JP7237434B1 - semiconductor equipment - Google Patents

Abstract

A semiconductor device capable of suppressing leakage of a cooling medium from between a module mounting member and a fixing member is obtained. A semiconductor device includes a semiconductor module and a cooler. The cooler has a module mounting member and a fixing member. 206, between the cooling part 205 and the fixed member 202, a flow path 207 through which a cooling medium flows is formed, the cooling part 205 has a cooling main body part 208 and a peripheral edge part 209, The peripheral edge portion 209 is fixed to the fixing member 202 , the peripheral edge portion 209 is a thick portion 221 , and the dimension T1 of the thick portion 221 in the thickness direction of the cooling portion 205 It is larger than the dimension T2 of the cooling body 208 in the vertical direction. [Selection drawing] Fig. 2

Description

The present disclosure relates to semiconductor devices.

2. Description of the Related Art Conventionally, a semiconductor device is known that includes a semiconductor module and a cooler that cools the semiconductor module. The cooler has a module mounting member on which the semiconductor module is mounted and a fixing member to which the module mounting member is fixed. A flow path through which a cooling medium flows is formed between the module mounting member and the fixing member. The module mounting member is fixed to the fixing member with a fastener (see Patent Document 1, for example).

Japanese Patent No. 6884241

However, when the pressure of the cooling medium flowing through the flow path formed between the module mounting member and the fixing member increases, the module mounting member is deformed, and cooling occurs between the module mounting member and the fixing member. There is a problem that the medium may leak out.

The present disclosure has been made to solve the problems described above, and an object thereof is to provide a semiconductor device capable of suppressing leakage of a cooling medium from between a module mounting member and a fixing member. It is something to do.

A semiconductor device according to the present disclosure includes a semiconductor module and a cooler for cooling the semiconductor module. The cooler includes a module mounting member on which the semiconductor module is mounted and a fixing member to which the module mounting member is fixed. The module mounting member has a plate-shaped cooling portion and cooling fins provided in the cooling portion, and a flow path through which a cooling medium flows is formed between the cooling portion and the fixed member. The cooling part has a cooling body part and a peripheral edge part surrounding the cooling body part, and the cooling body part has a cooling surface facing the flow path and a A mounting surface provided on the opposite side to the cooling surface is formed, the semiconductor module is mounted on the mounting surface, the cooling fins are provided on the cooling surface, and the peripheral portion is formed by the fixing member. When viewed in the thickness direction of the cooling section, the outer shape of the cooling body is rectangular, and when viewed in the thickness direction of the cooling section, the longitudinal direction of the cooling body is A first direction is defined as a direction perpendicular to the first direction, and a direction orthogonal to the first direction is defined as a second direction. Peripheral portions arranged at both ends of the cooling portion in the second direction are defined as long side portions, and only the long side portions of the peripheral portion are defined as long side portions . is a thick portion, and the dimension of the thick portion in the thickness direction of the cooling portion is larger than the dimension of the cooling body portion in the thickness direction of the cooling portion.

According to the semiconductor device of the present disclosure, it is possible to suppress leakage of the cooling medium from between the module mounting member and the fixing member.

1 is a plan view showing a semiconductor device according to a first embodiment; FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1; FIG. 3 is an enlarged view showing the cooler and the semiconductor module of FIG. 2; FIG. FIG. 3 is a cross-sectional view showing a semiconductor device of a comparative example; FIG. 10 is a plan view showing a semiconductor device according to a second embodiment; FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5; FIG. 11 is a plan view showing a semiconductor device according to a third embodiment;

Embodiment 1.
FIG. 1 is a plan view showing a semiconductor device according to Embodiment 1. FIG. FIG. 2 is a cross-sectional view taken along line II-II of FIG. The semiconductor device according to Embodiment 1 includes three semiconductor modules 1 and a cooler 2 that cools each of the three semiconductor modules 1 . The semiconductor device according to the first embodiment is provided, for example, in an electric vehicle. Examples of electric vehicles provided with the semiconductor device according to the first embodiment include hybrid vehicles and electric vehicles.

The cooler 2 has a module mounting member 201 , a fixing member 202 , a sealing member 203 and a plurality of fasteners 204 . Each of the three semiconductor modules 1 is mounted on the module mounting member 201 . A module mounting member 201 is fixed to the fixing member 202 . A sealing member 203 is provided between the module mounting member 201 and the fixing member 202 . A module mounting member 201 is fixed to a fixing member 202 with a plurality of fasteners 204 .

The module mounting member 201 has a plate-shaped cooling portion 205 and a plurality of cooling fins 206 provided on the cooling portion 205 . Between the cooling portion 205 and the fixed member 202, a flow path 207 is formed through which a cooling medium flows. The cooling coolant flowing through the channel 207 cools the module mounting member 201 . The semiconductor module 1 is cooled by cooling the module mounting member 201 . Therefore, the module mounting member 201 has the function of a heat sink that transfers the heat generated in the semiconductor module 1 to the cooling medium.

The cooling portion 205 has a cooling body portion 208 and a peripheral edge portion 209 surrounding the cooling body portion 208 . The cooling main body 208 has a cooling surface 210 facing the flow path 207 and a mounting surface 211 provided on the opposite side of the cooling surface 210 in the thickness direction of the cooling main body 208. .

When viewed in the thickness direction of the cooling portion 205, the outer shape of the cooling body portion 208 is rectangular. The longitudinal direction of the cooling body portion 208 when viewed in the thickness direction of the cooling portion 205 is defined as a first direction D1. A direction perpendicular to the first direction D1 when viewed in the thickness direction of the cooling portion 205 is defined as a second direction D2.

Three semiconductor modules 1 are mounted on the mounting surface 211 . Thereby, the module mounting member 201 is arranged between the fixing member 202 and the three semiconductor modules 1 . A plurality of cooling fins 206 are provided on the cooling surface 210 . A plurality of cooling fins 206 are arranged in the channel 207 .

The mounting surface 211 is arranged along a plane orthogonal to the thickness direction of the cooling section 205 . The direction in which the three semiconductor modules 1 are arranged matches the first direction D1. In other words, the three semiconductor modules 1 are arranged in a row in the longitudinal direction of the cooling body 208 .

When viewed in the thickness direction of the cooling portion 205 , the peripheral edge portion 209 overlaps the fixing member 202 . Peripheral edge 209 is secured to securing member 202 by a plurality of fasteners 204 .

The sealing member 203 closes the gap between the peripheral portion 209 and the fixing member 202 . The sealing member 203 closes the gap between the peripheral portion 209 and the fixing member 202 , thereby suppressing leakage of the cooling medium flowing through the flow path 207 from between the module mounting member 201 and the fixing member 202 .

The module mounting member 201 is made of metal. Metals forming the module mounting member 201 include, for example, aluminum, iron, and copper.

The fixing member 202 is made of metal. Examples of the metal forming the fixing member 202 include aluminum, iron, and copper.

Fasteners 204 include, for example, screws.

The seal member 203 is composed of an elastic body. Examples of the elastic body forming the seal member 203 include rubber. Note that the sealing member 203 is not limited to an elastic body, and may be, for example, a liquid sealing material.

The semiconductor module 1 performs power conversion. The semiconductor module 1 has an input terminal and an output terminal. The semiconductor module 1 converts a direct current supplied from a battery (not shown) into an alternating current and outputs the converted alternating current.

The fixed member 202 has a support plate 212 , a lower plate 213 , a first pipe 214 and a second pipe 215 .

The support plate 212 is formed with a first hole 216 into which the first pipe 214 is inserted and a second hole 217 into which the second pipe 215 is inserted. The first pipe 214 is fixed to the support plate 212 . The second pipe 215 is fixed to the support plate 212 . The cooling coolant enters the flow path 207 by passing through the first pipe 214 and exits the flow path 207 by passing through the second pipe 215 .

The lower plate 213 is arranged between the support plate 212 and the module mounting member 201 . The lower plate 213 is fixed to the support plate 212 . The shape of the lower plate 213 is a plate shape. A through hole 218 is formed in the lower plate 213 . The through hole 218 penetrates the lower plate 213 in the thickness direction of the lower plate 213 .

The lower plate 213 faces the peripheral portion 209 of the module mounting member 201 . A fixing surface 219 facing the peripheral edge portion 209 is formed on the lower plate 213 . A seal groove 220 into which the seal member 203 is inserted is formed in the fixed surface 219 . The seal groove 220 and the seal member 203 are formed to surround the through hole 218 when viewed in the thickness direction of the lower plate 213 . The sealing member 203 closes the gap between the lower plate 213 and the peripheral edge portion 209 while the sealing member 203 is in contact with the peripheral edge portion 209 .

The module mounting member 201 closes the through hole 218 . A peripheral edge portion 209 of the module mounting member 201 is in contact with the fixed surface 219 of the lower plate 213 .

When viewed in the thickness direction of the cooling portion 205, the through hole 218 is an elongated hole extending in the first direction D1. Moreover, when viewed in the thickness direction of the cooling portion 205 , the three semiconductor modules 1 are arranged inside the through-holes 218 .

The semiconductor module 1 is fixed to the cooling body 208 by fixing the semiconductor module 1 to the mounting surface 211 . A method of fixing the semiconductor module 1 to the mounting surface 211 includes, for example, a method of fixing with an adhesive or brazing. As a method for fixing the semiconductor module 1 to the cooling main body 208, the semiconductor module 1 is fixed by a pressing member that presses the semiconductor module 1 against the cooling main body 208 and a fastener that fixes the pressing member to the cooling main body 208. A method of fixing to the cooling main body 208 may be used.

Each cooling fin 206 protrudes from the cooling surface 210 of the cooling body 208 in the thickness direction of the cooling body 208 . A tip of each cooling fin 206 is inserted into a through hole 218 of the lower plate 213 . Each cooling fin 206 has a cylindrical shape.

When viewed in the thickness direction of the cooling portion 205 , the peripheral edge portion 209 overlaps the lower plate 213 of the fixing member 202 . When viewed in the thickness direction of the cooling portion 205 , the peripheral portion 209 is arranged so as to surround the mounting surface 211 .

Peripheral edge 209 is secured to bottom plate 213 by a plurality of fasteners 204 . The seal groove 220 and the seal member 203 are arranged closer to the through hole 218 than the plurality of fasteners 204 when viewed in the thickness direction of the cooling portion 205 . Note that the peripheral portion 209 may be fixed to the lower plate 213 by adhesion or welding. In this case, the fastener 204 becomes unnecessary. As a method for fixing the peripheral edge portion 209 to the lower plate 213, the peripheral edge portion 209 is fixed to the lower plate 213 by a pressing member that presses the peripheral edge portion 209 against the lower plate 213 and a fastener that fixes the pressing member to the lower plate 213. It may be a method of fixing to.

Cooling portion 205 and cooling fins 206 are integrally formed with each other. In other words, the module mounting member 201 is a single member made of the same material and integrally formed so as not to be disassembled.

The cooling part 205 is manufactured by manufacturing a plate-shaped intermediate material by extrusion molding and then cutting the intermediate material so that the mounting surface 211 is formed. Note that the cooling portion 205 may be manufactured by forging. In the case of forging, the step of cutting can be eliminated as compared with the case of extrusion. Therefore, in this case, the manufacturing process of the cooling part 205 can be simplified.

FIG. 3 is an enlarged view showing the semiconductor module 1, the module mounting member 201 and the fastener 204 of FIG. The entire peripheral portion 209 is a thick portion 221 . The dimension of the thick portion 221 in the thickness direction of the cooling portion 205, that is, the thickness of the thick portion 221 is T1. The dimension of the cooling main body 208 in the thickness direction of the cooling part 205, that is, the thickness of the cooling main body 208 is T2. The thickness T1 of the thick portion 221 is larger than the thickness T2 of the cooling body portion 208 .

As shown in FIG. 2 , the surface of the thick portion 221 facing the fixing member 202 is flush with the cooling surface 210 of the cooling body portion 208 .

The thick portion 221 protrudes toward the semiconductor module 1 from the mounting surface 211 in the thickness direction of the cooling portion 205 . The thickness T1 of the thick portion 221 is larger than the thickness T2 of the cooling body portion 208 because the thick portion 221 protrudes toward the semiconductor module 1 from the mounting surface 211 .

FIG. 4 is a cross-sectional view showing a semiconductor device of a comparative example. The semiconductor device of the comparative example includes a semiconductor module 1A and a cooler 2A for cooling the semiconductor module 1A. The cooler 2A has a module mounting member 201A, a fixing member 202A, a sealing member 203A, and a plurality of fasteners 204A. The configuration of the semiconductor device of the comparative example is the same as that of the semiconductor device according to the first embodiment, except for the module mounting member 201A.

The module mounting member 201A has a plate-shaped cooling portion 205A and cooling fins 206A provided on the cooling portion 205A. Between the cooling portion 205A and the fixed member 202A, a channel 207A through which a cooling medium flows is formed. The cooling portion 205A has a cooling body portion 208A and a peripheral edge portion 209A surrounding the cooling body portion 208A.

The dimension of the peripheral edge portion 209A in the thickness direction of the cooling portion 205A, that is, the thickness of the peripheral edge portion 209A, is the same as the dimension of the cooling main body portion 208A in the thickness direction of the cooling portion 205A, that is, the thickness of the cooling main body portion 208A. ing. In other words, the peripheral portion 209A is not a thick portion.

In the semiconductor device of the comparative example, the rigidity of the module mounting member 201A can be increased by increasing the thickness of the cooling body portion 208A and the thickness of the peripheral edge portion 209A. By increasing the rigidity of the module mounting member 201A, deformation of the module mounting member 201A is suppressed even when the pressure of the coolant flowing through the flow path 207A increases. As a result, it is possible to prevent the coolant from leaking out from between the module mounting member 201A and the fixing member 202A.

However, increasing the thickness of the cooling main body 208A increases the thermal resistance between the cooling medium in the cooler 2A and the semiconductor module 1A. As a result, the cooling performance of the semiconductor module 1A by the cooler 2A is degraded.

On the other hand, in the semiconductor device according to the first embodiment, as shown in FIG. The thickness T1 of the thick portion 221 is larger than the thickness T2 of the cooling body portion 208 . As a result, the rigidity of the module mounting member 201 can be increased without increasing the thickness of the cooling main body 208 . Therefore, it is possible to prevent the coolant from leaking out from between the module mounting member 201 and the fixing member 202 without lowering the cooling performance of the semiconductor module 1 by the cooler 2 .

As described above, the semiconductor device according to the first embodiment includes semiconductor module 1 and cooler 2 that cools semiconductor module 1 . The cooler 2 has a module mounting member 201 on which the semiconductor module 1 is mounted, and a fixing member 202 to which the module mounting member 201 is fixed. The module mounting member 201 has a plate-shaped cooling portion 205 and cooling fins 206 provided on the cooling portion 205 . Between the cooling portion 205 and the fixed member 202, a flow path 207 is formed through which a cooling medium flows. The cooling portion 205 has a cooling body portion 208 and a peripheral edge portion 209 surrounding the cooling body portion 208 . The peripheral edge portion 209 is fixed to the fixing member 202 , and the peripheral edge portion 209 is a thick portion 221 . The thickness T1 of the thick portion 221 is larger than the thickness T2 of the cooling body portion 208 .

According to this configuration, the rigidity of the module mounting member 201 can be increased without lowering the cooling performance of the semiconductor module 1 by the cooler 2 . As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be suppressed without reducing the cooling performance of the semiconductor module 1 by the cooler 2 .

Further, since the rigidity of the module mounting member 201 is increased, the deformation of the module mounting member 201 due to the pressure of the coolant flowing through the flow path 207 is suppressed. This suppresses the positional fluctuation of the semiconductor module 1 provided on the module mounting member 201 . The semiconductor module 1 has connection terminals electrically connected to a control board (not shown). When the position of the semiconductor module 1 with respect to the control board changes, stress acts on the connection terminals of the semiconductor module 1 . The electrical connection between the connection terminals of the semiconductor module 1 and the control substrate may be broken due to repeated application of stress to the connection terminals of the semiconductor module 1 . Conventionally, in order to suppress disconnection of the electrical connection between the connection terminals of the semiconductor module and the control board, the length of the connection terminals of the semiconductor module is increased to reduce the stress acting on the connection terminals of the semiconductor module. had been reduced. On the other hand, in the semiconductor device according to the first embodiment, positional variation of the semiconductor module 1 is suppressed. As a result, the stress acting on the connection terminals of the semiconductor module 1 can be reduced, and the length of the connection terminals can be reduced.

As the module mounting member 201 approaches the central portion in the first direction D1, the deformation of the module mounting member 201 due to the pressure of the cooling medium flowing through the flow path 207 increases. Conventionally, the stress acting on the connection terminals of the semiconductor module has been reduced by arranging the connection terminals of the semiconductor module while avoiding the central portion of the module mounting member in the first direction D1. Conventionally, when the connection terminals of the semiconductor module are arranged in the central portion of the module mounting member in the first direction D1, the length of the connection terminals of the semiconductor module is increased so that the connection terminals of the semiconductor module 1 It reduced the acting stress. On the other hand, in the semiconductor device according to the first embodiment, positional variation of the semiconductor module 1 is suppressed. Accordingly, the connection terminals of the semiconductor module 1 can be arranged in the central portion of the module mounting member 201 in the first direction D1 without increasing the length of the connection terminals of the semiconductor module 1 .

Further, since the rigidity of the module mounting member 201 is increased, fluctuations in the flow channel cross-sectional area of the flow channel 207 formed between the module mounting member 201 and the fixing member 202 are suppressed. Thereby, the cooling performance of the semiconductor module 1 by the module mounting member 201 can be stabilized.

In order to suppress fluctuations in the cooling performance of the semiconductor module 1 by the module mounting member 201, it is conceivable to reduce the thermal resistance between the module mounting member 201 and the semiconductor module 1. FIG. Conventionally, fluctuations in the cooling performance of the semiconductor module 1 due to the module mounting member 201 have been suppressed by forming the mounting surface of the module mounting member so that the surface roughness of the mounting surface of the module mounting member is small. On the other hand, in the semiconductor device according to the first embodiment, cooling performance of the semiconductor module 1 by the module mounting member 201 is stabilized. This eliminates the need to reduce the surface roughness of the mounting surface 211 of the module mounting member 201 .

The semiconductor device according to the first embodiment also includes sealing member 203 that closes the gap between peripheral edge portion 209 and fixing member 202 . The sealing member 203 is arranged between the thick portion 221 and the fixed member 202 . With this configuration, the rigidity of the module mounting member 201 can be further increased. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be more reliably suppressed. In addition, the rigidity of the portion of the peripheral portion 209 that is in contact with the seal member 203 can be increased. This can prevent the peripheral portion 209 from separating from the seal member 203 .

Moreover, in the semiconductor device according to the first embodiment, the semiconductor module 1 is adhered to the mounting surface 211 with an adhesive. This configuration can prevent the semiconductor module 1 from coming off the module mounting member 201 . By fixing the semiconductor module 1 to the mounting surface 211 with an adhesive, stress is likely to act on the semiconductor module 1 from the module mounting member 201 . However, in the semiconductor device according to the first embodiment, the stress acting on the semiconductor module 1 from the module mounting member 201 can be reduced by increasing the rigidity of the module mounting member 201 . As a result, deterioration of fixing between the mounting surface 211 and the semiconductor module 1 can be suppressed.

Embodiment 2.
FIG. 5 is a plan view showing the semiconductor device according to the second embodiment. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5. FIG. In the semiconductor device according to the second embodiment, when viewed in the thickness direction of the cooling portion 205, the portions of the peripheral portion 209 arranged at both ends of the cooling portion 205 in the second direction D2 are the long side portions 222. and Thus, long side 222 is part of peripheral edge 209 .

The entire long side portion 222 is a thick portion 223 . The dimension of the thick portion 223 in the thickness direction of the cooling portion 205 , that is, the thickness T<b>1 of the thick portion 223 is greater than the thickness T<b>2 of the cooling body portion 208 . Therefore, the thickness T1 of the long side portion 222 is greater than the thickness T2 of the cooling main body portion 208 .

The thickness of the peripheral edge portion 209 excluding the long side portion 222 matches the thickness T2 of the cooling body portion 208 .

Cooling section 205 is manufactured by extrusion. Note that the cooling portion 205 may be manufactured by forging. Regardless of whether extrusion molding or forging molding is used, the cooling portion 205 can be manufactured by one-time processing without a step of cutting.

Other configurations of the semiconductor device according to the second embodiment are the same as those of the semiconductor device according to the first embodiment.

As described above, in the semiconductor device according to the second embodiment, the long side portions 222 are arranged at both ends of the cooling portion 205 in the second direction D2 when viewed in the thickness direction of the cooling portion 205. ing. The entire long side portion 222 is a thick portion 223 . The thickness T1 of the thick portion 223 is larger than the thickness T2 of the cooling body portion 208 . With this configuration, the rigidity against deformation of the central portion of the module mounting member 201 in the first direction D1 can be increased. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be suppressed.

Further, in the semiconductor device according to the second embodiment, part of sealing member 203 is arranged between thick portion 223 and fixing member 202 . According to this configuration, the rigidity against deformation of the central portion of the module mounting member 201 in the first direction D1 can be further increased. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be more reliably suppressed. Further, the rigidity of the portion of the long side portion 222 that is in contact with the seal member 203 can be increased. This can prevent the long side portion 222 from separating from the seal member 203 .

Embodiment 3.
FIG. 7 is a plan view showing the semiconductor device according to the third embodiment. In the semiconductor device according to the third embodiment, part of long side portion 222 is thick portion 224 . The dimension of the thick portion 224 in the thickness direction of the cooling portion 205 , that is, the thickness T<b>1 of the thick portion 224 is greater than the thickness T<b>2 of the cooling body portion 208 . Accordingly, the thickness T1 of a portion of the long side portion 222 is greater than the thickness T2 of the cooling main body portion 208 .

The thickness of the peripheral portion 209 excluding the thick portion 224 matches the thickness T2 of the cooling body portion 208 .

The thick portion 224 is arranged in the middle portion of the long side portion 222 in the first direction D1. Module mounting member 201 is formed to extend in first direction D1. Therefore, the central portion of the module mounting member 201 in the first direction D1 is likely to be deformed. By arranging the thick portion 224 in the middle portion of the long side portion 222 in the first direction D1, the rigidity against deformation of the central portion of the module mounting member 201 in the first direction D1 is increased.

The cooling portion 205 is manufactured by manufacturing a plate-shaped intermediate member by extrusion molding, and then cutting the intermediate member so as to leave the thick portion 223 on part of the long side portion 222 . Note that the cooling portion 205 may be manufactured by forging.

Other configurations of the semiconductor device according to the third embodiment are the same as those of the semiconductor device according to the second embodiment.

As described above, in the semiconductor device according to the third embodiment, part of the long side portion 222 is the thick portion 224 . The thick portion 224 is arranged in the middle portion of the long side portion 222 in the first direction D1. This configuration increases the rigidity against deformation of the central portion of the module mounting member 201 in the first direction D1. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be suppressed.

Further, in the semiconductor device according to the third embodiment, part of sealing member 203 is arranged between thick portion 224 and fixing member 202 . According to this configuration, the rigidity against deformation of the central portion of the module mounting member 201 in the first direction D1 can be further increased. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be more reliably suppressed. Further, the rigidity of the portion of the long side portion 222 that is in contact with the seal member 203 can be increased. This can prevent the long side portion 222 from separating from the seal member 203 .

1 semiconductor module, 2 cooler, 201 module mounting member, 202 fixing member, 203 sealing member, 204 fastener, 205 cooling part, 206 cooling fin, 207 flow path, 208 cooling body part, 209 peripheral part, 210 cooling surface , 211 mounting surface, 212 support plate, 213 lower plate, 214 first pipe, 215 second pipe, 216 first hole, 217 second hole, 218 through hole, 219 fixing surface, 220 seal groove, 221 thick portion, 222 long side portion, 223 thick portion, 224 thick portion.

Claims (4)

a semiconductor module;
a cooler for cooling the semiconductor module;
with
The cooler has a module mounting member on which the semiconductor module is mounted and a fixing member to which the module mounting member is fixed,
The module mounting member has a plate-shaped cooling portion and cooling fins provided in the cooling portion,
A flow path through which a cooling medium flows is formed between the cooling part and the fixing member,
The cooling unit has a cooling main body and a peripheral edge surrounding the cooling main body,
The cooling main body has a cooling surface facing the flow path and a mounting surface provided on the side opposite to the cooling surface in the thickness direction of the cooling main body,
The semiconductor module is mounted on the mounting surface,
The cooling fins are provided on the cooling surface,
The peripheral portion is fixed to the fixing member,
When viewed in the thickness direction of the cooling portion, the outer shape of the cooling body portion is a rectangle,
When viewed in the thickness direction of the cooling portion, the longitudinal direction of the cooling body portion is defined as a first direction, the direction orthogonal to the first direction is defined as a second direction, and both ends of the cooling portion in the second direction The portion of the peripheral edge portion arranged in each of the portions is a long side portion,
Only the long side portion in the peripheral portion is a thick portion,
A semiconductor device, wherein the dimension of the thick portion in the thickness direction of the cooling portion is larger than the dimension of the cooling body portion in the thickness direction of the cooling portion. 2. The semiconductor device according to claim 1, wherein said peripheral portion is fixed to said fixing member by adhesion or welding. The cooler has a sealing member that closes a gap between the peripheral portion and the fixed member,
3. The semiconductor device according to claim 1, wherein at least part of said sealing member is arranged between said thick portion and said fixing member. 4. The semiconductor device according to claim 1, wherein said semiconductor module is fixed to said mounting surface by an adhesive or brazing.

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