JP7205285B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP7205285B2
JP7205285B2 JP2019029281A JP2019029281A JP7205285B2 JP 7205285 B2 JP7205285 B2 JP 7205285B2 JP 2019029281 A JP2019029281 A JP 2019029281A JP 2019029281 A JP2019029281 A JP 2019029281A JP 7205285 B2 JP7205285 B2 JP 7205285B2
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JP
Japan
Prior art keywords
porous portion
porous
dielectric substrate
ceramic dielectric
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019029281A
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English (en)
Japanese (ja)
Other versions
JP2019165207A (ja
JP2019165207A5 (https=
Inventor
康介 山口
純 白石
郁夫 板倉
大 籾山
修一郎 西願
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of JP2019165207A publication Critical patent/JP2019165207A/ja
Publication of JP2019165207A5 publication Critical patent/JP2019165207A5/ja
Priority to JP2022209900A priority Critical patent/JP7412684B2/ja
Application granted granted Critical
Publication of JP7205285B2 publication Critical patent/JP7205285B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP2019029281A 2018-03-14 2019-02-21 静電チャック Active JP7205285B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022209900A JP7412684B2 (ja) 2018-03-14 2022-12-27 静電チャック

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018047010 2018-03-14
JP2018047010 2018-03-14

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018203734A Division JP6489277B1 (ja) 2018-03-14 2018-10-30 静電チャック

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022209900A Division JP7412684B2 (ja) 2018-03-14 2022-12-27 静電チャック

Publications (3)

Publication Number Publication Date
JP2019165207A JP2019165207A (ja) 2019-09-26
JP2019165207A5 JP2019165207A5 (https=) 2021-12-09
JP7205285B2 true JP7205285B2 (ja) 2023-01-17

Family

ID=65895222

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019029281A Active JP7205285B2 (ja) 2018-03-14 2019-02-21 静電チャック
JP2022209900A Active JP7412684B2 (ja) 2018-03-14 2022-12-27 静電チャック

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022209900A Active JP7412684B2 (ja) 2018-03-14 2022-12-27 静電チャック

Country Status (1)

Country Link
JP (2) JP7205285B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7620578B2 (ja) * 2022-01-07 2025-01-23 日本碍子株式会社 半導体製造装置用部材
CN115959479B (zh) * 2023-02-09 2025-12-12 中国科学院光电技术研究所 一种吸盘气道的设计方法、吸盘和设计装置
JP7551827B1 (ja) 2023-04-21 2024-09-17 日本特殊陶業株式会社 保持装置
JP7588686B1 (ja) 2023-07-04 2024-11-22 日本特殊陶業株式会社 保持装置、保持装置の製造方法、取付体、及び取付体の製造方法
KR20260035984A (ko) * 2023-08-30 2026-03-13 교세라 가부시키가이샤 시료 유지구
WO2025134289A1 (ja) * 2023-12-20 2025-06-26 日本碍子株式会社 半導体製造装置用部材
JP7748570B1 (ja) * 2024-03-08 2025-10-02 日本碍子株式会社 半導体製造装置用部材

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253144A (ja) 2005-07-21 2007-10-04 Ibiden Co Ltd ハニカム構造体及び排ガス浄化装置
JP2017157726A (ja) 2016-03-03 2017-09-07 日本特殊陶業株式会社 保持装置および保持装置の製造方法
JP2017218352A (ja) 2016-06-09 2017-12-14 新光電気工業株式会社 焼結体及びその製造方法と静電チャック
WO2017213714A1 (en) 2016-06-07 2017-12-14 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045809A (ja) * 2001-07-31 2003-02-14 Toshiba Ceramics Co Ltd シャワープレート
JP5449750B2 (ja) * 2008-11-19 2014-03-19 株式会社日本セラテック 静電チャックおよびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253144A (ja) 2005-07-21 2007-10-04 Ibiden Co Ltd ハニカム構造体及び排ガス浄化装置
JP2017157726A (ja) 2016-03-03 2017-09-07 日本特殊陶業株式会社 保持装置および保持装置の製造方法
WO2017213714A1 (en) 2016-06-07 2017-12-14 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
JP2017218352A (ja) 2016-06-09 2017-12-14 新光電気工業株式会社 焼結体及びその製造方法と静電チャック

Also Published As

Publication number Publication date
JP2023040112A (ja) 2023-03-22
JP7412684B2 (ja) 2024-01-15
JP2019165207A (ja) 2019-09-26

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