JP7229558B2 - Nozzle for bonding electronic parts - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding nozzle that ejects an adhesive when bonding an electronic component to a mounting board or the like.

A large number of various electronic components are used in equipment and machines such as electronic equipment, precision equipment, transportation equipment, and machine tools. Alternatively, in addition to the parts to be assembled, a wide variety of parts are required that are attached and combined as needed. Such electronic components are mounted on mounting substrates mounted on electronic equipment or precision equipment.

Here, the electronic parts mounted on the mounting substrate are various, such as semiconductor elements, LSIs, optical elements, discrete electronic parts and electronic elements. At present, these electronic components are extremely miniaturized and have high performance. In particular, many sensor elements are mounted in recent electronic devices. This applies not only to electronic equipment, but also to transportation equipment such as automobiles, and machine tools used in factories and the like. A variety of modern machines and devices implement many such sensor elements. This is because many sensor elements are required in many parts in order to realize automatic driving and remote control.

In addition to sensor elements, these machines and instruments also have many electronic components to perform electronic operations. Many of these electronic components are mounted on mounting boards mounted on machines and equipment. An electronic component is mounted on a mounting substrate using a conductive paste such as solder or various adhesives. At this time, it is necessary to apply a conductive paste or adhesive for mounting (hereinafter collectively referred to as “adhesive” as necessary) to the mounting board.

There are various ways to apply such adhesives. Several techniques have been proposed for applying an adhesive required for mounting such electronic components (see, for example, Patent Documents 1, 2, and 3).

JP 2018-101815 A JP 2019-58886 A JP-A-2005-334733

Patent Document 1 discloses that a cleaning member 22 is picked up by a mounting head 9 from a cleaning member feeder mounted together with other parts feeders on a feeder base of a component supply unit, and held at a position where the cleaning member 22 is in contact with the discharge nozzle 46 of the dispenser unit 6. , and causes the mounting head 9 to execute a predetermined pattern of cleaning operation of horizontally reciprocating the cleaning member 22 to clean the discharge nozzle 46 . Thus, an electronic component mounting apparatus is disclosed that can efficiently and appropriately perform maintenance and cleaning work required for stabilizing the application of the paste P by the dispenser unit 6 .

Patent Literature 1 discloses a technique that enables mounting of electronic components by ejecting an adhesive using a dispenser.

However, in recent electronic equipment and transportation equipment, a large number of electronic components are mounted. In addition, the size of electronic parts has become extremely small and minute, and the amount of adhesive to be discharged onto a mounting substrate is extremely small. In addition, it is necessary to accurately dispense the adhesive to a very pinpoint narrow area. Severe accuracy is now required for the area to be ejected, the amount of ejection, and the spacing between adjacent ejection areas.

Patent Document 1 has a problem that it does not have the ability to cope with such severe accuracy.

Patent Document 2 discloses a nozzle unit (100) comprising a nozzle (10) made of a ceramic material that discharges a liquid (L) from a tip (10a), and a holding part (20) that holds the nozzle in a fitting dimension. and a fixing part (30) for fixing the tip of the nozzle so that it protrudes using the taper part (31) of the nozzle, and fixing the nozzle by screwing the holding part and the fixing part. Disclosed is a nozzle unit characterized by:

In Patent Document 3, a nozzle hole 1 has a tapered discharge hole portion 4 in which the cross-sectional area of the hole gradually decreases toward an opening portion 3 that opens in a nozzle tip surface 2 in the direction perpendicular to the axis. The distal end of the tapered discharge hole portion 4 continues to the opening portion 3 without intervening a portion. Further, a nozzle is disclosed in which the inclination angle .theta.

Patent Documents 2 and 3 have the same problem as Patent Document 2.

The adhesive dispenser has a nozzle for ejecting adhesive at its tip. An adhesive is delivered to this nozzle, and the adhesive is ejected from the tip of the nozzle by pressure. By discharging the adhesive, the adhesive can be placed on the electronic substrate where the electronic component is to be adhered.

As described above, at present, there is a demand for high-speed mounting of a large number of small electronic components. A large number of electronic components such as sensors need to be mounted on one electronic board, or a plurality of electronic components need to be mounted at various locations on the electronic board.

In addition, it is necessary to mount (adhere) electronic components very quickly and reliably in an automatic mounting apparatus. Therefore, a very large pressure is applied to the nozzle for discharging the adhesive. At this time, if the surface of the hole through which the adhesive is discharged inside the nozzle has large unevenness or roughness, the adhesive cannot be discharged accurately. Because the adhesive is ejected from the nozzle hole by applying a large pressure, the adhesive under this pressure gets stuck on the unevenness and roughness of the hole, which adversely affects the accuracy of the ejection direction. is.

In particular, since it is required to continuously discharge a small amount of adhesive to a finer position, a high pressure is continuously applied to the nozzle. When the adhesive is discharged under this pressure, there is a problem that the unevenness inside the discharge hole becomes an obstacle, and the discharge direction of the adhesive is shifted, and the discharge becomes insufficient due to clogging. .

In addition, the lack of accuracy in ejection results in a lack of durability of the nozzle, which may lead to a shortened service life and an increase in replacement and maintenance costs.

These lead to problems such as a decrease in yield in mounting based on ejection of the adhesive from the nozzle. Inadequate ejection of adhesive to the correct position makes it impossible to mount electronic components where they should be mounted, and adhesive adheres to other electronic components, making it unusable as an electronic board. Because sometimes it happens.

As a result, the mounting capability of the mounting apparatus may be reduced.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an electronic component bonding nozzle capable of ejecting an optimum amount of adhesive to a narrow area with high accuracy.

In order to solve the above problems, the electronic component bonding nozzle of the present invention is an electronic component bonding nozzle that discharges an adhesive necessary for mounting an electronic component,
a main body;
an internal space provided inside the main body and supplied with the adhesive;
a discharge through hole provided from the internal space toward the tip of the main body,
The main body is formed of a cemented carbide containing tungsten as a main raw material,
The discharge through-hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet from which the adhesive from the internal space is discharged to the outside,
The diameter of the ejection outlet is 50 μm or less,
The adhesive supplied to the internal space receives a discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet,
The inner surface of the discharge through-hole is subjected to a surface treatment to reduce friction,
the electronic component is of a small size corresponding to the diameter of the ejection outlet, and the ejection outlet dispenses a minute amount and diameter of adhesive corresponding to the small electronic component;
Regarding the surface roughness of the discharge through-hole, the arithmetic mean height is 0.09 μm or less based on the standard of “JIS B 0601:2001”.

The electronic component bonding nozzle of the present invention can discharge an adhesive with high precision into a narrow area corresponding to a very small electronic component. At this time, the adhesive can be discharged at the optimum level in terms of the position, area, and amount to be discharged.

Moreover, since it has high durability, it can be used repeatedly. As a result, the cost of mounting electronic components can be reduced.

1 is a photograph of an electronic component bonding nozzle (hereinafter abbreviated as "nozzle" as necessary) according to an embodiment of the present invention. 1 is a cross-sectional view of an electronic component bonding nozzle according to an embodiment of the present invention; FIG. 1 is a side view of a long type electronic component bonding nozzle according to an embodiment of the present invention; FIG. 1 is a cross-sectional view of an electronic component bonding nozzle according to an embodiment of the present invention; FIG. 1 is a cross-sectional view of an electronic component bonding nozzle according to an embodiment of the present invention; FIG. 4 is a graph showing the results of measuring the surface shape of the inner surface of the ejection through hole before surface treatment. 7 is a table showing various index results of surface roughness calculated based on the measurement results of FIG. 6. FIG. 5 is a graph showing the results of measuring the surface shape of the inner surface of the discharge through-hole after the surface treatment of the created nozzle 1. FIG. 9 shows various index results of surface roughness calculated based on the measurement results of FIG. 8. FIG. FIG. 10 is an explanatory diagram showing the results of an ejection experiment using nozzles from other companies that have not been subjected to surface treatment. FIG. 4 is an explanatory diagram showing a discharge experiment using the nozzle of the present invention; 1 is a side view of an electronic component bonding dispenser according to an embodiment of the present invention; FIG. 1 is a side view of an electronic component bonding dispenser according to an embodiment of the present invention; FIG.

An electronic component bonding nozzle according to a first aspect of the present invention is an electronic component bonding nozzle that discharges an adhesive necessary for mounting an electronic component,
a main body;
an internal space provided inside the main body and supplied with the adhesive;
a discharge through hole provided from the internal space toward the tip of the main body,
The discharge through-hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet from which the adhesive from the internal space is discharged to the outside,
The diameter of the ejection outlet is 50 μm or less,
The adhesive supplied to the internal space receives a discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet,
The inner surface of the discharge through-hole is surface-treated to reduce friction.

With this configuration, strong resistance and friction during ejection are reduced, and ejection becomes smooth. As a result of the smoothness, the accuracy of hitting the ejection destination is improved.

In the electronic component bonding nozzle according to the second aspect of the present invention, in addition to the first aspect, the surface treatment includes polishing the inner surface of the ejection through hole.

This configuration can reduce the surface roughness.

In the electronic component bonding nozzle according to the third aspect of the present invention, in addition to the second aspect, the polishing process includes electric discharge machining.

With this configuration, the polishing process can be performed efficiently.

In the electronic component bonding nozzle according to the fourth aspect of the present invention, in addition to any one of the first to third aspects, the surface roughness of the ejection through hole satisfies the standard of "JIS B 0601:2001" , the maximum height is 0.8 μm or less.

With this configuration, the surface roughness is sufficiently low, and the smoothness of the ejection and the accuracy of the ejection are enhanced.

In the electronic component bonding nozzle according to the fifth aspect of the present invention, in addition to any one of the first to fourth aspects, the surface roughness of the ejection through hole satisfies the standard of "JIS B 0601:2001" Based on, the arithmetic mean height is 0.09 μm or less.

With this configuration, the surface roughness is sufficiently low, and the smoothness of the ejection and the accuracy of the ejection are enhanced.

In the electronic component bonding nozzle according to the sixth aspect of the present invention, in addition to any one of the first to fifth aspects, the main body is made of cemented carbide.

With this configuration, high durability can be achieved. In addition, the accuracy of the ejection axis of the ejection through hole is improved, and the amount of adhesive to be ejected and the ejection diameter can be optimized.

In the electronic component bonding nozzle according to the seventh aspect of the present invention, in addition to any one of the first to sixth aspects, the main body is formed of a sintered body of metal powder.

This configuration facilitates formation of the main body. Also, the forming accuracy can be improved.

In the electronic component bonding nozzle according to the eighth aspect of the present invention, in addition to any one of the first to seventh aspects, in the ejection through hole, the diameter of the ejection outlet is larger than the diameter of the injection inlet. small.

With this configuration, the adhesive to be discharged can be discharged at a more pinpointed position in an appropriate amount.

In the electronic component bonding nozzle according to the ninth invention of the present invention, in addition to the eighth invention, the diameter of the injection inlet is 10% or more larger than the diameter of the discharge outlet.

With this configuration, the adhesive can be discharged to a finer portion.

In the electronic component bonding nozzle according to the tenth aspect of the present invention, in addition to any one of the first to ninth aspects, the ejection through hole has an inner diameter that gradually decreases from the injection inlet to the ejection outlet. To go.

With this configuration, the adhesive can be reliably discharged to an optimal minute position.

In the electronic component bonding nozzle according to the eleventh aspect of the present invention, in addition to any one of the first to tenth aspects, the discharge outlet has a diameter of 40 μm or less.

With this configuration, a very fine amount of adhesive can be discharged.

In the electronic component bonding nozzle according to the twelfth aspect of the present invention, in addition to any one of the first to tenth aspects, the discharge outlet has a diameter of 30 μm or less.

With this configuration, a very fine amount of adhesive can be discharged.

In the electronic component bonding nozzle according to the thirteenth invention of the present invention, in addition to any one of the first to twelfth inventions, the ejection through hole is formed by machining.

With this configuration, a discharge through-hole can be formed with high accuracy.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment)

An embodiment will be described.

(overall overview)
FIG. 1 is a photograph of an electronic component bonding nozzle (hereinafter abbreviated as “nozzle” as necessary) according to an embodiment of the present invention. FIG. 1 shows a state in which the electronic component bonding nozzle 1 is viewed obliquely from above. That is, the state seen from the direction of the internal space 3 provided inside the body portion 2 is shown.

FIG. 2 is a cross-sectional view of an electronic component bonding nozzle according to an embodiment of the present invention. The inside of the electronic component bonding nozzle 1, such as a discharge through-hole 4, which will be described later, is shown in a see-through state.

The electronic component bonding nozzle 1 includes a body portion 2 , an internal space 3 , and a discharge through hole 4 . The body portion 2 forms the outer shape of the electronic component bonding nozzle 1 . By attaching other elements to this external shape, the main body 2 can constitute the electronic component bonding nozzle 1 .

The internal space 3 is a space provided inside the body portion 2 . The electronic component bonding nozzle 1 is supplied with an adhesive and discharges it to achieve bonding (mounting) of the electronic component to the electronic substrate. This internal space 3 is supplied with adhesive. That is, the adhesive is supplied (filled) into the internal space 3 . The internal space 3 is a space for receiving adhesive.

The discharge through-hole 4 is a through-hole provided from the internal space 3 toward the tip of the body portion 2 . The discharge through hole 4 discharges the adhesive from the internal space 3 . At this time, the discharge through-hole 4 has an injection inlet 41 into which the adhesive from the internal space 3 is injected and a discharge outlet 42 through which the adhesive is discharged to the outside.

The diameter of the discharge outlet 42 is 50 μm or less.

Here, the inner surface of the discharge through-hole 4 is subjected to surface treatment to reduce the frictional force. This surface treatment reduces, for example, internal surface irregularities and surface roughness. Reducing the surface roughness also leads to a reduction in the frictional force and the resistance to ejection of the adhesive.

In this way, when the surface treatment for reducing the frictional force (the surface treatment for reducing unevenness and surface roughness) is applied, the adhesive that is ejected under the ejection pressure can be ejected smoothly. Receiving resistance or repulsion during ejection is reduced, and the adhesive is accurately ejected along the vector direction of the ejection pressure and the ejection through hole 4 . That is, the electronic component bonding nozzle 1 (that is, the electronic component bonding dispenser provided with this) can accurately discharge the adhesive to the target position.

This is because the amount of frictional force, resistance force, repulsive force, etc. received during ejection is reduced, and ejection in a direction deviating from the vector direction of the ejection pressure and the ejection through hole 4 is less likely to occur. On the other hand, if the surface is not treated to reduce the frictional force, unevenness and surface roughness may cause the ejection direction to deviate, and the ink may not be ejected to the intended position.

Since the electronic component bonding nozzle 1 of the present invention is subjected to a surface treatment to reduce the frictional force on the inner surface of the ejection through hole 4, the ejection direction is deviated. can be resolved.

Of course, this can prevent mounting defects and the like, leading to an improvement in yield in mounting electronic components on electronic substrates using the electronic component bonding nozzle 1 . That is, it is possible to enhance the mounting capability of the mounting apparatus.

Further, the surface treatment of the inner surface of the discharge through hole 4 facilitates the discharge of the adhesive. The inside of the ejection through hole 4 is less likely to be clogged with the adhesive, and the adhesive can be reliably ejected in an optimum amount and ejection diameter. In addition, clogging is less likely to occur, which is effective in extending the durability and life of the electronic component bonding nozzle 1 .

As will be described later, the fact that the main body 2 is made of a cemented carbide and that the surface is treated is effective in increasing the durability and extending the life of the electronic component bonding nozzle 1 . As a result, the durability of the nozzle 1 and the electronic component bonding dispenser provided therewith is improved, and replacement costs and maintenance costs are reduced. In addition, it is possible to improve work efficiency in mounting by a mounting apparatus, and reduce work costs by reducing maintenance time.

Surface treatment for reducing friction may be achieved by various means such as coating treatment and polishing treatment (polishing treatment). The polishing treatment may be polishing treatment by electrical discharge machining. The surface treatment reduces the surface roughness of the inner surface of the discharge through hole 4 . This reduction gives rise to the benefits described above.

The electronic component bonding nozzle 1 is attached to an electronic component bonding dispenser. The electronic component bonding dispenser actually supplies the adhesive and discharges the adhesive through the nozzle 1 to the adhesive application position of the electronic substrate. This electronic component adhesive dispenser is incorporated in a mounting apparatus for mounting electronic components on an electronic substrate.

With such a configuration, the adhesive is supplied to the internal space 3 . The electronic component bonding dispenser supplies adhesive to the internal space 3 of the nozzle 1 . Also, a discharge pressure for discharging the adhesive is applied in accordance with the supply of the adhesive. The adhesive that has received this ejection pressure is ejected from the internal space 3 to the outside through the ejection through hole 4 . At this time, the adhesive in the internal space 3 is injected into the injection port 41 and passes through the discharge through hole 4 . The adhesive that has passed through is discharged from the discharge outlet 42 to the outside.

Here, there is a mounting position for the electronic component set on the electronic board, and the discharge outlet 42 discharges the adhesive to this mounting position. After that, the electronic component is placed on the adhesive to complete the mounting of the electronic component. At this time, the adhesive may be a so-called resin or polymer material adhesive, or may be a conductive metal paste. These may be determined according to the specifications for mounting the electronic component on the electronic board.

The adhesive discharged through the discharge through hole 4 is finally discharged from the discharge outlet 42 . At this time, as described above, the diameter of the discharge outlet 42 is 50 μm or less. This allows the adhesive to be dispensed in very fine volumes and dispensing diameters. In recent years, electronic components have become very small. Not only electronic parts such as semiconductor integrated circuits, but also sensors with various functions are becoming smaller. In particular, automobiles and transportation equipment tend to be equipped with a large number of various sensors for purposes such as autonomous driving.

In such situations, fine volume and dispensing diameter adhesive dispensing is required.

By setting the diameter of the ejection outlet 42 to be 50 μm or less, it is possible to dispense the adhesive in a required minute amount and ejection diameter. By using the electronic component bonding nozzle 1 of the present invention, it is possible to realize mounting of electronic components that are miniaturized.

Further, as described above, the inner surface of the ejection through hole 4 is subjected to a surface treatment to reduce the frictional force. This surface treatment improves the accuracy of the ejection direction and the accuracy of the ejection amount of the adhesive to be ejected. In addition, the durability is also enhanced, which reduces mounting costs and maintenance costs.

Next, details and variations of each part will be described.

(main body)
The body portion 2 is preferably made of cemented carbide. For example, a cemented carbide made mainly of tungsten is used. It may be an alloy in which tungsten carbide is bound with a binder, or an alloy in which titanium carbide or the like is mixed.

Since the main body 2 is made of cemented carbide, the strength and durability of the electronic component bonding nozzle 1 are enhanced. The electronic component bonding nozzle 1 is repeatedly used a great number of times to bond a large number of electronic components. Also, the operation interval is very short. This adds a lot of load. In addition to supplying and dispensing the adhesive, the dispensing pressure is also applied one after another at short intervals.

Since the main body 2 is made of cemented carbide, it can withstand such a large load. Its high durability allows it to withstand heavy use.

In particular, the strength and durability of the nozzle 1 are improved by being made of cemented carbide. Due to this improvement, the nozzle 1 is less likely to be damaged or damaged even when the adhesive is discharged continuously and many times. Therefore, maintenance costs can be reduced. Of course, there is also the merit of shortening the necessary period until replacement.

In addition, since the nozzle 1 has high durability, it is possible to maintain the discharge of the adhesive with high accuracy (especially the discharge of the adhesive to a fine area). Therefore, the adhesive can be discharged accurately for a certain period of time, and the efficiency of mounting electronic components on the electronic substrate can be improved and continued.

As described above, there is a need to continuously mount extremely small electronic components at high speed in a mounting apparatus. Mounting positions of the components to be mounted on the electronic substrate are various, and it is required to improve the mounting speed of the mounting apparatus.

In order to meet such demands, it is required to discharge a very fine amount of adhesive to a precise position. Furthermore, it is also required to eject continuously and at high-speed time intervals. As a result, it is necessary to make the diameter of the discharge outlet 42 as fine as 50 μm or less. When the diameter of the discharge outlet 42 becomes minute, a high discharge pressure is required, and the body portion 2 of the nozzle 1 is subjected to a corresponding load. The same is true for high-speed continuous ejection.

Since the main body 2 of the nozzle 1 is made of cemented carbide, it is possible to cope with these problems. That is, the durability against high loads increases, and it becomes easier to continue high-precision ejection for a longer period of time. As a result, the maintenance cost can be reduced and the yield of mounting itself can be improved.

In the prior art, there is no disclosure or suggestion about the strength and durability of the nozzle, and there is no disclosure of how to solve the problem. On the other hand, since the nozzle 1 is made of cemented carbide, the electronic component bonding nozzle 100 of the present invention can cope with technical problems not disclosed in the prior art as described above.

The fact that the main body portion 2 is made of cemented carbide enhances the smoothness of the ejection, together with the surface treatment of the inner surface of the ejection through hole 4 described above. It also increases durability. As a result, the maintenance cost of the nozzle 1 and the electronic component bonding dispenser provided therewith can be reduced.

Further, as described above, the electronic component bonding nozzle 1 is required to discharge the adhesive in a very small amount and in a very small discharge diameter. Therefore, high precision is required for the inner diameter of the discharge through hole 4 and the discharge shaft. The discharge through-hole 4 is formed by drilling a predetermined position of the main body 2, by laminating or by molding.

The discharge through-hole 4 formed in this way can be easily formed with high accuracy because the main body 2 is made of cemented carbide. In addition, since it is made of cemented carbide, there is an advantage that the shape and the discharge shaft are not easily deformed even after being formed. In particular, there is a concern that the discharge through-hole 4 may be deformed under conditions of repeated use under a high load. Even in such a case, if the body portion 2 is made of cemented carbide, there is an advantage that the risk of such deformation can be greatly reduced.

It is also preferable that the main body 2 is made of a sintered body of metal powder. At this time, the powder of the cemented carbide material such as tungsten carbide may be mixed with other powder materials and then sintered to form a sintered body. Of course, other metal materials may be used.

By forming the body portion 2 from such a sintered body of metal powder, the body portion 2 can be manufactured with high precision. Further, the discharge through-holes 4 may be provided when forming the sintered body, or the discharge through-holes 4 may be formed by boring or the like after the sintered body is formed. In either case, forming the main body 2 from a sintered body facilitates formation.

In addition, since it is a sintered body, the strength and durability of the main body 2 are increased, and the durability against repeated use with high load as described above is enhanced. In addition, since it is a sintered body, the body portion 2 can be formed in an appropriate shape. For example, as shown in FIG. 3, it may be necessary to manufacture an electronic component bonding nozzle 1 having an elongated tip. In such a case, by using a sintered body, it is possible to form the shape with high accuracy. Of course, it is possible to form the body portion 2 having such a shape even if it is not a sintered body.

FIG. 3 is a side view of a long type electronic component bonding nozzle according to an embodiment of the present invention. The right side of FIG. 3 shows a side view of the long type electronic component bonding nozzle 1 . The left side of FIG. 3 shows a cross-sectional view showing the inside. As can be seen from the left and right of FIG. 3, the long type electronic component bonding nozzle 1 also
An internal space 3 and a discharge through hole 4 are provided, and the adhesive can be discharged.

With such a long-type electronic component bonding nozzle 1, the adhesive can be discharged more accurately and with high accuracy. In addition, when higher density mounting is required, the extension of the distal end portion allows the adhesive to be discharged in response to high density mounting.

(internal space)
The internal space 3 is a space provided inside the body portion 2 . The internal space 3 may be formed at the same time when the body portion 2 is formed. Alternatively, the internal space 3 may be formed by cutting the inside of the body portion 2 .

The electronic component bonding nozzle 1 is used in combination with a device that supplies an adhesive and applies a discharge pressure. When combined with this device, adhesive is supplied to this interior space 3 from the device. In addition, the device applies a discharge pressure to the internal space 3 in accordance with this supply. Upon receiving this application, the internal space 3 discharges the supplied adhesive through the discharge through hole 4 communicating with the internal space 3 .

At this time, the discharge through-hole 4 communicating with the internal space 3 connects the internal space 3 and the injection inlet 41 . The injection inlet 41 is connected to a discharge outlet 42 through the discharge through hole 4 .

The internal space 3 may have a volume matching the size of the body portion 2 . Moreover, it is only necessary to have a volume corresponding to the amount of adhesive to be discharged and the number of discharge times. Alternatively, it may be determined in relation to the device that applies the ejection pressure.

It is also preferable that the inner surface of the inner space 3 be surface-treated to reduce the frictional force, as with the discharge through-hole 4 . The surface treatment method and level are the same as the surface treatment of the inner surface of the discharge through hole 4 . By reducing surface roughness, friction and resistance are reduced. Thereby, after the adhesive is supplied, the movement of the adhesive from the internal section 3 to the discharge through-hole 4 can be made smoother.

(Discharge through hole)
The discharge through hole 4 actually discharges the adhesive that enters under pressure from the internal space. The discharge destination is a mounting portion of an electronic substrate on which electronic components are mounted. The discharge through-hole 4 includes an injection inlet 41 into which the adhesive from the internal space 4 is injected and a discharge outlet 42 through which the adhesive is discharged.

The adhesive supplied to the internal space 3 enters the injection port 41 under the discharge pressure. The adhesive is discharged from the discharge outlet 42 while receiving the discharge pressure. By this discharge, the adhesive is applied in a mountable state.

The surface treatment of the inner surface of the ejection through hole 4 is as described above.

Here, as shown in FIG. 4, it is also preferable that the diameter of the discharge outlet 42 in the discharge through-hole 4 is smaller than the diameter of the injection inlet 41 . FIG. 4 is a cross-sectional view of an electronic component bonding nozzle according to an embodiment of the present invention. It is shown so that the internal structure of the discharge through-hole 4 can be understood.

At this time, as shown in FIG. 5 , the ejection through-hole may be made smaller in stages toward the ejection outlet 42 . FIG. 5 is a cross-sectional view of an electronic component bonding nozzle according to an embodiment of the present invention. In FIG. 5 , the discharge through-hole 4 has a two-stage shape, and the diameter of the discharge outlet 42 is smaller than the diameter of the injection inlet 41 .

Since the diameter of the discharge outlet 42 is smaller than the diameter of the injection inlet 41, the adhesive discharged through the discharge through-hole 4 is easily discharged in a minute amount and in a fine diameter. In particular, it is possible to eject with higher precision when ejecting with a fine ejection diameter. In addition, it is possible to eject more correctly to the ejection site.

Further, the discharge through hole 4 has a structure in which the inner diameter gradually decreases from the injection inlet 41 toward the discharge outlet 42 . With such a structure, the adhesive is more accurately discharged to the position where it should be discharged in the process of moving through the discharge through hole 4 . That is, the droplets are ejected to the intended position.

In addition, since the inner diameter gradually decreases toward the tip, it is possible to dispense a finer amount and a dispense diameter.

Here, it is also preferable that the diameter of the injection inlet 41 is larger than the diameter of the discharge outlet 42 by 10% or more. For example, when the injection port 41 has a diameter of 50 μm, the discharge port 42 has a diameter of 40 μm. Alternatively, when the injection inlet 42 has a diameter of 40 μm, the discharge outlet 42 has a diameter of 30 μm.

Due to such a size difference, the adhesive that moves from the injection inlet 41 to the discharge outlet 42 and is discharged is surely discharged with a fine discharge diameter. In particular, it becomes possible to reliably discharge the adhesive to minute positions. This is because the discharge outlet 42 is smaller than the injection inlet 41 into which the adhesive enters, so that the adhesive is more likely to be discharged to a target position when moving through the discharge through hole 4 .

Here, it is also preferable that the diameter of the discharge outlet 42 is 40 μm or less. In recent years, the miniaturization of electronic components has progressed remarkably, and in order to mount such small electronic components on an electronic substrate, it is preferable that the adhesive be discharged from the discharge outlet 42 with a diameter of 40 μm or less.

Since the diameter of the ejection outlet 42 is 40 μm or less, the adhesive can be ejected to a portion with a very small area.

Furthermore, it is also preferable that the diameter of the discharge outlet 42 is 30 μm or less. Furthermore, it is possible to discharge the adhesive in the optimum amount and to the part required for mounting small electronic parts. Since the diameter of the discharge outlet 42 is 30 μm or less, it is possible to discharge an adhesive suitable for mounting smaller electronic components. Alternatively, it is possible to discharge an adhesive suitable for higher density mounting.

(Variation of discharge through hole)
It is also preferable that the discharge through-hole 4 is formed by machining the body portion 2 . After the body portion 2 is formed, the internal space 3 and the discharge through hole 4 may be formed by machining. By forming the discharge through hole 4 by punching by machining, the discharge through hole 4 can be formed with high accuracy.

Moreover, as described above, it is also preferable that the ejection through-hole 4 tapers toward the ejection outlet 42 . Even in the case of such a shape, it can be easily realized by forming the discharge through hole 4 by machining. Moreover, by forming by machining, the discharge through-hole 4 with high durability can be realized. In addition, very fine diameter discharge through-holes 4 can also be realized.

(Surface treatment of inner surface of discharge through-hole)
As described above, the inner surface of the discharge through-hole 4 is surface-treated. At this time, it is also preferable that the inner surface of the inner space 3 is similarly surface-treated. The advantages of surface treatment are as described above. That is, the frictional force and the resistance force are reduced, the adhesive under the ejection pressure can be ejected smoothly, and the straightness of the adhesive is improved, so that the accuracy of ejection to the target position can be improved.

(surface treatment)
Surface treatment includes polishing. The polishing process can reduce the surface roughness of the inner surface. Also, the polishing treatment may be by electrical discharge machining. Electrical discharge machining produces an effect similar to that of a polishing process. That is, the surface roughness of the inner surface can be reduced.

The surface roughness is caused by irregularities, burrs, etc., which are inevitably generated in the process of molding the nozzle 1 . For example, when the internal space 3 and the discharge through hole 4 are formed by grinding, unevenness, burrs, and the like are generated. Alternatively, a minute protruding portion or the like is also generated on the surface. This results in surface roughness.

The unevenness and burrs can be reduced and the surface roughness can be reduced by polishing or electrical discharge machining. This reduction in surface roughness reduces frictional force and resistance as described above.

(Experimental result)
Here, experimental results of the surface treatment with the nozzle 1 actually manufactured by the inventor will be described. The inventor reduced the surface roughness of the discharge through-hole 4 by performing a polishing process or the like. Here, the inventor measured the surface roughness of the actually manufactured nozzle 1 . As for the surface roughness, the surface shape of the inner surface was measured using "Mitaka Kohki's ultra-precision non-contact three-dimensional measuring device NH-3SP". Based on this measurement, "arithmetic mean roughness" and "maximum height", which are indicators of surface roughness, were measured according to the standard of "JIS B 0601:2001".

Here, "arithmetic mean roughness" based on this standard is defined as follows.

"From the roughness curve, extract only the reference length in the direction of the average line, take the X axis in the direction of the average line of this extracted part, and the Y axis in the direction of the longitudinal magnification, and set the roughness curve to y = f (χ ) and expressed in micrometers (μm).

Similarly, the "maximum height" is defined as follows.

"Only the reference length is extracted from the roughness curve in the direction of the average line, the interval between the peak line and the valley bottom line of this extracted portion is measured in the direction of the longitudinal magnification of the roughness curve, and this value is measured in micrometers (μm )”

(maximum height and arithmetic mean height)

FIG. 6 is a graph showing the results of measuring the surface shape of the inner surface of the discharge through hole before surface treatment. FIG. 7 is a table showing various index results of surface roughness calculated based on the measurement results of FIG. FIG. 8 is a graph showing the results of measuring the surface shape of the inner surface of the discharge through-hole after the surface treatment of the manufactured nozzle 1 . FIG. 9 shows the results of various indexes of surface roughness calculated based on the measurements shown in FIG.

6 and 7 show the results of surface roughness before surface treatment, and FIGS. 8 and 9 show the results of surface roughness after surface treatment.

As can be seen from the results of FIG. 9, the surface roughness of the inner surface of the discharge through hole 4 has a maximum height of 0.8 μm or less based on the standard of “JIS B 0601:2001”.

Further, as can be seen from the results of FIG. 9, the arithmetic mean height of the surface roughness of the inner surface of the discharge through-hole 4 is 0.09 μm or less based on the standard of “JIS B 0601:2001”.

In the results before surface treatment in FIG. 7, the maximum height is 4.48 μm and the arithmetic mean height is 0.69 μm, which are much larger than those after surface treatment. The surface roughness after surface treatment is very small in both maximum height and arithmetic mean height as described above. That is, the surface roughness is lowered. This reduction in surface roughness reduces friction and resistance. As a result, ejection accuracy is improved.

(Results of discharge experiment)
In order to confirm the effect of the surface treatment, the inventor conducted a discharge experiment in which the adhesive was actually discharged. A nozzle 1 was attached to a dispenser for bonding electronic parts, and a discharge experiment was conducted in which the adhesive was discharged. A discharge target paper was installed at the tip of the nozzle 1, the adhesive was actually discharged, and the actual position of the discharge was measured.

10A and 10B are explanatory diagrams showing the results of an ejection experiment using nozzles from other companies that have not undergone surface treatment. FIG. 11 is an explanatory diagram showing a discharge experiment using the nozzle of the present invention.

As is clear from FIG. 10, the other company's nozzles, which are not subjected to surface treatment, have variations in ejection positions, and the ejection is rarely performed at accurate positions. In many dispense experiments, the dispense is in an incorrect location.

On the other hand, as is clear from FIG. 11, the surface-treated nozzle 1 according to the present invention has less variation, unlike that shown in FIG. Almost accurate ejection can be achieved in most cases in the ejection experiment of 40 times or more. Also, the variation is small. It is greatly different from the ejection result of FIG.

As described above, the surface roughness is actually reduced by applying the surface treatment. Experiments have also confirmed that the reduction in surface roughness improves the ejection accuracy.

(Dispenser for bonding electronic parts)
Next, a case where the nozzle 1 is attached to an electronic component bonding dispenser and used for mounting will be described.

(Adhesive container)
As shown in FIGS. 12 and 13, the case where the nozzle 1 is attached to an electronic component bonding dispenser and used for mounting will be described. 12 and 13 are side views of the electronic component bonding dispenser according to the embodiment of the present invention.

The adhesive container 110 constitutes the main body of the electronic component bonding dispenser 100 . In addition, the internal space 111 contains an adhesive. The adhesive container 110 has the electronic component bonding nozzle 1 at its tip, and the internal space 111 of the adhesive container 110 and the internal space 3 of the electronic component bonding nozzle 1 communicate with each other. Due to this communication, the adhesive contained in the internal space 111 moves to the internal space 3 of the electronic component bonding nozzle 1 (supplied to the internal space 3).

Further, the adhesive is supplied from the internal space 111 to the internal space 3 during the vertical movement of the ejector pin 120 . By this supply, the internal space 2 of the electronic component bonding nozzle 1 is filled with the adhesive.

(supply mechanism)

A supply mechanism 115 for supplying adhesive to the adhesive container 110 is further provided. This supply mechanism 115 is shown in FIG. The supply mechanism 115 is, for example, a pipeline connected to the internal space 111, and can supply the adhesive to the internal space 111 from the outside through this pipeline.

By providing the supply mechanism 115 , it is possible to maintain a state in which the adhesive is always accommodated in the internal space 111 of the adhesive container 110 . As a result, it is possible to ensure the long-term continuity of the mounting work for mounting the electronic component on the electronic board.

(ejector pin)
The ejector pin 120 is capable of vertical movement (movement in the direction along which the adhesive is discharged) in response to repeated application and release of pressure from the pressure member 130 . When the push-out pressure is applied by the pressure member 130, the push-out pin 120 is pushed out accordingly. By this extrusion, the tip of the ejector pin 120 enters the internal space 3 of the electronic component bonding nozzle 1, as shown in FIG. Due to this intrusion, a discharge pressure can be applied to the adhesive filled in the internal space 3 .

FIG. 13 shows a state in which the push pin 120 is pushed out. When the pressure member 130 pushes out, the state shown in FIG. 13 is obtained and the adhesive is discharged from the discharge outlet 42.

When the pressure member 130 releases (stops) the pushing pressure, the pushing pin 120 is pulled back. When pulled back, the tip of the push pin 120 is removed from entering the internal space 3 and the internal space 3 is supplied with adhesive from the internal space 111 .

When the pressure member 130 applies the extrusion pressure again, the ejection pin 120 applies the ejection pressure to the adhesive in the internal space 3 . As a result, the adhesive is discharged from the discharge outlet 42 again.

(pressure member)
The pressure member 130 repeatedly applies and releases an extrusion pressure to the ejection pin 120 . In a certain cycle (including not only constant cycles but also irregular cycles), the pressure member 130 repeats the timing of applying the ejection pressure to the ejection pin 120 and the release (release) of the ejection pressure. By this repetition, the ejector pin 120 repeats moving into and out of the internal space 3 . By repeating this movement, the application of ejection pressure to the adhesive in the internal space 3 and the state in which no ejection pressure is applied (the state in which the adhesive is supplied to the internal space 3) can be repeated.

That is, the pressure member 130 can finally repeat the adhesive ejection and non-ejection periods.

Here, the pressure member 130 also preferably includes a piezo element. The piezo element can receive a voltage and repeatedly apply and release the extrusion pressure. As a result, the ejector pin 120 can be repeatedly pushed out and pulled back.

In particular, piezoelectric elements can change their behavior by applying a voltage. Therefore, operation control becomes easy and accurate. This accurate operation allows the adhesive to be discharged accurately at the timing at which it should be discharged. As a result, it is possible to accurately discharge the adhesive from the electronic component bonding dispenser.

Of course, elements other than piezo elements may be used for the pressure member 130 .

It is also preferable to further include a pressure member controller 150 that controls the pressure member 130 . As shown in FIG. 13, a pressure member control 150 is also provided. The pressure member control unit 150 causes the pressure member 130 to apply the pushing pressure based on a predetermined timing.

For example, when the pressure member 130 includes a piezo element, the pressure member control section 150 applies voltage at a predetermined timing. The application of this voltage causes the piezo element to operate, so that the ejecting pin 120 can be applied with an ejecting pressure.

The pressure member control unit 150 switches between application of the pushing pressure by the pressure member 130 at a certain timing (period) and cancellation of application of the pushing pressure by the pressure member 130 at another timing (period). When the pressure member 130 includes a piezo element, the pressure member 130 applies an extrusion pressure during the voltage application period, and the pressure member 130 does not apply the extrusion pressure during the voltage application non-application period.

The pressure member 130 pushes the push pin 120 at the timing of pressure application. During the period when the ejector pin 120 is being ejected, the ejector pin 120 enters the internal space 3 . A recessed ejector pin 120 can apply a dispensing pressure to the adhesive.

The pressure member 130 pulls back the ejector pin 120 at timings other than pressure application. The tip of the ejector pin 120 that has been pulled back is removed from the internal space 3 (there are cases where it is completely removed and there are cases where it is partially removed). While the ejector pin 120 is pulled back, the adhesive is supplied from the inner space 111 of the adhesive container 110 to the inner space 3 of the electronic component bonding nozzle 1 . This repetition realizes an adhesive discharge cycle.

It should be noted that the adhesive is also supplied along with the ejection of the ejector pin 120 .

Even when the electronic component bonding dispenser 100 is provided with the nozzle 1 in this way, the inner surface of the discharge through-hole 4 of the nozzle 1 is surface-treated. This surface treatment increases the discharge accuracy and discharge capacity of the electronic component bonding dispenser 100 .

The electronic component bonding nozzles described in the embodiments above are examples for explaining the gist of the present invention, and include modifications and alterations within the scope of the gist of the present invention.

REFERENCE SIGNS LIST 1 electronic component bonding nozzle 2 body portion 3 internal space 4 discharge through hole 41 injection inlet 42 discharge outlet 100 electronic component bonding dispenser 110 adhesive container 111 internal space 120 ejector pin 130 pressure member 150 pressure member control section

Claims (13)

An electronic component bonding nozzle that ejects an adhesive required for mounting electronic components,
a main body;
an internal space provided inside the main body and supplied with the adhesive;
a discharge through hole provided from the internal space toward the tip of the main body,
The main body is formed of a cemented carbide containing tungsten as a main raw material,
The discharge through-hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet from which the adhesive from the internal space is discharged to the outside,
The diameter of the ejection outlet is 50 μm or less,
The adhesive supplied to the internal space receives a discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet,
The inner surface of the discharge through-hole is subjected to a surface treatment to reduce friction,
the electronic component is of a small size corresponding to the diameter of the ejection outlet, and the ejection outlet dispenses a minute amount and diameter of adhesive corresponding to the small electronic component;
The electronic component bonding nozzle, wherein the surface roughness of the discharge through hole has an arithmetic mean height of 0.09 μm or less based on the standard of “JIS B 0601:2001”. 2. The electronic component bonding nozzle according to claim 1, wherein said surface treatment includes a polishing treatment of the inner surface of said ejection through hole. 3. The electronic component bonding nozzle according to claim 2, wherein said polishing process includes electrical discharge machining. 4. The electronic component bonding nozzle according to any one of claims 1 to 3, wherein the surface roughness of the discharge through-hole has a maximum height of 0.8 μm or less based on the standard of “JIS B 0601:2001”. . 5. The electronic component bonding nozzle according to claim 1 , wherein said main body is made of cemented carbide. 6. The electronic component bonding nozzle according to claim 1 , wherein said main body is formed of a sintered body of metal powder. 7. The nozzle for bonding electronic parts according to claim 1 , wherein the diameter of the outlet of the through-hole for discharge is smaller than the diameter of the injection inlet. 8. The nozzle for bonding electronic parts according to claim 7 , wherein the diameter of said inlet is 10% or more larger than the diameter of said outlet. 9. The electronic component bonding nozzle according to claim 1 , wherein said discharge through-hole has an inner diameter that gradually decreases from said injection inlet to said discharge outlet. 10. The nozzle for bonding electronic parts according to claim 1 , wherein the diameter of said discharge outlet is 40 [mu]m or less. 10. The nozzle for bonding electronic parts according to claim 1 , wherein the diameter of said discharge outlet is 30 [mu]m or less. 12. The electronic component bonding nozzle according to claim 1 , wherein said ejection through hole is formed by machining. An electronic component bonding dispenser that discharges an adhesive required for mounting electronic components,
an adhesive containing container containing an adhesive;
The electronic component bonding nozzle according to any one of claims 1 to 12 , which is provided at the tip of the adhesive container,
an ejector pin that can move up and down inside the adhesive container;
a pressure member that applies a pushing pressure to the push pin, wherein the internal space communicates with the internal space of the adhesive storage container, and the adhesive stored in the adhesive storage container supplied to the inner space,
A dispenser for bonding electronic components, wherein extrusion of the ejector pin produces the discharge pressure.

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