JP7151411B2 - Acid group-containing (meth)acrylate resin, curable resin composition, cured product, insulating material, resin material for solder resist, and resist member - Google Patents

Description

The present invention provides an acid group-containing (meth)acrylate resin excellent in heat resistance and substrate adhesion in a cured product, a curable resin composition containing the same, an insulating material comprising the curable resin composition, and a solder resist. The present invention relates to resin materials and resist members.

In recent years, acid group-containing epoxy acrylate resins obtained by reacting acid anhydrides after acrylated epoxy resins with acrylic acid have been widely used as resin materials for solder resists for printed wiring boards. Various properties such as excellent heat resistance and adhesion to a substrate in a cured product are required for the solder resist resin material.

As a conventionally known resin material for solder resist, active energy ray-curing obtained by reacting a reaction product of a novolak type epoxy resin and an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride Resins are known (see, for example, Patent Document 1 below), but although they are excellent in heat resistance in cured products, they do not satisfy the increasingly increasing demand for substrate adhesion in the future. It was not sufficient for market demand.

Therefore, there has been a demand for a material that is excellent in heat resistance and adhesion to a substrate in a cured product.

JP-A-61-243869

The problem to be solved by the present invention consists of an acid group-containing (meth)acrylate resin excellent in heat resistance and adhesion to a substrate in a cured product, a curable resin composition containing the same, and the curable resin composition. An object of the present invention is to provide an insulating material, a solder resist resin material, and a resist member.

As a result of intensive studies to solve the above problems, the present inventors have found that an amideimide resin (A) having an acid group or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound (B), an epoxy group-containing (meth) By using an acid group-containing (meth)acrylate resin characterized by using an acrylate compound (C), a polycarboxylic anhydride (D) and an isocyanate group-containing (meth)acrylate compound (E) as essential reaction raw materials , found that the above problems can be solved, and completed the present invention.

That is, the present invention provides an amideimide resin (A) having an acid group or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound (B), an epoxy group-containing (meth)acrylate compound (C), a polycarboxylic anhydride ( D) and an isocyanate group-containing (meth)acrylate compound (E) as essential reaction raw materials, an acid group-containing (meth)acrylate resin, a curable resin composition containing the same, and the curable resin composition The present invention relates to a cured product, an insulating material, a resin material for solder resist, and a resist member.

Since the acid-group-containing (meth)acrylate resin of the present invention is excellent in heat resistance and substrate adhesion in a cured product, it can be suitably used as an insulating material, a solder resist resin material, and a resist member.

The present invention will be described in detail below.
The acid group-containing (meth)acrylate resin of the present invention includes an amideimide resin (A) having an acid group or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound (B), and an epoxy group-containing (meth)acrylate compound (C). , a polycarboxylic anhydride (D) and an isocyanate group-containing (meth)acrylate compound (E) as essential reaction raw materials.

In addition, in this invention, "(meth)acrylate" means an acrylate and/or a methacrylate. Moreover, "(meth)acryloyl" means acryloyl and/or methacryloyl. Furthermore, "(meth)acryl" means acryl and/or methacryl.

The amide-imide resin (A) having an acid group or an acid anhydride group may have either one of the acid group or the acid anhydride group, or may have both. Among them, from the viewpoint of reactivity and reaction control with the hydroxyl group-containing (meth)acrylate compound (B) and the epoxy group-containing (meth)acrylate compound (C), it is preferable to have an acid anhydride group. , preferably has both an acid group and an acid anhydride group. The acid value of the amide-imide resin (A) is preferably in the range of 60 to 350 mgKOH/g as measured under neutral conditions, that is, under conditions where the acid anhydride group is not ring-opened. On the other hand, it is preferable that the measured value under the condition that the acid anhydride group is ring-opened, such as in the presence of water, is in the range of 61 to 360 mgKOH/g. In the present invention, the acid value is a value measured by the neutralization titration method of JIS K 0070 (1992).

The specific structure and production method of the amide imide resin (A) are not particularly limited, and general amide imide resins and the like can be widely used. Concretely, there is a case where a polyisocyanate compound (a1) and a polycarboxylic acid or its acid anhydride (a2) are used as reaction raw materials.

Examples of the polyisocyanate compound (a1) include aliphatic diisocyanate compounds such as butane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate; Alicyclic diisocyanate compounds such as isophorone diisocyanate, hydrogenated xylylene diisocyanate, and hydrogenated diphenylmethane diisocyanate; Aromatic diisocyanate compounds such as diisocyanato-3,3′-dimethylbiphenyl and o-tolidine diisocyanate; polymethylene polyphenyl polyisocyanate having a repeating structure represented by the following structural formula (1); isocyanurate modified products thereof, biuret Modified products, allophanate modified products and the like can be mentioned. In addition, these polyisocyanate compounds can be used alone or in combination of two or more.

［式（１）中、Ｒ^１はそれぞれ独立して、水素原子、または炭素原子数１～６の炭化水素基の何れかである。Ｒ^２はそれぞれ独立して、炭素原子数１～４のアルキル基、または構造式（１）で表される構造部位と＊印が付されたメチレン基を介して連結する結合点の何れかである。ｌは０または１～３の整数であり、ｍは１～１５の整数である。］

[In formula (1), each R ¹ is independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms. Each R ² is independently either an alkyl group having 1 to 4 carbon atoms, or a point of attachment that connects the structural site represented by Structural Formula (1) via a methylene group marked with *. be. l is 0 or an integer of 1-3; m is an integer of 1-15; ]

Among these, the above-mentioned alicyclic diisocyanate compound or its modified form is preferred, and the alicyclic diisocyanate or its isocyanurate modified form is preferred in that it becomes an acid group-containing (meth)acrylate resin having excellent solvent solubility. In addition, the aliphatic diisocyanate compound or its modified form is preferable in terms of becoming an acid group-containing (meth)acrylate resin having very excellent heat resistance and substrate adhesion in the cured product, and the aliphatic diisocyanate or its isocyanurate modified form is preferred. Furthermore, the ratio of the total mass of the alicyclic diisocyanate compound or modified product thereof and the aliphatic diisocyanate compound or modified product thereof to the total mass of the polyisocyanate compound (a1) is preferably 70% by mass or more, It is more preferably 90% by mass or more. When the alicyclic diisocyanate compound or modified product thereof and the aliphatic diisocyanate compound or modified product thereof are used together, the mass ratio of the two is preferably in the range of 20/80 to 80/20.

As the polycarboxylic acid or its acid anhydride (a2), the specific structure is not particularly limited as long as it is a compound having a plurality of carboxyl groups in the molecular structure or its acid anhydride, and a wide variety of compounds can be used. . The polycarboxylic acid or its acid anhydride (a2) may be used alone or in combination of two or more. In order for the amideimide resin (A) to have both an amide group and an imide group, both a carboxyl group and an acid anhydride group must be present in the system. A compound having both a carboxyl group and an acid anhydride group in the molecule may be used, or a compound having a carboxyl group and a compound having an acid anhydride group may be used in combination.

Examples of the polycarboxylic acid or its acid anhydride (a2) include, for example, an aliphatic polycarboxylic acid compound or its acid anhydride, an alicyclic polycarboxylic acid compound or its acid anhydride, an aromatic polycarboxylic acid compound or its acid anhydride.

The aliphatic polycarboxylic acid compound or its acid anhydride may have an aliphatic hydrocarbon group of either a straight chain type or a branched type, and may have an unsaturated bond in its structure. Examples of the aliphatic polycarboxylic acid compounds or acid anhydrides thereof include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, and fumaric acid. acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, acid anhydrides thereof, and the like.

As the alicyclic polycarboxylic acid compound or its anhydride, in the present invention, an alicyclic polycarboxylic acid compound or its anhydride having a carboxyl group or an acid anhydride group bonded to an alicyclic structure, The presence or absence of an aromatic ring in other structural sites is irrelevant. Examples of the alicyclic polycarboxylic acid compounds or anhydrides thereof include tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1 ]heptane-2,3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3, 4-tetrahydronaphthalene-1,2-dicarboxylic acid, acid anhydrides thereof, and the like.

Examples of the aromatic polycarboxylic acid compounds or acid anhydrides thereof include phthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, and biphenyltricarboxylic acid. , biphenyltetracarboxylic acid, benzophenonetetracarboxylic acid, and acid anhydrides thereof.

Among these, since an acid group-containing (meth)acrylate compound capable of forming a cured product having excellent heat resistance and substrate adhesion can be obtained, the alicyclic polycarboxylic acid compound or its acid anhydride, or The aromatic polycarboxylic acid compound or its acid anhydride is preferred. Further, since the amideimide resin (A) can be efficiently produced, it is preferable to use a tricarboxylic anhydride having both a carboxyl group and an acid anhydride group in the molecular structure, such as cyclohexanetricarboxylic anhydride or trimellit. Particular preference is given to using acid anhydrides. Furthermore, the ratio of the total amount of the alicyclic tricarboxylic anhydride and the aromatic tricarboxylic anhydride to the total mass of the polycarboxylic acid or its acid anhydride (a2) is preferably 70% by mass or more, and 90 % or more is preferable.

When the amideimide resin (A) is a reaction raw material of the polyisocyanate compound (a1) and the polycarboxylic acid or its acid anhydride (a2), other resins may be used depending on the desired resin performance. A reaction raw material may be used in combination. In this case, since the effect of the present invention is fully exhibited, the ratio of the polyisocyanate compound (a1) and the polycarboxylic acid or its acid anhydride (a2) to the total mass of the reaction raw materials of the amideimide resin (A) is The ratio of the total mass is preferably 90% by mass or more, more preferably 95% by mass or more.

When the amideimide resin (A) is a reaction raw material of a polyisocyanate compound (a1) and a polycarboxylic acid or an acid anhydride thereof (a2), the production method is not particularly limited, and any method can be used. may be manufactured in For example, it can be produced by the same method as for general amide-imide resins. Specifically, with respect to 1 mol of the isocyanate group of the polyisocyanate compound (a1), 0.8 to 3.5 mol of the polycarboxylic acid or its acid anhydride (a2) is used, and the temperature is about 100 to 180 ° C. and a method of stirring and mixing under temperature conditions of .

The reaction may be carried out in an organic solvent, if desired. The selection of the organic solvent to be used is appropriately selected depending on the solubility of the acid group-containing (meth)acrylate resin as the reaction raw material and product, the reaction temperature conditions, etc. Examples include methyl ethyl ketone, acetone, dimethylformamide, methyl isobutyl ketone, Methoxypropanol, cyclohexanone, methyl cellosolve, dialkylene glycol monoalkyl ether acetate, dialkylene glycol acetate and the like. These organic solvents can be used alone or in combination of two or more. The amount of the organic solvent used is preferably in the range of about 0.1 to 5 times the total mass of the reaction raw materials, since the reaction efficiency is improved.

As the hydroxyl group-containing (meth)acrylate compound (B), other specific structures are not particularly limited as long as they are compounds having a hydroxyl group and a (meth)acryloyl group in the molecular structure, and a wide variety of compounds can be used. can. Examples thereof include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) ) acrylate, dipentaerythritol (meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ditrimethylolpropane tri(meth)acrylate and the like. In addition, a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, (poly)oxypropylene chain, or (poly)oxytetramethylene chain is introduced into the molecular structure of the various hydroxyl group-containing (meth)acrylate compounds ( Poly)oxyalkylene modified products and lactone modified products obtained by introducing a (poly)lactone structure into the molecular structure of the various hydroxyl group-containing (meth)acrylate compounds can also be used. These hydroxyl group-containing (meth)acrylate compounds can be used alone or in combination of two or more. Also, among these, a (meth)acrylate compound having one hydroxyl group is preferable because the reaction can be easily controlled.

The molecular weight of the hydroxyl group-containing (meth)acrylate compound (B) is 1,000 or less because an acid group-containing (meth)acrylate compound capable of forming a cured product having excellent heat resistance and substrate adhesion is obtained. is preferred. Further, when the hydroxyl group-containing (meth)acrylate compound (B) is an oxyalkylene modified product or a lactone modified product, the weight average molecular weight (Mw) is preferably 1,000 or less.

The epoxy group-containing (meth)acrylate compound (C) is not particularly limited to other specific structures as long as it has a (meth)acryloyl group and an epoxy group in its molecular structure, and a wide variety of compounds are used. be able to. Examples thereof include glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, glycidyl group-containing (meth)acrylate monomers such as epoxycyclohexylmethyl (meth)acrylate; Examples include mono(meth)acrylates of diglycidyl ether compounds such as naphthalene diglycidyl ether, biphenol diglycidyl ether, and bisphenol diglycidyl ether. These epoxy group-containing (meth)acrylate compounds can be used alone or in combination of two or more. Among these, a (meth)acrylate compound having one epoxy group is preferable because it facilitates control of the reaction, and an acid group-containing (meth)acrylate compound capable of forming a cured product having excellent heat resistance and substrate adhesion can be obtained. ) A glycidyl group-containing (meth)acrylate monomer is preferred because an acrylate compound can be obtained. Moreover, the molecular weight of the glycidyl group-containing (meth)acrylate monomer is preferably 500 or less. Furthermore, the ratio of the glycidyl group-containing (meth)acrylate monomer to the total mass of the epoxy group-containing (meth)acrylate compound (C) is preferably 70% by mass or more, more preferably 90% by mass or more. .

Examples of the polycarboxylic anhydride (D) include phthalic anhydride, succinic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and methyl nadic anhydride. acid, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, octenyl succinic anhydride, tetrapropenyl succinic anhydride and the like. Aliphatic polycarboxylic acid anhydrides, alicyclic polycarboxylic acid anhydrides, aromatic polycarboxylic acid anhydrides and the like among the compounds exemplified as the polycarboxylic acid or its acid anhydride (a2) can also be used. can be done. These polycarboxylic anhydrides (D) can be used alone or in combination of two or more. In addition, among these, since an acid group-containing (meth)acrylate compound capable of forming a cured product having excellent heat resistance and substrate adhesion is obtained, aliphatic polycarboxylic acid anhydride or alicyclic polycarboxylic acid Acid anhydrides are preferred, and aliphatic dicarboxylic acid anhydrides or alicyclic dicarboxylic acid anhydrides are more preferred.

As the isocyanate group-containing (meth)acrylate compound (E), other specific structures are not particularly limited as long as they have a (meth)acryloyl group and an isocyanate group in the molecular structure, and a wide variety of compounds are used. be able to. Examples thereof include 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate, 1,1-bis(acryloyloxymethyl)ethyl isocyanate and the like. Commercially available isocyanate group-containing (meth)acrylate compounds include “Karenzu AOI”, “Karenzu MOI” and “AOI-VM” manufactured by Showa Denko K.K. Furthermore, as the isocyanate group-containing (meth)acrylate compound (E), an isocyanate compound having at least two isocyanate groups and a hydroxyl group-containing (meth)acrylate compound are added to 1 mol of the isocyanate group of the isocyanate compound. It is also possible to use those obtained by reacting under conditions in which the number of moles of hydroxyl groups possessed by the contained (meth)acrylate compound is in the range of 0.3 to 0.7 moles.

As the isocyanate compound having at least two isocyanate groups, the same polyisocyanate compound (a1) as described above can be used.

As the hydroxyl group-containing (meth)acrylate compound, the same hydroxyl group-containing (meth)acrylate compound (B) can be used.

The acid group-containing (meth)acrylate resin of the present invention may be selected from the amideimide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B) depending on the desired resin performance. ), the epoxy group-containing (meth)acrylate compound (C), the polycarboxylic anhydride (D) and the isocyanate group-containing (meth)acrylate compound (E), in addition to other reaction raw materials may be used in combination. . In this case, since the effects of the present invention are sufficiently exhibited, the ratio of the total mass of the components (A) to (E) to the total mass of reaction raw materials of the acid group-containing (meth)acrylate resin is 80% by mass or more. and more preferably 90% by mass or more.

The method for producing the acid group-containing (meth)acrylate resin is not particularly limited, and any method may be used. For example, it may be produced by a method of reacting all of the reaction raw materials at once, or may be produced by a method of sequentially reacting the reaction raw materials. Among them, since the reaction is easy to control, the amide imide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B) are reacted (step 1), and the product of step 1 and the epoxy group-containing ( meth) acrylate compound (C) is reacted (step 2), the product of step 2 is reacted with the polycarboxylic anhydride (D) (step 3), the product of step 3 and the isocyanate group-containing It is preferably produced by the method (step 4) of reacting with the (meth)acrylate compound (E).

Regarding the step 1, the reaction between the amide imide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B) mainly includes the acid group or acid anhydride group in the amide imide resin (A) and the hydroxyl group-containing ( The hydroxyl groups in the meth)acrylate compound (B) are reacted. Since the hydroxyl group-containing (meth)acrylate compound (B) is particularly excellent in reactivity with acid anhydride groups, as described above, the amideimide resin (A) preferably has acid anhydride groups. In addition, the ratio of the reaction between the amideimide resin (A) and the hydroxyl group (meth)acrylate compound (B) is based on the total number of acid groups and acid anhydride groups in the amideimide resin (A) with respect to the hydroxyl group-containing (meth)acrylate compound (B). ) It is preferable to use the acrylate compound (B) in the range of 0.9 to 1.1 mol. The content of the acid anhydride groups in the amide imide resin (A) is the difference between the two acid value measurements described above, that is, the acid value under the conditions in which the acid anhydride group is ring-opened, It can be calculated from the difference from the acid value under conditions where the acid anhydride group is not ring-opened.

The reaction between the amide imide resin (A) and the hydroxyl group-containing (meth)acrylate compound (B) may be carried out by heating and stirring at a temperature of about 90 to 140° C. in the presence of a suitable esterification catalyst, for example. can be done. Examples of the esterification catalyst include phosphorus compounds such as trimethylphosphine, tributylphosphine and triphenylphosphine; amine compounds such as triethylamine, tributylamine and dimethylbenzylamine; 2-methylimidazole, 2-heptadecylimidazole, 2-ethyl -4-methylimidazole, 1-benzyl-2-methylimidazole, 1-isobutyl-2-methylimidazole and other imidazole compounds. These esterification catalysts can be used alone or in combination of two or more. The amount of the esterification catalyst to be added is preferably in the range of 0.001 to 5 parts by mass with respect to 100 parts by mass of the total mass of the reaction raw materials.

The reaction may be carried out in an organic solvent, if desired. The selection of the organic solvent to be used is appropriately selected depending on the solubility of the acid group-containing (meth)acrylate resin as the reaction raw material and product, the reaction temperature conditions, etc. Examples include methyl ethyl ketone, acetone, dimethylformamide, methyl isobutyl ketone, Methoxypropanol, cyclohexanone, methyl cellosolve, dialkylene glycol monoalkyl ether acetate, dialkylene glycol acetate and the like. These organic solvents can be used alone or in combination of two or more. When the production of the amide-imide resin (A) and step 1 are performed continuously, the reaction may be continued in the organic solvent used in the production of the amide-imide resin (A).

Regarding step 2, the epoxy group-containing (meth)acrylate compound (C) mainly reacts with the carboxyl groups in the product of step 1 above. The reaction ratio is preferably in the range of 0.5 to 1.2 mol of the epoxy group-containing (meth)acrylate compound (C) with respect to the carboxyl group in the product of step 1, and 0.9 to It is more preferable to use in the range of 1.1 mol. The reaction in step 2 can be carried out, for example, in the presence of a suitable esterification catalyst, with heating and stirring at a temperature of about 90 to 140°C. When step 1 and step 2 are performed continuously, the esterification catalyst may not be added, or may be added as appropriate. Moreover, you may carry out reaction in an organic solvent as needed.

Regarding step 3, the polycarboxylic anhydride (D) reacts mainly with hydroxyl groups in the product of step 2 above. The product of step 2 contains, for example, hydroxyl groups generated by ring-opening of epoxy groups in the epoxy group-containing (meth)acrylate compound (C). The reaction ratio of the polycarboxylic anhydride (D) is preferably adjusted so that the resulting acid group-containing (meth)acrylate resin has an acid value of about 60 to 120 mgKOH/g. The reaction of step 3 can be carried out, for example, in the presence of a suitable esterification catalyst, with heating and stirring at a temperature of about 90 to 140°C. When step 2 and step 3 are performed continuously, the esterification catalyst may not be added, or may be added as appropriate. Moreover, you may carry out reaction in an organic solvent as needed.

In step 4, the isocyanate group-containing (meth)acrylate compound (E) reacts with the remaining hydroxyl groups. The isocyanate group-containing (meth)acrylate compound (E) is preferably adjusted so that the resulting acid group-containing (meth)acrylate resin has an acid value of about 60 to 120 mgKOH/g. The reaction of step 4 can be carried out, for example, in the presence of a suitable urethanization catalyst by heating and stirring at a temperature of about 50 to 100°C. Moreover, you may carry out reaction in an organic solvent as needed.

Examples of the urethanization catalyst include pyridine, pyrrole, triethylamine, diethylamine, amines such as dibutylamine, phosphines such as triphenylphosphine and triethylphosphine, dibutyltin dilaurate, octyltin trilaurate, octyltin diacetate, dioctyltin. Organic tin compounds such as diacetate, dioctyltin dineodecanoate, dibutyltin diacetate, tin octylate, 1,1,3,3-tetrabutyl-1,3-dodecanoyl distannoxane, zinc octylate, octyl Organic metal compounds such as bismuth oxide, inorganic tin compounds such as tin octoate, and inorganic metal compounds can be used.

The acid value of the acid-group-containing (meth)acrylate resin of the present invention is 50 to 120 mgKOH, since an acid-group-containing (meth)acrylate resin capable of forming a cured product having excellent heat resistance and substrate adhesion can be obtained. /g is preferred, and the range of 60-110 mgKOH/g is more preferred. In the present invention, the acid value of the acid group-containing (meth)acrylate resin is a value measured by the neutralization titration method of JIS K 0070 (1992).

Also, the weight average molecular weight (Mw) of the acid group-containing (meth)acrylate resin is preferably in the range of 1,000 to 20,000. In addition, in this invention, a weight average molecular weight (Mw) shows the value measured by the gel permeation chromatography (GPC) method.

Since the acid group-containing (meth)acrylate resin of the present invention has a polymerizable (meth)acryloyl group in its molecular structure, it can be used as a curable resin composition by adding a photopolymerization initiator, for example. can be done.

As for the photopolymerization initiator, an appropriate one may be selected and used according to the type of active energy ray to be irradiated. Further, it may be used in combination with a photosensitizer such as an amine compound, a urea compound, a sulfur-containing compound, a phosphorus-containing compound, a chlorine-containing compound and a nitrile compound. Specific examples of photopolymerization initiators include 1-hydroxy-cyclohexyl-phenyl-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-(dimethylamino) -2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone and other alkylphenone photoinitiators; 2,4,6-trimethylbenzoyl-diphenyl- acylphosphine oxide-based photopolymerization initiators such as phosphine oxide; intramolecular hydrogen abstraction type photopolymerization initiators such as benzophenone compounds; Each of these may be used alone, or two or more of them may be used in combination.

Examples of the photopolymerization initiator include 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2- Hydroxy-2-methyl-1-propan-1-one, thioxanthone and thioxanthone derivatives, 2,2′-dimethoxy-1,2-diphenylethan-1-one, diphenyl(2,4,6-trimethoxybenzoyl)phosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropane-1- one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, and the like.

Commercially available products of the other photopolymerization initiators include, for example, "Omnirad-1173", "Omnirad-184", "Omnirad-127", "Omnirad-2959", "Omnirad-369", and "Omnirad-379". , "Omnirad-907", "Omnirad-4265", "Omnirad-1000", "Omnirad-651", "Omnirad-TPO", "Omnirad-819", "Omnirad-2022", "Omnirad-2100", " Omnirad-754”, “Omnirad-784”, “Omnirad-500”, “Omnirad-81” (manufactured by IGM), “Kayacure-DETX”, “Kayacure-MBP”, “Kayacure-DMBI”, “Kayacure-EPA ”, “Kayacure-OA” (manufactured by Nippon Kayaku Co., Ltd.), “Vicure-10”, “Vicure-55” (manufactured by Stouffer Chemical), “Trigonal P1” (manufactured by Akzo), “Sunray 1000” ( Sands), "Deep" (Upjohn), "Quantacure-PDO", "Quantacure-ITX", "Quantacure-EPD" (Ward Blenkinsop), "Runtecure-1104" (Runtec company) and the like. These photopolymerization initiators can be used alone or in combination of two or more.

The amount of the photopolymerization initiator added is, for example, preferably in the range of 0.05 to 15% by mass with respect to the total of components other than the solvent of the curable resin composition, and in the range of 0.1 to 10% by mass. is more preferable.

The curable resin composition of the present invention may contain resin components other than the acid group-containing (meth)acrylate resin described above. Examples of the other resin components include an acid group-containing (meth)acrylate resin (F) and various (meth)acrylate monomers.

As the acid group-containing (meth)acrylate resin (F), any resin having an acid group and a (meth)acryloyl group may be used. urethane (meth)acrylate resins containing acid groups, acrylic (meth)acrylate resins containing acid groups, amideimide (meth)acrylate resins containing acid groups, acrylamide resins containing acid groups, and the like.

Examples of the acid group include a carboxyl group, a sulfonic acid group, and a phosphoric acid group.

Examples of the acid group-containing epoxy (meth)acrylate resin include, for example, an acid group-containing epoxy (meth)acrylate resin containing an epoxy resin, an unsaturated monobasic acid, and a polybasic acid anhydride as essential reaction raw materials, and an epoxy resin. , unsaturated monobasic acid, polybasic acid anhydride, polyisocyanate compound, and hydroxyl group-containing (meth)acrylate compound as reaction raw materials, and acid group- and urethane group-containing epoxy (meth)acrylate resins.

Examples of the epoxy resin include bisphenol type epoxy resin, phenylene ether type epoxy resin, naphthylene ether type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, Bisphenol novolak type epoxy resin, naphthol novolac type epoxy resin, naphthol-phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene-phenol addition Reactive epoxy resins, biphenylaralkyl-type epoxy resins, fluorene-type epoxy resins, xanthene-type epoxy resins, and the like can be mentioned. These epoxy resins can be used alone or in combination of two or more.

The unsaturated monobasic acid refers to a compound having a (meth)acryloyl group and a carboxyl group in one molecule, such as acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, α-cyanocinnamic acid, β- styryl acrylic acid, β-furfuryl acrylic acid and the like. Esterified products, acid halides, acid anhydrides, etc. of the unsaturated monobasic acids can also be used. These unsaturated monobasic acids can be used alone or in combination of two or more.

Examples of the polybasic acid anhydride include phthalic anhydride, succinic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydro phthalic anhydride, methylhexahydrophthalic anhydride, octenyl succinic anhydride, tetrapropenyl succinic anhydride and the like. These polybasic acid anhydrides can be used alone or in combination of two or more. Among these, tetrahydrophthalic anhydride and succinic anhydride are preferable, since a curable resin composition capable of forming a cured product having excellent heat resistance and adhesion to a substrate can be obtained.

As the polyisocyanate compound, the same polyisocyanate compound (a1) as described above can be used.

As the hydroxyl group-containing (meth)acrylate compound, the same hydroxyl group-containing (meth)acrylate compound (B) can be used.

Examples of the acid group-containing urethane (meth)acrylate resin include polyisocyanate compounds, hydroxyl group-containing (meth)acrylate compounds, carboxyl group-containing polyol compounds, and optionally polybasic acid anhydrides and the carboxyl group-containing polyol compounds. Those obtained by reacting with other polyol compounds, polyisocyanate compounds, hydroxyl group-containing (meth) acrylate compounds, polybasic acid anhydrides, and polyol compounds other than carboxyl group-containing polyol compounds obtained by reacting etc.

As the polyisocyanate compound, the same polyisocyanate compound (a1) as described above can be used.

As the hydroxyl group-containing (meth)acrylate compound, the same hydroxyl group-containing (meth)acrylate compound (B) can be used.

Examples of the carboxyl group-containing polyol compound include 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, and 2,2-dimethylolvaleric acid.

As the polybasic acid anhydride, the same polybasic acid anhydride as described above can be used.

Examples of polyol compounds other than the carboxyl group-containing polyol compounds include aliphatic polyol compounds such as ethylene glycol, propylene glycol, butanediol, hexanediol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, and dipentaerythritol; Aromatic polyol compounds such as biphenols and bisphenols; (poly)oxyalkylene chains such as (poly)oxyethylene chains, (poly)oxypropylene chains, and (poly)oxytetramethylene chains in the molecular structures of the above-mentioned various polyol compounds Introduced (poly)oxyalkylene modified products; lactone modified products obtained by introducing a (poly)lactone structure into the molecular structure of the above-mentioned various polyol compounds, and the like.

The acid group-containing acrylic (meth)acrylate resin is obtained, for example, by polymerizing a (meth)acrylate compound (α) having a reactive functional group such as a hydroxyl group, a carboxyl group, an isocyanate group, or a glycidyl group as an essential component. A reaction product obtained by introducing a (meth)acryloyl group by further reacting a (meth)acrylate compound (β) having a reactive functional group capable of reacting with these functional groups to the acrylic resin intermediate obtained by and those obtained by reacting the hydroxyl groups in the reaction product with a polybasic acid anhydride.

The acrylic resin intermediate may be obtained by copolymerizing the (meth)acrylate compound (α) and, if necessary, other polymerizable unsaturated group-containing compounds. The other polymerizable unsaturated group-containing compounds include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and the like (meth) Alkyl acrylic ester; Alicyclic structure-containing (meth)acrylates such as cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate; phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxy aromatic ring-containing (meth)acrylates such as ethyl acrylate; silyl group-containing (meth)acrylates such as 3-methacryloxypropyltrimethoxysilane; styrene derivatives such as styrene, α-methylstyrene, and chlorostyrene; These can be used alone or in combination of two or more.

The (meth)acrylate compound (β) is not particularly limited as long as it can react with the reactive functional group of the (meth)acrylate compound (α). From the viewpoint of reactivity, the following combinations are preferred: is preferred. That is, when a hydroxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use an isocyanate group-containing (meth)acrylate as the (meth)acrylate compound (β). When a carboxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a glycidyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When an isocyanate group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a hydroxyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When a glycidyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a carboxyl group-containing (meth)acrylate as the (meth)acrylate compound (β).

As the polybasic acid anhydride, the same polybasic acid anhydride as described above can be used.

Examples of the acid group-containing amideimide (meth)acrylate resin include, for example, an amideimide resin having an acid group or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound and/or a (meth)acryloyl group-containing epoxy compound, and, if necessary, Accordingly, those obtained by reacting a compound having one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxyl group, an isocyanate group, a glycidyl group, and an acid anhydride group may be mentioned. The compound having a reactive functional group may or may not have a (meth)acryloyl group.

The amide-imide resin may have either an acid group or an acid anhydride group, or may have both. From the viewpoint of reactivity and reaction control with hydroxyl group-containing (meth)acrylate compounds and (meth)acryloyl group-containing epoxy compounds, it preferably has an acid anhydride group, and both the acid group and the acid anhydride group. It is more preferable to have The acid value of the amide-imide resin is preferably in the range of 60 to 350 mgKOH/g as measured under neutral conditions, that is, under conditions in which ring-opening of acid anhydride groups is not performed. On the other hand, it is preferable that the measured value under the condition that the acid anhydride group is ring-opened, such as in the presence of water, is in the range of 61 to 360 mgKOH/g.

The specific structure and manufacturing method of the amide-imide resin are not particularly limited, and general amide-imide resins and the like can be widely used. Examples thereof include those obtained by using a polyisocyanate compound and a polybasic acid or a polybasic acid anhydride as reaction raw materials.

As the polyisocyanate compound, the same polyisocyanate compound (a1) as described above can be used.

Any compound having two or more carboxyl groups in one molecule can be used as the polybasic acid. For example, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic acid, hexahydro phthalic acid, methylhexahydrophthalic acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane- 2,3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydro naphthalene-1,2-dicarboxylic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid, biphenyltetracarboxylic acid, benzophenonetetracarboxylic acid, and the like. be done. As the polybasic acid, for example, a copolymer of a conjugated diene-based vinyl monomer and acrylonitrile, which has a carboxyl group in its molecule, can also be used. These polybasic acids can be used alone or in combination of two or more.

As the polybasic acid anhydride, the same polybasic acid anhydride as described above can be used.

As the hydroxyl group-containing (meth)acrylate compound, the same hydroxyl group-containing (meth)acrylate compound (B) can be used.

As the (meth)acryloyl group-containing epoxy compound, the same epoxy group-containing (meth)acrylate compound (C) can be used.

Examples of the acid group-containing acrylamide resin include, for example, a phenolic hydroxyl group-containing compound, an alkylene oxide or an alkylene carbonate, an N-alkoxyalkyl (meth)acrylamide compound, a polybasic acid anhydride, and optionally an unsaturated monoacrylamide. Examples include those obtained by reacting with a basic acid.

The phenolic hydroxyl group-containing compound is a compound having at least two phenolic hydroxyl groups in the molecule. Examples of the compound having at least two phenolic hydroxyl groups in the molecule include compounds represented by the following structural formulas (1-1) to (1-4).

In the structural formulas (1-1) to (1-4) above, R ¹ is an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, or a halogen atom. , R ² are each independently a hydrogen atom or a methyl group. In addition, p is 0 or an integer of 1 or more, preferably 0 or an integer of 1 to 3, more preferably 0 or 1, still more preferably 0. q is an integer of 2 or more, preferably 2 or 3; The position of the substituent on the aromatic ring in the above structural formula is arbitrary. For example, in the naphthalene ring of structural formula (1-2), any ring may be substituted, and the structural formula ( In 1-3), any benzene ring present in one molecule may be substituted, and in structural formula (1-4), any benzene ring present in one molecule may be substituted. It indicates that it may be substituted, and indicates that the number of substituents in one molecule is p and q.

Further, as the phenolic hydroxyl group-containing compound, for example, a compound having one phenolic hydroxyl group in the molecule and a compound represented by any of the following structural formulas (x-1) to (x-5) are essential. or a reaction product used as a reaction raw material, or a compound having at least two phenolic hydroxyl groups in the molecule and a compound represented by any of the following structural formulas (x-1) to (x-5): A reaction product used as a raw material can also be used. In addition, a novolac-type phenolic resin that uses one or more compounds having one phenolic hydroxyl group in the molecule as a reaction raw material, and one or more compounds having at least two phenolic hydroxyl groups in the molecule. A novolak-type phenol resin or the like used as a reaction raw material can also be used.

［式（ｘ－１）中、ｈは０または１である。式（ｘ－２）～（ｘ－５）中、Ｒ^３は、炭素原子数１～２０のアルキル基、炭素原子数１～２０のアルコキシ基、アリール基、ハロゲン原子の何れかであり、ｉは、０または１～４の整数である。式（ｘ－２）、（ｘ－３）及び（ｘ－５）中、Ｚは、ビニル基、ハロメチル基、ヒドロキシメチル基、アルキルオキシメチル基の何れかである。式（ｘ－５）中、Ｙは、炭素原子数１～４のアルキレン基、酸素原子、硫黄原子、カルボニル基の何れかであり、ｊは１～４の整数である。］

[In formula (x−1), h is 0 or 1. In formulas (x-2) to (x-5), R ³ is an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, or a halogen atom, i is an integer of 0 or 1-4. In formulas (x-2), (x-3) and (x-5), Z is a vinyl group, a halomethyl group, a hydroxymethyl group or an alkyloxymethyl group. In formula (x-5), Y is an alkylene group having 1 to 4 carbon atoms, an oxygen atom, a sulfur atom or a carbonyl group, and j is an integer of 1 to 4. ]

Examples of the compound having one phenolic hydroxyl group in the molecule include compounds represented by the following structural formulas (2-1) to (2-4).

In the structural formulas (2-1) to (2-4) above, R ⁴ is an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, or a halogen atom. , R ⁵ are each independently a hydrogen atom or a methyl group. In addition, p is 0 or an integer of 1 or more, preferably 0 or an integer of 1 to 3, more preferably 0 or 1, still more preferably 0. The position of the substituent on the aromatic ring in the above structural formula is arbitrary. For example, the naphthalene ring of structural formula (2-2) may be substituted on any ring, and the structural formula ( In 2-3), any benzene ring present in one molecule may be substituted, and in structural formula (2-4), any benzene ring present in one molecule may be substituted. Indicates that substitution is allowed.

As the compound having at least two phenolic hydroxyl groups in the molecule, the compounds represented by the above structural formulas (1-1) to (1-4) can be used.

These phenolic hydroxyl group-containing compounds can be used alone or in combination of two or more.

Examples of the alkylene oxide include ethylene oxide, propylene oxide, butylene oxide, and pentylene oxide. Among these, ethylene oxide or propylene oxide is preferable because a curable resin composition capable of forming a cured product having excellent heat resistance and adhesion to a substrate can be obtained.

Examples of the alkylene carbonate include ethylene carbonate, propylene carbonate, butylene carbonate, pentylene carbonate, and the like. Among these, ethylene carbonate or propylene carbonate is preferable because a curable resin composition capable of forming a cured product having excellent heat resistance and adhesion to a substrate can be obtained.

Examples of the N-alkoxyalkyl(meth)acrylamide compounds include N-methoxymethyl(meth)acrylamide, N-ethoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, and N-methoxyethyl(meth)acrylamide. , N-ethoxyethyl (meth)acrylamide, N-butoxyethyl (meth)acrylamide and the like.

As the polybasic acid anhydride, the same polybasic acid anhydride as described above can be used.

As the unsaturated monobasic acid, the same unsaturated monobasic acid as described above can be used.

The amount of the acid group-containing (meth)acrylate resin (F) used is preferably in the range of 10 to 900 parts by mass with respect to 100 parts by mass of the acid group-containing (meth)acrylate resin of the present invention.

Examples of the various (meth)acrylate monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2 - aliphatic mono (meth) acrylate compounds such as ethylhexyl (meth) acrylate and octyl (meth) acrylate; alicyclic mono (meth) acrylate compounds such as cyclohexyl (meth) acrylate, isobornyl (meth) acrylate and adamantyl mono (meth) acrylate Acrylate compounds; heterocyclic mono (meth) acrylate compounds such as glycidyl (meth) acrylate and tetrahydrofurfuryl acrylate; benzyl (meth) acrylate, phenyl (meth) acrylate, phenylbenzyl (meth) acrylate, phenoxy (meth) acrylate, phenoxyethyl (meth)acrylate, phenoxyethoxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, phenoxybenzyl (meth)acrylate, benzylbenzyl (meth)acrylate, phenylphenoxyethyl (meth)acrylate, etc. Mono (meth) acrylate compounds such as aromatic mono (meth) acrylate compounds of: (poly) oxyethylene chain, (poly) oxypropylene chain, (poly) oxy in the molecular structure of the various mono (meth) acrylate monomers (Poly)oxyalkylene-modified mono(meth)acrylate compounds into which polyoxyalkylene chains such as tetramethylene chains are introduced; (Meth)acrylate compounds; aliphatics such as ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butanediol di(meth)acrylate, hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate Di(meth)acrylate compounds; 1,4-cyclohexanedimethanol di(meth)acrylate, norbornane di(meth)acrylate, norbornanedimethanol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, tricyclodecanedi Alicyclic di(meth)acrylate compounds such as methanol di(meth)acrylate; Aromatic di(meth)acrylate compounds such as nord di(meth)acrylate; (poly)oxyethylene chain, (poly)oxypropylene chain, (poly)oxytetramethylene in the molecular structure of the various di(meth)acrylate compounds polyoxyalkylene-modified di(meth)acrylate compound into which a (poly)oxyalkylene chain such as a chain is introduced; ) acrylate compound; aliphatic tri(meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate and glycerin tri(meth)acrylate; (poly)oxyethylene chain in the molecular structure of the aliphatic tri(meth)acrylate compound , (poly)oxypropylene chain, (poly)oxytetramethylene chain, etc. (poly)oxyalkylene-modified tri(meth)acrylate compound introduced with (poly)oxyalkylene chain; molecule of the aliphatic tri(meth)acrylate compound Lactone-modified tri(meth)acrylate compounds having a (poly)lactone structure introduced into the structure; tetrafunctional or higher such as pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc. Aliphatic poly (meth) acrylate compound; in the molecular structure of the aliphatic poly (meth) acrylate compound (poly) oxyethylene chain, (poly) oxypropylene chain, (poly) oxytetramethylene chain such as (poly) Tetra- or more functional (poly)oxyalkylene-modified poly(meth)acrylate compound into which an oxyalkylene chain is introduced; Tetra- or more-functional lactone into which a (poly)lactone structure is introduced into the molecular structure of the aliphatic poly(meth)acrylate compound A modified poly(meth)acrylate compound and the like can be mentioned.

The curable resin composition of the present invention may optionally contain a curing agent, a curing accelerator, an organic solvent, inorganic fine particles or polymer fine particles, a pigment, an antifoaming agent, a viscosity modifier, a leveling agent, a flame retardant, Various additives such as storage stabilizers can also be contained.

The curing agent is not particularly limited as long as it has a functional group capable of reacting with the carboxy group in the acid group-containing (meth)acrylate resin, and examples thereof include epoxy resins. Examples of the epoxy resin include bisphenol type epoxy resin, phenylene ether type epoxy resin, naphthylene ether type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, Bisphenol novolak type epoxy resin, naphthol novolac type epoxy resin, naphthol-phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene-phenol addition Reactive epoxy resins, biphenylaralkyl-type epoxy resins, fluorene-type epoxy resins, xanthene-type epoxy resins, and the like can be mentioned. These epoxy resins can be used alone or in combination of two or more. In addition, among these, since a curable resin composition capable of forming a cured product having excellent heat resistance and substrate adhesion can be obtained, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol novolak type epoxy resin Novolac type epoxy resins such as resins, naphthol novolac type epoxy resins, naphthol-phenol co-condensed novolac type epoxy resins, naphthol-cresol co-condensed novolac type epoxy resins are preferred, and those having a softening point in the range of 50 to 120 ° C. are particularly preferred. preferable.

The curing accelerator accelerates the curing reaction of the curing agent. When an epoxy resin is used as the curing agent, a phosphorus compound, a tertiary amine, imidazole, an organic acid metal salt, a Lewis acid , amine complex salts and the like. These curing accelerators can be used alone or in combination of two or more. Moreover, the amount of the curing accelerator added is preferably in the range of 1 to 10 parts by mass with respect to 100 parts by mass of the curing agent.

The organic solvent is not particularly limited as long as it can dissolve various components such as the acid group-containing (meth)acrylate resin and the curing agent. Examples include ketones such as methyl ethyl ketone, acetone, dimethylformamide, and methyl isobutyl ketone. Solvents; Cyclic ether solvents such as tetrahydrofuran and dioxolane; Ester solvents such as methyl acetate, ethyl acetate and butyl acetate; Aromatic solvents such as toluene, xylene and solvent naphtha; Alicyclic solvents such as cyclohexane and methylcyclohexane; Alcohol solvents such as cellosolve, methanol, isopropanol, butanol, propylene glycol monomethyl ether; glycol ether solvents such as alkylene glycol monoalkyl ether, dialkylene glycol monoalkyl ether, dialkylene glycol monoalkyl ether acetate; methoxypropanol, cyclohexanone, methyl cellosolve , diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like. These organic solvents can be used alone or in combination of two or more.

The cured product of the present invention can be obtained by irradiating the curable resin composition with an active energy ray. Examples of the active energy rays include ionizing radiation such as ultraviolet rays, electron beams, α rays, β rays, and γ rays. When ultraviolet rays are used as the active energy rays, the irradiation may be performed in an atmosphere of an inert gas such as nitrogen gas or in an air atmosphere in order to efficiently perform the curing reaction using the ultraviolet rays.

An ultraviolet lamp is generally used as a source of ultraviolet light from the viewpoint of practicality and economy. Specific examples include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, gallium lamps, metal halide lamps, sunlight, and LEDs.

The integrated amount of active energy rays is not particularly limited, but is preferably 10 to 5,000 mJ/cm ² , more preferably 50 to 1,000 mJ/cm ² . It is preferable that the integrated amount of light is within the above range because the generation of uncured portions can be prevented or suppressed.

The irradiation with the active energy ray may be performed in one step, or may be performed in two or more steps.

In addition, since the cured product of the present invention has excellent heat resistance and substrate adhesion, it can It can be suitably used as a layer or an adhesive layer between an integrated circuit element and a circuit board. In addition, it can be suitably used for thin film transistor protective films, liquid crystal color filter protective films, color filter pigment resists, black matrix resists, spacers, and the like in thin display applications such as LCDs and OELDs. Among these, it can be preferably used for solder resist applications.

The resin material for solder resist of the present invention comprises the curable resin composition.

The resist member of the present invention is, for example, a photomask in which the desired pattern is formed after applying the solder resist resin material on a substrate and volatilizing and drying the organic solvent at a temperature range of about 60 to 100 ° C. It can be obtained by exposing to active energy rays through a ray, developing an unexposed portion with an alkaline aqueous solution, and further curing by heating at a temperature in the range of about 140 to 200°C.

Examples of the substrate include metal foil such as copper foil and aluminum foil.

The present invention will be described in more detail below with examples and comparative examples.

In the examples of the present application, the acid value of the acid group-containing (meth)acrylate resin was measured by the neutralization titration method of JIS K 0070 (1992).

In the examples of the present application, the molecular weight of the acid group-containing (meth)acrylate resin was measured by GPC under the following conditions.

Measuring device: "HLC-8220 GPC" manufactured by Tosoh Corporation,
Column: Guard column "HXL-L" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G3000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G4000HXL" manufactured by Tosoh Corporation
Detector: RI (differential refractometer)
Data processing: "GPC-8020 model II version 4.10" manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40°C
Developing solvent Tetrahydrofuran
Flow rate 1.0 ml/min Standard: The following monodisperse polystyrene with a known molecular weight was used in accordance with the measurement manual of "GPC-8020 Model II Version 4.10".
(Polystyrene used)
"A-500" manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
"F-1" manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
"F-4" manufactured by Tosoh Corporation
"F-10" manufactured by Tosoh Corporation
"F-20" manufactured by Tosoh Corporation
"F-40" manufactured by Tosoh Corporation
"F-80" manufactured by Tosoh Corporation
"F-128" manufactured by Tosoh Corporation
Sample: 1.0% by mass of tetrahydrofuran solution in terms of resin solid content filtered through a microfilter (50 μl)

(Example 1: Production of acid group-containing (meth)acrylate resin (1))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 399.8 parts by mass of diethylene glycol monomethyl ether acetate, an isocyanurate modified form of isophorone diisocyanate (manufactured by EVONIK "VESTANAT T-1890/100", isocyanate group content 17.2% by mass), 137.4 parts by mass of trimellitic anhydride, and 1.5 parts by mass of dibutylhydroxytoluene were added and dissolved. After reacting at 160° C. for 5 hours in a nitrogen atmosphere, it was confirmed that the isocyanate group content was 0.1% by mass or less. Then, 0.3 parts by mass of methoquinone, pentaerythritol polyacrylate mixture (“Aronix M-306” manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 105.7 parts by mass and 3.0 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 5 hours while blowing air. Then, 118.1 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 5 hours. Further, 74.8 parts by mass of succinic anhydride was added and reacted at 110° C. for 5 hours. Next, 8.4 parts by mass of 2-isocyanatoethyl acrylate and 0.1 part by mass of dioctyltin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) were added and reacted at 80° C. for 3 hours. , to obtain the desired acid group-containing (meth)acrylate resin (1). The acid group-containing (meth)acrylate resin (1) had a solid content acid value of 73 mgKOH/g and a weight average molecular weight of 3,700.

(Example 2: Production of acid group-containing (meth)acrylate resin (2))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 399.9 parts by mass of diethylene glycol monomethyl ether acetate, an isocyanurate modified form of isophorone diisocyanate (manufactured by EVONIK "VESTANAT T-1890/100", isocyanate group content 17.2% by mass), 140.3 parts by mass of trimellitic anhydride, and 1.5 parts by mass of dibutylhydroxytoluene were added and dissolved. After reacting at 160° C. for 5 hours in a nitrogen atmosphere, it was confirmed that the isocyanate group content was 0.1% by mass or less. Then, 0.3 parts by mass of methoquinone, pentaerythritol polyacrylate mixture (“Aronix M-306” manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value of 159.7 mg KOH / g) 108.0 parts by mass and 3.0 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 5 hours while blowing air. Then, 120.6 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 5 hours. Furthermore, 76.4 parts by mass of succinic anhydride was added and reacted at 110° C. for 5 hours. Next, a reaction product of isophorone diisocyanate and hydroxyethyl acrylate (“VESTANAT EP-DC 1241” manufactured by EVONIK) 21.3 parts by mass, dioctyl tin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) 0 1 part by mass was added and reacted at 80° C. for 3 hours to obtain the desired acid group-containing acid group-containing (meth)acrylate resin (2). The acid group-containing (meth)acrylate resin (2) had a solid content acid value of 75 mgKOH/g and a weight average molecular weight of 3,630.

(Example 3: Production of acid group-containing (meth)acrylate resin (3))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 349.0 parts by mass of diethylene glycol monomethyl ether acetate, an isocyanurate modified form of isophorone diisocyanate ("VESTANAT T-1890/100" manufactured by EVONIK, isocyanate group content 17.2% by mass) 72.2 parts by mass, 72.2 parts by mass of hexamethylene diisocyanate nurate modified product (DIC Corporation "Barnock DN901S", isocyanate group content 23.5% by mass) 72.2 parts by mass, 176 trimellitic anhydride .2 parts by mass and 1.5 parts by mass of dibutylhydroxytoluene were added and dissolved. After reacting at 160° C. for 5 hours in a nitrogen atmosphere, it was confirmed that the isocyanate group content was 0.1% by mass or less. Then, 0.3 parts by mass of methoquinone, pentaerythritol polyacrylate mixture (“Aronix M-306” manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 106.6 parts by mass and 3.3 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 5 hours while blowing air. Then, 149.2 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 5 hours. Further, 90.4 parts by mass of succinic anhydride was added and allowed to react at 110° C. for 5 hours. Next, 14.8 parts by mass of 2-isocyanatoethyl acrylate and 0.1 part by mass of dioctyltin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) were added and reacted at 80° C. for 3 hours. , to obtain the desired acid group-containing (meth)acrylate resin (3). The acid group-containing (meth)acrylate resin (3) had a solid content acid value of 80 mgKOH/g and a weight average molecular weight of 3,250.

(Example 4: Production of acid group-containing (meth)acrylate resin (4))
A flask equipped with a thermometer, a stirrer, and a reflux condenser was charged with 301.4 parts by mass of diethylene glycol monomethyl ether acetate, a nurate modified form of hexamethylene diisocyanate ("Barnock DN901S" manufactured by DIC Corporation, an isocyanate group content of 23.5 %), 185.8 parts by mass of trimellitic anhydride, and 1.8 parts by mass of dibutylhydroxytoluene were added and dissolved. After reacting at 160° C. for 5 hours in a nitrogen atmosphere, it was confirmed that the isocyanate group content was 0.1% by mass or less. Then, 0.4 parts by mass of methoquinone, pentaerythritol polyacrylate mixture ("Aronix M-306" manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 53.3 parts by mass and 3.5 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 5 hours while blowing air. Then, 192.8 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 5 hours. Further, 96.4 parts by mass of succinic anhydride was added and reacted at 110° C. for 5 hours. Next, 44.0 parts by mass of 2-isocyanatoethyl acrylate and 0.1 part by mass of dioctyltin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) were added and reacted at 80° C. for 3 hours. , to obtain the desired acid group-containing (meth)acrylate resin (4). The acid group-containing (meth)acrylate resin (4) had a solid content acid value of 80 mgKOH/g and a weight average molecular weight of 2,770.

(Example 5: Production of acid group-containing (meth)acrylate resin (5))
A flask equipped with a thermometer, stirrer, and reflux condenser was charged with 300.1 parts by weight of diethylene glycol monomethyl ether acetate, 207.7 parts by weight of isophorone diisocyanate, 269.4 parts by weight of trimellitic anhydride, and 1.8 parts by weight of dibutylhydroxytoluene. parts by mass were added and dissolved. After reacting at 160° C. for 5 hours in a nitrogen atmosphere, it was confirmed that the isocyanate group content was 0.1% by mass or less. Then, 0.4 parts by mass of methoquinone, pentaerythritol polyacrylate mixture ("Aronix M-306" manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 79.0 parts by mass and 3.5 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 5 hours while blowing air. Then, 132.3 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 5 hours. Further, 84.8 parts by mass of succinic anhydride was added and reacted at 110° C. for 5 hours. Next, 9.2 parts by mass of 2-isocyanatoethyl acrylate and 0.1 part by mass of dioctyltin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) were added and reacted at 80° C. for 3 hours. , to obtain the desired acid group-containing (meth)acrylate resin (5). The acid group-containing (meth)acrylate resin (5) had a solid content acid value of 71 mgKOH/g and a weight average molecular weight of 2,190.

(Example 6: Production of acid group-containing (meth)acrylate resin (6))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 382.7 parts by mass of diethylene glycol monomethyl ether acetate, an isocyanurate modified form of isophorone diisocyanate (manufactured by EVONIK "VESTANAT T-1890/100", isocyanate group content 17.2% by mass) 175.8 parts by mass, 150.3 parts by mass of cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, and 1.2 parts by mass of dibutylhydroxytoluene were added and dissolved. After reacting at 160° C. for 5 hours in a nitrogen atmosphere, it was confirmed that the isocyanate group content was 0.1% by mass or less. Then, 0.2 parts by mass of methoquinone, pentaerythritol polyacrylate mixture ("Aronix M-306" manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 37.3 parts by mass , and 2.3 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 5 hours while blowing air. Then, 144.0 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 10 hours. Furthermore, 98.7 parts by mass of tetrahydrophthalic anhydride was added and reacted at 110° C. for 5 hours. Next, 42.9 parts by mass of 2-isocyanatoethyl acrylate and 0.1 part by mass of dioctyltin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) were added and reacted at 80° C. for 3 hours. , to obtain the desired acid group-containing (meth)acrylate resin (6). The acid group-containing (meth)acrylate resin (6) had a solid content acid value of 80 mgKOH/g and a weight average molecular weight of 3,650.

(Example 7: Production of acid group-containing (meth)acrylate resin (7))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 399.9 parts by mass of diethylene glycol monomethyl ether acetate, an isocyanurate modified form of isophorone diisocyanate (manufactured by EVONIK "VESTANAT T-1890/100", isocyanate group content 17 .2% by mass), 129.4 parts by mass of trimellitic anhydride, and 1.5 parts by mass of dibutylhydroxytoluene were added and dissolved. After reacting at 160° C. for 5 hours in a nitrogen atmosphere, it was confirmed that the isocyanate group content was 0.1% by mass or less. Then, 0.3 parts by mass of methoquinone, pentaerythritol triacrylate mixture (“Aronix M-306” manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 99.5 parts by mass and 3.0 parts by mass of triphenylphosphine were added, and the mixture was reacted at 110° C. for 5 hours while blowing air. Then, 159.3 parts by mass of 3,4-epoxycyclohexylmethyl methacrylate (“Cychromer M100” manufactured by Daicel Corporation, epoxy group equivalent: 207 g/equivalent) was added and reacted at 110° C. for 7 hours. Furthermore, 71.5 parts by mass of succinic anhydride was added and reacted at 110° C. for 5 hours. Next, 5.4 parts by mass of 2-isocyanatoethyl acrylate and 0.1 part by mass of dioctyltin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) were added and reacted at 80° C. for 3 hours. , to obtain the desired acid group-containing (meth)acrylate resin (7). The acid group-containing (meth)acrylate resin (7) had a solid content acid value of 70 mgKOH/g and a weight average molecular weight of 3,820.

(Comparative Example 1: Production of acid group-containing (meth)acrylate resin (C1))
A flask equipped with a thermometer, a stirrer, and a reflux condenser was charged with 101 parts by mass of diethylene glycol monomethyl ether acetate, and 428 of ortho-cresol novolak type epoxy resin ("EPICLON N-680" manufactured by DIC Corporation, epoxy equivalent: 214). 4 parts by mass of dibutylhydroxytoluene as an antioxidant and 0.4 parts by mass of methoquinone as a thermal polymerization inhibitor were added, and then 144 parts by mass of acrylic acid and 1.6 parts by mass of triphenylphosphine were added. Then, an esterification reaction was carried out at 120° C. for 10 hours while blowing air. Thereafter, 311 parts by mass of diethylene glycol monomethyl ether acetate and 160 parts by mass of tetrahydrophthalic anhydride were added and reacted at 110° C. for 2.5 hours to obtain the desired acid group-containing (meth)acrylate resin (C1). The solid content acid value of this acid group-containing (meth)acrylate resin (C1) was 85 mgKOH/g.

(Example 8: Preparation of curable resin composition (1))
Acid-group-containing (meth)acrylate resin (1) obtained in Example 1, ortho-cresol novolac-type epoxy resin ("EPICLON N-680" manufactured by DIC Corporation) as a curing agent, and 2-methyl-1 as a photopolymerization initiator. -(4-Methylthiophenyl)-2-morpholinopropane-1-one ("Omnirad-907" manufactured by IGM) and diethylene glycol monomethyl ether acetate as an organic solvent are blended in the parts by weight shown in Table 1 to form a curable resin. A composition (1) was obtained.

(Examples 9 to 14: Preparation of curable resin compositions (2) to (7))
Instead of the acid group-containing (meth)acrylate resin (1) used in Example 8, the acid group-containing (meth)acrylate resins (2) to (7) obtained in Examples 2 to 7 were used, respectively. , to obtain curable resin compositions (2) to (7) in the same manner as in Example 8.

(Comparative Example 2: Preparation of curable resin composition (C2))
The procedure of Example 8 was repeated except that the acid group-containing (meth)acrylate resin (C1) obtained in Comparative Example 1 was used instead of the acid group-containing (meth)acrylate resin (1) used in Example 8. to obtain a curable resin composition (C2).

The following evaluations were performed using the curable resin compositions (1) to (7) and (C2) obtained in the above examples and comparative examples.

[Heat resistance evaluation method]
<Preparation of test piece 1>
The curable resin compositions obtained in Examples and Comparative Examples were applied on a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 μm) with a 50 μm applicator and dried at 80 ° C. for 30 minutes. rice field. After irradiating ultraviolet rays of 1000 mJ/cm ² using a metal halide lamp, it was heated at 160° C. for 1 hour. The cured product was peeled off from the copper foil to obtain test piece 1 (cured product).

The test piece 1 was cut into a size of 6 mm × 40 mm, and a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device “RSA II” manufactured by Rheometric Co., tension method: frequency 1 Hz, temperature increase rate 3 ° C./min) was used. The temperature at which the change in elastic modulus is maximum (the rate of change in tan δ is the largest) was evaluated as the glass transition temperature (Tg).

[Evaluation method for substrate adhesion]
The adhesion to the substrate was evaluated by measuring the peel strength.

<Preparation of test piece 2>
The curable resin compositions obtained in Examples and Comparative Examples were applied on a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 μm) with a 50 μm applicator and dried at 80 ° C. for 30 minutes. rice field. After irradiating 1000 mJ/cm ² of ultraviolet rays using a metal halide lamp, it was heated at 160° C. for 1 hour to obtain a test piece 2 .

<Method for measuring peel strength>
The test piece 2 was cut into a size of 1 cm in width and 12 cm in length, and the 90° peel strength was measured using a peel tester ("A&D Tensilon" manufactured by A&D Co., Ltd., peel speed 50 mm/min).

The compositions and evaluation results of the curable resin compositions (1) to (7) prepared in Examples 8 to 14 and the curable resin composition (C2) prepared in Comparative Example 2 are shown in Table 1.

The "curing agent" in Table 1 indicates an ortho-cresol novolac type epoxy resin ("EPICLON N-680" manufactured by DIC Corporation, epoxy equivalent: 214).

"Organic solvent" in Table 1 indicates diethylene glycol monomethyl ether acetate.

"Photopolymerization initiator" in Table 1 indicates "Omnirad-907" manufactured by IGM.

Examples 8 to 14 shown in Table 1 are examples of curable resin compositions using the acid group-containing (meth)acrylate resin of the present invention. It was confirmed that the cured product of this curable resin composition had excellent heat resistance and substrate adhesion.

On the other hand, Comparative Example 2 is an example of a curable resin composition that does not use the acid group-containing (meth)acrylate resin of the present invention. It was confirmed that the cured product of this curable resin composition was remarkably inadequate in both heat resistance and substrate adhesion.

Claims (10)

Amide imide resin (A) having acid group or acid anhydride group, hydroxyl group-containing (meth)acrylate compound (B), epoxy group-containing (meth)acrylate compound (C), polycarboxylic anhydride (D) and isocyanate group-containing A curable resin composition comprising an acid group-containing (meth)acrylate resin characterized by using a (meth)acrylate compound (E) as an essential reaction raw material, and a photopolymerization initiator. The amideimide resin (A) having an acid group or an acid anhydride group contains a polyisocyanate compound (a1) and a polycarboxylic acid or an acid anhydride thereof (a2) as essential reaction raw materials,
The polyisocyanate compound (a1) contains an alicyclic diisocyanate compound or a modified product thereof as an essential component, and the polycarboxylic acid or its acid anhydride (a2) contains a tricarboxylic acid anhydride as an essential component. A curable resin composition comprising the acid group-containing (meth)acrylate resin according to claim 1 and a photopolymerization initiator . The amideimide resin (A) having an acid group or an acid anhydride group contains a polyisocyanate compound (a1) and a polycarboxylic acid or an acid anhydride thereof (a2) as essential reaction raw materials,
The polyisocyanate compound (a1) contains an aliphatic diisocyanate compound or a modified product thereof as an essential component, and the polycarboxylic acid or its acid anhydride (a2) contains a tricarboxylic acid anhydride as an essential component. A curable resin composition comprising the acid group-containing (meth)acrylate resin according to claim 1 and a photopolymerization initiator . The acid group-containing (meth)acrylate resin according to claim 1, wherein the polycarboxylic anhydride (D) is an aliphatic polycarboxylic anhydride or an alicyclic polycarboxylic anhydride, and a photopolymerization initiator curable resin composition containing ; The curable resin composition according to any one of claims 1 to 4, further comprising an organic solvent and a curing agent. Any one of claims 1 to 4, further comprising an acid group-containing (meth)acrylate resin (F) other than the acid group-containing (meth)acrylate resin according to any one of claims 1 to 4. The curable resin composition according to item . A cured product, which is a cured reaction product of the curable resin composition according to any one of claims 1 to 6 . An insulating material comprising the curable resin composition according to any one of claims 1 to 6 . A resin material for a solder resist, comprising the curable resin composition according to any one of claims 1 to 6 . A resist member comprising the solder resist resin material according to claim 9 .