JP7196587B2 - Acid group-containing (meth)acrylate resin, curable resin composition, cured product, insulating material, resin material for solder resist, and resist member - Google Patents

Description

The present invention provides an acid group-containing (meth)acrylate resin excellent in heat resistance and elongation in a cured product, a curable resin composition containing the same, an insulating material comprising the curable resin composition, and a resin material for solder resist. , and a resist member.

In recent years, acid group-containing epoxy acrylate resins obtained by reacting acid anhydrides after acrylated epoxy resins with acrylic acid have been widely used as resin materials for solder resists for printed wiring boards. The performance requirements for resin materials for solder resists include curing with a small amount of exposure, excellent alkali developability, heat resistance, elongation and strength, flexibility, elongation, dielectric properties, substrate adhesion, etc. in the cured product. There are many things that are good.

As a conventionally known resin material for solder resist, active energy ray-curing obtained by reacting a reaction product of a novolak type epoxy resin and an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride Resins are known (see, for example, Patent Document 1 below.), but although they have excellent heat resistance in cured products, they do not satisfy the ever-increasing demand for elongation in the future. it wasn't good enough.

Therefore, there has been a demand for a material that is even more excellent in terms of heat resistance and elongation in the cured product.

JP-A-61-243869

The problem to be solved by the present invention is an acid group-containing (meth)acrylate resin excellent in heat resistance and elongation in a cured product, a curable resin composition containing the same, and an insulating material comprising the curable resin composition. , a solder resist resin material, and a resist member.

As a result of intensive studies to solve the above problems, the present inventors have found that an amideimide resin having an acid group and/or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound, an epoxy group-containing (meth)acrylate compound and polycarboxylic acid. An acid group-containing (meth)acrylate resin containing an acid anhydride as an essential reaction raw material, wherein the amideimide resin contains a polyisocyanate compound, an epoxy resin and a polycarboxylic acid anhydride as essential reaction raw materials. The inventors have found that the above problems can be solved by using an acid group-containing (meth)acrylate resin characterized by, and have completed the present invention.

That is, an amide imide resin (A) having an acid group and/or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound (B), an epoxy group-containing (meth)acrylate compound (C) and a polycarboxylic anhydride (D) is an essential reaction raw material, wherein the amideimide resin (A) comprises a polyisocyanate compound (a1), an epoxy resin (a2) and a polycarboxylic anhydride (a3) as essential Acid group-containing (meth) acrylate resin, characterized in that it is a reaction raw material of, a curable resin composition containing this, a cured product made of the curable resin composition, an insulating material, a solder resist resin It relates to materials and resist members.

Since the acid-group-containing (meth)acrylate resin of the present invention is excellent in heat resistance and elongation in a cured product, it can be suitably used as an insulating material, a solder resist resin material, and a resist member.

The acid group-containing (meth)acrylate resin of the present invention includes an amide imide resin (A) having an acid group and/or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound (B), an epoxy group-containing (meth)acrylate compound ( C) and polycarboxylic anhydride (D) are used as essential reaction raw materials.

In addition, in this invention, "(meth)acrylate" means an acrylate and/or a methacrylate. Moreover, "(meth)acryloyl" means acryloyl and/or methacryloyl. Furthermore, "(meth)acryl" means acryl and/or methacryl.

The amide imide resin (A) having an acid group and/or an acid anhydride group may have either an acid group or an acid anhydride group, or may have both. good. Among them, from the viewpoint of reactivity and reaction control with the hydroxyl group-containing (meth)acrylate compound (B) and the epoxy group-containing (meth)acrylate compound (C), it is preferable to have an acid anhydride group. , preferably has both an acid group and an acid anhydride group.

Examples of the acid group include a carboxyl group, a sulfonic acid group, and a phosphoric acid group.

Examples of the acid anhydride group include a carboxylic anhydride group, a sulfonic anhydride group, and a phosphoric anhydride group.

As the amide-imide resin (A), a polyisocyanate compound (a1), an epoxy resin (a2) and a polycarboxylic anhydride (a3) are essential reaction raw materials.

Examples of the polyisocyanate compound (a1) include aliphatic diisocyanate compounds such as butane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate; Alicyclic diisocyanate compounds such as isophorone diisocyanate, hydrogenated xylylene diisocyanate, and hydrogenated diphenylmethane diisocyanate; Aromatic diisocyanate compounds such as diisocyanato-3,3′-dimethylbiphenyl and o-tolidine diisocyanate; polymethylene polyphenyl polyisocyanate having a repeating structure represented by the following structural formula (1); isocyanurate modified products thereof, biuret Modified products, allophanate modified products and the like can be mentioned. In addition, these polyisocyanate compounds can be used alone or in combination of two or more. These polyisocyanate compounds (a1) are preferably non-isocyanurate modified products because they yield an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation.

［式（１）中、Ｒ^１はそれぞれ独立して、水素原子、または炭素原子数１～６の炭化水素基の何れかである。Ｒ^２はそれぞれ独立して、炭素原子数１～４のアルキル基、または構造式（１）で表される構造部位と＊印が付されたメチレン基を介して連結する結合点の何れかである。ｌは０または１～３の整数であり、ｍは１～１５の整数である。］

[In formula (1), each R ¹ is independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms. Each R ² is independently either an alkyl group having 1 to 4 carbon atoms, or a point of attachment that connects the structural site represented by Structural Formula (1) via a methylene group marked with *. be. l is 0 or an integer of 1-3; m is an integer of 1-15; ]

Among these, the alicyclic diisocyanate compound or its modified form is preferable, and the alicyclic diisocyanate is preferable in that it becomes an acid group-containing (meth)acrylate resin having excellent solvent solubility. In addition, the above aliphatic diisocyanate compounds or modified products thereof are preferred, and aliphatic diisocyanates are preferred, in that an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained. Furthermore, the ratio of the total mass of the alicyclic diisocyanate compound or modified product thereof and the aliphatic diisocyanate compound or modified product thereof to the total mass of the polyisocyanate compound (a1) is preferably 70% by mass or more, It is more preferably 90% by mass or more. When the alicyclic diisocyanate compound or modified product thereof and the aliphatic diisocyanate compound or modified product thereof are used together, the mass ratio of the two is preferably in the range of 20/80 to 80/20.

Examples of the epoxy resin (a2) include bisphenol-type epoxy resins, phenylene ether-type epoxy resins, naphthylene ether-type epoxy resins, biphenyl-type epoxy resins, triphenylmethane-type epoxy resins, phenol novolac-type epoxy resins, and cresol novolac-type epoxy resins. Epoxy resins, bisphenol novolak type epoxy resins, naphthol novolac type epoxy resins, naphthol-phenol co-condensation novolak type epoxy resins, naphthol-cresol co-condensation novolak type epoxy resins, phenol aralkyl type epoxy resins, naphthol aralkyl type epoxy resins, dicyclopentadiene -phenol addition reaction type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, dihydroxybenzene type epoxy resin, trihydroxybenzene type epoxy resin and the like. These epoxy resins can be used alone or in combination of two or more. In addition, among these, bisphenol type epoxy resin, phenylene ether type epoxy resin, naphthylene ether type epoxy resin, Biphenyl-type epoxy resins and dihydroxybenzene-type epoxy resins are preferred.

In addition, as the epoxy resin (a2), an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained, so it has two epoxy groups in one molecule. things are preferred.

Examples of the polycarboxylic anhydride (a3) include aliphatic polycarboxylic anhydrides, alicyclic polycarboxylic anhydrides, and aromatic polycarboxylic anhydrides.

Examples of the aliphatic polycarboxylic acid anhydrides include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, citraconic acid, and itaconic acid. acids, glutaconic acid, acid anhydrides of 1,2,3,4-butanetetracarboxylic acid, and the like. These aliphatic polycarboxylic acid anhydrides can be used alone or in combination of two or more. In addition, the aliphatic polycarboxylic acid anhydride may have an aliphatic hydrocarbon group of either a straight chain type or a branched type, and may have an unsaturated bond in its structure.

As the alicyclic polycarboxylic anhydride, in the present invention, one in which an acid anhydride group is bonded to an alicyclic structure is an alicyclic polycarboxylic anhydride, and the aromatic ring in the other structural site is It does not matter whether or not Examples of the alicyclic polycarboxylic anhydride include tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane-2, 3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene- Examples include acid anhydrides of 1,2-dicarboxylic acids.

Examples of the aromatic polycarboxylic anhydrides include phthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid, biphenyltetracarboxylic acid, An acid anhydride of benzophenonetetracarboxylic acid and the like can be mentioned.

These polycarboxylic anhydrides (a3) can be used alone or in combination of two or more. Further, among these, since an acid group-containing (meth) acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained, the alicyclic polycarboxylic anhydride or the aromatic poly Carboxylic anhydrides are preferred. In addition, since an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation is obtained, tricarboxylic acid anhydride having both a carboxyl group and an acid anhydride group in the molecular structure It is preferable to use a substance, and it is particularly preferable to use cyclohexanetricarboxylic anhydride or trimellitic anhydride. At this time, the content of the tricarboxylic anhydride in the polycarboxylic anhydride (a3) is preferably 70% by mass or more, more preferably 90% by mass or more.

Further, as the amideimide resin (A), an acid-group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation is obtained, and therefore, those having an oxazolidone ring are preferable.

The content of the oxazolidone ring in the amideimide resin (A) is 0.70 mol/kg or less, since an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained. is preferred, and a range of 0.20 to 0.70 mol/kg is more preferred. In the present invention, the content of the oxazolidone ring is obtained by dividing the mass of the epoxy resin (a2) by the epoxy equivalent of the epoxy resin (a2) with respect to the mass (nonvolatile matter) of the amideimide resin (A). It is calculated.

In addition, as the amideimide resin (A), if necessary, in addition to the polyisocyanate compound (a1), the epoxy resin (a2) and the polycarboxylic anhydride (a3), other compounds may be used as reaction raw materials. They can also be used in combination. When the other compounds are used in combination, the effect of the present invention is sufficiently exhibited, so that the polyisocyanate compound (a1), the epoxy resin (a2) and the The total content of the polycarboxylic anhydride (a3) is preferably 80% by mass or more, more preferably 85% by mass.

Examples of the other compounds include polycarboxylic acids.

Any compound having two or more carboxyl groups in one molecule can be used as the polycarboxylic acid. For example, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic acid, hexahydro phthalic acid, methylhexahydrophthalic acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane- 2,3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydro naphthalene-1,2-dicarboxylic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid, biphenyltetracarboxylic acid, benzophenonetetracarboxylic acid, and the like. be done. As the polycarboxylic acid, for example, a copolymer of a conjugated diene-based vinyl monomer and acrylonitrile, which has a carboxyl group in its molecule, can also be used. These polycarboxylic acids can be used alone or in combination of two or more.

Examples of the copolymer of the conjugated diene-based vinyl monomer and acrylonitrile and having a carboxyl group in the molecule include a butadiene-acrylonitrile copolymer represented by the following structural formula (2-1) Half of a polymer having a carboxyl group in or a polymer having a hydroxyl group in the molecule of a butadiene-acrylonitrile copolymer represented by the following structural formula (2-2) and a polybasic acid anhydride such as maleic anhydride and esters. The position of the carboxyl group may be on either the side chain or the terminal of the molecule, but the terminal is preferred.

［構造式（２－１）中、Ｘは１～５０の整数であり、Ｙは１～５０の整数であり、Ｚは１～２０の整数である。］

[In Structural Formula (2-1), X is an integer of 1 to 50, Y is an integer of 1 to 50, and Z is an integer of 1 to 20. ]

［構造式（２－２）中、Ｘは１～５０の整数であり、Ｙは１～５０の整数であり、Ｚは１～２０の整数である。］

[In Structural Formula (2-2), X is an integer of 1 to 50, Y is an integer of 1 to 50, and Z is an integer of 1 to 20. ]

The acid value of the amide imide resin (A) is neutral under neutral conditions, i.e., acid anhydride, since an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained. The measured value under conditions in which the group is not opened is preferably in the range of 60 to 350 mgKOH/g, and the measured value under conditions in which the acid anhydride group is opened such as in the presence of water is 61 to 360 mgKOH/g. is preferably in the range of In the present invention, the acid value is a value measured by the neutralization titration method of JIS K 0070 (1992).

The method for producing the amide-imide resin (A) is not particularly limited, and any method may be used. For example, it may be produced by a method of reacting all of the reaction raw materials at once, or may be produced by a method of sequentially reacting the reaction raw materials. Among them, since the reaction is easy to control, the polyisocyanate compound (a1) and the epoxy resin (a2) are reacted (step A1), and the intermediate reaction product obtained in the step A1 and the polycarboxylic acid It is preferably produced by a method of reacting with an acid anhydride (a3) (step A2).

The step A1 is a step of reacting the polyisocyanate compound (a1) and the epoxy resin (a2) to obtain an intermediate reaction product. The reaction mainly involves reacting the isocyanate groups of the polyisocyanate compound (a1) with the epoxy groups of the epoxy resin (a2). Regarding the reaction ratio of the reaction, the number of moles of the isocyanate groups of the polyisocyanate compound (a1) per 1 mole of the epoxy groups of the epoxy resin (a2) is preferably in the range of 2 to 40, more preferably in the range of 5 to 20. more preferred. The reaction of step A1 can be carried out, for example, in the presence of a suitable basic catalyst, with heating and stirring at a temperature of about 100 to 200°C. Also, the reaction may be carried out in an organic solvent, if necessary.

Examples of the organic solvent include ketone solvents such as methyl ethyl ketone, acetone, dimethylformamide and methyl isobutyl ketone; cyclic ether solvents such as tetrahydrofuran and dioxolane; ester solvents such as methyl acetate, ethyl acetate and butyl acetate; toluene, xylene and solvent. Aromatic solvents such as naphtha; Alicyclic solvents such as cyclohexane and methylcyclohexane; Alcohol solvents such as carbitol, cellosolve, methanol, isopropanol, butanol and propylene glycol monomethyl ether; Alkylene glycol monoalkyl ethers and dialkylene glycol monoalkyl ethers , dialkylene glycol monoalkyl ether acetate; methoxypropanol, cyclohexanone, methyl cellosolve, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like. These organic solvents can be used alone or in combination of two or more. Further, the amount of the organic solvent used is preferably in the range of about 0.1 to 5 times the total mass of the reaction raw materials, since the reaction efficiency is improved.

Examples of the basic catalyst include N-methylmorpholine, pyridine, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 1,5-diazabicyclo[4.3.0]nonene- 5 (DBN), 1,4-diazabicyclo[2.2.2]octane (DABCO), tri-n-butylamine or dimethylbenzylamine, butylamine, octylamine, monoethanolamine, diethanolamine, triethanolamine, imidazole, 1 -methylimidazole, 2,4-dimethylimidazole, 1,4-diethylimidazole, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(N-phenyl)aminopropyltrimethoxysilane, 3-( 2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropylmethyldimethoxysilane, amine compounds such as tetramethylammonium hydroxide; trioctylmethylammonium chloride, trioctylmethylammonium acetate, etc. ammonium salts; phosphines such as trimethylphosphine, tributylphosphine, and triphenylphosphine; Phosphonium salts such as chloride, triphenylphosphonium chloride, and benzylphosphonium chloride; Organic tin compounds such as 1,1,3,3-tetrabutyl-1,3-dodecanoyldistannoxane; Organometallic compounds such as zinc octylate and bismuth octylate; Inorganic tin compounds such as tin octoate; etc. These basic catalysts can be used alone or in combination of two or more.

The step A2 is a reaction between the intermediate reaction product obtained in the step A1 and the polycarboxylic anhydride (a3). The reaction mainly involves reacting the isocyanate group of the intermediate reaction product obtained in step A1 with the polycarboxylic anhydride (a3). As for the reaction ratio of the reaction, it is preferable to use 0.5 to 5.0 mol of the polycarboxylic anhydride (a3) per 1 mol of the isocyanate group in the intermediate reaction product. Further, the reaction in step A2 can be carried out with heating and stirring at a temperature of about 100 to 180°C. The reaction of step A2 may be carried out in an organic solvent, or a basic catalyst may be used, if necessary.

As the organic solvent, the same organic solvent as described above can be used. Moreover, as said organic solvent, using independently can also use 2 or more types together.

As the basic catalyst, the same basic catalyst as described above can be used. Moreover, as said basic catalyst, using independently can also use 2 or more types together.

As the hydroxyl group-containing (meth)acrylate compound (B), the hydroxyl group-containing (meth)acrylate compound (B) is a compound having a hydroxyl group and a (meth)acryloyl group in its molecular structure. is not particularly limited, and a wide variety of compounds can be used. Examples thereof include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, trimethylolpropane (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol (meth) acrylate, pentaerythritol di(meth) ) acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol (meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta (Meth)acrylate, ditrimethylolpropane (meth)acrylate, ditrimethylolpropane di(meth)acrylate, ditrimethylolpropane tri(meth)acrylate and the like. In addition, a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, (poly)oxypropylene chain, or (poly)oxytetramethylene chain is introduced into the molecular structure of the various hydroxyl group-containing (meth)acrylate compounds ( Poly)oxyalkylene modified products and lactone modified products obtained by introducing a (poly)lactone structure into the molecular structure of the various hydroxyl group-containing (meth)acrylate compounds can also be used. These hydroxyl group-containing (meth)acrylate compounds can be used alone or in combination of two or more.

The molecular weight of the hydroxyl group-containing (meth)acrylate compound (B) is preferably 1,000 or less because an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained. . Further, when the hydroxyl group-containing (meth)acrylate compound (B) is an oxyalkylene modified product or a lactone modified product, the weight average molecular weight (Mw) is preferably 1,000 or less.

The epoxy group-containing (meth)acrylate compound (C) is not particularly limited to other specific structures as long as it has a (meth)acryloyl group and an epoxy group in its molecular structure, and a wide variety of compounds are used. be able to. Examples thereof include glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, glycidyl group-containing (meth)acrylate monomers such as epoxycyclohexylmethyl (meth)acrylate; Examples include mono(meth)acrylates of diglycidyl ether compounds such as naphthalene diglycidyl ether, biphenol diglycidyl ether, and bisphenol diglycidyl ether. These epoxy group-containing (meth)acrylate compounds can be used alone or in combination of two or more. Among these, a (meth)acrylate compound having one epoxy group is preferable because it facilitates control of the reaction, and an acid group-containing (meth)acrylate capable of forming a cured product having excellent heat resistance and elongation. A glycidyl group-containing (meth)acrylate monomer is preferred because a resin can be obtained. Moreover, the molecular weight of the glycidyl group-containing (meth)acrylate monomer is preferably 500 or less. Furthermore, the ratio of the glycidyl group-containing (meth)acrylate monomer to the total mass of the epoxy group-containing (meth)acrylate compound (C) is preferably 70% by mass or more, more preferably 90% by mass or more. .

As the polycarboxylic anhydride (D), the same polycarboxylic anhydride (a3) as described above can be used, and the polycarboxylic anhydride (D) can be used alone or in two types. The above can also be used together. In addition, since an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained, an aliphatic polycarboxylic anhydride or an alicyclic polycarboxylic anhydride is preferable. Aliphatic dicarboxylic anhydrides or alicyclic dicarboxylic anhydrides are more preferred.

As the acid group-containing (meth)acrylate resin of the present invention, the amide imide resin (A), the hydroxyl group-containing (meth)acrylate compound (B), the epoxy group-containing (meth)acrylate according to the desired resin performance, etc. In addition to the compound (C) and the polycarboxylic anhydride (D), other reaction raw materials can also be used in combination. When the other reaction raw materials are used in combination, the effects of the present invention are sufficiently exhibited, so that the total content of the components (A) to (D) in the reaction raw materials of the acid group-containing (meth)acrylate resin is contained. The amount is preferably 80% by mass or more, more preferably 85% by mass or more.

The method for producing the acid group-containing (meth)acrylate resin of the present invention is not particularly limited, and any method may be used. For example, it may be produced by a method of reacting all of the reaction raw materials at once, or may be produced by a method of sequentially reacting the reaction raw materials. Among them, since the reaction is easy to control, the amide imide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B) are reacted (step 1), and the product of step 1 and the epoxy group-containing ( It is preferably produced by a method of reacting the meth)acrylate compound (C) (Step 2) and reacting the product of Step 2 with the polycarboxylic anhydride (D) (Step 3).

The step 1 is a reaction between the amide imide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B). The reaction mainly involves reacting the acid groups and/or acid anhydride groups in the amide-imide resin (A) with the hydroxyl groups in the hydroxyl-containing (meth)acrylate compound (B). Since the hydroxyl group-containing (meth)acrylate compound (B) is particularly excellent in reactivity with acid anhydride groups, as described above, the amideimide resin (A) preferably has acid anhydride groups. The content of the acid anhydride groups in the amide imide resin (A) is the difference between the two acid value measurements described above, that is, the acid value under the conditions in which the acid anhydride group is ring-opened, It can be calculated from the difference from the acid value under conditions where the acid anhydride group is not ring-opened.

The reaction ratio between the amideimide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B) is, when the amideimide resin (A) has an acid group and an acid anhydride group, and when the amideimide resin (A) is When having an acid anhydride group, the number of moles of hydroxyl groups possessed by the hydroxyl group-containing (meth)acrylate compound (B) per 1 mol of acid anhydride groups possessed by the amideimide resin (A) is 0.9 to 1.1. It is preferable to use it in the range which becomes. Further, when the amideimide resin (A) has an acid group, the number of moles of hydroxyl groups in the hydroxyl group-containing (meth)acrylate compound (B) per 1 mol of acid groups in the amideimide resin (A) is 0. It is preferable to use it in the range of 1 to 0.5.

The reaction between the amide imide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B) may be carried out by heating and stirring at a temperature of about 80 to 140° C. in the presence of a suitable esterification catalyst, for example. can be done. Examples of the esterification catalyst include phosphorus compounds such as trimethylphosphine, tributylphosphine and triphenylphosphine; amine compounds such as triethylamine, tributylamine and dimethylbenzylamine; 2-methylimidazole, 2-heptadecylimidazole, 2-ethyl -4-methylimidazole, 1-benzyl-2-methylimidazole, 1-isobutyl-2-methylimidazole and other imidazole compounds. These esterification catalysts can be used alone or in combination of two or more. The amount of the esterification catalyst to be added is preferably in the range of 0.001 to 5 parts by mass with respect to 100 parts by mass of the total mass of the reaction raw materials.

The reaction may be carried out in an organic solvent if necessary, and an acidic catalyst may be used if necessary.

As the organic solvent, the same organic solvent as described above can be used, and the organic solvent can be used alone or in combination of two or more. When the production of the amide-imide resin (A) and step 1 are performed continuously, the reaction may be continued in the organic solvent used in the production of the amide-imide resin (A).

The step 2 is a reaction between the product of the step 1 and the epoxy group-containing (meth)acrylate compound (C). The reaction mainly involves reacting the acid group in the product obtained in step 1 with the epoxy group-containing (meth)acrylate compound. The reaction ratio is such that the number of moles of epoxy groups in the epoxy group-containing (meth)acrylate compound (C) per 1 mole of acid groups in the product obtained in step 1 is 0.7 to 1.2. It is preferably used within the range of 0.9 to 1.1, more preferably used. The reaction of step 2 can be carried out, for example, in the presence of a suitable esterification catalyst, with heating and stirring at a temperature of about 90 to 140°C. When step 1 and step 2 are performed continuously, the esterification catalyst may not be added, or may be added as appropriate. Moreover, you may carry out reaction in an organic solvent as needed. As the esterification catalyst and the organic solvent, the same esterification catalyst and organic solvent as described above can be used, and they can be used alone or in combination of two or more.

The step 3 is the reaction of the product of the step 2 and the polycarboxylic anhydride (D). The reaction mainly involves reacting the hydroxyl groups in the product obtained in step 2 with the polycarboxylic anhydride (D). The product of step 2 contains, for example, hydroxyl groups generated by ring-opening of epoxy groups in the epoxy group-containing (meth)acrylate compound (C). The reaction rate of the polycarboxylic anhydride (D) is preferably adjusted so that the resulting acid group-containing (meth)acrylate resin has an acid value of about 60 to 120 mgKOH/g. The reaction in step 3 can be carried out, for example, in the presence of a suitable esterification catalyst, with heating and stirring at a temperature of about 80 to 140°C. When step 2 and step 3 are performed continuously, the esterification catalyst may not be added, or may be added as appropriate. Moreover, you may carry out reaction in an organic solvent as needed. As the esterification catalyst and the organic solvent, the same esterification catalyst and organic solvent as described above can be used, and they can be used alone or in combination of two or more.

The acid value of the acid group-containing (meth)acrylate resin of the present invention is 50 to 120 mgKOH/g, since an acid group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and elongation can be obtained. is preferred, and the range of 60 to 110 mgKOH/g is more preferred. In the present invention, the acid value of the acid group-containing (meth)acrylate resin is a value measured by the neutralization titration method of JIS K 0070 (1992).

Also, the weight average molecular weight (Mw) of the acid group-containing (meth)acrylate resin is preferably in the range of 1,000 to 20,000. In addition, in this invention, a weight average molecular weight (Mw) shows the value measured by the gel permeation chromatography (GPC) method.

Since the acid group-containing (meth)acrylate resin of the present invention has a polymerizable (meth)acryloyl group in its molecular structure, it can be used as a curable resin composition by adding a photopolymerization initiator, for example. can be done.

As for the photopolymerization initiator, an appropriate one may be selected and used according to the type of active energy ray to be irradiated. Further, it may be used in combination with a photosensitizer such as an amine compound, a urea compound, a sulfur-containing compound, a phosphorus-containing compound, a chlorine-containing compound and a nitrile compound. Specific examples of photopolymerization initiators include 1-hydroxy-cyclohexyl-phenyl-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-(dimethylamino) -2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone and other alkylphenone photoinitiators; 2,4,6-trimethylbenzoyl-diphenyl- acylphosphine oxide-based photopolymerization initiators such as phosphine oxide; intramolecular hydrogen abstraction type photopolymerization initiators such as benzophenone compounds; Each of these may be used alone, or two or more of them may be used in combination.

Examples of the photopolymerization initiator include 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2- Hydroxy-2-methyl-1-propan-1-one, thioxanthone and thioxanthone derivatives, 2,2′-dimethoxy-1,2-diphenylethan-1-one, diphenyl(2,4,6-trimethoxybenzoyl)phosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropane-1- one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, and the like.

Commercially available products of the other photopolymerization initiators include, for example, "Omnirad-1173", "Omnirad-184", "Omnirad-127", "Omnirad-2959", "Omnirad-369", and "Omnirad-379". , "Omnirad-907", "Omnirad-4265", "Omnirad-1000", "Omnirad-651", "Omnirad-TPO", "Omnirad-819", "Omnirad-2022", "Omnirad-2100", " Omnirad-754”, “Omnirad-784”, “Omnirad-500”, “Omnirad-81” (manufactured by IGM), “Kayacure-DETX”, “Kayacure-MBP”, “Kayacure-DMBI”, “Kayacure-EPA ”, “Kayacure-OA” (manufactured by Nippon Kayaku Co., Ltd.), “Vicure-10”, “Vicure-55” (manufactured by Stouffer Chemical), “Trigonal P1” (manufactured by Akzo), “Sunray 1000” ( Sands), "Deep" (Upjohn), "Quantacure-PDO", "Quantacure-ITX", "Quantacure-EPD" (Ward Blenkinsop), "Runtecure-1104" (Runtec company) and the like. These photopolymerization initiators can be used alone or in combination of two or more.

The amount of the photopolymerization initiator added is, for example, preferably in the range of 0.05 to 15% by mass with respect to the total of components other than the solvent of the curable resin composition, and in the range of 0.1 to 10% by mass. is more preferable.

The curable resin composition of the present invention may contain resin components other than the acid group-containing (meth)acrylate resin described above. Examples of the other resin components include an acid group-containing (meth)acrylate resin (E) and various (meth)acrylate monomers.

The resin (E) having an acid group and a polymerizable unsaturated bond may be any resin having an acid group and a polymerizable unsaturated bond. epoxy resin, urethane resin having acid group and polymerizable unsaturated bond, acrylic resin having acid group and polymerizable unsaturated bond, amide imide resin having acid group and polymerizable unsaturated bond, acid group and polymerizable unsaturated bond Examples include acrylamide resins having bonds.

Examples of the acid group include a carboxyl group, a sulfonic acid group, and a phosphoric acid group.

Examples of the epoxy resin having an acid group and a polymerizable unsaturated bond include, for example, an acid group-containing epoxy (meth)acrylate resin containing an epoxy resin, an unsaturated monobasic acid, and a polybasic acid anhydride as essential reaction raw materials, , epoxy resins, unsaturated monobasic acids, polybasic acid anhydrides, polyisocyanate compounds, and acid group- and urethane group-containing epoxy (meth)acrylate resins using hydroxyl group-containing (meth)acrylate compounds as reaction raw materials.

Examples of the epoxy resin include bisphenol type epoxy resin, phenylene ether type epoxy resin, naphthylene ether type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, Bisphenol novolak type epoxy resin, naphthol novolac type epoxy resin, naphthol-phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene-phenol addition Reactive epoxy resins, biphenylaralkyl-type epoxy resins, fluorene-type epoxy resins, xanthene-type epoxy resins, dihydroxybenzene-type epoxy resins, trihydroxybenzene-type epoxy resins, and the like can be mentioned. These epoxy resins can be used alone or in combination of two or more.

The unsaturated monobasic acid refers to a compound having an acid group and a polymerizable unsaturated bond in one molecule. Examples of the acid group include a carboxyl group, a sulfonic acid group, and a phosphoric acid group. Examples of the unsaturated monobasic acid (D) include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, α-cyanocinnamic acid, β-styrylacrylic acid, β-furfurylacrylic acid and the like. Esterified products, acid halides, acid anhydrides, etc. of the unsaturated monobasic acids can also be used. These unsaturated monobasic acids can be used alone or in combination of two or more.

Examples of the polybasic acid anhydride include phthalic anhydride, succinic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydro phthalic anhydride, methylhexahydrophthalic anhydride, octenyl succinic anhydride, tetrapropenyl succinic anhydride and the like. These polybasic acid anhydrides can be used alone or in combination of two or more. Among these, tetrahydrophthalic anhydride and succinic anhydride are preferred, since a curable resin composition capable of forming a cured product having excellent heat resistance and elongation can be obtained.

As the polyisocyanate compound, the same polyisocyanate compound (a1) as described above can be used, and the polyisocyanate compound can be used alone or in combination of two or more.

As the hydroxyl group-containing (meth)acrylate compound, the same hydroxyl group-containing (meth)acrylate compound (B) can be used, and the hydroxyl group-containing (meth)acrylate compound can be used alone or in two types. The above can also be used together.

The method for producing the epoxy resin having an acid group and a polymerizable unsaturated bond is not particularly limited, and any method may be used. The production of the epoxy resin having an acid group and a polymerizable unsaturated bond may be carried out in an organic solvent if necessary, and a basic catalyst may be used if necessary.

As the organic solvent, the same organic solvent as described above can be used, and the organic solvent can be used alone or in combination of two or more.

As the basic catalyst, the same basic catalyst as described above can be used, and the basic catalyst can be used alone or in combination of two or more.

Examples of the urethane resin having an acid group and a polymerizable unsaturated bond include, for example, a polyisocyanate compound, a hydroxyl group-containing (meth)acrylate compound, a carboxyl group-containing polyol compound, and optionally a polybasic acid anhydride, the carboxyl group Those obtained by reacting with a polyol compound other than the contained polyol compound, or reacting with a polyol compound other than a polyisocyanate compound, a hydroxyl group-containing (meth)acrylate compound, a polybasic acid anhydride, and a carboxyl group-containing polyol compound and the like.

As the polyisocyanate compound, the same polyisocyanate compound (a1) as described above can be used, and the polyisocyanate compound can be used alone or in combination of two or more.

As the hydroxyl group-containing (meth)acrylate compound, the same hydroxyl group-containing (meth)acrylate compound (B) can be used, and the hydroxyl group-containing (meth)acrylate compound can be used alone or in two types. The above can also be used together.

Examples of the carboxyl group-containing polyol compound include 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, and 2,2-dimethylolvaleric acid. The carboxyl group-containing polyol compounds can be used alone or in combination of two or more.

As the polybasic acid anhydride, the same polybasic acid anhydrides as described above can be used, and the polybasic acid anhydrides can be used alone or in combination of two or more.

Examples of polyol compounds other than the carboxyl group-containing polyol compounds include aliphatic polyol compounds such as ethylene glycol, propylene glycol, butanediol, hexanediol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, and dipentaerythritol; Aromatic polyol compounds such as biphenols and bisphenols; (poly)oxyalkylene chains such as (poly)oxyethylene chains, (poly)oxypropylene chains, and (poly)oxytetramethylene chains in the molecular structures of the above-mentioned various polyol compounds Introduced (poly)oxyalkylene modified products; lactone modified products obtained by introducing a (poly)lactone structure into the molecular structure of the above-mentioned various polyol compounds, and the like. The polyol compounds other than the carboxyl group-containing polyol compound can be used alone or in combination of two or more.

The method for producing the urethane resin having an acid group and a polymerizable unsaturated bond is not particularly limited, and any method may be used. The production of the urethane resin having an acid group and a polymerizable unsaturated bond may be carried out in an organic solvent if necessary, and a basic catalyst may be used if necessary.

As the organic solvent, the same organic solvent as described above can be used, and the organic solvent can be used alone or in combination of two or more.

As the basic catalyst, the same basic catalyst as described above can be used, and the basic catalyst can be used alone or in combination of two or more.

As the acrylic resin having an acid group and a polymerizable unsaturated bond, for example, a (meth)acrylate compound (α) having a reactive functional group such as a hydroxyl group, a carboxyl group, an isocyanate group, or a glycidyl group is polymerized as an essential component. A reaction obtained by introducing a (meth)acryloyl group by further reacting the acrylic resin intermediate obtained by further reacting a (meth)acrylate compound (β) having a reactive functional group capable of reacting with these functional groups products, and those obtained by reacting a hydroxyl group in the reaction product with a polybasic acid anhydride.

The acrylic resin intermediate may be obtained by copolymerizing the (meth)acrylate compound (α) and, if necessary, other polymerizable unsaturated group-containing compounds. The other polymerizable unsaturated group-containing compounds include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and the like (meth) Alkyl acrylic ester; Alicyclic structure-containing (meth)acrylates such as cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate; phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxy aromatic ring-containing (meth)acrylates such as ethyl acrylate; silyl group-containing (meth)acrylates such as 3-methacryloxypropyltrimethoxysilane; styrene derivatives such as styrene, α-methylstyrene, and chlorostyrene; These can be used alone or in combination of two or more.

The (meth)acrylate compound (β) is not particularly limited as long as it can react with the reactive functional group of the (meth)acrylate compound (α). From the viewpoint of reactivity, the following combinations are preferred: is preferred. That is, when a hydroxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use an isocyanate group-containing (meth)acrylate as the (meth)acrylate compound (β). When a carboxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a glycidyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When an isocyanate group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a hydroxyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When a glycidyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a carboxyl group-containing (meth)acrylate as the (meth)acrylate compound (β). The (meth)acrylate compound (β) can be used alone or in combination of two or more.

The same polybasic acid anhydride as described above can be used as the polybasic acid anhydride, and the polybasic acid anhydrides can be used alone or in combination of two or more.

The method for producing the acrylic resin having an acid group and a polymerizable unsaturated bond is not particularly limited, and any method may be used. The production of the acrylic resin having an acid group and a polymerizable unsaturated bond may be carried out in an organic solvent if necessary, and a basic catalyst may be used if necessary.

As the organic solvent, the same organic solvent as described above can be used, and the organic solvent can be used alone or in combination of two or more.

As the basic catalyst, the same basic catalyst as described above can be used, and the basic catalyst can be used alone or in combination of two or more.

Examples of the amideimide resin having an acid group and a polymerizable unsaturated bond include, for example, an amideimide resin having an acid group and/or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound and/or an epoxy group-containing (meth)acrylate Those obtained by reacting a compound with, if necessary, a compound having one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxyl group, an isocyanate group, a glycidyl group, and an acid anhydride group. be done. The compound having a reactive functional group may or may not have a (meth)acryloyl group.

The amide-imide resin may have either an acid group or an acid anhydride group, or may have both. From the viewpoint of reactivity and reaction control with hydroxyl group-containing (meth)acrylate compounds and (meth)acryloyl group-containing epoxy compounds, it preferably has an acid anhydride group, and both the acid group and the acid anhydride group. It is more preferable to have The acid value of the amide-imide resin is preferably in the range of 60 to 350 mgKOH/g as measured under neutral conditions, that is, under conditions in which ring-opening of acid anhydride groups is not performed. On the other hand, it is preferable that the measured value under the condition that the acid anhydride group is ring-opened, such as in the presence of water, is in the range of 61 to 360 mgKOH/g.

Examples of the amide-imide resin include those obtained by reacting a polyisocyanate compound and a polybasic acid anhydride as starting materials.

As the polyisocyanate compound, the same polyisocyanate compound (a1) as described above can be used, and the polyisocyanate compound can be used alone or in combination of two or more.

As the polybasic acid anhydride, the same polybasic acid anhydride as described above can be used, and the polyisocyanate compound can be used alone or in combination of two or more.

Moreover, the amide-imide resin can also use polybasic acid together as a reaction raw material other than the said polyisocyanate compound and polybasic acid anhydride if needed.

Any compound having two or more carboxyl groups in one molecule can be used as the polybasic acid. For example, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic acid, hexahydro phthalic acid, methylhexahydrophthalic acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane- 2,3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydro naphthalene-1,2-dicarboxylic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid, biphenyltetracarboxylic acid, benzophenonetetracarboxylic acid, and the like. be done. As the polybasic acid, for example, a copolymer of a conjugated diene-based vinyl monomer and acrylonitrile, which has a carboxyl group in its molecule, can also be used. These polybasic acids can be used alone or in combination of two or more.

As the hydroxyl group-containing (meth)acrylate compound, the same hydroxyl group-containing (meth)acrylate compound (B) can be used, and the hydroxyl group-containing (meth)acrylate compound can be used alone or in two types. The above can also be used together.

As the epoxy group-containing (meth)acrylate compound, the same epoxy group-containing (meth)acrylate compound (C) can be used, and the epoxy group-containing (meth)acrylate compound can be used alone. can also be used in combination of two or more.

The method for producing the amide-imide resin having an acid group and a polymerizable unsaturated bond is not particularly limited, and any method may be used. The production of the amide-imide resin having an acid group and a polymerizable unsaturated bond may be carried out in an organic solvent if necessary, and a basic catalyst may be used if necessary.

As the organic solvent, the same organic solvent as described above can be used, and the organic solvent can be used alone or in combination of two or more.

As the basic catalyst, the same basic catalyst as described above can be used, and the basic catalyst can be used alone or in combination of two or more.

Examples of the acrylamide resin having an acid group and a polymerizable unsaturated bond include, for example, a phenolic hydroxyl group-containing compound, an alkylene oxide or an alkylene carbonate, an N-alkoxyalkyl (meth)acrylamide compound, a polybasic acid anhydride, Examples include those obtained by reacting with an unsaturated monobasic acid as necessary.

The phenolic hydroxyl group-containing compound is a compound having at least two phenolic hydroxyl groups in the molecule. Examples of the compound having at least two phenolic hydroxyl groups in the molecule include compounds represented by the following structural formulas (3-1) to (3-4).

In the structural formulas (3-1) to (3-4) above, R ¹ is an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, or a halogen atom. , R ² are each independently a hydrogen atom or a methyl group. In addition, p is 0 or an integer of 1 or more, preferably 0 or an integer of 1 to 3, more preferably 0 or 1, still more preferably 0. q is an integer of 2 or more, preferably 2 or 3; The position of the substituent on the aromatic ring in the above structural formula is arbitrary. For example, the naphthalene ring of structural formula (3-2) may be substituted on any ring, and the structural formula ( In 3-3), any benzene ring present in one molecule may be substituted, and in structural formula (3-4), any benzene ring present in one molecule may be substituted. It indicates that it may be substituted, and indicates that the number of substituents in one molecule is p and q.

Further, as the phenolic hydroxyl group-containing compound, for example, a compound having one phenolic hydroxyl group in the molecule and a compound represented by any of the following structural formulas (x-1) to (x-5) are essential. or a reaction product used as a reaction raw material, or a compound having at least two phenolic hydroxyl groups in the molecule and a compound represented by any of the following structural formulas (x-1) to (x-5): A reaction product used as a raw material can also be used. In addition, a novolac-type phenolic resin that uses one or more compounds having one phenolic hydroxyl group in the molecule as a reaction raw material, and one or more compounds having at least two phenolic hydroxyl groups in the molecule. A novolak-type phenol resin or the like used as a reaction raw material can also be used.

［式（ｘ－１）中、ｈは０または１である。式（ｘ－２）～（ｘ－５）中、Ｒ^３は、炭素原子数１～２０のアルキル基、炭素原子数１～２０のアルコキシ基、アリール基、ハロゲン原子の何れかであり、ｉは、０または１～４の整数である。式（ｘ－２）、（ｘ－３）及び（ｘ－５）中、Ｚは、ビニル基、ハロメチル基、ヒドロキシメチル基、アルキルオキシメチル基の何れかである。式（ｘ－５）中、Ｙは、炭素原子数１～４のアルキレン基、酸素原子、硫黄原子、カルボニル基の何れかであり、ｊは１～４の整数である。］

[In formula (x−1), h is 0 or 1. In formulas (x-2) to (x-5), R ³ is an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, or a halogen atom, i is an integer of 0 or 1-4. In formulas (x-2), (x-3) and (x-5), Z is a vinyl group, a halomethyl group, a hydroxymethyl group or an alkyloxymethyl group. In formula (x-5), Y is an alkylene group having 1 to 4 carbon atoms, an oxygen atom, a sulfur atom or a carbonyl group, and j is an integer of 1 to 4. ]

Examples of the compound having one phenolic hydroxyl group in the molecule include compounds represented by the following structural formulas (2-1) to (2-4).

In the structural formulas (4-1) to (4-4) above, R ⁴ is an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, or a halogen atom. , R ⁵ are each independently a hydrogen atom or a methyl group. In addition, p is 0 or an integer of 1 or more, preferably 0 or an integer of 1 to 3, more preferably 0 or 1, still more preferably 0. The position of the substituent on the aromatic ring in the above structural formula is arbitrary. For example, the naphthalene ring of structural formula (4-2) may be substituted on any ring, and the structural formula ( In 4-3), any benzene ring present in one molecule may be substituted, and in structural formula (4-4), any benzene ring present in one molecule may be substituted. Indicates that substitution is allowed.

As the compound having at least two phenolic hydroxyl groups in the molecule, the compounds represented by the above structural formulas (3-1) to (3-4) can be used.

These phenolic hydroxyl group-containing compounds can be used alone or in combination of two or more.

Examples of the alkylene oxide include ethylene oxide, propylene oxide, butylene oxide, and pentylene oxide. Among these, ethylene oxide or propylene oxide is preferable because a curable resin composition capable of forming a cured product having excellent heat resistance and elongation can be obtained. The alkylene oxides can be used alone or in combination of two or more.

Examples of the alkylene carbonate include ethylene carbonate, propylene carbonate, butylene carbonate, pentylene carbonate, and the like. Among these, ethylene carbonate or propylene carbonate is preferable because a curable resin composition capable of forming a cured product having excellent heat resistance and elongation can be obtained. The alkylene carbonates can be used alone or in combination of two or more.

Examples of the N-alkoxyalkyl(meth)acrylamide compounds include N-methoxymethyl(meth)acrylamide, N-ethoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, and N-methoxyethyl(meth)acrylamide. , N-ethoxyethyl (meth)acrylamide, N-butoxyethyl (meth)acrylamide and the like. The N-alkoxyalkyl(meth)acrylamide compounds can be used alone or in combination of two or more.

As the polybasic acid anhydride, the same polybasic acid anhydrides as described above can be used, and the polybasic acid anhydrides can be used alone or in combination of two or more.

As the unsaturated monobasic acid, the same unsaturated monobasic acid as described above can be used, and the unsaturated monobasic acid can be used alone or in combination of two or more.

The method for producing the acrylamide resin having an acid group and a polymerizable unsaturated bond is not particularly limited, and any method may be used. The production of the acrylamide resin having an acid group and a polymerizable unsaturated bond may be carried out in an organic solvent, if necessary, and if necessary, a basic catalyst and an acidic catalyst may be used.

As the organic solvent, the same organic solvent as described above can be used, and the organic solvent can be used alone or in combination of two or more.

As the basic catalyst, the same basic catalyst as described above can be used, and the basic catalyst can be used alone or in combination of two or more.

As the acidic catalyst, the same acidic catalyst as described above can be used, and the acidic catalyst can be used alone or in combination of two or more.

The amount of the resin (E) having an acid group and a polymerizable unsaturated bond is preferably in the range of 10 to 900 parts by mass with respect to 100 parts by mass of the acid group-containing (meth)acrylate resin of the present invention.

Examples of the various (meth)acrylate monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2 - aliphatic mono (meth) acrylate compounds such as ethylhexyl (meth) acrylate and octyl (meth) acrylate; alicyclic mono (meth) acrylate compounds such as cyclohexyl (meth) acrylate, isobornyl (meth) acrylate and adamantyl mono (meth) acrylate Acrylate compounds; heterocyclic mono (meth) acrylate compounds such as glycidyl (meth) acrylate and tetrahydrofurfuryl acrylate; benzyl (meth) acrylate, phenyl (meth) acrylate, phenylbenzyl (meth) acrylate, phenoxy (meth) acrylate, phenoxyethyl (meth)acrylate, phenoxyethoxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, phenoxybenzyl (meth)acrylate, benzylbenzyl (meth)acrylate, phenylphenoxyethyl (meth)acrylate, etc. Mono (meth) acrylate compounds such as aromatic mono (meth) acrylate compounds of: (poly) oxyethylene chain, (poly) oxypropylene chain, (poly) oxy in the molecular structure of the various mono (meth) acrylate monomers (Poly)oxyalkylene-modified mono(meth)acrylate compounds into which polyoxyalkylene chains such as tetramethylene chains are introduced; (Meth)acrylate compounds; aliphatics such as ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butanediol di(meth)acrylate, hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate Di(meth)acrylate compounds; 1,4-cyclohexanedimethanol di(meth)acrylate, norbornane di(meth)acrylate, norbornanedimethanol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, tricyclodecanedi Alicyclic di(meth)acrylate compounds such as methanol di(meth)acrylate; Aromatic di(meth)acrylate compounds such as nord di(meth)acrylate; (poly)oxyethylene chain, (poly)oxypropylene chain, (poly)oxytetramethylene in the molecular structure of the various di(meth)acrylate compounds polyoxyalkylene-modified di(meth)acrylate compound into which a (poly)oxyalkylene chain such as a chain is introduced; ) acrylate compound; aliphatic tri(meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate and glycerin tri(meth)acrylate; (poly)oxyethylene chain in the molecular structure of the aliphatic tri(meth)acrylate compound , (poly)oxypropylene chain, (poly)oxytetramethylene chain, etc. (poly)oxyalkylene-modified tri(meth)acrylate compound introduced with (poly)oxyalkylene chain; molecule of the aliphatic tri(meth)acrylate compound Lactone-modified tri(meth)acrylate compounds having a (poly)lactone structure introduced into the structure; tetrafunctional or higher such as pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc. Aliphatic poly (meth) acrylate compound; in the molecular structure of the aliphatic poly (meth) acrylate compound (poly) oxyethylene chain, (poly) oxypropylene chain, (poly) oxytetramethylene chain such as (poly) Tetra- or more functional (poly)oxyalkylene-modified poly(meth)acrylate compound into which an oxyalkylene chain is introduced; Tetra- or more-functional lactone into which a (poly)lactone structure is introduced into the molecular structure of the aliphatic poly(meth)acrylate compound A modified poly(meth)acrylate compound and the like can be mentioned. The various (meth)acrylate monomers can be used alone or in combination of two or more.

The curable resin composition of the present invention may optionally contain a curing agent, a curing accelerator, an organic solvent, inorganic fine particles or polymer fine particles, a pigment, an antifoaming agent, a viscosity modifier, a leveling agent, a flame retardant, Various additives such as storage stabilizers can also be contained.

The curing agent is not particularly limited as long as it has a functional group capable of reacting with the carboxy group in the acid group-containing (meth)acrylate resin, and examples thereof include epoxy resins. Examples of the epoxy resin include bisphenol type epoxy resin, phenylene ether type epoxy resin, naphthylene ether type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, Bisphenol novolak type epoxy resin, naphthol novolac type epoxy resin, naphthol-phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene-phenol addition Reactive epoxy resins, biphenylaralkyl-type epoxy resins, fluorene-type epoxy resins, xanthene-type epoxy resins, dihydroxybenzene-type epoxy resins, trihydroxybenzene-type epoxy resins, and the like can be mentioned. These epoxy resins can be used alone or in combination of two or more. In addition, among these, since a curable resin composition capable of forming a cured product having excellent heat resistance and elongation can be obtained, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol novolak type epoxy resin, Preferred are novolac type epoxy resins such as naphthol novolac type epoxy resins, naphthol-phenol co-condensed novolac type epoxy resins, naphthol-cresol co-condensed novolac type epoxy resins, and those having a softening point in the range of 20 to 120° C. are particularly preferred.

The curing accelerator accelerates the curing reaction of the curing agent. When an epoxy resin is used as the curing agent, a phosphorus compound, an amine compound, imidazole, an organic acid metal salt, a Lewis acid, Amine complex salts and the like can be mentioned. These curing accelerators can be used alone or in combination of two or more. Moreover, the amount of the curing accelerator added is preferably in the range of 1 to 10 parts by mass with respect to 100 parts by mass of the curing agent.

As the organic solvent, the same organic solvent as described above can be used, and the organic solvent can be used alone or in combination of two or more.

The cured product of the present invention can be obtained by irradiating the curable resin composition with an active energy ray. Examples of the active energy rays include ionizing radiation such as ultraviolet rays, electron beams, α rays, β rays, and γ rays. When ultraviolet rays are used as the active energy rays, the irradiation may be performed in an atmosphere of an inert gas such as nitrogen gas or in an air atmosphere in order to efficiently perform the curing reaction using the ultraviolet rays.

An ultraviolet lamp is generally used as a source of ultraviolet light from the viewpoint of practicality and economy. Specific examples include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, gallium lamps, metal halide lamps, sunlight, and LEDs.

The integrated amount of active energy rays is not particularly limited, but is preferably 10 to 5,000 mJ/cm ² , more preferably 50 to 1,000 mJ/cm ² . It is preferable that the integrated amount of light is within the above range because the generation of uncured portions can be prevented or suppressed.

The irradiation with the active energy ray may be performed in one step, or may be performed in two or more steps.

In addition, since the cured product of the present invention has excellent heat resistance, it can be It can be suitably used as an adhesive layer between an element and a circuit board. In addition, it can be suitably used for thin film transistor protective films, liquid crystal color filter protective films, color filter pigment resists, black matrix resists, spacers, and the like in thin display applications such as LCDs and OELDs. Among these, it can be preferably used for solder resist applications.

The resin material for solder resist of the present invention comprises the curable resin composition.

The resist member of the present invention is, for example, a photomask in which the desired pattern is formed after applying the solder resist resin material on a substrate and volatilizing and drying the organic solvent at a temperature range of about 60 to 100 ° C. It can be obtained by exposing to active energy rays through a ray, developing an unexposed portion with an alkaline aqueous solution, and further curing by heating at a temperature in the range of about 140 to 200°C.

Examples of the substrate include metal foil such as copper foil and aluminum foil.

The present invention will be described in more detail below with examples and comparative examples.

In the examples of the present application, the acid value of the acid group-containing (meth)acrylate resin was measured by the neutralization titration method of JIS K 0070 (1992).

In the examples of the present application, the molecular weight of the acid group-containing (meth)acrylate resin was measured by GPC under the following conditions.

Measuring device: "HLC-8220 GPC" manufactured by Tosoh Corporation,
Column: Guard column "HXL-L" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G3000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G4000HXL" manufactured by Tosoh Corporation
Detector: RI (differential refractometer)
Data processing: "GPC-8020 model II version 4.10" manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40°C
Developing solvent Tetrahydrofuran
Flow rate 1.0 ml/min Standard: The following monodisperse polystyrene with a known molecular weight was used in accordance with the measurement manual of "GPC-8020 Model II Version 4.10".
(Polystyrene used)
"A-500" manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
"F-1" manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
"F-4" manufactured by Tosoh Corporation
"F-10" manufactured by Tosoh Corporation
"F-20" manufactured by Tosoh Corporation
"F-40" manufactured by Tosoh Corporation
"F-80" manufactured by Tosoh Corporation
"F-128" manufactured by Tosoh Corporation
Sample: 1.0% by mass of tetrahydrofuran solution in terms of resin solid content filtered through a microfilter (50 μl)

In this example, the liquid chromatography chart was measured under the following conditions.
[Measurement condition]
Apparatus: "LCMS-2010EV" manufactured by Shimadzu Corporation
Data processing: "LCMS Solution" manufactured by Shimadzu Corporation
Column: "ODS-100V" manufactured by Tosoh Corporation (2.0 mm ID × 150 mm, 3 µm) 40 ° C.
Eluent: water/acetonitrile, 0.4 mL/min Detector: PDA, MS
Sample preparation:1. Dissolve 50 mg of sample in 10 ml of acetonitrile (for LC)
2. Vortex for 30 seconds
3. Set aside for 30 minutes
4. Calculation of the area ratio of passing liquid through a 0.2 μm filtration filter and using it as a measurement sample: Calculated at a UV wavelength of 210 nm

(Example 1: Production of acid group-containing (meth)acrylate resin (1))
Into a flask equipped with a thermometer, a stirrer, and a reflux condenser, 111 parts by mass of isophorone diisocyanate, bisphenol A type epoxy resin (manufactured by DIC Corporation "EPICLON 860", epoxy equivalent: 240 g / equivalent) (hereinafter referred to as "epoxy resin (1)”.) 24 parts by mass, tetra-n-butylphosphonium bromide (“TBP-BB” manufactured by Hokko Chemical Industry Co., Ltd.) (hereinafter abbreviated as “basic catalyst (1)”) 0 .2 parts by mass were added and reacted at 180° C. for 6 hours in a nitrogen atmosphere. Next, 231 parts by mass of diethylene glycol monomethyl ether acetate, 125 parts by mass of trimellitic anhydride, and 0.6 parts by mass of dibutylhydroxytoluene are added and reacted at 160° C. for 6 hours under a nitrogen atmosphere until the isocyanate group content is 0.1. After confirming that the content was below mass %, an amide-imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.43 mol/kg. Then, 0.2 parts by mass of methoquinone, pentaerythritol polyacrylate mixture (manufactured by Toagosei Co., Ltd., "Aronix M-306", pentaerythritol triacrylate content of about 67%, hydroxyl value of 159.7 mg KOH / g) were added to the resulting amide imide resin. ) (hereinafter abbreviated as “hydroxyl group-containing (meth)acrylate compound (1)”) and 1.7 parts by mass of triphenylphosphine were added and reacted at 110° C. for 3 hours while blowing air. Then, 73 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 6 hours. Furthermore, 50 parts by mass of succinic anhydride and 58 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (1). The acid group-containing (meth)acrylate resin (1) had a solid content acid value of 76 mgKOH/g and a weight average molecular weight of 3,890.

(Example 2: Production of acid group-containing (meth)acrylate resin (2))
111 parts by mass of isophorone diisocyanate, 24 parts by mass of epoxy resin (1), and 0.2 parts by mass of basic catalyst (1) were added to a flask equipped with a thermometer, a stirrer, and a reflux condenser. The reaction was carried out at 180°C for 6 hours. Next, 231 parts by mass of diethylene glycol monomethyl ether acetate, 125 parts by mass of trimellitic anhydride, and 0.6 parts by mass of dibutylhydroxytoluene are added and reacted at 160° C. for 6 hours under a nitrogen atmosphere until the isocyanate group content is 0.1. After confirming that the content was below mass %, an amide-imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.43 mol/kg. 0.2 parts by mass of methoquinone, 29 parts by mass of hydroxyl group-containing (meth)acrylate compound (1) and 1.8 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110°C for 3 hours while blowing air. Next, 3,4-epoxycyclohexylmethyl methacrylate (“Cychromer M100” manufactured by Daicel Corporation, epoxy group equivalent weight: 207 g/equivalent) (hereinafter abbreviated as “epoxy group-containing (meth)acrylate compound (1)”). ) was added and reacted at 110° C. for 7 hours. Furthermore, 51 parts by mass of succinic anhydride and 97 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (2). The acid group-containing (meth)acrylate resin (2) had a solid content acid value of 72 mgKOH/g and a weight average molecular weight of 4,000.

(Example 3: Production of acid group-containing (meth)acrylate resin (3))
111 parts by mass of isophorone diisocyanate, 24 parts by mass of epoxy resin (1), and 0.2 parts by mass of basic catalyst (1) were added to a flask equipped with a thermometer, a stirrer, and a reflux condenser. The reaction was carried out at 180°C for 6 hours. Then, 235 parts by mass of diethylene glycol monomethyl ether acetate, 129 parts by mass of cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, and 0.6 parts by mass of dibutylhydroxytoluene were added, and the mixture was heated at 160°C under a nitrogen atmosphere. After reacting for 6 hours, it was confirmed that the isocyanate group content was 0.1% by mass or less, and an amide imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.43 mol/kg. 0.2 parts by mass of methoquinone, 30 parts by mass of hydroxyl group-containing (meth)acrylate compound (1) and 1.7 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 3 hours while blowing air. Then, 76 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 6 hours. Furthermore, 79 parts by mass of tetrahydrophthalic anhydride and 82 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (3). The acid group-containing (meth)acrylate resin (3) had a solid content acid value of 74 mgKOH/g and a weight average molecular weight of 3,780.

(Example 4: Production of acid group-containing (meth)acrylate resin (4))
111 parts by mass of isophorone diisocyanate, 24 parts by mass of epoxy resin (1), and 0.2 parts by mass of basic catalyst (1) were added to a flask equipped with a thermometer, a stirrer, and a reflux condenser. The reaction was carried out at 180°C for 6 hours. Then, 235 parts by mass of diethylene glycol monomethyl ether acetate, 129 parts by mass of cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, and 0.6 parts by mass of dibutylhydroxytoluene were added, and the mixture was heated at 160°C under a nitrogen atmosphere. After reacting for 6 hours, it was confirmed that the isocyanate group content was 0.1% by mass or less, and an amide imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.43 mol/kg. 0.2 parts by mass of methoquinone, 30 parts by mass of hydroxyl group-containing (meth)acrylate compound (1), and 1.8 parts by mass of triphenylphosphine were added and reacted at 110°C for 3 hours while blowing air. Then, 111 parts by mass of epoxy group-containing (meth)acrylate compound (1) was added and reacted at 110° C. for 7 hours. Furthermore, 53 parts by mass of succinic anhydride and 101 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (4). The acid group-containing (meth)acrylate resin (4) had a solid content acid value of 73 mgKOH/g and a weight average molecular weight of 3,910.

(Example 5: Production of acid group-containing (meth)acrylate resin (5))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 111 parts by mass of isophorone diisocyanate, bisphenol F type epoxy resin (manufactured by DIC Corporation "EPICLON 830-S", epoxy equivalent: 170 g / equivalent) (hereinafter referred to as " 17 parts by mass of the basic catalyst (1) and 0.2 parts by mass of the basic catalyst (1) were added and reacted at 180° C. for 6 hours in a nitrogen atmosphere. Next, 224 parts by mass of diethylene glycol monomethyl ether acetate, 125 parts by mass of trimellitic anhydride, and 0.6 parts by mass of dibutylhydroxytoluene are added and reacted at 160° C. for 6 hours under a nitrogen atmosphere until the isocyanate group content is 0.1. After confirming that the content was below mass %, an amide-imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.45 mol/kg. 0.2 parts by mass of methoquinone, 28 parts by mass of hydroxyl group-containing (meth)acrylate compound (1) and 1.7 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110°C for 3 hours while blowing air. Then, 76 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 6 hours. Furthermore, 52 parts by mass of succinic anhydride and 63 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (5). The acid group-containing (meth)acrylate resin (5) had a solid content acid value of 80 mgKOH/g and a weight average molecular weight of 3,590.

(Example 6: Production of acid group-containing (meth)acrylate resin (6))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 111 parts by mass of isophorone diisocyanate, bisphenol A type epoxy resin (manufactured by DIC Corporation "EPICLON 850-S", epoxy equivalent: 187 g / equivalent) (hereinafter, " Epoxy resin (3)") and 0.2 parts by mass of basic catalyst (1) were added and reacted at 180° C. for 6 hours in a nitrogen atmosphere. Then, 224 parts by mass of diethylene glycol monomethyl ether acetate, 136 parts by mass of trimellitic anhydride, and 0.6 parts by mass of dibutylhydroxytoluene are added and reacted at 160° C. for 6 hours under a nitrogen atmosphere until the isocyanate group content is 0.1. After confirming that the content was below mass %, an amide-imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.19 mol/kg. 0.2 parts by mass of methoquinone, 28 parts by mass of hydroxyl group-containing (meth)acrylate compound (1) and 1.6 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110°C for 3 hours while blowing air. Then, 77 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 6 hours. Furthermore, 53 parts by mass of succinic anhydride and 64 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (6). The acid group-containing (meth)acrylate resin (6) had a solid content acid value of 76 mgKOH/g and a weight average molecular weight of 3,660.

(Example 7: Production of acid group-containing (meth)acrylate resin (7))
111 parts by mass of isophorone diisocyanate, 30 parts by mass of epoxy resin (3), and 0.2 parts by mass of basic catalyst (1) were added to a flask equipped with a thermometer, a stirrer, and a reflux condenser. The reaction was carried out at 180°C for 6 hours. Then, 228 parts by mass of diethylene glycol monomethyl ether acetate, 113 parts by mass of trimellitic anhydride, and 0.6 parts by mass of dibutylhydroxytoluene are added and reacted at 160° C. for 6 hours under a nitrogen atmosphere until the isocyanate group content is 0.1. After confirming that the content was below mass %, an amide-imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.71 mol/kg. 0.2 parts by mass of methoquinone, 29 parts by mass of hydroxyl group-containing (meth)acrylate compound (1), and 1.6 parts by mass of triphenylphosphine were added and reacted at 110°C for 3 hours while blowing air. Then, 62 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 6 hours. Furthermore, 43 parts by mass of succinic anhydride and 67 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (7). The acid group-containing (meth)acrylate resin (7) had a solid content acid value of 70 mgKOH/g and a weight average molecular weight of 4,220.

(Example 8: Production of acid group-containing (meth)acrylate resin (8))
Into a flask equipped with a thermometer, a stirrer, and a reflux condenser, 244 parts by mass of isocyanurate-modified isophorone diisocyanate ("VESTANAT T-1890/100" manufactured by EVONIK, isocyanate group content 17.2% by mass), 19 parts by mass of epoxy resin (3) and 0.2 parts by mass of basic catalyst (1) were added and reacted at 180° C. for 6 hours in a nitrogen atmosphere. Then, 692 parts by mass of diethylene glycol monomethyl ether acetate, 557 parts by mass of trimellitic anhydride, and 1.7 parts by mass of dibutylhydroxytoluene are added and reacted at 160° C. for 6 hours under a nitrogen atmosphere until the isocyanate group content is 0.1. After confirming that the content was below mass %, an amide-imide resin was obtained. The content of oxazolidone rings in this amideimide resin was 0.14 mol/kg. 0.6 parts by mass of methoquinone, 217 parts by mass of the hydroxyl group-containing (meth)acrylate compound (1) and 5.9 parts by mass of triphenylphosphine were added and reacted at 110°C for 3 hours while blowing air. Then, 264 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 7 hours. Furthermore, 181 parts by mass of succinic anhydride and 416 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110° C. for 4 hours to obtain an acid group-containing (meth)acrylate resin (8). The acid group-containing (meth)acrylate resin (8) had a solid content acid value of 78 mgKOH/g and a weight average molecular weight of 4,020.

(Comparative Example 1: Production of acid group-containing acrylate resin (C1))
A flask equipped with a thermometer, a stirrer, and a reflux condenser was charged with 101 parts by mass of diethylene glycol monomethyl ether acetate, and ortho-cresol novolac type epoxy resin ("EPICLON N-680" manufactured by DIC Corporation, epoxy equivalent: 214 g/equivalent). ) was dissolved, 4 parts by mass of dibutylhydroxytoluene as an antioxidant and 0.4 parts by mass of methoquinone as a thermal polymerization inhibitor were added, and then 144 parts by mass of acrylic acid and 1.6 parts by mass of triphenylphosphine were added. Then, an esterification reaction was carried out at 120° C. for 10 hours while blowing air. Thereafter, 311 parts by mass of diethylene glycol monomethyl ether acetate and 160 parts by mass of tetrahydrophthalic anhydride were added and reacted at 110° C. for 2.5 hours to obtain the desired acid group-containing acrylate resin (C1). The solid content acid value of this acid group-containing acrylate resin (C1) was 85 mgKOH/g.

(Example 9: Preparation of curable resin composition (1))
Acid-group-containing (meth)acrylate resin (1) obtained in Example 1, ortho-cresol novolac-type epoxy resin (manufactured by DIC Corporation "EPICLON N-680" as a curing agent, epoxy equivalent: 214 g/equivalent), photopolymerization initiation 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one ("Omnirad-907" manufactured by IGM) as an agent and diethylene glycol monomethyl ether acetate as an organic solvent in parts by mass shown in Table 1. By blending, a curable resin composition (1) was obtained.

(Examples 10 to 16: Preparation of curable resin compositions (2) to (8))
Instead of the acid group-containing (meth)acrylate resin (1) used in Example 10, the acid group-containing (meth)acrylate resins (2) to (8) obtained in Examples 2 to 8 were used, respectively. , to obtain curable resin compositions (2) to (8) in the same manner as in Example 9.

(Comparative Example 2: Preparation of curable resin composition (C2))
Curability was determined in the same manner as in Example 9 except that the acid group-containing (meth)acrylate resin (1) used in Example 9 was replaced with the acid group-containing acrylate resin (C1) obtained in Comparative Example 1. A resin composition (C2) was obtained.

The following evaluations were performed using the curable resin compositions (1) to (8) and (C2) obtained in the above examples and comparative examples.

[Heat resistance evaluation method]
<Preparation of test piece 1>
The curable resin compositions obtained in Examples and Comparative Examples were applied on a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 μm) with a 50 μm applicator and dried at 80 ° C. for 30 minutes. rice field. After irradiating with ultraviolet rays of 1000 mJ/cm ² using a metal halide lamp, it was heated at 160° C. for 1 hour. The cured product was peeled off from the copper foil to obtain test piece 1 (cured product).

The test piece 1 was cut into a size of 6 mm × 40 mm, and a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device “RSA II” manufactured by Rheometric Co., tension method: frequency 1 Hz, temperature increase rate 3 ° C./min) was used. The temperature at which the change in elastic modulus is maximum (the rate of change in tan δ is the largest) was evaluated as the glass transition temperature (Tg).

[Method for measuring elongation]
Elongation measurements were based on tensile tests.
<Production of test piece 2>
The curable resin compositions obtained in Examples and Comparative Examples were applied onto a glass substrate with a 50 μm applicator and dried at 80° C. for 30 minutes. After irradiating ultraviolet rays of 1000 mJ/cm ² using a metal halide lamp, it was heated at 160° C. for 1 hour. The cured product was peeled off from the glass substrate to obtain test piece 2 (cured product).

<Tensile test>
The test piece 2 was cut into a size of 10 mm×80 mm, and a tensile test was performed on the test piece under the following measurement conditions using a precision universal testing machine Autograph “AG-IS” manufactured by Shimadzu Corporation. The elongation (%) until the test piece broke was measured and evaluated according to the following criteria.

Measurement conditions: temperature 23° C., humidity 50%, distance between gauge lines 20 mm, distance between fulcrums 20 mm, tensile speed 10 mm/min.

The compositions and evaluation results of the curable resin compositions (1) to (8) prepared in Examples 9 to 16 and the curable resin composition (C2) prepared in Comparative Example 2 are shown in Table 1.

The "curing agent" in Table 1 indicates an ortho-cresol novolac type epoxy resin ("EPICLON N-680" manufactured by DIC Corporation, epoxy equivalent: 214 g/equivalent).

"Organic solvent" in Table 1 indicates diethylene glycol monomethyl ether acetate.

"Photopolymerization initiator" in Table 1 indicates "Omnirad-907" manufactured by IGM.

Examples 9 to 16 shown in Table 1 are examples of curable resin compositions using the acid group-containing (meth)acrylate resin of the present invention. It was confirmed that this curable resin composition had excellent heat resistance and elongation in the cured product.

On the other hand, Comparative Example 2 is an example of a curable resin composition that does not use the acid group-containing (meth)acrylate resin of the present invention. It was confirmed that this curable resin composition was remarkably inadequate in heat resistance in the cured product, and also inadequate in elongation.

Claims (13)

An amide imide resin (A) having an acid group and/or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound (B), an epoxy group-containing (meth)acrylate compound (C), and a polycarboxylic anhydride (D) are essential An acid group-containing (meth)acrylate resin used as a reaction raw material of
The amideimide resin (A) contains a polyisocyanate compound (a1), an epoxy resin (a2) and a polycarboxylic anhydride (a3) as essential reaction raw materials,
An acid group-containing (meth)acrylate resin, characterized in that the total content of the components (A) to (D) in the reaction raw materials for the acid group-containing (meth)acrylate resin is 80% by mass or more. The acid group-containing (meth)acrylate resin according to claim 1, wherein the amideimide resin (A) has an oxazolidone ring. 2. The acid group-containing (meth)acrylate resin according to claim 1, wherein the polyisocyanate compound (a1) is an aliphatic diisocyanate or an alicyclic diisocyanate. 2. The acid group-containing (meth)acrylate resin according to claim 1, wherein said polycarboxylic anhydride (D) is an aliphatic polycarboxylic anhydride and/or an alicyclic polycarboxylic anhydride. The acid group-containing (meth)acid group-containing (meth)acid group according to claim 1 , wherein the amideimide resin (A) has an oxazolidone ring, and the content of the oxazolidone ring in the amideimide resin (A) is 0.70 mol/kg or less. Acrylate resin. The amideimide resin (A) is a reaction product of an intermediate reaction product of the polyisocyanate compound (a1) and the epoxy resin (a2) and the polycarboxylic anhydride (a3). 2. The acid group-containing (meth)acrylate resin according to 1. A curable resin composition comprising the acid group-containing (meth)acrylate resin according to any one of claims 1 to 6 and a photopolymerization initiator. 8. The curable resin composition according to claim 7, further comprising an organic solvent and a curing agent. Furthermore, the curing according to claim 8, which contains a resin (E) having an acid group and a polymerizable unsaturated bond other than the acid group-containing (meth)acrylate resin according to any one of claims 1 to 6. elastic resin composition. A cured product, which is a cured reaction product of the curable resin composition according to any one of claims 7 to 9. An insulating material comprising the curable resin composition according to any one of claims 7 to 9. A resin material for a solder resist, comprising the curable resin composition according to any one of claims 7 to 9. A resist member comprising the resin material for solder resist according to claim 12 .