JP2011123721A - Non-contact ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC medium, wherein a card that is no longer needed can be recycled and the card can be easily disposed of. <P>SOLUTION: The non-contact IC card allowed to be recycled for environmental protection includes a card base material and an inlet provided with an IC chip and an antenna. The card base material is made of paper and/or biodegradable resin. Further, a perforation part for separating the inlet from the card is formed on the card. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a non-contact IC medium such as an IC card using a paper base or a biodegradable base, and more particularly to a non-contact IC medium having a structure in consideration of ecology or recycling.

  Conventionally, card media used for credit cards, cash cards, IC cards, and the like are required to have a long life and durability. Therefore, as a material, resins such as PET (polyethylene terephthalate) and PVC (polyvinyl chloride) are used. Plastic cards using the composition have become mainstream.

  In recent years, non-contact IC cards and RFIDs that use paper media are emerging, and for non-contact IC media applications that do not require mechanical transportability, their durability and lifetime are compared to the above-mentioned plastic media. Even if it is inferior, there is no particular problem, and there is a high possibility that usage will increase in the future.

  However, in recent years, the circulation of cards has become extremely large, and environmental problems have been pointed out, and consideration for the environment is necessary. That is, in the usual case, the card is used by the user, and after the card is no longer needed, it is discarded as household waste and disposed of by incineration or landfill as waste.

  However, in the case of incineration, the combustion temperature increases due to incineration, and there are problems of durability of the incinerator and pollution problems such as combustion gas. In the landfill process, it remains in its original form without being decomposed. Therefore, it remains on the earth semi-permanently, and the impact on the natural environment is a problem.

  Also, in the case of a card using the above-mentioned paper medium, there are many cases in which the durability or water resistance of the card is imparted by laminating a resin layer such as polyethylene or PET on the paper base material as a protective layer. In this case, there was a problem similar to that of the plastic card.

In recent years, for example, the use of biomass resources and biodegradable resin materials has been studied as countermeasures against such card disposal problems.
Biomass resources use substances composed of living organisms as industrial resources, and correspond to, for example, food waste, raw garbage, thinned wood, straw, feed crops, or paper. Biodegradable resins include those using biomass as a raw material and those using petroleum as a raw material, but have the property of being decomposed by microorganisms and finally decomposed into water and carbon dioxide. Therefore, even if discarded, it can be decomposed and returned to nature, which can be one of the solutions to environmental problems.

  However, in the case of a non-contact IC card, since the component includes a metal antenna part and a semiconductor, it is necessary to disassemble and separate only that part, but the structure cannot be easily disassembled. . Therefore, it is difficult to handle the system as a recycled product for environmental protection as described above, and there is a problem that even if a medium that can be recycled is used, it is eventually disposed of as non-burnable garbage.

To deal with such a card disposal problem, for example, Patent Document 1 below discloses a method in which an IC chip is separated from an unnecessary card using a needle or a blade, and the card and the IC chip are disposed of separately. Has been.

  However, this method can protect confidential information by destroying the IC chip, but it does not recycle for the environment, and it takes time and effort as a separation method. There was a problem that was not limited.

JP 2003-290756 A

  As explained above, when disposing of non-contact IC media that have parts that originally need to be separated for environmental protection, it is time consuming to screen and select and separate the metal parts. There is a method to recycle.

  However, it is actually difficult to implement such a method for each card, and in countries where recycling methods are not widespread, the method of landfilling and discarding is still the mainstream. It is not a realistic solution.

  The present invention has been made to solve the above problem, and an object of the present invention is to provide a non-contact IC medium in which used cards can be recycled and can be easily disposed of.

  In order to solve the above-described problems, the present invention is configured as follows.

The non-contact IC card according to the invention of claim 1 is:
A contactless IC card that can be recycled for environmental protection,
A card base and an inlet having an IC chip and an antenna;
The card substrate is made of paper and / or biodegradable resin,
And the said card | curd is provided with the cutting process part for isolate | separating the said inlet from a card | curd, It is characterized by the above-mentioned.

The non-contact IC card according to the invention of claim 2
The area of the inlet is 50% or less of the area of the card,
And the card | curd base material is each laminated | stacked on both surfaces of an inlet, It is characterized by the above-mentioned.

The non-contact IC card according to the invention of claim 3
The card cutting portion is cut so as to surround a peripheral portion of the inlet.

The non-contact IC card according to the invention of claim 4
A sealing layer and a card base material are respectively laminated in this order on both surfaces of the inlet.

The non-contact IC card according to the invention of claim 5 is:
The sealing layer, the intermediate base material, and the card base material are respectively laminated in this order on both surfaces of the inlet.

The non-contact IC card according to the invention of claim 6 is
The card cut-out portion is cut out using any one of punching, half-cutting, and perforation.

The non-contact IC card according to the invention of claim 7 is
The card cut-out processing section extends from the inlet cut-out line surrounding the peripheral edge of the inlet, and extends from the inlet cut-out line toward the upper end and the lower end of the long side of the card to reach the upper end and the lower end. And a cut line.

According to the non-contact IC card of the present invention, paper or a biodegradable resin is used as a card base material, and recycling can be performed by easily processing an inlet portion including an IC chip from the card. A card that is possible and easy to handle is obtained.
Further, by providing the sealing layer and the intermediate base material, it is possible to protect the inlet and maintain water resistance and durability.

It is sectional drawing which shows the 1st Example of the non-contact IC card of this invention. It is sectional drawing which shows the 2nd Example of the non-contact IC card of this invention. It is sectional drawing which shows the 3rd Example of the non-contact IC card of this invention. It is a top view which shows the external appearance shape of the non-contact IC card of this invention. It is a figure which shows an example of the cutting process of the non-contact IC card of this invention. It is a figure which shows another example of the cutting process of the non-contact IC card of this invention.

  Embodiments of a non-contact IC card according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a cross-sectional view showing a first configuration example of a non-contact IC card according to the present invention, in which each layer is separated to show a layer configuration.

  In the non-contact IC card 10, the IC circuit portion including the IC chip 9 and the antenna was placed on the inlet forming substrate 3 to form the inlet 2. The antenna is patterned by etching, printing, plating, pattern deposition, or winding using copper, silver, aluminum, etc., and functions as a non-contact IC by being electrically connected to the IC chip. .

  Then, the 1st base material 1 was laminated | stacked on the surface by which the IC chip of the said inlet 2 was provided, and the 2nd base material 4 was laminated | stacked on the other surface.

  Further, the card medium was subjected to a cutting process for separating the inlet portion from the card by the method shown in a cutting process example 1 described later. As a result, the inlet portion can be easily cut from the card.

  As the material of the base material, paper and / or biodegradable resin can be used as a material in order to enable recycling, and the entire inlet is prevented to prevent physical impact from the outside or erosion due to the external atmosphere. Cover and protect.

As the paper or biodegradable resin used for the first base material and the second base material, known materials can be appropriately used.

  For example, biodegradable resin materials include 3-hydroxybutyric acid, 3-hydroxyvaleric acid copolymer P (3HB-3HV) and other microbial-produced polyesters, polycaprolactam (PCL) and other aliphatic polyesters, and polylactic acid and the like. Glycolide, polyvinyl alcohol, starch complex and the like can be used.

  All the biodegradable resin materials have the property of being gradually decomposed by the action of microorganisms and finally completely decomposed into water, carbon dioxide, etc. when left in a natural environment such as soil or water. Have. As a result, disposal processing that protects the natural environment becomes possible.

  In the first embodiment, an adhesive layer may be provided between the inlet 2 and the first substrate 1 and / or between the inlet 2 and the second substrate 4. In addition, a print layer or a protective layer for patterns, characters, and the like can be optionally provided outside the first base material and the second base material. (Not shown)

(Second embodiment)
FIG. 2 is a sectional view showing a second embodiment of the non-contact IC card of the present invention, in which each layer is shown separately.

In this embodiment, as shown in FIG. 2, the first intermediate base material 5 and the first base material 1 are laminated in this order on the side of the inlet 2 facing the IC chip 9 and the antenna, and the inlet 2 of the inlet 2 is further laminated. The second intermediate substrate 6 and the second substrate 4 were laminated in this order on the side facing the forming substrate 3.
The outer shape of the inlet and the size of the card were the same as in the first embodiment.

  Next, the card medium was subjected to a cutting process for separating the inlet portion from the card by the method shown in a cutting process example 2 described later. As a result, the inlet portion can be easily cut from the card.

  The first intermediate base material 5 and the second intermediate base material 6 were introduced for the purpose of preventing unevenness on the card surface due to the thickness of the inlet 2 and for the purpose of reinforcing the physical strength of the card itself. In this example, biodegradable resin was used as the material for these base material and intermediate base material.

As the material of the base material and the intermediate base material, it is preferable to use paper and / or a biodegradable resin for the reasons described above.
In addition, the said intermediate | middle base material may be provided in either one side, or may be provided in both surfaces, and can be selected suitably.

  In the non-contact IC card of the present invention, between the first substrate 1 and the first intermediate substrate 5, between the second substrate 4 and the second intermediate substrate 6, the inlet 2 and the first intermediate substrate. 5 and an adhesive layer may be provided between the inlet 2 and the second intermediate substrate 6. In addition, a printing layer or a protective layer for patterns and characters can be optionally provided on the outermost layer. (Not shown)

(Third embodiment)
FIG. 3 is a cross-sectional view showing a third embodiment of the non-contact IC card of the present invention, in which each layer is shown separately.

  In this embodiment, as shown in FIG. 3, the first sealing layer 7 is laminated on the inlet 2 on the side facing the IC chip 9 and the antenna, and the first sealing layer 7 on the side facing the inlet forming substrate 3 of the inlet 2 is stacked. Two sealing layers 8 were laminated. These sealing layers cover the inlet with a resin sheet or film so that the inlet is not easily affected by the external atmosphere.

  As the material for the sealing layer, for example, a resin or a film such as polyethylene, polypropylene, PETG (polyethylene terephthalate copolymer), polycarbonate, or the like can be used.

Subsequently, the first intermediate base material 5 and the first base material 1 are laminated in this order on the surface of the first sealing layer 7 opposite to the surface in contact with the inlet 2, and the second sealing is further performed. The second intermediate substrate 6 and the second substrate 4 were laminated in this order on the surface of the layer 8 opposite to the surface in contact with the inlet 2.
The outer shape of the inlet and the size of the card were the same as in the first embodiment.

  Next, similarly to the above-described embodiment, the card medium was subjected to a cutting process for separating the inlet portion from the card by the method shown in a cutting process example 2 described later.

  In the layer configuration of the present embodiment, between the first substrate 1 and the first intermediate substrate 5, between the second substrate 4 and the second intermediate substrate 6, the first sealing layer 7 and the first intermediate. An adhesive layer may be provided between the base material 5 and between the second sealing layer 8 and the second intermediate base material 6. In addition, a printing layer or a protective layer for patterns and characters can be optionally provided on the outermost layer. (Not shown)

  In the first to third embodiments described above, the outer shape of the inlet 2 is appropriately determined. The size of the inlet 2 is formed within a range of a circular region having a diameter of 30 mm or less or a rectangular region having a size of 30 mm × 30 mm or less. It is preferable.

In the non-contact IC card of the present invention, known techniques can be appropriately selected and used for manufacturing methods such as an inlet forming method, a laminating method of each layer structure, a card cutting method, and a printing method. Further, the thickness of the card may be adjusted by selecting the thickness of the base material or the intermediate base material so as to conform to a predetermined standard.
However, it is desirable to design so that characteristics such as physical strength, durability, and water resistance required as a product have desired values.

  Further, the inlet 2 uses the inlet forming base material 3 in the inlet 2, but without using the inlet forming base material 3, the IC chip 9 and the antenna are directly connected to the base material 1 or the base material 4, or the intermediate base material 5 or the intermediate base. It may be sandwiched between the materials 6 (not shown). In this case, an adhesive layer may be interposed between the inlet and the substrate.

  FIG. 4 is a plan view showing an appearance of the card as viewed from the front as an embodiment of the non-contact IC card of the present invention.

  In the non-contact IC card 10, the inlet forming portion 12 shows a state in which the inlet 2 is sealed inside the card, and the dotted line portion in the figure represents the outline of the outer shape of the inlet 2. Further, the periphery thereof shows a non-inlet forming portion 11.

  The area of the inlet forming portion 12 is preferably 50% or less of the area of the card base or the card final appearance. Thus, by limiting the area of the inlet forming portion, the area ratio of the recyclable portion at the time of disposal can be increased.

  The size of a general non-contact IC card is, for example, according to JIS 6301 standard, the long side is 85.47 to 85.72 mm, the short side is 53.92 to 54.03 mm, and the thickness is 0.68 to 0. Since it is defined as being within the range of .84 mm, the average size is 85.6 mm long side × 54 mm short side × 0.76 mm thickness, and the inlet forming area is set according to this. .

(Inlet cutting example 1)
FIG. 5 is a diagram showing an example of the cutting process of the non-contact IC card of the present invention.
A first cut-out processing portion 13 is provided near the outer periphery of the inlet forming portion 12, and the card is disposed so that the entire inlet forming portion 12 can be easily separated from the non-contact IC card 10 when the card is discarded. Processing has been applied.

  The cut-out processing portion 13 is formed by punching or half-cutting the card medium, and the joint portion between the inlet forming portion 12 and the non-inlet forming portion 11 has a small area. This part can be easily cut by means.

(Inlet cutting process example 2)
FIG. 6 is a diagram showing another example of the cutting process of the non-contact IC card of the present invention.
A second cut-out processing portion 14 is provided in the vicinity of the outer peripheral portion of the inlet forming portion 12, and cut-out processing lines 15a and 15b are provided from the second cut-out processing portion 14 to both ends of the long side of the card.

The cut-out processing part 14 and the cut-out processing lines 15a and 15b have been subjected to punching processing or half-cutting processing on the card medium. When the card is discarded, the entire inlet forming part 12 can be easily removed from the non-contact IC card 10 Can be separated.
Accordingly, the non-inlet forming portions 11a and 11b are separated from the inlet forming portion 12 and can be recycled.

  As described above, according to the non-contact IC card according to the present invention, recycling that protects the environment is possible, and a card having a recyclable portion as large as possible can be obtained. Moreover, it becomes possible to maintain the water resistance and durability similar to those of the conventional card.

DESCRIPTION OF SYMBOLS 1 First base material 2 Inlet 3 Inlet formation base material 4 Second base material 5 First intermediate base material 6 Second intermediate base material 7 First sealing layer 8 Second sealing layer 9 IC chip 10 Non-contact IC card 11 , 11a, 11b Non-inlet forming portion 12 Inlet forming portion 13 First cut processing portion 14 Second cut processing portions 15a, 15b Cut processing line

Claims (7)

A contactless IC card that can be recycled for environmental protection,
A card base and an inlet having an IC chip and an antenna;
The card substrate is made of paper and / or biodegradable resin,
And the said card is provided with the cutting process part for isolate | separating the said inlet from a card | curd, The non-contact IC card characterized by the above-mentioned. The area of the inlet is 50% or less of the area of the card,
The non-contact IC card according to claim 1, wherein the card base material is laminated on both sides of the inlet.   The non-contact IC card according to claim 1, wherein the cut-out portion of the card is cut so as to surround a peripheral portion of the inlet.   The contactless IC card according to any one of claims 1 to 3, wherein a sealing layer and a card substrate are respectively laminated in this order on both surfaces of the inlet.   The contactless IC card according to any one of claims 1 to 3, wherein a sealing layer, an intermediate base material, and a card base material are respectively laminated in this order on both surfaces of the inlet.   6. The non-contact method according to claim 1, wherein the cut portion of the card is cut using any one of a punching process, a half punching process, and a perforation process. IC card.   The card cut-out processing portion extends from the inlet cut-out line surrounding the peripheral edge of the inlet, and extends from the inlet cut-out line toward the upper end and the lower end of the long side of the card to reach the upper end and the lower end. The contactless IC card according to claim 1, further comprising a cut line.

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