JP7205167B2 - Tokens and their manufacturing method - Google Patents

Description

The present invention relates to a contactless medium (also called a token (money in lieu of money)) having an electronic payment function. In particular, it relates to tokens that can be attached to and detached from various housings such as wristbands, figures, key holders, etc., and prevents children from swallowing them by mistake.

Tokens that can be electronically settled have been used in forms that can be attached to and detached from housings such as wristbands, figures, and key chains.

Such tokens have been taken out of the housing for some reason, and children have accidentally swallowed them.

As prior art similar to such technology, there is a food packaging container coated with a bitter emetic agent having a pest repellent function on the outer surface (Patent Document 1), and an emetic agent on the surface of the housing or printed characters and a circuit board on which a semiconductor chip is mounted are enclosed in a closed space formed by a cover portion on the back side of the circuit board and a cover portion on the front side of the circuit board. A memory card having a bittering agent on the front and back surfaces of the memory card (Patent Document 3) can be mentioned.

All of these techniques have an emetogenic bitter agent on at least the surface of the article, so that when an infant or the like puts it in their mouth, they will feel the bitter taste and spit it out, thereby preventing accidental ingestion. However, there is a problem that, for example, simply gripping these articles with the fingertips causes the bittering agent or the emetic to adhere to the fingertips.

JP-A-2002-255187 JP-A-2006-3955 JP 2007-293402 A

In order to solve the above problems, the present invention exposes only a specific portion of the emetogenic bittering agent, so that the bittering agent does not adhere to the fingertips when the fingertips are grasped, but the bittering agent does not adhere to the fingertips when put in the mouth. The challenge is to provide tokens that demonstrate their functions.

As a means for solving the above problems, the invention according to claim 1 of the present invention provides a substrate module having at least an antenna that enables wireless communication between an IC chip and an external device on a material sheet. In the token sandwiched by the lower cover for the board module and the upper cover for the board module,
The substrate module upper cover contains an emetogenic bittering agent,
A white solid print layer and at least one pattern print layer are provided in this order on the board module upper cover,
The pattern printed layer is provided with a pattern printed layer removal portion in which the underlying substrate module upper cover is exposed by partially removing the pattern printed layer and the white solid printed layer. is a token.

According to a second aspect of the present invention, there is provided a housing that includes the token according to the first aspect.

According to a third aspect of the invention, there is provided the token manufacturing method according to the first aspect, comprising the steps of: forming a substrate module lower cover; and incorporating the substrate module into the manufactured substrate module lower cover. forming the substrate module upper cover on the substrate module; forming the white solid print layer on the substrate module upper cover; and forming the pattern on the white solid print layer. a step of forming a printed layer; and partially removing the pattern printed layer and the solid white printed layer in the pattern printed layer, thereby exposing the surface of the substrate module upper cover which is the base of the solid white printed layer. A method of manufacturing a token characterized by comprising the steps of:

According to the token of the present invention, an emetogenic bittering agent is contained on one side of the token, and a white solid print layer impermeable to the bittering agent and a pattern printed layer are provided in that order on that side . , and the white solid print layer and picture print layer are partially removed, exposing one side of the token containing the underlying bittering agent. Therefore, in the part where the solid white printed layer and the pattern printed layer are partially removed, when put into the mouth, the bittering agent is eluted and emetogenicity is exhibited. However, other parts of the token do not expose the part containing the emetogenic bittering agent, so that the bittering agent does not exert its emetogenicity upon contact. As described above, even if the token of the present invention is gripped with a finger, the bittering agent does not transfer to the finger. is possible.

Further, according to the token manufacturing method of the present invention, the token of the present invention can be manufactured.

FIG. 4 is a schematic cross-sectional view illustrating the layer configuration of the token of the present invention; Explanatory drawing explaining the example of the manufacturing method of the token of this invention.

<Token>
A token of the present invention will be described with reference to FIG.
The token of the present invention includes a substrate module 2 having at least an antenna 9 for wireless communication between an IC chip 7 and an external device on a substrate sheet 8, and a substrate module lower cover 1 and a substrate module upper cover. It is a token 10 sandwiched by 3.

The substrate module upper cover 3 contains an emetogenic bittering agent.

A white solid print layer 4 and at least one pattern print layer 5 are provided in this order on the board module upper cover 3 .

Further, the pattern printed layer 5 is provided with a pattern printed layer removed portion 6 in which the underlying board module upper cover 3 is exposed by partially removing the pattern printed layer 5 and the white solid printed layer 4 . It is characterized by

(base material module)
The base module 2 has an IC chip 7 electrically connected to an antenna 9 formed on a base sheet 8 and mounted thereon. The antenna 9 includes a wiring circuit on which the IC chip 7 is mounted.

The material of the base sheet 8 is not particularly limited, but generally a resin film can be suitably used. As for the type of resin film, when high heat resistance is required, various super engineering plastics and engineering plastics including polyimide resins can be used. For example, for general applications, resins such as polyethylene terephthalate (PET), polyethylene, polypropylene, and polyester can be used.

As the conductive material constituting the antenna 9 and the wiring circuit, a metal such as copper or aluminum having high conductivity can be suitably used. It is also possible to use conductive inks. It may be selected according to the required electric resistance value.

As a method for manufacturing the base material module 2, for example, a material obtained by bonding an electrolytic copper foil to a PET film is used, and after forming an etching mask on the surface of the electrolytic copper foil, an etchant for the copper foil, such as dichloride, is used. Spray etching can be performed using an iron-based etchant. In this manner, the pattern of the antenna 9, the terminal electrodes for mounting the IC chip 7, and the wiring circuit can be simultaneously formed on the PET film. Next, the IC chip is connected to the electrode terminals. Soldering, a conductive adhesive, an anisotropic conductive sheet, or the like can be used as connecting means. As electronic parts to be connected to the terminal electrodes, not only the IC chip 7 but also chip parts such as resistance elements, capacitor elements, inductance elements, and other parts may be mounted.

(Lower cover for base material module)
The base module lower cover 1 can be manufactured using, for example, a resin injection molding technique. Injection molding involves injecting molten resin under pressure into the space formed by combining two molds, filling the space, and solidifying it at a temperature lower than the melting temperature of the resin. is a method of extracting Any means can be used as long as the desired shape of the base module lower cover 1 can be produced, and the method may be selected according to economic restrictions. Examples of such means include molding methods such as injection molding, extrusion molding, blow molding, vacuum molding, and compression molding.
Resins used include polyester resin, acrylonitrile butadiene copolymer synthetic resin (ABS resin), vinyl chloride-vinyl acetate copolymer resin, PET-G (PET reinforced by copolymerization), polypropylene, polycarbonate, triacetate, polyamide, etc. can include, but are not limited to, these resins.

(Upper cover for base material module)
The substrate module upper cover 3 is similar to the substrate module upper cover 1, but differs in that an emetogenic bittering agent is added.

(bittering agent)
As a bittering agent, for example, a taste-imparting substance that gives a bitter taste when put in the mouth can be used. As the emetogenic bittering agent, it is desirable that it is approved for use as a food additive because it is assumed to be put in the mouth. Examples include denatonium benzoate, octaacetylsucrose (octaacetylated sucrose), hops, spice extracts, chrysanthemum extracts, yellowfin tuna extracts, Agaricus blazei extract, litchi extract, versicolor extract, naringi, humulone, and the like. be able to. Furthermore, among compounds such as catechins, alkaloids, xanthines, terpenes, triterpenoids, and terpene glycosides, compounds that can be used as food additives can be mentioned. Furthermore, not only bitterness but also pungent agents can be used. Examples of pungent agents include capsaicin, isothiocyanate, sinigrin, and the like. Acidulants can also be used. Acidulants include citric acid, tartaric acid, fumaric acid, sodium fumarate, malic acid, adipic acid and the like. Astringents can also be used. Examples of astringent agents include catechin and protocyaninic acid.
These bittering agents may be contained in the resin, or may be applied to the surface of the base module upper cover 3 . When the bittering agent is contained in the resin, the ratio of the bittering agent to the total is preferably 0.1 to 5.0% by mass. When applying to the surface, the surface of the base material module upper cover 3 can be applied by a dispenser method, a spraying method, a printing method, or the like. Organic solvents such as aromatic hydrocarbons, ketone compounds, and ester compounds can be suitably used as the solvent for the coating liquid.

(White solid print layer)
As the white solid print layer 4, a general printing ink in which a white inorganic pigment is uniformly dispersed in a vehicle can be used. As the vehicle, a composition comprising oil, resin, solvent, etc., which are commonly used in printing inks, may be used. Oils can be selected from vegetable oils, mineral oils, processed oils, and the like. The resin can be selected from natural resins, natural product derivatives, synthetic resins, and the like. Solvents can be selected from hydrocarbons, alcohols, esters, ketones, glycols and derivatives thereof. The white pigment can be selected from titanium oxide (titanium white), zinc white (zinc white), lithopone, lead white, and the like.

The method for forming the white solid print layer 4 is not particularly limited. For example, various printing methods, coating methods, and the like can be used. Screen printing, various types of offset printing, gravure printing, and the like can be suitably used as the printing method. As a coating method, a roll coater, a gravure coating device, an offset gravure coating device, or the like can be preferably used.

(Pattern printed layer)
As the pattern printed layer 5, it is possible to use color inks that are commonly used for various types of printing. One or more layers may be formed as the pattern printed layer 5 .
For example, in the case of inkjet printing, it is preferable to use a UV curable inkjet ink. The composition of the UV curable ink includes inorganic and organic pigments such as carbon black and disazo yellow, vehicles such as oligomers (also called prepolymers) and polyfunctional acrylic monomers (also called varnish), and photopolymerization initiators. Auxiliaries and the like can be mentioned.

Phthalocyanine copper and disazo yellow are used as pigments, polyvinyl acetate and its copolymer resins are used as resins, ethylene-vinyl acetate copolymer resins, vinyl chloride-vinyl acetate copolymer resins, ketone resins, PVC, acrylic resins, polyester resins, and alkyds. Various resins such as resins, polyamide resins, epoxy resins, and polyurethanes can be used alone, or two or more modified resins that improve adhesion to the photopolymerizable material can be used in combination as a vehicle. From the viewpoint of compatibility and adhesion with the token base material, it is preferable to use an ultraviolet curable inkjet ink. As the resin, an acrylic resin or a copolymer resin thereof is preferable. Moreover, benzophenone, benzyl, dimethylaminobenzophenone, etc. can be mentioned as a photoinitiator. In addition, it is preferable to add hydroquinone or the like as a thermal polymerization inhibitor.
Inkjet inks have been described, but in the case of using a printing method other than inkjet, an ink suitable for each type of printing may be used.

As a method for forming the pattern printed layer 5, printing may be performed using a normal printing technique. For example, the pattern printed layer 5 may be formed using inkjet printing, various types of offset printing, screen printing, pad printing, or the like.

(Picture print layer removal part)
The pattern printed layer 5 and the solid white printed layer 4 are removed from the pattern printed layer removed portion 6 so that the underlying surface of the board module upper cover 3 is exposed. It may be formed by biting into the board module upper cover 3 .

A laser beam can be used to remove the pattern printed layer and the like in forming the pattern printed layer removed portion 6 . For example, a laser marking device can be preferably used.

<Method of manufacturing tokens>
Next, the token manufacturing method of the present invention will be described with reference to FIG.
The token manufacturing method of the present invention comprises a step of forming a substrate module lower cover 1 (FIG. 2(a)), a step of incorporating a substrate module 2 into the fabricated substrate module lower cover 1 (FIG. 2(b)), A step of forming a substrate module upper cover 3 on the substrate module 2 (FIG. 2(c)) and a step of forming a white solid print layer 4 on the substrate module upper cover 3 (FIG. 2(d)). and a step of forming a pattern printed layer 5 on the white solid printed layer 4 (FIG. 2(e)), and removing the pattern printed layer 5 and the white solid printed layer 4 from the pattern printed layer 5. and a step of exposing the surface of the board module upper cover 3, which is the base of the white solid print layer 4 (FIG. 2(f)).

The step of forming the substrate module lower cover 1 (also referred to as primary molding step) (FIG. 2(a)) can be performed using an injection molding apparatus. A space formed by the pair of molds is filled with resin by press-fitting molten resin into the space of the pair of molds having a space corresponding to the shape of the substrate module lower cover 1 to be formed. The board module lower cover 1 can be obtained by opening a pair of molds at a temperature at which the filled resin solidifies and taking out the solidified resin. As the resin used in this step, a resin containing no bittering agent is used.

Next, the board module 2 prepared in advance is fitted into the manufactured board module lower cover 1 (FIG. 2(b)). The board module lower cover 1 is provided with alignment protrusions 11 (see FIG . 2A) at positions corresponding to the alignment holes formed in the board module 2, so that the board module bottom cover 1 can be easily installed. The board module 2 can be set at a fixed position.

Next, the substrate module upper cover 3 is formed using an injection molding machine (FIG. 2(c)). Specifically, after the board module 2 is set on the board module lower cover 1, it is loaded into one of the dedicated molds of the injection molding apparatus with the board module 2 side facing up, and then the other mold is placed. The mold is closed by putting them together, and the space formed inside the mold is filled with the molten resin. When the temperature is below the curing temperature of the resin, the mold is opened and the injection-molded article is taken out. The resin used in this step is a resin containing a bittering agent.
In this manner, an article (token before pattern printing) in which the board module 2 is sandwiched between the board module lower cover 1 and the board module upper cover 3 is completed.

Next, a white solid print layer 4 is formed on the board module upper cover 3 of the token before pattern printing (FIG. 2(d)).

Next, a pattern printed layer 5 is formed on the white solid printed layer 4 (FIG. 2(e)).

Next, by removing the pattern printed layer 5 and the white solid printed layer 4 at a preset position of the pattern printed layer 5 using a laser marker, a pattern printed layer removed portion 6 is formed (FIG. 2(f)). ).

Next, examples of the present invention will be described.

<Example 1>
RC-S111 (manufactured by SONY) was used as a substrate module, in which an IC chip: RC-SA00 was mounted on an FPC (Flexible Printed Circuit Board) using a polyimide substrate (thickness: 0.23 mm).

First, using an ABS resin, an injection molding apparatus was used to produce a lower cover for a substrate module (primary molding). A mold for primary molding used in an injection molding apparatus has a form in which a pair of alignment projections (alignment pins) are formed in correspondence with a pair of alignment holes formed in the substrate module. I assumed. The diameter of the alignment projections formed on the substrate module lower cover was designed to be about 0.1 mm smaller than the diameter of the pair of alignment holes of the substrate module.

Next, the substrate module was loaded into the substrate module lower cover by inserting a pair of alignment projections of the manufactured substrate module bottom cover into the pair of alignment holes of the substrate module.

Next, the article with the board module loaded in the board module lower cover is loaded into one of a pair of molds of the injection molding machine, the other mold is put together to close the mold, and then the molten resin is press-fitted. A substrate module upper cover was formed by injection molding (secondary molding). The resin used for the secondary molding was the same type of resin as the resin used for the primary molding, but a resin containing 1.0% by mass of denatonium benzoate as a bittering agent was used.

Next, a white solid print layer was printed on the entire upper surface of the formed substrate module upper cover by an inkjet printing device and dried so that the dry film thickness was 5 μm. An evaporative drying white ink for plastic printing using titanium white was used. As the resin used for the white ink varnish, the same ABS resin as used for the upper cover for the board module was used.

Next, an inkjet printing device was used to form a pattern printed layer on the white solid printed layer. The inkjet ink used was a UV-curing inkjet ink, and after inkjet printing, the printed pattern layer was formed by curing the ink by UV irradiation.

As the resin constituting the vehicle of the UV curable inkjet ink, the same acrylic resin as used in the white solid print layer was used.

Next, using a laser marker (manufactured by KEYENCE, MD-V/YVO4), the pattern printed layer and the white solid printed layer are removed to expose the substrate module upper cover on which the circular pattern is printed. A layer removal portion was formed. The pattern-printed layer-removed portion had a diameter of 300 μm and was formed uniformly in an XY matrix at a pitch of 500 μm.

The token prepared as described above could be handled without the bittering agent adhering to the finger even if the token was gripped and handled by a person. Moreover, when the token was put into the mouth, a bitter taste was immediately felt. Therefore, even if children put it in their mouth by mistake, they could immediately feel the bitterness of
It was confirmed that accidental ingestion could be prevented.

<Comparative Example 1>
It was the same as Example 1, except that the design print layer removed portion was not formed.

Even when a person gripped and handled this token with their fingers, they could handle it without the bittering agent adhering to their fingers. However, I could not feel any bitterness when I put this token in my mouth.

REFERENCE SIGNS LIST 1: Board module lower cover 2: Board module 3: Board module upper cover 4: White solid print layer 5: Picture print layer 6: Picture print layer removing section 7. IC chip 8 Base material sheet 9 Antenna 10 Token 11 Alignment protrusion

Claims (3)

A token in which a substrate module having at least an antenna enabling wireless communication between an IC chip and an external device is sandwiched between a substrate module lower cover and a substrate module upper cover on a substrate sheet,
The substrate module upper cover contains an emetogenic bittering agent,
A white solid print layer and at least one pattern print layer are provided in this order on the board module upper cover,
The pattern printed layer is provided with a pattern printed layer removal portion in which the underlying substrate module upper cover is exposed by partially removing the pattern printed layer and the white solid printed layer. token. A housing containing the token according to claim 1. A method of manufacturing a token according to claim 1, comprising:
forming a substrate module lower cover;
assembling the board module into the manufactured board module lower cover;
forming an upper cover for the substrate module on the substrate module;
a step of forming the white solid print layer on the substrate module upper cover;
forming the pattern printed layer on the white solid printed layer;
and exposing the surface of the substrate module upper cover, which is the base of the solid white printed layer, by partially removing the pattern printed layer and the solid white printed layer in the pattern printed layer. A method of manufacturing a token characterized by:

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