JP7189465B2 - Method for manufacturing package and method for manufacturing light-emitting device - Google Patents

Description

The present disclosure relates to a package manufacturing method and a light emitting device manufacturing method.

In a display device in which a plurality of light-emitting devices are evenly arranged, when external light such as sunlight is applied to the display device, the surface of the package of the light-emitting device reflects the external light, resulting in reduced visibility. As a measure to reduce the influence of such external light reflection, for example, there is a method of using a material having a low light reflectance for the package of the light emitting device.

For example, Patent Literature 1 discloses a method of manufacturing a lamp that is used as a light source for a display or a backlight, and that can provide a high contrast ratio between when the lamp is lit and when it is not lit. In this manufacturing method, the step of coloring the upper surface of the molded package and at least a portion of the side surface of the molded package using a pad printing method so as to be darker than the inner surface of the recess formed in the molded package. It is carried out.

JP 2010-171130 A

When coloring the upper surface of the molded package in which the recess is formed and at least part of the side surface of the molded package, there is a possibility that the ink may enter the recess in the pad printing method. Moreover, if the upper surface and side surfaces of the molded package are colored twice or more so that the ink does not enter the concave portion, the manufacturing cost of the package increases.

An object of the embodiments of the present disclosure is to provide a method for manufacturing a package and a method for manufacturing a light-emitting device that reduce manufacturing costs.

A method for manufacturing a package according to an embodiment of the present disclosure includes a step of preparing a lead frame including leads and a resin molded body integrally formed with the leads and having a concave portion on the upper surface for accommodating a light emitting element. a step of placing the resin molded body in a cavity of a mold with the inside of the recess of the resin molded body closed; filling the cavity with ink darker than the inner surface of the recess; a step of applying the ink to the upper surface of and at least a part of the side surface of the resin molding; and a step of removing the resin molding to which the ink has adhered from the mold.

A method for manufacturing a package according to an embodiment of the present disclosure includes a step of preparing a lead frame including leads and a resin molded body integrally formed with the leads and having a concave portion on the upper surface for accommodating a light emitting element. a step of filling a cavity of a mold with an ink darker than the inner surface of the recess; and disposing the resin molded body in the cavity filled with the ink while the recess of the resin molded body is closed. and attaching the ink to the upper surface of the resin molded body and at least part of the side surface of the resin molded body, and removing the resin molded body to which the ink has adhered from the mold.

A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes a step of preparing a lead frame including leads and a resin molded body integrally formed with the leads and having a concave portion on the upper surface for accommodating a light-emitting element. a step of mounting a light emitting element in the recess; a step of filling the recess with a sealing member so as to cover the light emitting element; arranging in a cavity of a mold; filling the cavity with an ink darker than the inner surface of the recess; and removing the resin molded body to which the ink is adhered from the mold.

A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes a step of preparing a lead frame including leads and a resin molded body integrally formed with the leads and having a concave portion on the upper surface for accommodating a light-emitting element. mounting a light-emitting element in the recess; filling a sealing member in the recess so as to cover the light-emitting element; and filling a cavity of a mold with ink darker than the inner surface of the recess. and placing the resin molding in the cavity filled with the ink in a state in which the recess of the resin molding is closed, and at least one of the upper surface of the resin molding and the side surface of the resin molding. a step of applying the ink to the part; and a step of removing the resin molding to which the ink is applied from the mold.

According to the embodiments of the present disclosure, it is possible to provide a method of manufacturing a package and a method of manufacturing a light-emitting device that reduce manufacturing costs.

4 is a flow chart of a method for manufacturing a light emitting device according to an embodiment; FIG. 4 is a cross-sectional view showing an example of a mold used in the method for manufacturing the light emitting device according to the embodiment; FIG. 4 is a cross-sectional view showing a step of placing a resin molded body on a cavity of a mold in the method of manufacturing the light emitting device according to the embodiment; FIG. 4 is a cross-sectional view showing a step of arranging the resin molding in the cavity of the mold in the method of manufacturing the light emitting device according to the embodiment; FIG. 5 is a cross-sectional view showing a step of filling ink into a cavity in the method of manufacturing the light emitting device according to the embodiment; FIG. 4 is a cross-sectional view showing a step of taking out a resin molding from a cavity in the method of manufacturing the light emitting device according to the embodiment; FIG. 4 is a cross-sectional view showing a step of taking out a resin molding from a mold in the method of manufacturing the light emitting device according to the embodiment; 1 is a perspective view schematically showing the configuration of a light emitting device according to an embodiment; FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3; FIG. FIG. 5 is a cross-sectional view schematically showing an enlarged part of the resin molded body of FIG. 4 ; 5B is a cross-sectional view schematically showing an enlarged part of the ink of FIG. 5A; FIG. 4 is a cross-sectional view taken along line VI-VI of FIG. 3; FIG. 4 is a flow chart of a method for manufacturing a package according to another embodiment; It is a sectional view showing an example of a metallic mold used in a manufacturing method of a package concerning other embodiments. FIG. 10 is a cross-sectional view showing a step of placing a dummy block in a cavity in a method of manufacturing a package according to another embodiment; FIG. 10 is a cross-sectional view showing a step of filling ink into a cavity in a method of manufacturing a package according to another embodiment; FIG. 10 is a cross-sectional view showing a step of placing a resin molded body on a mold cavity in a method of manufacturing a package according to another embodiment; FIG. 10 is a cross-sectional view showing a step of placing a resin molded body in a mold cavity in a package manufacturing method according to another embodiment; FIG. 10 is a cross-sectional view showing a step of taking out a resin molding from a cavity in a method of manufacturing a package according to another embodiment; FIG. 10 is a cross-sectional view showing a step of removing a resin molded body from a mold in a method of manufacturing a package according to another embodiment; 4 is a flow chart of a method for manufacturing a package according to another embodiment; FIG. 10 is a cross-sectional view showing a step of refilling ink into a cavity in a method of manufacturing a package according to another embodiment; 6 is a flow chart of a method for manufacturing a light emitting device according to another embodiment; 6 is a flow chart of a method for manufacturing a light emitting device according to another embodiment; 6 is a flow chart of a method for manufacturing a light emitting device according to another embodiment;

Embodiments of a method for manufacturing a package and a method for manufacturing a light-emitting device according to the present invention will be described below. It should be noted that the drawings referred to in the following description schematically show the present invention, and therefore the scale, spacing, positional relationship, etc. of each member are exaggerated, or illustration of a part of the member is omitted. Sometimes. Also, the scale and spacing of each member may not match between the plan view and cross-sectional view. Further, in the following description, the same names and symbols basically indicate the same or homogeneous members, and detailed description thereof will be omitted as appropriate. Moreover, in the light-emitting device according to each embodiment of the present invention, "upper", "lower", "left", "right", etc. are interchangeable depending on the situation. In this specification, terms such as "upper" and "lower" indicate relative positions between constituent elements in the drawings referred to for explanation, and indicate absolute positions unless otherwise specified. not intended.

<First Embodiment>
[Method for manufacturing light-emitting device]
A method for manufacturing a light emitting device will be described with reference to FIG. Also, a method of manufacturing the package will be described with reference to FIGS. 2A to 2F. 2A to 2F, 8A to 8G, and 10 schematically show a partial cross-sectional view of the mold 20 and side views of the eject pin 23 and the resin molding 2 for the sake of explanation. clearly shown. In addition, solid color indicates that the surface of the resin molded body is white, and dots indicate that part of the surface of the resin molded body is black.

The method for manufacturing a light-emitting device includes steps S1 to S7 of manufacturing a package, step S11 of mounting a light-emitting element in a recess formed in the package, and step S13 of filling a sealing member in the recess so as to cover the light-emitting element. and have
The package manufacturing method includes a step S1 of preparing a lead frame 1 including leads 4 and a resin molded body 2 integrally molded with the leads 4 and having a concave portion in which a light emitting element is housed on the upper surface; Step S3 of placing the resin molded body 2 in the cavity 21 of the mold 20 with the recess of the body 2 closed, and filling the cavity 21 with ink 5 darker than the inner surface of the recess to form the resin molded body 2 and a step S7 of removing the resin molding 2 to which the ink 5 is adhered from the mold 20.

Each step of the method for manufacturing the light-emitting device will be described in detail below. As an example, as shown in FIG. 2A, a mold 20 having a cavity 21 is used. In order to simplify the explanation, only one resin molding 2 is shown in the drawings. In the mold 20, the resin molding 2 is sandwiched between the lower mold 22 and the upper mold 27, as shown in FIG. 2C. Here, it is assumed that the upper die 27 has a collet portion having a suction hole. A cavity block 24 is provided on the lower mold 22 as a base. The cavity 21 corresponds to the outer shape of the resin molded body 2 . Cavity 21 is formed by lower die 22 , eject pin 23 and cavity block 24 . The inner surface of the cavity block 24 is tapered according to the side surface 2b of the resin molding. The eject pin 23 is provided at a position corresponding to the cavity 21 in the lower mold 22 . A runner 25 communicating with the cavity 21 is formed in the cavity block 24 . Further, the cavity block 24 is formed with an air vent 26 communicating with the cavity 21 on the other side of the cavity 21 (right in FIG. 2A). The air vent 26 can be omitted depending on the printing conditions such as the viscosity of the ink to be used, the coloring area, and the size of the resin molding.

(Step of preparing lead frame)
In step S1 of preparing a lead frame, for example, the lead frame 1 shown in FIG. 2B is prepared. This lead frame 1 includes a resin molding 2 and leads 4 . The resin molded body 2 has a recess for accommodating the light emitting element. The resin molding 2 is arranged so that the surface in which the recess is formed faces the lower mold 22 . The leads 4 are bent after the resin molding 2 is removed from the mold. Details of the configurations of the resin molding 2 and the leads 4 will be described later.

(Step of arranging resin molding in cavity)
In the step S3 of arranging the resin molded body in the cavity, for example, first, the collet portion of the upper mold 27 is brought into contact with the bottom surface of the resin molded body 2 (that is, the surface opposite to the surface on which the recess is formed), The resin molding 2 is sucked by the suction holes provided in the collet portion. Then, the lead frame 1 is picked up while the resin molding 2 is sucked by the collet portion of the upper die 27 . Then, as shown in FIG. 2B, the resin molding 2 is transferred by moving the collet portion of the upper mold 27 to the position of the cavity 21 . At this time, the eject pin 23 of the mold 20 is protruded from the lower mold 22 and extended out of the cavity block 24 . As a result, the resin molding 2 is supported by the eject pin 23 being inserted into the concave portion while being attracted to the upper mold 27 .

Subsequently, as shown in FIG. 2C , the upper mold 27 is lowered together with the eject pin 23 of the mold 20 to arrange the resin molding 2 in the cavity 21 . A predetermined pressure is applied between the upper mold 27 and the lower mold 22 . At this time, between the surface of the cavity block 24 on the side of the cavity 21 and the side surface of the resin molding 2, a slight gap is formed through which ink can flow. Further, a slight gap is formed between the surface of the lower mold 22 and the upper surface of the resin molded body 2 (the surface on which the opening of the concave portion is formed) through which ink can flow. Moreover, a gap is provided between the upper die 27 and the lower die 22 so that the leads 4 do not come into contact with the upper die 27 and the lower die 22 . At this time, the collet portion of the upper mold 27 may release the adsorption of the resin molded body 2 or may continue to adsorb the resin molded body 2 .

As shown in FIG. 2C, the resin molding 2 preferably has a first protrusion 11 on its side surface. Here, a portion of the resin molded body 2 on the upper surface side (that is, the surface side where the opening of the concave portion is formed) is arranged in the cavity 21 with respect to the first convex portion 11 . The first convex portion 11 is formed so as to be positioned outside the opening of the cavity 21 . When the first protrusion 11 comes into contact with the lower mold 22 , the first protrusion 11 serves as a lid to close the gap between the surface on the cavity 21 side and the side surface of the resin molded body 2 .

It is preferable that the upper surface of the resin molding 2 has a second projection 12 (see FIG. 5A) protruding upward from the periphery of the opening of the recess. In addition, FIG. 5A is an enlarged view of the A part of FIG. The second convex portion 12 is formed in an annular shape so as to surround the opening of the concave portion. When the resin molded body 2 is placed in the cavity, the top of the second protrusion 12 contacts the lower mold 22, so that the second protrusion 12 serves as a lid, and the cavity block 24 faces the cavity 21. The gap between the surface of and the side surface of the resin molding 2 is closed. The annular second convex portion 12 blocks the ink infiltration path so as to prevent the ink from penetrating into the concave portion of the resin molded body 2, and can easily set the coloring film thickness of the ink.

(Step of attaching ink)
The step S<b>5 of applying ink is a step of coloring the surface of the resin molding 2 with the ink 5 . In this step S5, while a predetermined pressure is applied between the upper mold 27 and the lower mold 22, ink is filled into the cavity 21 from the runner 25 of the mold as shown in FIG. 2D. Then, the ink 5 flows into the small gap between the cavity 21 and the surface of the resin molding 2, and pushes out the air present in the small gap. The surface of the resin molding 2 is colored with the ink 5 that has flowed into the cavity 21, and the pushed air is discharged from the air vent 26. - 特許庁After a predetermined molding time has passed, the pressure between the upper mold 27 and the lower mold 22 is released, and the molds are released as described later. The ink 5 is formed by covering at least a part of the side surface and the upper surface of the resin molding 2 . Here, as shown in FIG. 2E, on the surface of the resin molded body 2, only a portion located below the first convex portion 11 (that is, on the opening side of the concave portion) is covered with the ink 5. Other parts are not covered with the ink 5 .

Further, when the resin molded body 2 is provided with the first convex portion 11 on the side surface, in the step S5 of applying the ink, the side surface of the resin molded body 2 is on the upper surface side (the opening of the concave portion is formed) rather than the first convex portion 11. Ink 5 adheres to the area of the surface side). In other words, the first convex portion 11 serves as a boundary between a portion to which ink is adhered and a portion to which ink is not adhered on the side surface.

Furthermore, when the second convex portion 12 is provided on the periphery of the opening of the concave portion of the resin molded body 2, in the step S5 of applying the ink, the second convex portion is formed on the upper surface of the resin molded body 2 (that is, the surface on which the opening of the concave portion is formed). The ink 5 adheres to the area on the side surface side of the portion 12 . In other words, the second convex portion 12 can prevent the ink from flowing into the concave portion of the resin molded body 2 .

The viscosity of the ink is preferably about 50 Pa·s/0.5 rpm or more and 1000 Pa·s/0.5 rpm or less at room temperature (25±5° C.). More preferably, the viscosity of the ink is about 300 Pa·s/0.5 rpm or more and 800 Pa·s/0.5 rpm or less at room temperature (25±5° C.). If the viscosity of the ink is 50 Pa·s/0.5 rpm or more, the ink can be easily arranged on the surface of the resin molding 2 . Moreover, if the viscosity of the ink is 1000 Pa·s/0.5 rpm or less, the shape of the ink 5 can be easily changed.

(Step of removing resin molding from mold)
In the step S7 of removing the resin molded body from the mold, first, with the resin molded body 2 sucked by the collet portion of the upper mold 27, the upper mold 27 is removed together with the eject pins 23 of the mold 20 as shown in FIG. 2E. raise. At this time, the eject pin 23 inserted into the concave portion of the resin molded body 2 is protruded from the lower die 22 and extended out of the cavity block 24 . Next, the lead frame 1 is picked up as shown in FIG. As a result, the support of the resin molded body 2 by the eject pins 23 is released, and the resin molded body 2 can be removed from the mold. Then, the resin molded body 2 is transferred by moving the collet portion of the upper mold 27 from the position of the cavity 21 to a predetermined position, and the adsorption of the resin molded body 2 by the collet portion of the upper mold 27 is released at the transfer destination. .

Further, a curing process such as heating may be performed to cure the ink adhered to the resin molding 2 . This completes the package (S9). The temperature for curing the ink 5 is, for example, 40° C. or higher and 200° C. or lower. By increasing the curing temperature, the time for curing the ink 5 can be shortened, which is efficient. As a method for curing the ink 5, for example, a plurality of resin moldings 2 can be placed in a furnace and cured. Alternatively, the ink 5 may be cured by blowing hot air onto the resin molding 2, using a panel heater or the like, using wavelength-controlled infrared irradiation, or using UV irradiation.

(Process of mounting light emitting element)
The step S11 of mounting the light emitting element is a step of mounting the light emitting element on the package after the package is completed (S9). In this step S11, a light-emitting element is mounted on the bottom surface of the concave portion of the package. The light-emitting element is face-up mounted on the bottom surface of the recess with a non-conductive adhesive, with the electrode-formed surface as the main light extraction surface and the surface opposite to the electrode-formed surface as the mounting surface. As the non-conductive adhesive, for example, an adhesive such as epoxy resin or silicone resin may be used. Also, the light-emitting element may be flip-chip mounted, in which case it is mounted using a conductive adhesive. As the conductive adhesive, for example, eutectic solder, conductive paste, bumps, or the like may be used.

(Step of filling the sealing member)
The step S13 of filling the sealing member is a step of forming a sealing member that covers the light emitting element. As the sealing member, it is preferable to use a resin material that can transmit light from the light emitting element. Examples of resin materials include thermosetting resins such as epoxy resins, modified epoxy resins, silicone resins, and modified silicone resins. In this step S13, an uncured resin material that forms the sealing member is arranged in the concave portion of the resin molding 2 by potting, spraying, or the like. After that, for example, the resin material is cured at a temperature of 120° C. or more and 200° C. or less to form the sealing member.

The lead frame 1 may include a plurality of resin moldings 2 connected via leads 4 . At this time, each step is performed using a mold 20 in which a plurality of cavities 21 are formed. In this case, FIGS. 2A to 2F can be regarded as diagrams schematically showing a portion corresponding to one package when a plurality of packages are manufactured simultaneously. The lead frame 1 may include a portion (hereinafter also referred to as a connection portion) that connects the leads 4 together in addition to the portion (the lead 4) that is integrally included in the individual resin molded body 2. . For example, in FIG. 2B, another lead and another resin molding can be provided on the left and right sides of the lead 4 of the resin molding 2 . In addition, another lead and another resin molded body can be provided via the connecting portion in the direction perpendicular to the plane of the paper. In the step S7 of removing the resin molded body from the mold, after the collet portion of the upper mold 27 releases the suction at the transfer destination of the resin molded body 2, an upper The collet portion of mold 27 can be moved and the process repeated.

When the lead frame 1 thus includes a plurality of resin molded bodies 2 connected via the leads 4, the number of the resin molded bodies 2 is not particularly limited. The number of resin moldings 2 may be the same as or different from the number of cavities 21 in the mold 20 . As an example of different cases, the number of resin moldings 2 in the lead frame 1 may be 300 (12 rows×25 columns). Also, the number of cavities in the mold may be, for example, 60 (12 rows×5 columns). In this case, each time the process of applying ink to the same number of resin molding groups in the lead frame 1 is completed, the untreated resin molding groups are moved to the corresponding cavity groups and each process is performed using the same mold. It is possible.

According to the package manufacturing method according to the present embodiment, the ink 5 can be attached to the upper surface and the side surface of the resin molded body 2 all at once, and the manufacturing cost can be reduced compared to the case where the ink is divided into two steps. .
According to the method for manufacturing a light-emitting device according to the present embodiment, the light-emitting element is mounted after the package is completed, so that the light-emitting element is not affected by heat for curing the ink adhered in the package manufacturing process. Therefore, for example, compared with the case where the step of applying ink to the resin molding is performed after mounting the light emitting element, the heat history that the light emitting element receives in the manufacturing process of the light emitting device can be suppressed. Therefore, it is not necessary to perform a special process for suppressing the thermal history that the light emitting element receives, and as a result, the manufacturing cost can be reduced.

Further, for example, if a sealing member is filled in the concave portion of the resin molded body 2 so as to cover the light emitting element before performing the step S5 of applying ink to the resin molded body, when the ink adheres to the sealing member, the light emission will not occur. This will cause the quality of the device to deteriorate. Therefore, a removal step is required to remove unnecessary ink adhering to the sealing member by, for example, blasting. On the other hand, according to the method for manufacturing a light emitting device according to the present embodiment, since the step S5 of applying ink to the resin molding is performed before filling the sealing member, the ink adheres to the sealing member. Therefore, the manufacturing cost can be reduced without a step of removing unnecessary ink.

[Structure of Light Emitting Device]
Next, a light-emitting device manufactured by the manufacturing method according to this embodiment will be described with reference to FIGS. 4 to 6. FIG. The light emitting device 100 includes a package 30 , a light emitting element 40 and a sealing member 50 . The configuration of each part of the light emitting device 100 will be described in detail one by one.

[package]
The package 30 includes a resin molding 2 and leads 4 .
The resin molding 2 has a concave portion 3 formed integrally with the lead 4 and housing the light emitting element 40 on the upper surface 2a. The opening 3a of the recess 3 is, for example, substantially rectangular with rounded corners in plan view. The inner surface of the recess 3 includes a bottom surface 3c on which the light emitting element 40 is placed, and a wall surface portion 3b formed to surround the bottom surface 3c. The light emitting element 40 is mounted on the lead 4 exposed on the bottom surface 3c of the recess 3. As shown in FIG.

The upper surface 2 a of the resin molded body 2 and at least part of the side surface 2 b of the resin molded body 2 are colored with ink 5 . It is preferable that the resin molding 2 has the first protrusion 11 on the side surface 2b. The first convex portion 11 protrudes outward from the side surface 2b substantially perpendicularly. The first convex portion 11 functions as a stopper when the resin molded body 2 is arranged in the cavity 21 of the mold 20 when the package 30 is manufactured. The resin molding 2 has first convex portions 11 on at least two opposing side surfaces 2b. It is preferable that the resin molding 2 is provided with the first protrusions 11 on all the side surfaces 2b. It is preferable that the first convex portion 11 is formed in a strip shape on the side surface 2b in parallel with the upper surface 2a. Ink 5 is provided in a portion of the resin molding 2 closer to the upper surface 2 a than the first convex portion 11 . The first convex portion 11 is arranged below the bottom surface 3 c of the concave portion 3 of the resin molded body 2 . As a result, the side surface 2b of the resin molded body 2 can be colored with the ink 5 below the position corresponding to the bottom surface 3c of the recess 3 by the manufacturing method described above.

As shown in FIGS. 4 and 6 , the first convex portion 11 of the resin molded body 2 is arranged below the bottom surface 3 c of the concave portion 3 of the resin molded body 2 . In the conventional pad printing method, the side surface of the resin molding can only be colored near the upper surface. can be placed up to Here, the ink 5 is provided over a length of 1/2 or more of the total height of the package 30 . Therefore, when the light-emitting device 100 is applied to a display, it is possible to improve the contrast ratio between when the light is on and when the light is off.

As shown in FIGS. 4 and 5A, the resin molded body 2 has a second protrusion 12 around the opening 3a of the recess 3 on the upper surface 2a. It is preferable that the shape of the second convex portion 12 is substantially the same shape as the opening 3a of the concave portion 3 in plan view. For example, it is preferable that the wall surface portion 3b of the concave portion 3 extends to form a part of the second convex portion 12 on the opening side. Thereby, a wider range of the upper surface 2a can be colored with ink. Further, for example, it is preferable to arrange the second convex portion 12 at a position about 5 μm to 50 μm outside the peripheral edge of the opening 3a of the concave portion 3 . As a result, the inflow of ink into the concave portion 3 of the resin molded body 2 can be more reliably suppressed. The second convex portion 12 protrudes substantially vertically upward from the upper surface 2a. The second protrusion 12 functions as a stopper when the ink 5 is adhered to the upper surface 2a during manufacture of the package 30, as already described. This allows the ink 5 to adhere only to the area on the side surface side of the second protrusion 12 on the upper surface 2a. It is preferable that the height to the top of the second convex portion 12 is, for example, 10 μm or more and 30 μm or less. It is preferable that the width of the second convex portion 12 in plan view is, for example, 20 μm or more and 50 μm or less.

The resin molding 2 has a mark portion 13 on the upper surface 2a. The mark portion 13 represents the polarity of the lead 4 and is used as a cathode mark or an anode mark. The shape and size of the mark portion 13 are arbitrary. Here, the mark portion 13 is formed in a triangular shape in a plan view so that one of the corners of the upper surface 2a is recessed downward.

Examples of materials for the resin molding 2 include PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), thermoplastic resins such as liquid crystal polymers, epoxy resins, silicone resins, modified epoxy resins, Thermosetting resin such as urethane resin or phenol resin can be used.

The lead 4 is exposed on the bottom surface 3 c of the recess 3 and connected to the light emitting element 40 . As shown in FIG. 6, the leads 4a, 4b, and 4c are arranged so that one end thereof is exposed to the bottom surface 3c of the recess 3, penetrates the inside of the resin molded body 2, and the other end extends from the lower surface of the resin molded body 2. side and is electrically connected to an external power source as an external electrode of the light emitting device 100 .

As the material of the lead 4, for example, Fe, Cu, Ni, Al, Ag, Au, or an alloy containing one of these can be used. Moreover, the lead 4 may have a plated layer formed on the surface thereof. For the plating layer, for example, Au, Ag, Cu, Pt, or an alloy containing one of these can be used. If the plated layer is made of these materials, the reflectance of light emitted from the light emitting element 40 to the wiring portion side can be further increased.

[ink]
The ink 5 contains a light absorbing material in the first resin. The content of the light absorbing material contained in the first resin of the ink 5 is appropriately adjusted. Examples of resin materials used for the first resin include thermosetting resins such as epoxy resins, modified epoxy resins, phenol resins, melamine resins, silicone resins, and modified silicone resins. In addition, it is preferable that the ink 5 further contains a filler in the first resin.

A light-absorbing material is a substance having a high light-absorbing rate with respect to external light. Moreover, the color of the light absorbing material is darker than the inner surface of the concave portion of the resin molding 2 . The light absorbing material is preferably black or a color close to black from the viewpoint of making the appearance appear blacker when the light emitting device 100 is not emitting light. The light absorbing material is preferably a substance that absorbs 90% or more of visible light, for example. Materials used for the light absorbing material include, for example, carbon black, pigments, and dyes. The particle size of the light absorbing material depends on the difference in specific gravity between the light absorbing material used and the first resin. For example, when carbon black is used as the light absorbing material, the average particle size is preferably about 3 nm or more and 500 nm or less. . The content concentration of the light absorbing material in the uncured first resin is, for example, about 5% by mass or more and 20% by mass or less.

The ink 5 is formed by covering at least a portion of the side surface 2b and the upper surface 2a of the resin molded body 2 . Here, on the side surface 2b of the resin molded body 2, only a portion located closer to the opening 3a of the concave portion 3 than the first convex portion 11 is coated with the ink 5, and the other portions of the side surface 2b are coated with the ink. 5 is exposed. The adhesion thickness of the ink 5 is preferably, for example, 5 μm or more and 20 μm or less. When the thickness of the ink 5 attached is 5 μm or more, extraction of light from the side surface 2 b of the resin molded body 2 can be suppressed. Also, if the thickness of the ink 5 adhered is 20 μm or less, the ink 5 can be easily applied. The adhesion thickness of the ink 5 on the upper surface 2a of the resin molded body 2 and the adhesion thickness of the ink 5 on the side surface 2b of the resin molded body 2 may be the same or different. The adhesion thickness of the ink 5 on the upper surface 2a of the resin molded body 2 is equal to or less than the height of the second convex portion 12 .

The adhesion thickness of the ink 5 described above can be formed by including a filler having an average particle diameter of 10% or more and less than 100% of the desired adhesion thickness of the ink 5 in the first resin. Among them, it is preferable to use a filler having an average particle diameter of 10% or more and less than 50% of the adhesion thickness of the ink 5, so that the surface of the ink layer can be formed flatter. Moreover, in this case, the content of the filler in the first resin is preferably 40% by mass or more and 80% by mass or less. The shape of the filler is preferably spherical in order to uniformly diffuse the filler in the first resin. In the example shown in FIG. 5B, the filler 7 is spherical and has an average particle size of about 30% of the thickness of the ink 5 adhered. Note that FIG. 5B is an enlarged view of the area indicated by the phantom line in FIG. 5A. Examples of filler materials include silicon carbide, silica, aluminum oxide, titanium carbide, zinc oxide, and zirconium oxide. Among them, silica-based fillers are used alone from the viewpoint of not impairing the appearance color of the ink. is preferred.
Further, the ink 5 may contain a nano-filler for adjusting viscosity, in addition to the filler described above. Examples of viscosity-adjusting particles include nanosilica.
The average particle size described above can be obtained, for example, by a laser diffraction/scattering method, an image analysis method (scanning electron microscope (SEM), transmission electron microscope (TEM)), dynamic light scattering method, X-ray small angle scattering method, and the like. can be measured by

[Light emitting element]
The light emitting element 40 is mounted on the concave portion 3 of the resin molding 2 . The light emitting element 40 includes, for example, a translucent supporting substrate and a semiconductor layer formed on the supporting substrate. The supporting substrate can be an insulating one, or a conductive one. The shape, size, etc. of the light emitting element 40 can be selected arbitrarily. As the emission color of the light emitting element 40, any wavelength can be selected depending on the application. For example, as the blue (light with a wavelength of 430 to 490 nm) and green (light with a wavelength of 495 to 565 nm) light emitting elements 40, a nitride-based semiconductor (In _X Al _Y Ga _1-XY N, 0≦X, 0 ≤ Y, X + Y ≤ 1), GaP or the like can be used. As the light emitting element 40 for red light (light having a wavelength of 610 to 700 nm), GaAlAs, AlInGaP, etc. can be used in addition to the nitride-based semiconductor element. The thickness of the light emitting element 40 (for example, the height from the lower surface of the support substrate to the upper surface of the semiconductor layer) is, for example, 100 μm or more and 300 μm or less.

The light emitting element 40 has a pair of electrodes on its upper surface and is face-up mounted on the bottom surface 3c of the recess 3 . A light-emitting element 40 is mounted on the lead 4 . Here, for example, as shown in FIG. 4, one electrode of the light emitting element 40 is connected to the lead 4b via a conductive member such as a wire 60, and the other electrode is connected to the lead 4d via a conductive member such as a wire 60. is joined to

The light-emitting device 100 may include multiple light-emitting elements 40 . Here, a light-emitting element 40 that emits three lights of blue, green, and red is arranged on the bottom surface 3c of the concave portion 3. As shown in FIG. However, the light-emitting device may be provided with one or two light-emitting elements 40, or may be provided with four or more.

[Sealing member]
The sealing member 50 is a member made of the resin material described above. The sealing member 50 is arranged and formed on the light emitting element 40 . The sealing member 50 may contain a phosphor, a diffusion material, a filler, or the like, depending on the purpose. As the phosphor, one known in the art can be used. For example, yellow phosphors such as YAG (Y ₃ Al ₅ O ₁₂ :Ce) and silicate; red phosphors such as CASN (CaAlSiN ₃ :Eu) and KSF (K ₂ SiF ₆ :Mn); ₄ : A green phosphor such as Eu ²⁺ can be used.
As the diffusing material, those known in the art can be used. For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be used.

<Second embodiment>
[Method for manufacturing light-emitting device]
Next, a method for manufacturing the light emitting device according to the second embodiment will be described. Below, the same steps as in the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted. In the manufacturing method of the light-emitting device according to this embodiment, the steps S11 and S13 performed after the package is completed are the same as the manufacturing steps in the above-described first embodiment, so description thereof will be omitted.

[Package manufacturing method]
A method of manufacturing the package will be described with reference to FIGS. 8A to 8G.
The method of manufacturing a package according to the present embodiment is a step of preparing a lead frame 1 having leads 4 and a resin molded body 2 integrally formed with the leads 4 and having a concave portion on the upper surface for accommodating a light emitting element. S1, step S2 of filling the cavity 21 of the mold 20 with the ink 5 darker than the inner surface of the recess, and filling the resin molding 2 with the ink 5 while the recess of the resin molding 2 is closed. A step S5 of disposing in the cavity 21 and attaching the ink 5 to the upper surface of the resin molded body 2 and at least part of the side surface of the resin molded body 2; and step S7.

Each step of the method for manufacturing the package will be described below, omitting it as appropriate.
As an example, as shown in FIGS. 8A and 8B, a mold 20 having a cavity 21 is used and a dummy block 28 is used. The mold 20 is similar to the mold 20 shown in FIG. 2A. The dummy block 28 has a protrusion on the surface of a plate-like member, for example. This projecting portion is formed in the same shape as the portion of the resin molded body 2 that is arranged in the cavity 21 . However, the projecting portion does not have to have the same structure as the recessed portion of the resin molded body 2 . Also, the dummy block may have a flat structure without protrusions. In addition, when the resin molding 2 is provided with the 1st convex part 11 and the 2nd convex part 12, you may be provided with the structure similar to them.
In step S1 of preparing a lead frame, for example, a lead frame 1 shown in FIG. 8D is prepared.

(Process of filling ink)
In the step S2 of filling the cavity of the mold with ink, first, as a preliminary step, a dummy block 28 is placed on the cavity block 24 by, for example, a suction mechanism, other mechanical means, or manually, as shown in FIG. 8B. put on. As a result, the lower surface of the plate-like portion of the dummy block 28 contacts the upper surface of the cavity block 24 , and the projecting portion of the dummy block 28 is arranged inside the cavity 21 . A predetermined pressure is applied between the dummy block 28 and the lower die 22 . At this time, between the surface of the cavity block 24 on the side of the cavity 21 and the surface of the protrusion of the dummy block 28, there is a slight gap through which ink can flow. Also, a slight gap through which ink can flow is created between the surface of the lower die 22 and the eject pin 23 on the cavity 21 side and the surface of the protruding portion of the dummy block 28 . When a dummy block having a flat structure is used, a space into which ink flows is created between the dummy block and the lower die 22 by bringing the eject pin 23 into contact with the dummy block.

Subsequently, while a predetermined pressure is applied between the dummy block 28 and the lower mold 22, ink is filled into the cavity 21 from the runner 25 of the mold as shown in FIG. 8C. The viscosity of the first resin that constitutes the ink 5 is adjusted so that the ink 5 stays on the inner surface of the cavity block 24 without slipping down. The ink flows into a small gap between the cavity 21 and the surface of the dummy block 28 and pushes out the air existing in the small gap. This air is then exhausted from the air vent 26 . After a predetermined molding time has passed, the pressure between the upper mold 27 and the lower mold 22 is released. Then, the dummy block 28 is removed from above the cavity block 24 by, for example, a suction mechanism, other mechanical means, or manually. At this time, the ink 5 remains in the cavity 21 of the mold 20 . That is, in the cavity 21 , the liquid ink 5 adheres and remains on the upper surface of the lower mold 22 , the upper surface of the eject pin 23 , and the inner surface of the cavity block 24 . Although the step S2 is performed after the step S1, the step S2 may be performed before the step S1.

(Step of attaching ink)
The step S5 of applying ink is the same step as the step S3 of arranging the resin molding in the cavity described in the first embodiment. That is, first, in a state in which the collet portion of the upper mold 27 adsorbs the resin molded body 2, the collet portion of the upper mold 27 is moved to the position of the cavity 21 as shown in FIG. transfer. At this time, the ink 5 remains in the cavity 21 of the mold 20 .

In the step S5 of applying ink, subsequently, as shown in FIG. 8E, the upper mold 27 is lowered together with the eject pin 23 of the mold 20 to place the resin molding 2 in the cavity 21 in which the ink 5 remains. . That is, the ink 5 is applied to the resin molding 2 with a stamp. At this time, the ink 5 is easily transferred to the side surface and the upper surface of the resin molding 2 simply by pressing the upper mold 27 and returning it immediately. There is a gap between the upper die 27 and the lower die 22 , and the leads 4 do not come into contact with the upper die 27 and the lower die 22 .

The step S7 of removing the resin molding from the mold is the same as in the first embodiment. That is, first, the upper mold 27 is lifted together with the eject pin 23 of the mold 20 as shown in FIG. , the lead frame 1 is picked up.

According to the method for manufacturing a light emitting device according to the present embodiment, if the ink 5 remains in the cavity 21 after the ink 5 is adhered to the resin molding 2, the remaining ink can be reused. can. Therefore, manufacturing costs can be reduced when manufacturing a plurality of packages.

<Third Embodiment>
[Method for manufacturing light-emitting device]
Next, a method for manufacturing the light emitting device according to the third embodiment will be described. Below, the same steps as in the second embodiment are given the same reference numerals, and the description thereof is omitted. In the manufacturing method of the light-emitting device according to this embodiment, the steps S11 and S13 performed after the package is completed are the same as the manufacturing steps in the above-described first embodiment, so description thereof will be omitted.

[Package manufacturing method]
A method of manufacturing the package will be described with reference to FIGS. 8A to 8G, 9 and 10. FIG.
In the package manufacturing method according to the present embodiment, the step of attaching the ink 5 is a step of placing the resin molding 2 in the cavity 21 filled with the ink 5 and then refilling the cavity 21 with the ink 5. Including S6.

In the package manufacturing method according to the present embodiment, ink is refilled between step S5 (FIG. 8E) of applying ink and step S7 (FIGS. 8F and 8G) of removing the resin molded body from the mold. The difference from the package manufacturing method according to the second embodiment is that step S6 (FIG. 10) is performed.

In the step S5 of applying ink, as shown in FIG. 8E, the upper mold 27 is pressed to apply the ink 5 to the resin molding 2 by means of a stamp. A predetermined pressure is applied between 27 and lower die 22 . When the upper mold 27 is pushed and immediately returned as in the second embodiment, the upper mold 27 is lowered again to apply a predetermined pressure between the upper mold 27 and the lower mold 22 .

(Step of refilling ink)
In the ink refilling step S6, ink is refilled into the cavity 21 from the runner 25 of the mold while a predetermined pressure is applied between the upper mold 27 and the lower mold 22, as shown in FIG. By doing so, the ink 5 is reattached to the resin molding 2 . This step S6 is the same as the step S5 of applying ink (see FIG. 2D), so a description thereof will be omitted.

According to the method of manufacturing a package according to the present embodiment, after the resin molding 2 is placed in the cavity 21 in which the ink 5 remains, the ink 5 is refilled into the cavity 21, so that the resin molding 2 is filled with the ink. 5 pressure can be applied. This makes it possible to stabilize the printing quality of the ink compared to the case of not refilling, which is suitable for mass production.

<Fourth Embodiment>
[Method for manufacturing light-emitting device]
Next, a method for manufacturing the light emitting device according to the fourth embodiment will be described with reference to FIGS. In the method for manufacturing a light-emitting device, the order of some steps is not limited, and the order may be changed. Below, the same steps as in the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.
A method for manufacturing a light emitting device according to the present embodiment includes a lead frame 1 including a lead 4 and a resin molded body 2 having a concave portion 3 formed integrally with the lead 4 and housing a light emitting element 40 on the upper surface 2a. a step S11 of mounting the light emitting element 40 in the recess 3; a step S13 of filling the sealing member 50 in the recess 3 so as to cover the light emitting element 40; Step S3 of placing the resin molded body 2 in the cavity 21 of the mold 20 in a closed state, filling the cavity 21 with ink 5 darker than the inner surface of the recess 3, and the upper surface 2a of the resin molded body 2 A step S5 of attaching the ink 5 to at least a part of the side surface 2b of the resin molding 2 and a step S7 of removing the resin molding 2 to which the ink 5 is attached from the mold 20 are included.
Each of the steps S1, S11, S13, S3, S5, and S7 described above is the same as the manufacturing steps in the first embodiment described above, so description thereof will be omitted.

In the method for manufacturing a light emitting device according to the present embodiment, the first point is that after filling the sealing member 50 in the concave portion 3 of the resin molding 2 so as to cover the light emitting element 40, the step S5 of applying ink is performed. It is different from the manufacturing method of the light emitting device according to the embodiment.
If, after completing the package by performing the step S5 of applying ink, the sealing member 50 is filled in the concave portion 3 of the package so as to cover the light emitting element 40, the sealing member 50 may be placed on the ink 5 on the upper surface of the package. There is a possibility that it will get wet and spread and cause shine. Therefore, a removal process is required to remove the unnecessary material of the sealing member that has leaked onto the ink on the upper surface of the package, for example, by blasting.
According to the method for manufacturing a light emitting device according to the present embodiment, the step S5 of applying ink is performed after filling the sealing member 50, so that the sealing member does not leak onto the ink on the upper surface of the package, and unnecessary The manufacturing cost can be reduced without the step of removing the sealing member.

<Fifth Embodiment>
Next, a method for manufacturing the light emitting device according to the fifth embodiment will be described with reference to FIGS. Below, the same reference numerals are assigned to the same configurations as in the first and second embodiments, and the description thereof is omitted.
A method for manufacturing a light emitting device according to the present embodiment includes a lead frame 1 including a lead 4 and a resin molded body 2 having a concave portion 3 formed integrally with the lead 4 and housing a light emitting element 40 on the upper surface 2a. a step S11 of mounting the light emitting element 40 in the recess 3; a step S13 of filling the sealing member 50 in the recess 3 so as to cover the light emitting element 40; Step S2 of filling the ink 5 darker than the inner surface of the recess 3, and placing the resin molding 2 in the cavity 21 filled with the ink 5 with the interior of the recess 3 of the resin molding 2 closed, and performing resin molding. It includes a step S5 of attaching the ink 5 to the upper surface 2a of the body 2 and at least a part of the side surface 2b of the resin molding 2, and a step S7 of removing the resin molding 2 to which the ink 5 is attached from the mold 20.
Each of the steps S1, S11, S13, S2, S5, and S7 described above is the same as the manufacturing steps in the first and second embodiments described above, so description thereof will be omitted.
According to the method for manufacturing the light emitting device according to this embodiment, the manufacturing cost can be reduced as in the fourth embodiment.

<Sixth embodiment>
Next, a method for manufacturing the light emitting device according to the sixth embodiment will be described with reference to FIGS. Below, the same code|symbol is attached|subjected to the same structure as 5th Embodiment, and description is abbreviate|omitted.
In the method for manufacturing a light-emitting device according to the present embodiment, the step of applying the ink 5 includes placing the resin molding 2 in the cavity 21 filled with the ink 5, and then refilling the cavity 21 with the ink 5. The manufacturing process of the fifth embodiment is different in that step S6 is included. The step S6 of refilling the ink according to this embodiment is the same as the step S6 of refilling the ink in the manufacturing method of the package according to the third embodiment described above, so the description thereof will be omitted.

As described above, the light emitting device according to the present invention has been specifically described by the embodiments for carrying out the invention. should be interpreted broadly. In addition, it goes without saying that various changes and modifications based on these descriptions are also included in the gist of the present invention.

For example, although the light-emitting device has been described to mount the light-emitting element face-up, the light-emitting element may be flip-chip mounted.
Further, the method for manufacturing a light-emitting device may include other steps between, or before and after each of the steps, as long as they do not adversely affect each of the steps. For example, a foreign matter removing step or the like for removing foreign matter mixed in during manufacturing may be included.

[Section 1]
a step of preparing a lead frame comprising a lead and a resin molded body integrally molded with the lead and having a concave portion on the upper surface for accommodating a light emitting element;
a step of placing the resin molded body in a cavity of a mold with the concave portion of the resin molded body closed;
a step of filling the cavity with an ink darker than the inner surface of the recess, and attaching the ink to the upper surface of the resin molded body and at least part of the side surface of the resin molded body;
and a step of removing the resin molding to which the ink is adhered from the mold.

[Section 2]
a step of preparing a lead frame comprising a lead and a resin molded body integrally molded with the lead and having a concave portion on the upper surface for accommodating a light emitting element;
filling the cavity of the mold with an ink darker than the inner surface of the recess;
The resin molded body is arranged in the cavity filled with the ink in a state in which the concave portion of the resin molded body is closed, and the upper surface of the resin molded body and at least a part of the side surface of the resin molded body are covered with the ink. a step of applying ink;
and a step of removing the resin molding to which the ink is adhered from the mold.

[Section 3]
Item 3. The method of manufacturing a package according to item 2, wherein the step of applying the ink includes a step of refilling the cavity with the ink after placing the resin molding in the cavity filled with the ink. .

[Section 4]
In the step of applying the ink,
4. The method of manufacturing a package according to any one of items 1 to 3, wherein the viscosity of the ink filled in the cavity is about 300 Pa·s/0.5 rpm or more and 800 Pa·s/0.5 rpm or less.

[Section 5]
In the step of applying the ink,
Item 5. The method for manufacturing a package according to any one of Items 1 to 4, wherein the thickness of the ink adhered is 5 μm or more and 20 μm or less.

[Section 6]
Item 6. The method of manufacturing a package according to any one of Items 1 to 5, wherein the ink contains a filler having an average particle diameter of 10% or more and less than 50% of the adhesion thickness of the ink.

[Section 7]
The resin molded body has a first convex portion on the side surface,
Item 7. The method of manufacturing a package according to any one of items 1 to 6, wherein in the step of attaching the ink, the ink is attached to a region on the upper surface side of the side surface of the resin molded body with respect to the first convex portion.

[Item 8]
Item 8. The method of manufacturing a package according to Item 7, wherein the first convex portion of the resin molded body is arranged below the bottom surface of the concave portion of the resin molded body.

[Item 9]
The resin molded body has a second convex portion on the upper surface of the opening peripheral edge of the concave portion,
Item 9. The method of manufacturing a package according to any one of items 1 to 8, wherein in the step of attaching the ink, the ink is attached to a region on the side surface side of the second convex portion on the upper surface of the resin molded body.

[Item 10]
The lead frame includes a plurality of resin moldings connected via the leads,
Item 10. The method of manufacturing a package according to any one of Items 1 to 9, wherein each step is performed using a mold in which a plurality of cavities are formed.

[Item 11]
A step of manufacturing a package by the package manufacturing method according to any one of Items 1 to 10;
a step of mounting a light emitting element in the recess;
filling a sealing member into the recess so as to cover the light emitting element.

[Item 12]
a step of preparing a lead frame comprising a lead and a resin molded body integrally molded with the lead and having a concave portion on the upper surface for accommodating a light emitting element;
a step of mounting a light emitting element in the recess;
filling the recess with a sealing member so as to cover the light emitting element;
a step of placing the resin molded body in a cavity of a mold with the concave portion of the resin molded body closed;
a step of filling the cavity with an ink darker than the inner surface of the recess, and attaching the ink to the upper surface of the resin molded body and at least part of the side surface of the resin molded body;
and removing the molded resin article to which the ink is adhered from the mold.

[Item 13]
a step of preparing a lead frame comprising a lead and a resin molded body integrally molded with the lead and having a concave portion on the upper surface for accommodating a light emitting element;
a step of mounting a light emitting element in the recess;
filling the recess with a sealing member so as to cover the light emitting element;
filling the cavity of the mold with an ink darker than the inner surface of the recess;
The resin molded body is arranged in the cavity filled with the ink in a state in which the concave portion of the resin molded body is closed, and the upper surface of the resin molded body and at least a part of the side surface of the resin molded body are covered with the ink. a step of applying ink;
and removing the molded resin article to which the ink is adhered from the mold.

[Item 14]
Item 14. Manufacturing a light-emitting device according to Item 13, wherein the step of applying the ink includes a step of refilling the cavity with the ink after placing the resin molding in the cavity filled with the ink. Method.

[Item 15]
The resin molded body has a first convex portion on the side surface,
Item 15. The method for manufacturing a light-emitting device according to any one of Items 12 to 14, wherein, in the step of applying the ink, the ink is applied to a region on the upper surface side of the side surface of the resin molded body relative to the first convex portion. .

[Item 16]
Item 16. The method for manufacturing a light-emitting device according to Item 15, wherein the first convex portion of the resin molded body is arranged below the bottom surface of the concave portion of the resin molded body.

[Item 17]
The resin molded body has a second convex portion on the upper surface of the opening peripheral edge of the concave portion,
Item 17. The method for manufacturing a light-emitting device according to any one of Items 12 to 16, wherein in the step of applying the ink, the ink is applied to a region on the side surface side of the second convex portion on the upper surface of the resin molded body. .

[Item 18]
The lead frame includes a plurality of resin moldings connected via the leads,
Item 18. The method of manufacturing a light-emitting device according to any one of Items 12 to 17, wherein each step is performed using a mold in which a plurality of cavities are formed.

Reference Signs List 1 lead frame 2 resin molding 2a upper surface 2b side surface 3 concave portion 3a opening 3b wall surface portion 3c bottom surface 4, 4a to 4d lead 5 ink 7 filler 11 first convex portion 12 second convex portion 20 mold 21 cavity 30 package 40 light emitting element 50 sealing member 100 light emitting device

Claims (6)

a step of preparing a lead frame comprising a lead and a resin molded body integrally molded with the lead and having a concave portion on the upper surface for accommodating a light emitting element;
a step of placing a protruding portion of a dummy block in a cavity of a lower mold and filling a space between the cavity and the dummy block with ink darker than the inner surface of the recess;
A step of lowering the upper mold to dispose the resin molding in the cavity filled with the ink, and attaching the ink to the upper surface of the resin molding and at least a part of the side surface of the resin molding. When,
and removing the resin molding to which the ink is adhered from the lower mold. 2. The manufacturing of the package according to claim 1, wherein the step of applying the ink includes a step of refilling the cavity with the ink after placing the resin molding in the cavity filled with the ink. Method. In the step of applying the ink,
3. The method of manufacturing a package according to claim 1, wherein the ink has a thickness of 5 [mu]m or more and 20 [mu]m or less. The resin molded body has a first convex portion on the side surface,
4. The manufacturing of the package according to any one of claims 1 to 3, wherein in the step of applying the ink, the ink adheres to a region on the upper surface side of the first convex portion on the side surface of the resin molded body. Method. 5. The method of manufacturing a package according to claim 4, wherein the first convex portion of the resin molded body is arranged below the bottom surface of the concave portion of the resin molded body. The resin molded body has a second convex portion on the upper surface of the opening peripheral edge of the concave portion,
6. The manufacturing of the package according to any one of claims 1 to 5, wherein in the step of applying the ink, the ink adheres to a region on the side surface side of the second convex portion on the upper surface of the resin molded body. Method.

Images