JP7229787B2 - FIXING MEMBER, FLEXIBLE ELECTRONIC DEVICE MANUFACTURING METHOD, LAMINATED BODY, AND PRINTING APPARATUS - Google Patents

Description

The present invention relates to a fixing member, a flexible electronic device manufacturing method, a laminate, and a printing apparatus.

As a method for manufacturing flexible electronic devices without causing malfunctions in electronic devices even when high-definition conductor patterns are required, a polymer film is temporarily fixed to a hard support via an adhesive layer to achieve high performance. A molecular film composite is formed, a conductive pattern is printed on the polymer film side surface of the polymer film composite by at least a contact printing method using a metal nanoparticle ink, a heating process is performed, and finally A method for peeling a polymer film from a support has been proposed (see, for example, Patent Document 1).

JP 2015-198176 A

In Patent Document 1, a polymer film is temporarily fixed to a rigid support to form a polymer film composite, and a conductive pattern is formed on the polymer film to form a thin film transistor (TFT). When forming a thin film transistor on a polymer film, a lower electrode is formed and baked on the polymer film, an insulating layer is formed and baked, and then an upper electrode is formed and baked. At this time, after the formation of the upper electrode and the formation of the insulating layer, the polymer film composite was transported to a baking apparatus, and the polymer film composite after baking was positioned in order to accurately form the upper electrode on the polymer film. It is necessary to form an upper electrode later. Therefore, there is a problem that the baking process and the positioning process take time, and it is difficult to efficiently manufacture the flexible electronic device.

An object of the present invention is to provide a fixing member capable of fixing a printing base material to a conveying section, easily peeling off from the conveying section, improving the positional accuracy of printing, and efficiently manufacturing a flexible electronic device. It is an object of the present invention to provide a method for manufacturing a flexible electronic device, a laminate, and a printing apparatus.

Specific means for achieving the above object are as follows.
<1> An adhesive layer for fixing a printing substrate and a non-adhesive portion are provided, the adhesive layer is provided on the outer peripheral portion of the non-adhesive portion, and the adhesive layer and the non-adhesive portion are provided. A fixing member in which the non-adhesive portion protrudes outward from the adhesive layer in the thickness direction of .
<2> The fixing member according to <1>, wherein the non-adhesive portion is disposed on the adhesive layer, and the adhesive layer is exposed at the outer peripheral portion of the non-adhesive portion.
<3> The ratio of the peel strength after heat treatment in which the pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer is attached to the printing base material at 180 ° C. for 60 minutes and the peel strength before heating. The fixing member according to <1> or <2>, wherein (peeling force after heat treatment/peeling force before heating) is 0.5 to 5.0.
<4> Further comprising a support, wherein the pressure-sensitive adhesive layer and the non-adhesive portion are provided on one side of the support, and further comprising a pressure-sensitive adhesive layer on the other side of the support <1 > to <3>.
<5> The fixing member according to <4>, wherein the support has a thickness of 25 μm to 250 μm.
<6> The fixing member according to any one of <1> to <5>, wherein the non-adhesive portion has a dimensional change rate of 1% or less when heated at 180° C. for 30 minutes.
<7> Any of <1> to <6>, wherein the distance between the surface of the non-adhesive portion and the surface of the adhesive layer is 10 μm to 500 μm in the thickness direction of the adhesive layer and the non-adhesive portion. 2. A fixing member according to claim 1.
<8> In the thickness direction of the adhesive layer and the non-adhesive portion, the ratio of the width of the adhesive layer to the distance between the surface of the non-adhesive portion and the surface of the adhesive layer (width of adhesive layer / distance) is 10 or more, the fixing member according to any one of <1> to <7>.

<9> A step of attaching the printing base material to the fixing member according to any one of <1> to <8> and fixing the printing base material to the fixing member; a step of printing a conductor pattern on the surface of a printing substrate; a step of heating the printing substrate on which the conductor pattern is printed; and a step of peeling the printing substrate on which the conductor pattern is printed from the fixing member. and a method of manufacturing a flexible electronic device.
<10> The method of manufacturing a flexible electronic device according to <9>, wherein the surface of the fixing member opposite to the side to be bonded to the printing substrate is attached to at least a part of the surface of the impression cylinder.
<11> The method for manufacturing a flexible electronic device according to <9>, wherein the surface of the fixing member opposite to the side to be bonded to the printing substrate is attached to a carrier sheet.

<12> A laminate used for manufacturing a flexible electronic device, in which a printing base material, the fixing member according to any one of <1> to <8>, and a carrier sheet are laminated in this order.

<13> The impression cylinder according to any one of <1> to <8>, wherein the surface opposite to the side to be bonded to the printing base material is attached to at least a part of the surface of the impression cylinder. Printing comprising: a fixing member; a printing unit that prints a conductor pattern on the printing base material that is fixed by being attached to the fixing member; and a heating unit that heats the printing base material on which the conductor pattern is printed. Device.
<14> The impression cylinder includes a first impression cylinder, a second impression cylinder, and a third impression cylinder, and the printing unit faces the first impression cylinder and has a lower electrode on the printing substrate. a second printing unit that faces the second impression cylinder and prints an insulating layer on the printing substrate on which the lower electrode is printed; and the third impression cylinder that faces the and a third printing unit for printing an upper electrode on the printing substrate on which the insulating layer is printed, and a fixing member to which the printing substrate is fixed is at least part of the surface of the first impression cylinder. , the printing apparatus according to <13>, which is attached to at least part of the surface of the second impression cylinder and at least part of the surface of the third impression cylinder.
<15> The printing unit includes: a first printing unit that faces the impression cylinder and prints a lower electrode on the printing substrate; The printing apparatus according to <13>, further comprising: a second printing unit that prints a layer; and a third printing unit that faces the impression cylinder and prints an upper electrode on the printing substrate on which the insulating layer is printed.

According to the present invention, a fixing member that can fix a printing base material to a conveying section, can be easily peeled off from the conveying section, improves the positional accuracy of printing, and can efficiently manufacture a flexible electronic device, and the fixing member are used. It is possible to provide a method for manufacturing a flexible electronic device, a laminate, and a printing apparatus.

1 is a schematic configuration diagram of a fixing member according to a first embodiment of the present disclosure as viewed from the side; FIG. FIG. 5 is a schematic configuration diagram of a fixing member according to a second embodiment of the present disclosure as viewed from the side; FIG. 5 is a schematic configuration diagram of a fixing member according to a second embodiment of the present disclosure, viewed from above; 1 is a schematic configuration diagram of a printing apparatus according to a first embodiment of the present disclosure; FIG. 1 is a schematic configuration diagram showing a flexible electronic device manufactured using a printing apparatus according to a first embodiment of the present disclosure; FIG. FIG. 5 is a schematic configuration diagram of a printing apparatus according to a second embodiment of the present disclosure; FIG. 11 is a schematic configuration diagram of a fixing member of Comparative Example 2 as viewed from above; FIG. 10 is a diagram showing a printing base material when ink is solid printed in Comparative Example 1; FIG. 10 is a diagram showing a printing base material when ink is solid printed in Comparative Example 2;

In the present disclosure, a numerical range represented using "to" means a range including the numerical values described before and after "to" as lower and upper limits.
In the numerical ranges described step by step in the present disclosure, the upper limit or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described step by step. . Moreover, in the numerical ranges described in the present disclosure, the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.

<Fixing member>
The fixing member of the present disclosure includes an adhesive layer that fixes a printing base material and a non-adhesive portion, the adhesive layer is provided on the outer peripheral portion of the non-adhesive portion, and the adhesive layer and In the thickness direction of the non-adhesive portion, the non-adhesive portion protrudes outward from the adhesive layer.

The fixing member of the present disclosure is used for attaching a printed substrate. More specifically, one surface is attached to a conveying portion such as an impression cylinder or a carrier sheet, and the opposite side of the fixing member attached to the conveying portion is attached to the printing base material to fix the printing base material. It is used to print a conductor pattern on a printing base material in a state of being fixed to the conveying section via a member.

In the fixing member of the present disclosure, the adhesive layer is provided on the outer periphery of the non-adhesive portion, and the non-adhesive portion protrudes outside the adhesive layer in the thickness direction of the adhesive layer and the non-adhesive portion. ing. Thereby, the printing base material can be appropriately fixed to the fixing member, and the printing base material can be easily peeled off from the fixing member. Furthermore, when the printing base material is conveyed by the conveying unit, it is possible to suppress the misalignment of the printing base material from the intended position. Flexible electronic devices can be manufactured well.

For example, when a plurality of impression cylinders are used to convey, print, and transfer a printing substrate in the case of continuous printing of a plurality of types of conductor patterns, the fixing member of the present disclosure prevents the position of the printing substrate from the intended location. Displacement can be suppressed, a conductive pattern can be accurately formed on a printing base material during continuous printing, and a flexible electronic device can be manufactured with high accuracy.

Conventionally, when a plurality of types of conductor patterns are printed, the printing base material is baked each time a conductor pattern is formed, and another conductor pattern is formed after baking, or the printing base material for forming another conductor pattern is used. I had to align the materials. For this reason, it took a long time to bake and align, and it was not possible to efficiently form the conductor pattern on the printing base material.

On the other hand, with the fixing member of the present disclosure, even when a plurality of types of conductor patterns are printed, continuous printing is possible by conveying the printing base material in a state of being fixed to the fixing member. It is possible to reduce the burden of alignment of the printing substrate for forming the . Therefore, by using the fixing member of the present disclosure, it is possible to efficiently manufacture a flexible electronic device.

In addition, the fixing member of the present disclosure does not have a non-adhesive portion, and compared to the case of using a fixing member having only an adhesive layer for fixing the printing substrate, air bubbles between the fixing member and the printing substrate are reduced. Since the entry of air bubbles can be suppressed, it is possible to reduce the adverse effect on the printing accuracy caused by the entry of air bubbles, and it is possible to suppress printing defects such as missing print. In addition, when a fixing member provided with only an adhesive layer for fixing the printing base material without a non-adhesive part is used, when the printing base material is fixed to the fixing member and heated, the adhesive layer and the printing base material are separated from each other. Due to the residual stress caused by the difference in thermal expansion coefficient between the two, the printed substrate separated from the fixing member tends to shrink, and the conductor pattern may also shrink. On the other hand, by using the fixing member of the present disclosure, the printing base material separated from the fixing member is less likely to shrink, and the printing base material having the intended conductor pattern can be easily obtained.

Furthermore, in the fixing member of the present disclosure, the non-adhesive portion protrudes outward from the adhesive layer, that is, the surface of the non-adhesive portion is positioned higher than the surface of the adhesive layer in the thickness direction. As a result, when performing a contact printing method in which an intermediate medium such as a printing plate or a blanket is brought into direct contact with a printing base material, which is the final medium, to transfer an image, the printing pressure tends to be uniformly applied to the entire printing base material. , a conductor pattern can be formed with high accuracy.

The fixing member of the present disclosure includes an adhesive layer that fixes the printing substrate. The adhesive layer is provided on the outer periphery of the non-adhesive portion described later, and furthermore, in the thickness direction of the adhesive layer and the non-adhesive portion, the non-adhesive portion protrudes outward from the adhesive layer. An agent layer is provided. The adhesive layer is not particularly limited as long as it contains an adhesive that can fix the printing substrate when it is brought into contact with the printing substrate, and the adhesive layer deforms when the printing substrate is dried and heated. From the viewpoint of suppressing deterioration and the like, it preferably contains an adhesive having excellent heat resistance, and it is preferable that the change in adhesive strength is small even after repeated adhesion and peeling.

The ratio of the peel strength after heat treatment in which the pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer is attached to the printing base material at 180 ° C. for 60 minutes and the peel strength before heating (after heat treatment The peel strength/the peel strength before heating) is preferably 0.5 to 5.0, more preferably 1.0 to 3.0.
The peel strength is determined by a 180 degree peel test in accordance with JIS Z 0237:2009.

The pressure-sensitive adhesive layer is 180° with respect to the printing substrate to be used in order to easily peel off the printing substrate from the fixing member after printing the conductive pattern while suppressing peeling when the printing substrate is fixed and conveyed. The peel strength is preferably 0.01 N/25 mm to 0.50 N/25 mm, more preferably 0.02 N/25 mm to 0.30 N/25 mm, and 0.04 N/25 mm to 0.20 N/25 mm. It is even more preferable to have If the peel strength is less than 0.01 N/25 mm, the printing substrate tends to peel off from the fixing member upon contact with the blanket, which is not preferable. It is not preferable because excessive stress is generated when it is pressed, causing breakage, wrinkles, and the like.

Examples of the adhesive contained in the adhesive layer include urethane-based adhesives, acrylic-based adhesives, and silicone-based adhesives. Among the adhesives, silicone-based adhesives are preferable from the viewpoints of heat resistance, reworkability, and air bubble removal.

The thickness of the adhesive layer is preferably 5 μm to 200 μm, more preferably 25 μm to 100 μm.

In this disclosure, the thickness of each configuration is the average of 10 random thickness measurements using a micrometer.

The adhesive layer is provided on the outer periphery of the non-adhesive portion, and the non-adhesive portion should protrude outside the adhesive layer in the thickness direction of the adhesive layer and the non-adhesive portion. For example, the non-adhesive part may be arranged on the adhesive layer, and the adhesive layer may be exposed at the outer peripheral part of the non-adhesive part, and the non-adhesive part is arranged so as to cover the outer peripheral part of the non-adhesive part. Alternatively, the thickness of the adhesive layer may be smaller than the thickness of the non-adhesive portion so that the surface of the non-adhesive portion protrudes outward from the surface of the adhesive layer.

The width of the adhesive layer is preferably 5 mm to 50 mm, more preferably 10 mm to 30 mm. The width of the adhesive layer means the width of the exposed portion.

The length of the adhesive layer is preferably 100 mm to 1000 mm, more preferably 200 mm to 500 mm.
The length of the adhesive layer means the length of the adhesive layer in the direction parallel to the conveying direction of the fixing member.

The non-adhesive portion is a portion that does not exhibit adhesiveness.
From the viewpoint of excellent heat resistance, the non-adhesive portion preferably has a dimensional change rate of 1% or less, more preferably 0.5% or less when heated at 180 ° C. for 30 minutes. .
Dimensional change rate (%) = [(dimension of non-adhesive part before heating - dimension of non-adhesive part after heat treatment)/dimension of non-adhesive part before heating] x 100
The dimension refers to at least one of the length dimension and the width dimension, and the dimensional change rate is preferably 1% or less in both the length dimension and the width dimension.

It is preferable to use a resin having a glass transition temperature (Tg) of 120.degree.
In the present disclosure, the glass transition temperature can be determined from a DSC curve obtained by differential scanning calorimetry (DSC).

Materials constituting the non-adhesive portion include metallic ceramics, stainless steel foil (SUS), aluminum foil, polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polycarbonate (PC), polyethylene naphthalate (PEN), and polyethylene terephthalate. (PET), polyamide, polyimide, and the like. Polyimide, polyethylene naphthalate, and the like are preferable as materials for forming the non-adhesive portion, as they have appropriate surface roughness and heat resistance and are hard to crack.

In the thickness direction of the adhesive layer and the non-adhesive portion, the distance between the surface of the non-adhesive portion and the surface of the adhesive layer is preferably 10 μm to 500 μm, more preferably 12 μm to 50 μm.
In the present disclosure, the distance between the surface of the non-adhesive portion and the surface of the adhesive layer is the height (height A) from the bottom surface of the fixing member opposite to the surface of the non-adhesive portion to the surface of the non-adhesive portion. The height (height B) from the bottom surface of the fixing member opposite to the surface of the adhesive layer to the surface of the adhesive layer (height B) was measured at 10 points at random using a micrometer, and the average value was calculated. , is the value obtained by subtracting the obtained average value (average value of height A−average value of height B).

In the thickness direction of the adhesive layer and the non-adhesive portion, the ratio of the width of the adhesive layer to the distance between the surface of the non-adhesive portion and the surface of the adhesive layer (width/distance of the adhesive layer) is, for example, 10 or more. , 100 or more, or 500 or more. Also, the width/distance of the pressure-sensitive adhesive layer may be 10,000 or less, 5,000 or less, or 3,000 or less.

The fixing member of the present disclosure further includes a support, an adhesive layer and a non-adhesive portion provided on one side of the support, and an adhesive layer on the other side of the support. good too. Furthermore, the support may be exposed from the outer peripheral portion of the pressure-sensitive adhesive layer provided on one side of the support. By providing the support, it becomes easier to attach the fixing member to a conveying unit such as an impression cylinder, and the workability of the fixing member is excellent. For example, by providing a support, it is possible to select an adhesive that is easy to stick to a conveying section such as an impression cylinder, and an adhesive that is easy to stick to a printing base material, respectively. A decrease in the durability of the pressure-sensitive adhesive layer can also be suppressed.

The thickness of the support is preferably 25 μm to 250 μm, more preferably 50 μm to 200 μm.

The support is not particularly limited, and includes polymer films, copper foils, aluminum foils and other metal foils, which will be described later.

From the viewpoint of excellent heat resistance, the support preferably has a dimensional change rate of 1% or less, more preferably 0.5% or less when heated at 180° C. for 30 minutes.
Dimensional change rate (%) = [(dimension of support before heating-dimension of support after heat treatment)/dimension of support before heating] x 100
The dimension refers to at least one of the length dimension and the width dimension, and the dimensional change rate is preferably 1% or less in both the length dimension and the width dimension.

Moreover, the glass transition temperature of the polymer film is preferably 80° C. or higher, more preferably 120° C. or higher, from the viewpoint of heat resistance.

The printing substrate is not limited as long as it is a substrate used for printing a conductor pattern, and a polymer film is preferable from the viewpoint of producing a flexible electronic device having excellent flexibility.

Polymer materials for forming polymer films include polyolefin resins such as polyimide, polyethylene, polypropylene, and poly(4-methylpentene-1), ring-opening metathesis polymers of norbornenes, addition polymers, and other olefins. Cycloolefin polymers such as addition copolymers, biodegradable polymers such as polylactic acid and polybutylene succinate, polyamide resins such as nylon 6, 11, 12, 66, aramid, polymethyl methacrylate, polyvinyl chloride, polyvinyl chloride Vinylidene, polyvinyl alcohol, polyvinyl butyral, ethylene vinyl acetate copolymer, polyacetal, polyglycolic acid, polystyrene, styrene-methyl methacrylate copolymer, polycarbonate, polypropylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, syndiotactic polystyrene, poly Polyester resins such as butylene terephthalate, polyethylene-2,6-naphthalate, polycyclohexanedimethylene terephthalate, polyether sulfone, polyether ketone, modified polyphenylene ether, polyphenylene sulfide, polyetherimide, polyarylate, tetrafluoroethylene-6 Propylene fluoride copolymers, polyvinylidene fluoride, acrylonitrile/butadiene/styrene copolymers, epoxy resins, and the like, which are known per se, can be used.
Polyimide, polyethylene naphthalate, polyethylene terephthalate, and the like are particularly preferable as the polymer material for forming the polymer film, and polyethylene naphthalate film, which can withstand heat treatment at relatively high temperatures and has good dimensional stability, is more preferable.

The thickness of the printing base material is not particularly limited, and is preferably 1 μm to 300 μm, more preferably 12 μm to 250 μm, and more preferably 25 μm to 200 μm from the viewpoint of mechanical strength and miniaturization. More preferred.

As specific configurations of the fixing member, the fixing member of the first embodiment and the fixing member of the second embodiment will be described below with reference to FIGS. 1 to 3. FIG. FIG. 1 is a schematic side view of a fixing member according to a first embodiment of the present disclosure, FIG. 2 is a side view of a securing member according to a second embodiment of the present disclosure, and FIG. [Fig. 4] is a schematic configuration diagram of a fixing member according to a second embodiment of the present disclosure as viewed from above;

[Fixing member of the first embodiment]
The fixing member of the first embodiment includes an adhesive layer 61 and a non-adhesive portion 62 and is attached to the surface of the impression cylinder 13, as shown in FIG. The non-adhesive portion 62 is arranged on the adhesive layer 61 , and the adhesive layer 61 is exposed on the outer peripheral portion of the non-adhesive portion 62 .

[Fixing member of the second embodiment]
In the fixing member of the second embodiment, as shown in FIG. 2, an adhesive layer 63, a support 64, an adhesive layer 65 and a non-adhesive portion 66 are laminated in this order when viewed from the impression cylinder 13 side. That is, in the fixing member of the present embodiment, the adhesive layer 65 and the non-adhesive portion 66 are provided on one side of the support 64, and the adhesive layer 63 is provided on the other side of the support 64. ing. The printing substrate 10 is attached to one surface of the support 64 , and the impression cylinder 13 is attached to the other surface of the support 64 .

As shown in FIG. 3 , the adhesive layer 65 is exposed on the entire outer peripheral portion of the non-adhesive portion 66 . For example, in the fixing member shown in FIG. 3, when the printing base material is rectangular, four sides of the printing base material are brought into contact with the adhesive layer 65 and fixed. For example, compared to when the printing substrate is rectangular and two or three sides of the printing substrate are fixed to the adhesive layer, it is easier to form a conductive pattern with high accuracy, and the conductive pattern is formed. It tends to be possible to suppress deformation of the printed substrate when the printed substrate is heated.

In addition, the present invention is not limited to the configuration in which the adhesive layer is exposed and provided on the entire outer peripheral portion of the non-adhesive portion, and the area where the adhesive layer is not provided on a part of the outer peripheral portion of the non-adhesive portion. may exist. For example, when the printing substrate has a rectangular shape, the adhesive layer is exposed at the outer periphery of the non-adhesive portion so that the four sides of the printing substrate are fixed in contact with the adhesive layer, and the four sides At least a part of, for example, a part of one side on the downstream side in the conveying direction may have a region where the pressure-sensitive adhesive layer is not provided. This makes it easier for the gas that has entered between the fixing member and the printing base material to escape from this region, thereby suppressing the floating of the printing base material when the printing base material is attached to the fixing member.

The fixing member of the present invention is not limited to a structure that is attached to a conveying portion such as an impression cylinder, and the above-described adhesive layer and the above-described non-adhesive portion are provided on the surface of the conveying portion such as an impression cylinder. A configuration to which the function of the fixing member of the present embodiment described above is added is also included in the fixing member of the present invention.
For example, a non-adhesive part is provided on a part of the surface, and an adhesive layer is provided on the outer periphery of the non-adhesive part, and the non-adhesive part is an adhesive layer in the thickness direction of the adhesive layer and the non-adhesive part. A conveying unit such as an impression cylinder having a structure protruding outward from the layer is also included in the fixing member of the present invention.

<Method for manufacturing flexible electronic device>
The manufacturing method of the flexible electronic device of the present disclosure includes the steps of attaching a printing base material to the fixing member of the present disclosure and fixing the printing base material to the fixing member, and fixing the printing base material to the fixing member. a step of printing a conductor pattern on the surface of; a step of heating the printed base material on which the conductor pattern is printed; and a step of peeling off the printed printed base material from the fixing member. be.

Flexible electronic devices manufactured by the manufacturing method of the present disclosure include those in which a thin film transistor (TFT), a transparent electrode, etc. are formed on a printing substrate such as a polymer film.

The manufacturing method of the present disclosure includes a step of attaching the printing substrate to the fixing member of the present disclosure and fixing the printing substrate to the fixing member (fixing step). At this time, the surface of the fixing member opposite to the side to be bonded to the printing base material is attached to at least a part of the surface of the impression cylinder, a carrier sheet, or the like, and is attached to the surface of the impression cylinder, the carrier sheet, or the like. A printing base material may be attached to the attached fixing member.

Further, in the manufacturing method of the present disclosure, after the printing base material is attached to the fixing member and the printing base material is fixed to the fixing member, the surface of the fixing member opposite to the side bonded to the printing base material is pressed. It may be attached to at least part of the surface of the barrel.

The manufacturing method of the present disclosure has a step of printing a conductor pattern on the surface of a printing substrate (printing step). The method for printing the conductor pattern is not particularly limited, and from the viewpoint of short printing time and high-speed production of flexible electronic devices, ink containing metal particles, preferably ink containing metal nanoparticles, is used for printing. A contact printing method is preferred in which an intermediate medium such as a plate or blanket is brought into direct contact with a printing substrate, which is the final medium, to effect image transfer. Examples of contact printing methods include letterpress printing, intaglio printing, lithographic printing, stencil printing, reverse offset printing, and the like. In particular, reverse offset printing, which enables high-definition printing, can be suitably applied.

The type of metal particles contained in the ink may be appropriately determined according to the required properties of the flexible electronic device, and examples thereof include platinum, gold, silver, copper, nickel, palladium, zinc, tin, and iron. The metal particles contained in the ink may be of only one type, or may be of two or more types.

The average particle size of the metal particles is not particularly limited, and is preferably 1 nm to 500 nm, more preferably 1 nm to 200 nm, even more preferably 1 nm to 100 nm. The average particle diameter of the metal particles is the particle diameter (D50) when the accumulation from the small diameter side is 50% in the volume-based particle size distribution measured by the laser diffraction method.

The manufacturing method of the present disclosure may have multiple printing steps depending on the conductor pattern to be formed on the printing substrate. For example, when forming a thin film transistor on a printed substrate, the printing process includes a first printing step of printing a lower electrode on the printed substrate and a second printing step of printing an insulating layer on the printed substrate on which the lower electrode is printed. and a third printing step of printing the upper electrode on the printing substrate on which the insulating layer is printed.

When the production method of the present disclosure has multiple printing steps, it may have a drying step for drying the printing substrate between each printing step. For example, a printed base material on which a lower electrode is printed, a printed base material on which a lower electrode and an insulating layer are printed, a printed base material on which a lower electrode, an insulating layer and an upper electrode are printed, and the like may be dried. Examples of methods for drying the printing base material include a method of irradiating with IR (infrared rays), electromagnetic waves, or the like, or a method of blowing hot air, hot air, or the like. The aforementioned printing step and the aforementioned drying step are preferably carried out in a continuous process. Thereby, a flexible electronic device can be manufactured efficiently and continuously.

The manufacturing method of the present disclosure has a step (heating step) of heating the printing substrate on which the conductor pattern is printed after the printing step. As a result, the metal nanoparticles printed on the printing substrate in the printing process are baked, and the solvent contained in the ink can be removed.

In the manufacturing method of the present disclosure, for example, when forming a thin film transistor on a printing substrate, after the third printing step of printing the upper electrode on the printing substrate on which the insulating layer is printed, the printing substrate on which the thin film transistor is formed may be heated.

The heating temperature in the heating step may be appropriately set according to the purpose. For example, it is preferably 80°C to 200°C, more preferably 100°C to 180°C, and 110°C to 150°C. is more preferred.

The manufacturing method of the present disclosure includes a step (peeling step) of stripping the printed base material on which the conductor pattern is printed from the fixing member. Thereby, a flexible electronic device can be manufactured. In addition, the peeling process may be performed before the heating process or after the heating process.

In the manufacturing method of the present disclosure, the position of the upper electrode actually printed in the manufactured flexible electronic device is compared with the position of the upper electrode assumed in advance, and depending on the difference between the two positions, the next time and later You may adjust the printing position of the upper electrode of a printing base material. Thereby, a flexible electronic device can be manufactured more efficiently and accurately.

<Laminate>
A laminate of the present disclosure is used for manufacturing a flexible electronic device by laminating a printed base material, a fixing member of the present disclosure, and a carrier sheet in this order. A flexible electronic device can be efficiently manufactured by transporting the laminate of the present disclosure and forming a conductive pattern on a printed substrate. For example, a conductive pattern can be formed on the printing substrate while fixing the printing substrate to the carrier sheet via a fixing member and transporting the carrier sheet together with the surfaces of the impression cylinder and the transport cylinder. As a result, there is no need to fix the printing base material to the fixing member each time the printing base material is transferred between the impression cylinder and the transfer cylinder. There is little stress applied to it, and deformation tends to be suppressed.

<Printing device>
The printing apparatus of the present disclosure includes an impression cylinder, the fixing member of the present disclosure having a surface opposite to a side to be bonded to a printing base material attached to at least a part of the surface of the impression cylinder, and the fixing member. A printing unit that prints a conductor pattern on the printing base material that is fixed by being attached to a member, and a heating unit that heats the printing base material on which the conductor pattern is printed are provided. The printing apparatus of the present disclosure can easily fix a printing base material to an impression cylinder, which is a conveying part, and peel it off from the impression cylinder, improve printing position accuracy, and efficiently manufacture a flexible electronic device.

A printing apparatus according to the first embodiment and a printing apparatus according to the second embodiment, which are specific configurations of the printing apparatus of the present disclosure, will be described below with reference to FIGS. 4 and 6. FIG. FIG. 4 is a schematic configuration diagram of the printing apparatus according to the first embodiment of the present disclosure, and FIG. 6 is a schematic configuration diagram of the printing apparatus according to the second embodiment of the present disclosure. Note that the printing apparatus of the present disclosure is not limited to these embodiments.

[Printing Apparatus of First Embodiment]
As shown in FIG. 4, the printing apparatus 100 of the first embodiment includes a printing material placement section 1 in which the printing material 10 is arranged, and a printing material supply section that supplies the printing material 10 to the impression cylinder 13 side. 2, conveying cylinders 21 and 22 for conveying the printing substrate 10 supplied from the printing substrate supply unit 2, and the printing substrate 10 is fixed via a fixing member (not shown), and the printing substrate 10 Impression cylinders 13 to 15 and transport cylinders 16 and 17 for transporting, a first printing unit 3 for printing a lower electrode on the printing substrate 10, a second printing unit 4 for printing an insulating layer on the printing substrate 10, A third printing unit 5 for printing an upper electrode on a printing substrate 10, a printing substrate receiving unit 6 for receiving the printing substrate 10 from a conveying cylinder 17, and printing in which the printing substrate 10 on which a conductor pattern is printed is arranged. and a base material placement part 7 .
Fixing members are attached to the surfaces of the impression cylinders 13 to 15 and the conveying cylinders 16 and 17, respectively. 10 is conveyed in a state of being fixed to a fixing member attached to each impression cylinder.

The impression cylinders 13 to 15 and the conveying cylinders 16, 17, 21 and 22 are provided with grasping means 1A to 1G for grasping a portion of the printing base material 10 being conveyed. The printing substrate 10 conveyed by the impression cylinders 13 to 15 and the conveying cylinders 16, 17, 21, and 22 is conveyed while being gripped by the gripping means 1A to 1G, and transferred to the impression cylinders or the conveying cylinders on the downstream side. In this case, the printing substrate 10 is gripped by the gripping means provided on the impression cylinder or the transport cylinder on the downstream side, and the printing substrate 10 is gripped by the gripping means provided on the impression cylinder or the transport cylinder on the upstream side. is released.
The shape of the gripping means 1A to 1G is not particularly limited as long as it is possible to grip the printing base material and transfer the printing base material. A plurality of gripping members may be provided in parallel at regular intervals in a direction orthogonal to the conveying direction of the substrate.

In addition, the printing apparatus 100 of the present embodiment includes a nip roll 91 facing the impression cylinder 13 upstream of the first printing unit 3 in the transport direction, and a nip roll facing the impression cylinder 14 upstream of the second printing unit 4 in the transport direction. 92 and a nip roll 93 facing the impression cylinder 15 upstream of the third printing unit 5 in the conveying direction.

First, the printing base material 10 placed in the printing base material placement section 1 is placed in the printing base material supply section 2 and supplied to the impression cylinder 13 (first impression cylinder) side. The fixing member described above is attached to at least part of the surface of the impression cylinder 13, and the printing substrate 10 supplied by the printing substrate supplying section 2 is attached to the fixing member.

The nip roll 91 faces the impression cylinder 13 upstream of the first printing unit 3 in the conveying direction, and applies the printing base material 10 supplied by the printing base material supply unit 2 to the fixed member attached to the impression cylinder 13 . The printing substrate 10 is fixed to the fixing member by pressing.

The printing base material 10 fixed to the fixing member attached to the surface of the impression cylinder 13 is conveyed by the rotation of the impression cylinder 13, and the lower electrode is printed on the printing base material 10 by the first printing unit 3. .

The first printing unit 3 faces the impression cylinder 13 and includes a blanket 33 , a drying unit 23 , an electrode material application unit 94 , a blanking plate 43 , and a cleaning unit 53 .

The blanket 33 transfers the lower electrode to the printing base material 10 and prints the lower electrode of a predetermined pattern on the printing base material 10 .

The drying section 23 dries the printed substrate 10 on which the lower electrode is printed. The drying unit 23 is not particularly limited, and examples thereof include an irradiation device for irradiating IR (infrared rays), electromagnetic waves, and the like, and a blower for blowing warm air, hot air, and the like.

The electrode material applying section 94 applies an electrode material to the blanket 33 . Thereby, the electrode material adheres to the surface of the blanket 33 .

The blanking plate 43 forms an electrode pattern on the blanket 33 to be transferred to the printing substrate 10 by removing unnecessary electrode materials from the electrode materials adhering to the surface of the blanket 33 .

The cleaning unit 53 cleans the blanking plate 43 to which the electrode material is attached.

The printing base material 10 on which the lower electrode is printed by the first printing unit 3 is conveyed by the rotation of the impression cylinder 13 and supplied to the conveying cylinder 16 . At this time, the gripping means 1C for gripping a portion of the printing substrate 10 fixed to the fixing member attached to the impression cylinder 13 is released, and the printing substrate is held by the gripping means 1D provided on the conveying cylinder 16. By gripping a portion of the material 10 , the printing base material 10 is peeled off from the fixed member attached to the impression cylinder 13 and attached to the fixed member attached to the conveying cylinder 16 . The printing base material 10 fixed to the fixing member attached to the surface of the conveying cylinder 16 is conveyed by the rotation of the conveying cylinder 16 .

The printing base material 10 is conveyed by the rotation of the conveying cylinder 16 and supplied to the impression cylinder 14 (second impression cylinder). At this time, the gripping means 1D for gripping a portion of the printing substrate 10 fixed to the fixing member attached to the conveying cylinder 16 is released, and the gripping means 1E provided on the impression cylinder 14 is released. By gripping a portion of the material 10 , the printing base material 10 is separated from the fixed member attached to the transport cylinder 16 and attached to the fixed member attached to the impression cylinder 14 .

The nip roll 92 faces the impression cylinder 14 upstream of the second printing unit 4 in the conveying direction, and presses the printing base material 10 supplied by the conveying cylinder 16 against the fixed member attached to the impression cylinder 14. to fix the printing substrate 10 to the fixing member.

The printing base material 10 fixed to the fixing member attached to the surface of the impression cylinder 14 is conveyed by the rotation of the impression cylinder 14, and an insulating layer is printed on the printing base material 10 by the second printing unit 4. .

The second printing unit 4 faces the impression cylinder 14 and includes an insulating material applying unit 34 and a drying unit 24 .

The insulating material application unit 34 is for printing an insulating layer by applying an insulating material to the printing substrate 10 on which the lower electrode is printed.

The drying section 24 dries the printing substrate 10 on which the insulating layer is printed. The drying section 24 is not particularly limited, and includes an irradiation device for irradiating IR (infrared rays), electromagnetic waves, etc., and a blower for blowing warm air, hot air, and the like.

The printing base material 10 on which the insulating layer is printed by the second printing unit 4 is conveyed by the rotation of the impression cylinder 14 and supplied to the conveying cylinder 17 . Then, the gripping means 1E for gripping a portion of the printing substrate 10 fixed to the fixing member attached to the impression cylinder 14 is released, and the printing substrate is moved to the gripping means 1F provided on the conveying cylinder 17. By holding a part of 10 , the printing base material 10 is separated from the fixed member attached to the impression cylinder 14 and is attached to the fixed member attached to the transport cylinder 17 . The printing base material 10 fixed to the fixing member attached to the surface of the transport cylinder 17 is transported by the rotation of the transport cylinder 17 and supplied to the impression cylinder 15 (third impression cylinder).

The gripping means 1F for gripping a portion of the printing base material 10 fixed to the fixing member attached to the conveying cylinder 17 is released, and the printing base material 10 is moved to the gripping means 1G provided on the impression cylinder 15. By partially gripping, the printing base material 10 is peeled off from the fixing member attached to the transport cylinder 17 and attached to the fixing member attached to the impression cylinder 15 .

The nip roll 93 faces the impression cylinder 15 upstream of the third printing unit 5 in the conveying direction, and presses the printing base material 10 supplied by the conveying cylinder 17 against the fixed member attached to the impression cylinder 15. to fix the printing substrate 10 to the fixing member.

The printing base material 10 fixed to the fixing member attached to the surface of the impression cylinder 15 is conveyed by the rotation of the impression cylinder 15, and the upper electrode is printed on the printing base material 10 by the third printing unit 5. .

The third printing unit 5 faces the impression cylinder 15 and includes a blanket 35 , a drying unit 25 , an electrode material application unit 95 , a blanking plate 45 and a cleaning unit 55 .

The blanket 35 transfers the upper electrode to the printing base material 10 on which the insulating layer is printed, and prints the upper electrode of a predetermined pattern on the printing base material 10 .

The drying section 25 dries the printing substrate 10 on which the upper electrode is printed. The drying unit 25 is not particularly limited, and examples thereof include an irradiation device for irradiating IR (infrared rays), electromagnetic waves, etc., and a blower for blowing warm air, hot air, and the like.

The electrode material application unit 95 applies an electrode material to the blanket 35 . Thereby, the electrode material adheres to the surface of the blanket 35 .

The blanking plate 45 forms an electrode pattern on the blanket 35 to be transferred to the printing substrate 10 by removing unnecessary electrode materials from the electrode materials adhering to the surface of the blanket 35 .

The cleaning unit 55 cleans the blanking plate 45 to which the electrode material is attached.

The printing apparatus 100 of the present embodiment has a configuration for printing the lower electrode and the upper electrode on the printing substrate by reverse offset printing, but the printing apparatus of the present invention is not limited to this. A configuration may be provided in which the lower electrode and the upper electrode are printed on the printing base material by a contact-type printing method other than the above.

The printing base material 10 on which the upper electrode is printed by the third printing unit 5 is conveyed by the rotation of the impression cylinder 15, and the printing base material 10 is peeled off from the fixing member attached to the impression cylinder 15 and printed. It is supplied to the base material receiving section 6 . Then, the printed base material 10 on which the conductor pattern is printed is placed in the printed base material placement section 7 .

By using the printing apparatus 100 of the present embodiment, a flexible electronic device 50 having a lower electrode 20, an insulating layer 30 and an upper electrode 40 in this order on a printed substrate 10 can be manufactured as shown in FIG.

Further, the printing apparatus 100 of the present embodiment includes confirmation means for confirming the positions of the upper electrodes actually printed on the manufactured flexible electronic device, the positions of the upper electrodes confirmed by the confirmation means, and the a control unit that controls the third printing unit 5 so as to compare the position of the upper electrode with the assumed position of the upper electrode and adjust the printing position of the upper electrode of the printing base material from the next time on according to the difference between the two positions; may be further provided.

[Printing Apparatus of Second Embodiment]
As shown in FIG. 6, the printing apparatus 200 of the second embodiment includes an impression cylinder 110 to which the printing substrate 10 is fixed via a fixing member (not shown) and which conveys the printing substrate 10, and a printing substrate. A blanket 120 (first printing part and third printing part) for printing the lower electrode and the upper electrode on the material 10, a blanket 130 (second printing part) for printing the insulating layer on the printing substrate 10, and the printing substrate 10 and a drying unit 140 that dries the

Further, the printing apparatus 200 includes a feed table 150 for supplying the printing base material 10, a transport cylinder 160 for transporting the printing base material 10 to the impression cylinder 110, and a transport for transporting the printing base material 10 separated from the impression cylinder 110. A cylinder 180 and a discharge table 190 to which the printing base material 10 conveyed from the conveying cylinder 180 is supplied are provided.
In addition, the transport cylinder 160 includes first gripping means (not shown) for gripping a portion of the printing substrate 10 supplied from the supply table 150 , and the impression cylinder 110 serves as the printing substrate transported from the transport cylinder 160 . A second gripping means (not shown) for gripping a portion of the material 10 is provided, and the transport cylinder 180 is provided with a third gripping means (not shown) for gripping a portion of the printing base material 10 transported from the impression cylinder 110 . ).
The printing apparatus 200 also includes a nip roll 170 that faces the impression cylinder 110 and presses the printing substrate 10 against a fixing member attached to the impression cylinder 110 .

The printing base material 10 is supplied from the supply table 150 to the conveying cylinder 160 , and the printing base material 10 gripped by the first gripping means is conveyed from the conveying cylinder 160 to the impression cylinder 110 . The printing base material 10 conveyed to the impression cylinder 110 is gripped by the second gripping means and attached to the fixing member attached to the surface of the impression cylinder 110 .

The nip roll 170 presses the printing substrate 10 against the fixing member attached to the impression cylinder 110 , thereby fixing the printing substrate 10 to the fixing member.

The printing base material 10 fixed to the fixing member attached to the surface of the impression cylinder 110 is conveyed as the impression cylinder 110 rotates, and the lower electrode is printed by the blanket 120 facing the impression cylinder 110 .

The blanket 120 has a lower electrode printed surface 121 and an upper electrode printed surface 122 . The blanket 120 transfers the electrode material adhering to the lower electrode printing surface 121 to the printing base material 10 to print the lower electrodes of a predetermined pattern on the printing base material 10 . In addition, the blanket 120 transfers the electrode material adhering to the upper electrode printed surface 122 to the printing substrate 10 on which the insulating layer is printed as described later, and prints the upper electrodes of a predetermined pattern on the printing substrate 10. .

An electrode material applied from an electrode material applying unit (not shown) adheres to the lower electrode printing surface 121, and unnecessary electrode material of the adhered electrode material is removed by a blanking plate (not shown). . As a result, the electrode material adhering to the lower electrode printed surface 121 has a predetermined pattern, and this electrode material is transferred to the printing base material 10, so that the lower electrode of the predetermined pattern is printed on the printing base material 10. .

The printing substrate 10 on which the lower electrode is printed is conveyed by the rotation of the impression cylinder 110 , and the insulating layer is printed by the blanket 130 facing the impression cylinder 110 .

An insulating material applied from an insulating material applying unit (not shown) adheres to the blanket 130, and the adhered insulating material is transferred to the printing base material 10 on which the lower electrode is printed. printed on

The printing base material 10 on which the insulating layer is printed is conveyed by the rotation of the impression cylinder 110 , and the printing base material 10 is dried by the drying unit 140 facing the impression cylinder 110 .

The drying section 140 dries the printing substrate 10 . The drying unit 140 is not particularly limited, and examples thereof include an irradiation device for irradiating IR (infrared rays), electromagnetic waves, and the like, and a blower for blowing warm air, hot air, and the like.

The printing substrate 10 conveyed to the drying section 140 is dried and conveyed by the rotation of the impression cylinder 110 , and the upper electrode is printed by the blanket 120 facing the impression cylinder 110 .

An electrode material applied from an electrode material applying unit (not shown) adheres to the upper electrode printing surface 122, and unnecessary electrode material of the adhered electrode material is removed by a blanking plate (not shown). . As a result, the electrode material adhering to the upper electrode printed surface 122 has a predetermined pattern, and this electrode material is transferred to the printing substrate 10 on which the insulating layer is printed, so that the lower electrode of the predetermined pattern is formed on the printing substrate. printed on the material 10;

The printing substrate 10 on which the upper electrode is printed by the blanket 120 is dried by the drying section 140 as necessary.

After being dried in the drying section 140 , the printing base material 10 on which the upper electrode is printed is gripped by the third gripping means, separated from the impression cylinder 110 , and transported from the impression cylinder 110 to the transport cylinder 180 .

The printing base material 10 conveyed from the conveying cylinder 180 is supplied to the discharge table 190 and discharged to the outside of the printing apparatus 200 . As a result, the printed substrate 10 on which the upper electrode is printed can be recovered.

By using the printing apparatus 200 of the present embodiment, a flexible electronic device 50 having a lower electrode 20, an insulating layer 30 and an upper electrode 40 in this order on a printing substrate 10 can be manufactured as shown in FIG.

The printing apparatus 200 of this embodiment may be provided with imaging means such as a camera facing the impression cylinder 110 and imaging the printing surface of the printing substrate 10 . The printing apparatus 200 further includes a control unit that controls printing of the blanket 120 so as to adjust the printing position of the upper electrode according to the position of the lower electrode pattern of the printing substrate 10 photographed by the photographing means. may

In the printing apparatus 200 of this embodiment, instead of the blanket 120 for printing the lower electrode and the upper electrode on the printing base material 10 and the blanket 130 for printing the insulating layer on the printing base material 10, when viewed from the rotation direction of the impression cylinder 110, A blanket for printing the lower electrode on the printing substrate 10, a blanket for printing the insulating layer on the printing substrate 10, and a blanket for printing the upper electrode on the printing substrate 10 may be provided in this order.

The present invention will be described in more detail below with reference to examples, but the present invention is not limited by the following examples. Moreover, it is of course possible to make appropriate modifications within a scope compatible with the gist of the present invention, and all of them are included in the technical scope of the present invention.

In Comparative Examples 1 to 3 and Example 1, flexible electronic devices were manufactured by printing a lower electrode, an insulating layer and an upper electrode on a printed base material using a printing apparatus.

[material]
The printing base materials used in Comparative Examples 1 to 3 and Example 1, and the pressure-sensitive adhesive layer on the impression cylinder side, the pressure-sensitive adhesive layer on the printing base side, the support, and the non-adhesive portion constituting the fixing member are as follows. is as follows.
<Print base material>
PEN: polyethylene naphthalate film (trade name: Teonex (registered trademark), model number: PQDA5, thickness 125 μm, width 400 mm, length 300 mm, manufactured by Teijin Film Solutions Co., Ltd.)
<Adhesive layer on impression cylinder side>
Silicone adhesive sheet (manufactured by Kyosha Co., Ltd., MagiCarry (registered trademark) β type NH, adhesive layer thickness 75 μm, width 330 mm, length 240 mm)
MagiCarry β has a configuration in which a removable weak adhesive layer is laminated on one side of a polyimide film base material, and a non-removable strong adhesive layer is laminated on the other side. The side was attached to the backing and the weak adhesive side was attached to the impression cylinder side.
<Adhesive layer on the printing substrate side>
Silicone adhesive sheet (manufactured by Kyosha Co., Ltd., MagiCarry (registered trademark) β, type NM, adhesive layer thickness 75 μm, width 330 mm, length 240 mm, 180 ° C. for 60 minutes while attached to the printing substrate The ratio of the peel force after heat treatment heated under the conditions to the peel force before heating (peeling force after heat treatment/peeling force before heating) is 1.5)
In MagiCarry β on the printing base material side, the strong adhesive side was used as a support, and the weak adhesive side was used as an adhesive layer for fixing the printing base material.
<Support>
PEN: polyethylene naphthalate (manufactured by Teijin Film Solution Co., Ltd., product name: Teonex (registered trademark), model number: PQDA5, thickness 125 μm, width 400 mm, length 300 mm, glass transition temperature 155 ° C., 180 ° C., 30 minutes Dimensional change rate when heated at 0.2%)
<Non-adhesive part>
Polyimide (manufactured by Toyobo Co., Ltd., trade name: Xenomax, thickness 38 μm, dimensional change rate 0.1% when heated at 180 ° C. for 30 minutes)

[Comparative Example 1]
A fixing member was prepared by laminating the pressure-sensitive adhesive layer on the impression cylinder side, the support, and the pressure-sensitive adhesive layer on the printing substrate side in this order. The entire adhesive surface (width 330 mm, length 240 mm) was exposed on the printing substrate side.
The fixing member prepared in Comparative Example 1 was attached to the surface of the impression cylinder of the printing apparatus shown in FIG.
In Comparative Example 1, the printing base material is fixed by the entire surface of the pressure-sensitive adhesive layer (fixed on the entire surface).

[Comparative Example 2]
A fixing member was prepared by laminating an adhesive layer on the impression cylinder side, a support, an adhesive layer on the printing substrate side, and a non-adhesive portion in this order. In the fixing member of Comparative Example 2, as shown in FIG. 7, a support 84, an adhesive layer 85 and a non-adhesive portion 86 are laminated in this order, and the adhesive layer 85 is exposed at both ends in the width direction. be. The exposed adhesive layer 85 had a width of 15 mm, and the non-adhesive portion 86 had a width of 300 mm and a length of 240 mm.
The fixing member prepared in Comparative Example 2 was attached to the surface of the impression cylinder of the printing apparatus shown in FIG.
In Comparative Example 2, the printing substrate is fixed by two sides of the adhesive layer 85 exposed in the width direction (fixed on two sides).

[Example 1]
A fixing member was prepared by laminating an adhesive layer on the impression cylinder side, a support, an adhesive layer on the printing substrate side, and a non-adhesive portion in this order. In the fixing member of Example 1, as shown in FIG. 3, a support 64, an adhesive layer 65, and a non-adhesive portion 66 are laminated in this order. The pressure-sensitive adhesive layer 65 is exposed. The length of the adhesive layer 65 exposed in the width direction is 15 mm, and the length of the adhesive layer 65 exposed in the length direction is 30 mm on the upstream side when the printing substrate is conveyed. It was 15 mm on the downstream side when conveying the material. The non-adhesive portion 66 had a width of 300 mm and a length of 195 mm.
The fixing member prepared in Example 1 was attached to the surface of the impression cylinder of the printing apparatus shown in FIG.
In Example 1, the printing substrate is fixed by two sides of the pressure-sensitive adhesive layer 65 exposed in the width direction and two sides of the pressure-sensitive adhesive layer 65 exposed in the length direction (four sides fixing).

[Fixation of printing substrate]
In Comparative Example 1, a method of adhesively fixing the printing base material to the impression cylinder to which the fixing member was attached was examined. First, the printing substrate was pressed with a nip roll, and the printing substrate was adhesively fixed to the fixing member attached to the impression cylinder while removing air bubbles trapped between the pressure-sensitive adhesive layer and the printing substrate. At this time, the width of the nip roll was set to 420 mm, which was larger than the width of the printing substrate, so that the entire surface of the printing substrate was uniformly pressed. Further, the printing base material was adhesively fixed to the fixing member so that the center of gravity of the printing base material coincided with the center of gravity of the support. Here, (1) when the printing base material is adhesively fixed to the fixing member attached to the impression cylinder using a blanket under the same conditions as the printing pressure, (2) the pressing amount when using the blanket is the above-mentioned ( 1) When the printing substrate is adhesively fixed to the fixing member attached to the impression cylinder with the thickness increased by 13 μm, and (3) Together with the above-mentioned (2), the downstream side of the printing substrate in the conveying direction is supported and lifted. The degree of entrapment of air bubbles was evaluated in the case where the printing substrate was gradually adhesively fixed to the fixing member attached to the impression cylinder from the upstream side in the conveying direction of the printing substrate in the state. In (1), it was confirmed that many bubbles were generated over the entire surface of the printing substrate, in (2) described above, the generation of bubbles was significantly reduced, and in (3) described above, (2) ), the generation of air bubbles was reduced.
In the following experiments of Comparative Examples 1 to 3 and Example 1, the printing substrate was adhered and fixed to the fixing member attached to the impression cylinder according to (2) above.

[Printing on printing substrate]
In Comparative Examples 1 to 3 and Example 1, a conductor pattern was printed on a printing substrate adhesively fixed to a fixing member attached to an impression cylinder. Specifically, after printing a gate electrode pattern with a reversal offset printer using silver nano ink (RAGT-19, manufactured by DIC Corporation), two infrared heaters rated at 2.4 kW are turned on at an applied overvoltage of 122 V. The heated area was dried (temporarily baked) for a total of 13 seconds while moving the printing substrate at a speed of 13.1 mm/second. Next, a gate insulating layer ink (SC-GI01/RP, manufactured by Sumitomo Chemical Co., Ltd.) was applied using a blanket and dried (temporarily baked) under the same conditions as the gate electrode pattern. Next, a source-drain electrode pattern was printed using a silver nanoink (RAGT-19, manufactured by DIC Corporation) by a reversal offset printing machine, and then the printing substrate on which the conductor pattern was printed was peeled off from the fixing member. After peeling from the fixing member, shrinkage of the printing substrate (with pre-baking) on which the conductor pattern was printed was verified.
In addition, after the printing of the gate electrode pattern and the printing of the source/drain electrode pattern, a printing base material on which the conductor pattern is printed is produced without drying, and this printing base material (without pre-firing) is subjected to shrinkage of the printing base material. verified.
The shrinkage of the printing substrate was evaluated based on the deviation value from the design value in the width direction of the printing substrate.
Table 1 shows the results. The outer circumference dimension in Table 1 means the amount of deviation (μm) from the design value in the width direction, a negative number means shrinkage, and a positive number means expansion. The smaller the absolute value of the outer circumference,

[Evaluation of Missing Print]
In Comparative Examples 1 to 3 and Example 1, the ink (RAGT19, manufactured by DIC Corporation) applied to the entire surface of the blanket was solidly printed on the printing base material adhesively fixed to the fixing member attached to the impression cylinder, and the printing was not performed. An evaluation was made as to whether or not areas (print defects) would occur.
The results of Comparative Examples 1 and 2 are shown in FIGS. 8 and 9. FIG.

As shown in FIG. 8, in Comparative Example 1, a large number of white spots with a diameter of about 2 mm were observed, and it was confirmed that print defects occurred. Furthermore, a detailed observation of the edge of the printed area confirmed an uneven shape with an amplitude of about 2 mm. Since the ink was uniformly applied to the blanket, it is presumed that the uneven shape was caused by the adhesive layer that fixed the printing substrate. More specifically, since the entire surface of the printing base material is fixed to the uneven adhesive layer, the printing base material is also deformed following the uneven shape. is assumed to occur easily.

On the other hand, as shown in FIG. 9, in Comparative Example 2, almost no white spots were observed, and print defects were greatly reduced compared to Comparative Example 1. Also, in Example 1, as in Comparative Example 2, almost no white spots were observed, and print defects were greatly reduced as compared with Comparative Example 1. In Comparative Examples 2 and 3 and Example 1, the fixing member has a non-adhesive portion, and since this fixing member is in contact with the printing base material, it is difficult to deform following the adhesive having an uneven shape. Due to the high uniformity and easy application of printing pressure, it is presumed that print defects are less likely to occur.

The results of each experiment are summarized in Table 2 below. As shown in Table 2, in Example 1, print defects, deformation of the printing substrate, and shrinkage of the printing substrate were suppressed as compared with Comparative Examples 1 to 3, and printing accuracy was also good.

[Examples 2 to 4]
As the non-adhesive part, SUS (thickness 100 μm, dimensional change rate 0% when heated at 180 ° C. for 30 minutes), PEN (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teonex (registered trademark), model number : PQDA5, thickness 125 μm, width 400 mm, length 300 mm, glass transition temperature 155 ° C., thickness 50 μm, 180 ° C., dimensional change rate when heated under the conditions of 30 minutes 0.2%) and polyimide (Toyobo Co., Ltd. company, product name: Xenomax, thickness 25 μm, dimensional change rate 0.1% when heated at 180 ° C. for 30 minutes) was fixed in the same manner as in Example 1. A member was produced, and the printing substrate was printed in the same manner as in Example 1.

In Examples 2 to 4, similarly to Example 1, it was confirmed that there were few print defects, deformation of the printing substrate, and shrinkage of the printing substrate, and that the printing accuracy was good.

REFERENCE SIGNS LIST 1 printing base material arrangement unit 2 printing base material supply unit 3 first printing unit 4 second printing unit 5 third printing unit 6 printing base receiving unit 7 printing base material Arrangement part 10... Printing base material 13-15, 110... Impression cylinder 16, 17, 21, 22... Transport cylinder 20... Lower electrode 23-25... Drying part 30... Insulating layer 33, 35, DESCRIPTION OF SYMBOLS 120, 130... Blanket, 34... Insulating material application part, 40... Upper electrode, 43, 45... Cutting plate, 50... Flexible electronic device, 53, 55... Washing part, 61, 63, 65, 85... Adhesive layer, 62, 66, 86... non-adhesive part 64, 84... support 91, 92, 93... nip rolls 94, 95... electrode material application part 100, 200... printing apparatus 121... lower electrode printing surface 122... Upper electrode printing surface 140 Drying unit 150 Supply table 160, 180 Transport cylinder 170 Nip roll 190 Discharge table 1A to 1G Grasping means

Claims (14)

an adhesive layer for fixing the printing substrate;
and a non-adhesive portion,
The adhesive layer is provided on the outer periphery of the non-adhesive portion, and the non-adhesive portion protrudes outward from the adhesive layer in the thickness direction of the adhesive layer and the non-adhesive portion. cage,
The fixing member, wherein the distance between the surface of the non-adhesive portion and the surface of the adhesive layer is 10 μm to 500 μm in the thickness direction of the adhesive layer and the non-adhesive portion. The fixing member according to claim 1, wherein the non-adhesive portion is arranged on the adhesive layer, and the adhesive layer is exposed at the outer peripheral portion of the non-adhesive portion. The ratio of the peel force after heat treatment in which the adhesive contained in the adhesive layer is attached to the printing substrate at 180 ° C. for 60 minutes and the peel force before heating (heat treatment 3. The fixing member according to claim 1 or 2, wherein the post-peeling force/peeling force before heating) is 0.5 to 5.0. further comprising a support;
The adhesive layer and the non-adhesive portion are provided on one surface side of the support,
The fixing member according to any one of claims 1 to 3, further comprising an adhesive layer on the other side of the support. 5. The fixing member according to claim 4, wherein the support has a thickness of 25 μm to 250 μm. The fixing member according to any one of claims 1 to 5, wherein the non-adhesive portion has a dimensional change rate of 1% or less when heated at 180°C for 30 minutes. In the thickness direction of the adhesive layer and the non-adhesive portion, the ratio of the width of the adhesive layer to the distance between the surface of the non-adhesive portion and the surface of the adhesive layer (width of adhesive layer/distance) is , 10 or more, the fixing member according to any one of claims 1 to 6 . A step of attaching the printing base material to the fixing member according to any one of claims 1 to 7 and fixing the printing base material to the fixing member;
a step of printing a conductor pattern on the surface of the printing substrate fixed to the fixing member;
heating the printing substrate on which the conductor pattern is printed;
A method for manufacturing a flexible electronic device, comprising a step of peeling off the printed base material on which the conductive pattern is printed from the fixing member. 9. The method of manufacturing a flexible electronic device according to claim 8 , wherein the surface of the fixing member opposite to the side to be bonded to the printing substrate is attached to at least a part of the surface of the impression cylinder. 9. The method for manufacturing a flexible electronic device according to claim 8 , wherein the surface of the fixing member opposite to the side to be bonded to the printed base material is attached to a carrier sheet. A laminate used for manufacturing a flexible electronic device, comprising a printed substrate, a fixing member according to any one of claims 1 to 7 , and a carrier sheet, which are laminated in this order. an impression cylinder;
The fixing member according to any one of claims 1 to 7, wherein the surface opposite to the side to be bonded to the printing base material is attached to at least a part of the surface of the impression cylinder;
a printing unit that prints a conductor pattern on the printing substrate that is fixed by being attached to the fixing member;
a heating unit that heats the printing substrate on which the conductor pattern is printed;
a printing device. The impression cylinder comprises a first impression cylinder, a second impression cylinder and a third impression cylinder,
The printing unit includes a first printing unit that faces the first impression cylinder and prints a lower electrode on the printing substrate, and a printing substrate that faces the second impression cylinder and has the lower electrode printed thereon. A second printing unit that prints an insulating layer on a material, and a third printing unit that faces the third impression cylinder and prints an upper electrode on the printing base material on which the insulating layer is printed,
The fixing member to which the printing substrate is fixed includes at least part of the surface of the first impression cylinder, at least part of the surface of the second impression cylinder, and at least part of the surface of the third impression cylinder. 13. The printing device according to claim 12 , attached to the . The printing unit includes a first printing unit that faces the impression cylinder and prints a lower electrode on the printing substrate, and a first printing unit that faces the impression cylinder and prints an insulating layer on the printing substrate on which the lower electrode is printed. 13. The printing apparatus according to claim 12 , further comprising: a second printing unit for printing an upper electrode on the printing base material on which the insulating layer is printed, the third printing unit facing the impression cylinder.

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