JP7234597B2 - LAMINATED FILM FOR PACKAGING MATERIAL, PACKAGING MATERIAL, AND PACKAGE - Google Patents

Description

TECHNICAL FIELD The present invention relates to laminated films for packaging materials, packaging materials, and packages.

Packaging materials are used, for example, as packaging bags for packaging foodstuffs, medical supplies, and the like. The contents of the packaging bag are in various states such as liquid, powder, paste, and solid. Films used as packaging materials for such packaging bags generally include films of polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyamide, polyester and the like.
The physical properties required for packaging materials include filling aptitude when filling the contents, no damage to the bag when external force is applied to the packaging material, ease of opening the packaging material, transparency to see the contents, etc. Good physical properties and good productivity during production are required.

In terms of mechanical strength, such as the fact that the bag will not be damaged when external force is applied to the packaging material as described above, a base material with excellent barrier properties and mechanical strength is laminated on the laminated film for packaging materials. Thus, strength as a packaging material may be imparted. However, the use of an adhesive used for lamination increases the number of packaging material manufacturing processes, leading to problems such as product stability, decreased production efficiency, and environmental load.
In order to solve these problems, for example, in addition to polyolefin resins such as polyethylene and polypropylene, co-extrusion of multiple resins with different properties, such as polyamide resins such as nylon (registered trademark), makes the film multifunctional. method of giving is used. For example, Patent Literature 1 discloses a multi-layer film having a polyamide-based resin layer, an olefin-based resin layer, and a rubber elastic layer therebetween and characterized by low warpage, which is produced by an inflation method.

JP 2013-002893 A

However, in the method of Patent Document 1, when laminating many types of resins or resins with different properties, an adhesive layer made of an adhesive resin is provided between the intermediate layer and the back layer, for example, in order to facilitate mutual adhesion. The film is multi-layered. For this reason, in the method of Patent Document 1, the structure of the extruder is complicated, the number of types of materials used is increased, and production control becomes difficult.
In particular, when a polyamide resin, which is said to have excellent mechanical strength and high barrier properties, is laminated with a polyolefin resin, which has good low-temperature heat-sealing properties, the adhesion between the two is low. It is common to use Therefore, it is difficult to maintain stable quality control due to multi-layering accompanying functionalization.

The present invention provides a laminated film for packaging material that does not have an adhesive resin layer while maintaining mechanical strength, a packaging material having good bag breakability using the laminated film for packaging material, and a package using the same intended to provide

In order to solve the problem , one aspect of the present invention provides a laminated film for packaging comprising at least three layers, comprising: a first layer containing an olefinic thermoplastic resin as a main material; A second layer formed on the surface side and mainly composed of a polyolefin resin containing a compatibilizer, and a second layer formed on the opposite side of the second layer from the first layer, mainly composed of a polyamide resin A third layer as a material, and the compatibilizer is a thermoplastic resin whose main material is a molecular structure to which a reactive group capable of reacting with the polyamide resin is provided (that is, the polyamide resin and The third layer has a thickness of 50 μm or more and 125 μm or less, and the amount of the compatibilizing agent added to the second layer is the same as that of the second layer. The gist is that it is 10% by mass or more and 30% by mass or less of the mass of the polyolefin resin that constitutes the layer.

Further, the gist of the present invention is a packaging material in which at least a base material is laminated on the third layer of the laminated film for packaging material of the above aspect, and a package body using the packaging material.

According to the aspect of the present invention, since the back layer whose main material is a polyamide resin is laminated with a thickness of 50 μm or more and 125 μm or less, the film can be provided with good mechanical strength. Furthermore, in the aspect of the present invention, by providing a second layer mainly composed of a polyolefin resin containing an additive having a reactive group capable of reacting with a polyamide resin, low-temperature heat sealability and impact resistance can be improved. By creating a laminated structure without providing an adhesive resin layer between the first and third layers, the number of layers can be reduced, the physical properties required for packaging materials can be secured, and stable manufacturing management and It is possible to connect to quality control.

1 is a schematic cross-sectional view of a laminated film for packaging according to an embodiment of the present invention; FIG. 1 is a cross-sectional view of a standing pouch using packaging material according to an embodiment of the present invention; FIG. 1 is an exploded view of a standing pouch using a packaging material according to an embodiment of the present invention; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In addition, each figure is a figure shown typically. Further, each embodiment shown below is an example of a configuration for embodying the technical idea of the present invention. It does not specify anything.

The laminated film 1 for packaging materials of the present embodiment is composed of at least three layers, and as shown in FIG. and a back layer 4 that constitutes the
The surface layer 2 constituting the first layer is mainly made of olefinic thermoplastic resin. As the olefin-based thermoplastic resin, for example, a low-density olefin-based resin, which is a thermoplastic resin specialized for heat-sealing properties, is preferable.
The intermediate layer 3 that constitutes the second layer is mainly made of a polyolefin resin to which a compatibilizer having a molecular structure having a reactive group capable of reacting with the polyamide resin is blended (added).
The back layer 4 constituting the third layer has a thickness of 50 μm or more and 125 μm or less, and is mainly made of polyamide resin.
Herein, the main material refers to 90% by weight or more, preferably 95% by weight or more of the corresponding layer.

<Surface layer>
As the main material of the surface layer 2, a material that can be formed into a film by an extruder that can be heated to over 300°C is preferable, and general thermoplastic resins can be used. However, the surface layer 2 needs to have moderate flexibility and good workability in order to be suitably used as a packaging material. Therefore, the main materials of the surface layer 2 are olefin-based low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE) obtained by copolymerizing α-olefin and ethylene, and medium-density polyethylene (MDPE). ), high density polyethylene (HDPE) and homopolymer, random copolymer, polypropylene and cycloolefin polymer with block copolymer, etc., cycloolefin copolymer obtained by copolymerizing cycloolefin and olefin, and obtained by copolymerizing the above olefin and vinyl acetate ethylene-methyl acrylate copolymer (EMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-butyl acrylate copolymer (EBA), ethylene - It is preferable to select and use a single substance or a plurality of methacrylic acid copolymers (EMAA) and the like as appropriate.

In addition, regarding the surface layer 2, the required properties of the sealant film for packaging materials are the filling suitability when filling the contents, the absence of damage to the bag when external force is applied to the packaging material, and the unsealability of opening the packaging material. etc. must be satisfied. Specifically, when used as a single sealant film or laminated with a film such as polyethylene terephthalate, polyamide such as 6 nylon, 66 nylon, etc., it has the necessary melting point and heat of fusion to be processed into a bag. is important.
For the above-mentioned required properties, the main materials of the surface layer 2 are low density polyethylene (LDPE), linear low density polyethylene (LLDPE) obtained by copolymerizing α-olefin and ethylene, medium density polyethylene (MDPE), Polyolefin resins such as polypropylene resins having homopolymers, random copolymers, block copolymers, etc. are preferably used singly or in combination.
In addition, by applying the surface layer 2 mainly composed of a low-density polyolefin resin specialized for low-temperature heat-sealing properties to the laminated film 1 for packaging materials, mechanical strength can be maintained.

<Back layer>
The polyamide-based resin of the back layer 4 is made of, for example, a polyamide-based thermoplastic resin. Polyamide-based thermoplastic resins are generally known as general-purpose resins having high strength and high heat resistance, and can be used as layers included in laminated films for packaging materials as long as they are public. Specifically, the polyamide-based thermoplastic resin of the back layer 4 mainly includes copolymerized nylon such as polyamide 6 (PA6) and polyamide 6.66.
The thickness of the back layer 4 is preferably 50 μm or more and 125 μm or less. The polyamide-based resin that constitutes the back layer 4 can be, for example, a non-stretched nylon resin, and has high elasticity and excellent pinhole resistance. If it is thin, its function may not be exhibited. Further, when the thickness of the back layer 4 exceeds 125 μm, the precision of the thickness of each layer in the laminated film 1 for packaging may not be stable.

<Middle layer>
Polyolefin-based resins constituting the intermediate layer 3 include olefin-based low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE) obtained by copolymerizing α-olefin and ethylene, and medium-density polyethylene (MDPE). , High-density polyethylene (HDPE) and homopolymer, random copolymer, polypropylene and cycloolefin polymer having block copolymer, etc., cycloolefin copolymer obtained by copolymerizing cycloolefin and olefin, and obtained by copolymerizing the above olefin and vinyl acetate Ethylene-methyl acrylate copolymer (EMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-butyl acrylate copolymer (EBA), ethylene- Among methacrylic acid copolymers (EMAA) and the like, one or more of them may be selected and used as appropriate.

The compatibilizing agent added to the polyolefin resin forming the intermediate layer 3 is preferably a thermoplastic resin having a molecular structure to which a reactive group capable of reacting with the polyamide resin is added.
Commonly known compatibilizers can be used, such as ethylene-vinyl acetate copolymer (EVA) and maleic anhydride-modified polyethylene. =O) is preferred.
The compounding amount of the compatibilizer is preferably in the range of 10% by mass or more and 30% by mass or less of the mass of the polyolefin resin forming the intermediate layer 3 . If the amount is less than 10% by mass, the interlayer adhesion strength between the olefin resin of the intermediate layer 3 and the polyamide resin of the back layer 4 is weak, and there is a risk of affecting the deterioration of the physical properties as a laminated film for packaging materials such as puncture strength. There is On the other hand, if the blending amount of the compatibilizer exceeds 30%, the density of the polyolefin resin of the intermediate layer 3 depends on the resin density of the compatibilizer, and there is a possibility that the physical properties cannot be maintained.

<Film properties>
The standard puncture strength of the laminated film 1 for packaging materials conforms to the method described in JIS Z 1707: 1997, and the laminated film 1 for packaging materials is measured using a tensile tester (Shimadzu Corporation AGS-500NX), φ 1 mm. It is preferable that the piercing strength when pierced by a retort pouch piercing rod with a tip radius of 0.5 mm at a moving speed of 200 mm/min is 10 N or more. In this case, the total thickness of the laminated packaging film 1 must be increased in order to develop a puncture strength of 10 N or more. can be suppressed to 150 μm or less. For example, if the puncture strength is less than 10 N, pinholes in the laminated film increase in frequency during packaging and distribution processes, which is not preferable as a laminated film for packaging materials.

In addition to the puncture strength, the laminated film 1 for packaging materials is required to have physical properties such as heat sealability. In general, by using a low-density resin for the laminated film 1 for packaging materials, the heat-sealing property can be improved. Specifically, the average density of the surface layer 2 is preferably in the range of 0.900 g/cm ³ or more and 0.925 g/cm ^{3 or} less. The average density of the intermediate layer is preferably in the range of 0.900 g/cm ³ or more and 0.940 g/cm ³ or less.
The reason for this is that if it is 0.903 g/cm ³ or less, poor adhesion and flow marks will occur at the layer boundaries with other layers, which is not desirable. Also, if the density is 0.938 g/cm ³ or more, low-temperature heat-sealing properties cannot be obtained when the layer thickness is thin.
Moreover, the thickness of the surface layer 2 is preferably in the range of 10 μm or more and 20 μm or less. The surface layer 2 is required to have a thickness of 10 μm or more in order to serve as an adhesive layer as a low-temperature heat-seal layer. If the thickness exceeds 20 μm, the rigidity may be lowered, which is not preferable.
The delamination strength between back layer 4 and intermediate layer 3 is preferably 0.4 N or more. If it is less than 0.4 N, there is a possibility that adhesion may be lowered due to separation between layers.

<Manufacturing method>
The method for manufacturing the laminated film 1 for packaging of this embodiment is not particularly limited, and known methods can be used.
As a film forming method, it is possible to use an extruder, a method of forming a film with a T-die through a feed block or a multi-manifold, or a film forming method using an inflation method. At this time, for example, using a plurality of extruders, the laminated film 1 for packaging material having a layer structure of three or more layers is co-extruded with the intermediate layer 3 sandwiched between the surface layer 2 and the back layer 4. can be obtained.

As for the method for cooling the film 1 after film formation, it is possible to use it according to the above-described film formation method. For example, in the T-die method, there is no particular limitation, such as an air cooling system such as an air chamber, a vacuum chamber, or an air knife, or a water cooling system such as dipping a cooling roll into a cold water pan.
When imparting an uneven surface shape by shaping, a nip roll processed with silicone rubber, NBR rubber, Teflon (registered trademark), etc. and a cooling roll processed by cutting metal are applied to the contact portion with a pressure of 0.1 MPa or more. A system in which the molten resin is flowed into and cooled is particularly preferred.
In the laminated film for packaging material of the present embodiment, there are no particular restrictions on the use of the single film, lamination with other substrates, and bag-making method.
For example, a base material (not shown) may be laminated on the back layer 4 of the laminated film for packaging according to the present embodiment to form a packaging material.

As the substrate, which functions as a support layer of the laminated film 1 for packaging material, a film mainly made of plastic is selected, and it is appropriately selected depending on usage conditions such as the type of contents and the presence or absence of heat treatment after filling. be done. For example, polyethylene, polypropylene, polyethylene terephthalate, etc. can be applied, but there is no particular limitation. Furthermore, a single layer made of one of the above materials may be used, or a configuration in which a plurality of single layers of the above materials are combined and laminated can also be applied.
Even when used as a single film or laminated, the surface layer 2 serves as the content contact surface, and as shown in FIGS. can be used for

2 and 3, reference numeral 11 denotes a package, reference numeral 10 denotes a packaging material, reference numeral 12 denotes a standing pouch, reference numeral 13 denotes a pouch surface, reference numeral 14 denotes a pouch rear surface, reference numeral 16 denotes a pouring nozzle, and reference numeral 17 denotes an opening cutter. Line of sight, reference numeral 18 is an opening knob, reference numeral 19 is a half-cut line, reference numeral 20 is a bottom tape, reference numeral 21 is a ridge line of a bent portion, reference numeral 22 is left and right side seal portions, reference numeral 23 is a bottom seal portion, and reference numeral 24 is a pouring nozzle. A seal portion, reference numeral 25 is a spouting nozzle tip seal portion, and reference numeral 26 is an embossed portion.
As described above, in both cases of a single film and lamination with other substrates, it is possible to appropriately carry out a surface modification treatment to improve suitability for subsequent processes. For example, in order to improve the printability when using a single film or to improve the lamination aptitude when using a laminate, it is possible to apply a surface modification treatment to the surface that comes into contact with other substrates. The surface modification treatment is preferably a method of expressing the properties of functional groups by oxidizing the film surface, such as corona discharge treatment, plasma treatment, or flame treatment, or modification by a wet process such as coating of an easy-adhesion layer. Is possible.

Examples of the present invention will be described in detail below, but the present invention is not limited only to the following examples.

<Example 1>
The laminated film 1 for packaging material of Example 1 is specialized for heat-sealing properties, and has a surface layer 2 made of an olefinic thermoplastic resin that does not contain a compatibilizing agent and is provided with a reactive group capable of reacting with nylon. The intermediate layer 3 made of a polyolefin resin containing a compatibilizing agent (additive, hereinafter the same) to which a reactive group is added, and the back layer 4 made of a polyamide resin, are composed of three layers.
Specifically, the surface layer 2 includes linear low-density polyethylene resin (density: 0.918 g/cm ³ , melt flow rate (MFR): 3.8) and low-density polyethylene resin (density: 0.918 g/cm 3 ). 924 g/cm ³ , MFR 1.0) were blended at a ratio of 95:5.

The intermediate layer 3 contains linear low-density polyethylene resin (density 0.924 g/cm ³ , MFR 3.2) and low-density polyethylene resin (density 0.924 g/cm ³ , MFR 1.0) at a ratio of 95:5. I used a blend of 10% by mass of an ethylene-vinyl acetate copolymer (EVA, density 0.960 g/cm ³ , MFR 14) was added to the intermediate layer 3 as a compatibilizer having a reactive group capable of reacting with the polyamide resin.
Nylon 6 (density: 1.13 g/cm ³ , Melt Volume Rate (MVR): 70 cm ³ /min), which is a polyamide resin, was used for the back layer 4 .

The surface layer 2, the intermediate layer 3, and the back layer 4 are heated and melted at 260°C by a single-screw co-extruder, and the thickness of the surface layer 2 is 15 µm, and the thickness of the intermediate layer 3 is 85 µm by the T-die casting method. , the thickness of the back layer 4 was set to 50 μm, and the laminated film 1 for packaging material having a total thickness of 150 μm was formed. The film was cooled between a cooling roll and a Teflon-treated roll to obtain a laminated sealant film 1 for packaging materials.

<Example 2>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 50 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, 20% by mass of an ethylene-vinyl acetate copolymer (EVA) was added to form a laminate film 1 for packaging having a total thickness of 150 μm.

<Example 3>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 50 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, 30% by mass of ethylene-vinyl acetate copolymer (EVA) was added to form a laminate film 1 for packaging with a total thickness of 150 μm.

<Example 4>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 75 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, 10% by mass of ethylene-vinyl acetate copolymer (EVA) was added to prepare laminated film 1 for packaging with a total thickness of 175 μm.

<Example 5>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 100 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, 10% by mass of ethylene-vinyl acetate copolymer (EVA) was added to form a laminate film 1 for packaging having a total thickness of 200 μm.

<Example 6>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 125 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, 10% by mass of ethylene-vinyl acetate copolymer (EVA) was added to form a laminate film 1 for packaging having a total thickness of 225 μm.

<Comparative Example 1>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 50 μm, and the intermediate layer contains a compatibilizer having a reactive group capable of reacting with the polyamide resin. A laminated film 1 for packaging material having a total thickness of 150 μm was formed without adding ethylene-vinyl acetate copolymer (EVA).

<Comparative Example 2>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 50 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, An ethylene-vinyl acetate copolymer (EVA) was added in an amount of 5% by mass, and a laminated film 1 for packaging having a total thickness of 150 μm was formed.

<Comparative Example 3>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 25 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, 10% by mass of ethylene-vinyl acetate copolymer (EVA) was added to prepare laminated film 1 for packaging with a total thickness of 125 μm.

<Comparative Example 4>
In the same manufacturing method as in Example 1, the layer structure is the same as in Example 1, the thickness of the back layer 4 is 15 μm, and the intermediate layer contains, as a compatibilizer having a reactive group capable of reacting with the polyamide resin, 10% by mass of ethylene-vinyl acetate copolymer (EVA) was added to prepare laminated film 1 for packaging with a total thickness of 115 μm.

The laminated film 1 for packaging material obtained in each example and each comparative example was evaluated for puncture property, heat seal property, and interlayer adhesion between the back layer 4 and the intermediate layer 3 .

(Evaluation of puncture resistance)
In the puncture strength measurement, according to JIS Z 1707: 1997, a retort pouch puncture rod with a tip of φ1 mm and a tip radius of 0.5 mm was moved to the laminated film 1 for packaging material using a tensile tester (Shimadzu Corporation AGS-500NX). The puncture strength was measured when punctured at a speed of 200 mm/min.
The evaluation results were evaluated as "○" when the puncture strength was 10 N or more, and as "X" when not.

(Evaluation of heat sealability)
Heat-sealability evaluation was performed using a heat sealer (Tester Sangyo Co., Ltd. TP-701-B) with a sealing pressure of 0.2 MPa, a sealing time of 1 second, a sealing width of 10 mm, and a sealing temperature of 100 ° C. at intervals of 10 ° C. , the surfaces of the surface layers of the laminated film 1 for packaging materials were overlapped and sealed. The sealed film is cut into 15 mm width × 100 mm, the distance between chucks is 50 mm, the tensile speed is 300 mm / min, and the seal strength is measured when peeled at 180 ° using a tensile tester (Shimadzu Corporation AGS-500NX). bottom.
As a result, the lowest temperature at which the seal strength becomes 10 N or more was defined as the temperature at which heat seal was developed.

(Evaluation of interlayer adhesion)
Evaluation of the delamination strength between the back layer 4 and the intermediate layer 3 was performed by cutting the laminated film 1 for packaging material into 15 mm width x 100 mm pieces, setting the distance between the chucks to 50 mm, and the tensile speed to 300 mm/min, using a tensile tester manufactured by Shimadzu Corporation ( The 180° interlaminar strength of the back layer 4 and the intermediate layer 3 was measured using model No. AGS-500NX.
As a result, those with a peel strength of 0.5 N or more were evaluated as "○", and the others were evaluated as "X".

(comprehensive evaluation)
As a comprehensive judgment, all the evaluations of the above laminated film 1 for packaging materials were evaluated as "O", and those with even one evaluation of "X" were evaluated as "X". Table 1 shows the evaluation results of the sealant films 1 of the above Examples and Comparative Examples.

From Table 1, in Examples 1 to 6, the overall judgment is "○" or higher. In Comparative Examples 1 and 2, the amount of EVA added was insufficient, and the interlayer peel strength between the intermediate layer 3 and the back layer 4 was weak, so the comprehensive judgment was "x". In Comparative Examples 3 and 4, the thickness of the back layer was insufficient, and the required puncture strength was not obtained in the laminated film 1 for packaging materials. Due to the thinness, the delamination strength is insufficient, and the overall judgment is "x". In addition, in Examples 1 to 6 and Comparative Examples 1 to 4, all of the heat sealability evaluations are "○", so even if the thickness of the back layer 4 and the amount of EVA added are changed, the heat sealability is specialized. If the surface layer 2 is provided, the heat-sealing property of the laminated film for packaging does not change.

1 Laminated film for packaging material 2 Surface layer (first layer)
3 Intermediate layer (second layer)
4 back layer (third layer)

Claims (6)

A laminated film for packaging consisting of at least three layers,
A first layer mainly composed of an olefin-based thermoplastic resin, a second layer formed on one side of the first layer and mainly composed of a polyolefin-based resin containing a compatibilizer, A third layer formed on the opposite side of the first layer of the two layers and made mainly of unstretched nylon resin ,
The compatibilizing agent is made of a thermoplastic resin having a molecular structure having a reactive group capable of reacting with the unstretched nylon resin ,
The first layer has a thickness of 10 μm or more and 20 μm or less,
The third layer has a thickness of 50 μm or more and 125 μm or less,
The laminated film for packaging, wherein the second layer contains the compatibilizing agent in an amount of 10% by mass or more and 30% by mass or less of the mass of the polyolefin resin constituting the second layer. The first layer has an average density in the range of 0.900 g/cm ³ or more and 0.925 g/cm ³ or less,
2. The laminated film for packaging according to claim 1, wherein the second layer has an average density in the range of 0.900 g/cm ³ or more and 0.940 g/cm ³ or less. 3. The laminated film for packaging according to claim 1 or 2, wherein the molecular structure of the thermoplastic resin that constitutes the compatibilizer has a group that forms a hydrogen bond with an amide group. 4. The laminated film for packaging according to any one of claims 1 to 3, wherein the laminated film for packaging has a puncture strength of 10 N or more. A packaging material comprising: the laminated film for packaging material according to any one of claims 1 to 4; and a substrate laminated on the third layer side of the laminated film for packaging material. A package using the packaging material according to claim 5.

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