the overlapping portion included in the first C region S1C. In plan view, for each first C region S1C, the ratio of the area of the overlapping portion to the area of the first C region S1C is obtained, and the electric resistance value of the heating resistor 11 included in the first C region S1C is calculated according to the obtained ratio. may be reduced by different amounts.

Modifications of the above-described first and second embodiments will be described. FIG. 6 is a cross-sectional view of the sample holder along section line VI-VI of FIG. 3B. The branched portion of the internal wiring 12 generates more heat than the portion of the internal wiring 12 that does not include the branched portion. In the internal wiring 12, the wiring thickness of the branched portion is made thicker than the wiring thickness of the portion other than the branched portion. As a result, the amount of heat generated by the internal wiring 12 having the branched portion can be reduced. Note that the cutting plane line in FIG. 3B is a cutting plane line for explaining a modified example, and in the above description of FIG. are the same.

Further, another modified example of the above-described first and second embodiments will be described. FIG. 7 is a cross-sectional view of the sample holder along section line VII-VII of FIG. 3C. The connection portion between the internal wiring 12 and the first through conductor 13 or the second through conductor 14 generates more heat than the portion of the internal wiring 12 that does not include the connection portion. In the internal wiring 12, the wiring thickness of this connecting portion is made thicker than the wiring thickness of the portion other than the connecting portion. As a result, the amount of heat generated by the internal wiring 12 having the connecting portion can be reduced. Note that the cutting plane line in FIG. 3C is a cutting plane line for explaining another modification, and in the above description of FIG. Same as thickness.

Furthermore, at least part of the internal wiring 12 may be arranged along the boundary line L of the region S of the second surface 10b. For example, as shown in FIG. 3B, the portion having the branched portion of the internal wiring 12 is arranged along the boundary line L, and the general shape of this portion is a fan shape that is the shape of the first A region S1A. It has a shape similar to In particular, when the sample holding surface is circular, providing the fan-shaped region S facilitates the control of the amount of heat generated, and makes it possible to further suppress the non-uniformity of the temperature distribution. Since the shape of the internal wiring 12 (branch portion) and the shape of the region S are similar to each other in this manner, the heat generation overlap region is likely to be the same, and non-uniform temperature distribution is suppressed by controlling the heat generation amount of the region S. be able to.

The sample holder 100 shown in FIGS. 2A and 2B includes a first A region S1A including the branched portion of the internal wiring 12 and a first E region S1E including the connecting portion between the internal wiring 12 and the first penetrating conductor 13 for one sample. Although the holder 100 is assumed to have, neither the first A region S1A including the branched portion nor the first E region S1E including the connecting portion is not essential, and these regions may not be included.

The sample holder 101 shown in FIGS. 4 and 5 has a first C region S1C including overlapping portions of the first internal wiring 121 and the second internal wiring 122. The internal wiring 12 is the first internal wiring. Even in the multilayer wiring structure having 121 and the second internal wiring 122, the first C region S1C including the overlapping portion is not essential, and the first C region S1C may not be included.

Further, when the sample holder 100 has the first A region S1A including the branched portion, the electrical resistance value of the heating resistor 11 does not need to be lower than the first B region S1B that does not include the branched portion. . If the electrical resistance value is lower than the electrical resistance value of the heating resistor 11 in the second region S2, which is a region that does not include the internal wiring 12, the electrical resistance value of the heating resistor 11 in the first A region S1A and the electrical resistance value of the heating resistor 11 in the first B region S1B The electrical resistance value of the heating resistor 11 may be the same.

Further, when the sample holder 100 has the first E region S1E including the connecting portion, the electrical resistance value of the heating resistor 11 does not have to be lower than the first F region S1F not including the connecting portion. . If the electrical resistance value is lower than the electrical resistance value of the heating resistor 11 in the second region S2, which is a region not including the internal wiring 12, the electrical resistance value of the heating resistor 11 in the first E region S1E and the electrical resistance value of the heating resistor 11 in the first F region S1F The electrical resistance value of the heating resistor 11 may be the same.

Further, when the sample holder 101 has the first C region S1C including the overlapping portion, the electrical resistance value of the heating resistor 11 does not have to be lower than the first D region S1D not including the overlapping portion. . If the electrical resistance value is lower than the electrical resistance value of the heating resistor 11 in the second region S2, which is a region that does not include the internal wiring 12, the electrical resistance value of the heating resistor 11 in the first C region S1C and the electrical resistance value of the first D region S1D The electrical resistance value of the heating resistor 11 may be the same.

The present disclosure enables the following embodiments.

A sample holder according to the present disclosure includes a plate-shaped insulating substrate having a first surface serving as a sample holding surface and a second surface opposite to the first surface, and a heat generator provided on the second surface of the insulating substrate. A resistor and an internal wiring provided inside the insulating base are provided. The second surface is divided into a plurality of regions, and the plurality of regions are, in plan view, a first region including a portion of the internal wiring and a portion of the heating resistor, and a first region including the internal wiring. and a second region that does not include the heating resistor and includes another part of the heating resistor. The electrical resistance value of the portion of the heating resistor included in the first region is lower than the electrical resistance value of the portion of the heating resistor included in the second region.

According to the sample holder of the present disclosure, it is possible to suppress uneven temperature distribution on the sample holding surface.

Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications, improvements, etc. can be made without departing from the gist of the present disclosure. It is possible. It goes without saying that all or part of each of the above-described embodiments can be appropriately combined within a non-contradictory range.

REFERENCE SIGNS LIST 10 insulating substrate 10a first surface of insulating substrate 10b second surface of insulating substrate 11 heating resistor 12 internal wiring 13 first through conductor 14 second through conductor 15 first through hole 16 second through hole 20 support 20a support First surface of 20b Second surface of support 21 External wiring 22 Through hole 30 Bonding material 100 Sample holder 121 First internal wiring 122 Second internal wiring L Boundary line S Region S1 First region S1A First A region S1B First B Area S1C First C area S1D First D area S1E First E area S1F First F area S2 Second area

Claims (7)

a plate-like insulating substrate having a first surface serving as a sample holding surface and a second surface opposite to the first surface;
a heating resistor provided on the second surface of the insulating substrate;
and an internal wiring provided inside the insulating base,
The second surface is divided into a plurality of regions,
In plan view, the plurality of regions include a first region including a portion of the internal wiring and a portion of the heating resistor, and a first region that does not include the internal wiring and includes another portion of the heating resistor. and a second region;
A sample holder in which the electrical resistance value of the portion of the heating resistor included in the first region is lower than the electrical resistance value of the portion of the heating resistor included in the second region. the part of the internal wiring has a branched portion,
The first region has a first A region containing the branched portion and a first B region not containing the branched portion,
2. The sample holder according to claim 1, wherein a portion of said heating resistor included in said first A region has an electrical resistance value lower than an electrical resistance value of a portion of said heating resistor included in said first B region. The internal wiring has a first internal wiring and a second internal wiring located in a layer different from the first internal wiring,
The first region has a first C region in which the first internal wiring and the second internal wiring overlap each other in the vertical direction, and a first D region in which the first internal wiring and the second internal wiring do not overlap. ,
3. The sample holder according to claim 1, wherein the electrical resistance value of a portion of said heating resistor included in said first C region is lower than the electrical resistance value of a portion of said heating resistor included in said first D region. equipment. a first through conductor electrically connecting the internal wiring and the heating resistor;
a second through conductor electrically connecting the internal wiring and the external wiring,
The first region has a 1E region including at least one of the first through conductor and the second through conductor, and a 1F region that does not include the first through conductor and the second through conductor,
4. Any one of claims 1 to 3, wherein the electrical resistance value of the portion of the heating resistor included in the 1E region is lower than the electrical resistance value of the portion of the heating resistor included in the 1F region. The sample holder according to 1. 2. The sample holder according to claim 1, wherein said internal wiring has a branched portion, and the wiring thickness at said branched portion is thicker than the wiring thickness at portions other than said branched portion. a first through conductor electrically connecting the internal wiring and the heating resistor;
a second through conductor electrically connecting the internal wiring and the external wiring,
2. The sample holder according to claim 1, wherein said internal wiring has a wiring thickness at a connection portion connected to said first through conductor or said second through conductor, which is thicker than a wiring thickness at a portion other than said connection portion. The specimen holder according to any one of claims 1 to 6, wherein at least part of said internal wiring is arranged along a boundary line of said region.

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