CN116031223A - Semiconductor device with a semiconductor device having a plurality of semiconductor chips - Google Patents
Semiconductor device with a semiconductor device having a plurality of semiconductor chips Download PDFInfo
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- CN116031223A CN116031223A CN202211259354.9A CN202211259354A CN116031223A CN 116031223 A CN116031223 A CN 116031223A CN 202211259354 A CN202211259354 A CN 202211259354A CN 116031223 A CN116031223 A CN 116031223A
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- cooling
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Abstract
The invention provides a semiconductor device capable of inhibiting leakage of cooling medium from between a module mounting member and a fixing member. The semiconductor device comprises a semiconductor module (1) and a cooler (2), wherein the cooler (2) is provided with a module mounting member (201) and a fixing member (202), the module mounting member (201) is provided with a cooling part (205) and a cooling fin (206), a flow path (207) for cooling refrigerant to flow is formed between the cooling part (205) and the fixing member (202), the cooling part (205) is provided with a cooling main body part (208) and a peripheral part (209), the peripheral part (209) is fixed on the fixing member (202), the peripheral part (209) becomes a thick wall part (221), and the size (T1) of the thick wall part (221) in the thickness direction of the cooling part (205) is larger than the size (T2) of the cooling main body part (208) in the thickness direction of the cooling part (205).
Description
Technical Field
The present invention relates to a semiconductor device.
Background
Conventionally, a semiconductor device having a semiconductor module and a cooler for cooling the semiconductor module is known. The cooler has a module mounting member for mounting the semiconductor module and a fixing member for fixing the module mounting member. A flow path through which the cooling medium flows is formed between the module mounting member and the fixing member. The module mounting member is fixed to the fixing member by a fastener (for example, refer to patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent No. 6884241
Disclosure of Invention
Technical problem to be solved by the invention
However, in the case where the pressure of the cooling medium flowing in the flow path formed between the module mounting member and the fixing member increases, there is a problem as follows: the module mounting member may be deformed, resulting in leakage of the cooling medium from between the module mounting member and the fixing member.
The present disclosure has been made to solve the above-described problems, and an object thereof is to provide a semiconductor device capable of suppressing leakage of a cooling medium from between a module mounting member and a fixing member.
Technical means for solving the technical problems
The semiconductor device according to the present disclosure includes: the semiconductor module includes a module mounting member for mounting the semiconductor module, and a fixing member for fixing the module mounting member, wherein the module mounting member includes a plate-shaped cooling portion and a cooling fin provided in the cooling portion, a flow path through which a cooling refrigerant flows is formed between the cooling portion and the fixing member, the cooling portion includes a cooling body portion and a peripheral portion surrounding the cooling body portion, a cooling surface facing the flow path and a mounting surface provided on a side opposite to the cooling surface in a thickness direction of the cooling body portion are formed on the cooling body portion, the semiconductor module is mounted on the mounting surface, the cooling fin is provided on the cooling surface, the peripheral portion is fixed to the fixing member, at least a part of the peripheral portion is a thick-wall portion, and a size of the thick-wall portion in the thickness direction of the cooling portion is larger than a size of the cooling body portion in the thickness direction of the cooling portion.
Effects of the invention
According to the semiconductor device of the present disclosure, leakage of the cooling medium from between the module mounting member and the fixing member can be suppressed.
Drawings
Fig. 1 is a plan view showing a semiconductor device according to embodiment 1.
Fig. 2 is a sectional view taken along the arrow direction of the line II-II of fig. 1.
Fig. 3 is an enlarged view illustrating the cooler and the semiconductor module of fig. 2.
Fig. 4 is a cross-sectional view showing the semiconductor device of the comparative example.
Fig. 5 is a plan view showing a semiconductor device according to embodiment 2.
Fig. 6 is a cross-sectional view in the direction of the arrow along the VI-VI line of fig. 5.
Fig. 7 is a plan view showing a semiconductor device according to embodiment 3.
Detailed Description
Fig. 1 is a plan view showing a semiconductor device according to embodiment 1. Fig. 2 is a sectional view taken along the arrow direction of the line II-II of fig. 1. The semiconductor device of embodiment 1 includes three semiconductor modules 1 and a cooler 2 for cooling each of the three semiconductor modules 1. The semiconductor device of embodiment 1 is provided in an electrically powered vehicle, for example. Examples of the electrically powered vehicle provided with the semiconductor device of embodiment 1 include a hybrid vehicle and an electric vehicle.
The cooler 2 has a module mounting member 201, a fixing member 202, a sealing member 203, and a plurality of fasteners 204. Each of the three semiconductor modules 1 is mounted on the module mounting member 201. The module mounting member 201 is fixed to the fixing member 202. The sealing member 203 is disposed between the module mounting member 201 and the fixing member 202. The module mounting member 201 is secured to the securing member 202 by a plurality of fasteners 204.
The module mounting member 201 has a plate-shaped cooling portion 205 and a plurality of cooling fins 206 provided in the cooling portion 205. A flow path 207 through which the cooling refrigerant flows is formed between the cooling portion 205 and the fixing member 202. The module mounting member 201 is cooled by the cooling refrigerant flowing through the flow path 207. The semiconductor module 1 is cooled by cooling the module mounting member 201. Accordingly, the module mounting member 201 has a function of a heat sink that transfers heat generated in the semiconductor module 1 to the cooling medium.
The cooling portion 205 has a cooling body portion 208 and a peripheral portion 209 surrounding the cooling body portion 208. A cooling surface 210 facing the flow path 207 and a mounting surface 211 are formed on the cooling body 208, and the mounting surface 211 is provided on the opposite side of the cooling body 208 from the cooling surface 210 in the thickness direction.
The cooling body 208 has a rectangular outer shape when viewed in the thickness direction of the cooling portion 205. The longitudinal direction of the cooling body 208 is defined as a first direction D1 when viewed in the thickness direction of the cooling portion 205. When viewed in the thickness direction of the cooling portion 205, a direction orthogonal to the first direction D1 is set as a second direction D2.
Three semiconductor modules 1 are mounted on the mounting surface 211. Thereby, the module mounting member 201 is arranged between the fixing member 202 and the three semiconductor modules 1. A plurality of cooling fins 206 are disposed on the cooling surface 210. The plurality of cooling fins 206 are disposed in the flow path 207.
The mounting surface 211 is disposed along a plane orthogonal to the thickness direction of the cooling portion 205. The direction in which the three semiconductor modules 1 are arranged coincides with the first direction D1. In other words, the three semiconductor modules 1 are arranged in a row in the longitudinal direction of the cooling body 208.
The peripheral edge portion 209 overlaps the fixing member 202 when viewed in the thickness direction of the cooling portion 205. The peripheral edge portion 209 is fixed to the fixing member 202 by a plurality of fasteners 204.
The sealing member 203 closes the gap between the peripheral edge portion 209 and the fixing member 202. The sealing member 203 closes the gap between the peripheral portion 209 and the fixing member 202, thereby preventing the cooling medium flowing through the flow path 207 from leaking out from between the module mounting member 201 and the fixing member 202.
The module mounting member 201 is composed of metal. Examples of the metal constituting the module mounting member 201 include aluminum, iron, and copper.
The fixing member 202 is made of metal. Examples of the metal constituting the fixing member 202 include aluminum, iron, and copper.
The fastener 204 may be, for example, a screw.
The sealing member 203 is made of an elastomer. Examples of the elastic body constituting the sealing member 203 include rubber. The sealing member 203 is not limited to an elastomer, and may be a liquid sealing material, for example.
The semiconductor module 1 performs power conversion. The semiconductor module 1 has an input terminal and an output terminal. The semiconductor module 1 converts a direct current supplied from a battery, not shown, into an alternating current, and outputs the converted alternating current.
The fixing member 202 has a support plate 212, a lower plate 213, a first duct 214, and a second duct 215.
In the support plate 212, a first hole 216 into which the first duct 214 is inserted and a second hole 217 into which the second duct 215 is inserted are formed. The first conduit 214 is secured to the support plate 212. The second duct 215 is fixed to the support plate 212. The cooling refrigerant passes through the first pipe 214, enters the flow path 207, passes through the second pipe 215, and flows out of the flow path 207.
The lower plate 213 is disposed between the support plate 212 and the module mounting member 201. The lower plate 213 is fixed to the support plate 212. The shape of the lower plate 213 is a plate shape. A through hole 218 is formed in the lower plate 213. The through hole 218 penetrates the lower plate 213 in the thickness direction of the lower plate 213.
The lower plate 213 is opposed to the peripheral edge portion 209 of the module mounting member 201. The lower plate 213 has a fixing surface 219 facing the peripheral edge 209. In the fixing surface 219, a seal groove 220 into which the seal member 203 is inserted is formed. The seal groove 220 and the seal member 203 are formed so as to surround the through hole 218 when viewed in the thickness direction of the lower plate 213. In a state where the sealing member 203 is in contact with the peripheral edge portion 209, the sealing member 203 closes the gap between the lower plate 213 and the peripheral edge portion 209.
The module mounting member 201 blocks the through hole 218. The peripheral edge portion 209 of the module mounting member 201 contacts the fixing surface 219 of the lower plate 213.
The through hole 218 is a long hole extending in the first direction D1 when viewed in the thickness direction of the cooling portion 205. In addition, three semiconductor modules 1 are arranged inside the through hole 218 when viewed in the thickness direction of the cooling portion 205.
By fixing the semiconductor module 1 to the mounting surface 211, the semiconductor module 1 is fixed to the cooling body 208. As a method for fixing the semiconductor module 1 to the mounting surface 211, for example, a method of fixing by an adhesive or soldering is given. As a method of fixing the semiconductor module 1 to the cooling body 208, the semiconductor module 1 may be fixed to the cooling body 208 by a pressing member that presses the semiconductor module 1 against the cooling body 208 and a fastener that fixes the pressing member to the cooling body 208.
Each cooling fin 206 protrudes from a cooling surface 210 of the cooling body portion 208 in the thickness direction of the cooling body portion 208. The front end portions of the cooling fins 206 are inserted into the through holes 218 of the lower plate 213. The shape of each cooling fin 206 is a cylindrical shape.
The peripheral edge portion 209 overlaps the lower plate 213 of the fixing member 202 when viewed in the thickness direction of the cooling portion 205. The peripheral edge portion 209 is disposed so as to surround the mounting surface 211 when viewed in the thickness direction of the cooling portion 205.
The peripheral edge 209 is fixed to the lower plate 213 by a plurality of fasteners 204. The seal groove 220 and the seal member 203 are disposed closer to the through hole 218 than the plurality of fasteners 204 when viewed in the thickness direction of the cooling portion 205. The peripheral edge portion 209 may be fixed to the lower plate 213 by bonding or welding. In this case, the fastener 204 is not required. As a method of fixing the peripheral edge 209 to the lower plate 213, the peripheral edge 209 may be fixed to the lower plate 213 by a pressing member that presses the peripheral edge 209 against the lower plate 213 and a fastener that fixes the pressing member to the lower plate 213.
The cooling portion 205 and the cooling fin 206 are integrally formed with each other. In other words, the module mounting member 201 is composed of the same material, and is a single member that is non-detachably integrally formed.
The cooling portion 205 is manufactured by manufacturing a plate-shaped intermediate material by extrusion molding, and then by cutting the intermediate material to form the mounting surface 211. The cooling portion 205 may be manufactured by forging forming. In the case of forging, the cutting step can be omitted as compared with the case of extrusion. Therefore, in this case, the manufacturing process of the cooling unit 205 can be simplified.
Fig. 3 is an enlarged view showing the semiconductor module 1, the module mounting member 201, and the fastener 204 of fig. 2. The entire peripheral edge 209 is a thick portion 221. The dimension of the thick portion 221 in the thickness direction of the cooling portion 205, that is, the thickness of the thick portion 221 is set to T1. The dimension of the cooling body 208 in the thickness direction of the cooling portion 205, that is, the thickness of the cooling body 208 is set to T2. The thickness T1 of the thick portion 221 is greater than the thickness T2 of the cooling body portion 208.
As shown in fig. 2, the surface of the thick-wall portion 221 opposite to the fixing member 202 is flush with the cooling surface 210 in the cooling body portion 208.
The thick portion 221 protrudes to the semiconductor module 1 side from the mounting surface 211 in the thickness direction of the cooling portion 205. Since the thick portion 221 protrudes to the semiconductor module 1 side from the mounting surface 211, the thickness T1 of the thick portion 221 is larger than the thickness T2 of the cooling body portion 208.
Fig. 4 is a cross-sectional view showing the semiconductor device of the comparative example. The semiconductor device of the comparative example includes a semiconductor module 1A and a cooler 2A for cooling the semiconductor module 1A. The cooler 2A has a module mounting member 201A, a fixing member 202A, a sealing member 203A, and a plurality of fasteners 204A. The structure of the semiconductor device of the comparative example is the same as that of the semiconductor device of embodiment 1 except for the module mounting member 201A.
The module mounting member 201A has a plate-shaped cooling portion 205A and cooling fins 206A provided on the cooling portion 205A. A flow path 207A through which the cooling refrigerant flows is formed between the cooling portion 205A and the fixing member 202A. The cooling portion 205A has a cooling body portion 208A and a peripheral portion 209A surrounding the cooling body portion 208A.
The size of the peripheral edge portion 209A in the thickness direction of the cooling portion 205A, that is, the thickness of the peripheral edge portion 209A is the same as the size of the cooling body portion 208A in the thickness direction of the cooling portion 205A, that is, the thickness of the cooling body portion 208A. In other words, the peripheral edge portion 209A is not a thick wall portion.
In the semiconductor device of the comparative example, by increasing the respective dimensions of the thickness of the cooling body portion 208A and the thickness of the peripheral portion 209A, the rigidity of the module mounting member 201A can be improved. By increasing the rigidity of the module mounting member 201A, even when the pressure of the cooling refrigerant flowing in the flow path 207A increases, deformation of the module mounting member 201A can be suppressed. This can suppress leakage of the cooling refrigerant from between the module mounting member 201A and the fixing member 202A.
However, by increasing the thickness of the cooling body portion 208A, the thermal resistance between the cooling medium in the cooler 2A and the semiconductor module 1A becomes large. Thereby, the cooling performance of the semiconductor module 1A by the cooler 2A is lowered.
On the other hand, in the semiconductor device according to embodiment 1, as shown in fig. 3, the peripheral portion 209 is a thick portion 221. The thickness T1 of the thick portion 221 is greater than the thickness T2 of the cooling body portion 208. Thereby, the rigidity of the module mounting member 201 can be improved without increasing the thickness of the cooling body portion 208. Therefore, leakage of the cooling refrigerant from between the module mounting member 201 and the fixing member 202 can be suppressed without degrading the cooling performance of the cooler 2 to the semiconductor module 1.
As described above, the semiconductor device of embodiment 1 includes the semiconductor module 1 and the cooler 2 for cooling the semiconductor module 1. The cooler 2 has a module mounting member 201 that mounts the semiconductor module 1 and a fixing member 202 that fixes the module mounting member 201. The module mounting member 201 has a plate-shaped cooling portion 205 and cooling fins 206 provided in the cooling portion 205. A flow path 207 through which the cooling refrigerant flows is formed between the cooling portion 205 and the fixing member 202. The cooling portion 205 has a cooling body portion 208 and a peripheral portion 209 surrounding the cooling body portion 208. The peripheral edge portion 209 is fixed to the fixing member 202, and the peripheral edge portion 209 becomes a thick wall portion 221. The thickness T1 of the thick portion 221 is greater than the thickness T2 of the cooling body portion 208.
According to this structure, the rigidity of the module mounting member 201 can be improved without degrading the cooling performance of the cooler 2 to the semiconductor module 1. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be suppressed without degrading the cooling performance of the cooler 2 to the semiconductor module 1.
Further, by increasing the rigidity of the module mounting member 201, deformation of the module mounting member 201 due to the pressure of the cooling refrigerant flowing in the flow path 207 can be suppressed. This suppresses the variation in the position of the semiconductor module 1 mounted on the module mounting member 201. The semiconductor module 1 has connection terminals electrically connected to a control board not shown. When the position of the semiconductor module 1 relative to the control board varies, stress acts on the connection terminals of the semiconductor module 1. As stress repeatedly acts on the connection terminals of the semiconductor module 1, electrical connection between the connection terminals of the semiconductor module 1 and the control substrate may be cut off. Conventionally, in order to suppress disconnection of electrical connection between connection terminals of a semiconductor module and a control board, the length of the connection terminals of the semiconductor module has been increased, thereby reducing stress acting on the connection terminals of the semiconductor module. On the other hand, in the semiconductor device according to embodiment 1, the variation in the position of the semiconductor module 1 can be suppressed. Thereby, stress acting on the connection terminals of the semiconductor module 1 can be reduced, and the length of the connection terminals can be reduced.
As the module mounting member 201 approaches the central portion in the first direction D1, the deformation of the module mounting member 201 due to the pressure of the cooling medium flowing in the flow path 207 becomes large. Conventionally, stress acting on connection terminals of a semiconductor module has been reduced by disposing the connection terminals of the semiconductor module so as to avoid a central portion in the first direction D1 of the module mounting member. In addition, conventionally, when the connection terminals of the semiconductor modules are arranged at the central portion of the module mounting member in the first direction D1, the stress acting on the connection terminals of the semiconductor modules 1 is reduced by increasing the lengths of the connection terminals of the semiconductor modules. On the other hand, in the semiconductor device according to embodiment 1, the variation in the position of the semiconductor module 1 can be suppressed. Thus, the connection terminals of the semiconductor module 1 can be arranged at the central portion of the module mounting member 201 in the first direction D1 without increasing the length of the connection terminals of the semiconductor module 1.
Further, by increasing the rigidity of the module mounting member 201, variation in the flow path cross-sectional area in the flow path 207 formed between the module mounting member 201 and the fixing member 202 can be suppressed. This stabilizes the cooling performance of the module mounting member 201 with respect to the semiconductor module 1.
In order to suppress the variation in the cooling performance of the semiconductor module 1 due to the module mounting member 201, it is considered to reduce the thermal resistance between the module mounting member 201 and the semiconductor module 1. Conventionally, the surface roughness of the mounting surface of the module mounting member is reduced by forming the mounting surface of the module mounting member, whereby variation in cooling performance of the semiconductor module 1 due to the module mounting member 201 is suppressed. On the other hand, in the semiconductor device of embodiment 1, the module mounting member 201 is stable with respect to the cooling performance of the semiconductor module 1. Thus, there is no need to reduce the surface roughness of the mounting surface 211 of the module mounting member 201.
The semiconductor device according to embodiment 1 includes a sealing member 203, and the sealing member 203 is configured to close a gap between the peripheral portion 209 and the fixing member 202. The seal member 203 is disposed between the thick portion 221 and the fixing member 202. According to this structure, the rigidity of the module mounting member 201 can be further improved. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be further reliably suppressed. Further, the rigidity of the portion of the peripheral portion 209 that contacts the seal member 203 can be improved. This can prevent the peripheral edge 209 from separating from the sealing member 203.
In the semiconductor device according to embodiment 1, the semiconductor module 1 is bonded to the mounting surface 211 by an adhesive. According to this structure, the semiconductor module 1 can be restrained from being detached from the module mounting member 201. The semiconductor module 1 is fixed to the mounting surface 211 by an adhesive, and thus stress is easily applied from the module mounting member 201 to the semiconductor module 1. However, in the semiconductor device of embodiment 1, the rigidity of the module mounting member 201 becomes high, so that the stress acting on the semiconductor module 1 from the module mounting member 201 can be reduced. This suppresses deterioration in the fixation between the mounting surface 211 and the semiconductor module 1.
Fig. 5 is a plan view showing a semiconductor device according to embodiment 2. Fig. 6 is a cross-sectional view in the direction of the arrow along the VI-VI line of fig. 5. In the semiconductor device according to embodiment 2, a portion of the peripheral edge portion 209 that is disposed at each of both end portions in the second direction D2 of the cooling portion 205 is defined as a long side portion 222 when viewed in the thickness direction of the cooling portion 205. Therefore, the long side 222 is a part of the peripheral edge 209.
The entire long side 222 is a thick portion 223. The dimension of the thick portion 223 in the thickness direction of the cooling portion 205, that is, the thickness T1 of the thick portion 223 is larger than the thickness T2 of the cooling body portion 208. Accordingly, the thickness T1 of the long side portion 222 is greater than the thickness T2 of the cooling body portion 208.
The thickness of the portion of the peripheral edge portion 209 other than the long side portion 222 coincides with the thickness T2 of the cooling body portion 208.
The cooling portion 205 is manufactured by extrusion molding. The cooling portion 205 may be manufactured by forging forming. Even when either extrusion molding or forging molding is used, the cooling portion 205 can be manufactured by one-time processing without a cutting step.
Other structures of the semiconductor device according to embodiment 2 are the same as those of the semiconductor device according to embodiment 1.
As described above, in the semiconductor device according to embodiment 2, the long side portions 222 are arranged at the respective both end portions of the cooling portion 205 in the second direction D2, as viewed in the thickness direction of the cooling portion 205. The entire long side 222 is a thick portion 223. The thickness T1 of the thick portion 223 is greater than the thickness T2 of the cooling body portion 208. According to this structure, the rigidity of the central portion of the module mounting member 201 in the first direction D1 against deformation can be improved. This can suppress leakage of the cooling medium from between the module mounting member 201 and the fixing member 202.
In the semiconductor device according to embodiment 2, a part of the sealing member 203 is disposed between the thick portion 223 and the fixing member 202. According to this structure, the rigidity of the central portion of the module mounting member 201 in the first direction D1 against deformation can be further improved. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be further reliably suppressed. Further, the rigidity of the portion of the long side portion 222 that contacts the seal member 203 can be improved. This can prevent the long side 222 from separating from the seal member 203.
Embodiment 3
Fig. 7 is a plan view showing a semiconductor device according to embodiment 3. In the semiconductor device according to embodiment 3, a part of the long side portion 222 is a thick portion 224. The dimension of the thick portion 224 in the thickness direction of the cooling portion 205, that is, the thickness T1 of the thick portion 224 is greater than the thickness T2 of the cooling body portion 208. Accordingly, a thickness T1 of a portion of the long side portion 222 is greater than a thickness T2 of the cooling body portion 208.
The thickness of the portion of the peripheral edge portion 209 other than the thick portion 224 coincides with the thickness T2 of the cooling body portion 208.
The thick portion 224 is arranged in the middle portion of the long side portion 222 in the first direction D1. The module mounting member 201 is formed to extend in the first direction D1. Therefore, deformation easily occurs in the central portion of the module mounting member 201 in the first direction D1. By disposing the thick-wall portion 224 in the middle portion of the long side portion 222 in the first direction D1, the rigidity of the middle portion of the module mounting member 201 in the first direction D1 against deformation becomes high.
The plate-shaped intermediate material is manufactured by extrusion molding, and then the cooling portion 205 is manufactured by cutting the intermediate material so that the thick-wall portion 223 remains in a part of the long-side portion 222. The cooling portion 205 may be manufactured by forging forming.
Other structures of the semiconductor device according to embodiment 3 are the same as those of the semiconductor device according to embodiment 2.
As described above, in the semiconductor device according to embodiment 3, a part of the long side portion 222 is the thick portion 224. The thick portion 224 is arranged in the middle portion of the long side portion 222 in the first direction D1. According to this structure, the rigidity of the central portion of the module mounting member 201 in the first direction D1 against deformation becomes high. This can suppress leakage of the cooling medium from between the module mounting member 201 and the fixing member 202.
In the semiconductor device according to embodiment 3, a part of the sealing member 203 is disposed between the thick portion 224 and the fixing member 202. According to this structure, the rigidity of the central portion of the module mounting member 201 in the first direction D1 against deformation can be further improved. As a result, leakage of the cooling medium from between the module mounting member 201 and the fixing member 202 can be further reliably suppressed. Further, the rigidity of the portion of the long side portion 222 that contacts the seal member 203 can be improved. This can prevent the long side 222 from separating from the seal member 203.
Description of the reference numerals
The semiconductor module includes a semiconductor module 1, a cooler 2, a module mounting member 201, a fixing member 202, a sealing member 203, a fastener 204, a cooling portion 205, a cooling fin 206, a flow passage 207, a cooling body portion 208, a peripheral portion 209, a cooling surface 210, a mounting surface 211, a support plate 212, a lower plate 213, a first pipe 214, a second pipe 215, a first hole 216, a second hole 217, a through hole 218, a fixing surface 219, a seal groove 220, a thick wall portion 221, a long side portion 222, a thick wall portion 223, and a thick wall portion 224.
Claims (4)
1. A semiconductor device, comprising:
semiconductor module and method for manufacturing the same
A cooler for cooling the semiconductor module,
the cooler has a module mounting member for mounting the semiconductor module, and a fixing member for fixing the module mounting member,
the module mounting member has a plate-shaped cooling portion and cooling fins provided to the cooling portion,
a flow path through which a cooling refrigerant flows is formed between the cooling portion and the fixing member,
the cooling part has a cooling body part and a peripheral edge part surrounding the cooling body part,
a cooling surface facing the flow path and a mounting surface provided on the opposite side of the cooling body in the thickness direction of the cooling body are formed on the cooling body,
the semiconductor module is mounted on the mounting surface,
the cooling fins are arranged on the cooling surface,
the peripheral edge portion is fixed to the fixing member,
at least a part of the peripheral edge portion is a thick-walled portion,
the thick-walled portion in the thickness direction of the cooling portion has a larger size than the cooling main body portion in the thickness direction of the cooling portion.
2. The semiconductor device according to claim 1, wherein,
the peripheral edge portion is fixed to the fixing member by bonding or welding.
3. The semiconductor device according to claim 1 or 2, wherein,
the cooler has a sealing member for closing a gap between the peripheral edge portion and the fixing member,
at least a part of the sealing member is disposed between the thick-wall portion and the fixing member.
4. A semiconductor device according to any one of claims 1 to 3,
the semiconductor module is fixed to the mounting surface by an adhesive or soldering.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-175339 | 2021-10-27 | ||
| JP2021175339A JP7237434B1 (en) | 2021-10-27 | 2021-10-27 | semiconductor equipment |
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| CN116031223A true CN116031223A (en) | 2023-04-28 |
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| CN202211259354.9A Pending CN116031223A (en) | 2021-10-27 | 2022-10-14 | Semiconductor device with a semiconductor device having a plurality of semiconductor chips |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006294971A (en) | 2005-04-13 | 2006-10-26 | Toyota Industries Corp | Substrate for power module and its production process |
| JP5588956B2 (en) | 2011-11-30 | 2014-09-10 | 株式会社 日立パワーデバイス | Power semiconductor device |
| JP2014099504A (en) | 2012-11-14 | 2014-05-29 | Nittoshinko Corp | Heat dissipation member with adhesive layer and semiconductor device |
| WO2015033515A1 (en) | 2013-09-04 | 2015-03-12 | 三菱電機株式会社 | Semiconductor module and inverter device |
| JP6124742B2 (en) | 2013-09-05 | 2017-05-10 | 三菱電機株式会社 | Semiconductor device |
| JP6917289B2 (en) | 2017-12-12 | 2021-08-11 | 昭和電工株式会社 | Forging equipment and forging method |
| JP6570685B1 (en) | 2018-03-16 | 2019-09-04 | 三菱電機株式会社 | Power semiconductor device and manufacturing method thereof |
| JP2020072095A (en) | 2018-10-29 | 2020-05-07 | 京セラ株式会社 | Power unit, method of manufacturing the same, electric device having power unit, and heat sink |
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| JP2023064901A (en) | 2023-05-12 |
| JP7237434B1 (en) | 2023-03-13 |
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