JP7186419B2 - Magnetic body detection device - Google Patents

Magnetic body detection device Download PDF

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JP7186419B2
JP7186419B2 JP2018139966A JP2018139966A JP7186419B2 JP 7186419 B2 JP7186419 B2 JP 7186419B2 JP 2018139966 A JP2018139966 A JP 2018139966A JP 2018139966 A JP2018139966 A JP 2018139966A JP 7186419 B2 JP7186419 B2 JP 7186419B2
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magnetoresistive element
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信助 望月
智之 堤
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Kohden Co Ltd
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Description

本発明は、移動する検証物に含まれる磁性体を検出する磁性体検出装置に関する。 The present invention relates to a magnetic substance detection device for detecting a magnetic substance contained in a moving verification object.

一般に、紙幣、有価証券などの検証物に、磁性体を用いて所定のパターンを形成することは知られている。例えば、検証物に、磁気インクを用いて、所定の模様が印刷される。また、検証物に、帯状のパターンが漉き込まれる。それらの流通過程にて、前記磁性体のパターンを検出し、前記検出したパターンと正規のパターンとを比較することにより、それらの真偽が判定される。 Generally, it is known to form a predetermined pattern on a verifiable object such as bills and securities using a magnetic material. For example, a predetermined pattern is printed on the verification object using magnetic ink. Also, a belt-like pattern is drawn into the verification object. During the distribution process, the pattern of the magnetic material is detected, and the authenticity of the magnetic material is determined by comparing the detected pattern with a normal pattern.

上記の用途に好適な磁性体検出装置が、例えば、下記特許文献1に示されている。この磁性体検出装置は、所定の搬送路を磁性体が通過することによるバイアス磁界の変化を検出して、前記検出したバイアス磁界の変化に応じた電圧波形を出力する検出器を備えている。 A magnetic body detection device suitable for the above application is disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-200010. This magnetic body detection device includes a detector that detects a change in a bias magnetic field caused by a magnetic body passing through a predetermined transport path and outputs a voltage waveform corresponding to the detected change in the bias magnetic field.

ここで、検証物の磁性体が硬磁性体で構成される場合には、検証物の流通過程において、その磁性体が磁化され、その磁化状態が保持されている可能性がある。この場合、磁化状態が検証物ごとに異なり、検出器を用いて検出した磁性体のパターン(出力電圧波形)が正規のパターンとは異なるため、検証物の真偽を高精度に判定できない。そこで、特許文献1の磁性体検出装置は、上記の検出器のみならず、検証物の磁性体の磁化状態を予め所定の状態に矯正する磁化器も備えている。 Here, when the magnetic substance of the verification object is made of a hard magnetic substance, the magnetic substance may be magnetized during the distribution process of the verification object, and the magnetized state may be maintained. In this case, the magnetization state differs for each object to be verified, and the pattern of the magnetic material (output voltage waveform) detected by the detector is different from the normal pattern. Therefore, the magnetic material detection device of Patent Document 1 includes not only the above-described detector but also a magnetizer for preliminarily correcting the magnetization state of the magnetic material of the object to be verified to a predetermined state.

特開2014-190734号公報JP 2014-190734 A

上記特許文献1の磁化器は、検出器の前段に配置されている。つまり、磁化器と検出器とが別々に構成され、それらが検証物の搬送方向に離間している。したがって、磁性体検出装置全体としての寸法(とくに、検証物の移動方向の寸法)が比較的大きくなる傾向にある。また、磁化器と検出器とを別々に構成しているので、部品点数が多い。 The magnetizer of Patent Document 1 is arranged in front of the detector. That is, the magnetizer and the detector are constructed separately and are spaced apart in the conveying direction of the verification object. Therefore, there is a tendency for the size of the magnetic body detection device as a whole (especially the size in the moving direction of the object to be verified) to become relatively large. Moreover, since the magnetizer and the detector are configured separately, the number of parts is large.

本発明は上記問題に対処するためになされたもので、その目的は、部品点数を削減するとともに小型化した磁性体検出装置を提供することにある。なお、下記本発明の各構成要件の記載においては、本発明の理解を容易にするために、実施形態の対応箇所の符号を括弧内に記載しているが、本発明の各構成要件は、実施形態の符号によって示された対応箇所の構成に限定解釈されるべきものではない。 SUMMARY OF THE INVENTION The present invention has been made to address the above problem, and an object of the present invention is to provide a compact magnetic body detection device with a reduced number of parts. In addition, in the description of each constituent element of the present invention below, in order to facilitate understanding of the present invention, the symbols corresponding to the embodiments are described in parentheses, but each constituent element of the present invention is It should not be construed as being limited to the configurations of the corresponding portions indicated by the reference numerals in the embodiment.

上記目的を達成するために、本発明の特徴は、所定の搬送路(L)に沿って第1方向(前後方向)へ移動する検証物(OB)に含まれる磁性体(MS)を検出するための磁性体検出装置(1、1A)であって、前記第1方向に直交する第2方向(左右方向)に延設された第1磁石(M1)であって、前記第1方向に交差し、且つ前記第2方向に直交する方向に磁化され、その一方の磁極面が前記搬送路に対面配置されている第1磁石と、前記第1磁石から見て前記第1方向に離間した位置にて前記第2方向に延設されていて、前記第1磁石とは反対方向に磁化された第2磁石であって、前記第1磁石の一方の磁極面の磁極とは反対の磁極である磁極面が前記搬送路に対面配置され、前記第1磁石と協働して、前記第1磁石との間の所定の空間に磁界を形成する第2磁石(M2)と、前記第1磁石と前記第2磁石との間の所定の空間に形成された前記磁界の磁力線経路内に配置された基板(22)、及び前記基板の表面にて前記第2方向に対して所定の角度だけ傾斜した方向へ延びる線状部分を有するように形成されていて、前記基板の表面内における前記第2方向に直交する方向の前記磁界の変化に対して電気抵抗値が変化する磁気抵抗効果素子(23、24、23-1、23-2、24-1、24-2)を有する磁気センサ回路(MC)と、を備え、前記第1磁石と前記第2磁石とが協働して形成された前記磁界により、前記磁気抵抗効果素子の飽和磁界より小さな強さのバイアス磁界であって、前記磁気抵抗効果素子に対して前記基板の表面内の前記第2方向に直交する方向へ向けられたバイアス磁界(H1x、H2x)が付与され、且つ前記第1磁石の近傍の所定の領域内にて前記検証物の磁性体が前記第1磁石と前記第2磁石とが協働して形成された前記磁界の影響を受けて所定の状態に磁化されるように、前記第1磁石と前記第2磁石との間の空間に前記磁気センサ回路を配置するとともに、前記第1磁石の前記磁極面と前記検証物の搬送路との距離を前記第2磁石の前記磁極面と前記搬送路との距離よりも小さく設定したことを特徴とする磁性体検出装置としたことにある。
In order to achieve the above object, a feature of the present invention is to detect a magnetic material (MS) contained in a verification object (OB) moving in a first direction (back and forth direction) along a predetermined transport path (L). A magnetic body detection device (1, 1A) for a magnetic material detection device (1, 1A) for and a first magnet which is magnetized in a direction orthogonal to the second direction and whose one magnetic pole surface is arranged to face the conveying path , and a position spaced apart in the first direction when viewed from the first magnet. A second magnet extending in the second direction at and magnetized in the opposite direction to the first magnet, and having a magnetic pole opposite to the magnetic pole of one magnetic pole surface of the first magnet a second magnet (M2) having a magnetic pole surface facing the conveying path and cooperating with the first magnet to form a magnetic field in a predetermined space between the first magnet and the first magnet; a substrate (22) arranged in a magnetic force line path of the magnetic field formed in a predetermined space between the second magnet and a substrate (22) inclined at a predetermined angle with respect to the second direction on the surface of the substrate (22); a magnetoresistive element (23 , 24, 23-1, 23-2, 24-1, 24-2), wherein the first magnet and the second magnet are formed in cooperation with each other. A bias magnetic field having a strength smaller than the saturation magnetic field of the magnetoresistive effect element and directed to the magnetoresistive effect element in a direction perpendicular to the second direction in the surface of the substrate. (H1x, H2x) is given, and the magnetic body of the verification object is formed by the cooperation of the first magnet and the second magnet in a predetermined area near the first magnet. The magnetic sensor circuit is arranged in the space between the first magnet and the second magnet so as to be magnetized to a predetermined state under the influence of the magnetic pole face of the first magnet and the verification The magnetic body detection device is characterized in that the distance from the object conveying path is set smaller than the distance between the magnetic pole surface of the second magnet and the conveying path.

この場合、前記検証物の磁性体の磁化状態が前記第2磁石の近傍の所定の領域内にて変化しないように、前記搬送路と前記第2磁石との距離を設定するとよい。 In this case, the distance between the conveying path and the second magnet is preferably set so that the magnetization state of the magnetic material of the verification object does not change within a predetermined area near the second magnet.

また、この場合、前記第2磁石から見て前記第1磁石とは反対方向に離間した位置にて前記第2方向に延設された第3磁石であって、前記第1方向に交差し、且つ前記第2方向に直交する方向に磁化され、その一方の磁極面が前記搬送路に対面配置されていて、前記第1磁石及び前記第2磁石と協働して、前記第2磁石との間の所定の空間に磁界を形成するとともに、前記第1磁石と前記第2磁石との間の所定の空間に磁界を形成する第3磁石をさらに備え、前記第1磁石乃至前記第3磁石が協働して前記第1磁石と前記第2磁石との間に形成された磁界により、前記磁気抵抗効果素子の飽和磁界より小さな強さのバイアス磁界であって、前記磁気抵抗効果素子に対して前記基板の表面内の前記第2方向に直交する方向へ向けられたバイアス磁界が付与され、且つ前記第1磁石の近傍の所定の領域内にて前記検証物の磁性体が前記第1磁石と前記第2磁石との間に形成された前記磁界の影響を受けて所定の状態に磁化され、さらに、前記第3磁石の近傍の所定の領域内にて前記検証物の磁性体が前記第2磁石と前記第3磁石との間に形成された前記磁界の影響を受けて所定の状態に磁化されるように、前記第1磁石と前記第2磁石の間の空間に前記磁気センサ回路を配置するとともに、前記第1磁石の前記磁極面と前記搬送路との距離、及び前記第3磁石の前記磁極面と前記搬送路との距離を前記第2磁石の前記磁極面と前記搬送路との距離よりも小さく設定するとよい。
Further, in this case, a third magnet extending in the second direction at a position spaced apart in the opposite direction from the first magnet when viewed from the second magnet, intersecting the first direction, and magnetized in a direction orthogonal to the second direction, one of the magnetic pole surfaces is arranged to face the conveying path, and cooperates with the first magnet and the second magnet to cooperate with the second magnet. Further comprising a third magnet that forms a magnetic field in a predetermined space between the first magnet and the second magnet and that forms a magnetic field in a predetermined space between the first magnet and the second magnet, wherein the first to third magnets A magnetic field cooperatively formed between the first magnet and the second magnet produces a bias magnetic field having a strength smaller than the saturation magnetic field of the magnetoresistive element, and the bias magnetic field is applied to the magnetoresistive element. A bias magnetic field directed in a direction orthogonal to the second direction within the surface of the substrate is applied, and the magnetic material of the verification object is aligned with the first magnet within a predetermined region in the vicinity of the first magnet. It is magnetized in a predetermined state under the influence of the magnetic field formed between it and the second magnet. The magnetic sensor circuit is arranged in the space between the first magnet and the second magnet so as to be magnetized in a predetermined state under the influence of the magnetic field formed between the magnet and the third magnet. Further, the distance between the magnetic pole surface of the first magnet and the transportation path and the distance between the magnetic pole surface of the third magnet and the transportation path are set to the distances between the magnetic pole surface of the second magnet and the transportation path. It should be set smaller than the distance .

また、この場合、前記第1磁石の磁化方向と前記第3磁石の磁化方向とが同一方向であるとよい。 In this case, the magnetization direction of the first magnet and the magnetization direction of the third magnet may be the same.

なお、本発明における第2磁石は、磁界の影響を受けて磁石としての性質を帯びる物体を含むものとする。 It should be noted that the second magnet in the present invention includes an object that takes on the properties of a magnet under the influence of a magnetic field.

検証物が搬送路を通過する際、検証物の磁性体が磁気抵抗効果素子に近づくと、検証物の磁性体の影響を受けて、バイアス磁界が変化する。これにより、磁気抵抗効果素子の電気抵抗値が変化する。この電気抵抗値の変化に基づいて、検証物の真偽を判定できる。 When the object to be verified passes through the transport path, when the magnetic material of the object to be verified approaches the magnetoresistive effect element, the bias magnetic field changes under the influence of the magnetic material of the object to be verified. This changes the electrical resistance value of the magnetoresistive element. The authenticity of the verification object can be determined based on the change in the electric resistance value.

本発明においては、第1磁石の磁極面と搬送路との距離が、第2磁石の磁極面と搬送路との距離よりも小さく設定されている。これにより、検証物が、搬送路を通過する際、磁気抵抗効果素子に接近する前に、第1磁石によって、検証物の磁性体の磁化状態が所定の状態に矯正される。すなわち、検証物の流通過程において、その硬磁性が前記所定の状態とは異なる状態に磁化されていたとしても、予め、検証物の磁性体の磁化状態が矯正される。このように、検証物の磁性体の磁化状態を矯正することにより、真の検証物であれば、バイアス磁界の変化が所定の基準の変化に一致するので、磁気抵抗効果素子の電気抵抗値の変化も、所定の基準の変化に一致する。よって、本発明によれば、検証物の真偽を高精度に判定できる。また、本発明に係る磁性体検出装置では、バイアス磁界を形成する第1磁石を用いて、検証物の磁性体の磁化状態を矯正するため、従来の磁性体検出装置のような磁化器を別途設ける必要がない。よって、本発明によれば、部品点数を削減できる。また、磁性体検出装置を小型化できる。 In the present invention, the distance between the magnetic pole surface of the first magnet and the transport path is set smaller than the distance between the magnetic pole surface of the second magnet and the transport path. As a result, when the object to be verified passes through the transport path, the magnetization state of the magnetic material of the object to be verified is corrected to a predetermined state by the first magnet before it approaches the magnetoresistive effect element. That is, even if the hard magnetism of the verification object is magnetized in a state different from the predetermined state during the distribution process of the verification object, the magnetization state of the magnetic material of the verification object is corrected in advance. By correcting the magnetization state of the magnetic material of the object to be verified in this way, if it is a true object to be verified, the change in the bias magnetic field will match the change in the predetermined reference. The changes also correspond to changes in the predetermined criteria. Therefore, according to the present invention, the authenticity of the verification object can be determined with high accuracy. In addition, in the magnetic body detection device according to the present invention, since the magnetization state of the magnetic body of the verification object is corrected using the first magnet that forms the bias magnetic field, a magnetizer like the conventional magnetic body detection device is separately provided. No need to set. Therefore, according to the present invention, the number of parts can be reduced. Also, the magnetic body detection device can be miniaturized.

また、第1磁石及び第2磁石は、長尺状に形成されて第2方向にそれぞれ平行に延設されている。したがって、第1磁石及び第2磁石による磁力線は第2方向に直交する平面内にて楕円状に発生され、第1磁石及び第2磁石の形状、特に磁極面部分の形状に多少の誤差があっても、磁力線の方向は安定して、磁気抵抗効果素子を通過する磁力線は常に一定方向となる。その結果、磁気抵抗効果素子に付与される基板の平面内の第2方向に直交する方向のバイアス磁界が安定化し、磁性体の移動による磁気抵抗効果素子の電気抵抗値の変化を安定化させることができ、磁性体を高精度に検出できるようになる。また、第1磁石と第2磁石の距離、姿勢などを調整することにより、磁力線の通過経路の形状を種々に変更することができ、磁気抵抗効果素子に対するバイアス磁界の設定が簡単になる。 Also, the first magnet and the second magnet are formed in an elongated shape and extend parallel to each other in the second direction. Therefore, the magnetic lines of force generated by the first magnet and the second magnet are elliptical in the plane perpendicular to the second direction, and the shapes of the first and second magnets, particularly the shape of the magnetic pole faces, have some errors. However, the direction of the lines of magnetic force is stable, and the lines of magnetic force passing through the magnetoresistive element always have a constant direction. As a result, the bias magnetic field applied to the magnetoresistive element in the direction orthogonal to the second direction in the plane of the substrate is stabilized, and the change in the electrical resistance value of the magnetoresistive element due to the movement of the magnetic body is stabilized. It is possible to detect magnetic bodies with high accuracy. Further, by adjusting the distance and posture between the first magnet and the second magnet, the shape of the passage of the magnetic lines of force can be changed in various ways, which simplifies the setting of the bias magnetic field for the magnetoresistive effect element.

また、本発明の他の特徴は、前記磁気抵抗効果素子は、前記基板の表面内における前記第2方向の同一位置にて互いに対向する第1磁気抵抗素子及び第2磁気抵抗素子を有し、前記第1磁気抵抗素子及び前記第2磁気抵抗素子に対する前記バイアス磁界が反対方向になるように、前記磁界を設定するとともに前記磁気センサ回路を配置した磁性体検出装置としたことにある。
Another feature of the present invention is that the magnetoresistive element has a first magnetoresistive element and a second magnetoresistive element facing each other at the same position in the second direction within the surface of the substrate , In the magnetic body detection device, the magnetic field is set and the magnetic sensor circuit is arranged such that the bias magnetic field for the first magnetoresistive element and the second magnetoresistive element are directed in opposite directions.

これによれば、基板の平面内における第1磁気抵抗素子及び第2磁気抵抗素子の延設方向に直交する方向に付与されるバイアス磁界がほぼ反対方向であって同じ大きさになり、磁性体の第1方向への移動による第1磁気抵抗素子及び第2磁気抵抗素子の電気抵抗値の変化を正負反対方向にほぼ対称に変化させるようにでき、第1磁気抵抗素子及び第2磁気抵抗素子の電気抵抗値の変化を利用し易くすることができる。 According to this, the bias magnetic field applied in the direction orthogonal to the extending direction of the first magnetoresistive element and the second magnetoresistive element in the plane of the substrate is almost opposite in direction and has the same magnitude, and the magnetic body The change in the electrical resistance value of the first magnetoresistive element and the second magnetoresistive element due to the movement in the first direction can be changed substantially symmetrically in the positive and negative directions, and the first magnetoresistive element and the second magnetoresistive element change in electrical resistance can be easily utilized.

また、本発明の他の特徴は、第1磁気抵抗素子(23)と第2磁気抵抗素子(24)を直列に接続し、両端に所定電圧を印加して第1磁気抵抗素子と第2磁気抵抗素子の接続点の電圧を取り出す電気回路(31)を備えたことにある。 Another feature of the present invention is that the first magnetoresistive element (23) and the second magnetoresistive element (24) are connected in series, and a predetermined voltage is applied to both ends of the first magnetoresistive element and the second magnetoresistive element. It is provided with an electric circuit (31) for taking out the voltage at the connection point of the resistive element.

これによれば、第1磁気抵抗素子及び第2磁気抵抗素子はハーフブリッジ接続されるので、大きな出力電圧を取り出すことができる。 According to this, since the first magnetoresistive element and the second magnetoresistive element are half-bridge connected, a large output voltage can be obtained.

また、本発明の他の特徴は、前記磁気抵抗効果素子は、さらに、前記基板の表面内において、前記第1磁気抵抗素子(23-1)及び前記第2磁気抵抗素子(24-1)から見て前記第2方向に離間した位置にそれぞれ設けられ、前記基板の表面内における前記第2方向の同一位置にて互いに対向する第3磁気抵抗素子及び第4磁気抵抗素子であって、前記基板の表面内における前記第2方向と直交する方向の磁界の変化に対して電気抵抗値が変化する第3磁気抵抗素子(23-2)及び第4磁気抵抗素子(24-2)を有し、
前記第3磁気抵抗素子及び前記第4磁気抵抗素子に対する前記バイアス磁界が反対方向になるように構成し、さらに、前記第1磁気抵抗素子の前記第3磁気抵抗素子側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子側の端子を接続し、前記第2磁気抵抗素子の前記第4磁気抵抗素子側の端子と前記第3磁気抵抗素子の前記第1磁気抵抗素子側の端子を接続し、前記第1磁気抵抗素子の前記第3磁気抵抗素子と反対側の端子と前記第2磁気抵抗素子の前記第4磁気抵抗素子と反対側の端子を接続し、かつ前記第3磁気抵抗素子の前記第1磁気抵抗素子と反対側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子と反対側の端子を接続し、前記第1磁気抵抗素子と前記第2磁気抵抗素子の接続点と、前記第3磁気抵抗素子と前記第4磁気抵抗素子の接続点との間に所定電圧を印加して、前記第1磁気抵抗素子と前記第4磁気抵抗素子の接続点の電圧と、前記第2磁気抵抗素子と前記第3磁気抵抗素子の接続点の電圧との差電圧を取り出す電気回路(32)を備えた磁性体検出装置としたことにある。
Another feature of the present invention is that the magnetoresistive effect element further comprises: a third magnetoresistive element and a fourth magnetoresistive element provided at positions spaced apart in the second direction when viewed and opposed to each other at the same position in the second direction within the surface of the substrate , the substrate a third magnetoresistive element (23-2) and a fourth magnetoresistive element (24-2) whose electrical resistance changes with respect to a change in the magnetic field in the direction perpendicular to the second direction in the surface of the
The bias magnetic field for the third magneto-resistive element and the fourth magneto-resistive element are configured to be in opposite directions, and further, the terminal of the first magneto-resistive element on the side of the third magneto-resistive element and the fourth magneto-resistive element. The terminal of the resistance element on the side of the second magnetoresistance element is connected, and the terminal of the second magnetoresistance element on the side of the fourth magnetoresistance element and the terminal of the third magnetoresistance element on the side of the first magnetoresistance element are connected. connecting, connecting the terminal of the first magnetoresistance element opposite to the third magnetoresistance element and the terminal of the second magnetoresistance element opposite to the fourth magnetoresistance element, and connecting the third magnetoresistance The terminal of the element opposite to the first magnetoresistance element and the terminal of the fourth magnetoresistance element opposite to the second magnetoresistance element are connected, and the first magnetoresistance element and the second magnetoresistance element are connected. A predetermined voltage is applied between the connection point and the connection point between the third magnetoresistive element and the fourth magnetoresistive element, and the voltage at the connection point between the first magnetoresistive element and the fourth magnetoresistive element and a magnetic body detection device comprising an electric circuit (32) for extracting a differential voltage between the voltage at the connection point of the second magnetoresistive element and the third magnetoresistive element.

これによれば、第1磁気抵抗素子、第2磁気抵抗素子、第3磁気抵抗素子及び第4磁気抵抗素子はフルブリッジ接続されるので、出力電圧を前記ハーフブリッジ接続の場合の2倍にすることができる。また、電気回路が、第1磁気抵抗素子と第4磁気抵抗素子の接続点の電圧と、第2磁気抵抗素子と第3磁気抵抗素子の接続点の電圧との差電圧を出力することにより、第1磁気抵抗素子及び第3磁気低抵抗素子の電気抵抗値の変化をもたらすバイアス磁界と、第2磁気抵抗素子及び第4磁気低抵抗素子の電気抵抗値の変化をもたらすバイアス磁界とにそれぞれノイズが含まれていても、これらのノイズがもたらす抵抗値変化が互いに相殺されて、出力電圧のS/N比が向上する。 According to this, since the first magnetoresistive element, the second magnetoresistive element, the third magnetoresistive element and the fourth magnetoresistive element are connected in a full bridge, the output voltage is doubled compared to the case of the half bridge connection. be able to. Further, the electric circuit outputs the difference voltage between the voltage at the connection point of the first magnetoresistive element and the fourth magnetoresistive element and the voltage at the connection point of the second magnetoresistive element and the third magnetoresistive element, Noise in the bias magnetic field that causes changes in the electrical resistance values of the first and third magnetic low-resistance elements and the bias magnetic field that causes changes in the electrical resistance values of the second and fourth magnetic low-resistance elements is included, resistance value changes caused by these noises cancel each other out, and the S/N ratio of the output voltage is improved.

また、本発明の他の特徴は、前記磁気抵抗効果素子は、さらに、前記基板の表面内において、前記第1磁気抵抗素子(23-1)及び前記第2磁気抵抗素子(24-1)から見て前記第2方向に離間した位置にそれぞれ設けられ、前記基板の表面内における前記第2方向の同一位置にて互いに対向する第3磁気抵抗素子及び第4磁気抵抗素子であって、前記基板の表面内における前記第2方向と直交する方向の磁界の変化に対して電気抵抗値が変化する第3磁気抵抗素子(23-2)及び第4磁気抵抗素子(24-2)を有し、前記第3磁気抵抗素子及び前記第4磁気抵抗素子に対する前記バイアス磁界が反対方向になるように構成し、さらに、前記第1磁気抵抗素子の前記第3磁気抵抗素子と反対側の端子と前記第2磁気抵抗素子の前記第4磁気抵抗素子と反対側の端子を接続し、前記第3磁気抵抗素子の前記第1磁気抵抗素子の反対側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子と反対側の端子を接続し、前記第1磁気抵抗素子の前記第3磁気抵抗素子側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子側の端子を接続し、かつ前記第2磁気抵抗素子の前記第4磁気抵抗素子側の端子と前記第3磁気抵抗素子の前記第1磁気抵抗素子側の端子を接続し、前記第1磁気抵抗素子と前記第4磁気抵抗素子の接続点と、前記第2磁気抵抗素子と前記第3磁気抵抗素子の接続点との間に所定電圧を印加して、前記第1磁気抵抗素子と前記第2磁気抵抗素子の接続点の電圧と、前記第3磁気抵抗素子と前記第4磁気抵抗素子の接続点の電圧との差電圧を取り出す電気回路(32)を備えた磁性体検出装置としたことにある。
Another feature of the present invention is that the magnetoresistive effect element further comprises: a third magnetoresistive element and a fourth magnetoresistive element provided at positions spaced apart in the second direction when viewed and opposed to each other at the same position in the second direction within the surface of the substrate , the substrate a third magnetoresistive element (23-2) and a fourth magnetoresistive element (24-2) whose electrical resistance changes with respect to a change in the magnetic field in the direction perpendicular to the second direction in the surface of the The bias magnetic fields for the third magnetoresistive element and the fourth magnetoresistive element are configured to be in opposite directions, and the terminal of the first magnetoresistive element opposite to the third magnetoresistive element and the terminal of the first magnetoresistive element opposite to the third magnetoresistive element are connected to the terminal of the first magnetoresistive element opposite to the third magnetoresistive element. The terminals of the two magnetoresistive elements opposite to the fourth magnetoresistive element are connected, and the terminal of the third magnetoresistive element opposite to the first magnetoresistive element and the second magnetoresistive element of the fourth magnetoresistive element are connected. connecting the terminal opposite to the resistance element, connecting the terminal of the first magnetoresistance element on the side of the third magnetoresistance element and the terminal of the fourth magnetoresistance element on the side of the second magnetoresistance element, and The terminal of the second magnetoresistive element on the side of the fourth magnetoresistive element and the terminal of the third magnetoresistive element on the side of the first magnetoresistive element are connected, and the connection between the first magnetoresistive element and the fourth magnetoresistive element A predetermined voltage is applied between the connection point and the connection point between the second magnetoresistive element and the third magnetoresistive element, and the voltage at the connection point between the first magnetoresistive element and the second magnetoresistive element and a magnetic substance detection device comprising an electric circuit (32) for extracting a voltage difference between the voltage at the connection point of the third magnetoresistive element and the fourth magnetoresistive element.

これによっても、第1磁気抵抗素子、第2磁気抵抗素子、第3磁気抵抗素子及び第4磁気抵抗素子はフルブリッジ接続されるので、出力電圧を前記ハーフブリッジ接続の場合の2倍にすることができる。また、この場合も、電気回路が、第1磁気抵抗素子と第2磁気抵抗素子の接続点の電圧と、第3磁気抵抗素子と第4磁気抵抗素子の接続点の電圧との差電圧を出力することにより、第1磁気抵抗素子及び第3磁気低抵抗素子の電気抵抗値の変化をもたらすバイアス磁界と、第2磁気抵抗素子及び第4磁気低抵抗素子の電気抵抗値の変化をもたらすバイアス磁界とにそれぞれノイズが含まれていても、これらのノイズがもたらす抵抗値変化が互いに相殺されて、出力電圧のS/N比が向上する。 Also by this, the first magnetoresistive element, the second magnetoresistive element, the third magnetoresistive element and the fourth magnetoresistive element are connected in a full bridge, so that the output voltage can be doubled compared to the case of the half bridge connection. can be done. Also in this case, the electric circuit outputs the difference voltage between the voltage at the connection point of the first magnetoresistive element and the second magnetoresistive element and the voltage at the connection point of the third magnetoresistive element and the fourth magnetoresistive element. By doing so, a bias magnetic field that causes changes in the electrical resistance values of the first magnetoresistive element and the third magnetic low resistance element and a bias magnetic field that causes changes in the electrical resistance values of the second magnetoresistive element and the fourth magnetic low resistance element. and contain noise, the resistance value changes caused by these noises cancel each other out, and the S/N ratio of the output voltage is improved.

さらに、本発明の実施にあたっては、移動する検出物に含まれる磁性体を検出するための磁性体検出方法の発明としても実施し得るものである。 Further, the present invention can be implemented as an invention of a magnetic substance detection method for detecting a magnetic substance contained in a moving detection object.

本発明の一実施形態に係る磁性体検出装置の斜視図である。1 is a perspective view of a magnetic body detection device according to an embodiment of the present invention; FIG. 磁性体検出装置の左右方向に垂直な断面図である。It is a cross-sectional view perpendicular to the horizontal direction of the magnetic body detection device. 磁性体検出装置を斜め前方から見た分解斜視図である。FIG. 2 is an exploded perspective view of the magnetic body detection device as seen obliquely from the front; 磁性体検出装置を斜め後方から見た分解斜視図である。It is the exploded perspective view which looked at the magnetic body detection apparatus from diagonally back. 磁気センサ回路の斜視図である。1 is a perspective view of a magnetic sensor circuit; FIG. 磁気抵抗素子の配置の一例を示す配置図である。FIG. 3 is a layout diagram showing an example of the layout of magnetoresistive elements; 磁気抵抗素子の配置の他の例を示す配置図である。FIG. 4 is a layout diagram showing another example of the layout of magnetoresistive elements; 磁気抵抗措置の配置のさらに他の例を示す配置図である。FIG. 10 is a layout diagram showing still another example of the layout of magnetoresistive measures; 磁石により形成された磁界及び搬送路における磁力線ベクトルを示す概略図である。FIG. 4 is a schematic diagram showing a magnetic field formed by magnets and a magnetic line of force vector in a conveying path; バイアス磁界の一例を示す側面図である。FIG. 4 is a side view showing an example of a bias magnetic field; バイアス磁界の他の例を示す側面図である。FIG. 11 is a side view showing another example of a bias magnetic field; 磁気抵抗素子の磁界の強さに対する電気抵抗値の変化特性を示すグラフである。4 is a graph showing change characteristics of an electric resistance value with respect to a magnetic field strength of a magnetoresistive element; 硬磁性体部が前方へ移動した際の硬磁性体部の磁気ベクトル及び磁界の変化、並びに磁気抵抗素子の及び電気抵抗値の変化状態を示す特性図である。FIG. 10 is a characteristic diagram showing changes in the magnetic vector and magnetic field of the hard magnetic body portion and changes in the electrical resistance value of the magnetoresistive element when the hard magnetic body portion moves forward; 軟磁性体部が前方へ移動した際の硬磁性体部の磁気ベクトル及び磁界の変化、並びに磁気抵抗素子の及び電気抵抗値の変化状態を示す特性図である。FIG. 10 is a characteristic diagram showing changes in the magnetic vector and magnetic field of the hard magnetic body portion and changes in the electrical resistance value of the magnetoresistive element when the soft magnetic body portion moves forward; 硬磁性体部が後方へ移動した際の硬磁性体部の磁気ベクトル及び磁界の変化、並びに磁気抵抗素子の及び電気抵抗値の変化状態を示す特性図である。FIG. 10 is a characteristic diagram showing changes in the magnetic vector and magnetic field of the hard magnetic body portion and changes in the electrical resistance value of the magnetoresistive element when the hard magnetic body portion moves rearward; フレキシブルプリント基板上の電気回路図である。It is an electric circuit diagram on a flexible printed circuit board. フルブリッジ接続した磁気抵抗素子の配置及び接続の一例を示す電気回路図である。FIG. 2 is an electric circuit diagram showing an example of arrangement and connection of magnetoresistive elements connected in full bridge connection; フルブリッジ接続した磁気抵抗素子の配置及び接続の他の例を示す電気回路図である。FIG. 5 is an electric circuit diagram showing another example of arrangement and connection of magnetoresistive elements connected in full bridge connection; 単一の磁気抵抗素子を用いた磁気センサ回路の電気回路図である。FIG. 2 is an electrical circuit diagram of a magnetic sensor circuit using a single magnetoresistive element; 本発明の変形例に係る磁界の概略図である。FIG. 4 is a schematic diagram of a magnetic field according to a variant of the invention; 図16の変形例に係り、硬磁性体部が前方へ移動した際の硬磁性体部の磁気ベクトル及び磁界の変化、並びに磁気抵抗素子の及び電気抵抗値の変化状態を示す特性図である。FIG. 17 is a characteristic diagram showing changes in the magnetic vector and the magnetic field of the hard magnetic body portion and changes in the electrical resistance value of the magnetoresistance element when the hard magnetic body portion moves forward according to the modification of FIG. 16 ; 図16の変形例に係り、硬磁性体部が前方へ移動した際の硬磁性体部の磁気ベクトル及び磁界の変化、並びに磁気抵抗素子の及び電気抵抗値の変化状態を示す特性図である。FIG. 17 is a characteristic diagram showing changes in the magnetic vector and the magnetic field of the hard magnetic body portion and changes in the electrical resistance value of the magnetoresistance element when the hard magnetic body portion moves forward according to the modification of FIG. 16 ;

本発明の一実施形態に係る磁性体検出装置1について図面を用いて説明する。まず、磁性体検出装置1の概略について説明する。磁性体検出装置1は、図1及び図2に示すように、検証物OBを搬送路Lに沿って直線移動させて、検証物OBの真偽を判定する装置(例えば、現金自動預け払い機)に適用される。検証物OBは、例えば、紙幣、有価証券などであり、この検証物OBには、磁性体MSが含まれているものとする。以下の説明において、検証物OBの移動方向を前後方向と呼び、検証物OBの厚さ方向を上下方向と呼ぶ。また、前後方向に垂直且つ上下方向に垂直な方向を左右方向と呼ぶ。磁性体検出装置1は、検証物OBの搬送路Lの下方に配置されており、検証物OBに含まれる磁性体MSの移動による磁界(バイアス磁界)の変化を利用して、磁性体MSの有無(又は配列パターン)を検出する。なお、以下の説明において、検証物OBを、搬送路Lの一端側(入口側)から他端側(出口)側へ搬送する方向を前方とし、その逆方向を後方とする。図示省略しているが、検証物OBは、コンベアプレート、ローラなどを用いて前後方向へ搬送される。 A magnetic body detection device 1 according to an embodiment of the present invention will be described with reference to the drawings. First, the outline of the magnetic body detection device 1 will be described. As shown in FIGS. 1 and 2, the magnetic body detection device 1 moves the verification object OB linearly along the transport path L to determine the authenticity of the verification object OB. ). The verification object OB is, for example, banknotes, securities, etc., and the verification object OB includes the magnetic material MS. In the following description, the moving direction of the verification object OB is called the front-rear direction, and the thickness direction of the verification object OB is called the vertical direction. A direction perpendicular to the front-rear direction and perpendicular to the up-down direction is called a left-right direction. The magnetic body detection device 1 is arranged below the transport path L of the verification object OB, and utilizes changes in the magnetic field (bias magnetic field) due to the movement of the magnetic body MS included in the verification object OB to detect the magnetic body MS. The presence or absence (or array pattern) is detected. In the following description, the direction in which the verification object OB is transported from one end (entrance) of the transport path L to the other end (exit) is forward, and the opposite direction is backward. Although not shown, the verification object OB is conveyed in the front-rear direction using a conveyor plate, rollers, or the like.

つぎに、磁性体検出装置1の構成について説明する。磁性体検出装置1は、図2乃至図4に示すように、ケース11、磁石M1,M2,M3、磁石固定部材12及びカバー13、並びに複数(例えば10個)の磁気センサ回路MCを備える。 Next, the configuration of the magnetic body detection device 1 will be described. As shown in FIGS. 2 to 4, the magnetic body detection device 1 includes a case 11, magnets M1, M2 and M3, a magnet fixing member 12 and a cover 13, and a plurality (for example 10) of magnetic sensor circuits MC.

ケース11は、後述する磁石M1,M2,M3、磁石固定部材12などを収容する。ケース11は、左右方向に延びる溝状(又は箱状)部材である。ケース11の上面が開放されている。ケース11は、磁性体材料(例えば、軟磁性を呈するステンレス)により一体的に形成されている。また、ケース11の底面には、複数(10個)のスリット状の貫通孔TH11が、左右方向に等間隔に配列されている。貫通孔TH11は、左右方向に延設されている。 The case 11 accommodates magnets M1, M2, M3, a magnet fixing member 12, etc., which will be described later. The case 11 is a groove-shaped (or box-shaped) member extending in the left-right direction. The upper surface of the case 11 is open. The case 11 is integrally formed of a magnetic material (for example, stainless steel exhibiting soft magnetism). In addition, a plurality of (10) slit-shaped through holes TH 11 are arranged at equal intervals in the left-right direction on the bottom surface of the case 11 . The through hole TH11 extends in the left-right direction.

磁石M1,M2,M3は、永久磁石(例えば、フェライト磁石、ボンド磁石など)で構成されている。磁石M1,M2,M3は、左右方向にそれぞれ延設されている。磁石M1及び磁石M3の左右方向に垂直な断面は、略長方形を呈する。磁石M1及び磁石M3の断面形状は略同一である。磁石M2の左右方向に垂直な断面は、略長方形を呈する。磁石M2の上下方向の寸法は、磁石M1,M3の上下方向の寸法よりも小さい。磁石M1,M2,M3は、上下方向に磁化されている。ただし、磁石M2の磁化の向きは、磁石M1及び磁石M3の磁化の向きとは反対である。本実施形態においては、磁石M1及び磁石M3の上面がN極であり、下面がS極であるのに対し、磁石M2の上面がS極であり、下面がN極である。 The magnets M1, M2, M3 are composed of permanent magnets (for example, ferrite magnets, bond magnets, etc.). The magnets M1, M2, M3 are each extended in the left-right direction. A cross section perpendicular to the horizontal direction of the magnets M1 and M3 presents a substantially rectangular shape. The cross-sectional shapes of the magnets M1 and M3 are substantially the same. A cross section perpendicular to the left-right direction of the magnet M2 presents a substantially rectangular shape. The vertical dimension of the magnet M2 is smaller than the vertical dimension of the magnets M1 and M3. Magnets M1, M2 and M3 are magnetized in the vertical direction. However, the magnetization direction of the magnet M2 is opposite to the magnetization directions of the magnets M1 and M3. In this embodiment, the upper surfaces of the magnets M1 and M3 are N poles and the lower surfaces thereof are S poles, whereas the upper surface of the magnet M2 is an S pole and the lower surface is an N pole.

磁石固定部材12は、合成樹脂製であり、一体的に形成されている。磁石固定部材12は、磁石M1,M2,M3を、この順に、前後方向に所定距離だけ隔てて平行に保つ部材である。磁石固定部材12は、左右方向に延びる溝状部材である。磁石固定部材12の外寸は、ケース11の内寸と略同一である。磁石固定部材12は、磁石M1,M2,M3をそれぞれ収容する溝部G1,G2,G3を有する。溝部G1,G2,G3は、左右方向にそれぞれ延設されている。溝部G2は、溝部G1と溝部G3との間に設けられている。溝部G1及び溝部G3は、上側へ開放され、溝部G2は、下側へ開放されている。 The magnet fixing member 12 is made of synthetic resin and formed integrally. The magnet fixing member 12 is a member that keeps the magnets M1, M2, and M3 in this order parallel to each other with a predetermined distance in the front-rear direction. The magnet fixing member 12 is a groove-shaped member extending in the left-right direction. The outer dimensions of the magnet fixing member 12 are substantially the same as the inner dimensions of the case 11 . The magnet fixing member 12 has grooves G1, G2 and G3 that accommodate the magnets M1, M2 and M3, respectively. The grooves G1, G2, and G3 extend in the left-right direction. The groove portion G2 is provided between the groove portion G1 and the groove portion G3. The grooves G1 and G3 are opened upward, and the groove G2 is opened downward.

溝部G1は、側壁部121、底壁部122及び側壁部123から構成される。溝部G2は、側壁部123、底壁部124及び側壁部125から構成される。また、溝部G3は、側壁部125、底壁部126及び側壁部127から構成される。側壁部121,123,125,127は、前後方向に垂直な板状部である。一方、底壁部122,124,126は、上下方向に垂直な板状部である。底壁部122と底壁部126は同一高さに位置し、底壁部124は、底壁部122及び底壁部124よりも高い位置にある。 The groove portion G1 is composed of a side wall portion 121, a bottom wall portion 122 and a side wall portion 123. As shown in FIG. The groove portion G2 is composed of a side wall portion 123, a bottom wall portion 124 and a side wall portion 125. As shown in FIG. Moreover, the groove portion G3 is composed of a side wall portion 125 , a bottom wall portion 126 and a side wall portion 127 . The side wall portions 121, 123, 125, 127 are plate-like portions perpendicular to the front-rear direction. On the other hand, the bottom wall portions 122, 124, 126 are plate-shaped portions perpendicular to the vertical direction. The bottom wall portions 122 and 126 are positioned at the same height, and the bottom wall portion 124 is positioned higher than the bottom wall portions 122 and 124 .

側壁部121は、底壁部122の後端から上方へ延設されている。側壁部121の上端面は、底壁部124より高い位置にある。側壁部123は、底壁部122の前端から上方へ延設されて、底壁部124の後端に接続されている。また、側壁部127は、底壁部126の前端から上方へ延設されている。側壁部127の上端面は、側壁部121の上端面と同一高さにある。側壁部125は、底壁部126の後端から上方へ延設されて、底壁部124の前端に接続されている。側壁部123及び側壁部125の壁厚が、側壁部121及び側壁部127の壁厚よりも大きく設定されている。側壁部123の上面から下面へ貫通する複数のスリット状の貫通孔TH12が、左右方向に配列されている。これらの貫通孔TH12は、ケース11の貫通孔TH11に対応している。磁石固定部材12がケース11に収容された状態で、各貫通孔TH12と各貫通孔TH11とが連通する。 The side wall portion 121 extends upward from the rear end of the bottom wall portion 122 . The upper end surface of the side wall portion 121 is positioned higher than the bottom wall portion 124 . The side wall portion 123 extends upward from the front end of the bottom wall portion 122 and is connected to the rear end of the bottom wall portion 124 . The side wall portion 127 extends upward from the front end of the bottom wall portion 126 . The upper end surface of the side wall portion 127 is at the same height as the upper end surface of the side wall portion 121 . The side wall portion 125 extends upward from the rear end of the bottom wall portion 126 and is connected to the front end of the bottom wall portion 124 . The wall thickness of the side wall portion 123 and the side wall portion 125 is set larger than the wall thickness of the side wall portion 121 and the side wall portion 127 . A plurality of slit-shaped through-holes TH12 penetrating from the upper surface to the lower surface of the side wall portion 123 are arranged in the left-right direction. These through holes TH 12 correspond to the through holes TH 11 of the case 11 . With the magnet fixing member 12 housed in the case 11, each through hole TH12 communicates with each through hole TH11 .

磁石M1及び磁石M3が溝部G1及び溝部G3にそれぞれ収容され、その磁石固定部材12がケース11内に収容される。 The magnet M1 and the magnet M3 are housed in the groove G1 and the groove G3, respectively, and the magnet fixing member 12 is housed in the case 11 .

カバー13は、ケース11に組み付けられて、ケース11の上端を覆う蓋部材である。カバー13は、左右方向に延びる溝状(又は箱状)部材である。カバー13の下面が開放されている。カバー13は、剛性が高く且つ弾性を有する非磁性材料を用いて形成されている。 The cover 13 is a lid member that is attached to the case 11 and covers the upper end of the case 11 . The cover 13 is a groove-shaped (or box-shaped) member extending in the left-right direction. The lower surface of the cover 13 is open. The cover 13 is made of a highly rigid and elastic non-magnetic material.

ケース11及びカバー13の左右方向の長さは同一である。また、磁石M1,M2,M3及び磁石固定部材12の左右方向の長さは、ケース11及びカバー13の左右方向方の長さよりも若干短い。 The case 11 and the cover 13 have the same length in the left-right direction. The lengths of the magnets M1, M2, M3 and the magnet fixing member 12 in the left-right direction are slightly shorter than the lengths of the case 11 and the cover 13 in the left-right direction.

つぎに、磁気センサ回路MCの構成について説明する。磁気センサ回路MCは、図5に示すように、基板支持部材21、基板22、強磁性体薄膜磁気抵抗素子23,24及びフレキシブルプリント基板25を備えている。基板支持部材21は、合成樹脂製であり、一体的に形成されている。基板支持部材21は、左右方向に延設されている。基板支持部材21の左右方向に垂直な断面形状は略六角形状である。つまり、基板支持部材21は、下面211、後面212、斜面213、上面214、斜面215及び前面216、並びに右側面217及び左側面218を有する。下面211は、上下方向に垂直である。後面212は、下面211の後端から上方へ延設されている。斜面213は、後面212の上端から前方且つ上方へ斜めに延設されている。上面214は、斜面213の先端(前側且つ上側の端部)から前方へ延設されている。斜面215は、上面214の前端から前方且つ下方へ斜めに延設されている。前面216は、斜面215の先端(前側且つ下側の端部)から下方へ延設され、下面211の前端に接続されている。右側面217及び左側面218は、左右方向に垂直な平面状に形成されている。基板支持部材21の左右方向の長さは磁石固定部材12の左右方向の長さの1/10である。 Next, the configuration of the magnetic sensor circuit MC will be described. The magnetic sensor circuit MC includes a substrate supporting member 21, a substrate 22, ferromagnetic thin film magnetoresistive elements 23 and 24, and a flexible printed circuit board 25, as shown in FIG. The substrate support member 21 is made of synthetic resin and formed integrally. The board support member 21 extends in the left-right direction. The cross-sectional shape of the substrate support member 21 perpendicular to the left-right direction is substantially hexagonal. That is, the substrate support member 21 has a lower surface 211 , a rear surface 212 , an inclined surface 213 , an upper surface 214 , an inclined surface 215 and a front surface 216 , and a right side 217 and a left side 218 . The lower surface 211 is perpendicular to the up-down direction. The rear surface 212 extends upward from the rear end of the lower surface 211 . The slope 213 obliquely extends forward and upward from the upper end of the rear surface 212 . The upper surface 214 extends forward from the tip (front and upper end) of the slope 213 . The slope 215 extends obliquely forward and downward from the front end of the upper surface 214 . The front surface 216 extends downward from the tip (front and lower end) of the slope 215 and is connected to the front end of the lower surface 211 . The right side surface 217 and the left side surface 218 are formed in a planar shape perpendicular to the left-right direction. The length of the substrate support member 21 in the left-right direction is 1/10 of the length of the magnet fixing member 12 in the left-right direction.

基板22は、非磁性体材料で構成された平板状部材である。基板22は、基板支持部材21の斜面213と同等の大きさに形成されている。基板22の裏面が基板支持部材21の斜面213に固着されている。強磁性体薄膜磁気抵抗素子23,24は、強磁性体磁気抵抗材により基板22の上面に、スパッタリングなどにより薄膜に形成された磁気抵抗素子(例えば、AMR素子)である。なお、以下の説明では、簡単化のために、強磁性体薄膜磁気抵抗素子23,24を単に磁気抵抗素子23,24という。磁気抵抗素子23,24は、略左右方向に直線的に延設された線状部分を有する。これらの線状部分が互いに対向している。基板22の表面内において左右方向に直交する方向の磁界(磁力)の強さに応じて、磁気抵抗素子23,24の電気抵抗値が変化する。なお、磁気抵抗素子23,24として、異方性磁気抵抗効果(AMR)素子、巨大磁気抵抗効果(GMR)素子、トンネル磁気抵抗効果(TMR)素子などを採用できる。 The substrate 22 is a plate-like member made of a non-magnetic material. The substrate 22 is formed to have the same size as the inclined surface 213 of the substrate support member 21 . The back surface of the substrate 22 is fixed to the slope 213 of the substrate support member 21 . The ferromagnetic thin-film magnetoresistive elements 23 and 24 are magnetoresistive elements (for example, AMR elements) formed on the upper surface of the substrate 22 by sputtering or the like using a ferromagnetic material magnetoresistive material. In the following description, the ferromagnetic thin film magnetoresistive elements 23 and 24 are simply referred to as magnetoresistive elements 23 and 24 for simplification. The magnetoresistive elements 23 and 24 have linear portions that extend linearly in the horizontal direction. These linear portions face each other. The electrical resistance values of the magnetoresistive elements 23 and 24 change according to the strength of the magnetic field (magnetic force) in the direction orthogonal to the horizontal direction within the surface of the substrate 22 . As the magnetoresistive elements 23 and 24, an anisotropic magnetoresistive (AMR) element, a giant magnetoresistive (GMR) element, a tunnel magnetoresistive (TMR) element, or the like can be employed.

前記説明においては、磁気抵抗素子23,24は略左右方向に直線的に延設された線状部分を有していると説明したが、磁気抵抗素子23,24の延設方向、すなわち磁気抵抗素子23,24の線状部分は、基板22の表面(平面)内において左右方向に対して所定角度だけ傾けられている。この所定角度は、例えば、1°乃至65°の範囲内にある。 In the above description, the magnetoresistive elements 23 and 24 have linear portions extending substantially in the left-right direction. The linear portions of the elements 23 and 24 are inclined by a predetermined angle with respect to the horizontal direction within the surface (plane) of the substrate 22 . This predetermined angle is, for example, within the range of 1° to 65°.

この点について具体的に説明する。図6Aに示すように、磁気抵抗素子23,24は、例えば略左右方向に延設された線状部分を分割した2つの分割線状部分23a,23b,24a,24bを有し、分割線状部分23a,23b,24a,24bは、基板22の表面内にて左右方向に対して傾斜している。本実施形態では、分割線状部分23a,23bは図示右端が高くなり、分割線状部分24a,24bは図示右端が低くなるようにしているが、これらの傾き方向は同図に限られない。ただし、分割線状部分23a,23bの傾き方向が同一であり、かつ分割線状部分24a,24bの傾き方向が同一であるものとする。そして、分割線状部分23a,24aの各一端は導体26a,26bを介して基板22に設けた端子27a,27bにそれぞれ接続されている。分割線状部分23aの他端は分割線状部分23bの一端に導体26dを介して接続され、分割線状部分24aの他端は分割線状部分24bの一端に導体26eを介して接続され、分割線状部分23b,24bの各他端は導体26fを介して接続されている。すなわち、分割線状部分23a,23bからなる磁気抵抗素子23と分割線状部分24a,24bからなる磁気抵抗素子24とが直列に接続されている。そして、磁気抵抗素子23,24の接続点、すなわち分割線状部分23b,24bの接続点が導体26cを介して端子27cに接続されている。導体26a~26fは、基板22の表面に、導電性材料(非磁性材料)をスパッタリングなどにより形成されている。端子27a,27bは直列に接続された磁気抵抗素子23,24間に電圧(+Vb,GND)を付与するための端子であり、端子27cは磁気抵抗素子23,24間の電位を出力電圧Voutとして取り出すための端子である。 This point will be specifically described. As shown in FIG. 6A, the magnetoresistive elements 23 and 24 have, for example, two split linear portions 23a, 23b, 24a, and 24b obtained by splitting a linear portion extending substantially in the left-right direction. The portions 23 a , 23 b , 24 a , 24 b are inclined with respect to the horizontal direction within the surface of the substrate 22 . In the present embodiment, the right ends of the dividing line portions 23a and 23b are raised, and the right ends of the dividing line portions 24a and 24b are lowered. However, it is assumed that the dividing line portions 23a and 23b are inclined in the same direction and the dividing line portions 24a and 24b are inclined in the same direction. One ends of the dividing line portions 23a and 24a are connected to terminals 27a and 27b provided on the substrate 22 via conductors 26a and 26b, respectively. The other end of the dividing line portion 23a is connected to one end of the dividing line portion 23b via a conductor 26d, the other end of the dividing line portion 24a is connected to one end of the dividing line portion 24b via a conductor 26e, The other ends of the dividing line portions 23b and 24b are connected via a conductor 26f. That is, the magneto-resistive element 23 composed of the dividing line portions 23a and 23b and the magneto-resistive element 24 composed of the dividing line portions 24a and 24b are connected in series. A connection point between the magnetoresistive elements 23 and 24, that is, a connection point between the dividing line portions 23b and 24b is connected to a terminal 27c through a conductor 26c. The conductors 26a to 26f are formed on the surface of the substrate 22 by sputtering a conductive material (non-magnetic material). The terminals 27a and 27b are terminals for applying a voltage (+Vb, GND) between the magnetoresistive elements 23 and 24 connected in series, and the terminal 27c outputs the potential between the magnetoresistive elements 23 and 24 as the output voltage Vout It is a terminal for taking out.

なお、本実施形態では、磁気抵抗素子23,24の線状部分をそれぞれ2つに分割したが、3つ以上にそれぞれ分割するようにしてもよい。ただし、この場合も、磁気抵抗素子23の線状部分を分割した複数の分割線状部分及び磁気抵抗素子24の線状部分を分割した複数の分割線状部分は、それぞれ同一方向に傾くようにする。また、図6Bに示すように、磁気抵抗素子23,24の線状部分を分割することなく、基板22の表面において左右方向に対して傾けた一本の線状部分でそれぞれ構成するようにしてもよい。この場合には、磁気抵抗素子23,24の線状部分の各一端は前記場合と同様な導体26a,26bを介して基板22に設けた端子27a,27bにそれぞれ接続されている。磁気抵抗素子23,24の線状部分の各他端は導体26fにより接続されて磁気抵抗素子23,24が直列に接続されて、磁気抵抗素子23,24の接続点が導体26cを介して基板22に設けた端子27cに接続されている。 In this embodiment, each of the linear portions of the magnetoresistive elements 23 and 24 is divided into two, but may be divided into three or more. However, also in this case, the plurality of dividing linear portions obtained by dividing the linear portion of the magnetoresistive element 23 and the plurality of dividing linear portions obtained by dividing the linear portion of the magnetoresistive element 24 are inclined in the same direction. do. Further, as shown in FIG. 6B, without dividing the linear portions of the magnetoresistive elements 23 and 24, each linear portion inclined with respect to the horizontal direction is formed on the surface of the substrate 22. good too. In this case, one ends of the linear portions of the magnetoresistive elements 23 and 24 are respectively connected to terminals 27a and 27b provided on the substrate 22 through conductors 26a and 26b similar to the above case. The other ends of the linear portions of the magnetoresistive elements 23 and 24 are connected by a conductor 26f to connect the magnetoresistive elements 23 and 24 in series. 22 is connected to a terminal 27c.

さらに、図6Cに示すように、磁気抵抗素子23,24を左右方向に延設した延設部分を折り返して2本の線状部分を有するように構成してもよい。この場合、磁気抵抗素子23は一対の線状部分23A,23Bからなり、線状部分23Aは前記場合と同様な分割線状部分23a,23bからなり、分割線状部分23Bは分割線状部分23c,23dからなる。分割線状部分23c,23dは、基板22の上面において、分割線状部分23a,23bと対向させて、左右方向に直交する方向に分割線状部分23a,23bと平行に設けられている。磁気抵抗素子24は一対の線状部分24A,24Bからなり、線状部分24Aは前述の場合と同様な分割線状部分24a,24bからなり、分割線状部分24Bは分割線状部分24c,24dからなる。分割線状部分24c,24dは、基板22の上面において、分割線状部分24a,24bと対向させて、左右方向に直交する方向に分割線状部分24a,24bと平行に設けられている。 Furthermore, as shown in FIG. 6C, the magnetoresistive elements 23 and 24 may be configured to have two linear portions by folding back the extension portions extending in the left-right direction. In this case, the magnetoresistive element 23 is composed of a pair of linear portions 23A and 23B, the linear portion 23A is composed of dividing linear portions 23a and 23b similar to the above case, and the dividing linear portion 23B is composed of a dividing linear portion 23c. , 23d. The parting line portions 23c and 23d are provided on the upper surface of the substrate 22 so as to face the parting line portions 23a and 23b and parallel to the parting line portions 23a and 23b in a direction orthogonal to the horizontal direction. The magnetoresistive element 24 is composed of a pair of linear portions 24A and 24B. The linear portion 24A is composed of dividing linear portions 24a and 24b similar to those described above, and the dividing linear portion 24B is composed of dividing linear portions 24c and 24d. consists of The parting line portions 24c and 24d are provided on the upper surface of the substrate 22 so as to face the parting line portions 24a and 24b and parallel to the parting line portions 24a and 24b in a direction perpendicular to the horizontal direction.

分割線状部分23cの他端は分割線状部分23dの一端に導体26gを介して接続され、分割線状部分23b,23dの各他端は導体26hを介して接続されて、分割線状部分23a,23bと分割線状部分23c,23dとが折り返して直列に接続されている。分割線状部分24cの他端は分割線状部分24dの一端に導体26iを介して接続され、分割線状部分24b,24dの各他端は導体26jを介して接続されて、分割線状部分24a,24bと分割線状部分24c,24dとが折り返して直列に接続されている。そして、この場合には、磁気抵抗素子23の分割線状部分23a及び磁気抵抗素子24の分割線状部分24aの各一端は前記場合と同様な導体26a,26bを介して基板22に設けた端子27a,27bにそれぞれ接続されている。磁気抵抗素子23の分割線状部分23c及び磁気抵抗素子24の分割線状部分24cの各一端が導体26kにより接続されて磁気抵抗素子23,24が直列に接続され、磁気抵抗素子23,24の接続点が導体26cを介して基板22に設けた端子27cに接続されている。 The other end of the dividing linear portion 23c is connected to one end of the dividing linear portion 23d via a conductor 26g, and the other ends of the dividing linear portions 23b and 23d are connected via a conductor 26h to form a dividing linear portion. 23a, 23b and parting linear portions 23c, 23d are folded back and connected in series. The other end of the dividing line portion 24c is connected to one end of the dividing line portion 24d through a conductor 26i, and the other ends of the dividing line portions 24b and 24d are connected through conductors 26j to form the dividing line portion. 24a, 24b and parting linear portions 24c, 24d are folded back and connected in series. In this case, one end of each of the dividing line portion 23a of the magnetoresistive element 23 and the dividing line portion 24a of the magnetoresistive element 24 is connected to a terminal provided on the substrate 22 through the same conductors 26a and 26b as in the above case. 27a and 27b, respectively. One ends of the dividing line portion 23c of the magnetoresistive element 23 and the dividing line portion 24c of the magnetoresistive element 24 are connected by a conductor 26k to connect the magnetoresistive elements 23 and 24 in series. The connection point is connected to a terminal 27c provided on the substrate 22 via a conductor 26c.

ここで、磁気抵抗素子23,24の延設方向(磁気抵抗素子23,24の線状部分)を基板22の表面(平面)内において左右方向に対して所定角度だけ傾けた理由について説明しておく。磁気抵抗素子23,24すなわちAMRからなる強磁性体薄膜磁気抵抗素子の磁界による抵抗を安定して変化させるために、磁気抵抗素子23,24の長手方向にすなわち磁化容易軸方向に一定方向の磁力を与える必要がある。言い換えれば、磁気抵抗素子23,24を左右方向に延設した場合、磁石M1,M2,M3による磁力線(バイアス磁界)が基本的には磁気抵抗素子23,24の延設方向に直交し、磁気抵抗素子23,24内には磁力は発生せず、磁気抵抗素子23,24の動作が安定しない。そこで、本実施形態では、磁気抵抗素子23,24の延設方向を基板22の表面において左右方向に対して所定角度だけ傾けることにより、磁気抵抗素子23,24の動作を安定させるようにしている。なお、この点に関しては、磁気抵抗素子23,24の前述した各種変形(図6B及び図6C)においても同様である。 Here, the reason why the extending directions of the magnetoresistive elements 23 and 24 (linear portions of the magnetoresistive elements 23 and 24) are inclined by a predetermined angle with respect to the horizontal direction within the surface (plane) of the substrate 22 will be explained. back. In order to stably change the magnetic field resistance of the magnetoresistive elements 23 and 24, that is, the ferromagnetic thin film magnetoresistive element made of AMR, the magnetic force is unidirectionally directed in the longitudinal direction of the magnetoresistive elements 23 and 24, that is, in the direction of the easy axis of magnetization. should be given. In other words, when the magnetoresistive elements 23 and 24 are extended in the horizontal direction, the lines of magnetic force (bias magnetic field) by the magnets M1, M2 and M3 are basically perpendicular to the extension direction of the magnetoresistive elements 23 and 24, and the magnetoresistive elements 23 and 24 extend in the horizontal direction. No magnetic force is generated in the resistance elements 23 and 24, and the operations of the magnetoresistive elements 23 and 24 are unstable. Therefore, in this embodiment, the extending direction of the magnetoresistive elements 23 and 24 is inclined by a predetermined angle with respect to the horizontal direction on the surface of the substrate 22, thereby stabilizing the operation of the magnetoresistive elements 23 and 24. . This point also applies to the various modifications (FIGS. 6B and 6C) of the magnetoresistive elements 23 and 24 described above.

フレキシブルプリント基板25は、細長いプリント回路基板である。フレキシブルプリント基板25は、可とう性を有する。フレキシブルプリント基板25には、電気配線が施されており、磁気抵抗素子23,24のハーブリッジ回路を含む電気回路が構成されている。この電気回路は、複数の基板22の端子27aに直流電圧Vbを印加し、端子27bを接地(GND)し、端子27cを増幅器31に接続する(図13参照)。これにより、直列に接続された磁気抵抗素子23,24間には直流電圧Vbが付与され、磁気抵抗素子23,24の接続点の出力電圧Voutが増幅器31を介して出力される。なお、これらの回路を、フレキシブルプリント基板25ではなく、フレキシブルプリント基板25に接続された回路装置に設けるようにしてもよい。 Flexible printed circuit board 25 is an elongated printed circuit board. The flexible printed board 25 has flexibility. Electrical wiring is applied to the flexible printed circuit board 25, and an electrical circuit including a bridge circuit of the magnetoresistive elements 23 and 24 is configured. This electric circuit applies a DC voltage Vb to the terminals 27a of the substrates 22, grounds the terminals 27b, and connects the terminals 27c to the amplifier 31 (see FIG. 13). As a result, a DC voltage Vb is applied between the magnetoresistive elements 23 and 24 connected in series, and an output voltage Vout at the connection point of the magnetoresistive elements 23 and 24 is output via the amplifier 31 . Note that these circuits may be provided in a circuit device connected to the flexible printed circuit board 25 instead of the flexible printed circuit board 25 .

上記のように構成された複数(本実施形態では10個)の磁気センサ回路MCが、左右方向に配列されて、磁石固定部材12に固定される(図3及び図4参照)。具体的には、各磁気センサ回路MCの基板支持部材21の下面211が、底壁部124の上面に固定される。そして、各フレキシブルプリント基板25の下端部が、磁石固定部材12の貫通孔TH12及びケース11の貫通孔TH11に挿し通される。最後に、カバー13がケース11の上部に被せられて固定される。 A plurality of (ten in this embodiment) magnetic sensor circuits MC configured as described above are arranged in the horizontal direction and fixed to the magnet fixing member 12 (see FIGS. 3 and 4). Specifically, the lower surface 211 of the substrate support member 21 of each magnetic sensor circuit MC is fixed to the upper surface of the bottom wall portion 124 . The lower end of each flexible printed circuit board 25 is inserted through the through hole TH 12 of the magnet fixing member 12 and the through hole TH 11 of the case 11 . Finally, the cover 13 is put on the upper part of the case 11 and fixed.

上記のように構成された磁性体検出装置1において、磁石M1,M2,M3の上側の磁極面が搬送路Lにそれぞれ対向している。ただし、磁石M1及び磁石M3の上側の磁極面(N極)は略同一の高さにあり、磁石M2の上側の磁極面(S極)は、磁石M1及び磁石M3の上面よりも低い位置にある。すなわち、磁石M1及び磁石M3の上側の磁極面と搬送路Lとの距離が、磁石M2の上側の磁極面と搬送路Lとの距離よりも小さく設定されている。磁石M1,M2,M3は協働して、ケース11及びカバー13の周辺部に及ぶ磁界を形成する。 In the magnetic body detection device 1 configured as described above, the upper magnetic pole surfaces of the magnets M1, M2, and M3 face the transport path L, respectively. However, the upper magnetic pole faces (N pole) of the magnets M1 and M3 are at substantially the same height, and the upper magnetic pole face (S pole) of the magnet M2 is positioned lower than the upper surfaces of the magnets M1 and M3. be. That is, the distance between the upper magnetic pole surfaces of the magnets M1 and M3 and the transport path L is set smaller than the distance between the upper magnetic pole surface of the magnet M2 and the transport path L. Magnets M 1 , M 2 , M 3 cooperate to form a magnetic field that extends around the periphery of case 11 and cover 13 .

つぎに、磁石M1,M2,M3と磁気センサ回路MCとの配置関係について詳述する。前記磁界の磁力線であって、磁石M1から磁石M2に向かう磁力線及び磁石M3から磁石M2に向かう磁力線は、検証物OB(磁性体MS)が存在しない状態で、左右方向に垂直な平面内において、図7(A)に示すような曲線を呈する。そして、これらの磁力線の経路は、検証物OBの搬送路Lに交差している。また、磁石M1から磁石M2に向かう磁力線の経路の中間部に基板22の磁気抵抗素子23,24が位置する。そして、左右方向に垂直な平面内において、磁気抵抗素子23を通る磁力線(磁力線ベクトルH1)の成分であって、基板22の表面に平行な成分H1xと、磁気抵抗素子24を通る磁力線(磁力線ベクトルH2)の成分であって、基板22の表面に平行な成分H2xとが、反対方向を向き、且つそれらの大きさが同一となるように、磁石M1,M2,M3、磁気センサ回路MC(基板22の傾斜角度(つまり、斜面213の傾斜角度))の配置関係が設定される。 Next, the arrangement relationship between the magnets M1, M2, M3 and the magnetic sensor circuit MC will be described in detail. The magnetic lines of force of the magnetic field, which are the magnetic lines of force directed from the magnet M1 to the magnet M2 and the magnetic lines of force directed from the magnet M3 to the magnet M2, are in a plane perpendicular to the left-right direction in the absence of the verification object OB (magnetic body MS): It presents a curve as shown in FIG. 7(A). The paths of these magnetic lines of force intersect the transport path L of the verification object OB. Also, the magnetic resistance elements 23 and 24 of the substrate 22 are positioned in the middle of the path of the lines of magnetic force from the magnet M1 to the magnet M2. In a plane perpendicular to the horizontal direction, a component H1x of the magnetic force line (magnetic force line vector H1) passing through the magnetoresistive element 23 and parallel to the surface of the substrate 22 and a magnetic force line (magnetic force line vector H1) passing through the magnetoresistive element 24 H2) and the component H2x parallel to the surface of the substrate 22 are oriented in the opposite direction and have the same size. 22 (that is, the inclination angle of the slope 213)) is set.

例えば、図8Aに示すように、左右方向に垂直な平面内において、磁気抵抗素子23と磁気抵抗素子24を結ぶ直線上の点であって、磁気抵抗素子23と磁気抵抗素子24との間の中央位置Po(磁気抵抗素子23と磁気抵抗素子24までの距離が等しい位置)における磁力線が、基板22の表面に対して垂直となり、磁力線ベクトルH1の向きと、磁力線ベクトルH2の向きが、中央位置Poを通る磁力線(磁力線ベクトルHo)に対してほぼ対称に内側方向に傾いたものとなるように、磁石M1,M2,M3及び磁気センサ回路MCが配置される。すなわち、磁力線ベクトルH1,H2は、左右方向に垂直な平面内にて、磁力線ベクトルHoから見て、反対方向(内側)に傾斜する。なお、磁気抵抗素子23,24の距離は小さいので、磁力線ベクトルH1,H2の大きさはほぼ等しい。 For example, as shown in FIG. 8A, in a plane perpendicular to the horizontal direction, a point on a straight line connecting the magnetoresistive elements 23 and 24 and between the magnetoresistive elements 23 and 24 The magnetic lines of force at the central position Po (where the distances between the magnetoresistive element 23 and the magnetoresistive element 24 are equal) are perpendicular to the surface of the substrate 22, and the direction of the magnetic force line vector H1 and the direction of the magnetic force line vector H2 are aligned with each other at the central position. The magnets M1, M2, M3 and the magnetic sensor circuit MC are arranged so as to be tilted inward substantially symmetrically with respect to the magnetic force line (magnetic force line vector Ho) passing through Po. That is, the magnetic force line vectors H1 and H2 are inclined in the opposite direction (inward) when viewed from the magnetic force line vector Ho within a plane perpendicular to the left-right direction. Since the distance between the magnetoresistive elements 23 and 24 is small, the magnitudes of the magnetic force line vectors H1 and H2 are almost equal.

この場合、磁力線ベクトルH1,H2を、基板22の表面に平行な成分H1x,H2xと垂直な成分H1y,H2yに分けると、成分H1x,H2xは互いに反対方向(内側)であると同時に、その大きさはほぼ等しい。成分H1y,H2yは、方向が等しく且つその大きさもほぼ等しい。 In this case, if the magnetic line of force vectors H1 and H2 are divided into components H1x and H2x parallel to the surface of the substrate 22 and components H1y and H2y perpendicular to the surface of the substrate 22, the components H1x and H2x are opposite to each other (inward) and their magnitudes are are approximately equal. The components H1y and H2y have the same direction and approximately the same magnitude.

一方、例えば、図8Bに示すように、磁力線ベクトルH1の向きと、磁力線ベクトルH2の向きが、中央位置Poを通る磁力線(磁力線ベクトルHo)に対してほぼ対称に外側方向に傾いたものとなるように、磁石M1,M2,M3と磁気センサ回路MCとが配置されてもよい。この場合、成分H1x,H2xは互いに反対方向(外側)であると同時に、その大きさはほぼ等しく設定される。 On the other hand, for example, as shown in FIG. 8B, the direction of the magnetic force line vector H1 and the direction of the magnetic force line vector H2 are tilted outward substantially symmetrically with respect to the magnetic force line (magnetic force line vector Ho) passing through the central position Po. , the magnets M1, M2, M3 and the magnetic sensor circuit MC may be arranged. In this case, the components H1x and H2x are set in mutually opposite directions (outside), and at the same time, their magnitudes are set substantially equal.

以下、バイアス磁界を図8Aのように設定した例について説明するが、バイアス磁界を図8Bのように設定したとしても、後述する同一の効果が得られる。 An example in which the bias magnetic field is set as shown in FIG. 8A will be described below, but even if the bias magnetic field is set as shown in FIG. 8B, the same effects described later can be obtained.

ここで、磁気抵抗素子23,24を構成する強磁性薄膜磁気抵抗素子(異方性磁気抵抗素子)の磁界に対する電気抵抗値の変化特性について説明しておく。強磁性体薄膜磁気抵抗素子の延設方向の両端間の電気抵抗値は、図9に示すように、薄膜が存在する平面内において強磁性体薄膜磁気抵抗素子の延設方向と略直交する方向の磁界の強さが「0」であるとき最大である。そして、電気抵抗値は、前記磁界の強さの絶対値が大きくなるに従って小さくなり、その磁界の強さが飽和磁界に達すると、電気抵抗値はほぼ一定となる。すなわち、本実施形態では、磁気抵抗素子23,24の電気抵抗値は、成分H1x,H2xが「0」であるときが最大となる。また、成分H1x,H2xが大きくなるに従って、電気抵抗値が徐々に小さくなり、磁界の強さがさらに大きくなって、成分H1x,H2xが飽和磁界に達すると、電気抵抗値はほぼ一定となる。 Here, the change characteristic of the electric resistance value with respect to the magnetic field of the ferromagnetic thin film magnetoresistive element (anisotropic magnetoresistive element) constituting the magnetoresistive elements 23 and 24 will be described. As shown in FIG. 9, the electric resistance value between both ends of the ferromagnetic thin film magnetoresistive element in the extension direction is in the direction substantially orthogonal to the extension direction of the ferromagnetic thin film magnetoresistive element in the plane where the thin film exists. is maximum when the magnetic field strength of is "0". The electrical resistance value decreases as the absolute value of the magnetic field strength increases, and when the magnetic field strength reaches the saturation magnetic field, the electrical resistance value becomes substantially constant. That is, in this embodiment, the electrical resistance values of the magnetoresistive elements 23 and 24 are maximized when the components H1x and H2x are "0". Also, as the components H1x and H2x increase, the electrical resistance gradually decreases and the strength of the magnetic field further increases. When the components H1x and H2x reach the saturation magnetic field, the electrical resistance becomes substantially constant.

したがって、検証物OB(磁性体MS)の通過により、磁気抵抗素子23,24の電気抵抗値が、飽和することなく、それぞれ最大に変化するように、磁石M1,M2,M3により、磁気抵抗素子23,24に対してバイアス磁界を付与することが好ましい。そのため、検証物OB(磁性体MS)が存在しない状態で、磁気抵抗素子23,24の電気抵抗値が磁界の変化による磁気抵抗素子23,24の最大抵抗値と飽和磁界時の電気抵抗値との平均値(中央値)になるような成分H1x,H2xをバイアス磁界として設定する。この場合、前述のように、検証物OB(磁性体MS)が存在しない状態では、成分H1x,H2xは互いに反対方向であると同時に、その大きさはほぼ等しいので、図9に示すように、成分H1x,H2xがバイアス磁界+Hb,-Hbになるように、磁石M1,M2,M3の磁力、磁石M1,M2,M3と磁気センサ回路MCとの距離などを設定する。なお、図9においては、バイアス磁界+Hb,-Hbが成分H1x,H2xとして磁気抵抗素子23,24に付与された状態における磁気抵抗素子23,24の電気抵抗値を基準抵抗値Rbとして示している。この基準抵抗値Rbが、前記磁界の変化による磁気抵抗素子23,24の最大抵抗値と飽和磁界時の電気抵抗値との平均値にほぼ等しい。 Therefore, the magnets M1, M2, and M3 move the magnetoresistive elements 23 and 24 so that the electrical resistance values of the magnetoresistive elements 23 and 24 change maximally without saturating when the verification object OB (magnetic body MS) passes. A bias magnetic field is preferably applied to 23,24. Therefore, in the absence of the verification object OB (magnetic material MS), the electrical resistance values of the magnetoresistive elements 23 and 24 differ from the maximum resistance value of the magnetoresistive elements 23 and 24 due to changes in the magnetic field and the electrical resistance value at the saturation magnetic field. The components H1x and H2x are set as the bias magnetic field such that the average value (median value) of . In this case, as described above, in the absence of the verification object OB (magnetic material MS), the components H1x and H2x are in opposite directions and have approximately the same magnitude. Therefore, as shown in FIG. The magnetic forces of the magnets M1, M2 and M3 and the distances between the magnets M1, M2 and M3 and the magnetic sensor circuit MC are set so that the components H1x and H2x become the bias magnetic fields +Hb and -Hb. In FIG. 9, the electrical resistance values of the magnetoresistive elements 23 and 24 in the state where the bias magnetic field +Hb and -Hb are applied to the magnetoresistive elements 23 and 24 as components H1x and H2x are shown as the reference resistance value Rb. . This reference resistance value Rb is approximately equal to the average value of the maximum resistance value of the magnetoresistive elements 23 and 24 due to the change in the magnetic field and the electric resistance value at the saturation magnetic field.

このようにバイアス磁界+Hbが磁気抵抗素子23に付与された状態では、磁気抵抗素子23の電気抵抗値は、バイアス磁界+Hbを中心に、成分H1xの絶対値|H1x|の増加(図8Aの左下方向に対応した正方向への増加)に従って基準抵抗値Rbから徐々に小さくなくなり、成分H1xの絶対値|H1x|の減少(図8Aの左下方向に対応した正方向への減少)に従って基準抵抗値Rbから徐々に大きくなる。磁気抵抗素子24の電気抵抗値は、バイアス磁界-Hbを中心に、成分H2xの絶対値|H2x|の増加(図8Aの右上方向に対応した負方向への増加)に従って基準抵抗値Rbから徐々に小さくなり、成分H2xの絶対値|H2x|の減少(図8Aの右上方向に対応した負方向への減少)に従って基準抵抗値Rbから徐々に大きくなる。なお、後述するように、本実施形態においては、磁性体MSの移動による磁界の変化に対して、磁気抵抗素子23を通る磁界の成分H1xが負になったり、磁気抵抗素子24を通る磁界の成分H2xが正になったりすることはない。 In the state where the bias magnetic field +Hb is applied to the magnetoresistive element 23 in this manner, the electrical resistance value of the magnetoresistive element 23 increases with the bias magnetic field +Hb as the center of the absolute value |H1x| of the component H1x (decrease in the positive direction corresponding to the lower left direction in FIG. 8A). It gradually increases from Rb. The electrical resistance value of the magnetoresistive element 24 gradually increases from the reference resistance value Rb around the bias magnetic field −Hb as the absolute value |H2x| of the component H2x increases (increases in the negative direction corresponding to the upper right direction in FIG. 8A). , and gradually increases from the reference resistance value Rb as the absolute value |H2x| of the component H2x decreases (decreases in the negative direction corresponding to the upper right direction in FIG. 8A). As will be described later, in this embodiment, the component H1x of the magnetic field passing through the magnetoresistive element 23 becomes negative or The component H2x never becomes positive.

次に、上記のように構成した実施形態に係る磁性体検出装置1の動作を説明する。なお、磁性体MSは、検証物OBにおいて左右方向に細長く延設されている。また、磁性体MSは、複数の硬磁性体部MS1及び複数の軟磁性体部MS2を含む。硬磁性体部MS1及び軟磁性体部MS2は、左右方向に延びる線状にそれぞれ形成されている。これらの硬磁性体部MS1と軟磁性体部MS2とが、前後方向に所定の順に配列されて所定のパターンを形成しているものとする。 Next, the operation of the magnetic body detection device 1 according to the embodiment configured as described above will be described. In addition, the magnetic body MS is elongated in the left-right direction in the verification object OB. Also, the magnetic body MS includes a plurality of hard magnetic body parts MS1 and a plurality of soft magnetic body parts MS2. The hard magnetic body part MS1 and the soft magnetic body part MS2 are each formed in a linear shape extending in the left-right direction. It is assumed that the hard magnetic body part MS1 and the soft magnetic body part MS2 are arranged in a predetermined order in the front-rear direction to form a predetermined pattern.

まず、図10に示すように、検証物OBを、前方(つまり、搬送路Lの後端(入口側)から前端(出口側))へ移動させたときの磁気抵抗素子23,24の電気抵抗値の変化について説明する。 First, as shown in FIG. 10, the electrical resistance of the magnetoresistive elements 23 and 24 when the verification object OB is moved forward (that is, from the rear end (entrance side) to the front end (exit side) of the transport path L) Explain the value change.

検証物OBに含まれる硬磁性体部MS1は、搬送路Lを通過する際、磁力線の影響を受けて磁化される。ここで、磁性体MSが搬送路Lに存在しない状態において、磁石M1,M2,M3によって形成された磁界の磁力線のうち、搬送路Lに交差する磁力線の向き及び大きさ(磁力線ベクトル)は、図7(B)に示すように、位置に応じて異なる。例えば、磁石M1の近傍の領域においては、前方へ向かうに従って、磁力線ベクトルが時計方向に回転している。したがって、硬磁性体部MS1は、磁石M1の近傍の位置P1から前方へ向かうに従って、その磁化方向(磁気ベクトル)が、図10(A)において時計方向に回転するように変化する。以下、前方へ向かう磁気ベクトルの向きを「0°」とし、当該ベクトルを反時計方向へ回転させたベクトルの角度を正の値で表わす。また、前方へ向かう磁気ベクトルの向きを「0°」とし、当該ベクトルを時計方向へ回転させたベクトルの角度を負の値で表わす。 The hard magnetic body part MS1 included in the object to be verified OB is magnetized under the influence of the lines of magnetic force when passing through the transport path L. FIG. Here, in a state where the magnetic body MS does not exist in the transport path L, among the magnetic force lines of the magnetic field formed by the magnets M1, M2, and M3, the direction and magnitude (magnetic force line vector) of the magnetic force line that intersects the transport path L is As shown in FIG. 7B, it differs depending on the position. For example, in the area near the magnet M1, the magnetic line of force vector rotates clockwise as it goes forward. Therefore, the magnetization direction (magnetic vector) of the hard magnetic body portion MS1 changes to rotate clockwise in FIG. 10A as it goes forward from the position P1 near the magnet M1. Hereinafter, the direction of the forward magnetic vector is assumed to be "0°", and the angle of the vector obtained by rotating the vector in the counterclockwise direction is represented by a positive value. Further, the direction of the forward magnetic vector is assumed to be "0°", and the angle of the vector obtained by rotating the vector in the clockwise direction is represented by a negative value.

以下、硬磁性体部MS1の磁気ベクトルの向きについて具体的に説明する。本実施形態では、硬磁性体部MS1が位置P1にあるとき、硬磁性体部MS1の磁気ベクトルの向きは略「45°」である。硬磁性体部MS1がさらに前方へ移動して磁気抵抗素子23,24の直上の位置A1にあるとき、硬磁性体部MS1の磁気ベクトルの向きは、略「―45°」である。また、硬磁性体部MS1が磁石M2の直上の位置A2にあるとき、その磁気ベクトルの向きは、「-80°」乃至「-90°」である。図7(B)に示すように、位置A2の近傍から前方へ向かうに従って、磁力線ベクトルは徐々に大きくなるが、硬磁性体部MS1の磁化特性はヒステリシスを有するので、その磁気ベクトルが変化することなく、略一定に保たれたまま、さらに前方へ移動する。そして、硬磁性体部MS1は、磁石M3の近傍の位置P2にて、再着磁される。その磁気ベクトルの向きは、略「135°」である。 The direction of the magnetic vector of the hard magnetic body portion MS1 will be specifically described below. In this embodiment, when the hard magnetic body part MS1 is at the position P1, the direction of the magnetic vector of the hard magnetic body part MS1 is approximately "45°". When the hard magnetic body part MS1 moves further forward and is located at the position A1 directly above the magnetoresistive elements 23 and 24, the direction of the magnetic vector of the hard magnetic body part MS1 is approximately "-45°". Further, when the hard magnetic body part MS1 is at the position A2 directly above the magnet M2, the direction of the magnetic vector is "-80°" to "-90°". As shown in FIG. 7B, the magnetic line of force vector gradually increases from the vicinity of the position A2 toward the front. Instead, it moves further forward while remaining approximately constant. Then, the hard magnetic body portion MS1 is re-magnetized at a position P2 near the magnet M3. The direction of the magnetic vector is approximately "135°".

硬磁性体部MS1が、その磁気ベクトルの向きを図10(A)のように変化させながら磁気抵抗素子23,24の上方を通過する際、磁力線ベクトルH1,H2が硬磁性体部MS1の影響を受けて、成分H1x,H2xが変化して、磁気抵抗素子23,24の電気抵抗値が変化する。 When the hard magnetic body part MS1 passes over the magnetoresistive elements 23 and 24 while changing the direction of its magnetic vector as shown in FIG. As a result, the components H1x and H2x change, and the electrical resistance values of the magnetoresistive elements 23 and 24 change.

硬磁性体部MS1が磁気抵抗素子23,24から十分に離れた状態では、磁気抵抗素子23,24を通過する磁力線は、磁性体MSの影響を受けない。そのため、磁気抵抗素子23,24における磁力線ベクトルH1,H2の成分H1x,H2xはバイアス磁界+Hb,-Hbに保たれており、磁気抵抗素子23,24の両端間の電気抵抗値はともに基準抵抗値Rbに保たれる。磁性体MSが磁気抵抗素子23,24に近づくと、磁気抵抗素子23,24を通過する磁界は硬磁性体部MS1の影響を受け始めて、磁気抵抗素子23,24における磁力線ベクトルH1,H2の成分H1x,H2xが変化して、磁気抵抗素子23,24の両端間の電気抵抗値がそれぞれ変化する。以下、電気抵抗値の変化について具体的に説明する。 In a state where the hard magnetic body part MS1 is sufficiently separated from the magnetoresistive elements 23 and 24, the lines of magnetic force passing through the magnetoresistive elements 23 and 24 are not affected by the magnetic body MS. Therefore, the components H1x and H2x of the magnetic line vectors H1 and H2 in the magnetoresistive elements 23 and 24 are maintained at the bias magnetic fields +Hb and -Hb, and the electrical resistance values between both ends of the magnetoresistive elements 23 and 24 are both the reference resistance values kept at Rb. When the magnetic body MS approaches the magnetoresistive elements 23 and 24, the magnetic field passing through the magnetoresistive elements 23 and 24 begins to be affected by the hard magnetic body portion MS1, and the components of the magnetic line vectors H1 and H2 in the magnetoresistive elements 23 and 24 As H1x and H2x change, the electrical resistance values between both ends of the magnetoresistive elements 23 and 24 change, respectively. A change in the electrical resistance value will be specifically described below.

図10(B)に示すように、硬磁性体部MS1が、位置P1から位置A1に向かうに従って、磁力線が、硬磁性体部MS1の影響を受けて、上方へ徐々に引き寄せられる。これにより、磁気抵抗素子23を通過する磁力線ベクトルH1の成分H1xはバイアス磁界Hbよりも大きくなり、磁気抵抗素子23の電気抵抗値は基準抵抗値Rbより小さくなる。つまり、図10(D)の実線グラフのように、磁気抵抗素子23の電気抵抗値が徐々に減少し、位置A1にて最小値になる。そして、硬磁性体部MS1が、位置A1からさらに前方へ向かうに従って、磁気抵抗素子23の電気抵抗値が徐々に増大し、基準抵抗値Rbに戻る。 As shown in FIG. 10B, as the hard magnetic body part MS1 moves from the position P1 to the position A1, the lines of magnetic force are gradually drawn upward under the influence of the hard magnetic body part MS1. As a result, the component H1x of the magnetic line vector H1 passing through the magnetoresistive element 23 becomes larger than the bias magnetic field Hb, and the electrical resistance value of the magnetoresistive element 23 becomes smaller than the reference resistance value Rb. That is, as shown by the solid line graph in FIG. 10D, the electrical resistance value of the magnetoresistive element 23 gradually decreases and becomes the minimum value at position A1. Then, as the hard magnetic body portion MS1 moves further forward from the position A1, the electrical resistance value of the magnetoresistive element 23 gradually increases and returns to the reference resistance value Rb.

硬磁性体部MS1がさらに前方に移動するに従って、図10(C)に示すように、磁力線が、硬磁性体部MS1の影響を受けて、下方へ徐々に押される。これにより、磁気抵抗素子23を通過する磁力線ベクトルH1の成分H1xはバイアス磁界Hbよりも小さくなり、磁気抵抗素子23の電気抵抗値は基準抵抗値Rbより大きくなる。つまり、図10(D)の実線グラフのように、磁気抵抗素子23の電気抵抗値が徐々に増大し、位置A2にて最大値になる。そして、硬磁性体部MS1がさらに前方に移動するに従って、電気抵抗値が徐々に減少し、磁力線への硬磁性体部MS1の影響がなくなると、成分H1xはバイアス磁界+Hbに戻り、磁気抵抗素子23の電気抵抗値は基準抵抗値Rbに戻る。 As the hard magnetic body part MS1 moves further forward, the lines of magnetic force are gradually pushed downward under the influence of the hard magnetic body part MS1, as shown in FIG. 10(C). As a result, the component H1x of the magnetic line vector H1 passing through the magnetoresistive element 23 becomes smaller than the bias magnetic field Hb, and the electrical resistance value of the magnetoresistive element 23 becomes greater than the reference resistance value Rb. That is, as shown by the solid line graph in FIG. 10(D), the electrical resistance value of the magnetoresistive element 23 gradually increases and reaches the maximum value at position A2. Then, as the hard magnetic body part MS1 moves further forward, the electric resistance value gradually decreases, and when the influence of the hard magnetic body part MS1 on the magnetic lines of force disappears, the component H1x returns to the bias magnetic field +Hb, and the magnetoresistive element The electrical resistance value of 23 returns to the reference resistance value Rb.

つぎに、磁気抵抗素子24の電気抵抗値の変化について説明する。磁力線ベクトルH2は、磁力線ベクトルHoを中心にして、磁力線ベクトルH1と対称関係にあり、磁力線ベクトルH2の成分H2xは前記成分H1xと正負逆方向であってバイアス磁界-Hbになるように設定されている。したがって、硬磁性体部MS1の位置に応じて、磁気抵抗素子24の電気抵抗値は、磁気抵抗素子23の電気抵抗値の変化(図10(D)における実線グラフ)を基準抵抗値Rbに対して反転した、図10(D)の破線グラフのように変化する。なお、厳密には、磁気抵抗素子23,24の距離に応じて、図10(D)の実線グラフと破線グラフが左右方向に少しずれるが、磁気抵抗素子23,24の距離は微小なので、上記のずれを無視できる。 Next, changes in the electrical resistance value of the magnetoresistive element 24 will be described. The magnetic force line vector H2 is in a symmetrical relationship with the magnetic force line vector H1 with the magnetic force line vector Ho as the center, and the component H2x of the magnetic force line vector H2 is set to have the positive and negative directions opposite to those of the component H1x and to form the bias magnetic field -Hb. there is Therefore, depending on the position of the hard magnetic body portion MS1, the electrical resistance value of the magneto-resistive element 24 changes from the change in the electrical resistance value of the magneto-resistive element 23 (the solid line graph in FIG. 10(D)) to the reference resistance value Rb. 10(D), which is reversed by . Strictly speaking, the solid line graph and broken line graph in FIG. can be ignored.

一方、検証物OBに含まれる軟磁性体部MS2の前方への移動に伴い、軟磁性体部MS2の磁気ベクトルの向きは、磁力線の影響を受けて逐次変化する。言い換えれば、軟磁性体部MS2は、常に、磁力線を引き寄せる。このような軟磁性体部MS2が磁気抵抗素子23,24の上方を通過する際、磁力線ベクトルH1,H2が軟磁性体部MS2の影響を受けて、成分H1x,H2xが変化して、磁気抵抗素子23,24の電気抵抗値が変化する。 On the other hand, as the soft magnetic body part MS2 included in the verification object OB moves forward, the direction of the magnetic vector of the soft magnetic body part MS2 changes successively under the influence of the magnetic lines of force. In other words, the soft magnetic body part MS2 always attracts the lines of magnetic force. When the soft magnetic body part MS2 passes above the magnetoresistive elements 23 and 24, the magnetic force line vectors H1 and H2 are affected by the soft magnetic body part MS2, and the components H1x and H2x change to change the magnetic resistance. The electrical resistance values of the elements 23 and 24 change.

具体的には、図11(A)に示すように、軟磁性体部MS2が磁気抵抗素子23の上方を通過する際、軟磁性体部MS2の影響を受けて、磁力線が上方へ引き寄せられる。これにより、磁気抵抗素子23を通過する磁力線ベクトルH1の成分H1xはバイアス磁界Hbよりも大きくなり、磁気抵抗素子23の電気抵抗値は、図11(B)の実線グラフのように、基準抵抗値Rbより小さくなる。なお、軟磁性体部MS2が、位置P1から位置A1に向かうに従って、磁気抵抗素子23の電気抵抗値が徐々に減少し、位置A1にて最小値になる。軟磁性体部MS2が、位置A1からさらに前方に移動するに従って、磁気抵抗素子23の電気抵抗値が徐々に増大し、基準抵抗値Rbに戻る。硬磁性体部MS1とは異なり、軟磁性体部MS2の場合には、磁力線が基準状態から押し下げられる領域が存在しない。よって、この場合、磁気抵抗素子23の電気抵抗値は、基準抵抗値Rbを超えることはない。 Specifically, as shown in FIG. 11A, when the soft magnetic body part MS2 passes over the magnetoresistive element 23, the lines of magnetic force are attracted upward under the influence of the soft magnetic body part MS2. As a result, the component H1x of the magnetic line vector H1 passing through the magneto-resistive element 23 becomes larger than the bias magnetic field Hb, and the electrical resistance value of the magneto-resistive element 23 becomes the reference resistance value as shown by the solid line graph in FIG. smaller than Rb. As the soft magnetic body portion MS2 moves from the position P1 to the position A1, the electrical resistance value of the magnetoresistive element 23 gradually decreases and reaches the minimum value at the position A1. As the soft magnetic body part MS2 moves further forward from the position A1, the electrical resistance value of the magnetoresistive element 23 gradually increases and returns to the reference resistance value Rb. Unlike the hard magnetic body part MS1, in the case of the soft magnetic body part MS2, there is no region where the lines of magnetic force are pushed down from the reference state. Therefore, in this case, the electrical resistance value of the magnetoresistive element 23 does not exceed the reference resistance value Rb.

また、軟磁性体部MS2の前方への移動による磁気抵抗素子24の電気抵抗値は、軟磁性体部MS2の前方への移動による磁気抵抗素子23の電気抵抗値の変化(図11(B)における実線グラフ)を基準抵抗値Rbに対して反転した、図11(B)の破線グラフのように変化する。 Further, the electric resistance value of the magnetoresistive element 24 due to the forward movement of the soft magnetic body part MS2 is the change in the electric resistance value of the magnetoresistive element 23 due to the forward movement of the soft magnetic body part MS2 (Fig. 11(B) 11(B), which is obtained by inverting the solid line graph in FIG. 11(B) with respect to the reference resistance value Rb.

つぎに、検証物OBを、後方(つまり、搬送路Lの前端(出口側)から後端(入口側))へ移動させたときの磁気抵抗素子23,24の電気抵抗値の変化について説明する。 Next, changes in the electrical resistance values of the magnetoresistive elements 23 and 24 when the verification object OB is moved backward (that is, from the front end (exit side) to the rear end (entrance side) of the transport path L) will be described. .

まず、硬磁性体部MS1の通過による磁気抵抗素子23,24の電気抵抗値の変化について説明する。検証物OBに含まれる硬磁性体部MS1は、搬送路Lを通過する際、磁力線の影響を受けて磁化される。図7(B)に示すように、磁石M3の近傍から後方へ向かうに従って、磁力線ベクトルが反時計方向に回転している。したがって、硬磁性体部MS1は、磁石M3の近傍の位置P2から後方へ向かうに従って、その磁化方向(磁気ベクトル)が、図12(A)において反時計方向に回転するように変化する。 First, changes in the electrical resistance values of the magnetoresistive elements 23 and 24 due to passage through the hard magnetic material portion MS1 will be described. The hard magnetic body part MS1 included in the object to be verified OB is magnetized under the influence of the lines of magnetic force when passing through the transport path L. FIG. As shown in FIG. 7B, the magnetic line of force vector rotates counterclockwise from the vicinity of the magnet M3 toward the rear. Therefore, the magnetization direction (magnetic vector) of the hard magnetic body portion MS1 changes so as to rotate counterclockwise in FIG.

具体的には、本実施形態では、硬磁性体部MS1が位置P2にあるとき、硬磁性体部MS1の磁気ベクトルの向きは、略「135°」である。硬磁性体部MS1がさらに後方へ移動して位置A2の直上付近にあるとき、硬磁性体部MS1の磁気ベクトルの向きは、「-100°」乃至「―90°」である。図7(B)に示すように、位置A2の近傍から後方へ向かうに従って、磁力線ベクトルは徐々に大きくなるが、硬磁性体部MS1の磁化特性はヒステリシスを有するので、その磁気ベクトルが変化することなく、略一定に保たれたまま、さらに後方へ移動する。そして、硬磁性体部MS1は、位置P1にて、再着磁される。その磁気ベクトルの向きは、略「45°」である。 Specifically, in this embodiment, when the hard magnetic body portion MS1 is at the position P2, the direction of the magnetic vector of the hard magnetic body portion MS1 is approximately "135°". When the hard magnetic body part MS1 moves further rearward and is near the position A2, the direction of the magnetic vector of the hard magnetic body part MS1 is "-100°" to "-90°". As shown in FIG. 7B, the magnetic line of force vector gradually increases toward the rear from the vicinity of position A2, but since the magnetization characteristics of the hard magnetic material portion MS1 have hysteresis, the magnetic vector does not change. Instead, it moves further backward while being kept substantially constant. Then, the hard magnetic material portion MS1 is re-magnetized at the position P1. The direction of the magnetic vector is approximately "45°".

硬磁性体部MS1が、その磁気ベクトルの向きを図12(A)のように変化させながら磁気抵抗素子23,24の上方を通過する際、磁力線ベクトルH1,H2が硬磁性体部MS1の影響を受けて、成分H1x,H2xが変化して、磁気抵抗素子23,24の電気抵抗値が変化する。 When the hard magnetic body part MS1 passes over the magnetoresistive elements 23 and 24 while changing the direction of its magnetic vector as shown in FIG. As a result, the components H1x and H2x change, and the electrical resistance values of the magnetoresistive elements 23 and 24 change.

具体的には、図12(B)及び図12(C)に示すように、硬磁性体部MS1が、磁石M2の上方付近から後方へ向かうに従って、磁力線が、硬磁性体部MS1の影響を受けて、上方へ徐々に引き寄せられる。これにより、磁気抵抗素子23を通過する磁力線ベクトルH1の成分H1xはバイアス磁界Hbよりも大きくなり、図12(D)の実線グラフのように、磁気抵抗素子23の電気抵抗値は基準抵抗値Rbより小さくなる。つまり、磁気抵抗素子23の電気抵抗値が徐々に減少し、位置A1にて最小値になる。そして、硬磁性体部MS1が、位置A1からさらに後方へ向かうに従って、磁気抵抗素子23の電気抵抗値が徐々に増大し、基準抵抗値Rbに戻る。 Specifically, as shown in FIGS. 12(B) and 12(C), as the hard magnetic body part MS1 goes from above the magnet M2 toward the rear, the magnetic lines of force are affected by the hard magnetic body part MS1. It receives and is gradually drawn upwards. As a result, the component H1x of the magnetic line vector H1 passing through the magnetoresistive element 23 becomes larger than the bias magnetic field Hb, and the electrical resistance value of the magnetoresistive element 23 increases to the reference resistance value Rb as shown by the solid line graph in FIG. 12(D). become smaller. That is, the electrical resistance value of the magnetoresistive element 23 gradually decreases and becomes the minimum value at position A1. Then, as the hard magnetic body portion MS1 moves further rearward from the position A1, the electrical resistance value of the magnetoresistive element 23 gradually increases and returns to the reference resistance value Rb.

つぎに、硬磁性体部MS1の通過による磁気抵抗素子24の電気抵抗値の変化について説明する。この場合も、硬磁性体部MS1の位置に応じて、磁気抵抗素子24の電気抵抗値は、磁気抵抗素子23の電気抵抗値の変化(図12(D)における実線グラフ)を基準抵抗値Rbに対して反転した、図12(D)の破線グラフのように変化する。なお、この場合も、厳密には、磁気抵抗素子23,24の距離に応じて、図12(D)の実線グラフと破線グラフが左右方向に少しずれるが、磁気抵抗素子23,24の距離は微小なので、上記のずれを無視できる。 Next, the change in the electrical resistance value of the magnetoresistive element 24 due to passage through the hard magnetic material portion MS1 will be described. Also in this case, depending on the position of the hard magnetic body portion MS1, the electrical resistance value of the magnetoresistive element 24 changes from the change in the electrical resistance value of the magnetoresistive element 23 (the solid line graph in FIG. 12(D)) to the reference resistance value Rb It changes like the dashed line graph in FIG. 12(D), which is inverted with respect to Also in this case, strictly speaking, the solid line graph and broken line graph in FIG. Since it is minute, the deviation can be ignored.

つぎに、軟磁性体部MS2の通過による磁気抵抗素子23,24の電気抵抗値の変化について説明する。上記のように、軟磁性体部MS2は、常に、磁力線を引き寄せる。よって、磁気抵抗素子23,24の電気抵抗値の変化は、図11(B)の変化と同一である。 Next, changes in the electrical resistance values of the magnetoresistive elements 23 and 24 due to passage through the soft magnetic body portion MS2 will be described. As described above, the soft magnetic body part MS2 always attracts magnetic lines of force. Therefore, changes in the electrical resistance values of the magnetoresistive elements 23 and 24 are the same as those in FIG. 11(B).

このように、磁性体MSを有する検証物OBを搬送路Lに沿って移動させることにより、磁気抵抗素子23,24の電気抵抗値は図10(D)、図11(B)及び図12(D)に示すように変化する。一方、磁気抵抗素子23,24は、図13の電気回路図に示すように、直列に接続されて、その両端に直流電圧(+Vb,GND)が印加されている。そして、磁気抵抗素子23,24の接続点の電位が増幅器31を介して出力電圧Voutとして出力される。したがって、出力電圧Voutは、磁気抵抗素子23,24の電気抵抗値の変化の差分(図10(D)、図11(B)及び図12(D)の実線グラフと破線グラフの差分)に対応した電圧となる。その結果、出力電圧Voutとしては、磁気抵抗素子23(又は磁気抵抗素子24)の電気抵抗値の変化を2倍したものとなる。なお、前記説明では、磁気抵抗素子23,24からなる1つの磁気センサに関してのみ説明したが、複数組の磁気抵抗素子23,24からなる複数の磁気センサについても増幅器31から前記出力電圧Voutがそれぞれ出力されることは同じである。 In this way, by moving the verification object OB having the magnetic material MS along the transport path L, the electrical resistance values of the magnetoresistive elements 23 and 24 are changed to the values shown in FIGS. D) changes as shown. On the other hand, the magnetoresistive elements 23 and 24 are connected in series, and a DC voltage (+Vb, GND) is applied to both ends thereof, as shown in the electric circuit diagram of FIG. Then, the potential at the connection point of the magnetoresistive elements 23 and 24 is output through the amplifier 31 as the output voltage Vout. Therefore, the output voltage Vout corresponds to the difference in change in the electrical resistance values of the magnetoresistive elements 23 and 24 (the difference between the solid line graph and the broken line graph in FIGS. 10(D), 11(B), and 12(D)). voltage. As a result, the output voltage Vout is obtained by doubling the change in the electrical resistance value of the magnetoresistive element 23 (or the magnetoresistive element 24). In the above description, only one magnetic sensor composed of the magnetoresistive elements 23 and 24 has been described. The output is the same.

上記のように、磁性体検出装置1においては、搬送路Lの入口及び出口にそれぞれ配置された磁石M1及び磁石M3の磁極面と搬送路Lとの距離が、磁石M2の磁極面と搬送路Lとの距離よりも小さく設定される。これにより、検証物OBが搬送路Lを通過する際、磁気センサ回路MCに接近する前に、磁性体MSが磁石M1又は磁石M3によって、硬磁性体部MS1の磁化状態が所定の状態に矯正される。すなわち、検証物OBの流通過程において、硬磁性体部MS1が前記所定の状態とは異なる状態に磁化されていたとしても、磁気センサ回路MCによって硬磁性体部MS1を検出する前に、硬磁性体部MS1の磁化状態が矯正される。このように、硬磁性体部MS1の磁化状態を矯正することにより、真の検証物OBであれば、磁性体検出装置1の出力電圧Voutの波形が、正規の波形と同一になる。よって、磁性体検出装置1によれば、検証物OBの真偽を高精度に判定できる。また、磁性体検出装置1では、磁気センサ回路MCに付与するバイアス磁界+Hb,-Hbを形成する磁石M1,M2,M3のうちの磁石M1及び磁石M3を用いて、硬磁性体部MS1を矯正するため、従来の磁性体検出装置のような磁化器を別途設ける必要がない。よって、本実施形態によれば、磁性体検出装置1の部品点数を削減できる。また、磁性体検出装置1を小型化できる。 As described above, in the magnetic substance detection device 1, the distance between the magnetic pole surfaces of the magnets M1 and M3 arranged at the entrance and the exit of the transportation path L and the transportation path L is the distance between the magnetic pole surface of the magnet M2 and the transportation path. It is set smaller than the distance with L. As a result, when the verification object OB passes through the transport path L, the magnetization state of the hard magnetic body portion MS1 is corrected to a predetermined state by the magnet M1 or the magnet M3 before the magnetic body MS approaches the magnetic sensor circuit MC. be done. That is, even if the hard magnetic body MS1 is magnetized in a state different from the predetermined state during the distribution process of the verification object OB, before the hard magnetic body MS1 is detected by the magnetic sensor circuit MC, the hard magnetic body The magnetization state of body MS1 is corrected. By correcting the magnetization state of the hard magnetic body part MS1 in this manner, the waveform of the output voltage Vout of the magnetic body detection device 1 becomes the same as the normal waveform if the verification object OB is true. Therefore, according to the magnetic body detection device 1, the authenticity of the verification object OB can be determined with high accuracy. Further, in the magnetic body detection device 1, the magnet M1 and the magnet M3 among the magnets M1, M2, and M3 forming the bias magnetic fields +Hb and -Hb applied to the magnetic sensor circuit MC are used to correct the hard magnetic body portion MS1. Therefore, there is no need to separately provide a magnetizer unlike the conventional magnetic body detection device. Therefore, according to this embodiment, the number of parts of the magnetic body detection device 1 can be reduced. Moreover, the magnetic body detection device 1 can be miniaturized.

また、硬磁性体部MS1を前方へ移動させたときの検出波形(図10(D)参照)と、軟磁性体部MS2を前方へ移動させたときの検出波形(図11(B)参照)とを異ならせることができる。また、硬磁性体部MS1を前方へ移動させたときの検出波形(図10(D)参照)と、硬磁性体部MS1を後方へ移動させたときの検出波形(図12(D)参照)とを異ならせることができる。よって、磁性体検出装置1によれば、上記の検出波形の違いに基づいて、検証物OBの真偽を高精度に判定できる。例えば、検証物OBを前方へ移動させたときの検証波形のパターンと正規のパターンとの比較だけでなく、検証物OBを後方へ移動させたときの検証波形のパターンと正規のパターンとの比較も実施することにより、検証物OBの真偽をより高精度に判定できる。 Further, the detected waveform when the hard magnetic body part MS1 is moved forward (see FIG. 10D) and the detected waveform when the soft magnetic body part MS2 is moved forward (see FIG. 11B). can be different from Further, the detected waveform when the hard magnetic body part MS1 is moved forward (see FIG. 10D) and the detected waveform when the hard magnetic body part MS1 is moved backward (see FIG. 12D). can be different from Therefore, according to the magnetic substance detection device 1, based on the difference in the detected waveforms, the authenticity of the verification object OB can be determined with high accuracy. For example, not only the comparison between the verification waveform pattern and the normal pattern when the object to be verified OB is moved forward, but also the comparison between the verification waveform pattern and the normal pattern when the object to be verified OB is moved backward. Also, the authenticity of the object to be verified OB can be determined with higher accuracy.

また、磁性体検出装置1においては、左右方向に延びる3つの磁石M1,M2,M3を、前後方向に所定の間隔をおいて配置した。これにより、磁石M1,M2,M3間の磁力線は左右方向に垂直な平面内にて曲線状に発生される。そして、磁石M1,M2,M3の形状、特に磁極面部分の形状に多少の誤差があっても、磁力線の方向は安定して、磁気抵抗素子23,24を通過する磁力線は常に一定方向となる。その結果、磁気抵抗素子23,24に付与されるバイアス磁界+Hb,-Hbが安定化し、磁性体MSの移動による磁気抵抗素子23,24の電気抵抗値の変化を安定化させることができ、磁性体MSを高精度に検出できるようになる。また、磁石M1,M2,M3の距離、配置方向(磁化方向)を調整することにより、磁力線の軌跡の形状を種々に変更することができ、磁気抵抗素子23,24に対するバイアス磁界+Hb,-Hbの向き及び大きさの設定が簡単になる。 Further, in the magnetic body detection device 1, the three magnets M1, M2, and M3 extending in the left-right direction are arranged at predetermined intervals in the front-rear direction. As a result, magnetic lines of force between the magnets M1, M2, and M3 are generated in a curved shape within a plane perpendicular to the left-right direction. Even if there are some errors in the shape of the magnets M1, M2, and M3, especially in the shape of the magnetic pole faces, the direction of the magnetic lines of force is stable, and the magnetic lines of force passing through the magnetoresistive elements 23 and 24 are always in the same direction. . As a result, the bias magnetic fields +Hb and -Hb applied to the magnetoresistive elements 23 and 24 are stabilized, and changes in the electrical resistance values of the magnetoresistive elements 23 and 24 due to movement of the magnetic body MS can be stabilized. It becomes possible to detect the body MS with high accuracy. Further, by adjusting the distance and arrangement direction (magnetization direction) of the magnets M1, M2 and M3, the shape of the trajectory of the lines of magnetic force can be changed variously, and the bias magnetic fields +Hb and -Hb for the magnetoresistive elements 23 and 24 can be changed. It is easy to set the orientation and size of

また、上記実施形態においては、磁気抵抗素子23,24又は磁気抵抗素子23,24の分割線状部分23a~23d,24a~24dの延設方向を、基板22の表面において左右方向に対して少し傾けて配置した。これにより、磁気抵抗素子23,24又は磁気抵抗素子23,24の分割線状部分23a~23d,24a~24d内に、それらの延設方向に沿った一定方向の磁束線を発生させて、磁気抵抗素子23,24の抵抗の変化を安定化させることができる。その結果、磁性体検出装置による磁性体MSの検出精度を高めることができる。 Further, in the above embodiment, the extending direction of the magnetoresistive elements 23 and 24 or the parting line portions 23a to 23d and 24a to 24d of the magnetoresistive elements 23 and 24 is set to be slightly different from the horizontal direction on the surface of the substrate 22. Placed at an angle. As a result, in the magnetic resistance elements 23 and 24 or the dividing line portions 23a to 23d and 24a to 24d of the magnetic resistance elements 23 and 24, magnetic flux lines are generated in a certain direction along the extension direction of the magnetic resistance elements 23 and 24. Changes in the resistance of the resistance elements 23 and 24 can be stabilized. As a result, it is possible to improve the detection accuracy of the magnetic material MS by the magnetic material detection device.

また、上記実施形態においては、ケース11は、磁性体材料(軟磁性体であるステンレス)で構成され、磁石M1,M2,M3の磁気抵抗素子23,24の下側を覆っている。これにより、磁石M1,M2,M3による磁気抵抗素子23,24側の磁力線の分布を、外部磁界による影響を受けずに安定化させることができ、磁性体検出装置による磁性体MSの検出精度を高めることができる。 In the above embodiment, the case 11 is made of a magnetic material (stainless steel, which is a soft magnetic material) and covers the lower sides of the magnetic resistance elements 23 and 24 of the magnets M1, M2 and M3. As a result, the distribution of the lines of magnetic force on the side of the magnetoresistive elements 23 and 24 by the magnets M1, M2 and M3 can be stabilized without being affected by the external magnetic field. can be enhanced.

また、上記実施形態においては、磁気抵抗素子23,24に付与されるバイアス磁界(成分H1x及び成分H2x)がほぼ反対方向であって同じ大きさになるように設定した。これにより、磁性体MSの前後方向への移動による磁気抵抗素子23,24の電気抵抗値の変化を正負反対方向にほぼ対称に変化させるようにでき、磁気抵抗素子23,24の電気抵抗値の変化を利用し易くすることができる。そして、1つの磁気センサ回路MCを構成する磁気抵抗素子23,24をハーフブリッジ接続して出力電圧Voutを取り出すようにしたので、1つの磁気抵抗素子を用いる場合に比べて、出力電圧Voutの変化を大きくすることができる。 Further, in the above embodiment, the bias magnetic fields (component H1x and component H2x) applied to the magnetoresistive elements 23 and 24 are set to have substantially opposite directions and the same magnitude. As a result, the change in the electrical resistance values of the magnetoresistive elements 23 and 24 due to the movement of the magnetic body MS in the front-rear direction can be changed substantially symmetrically in the positive and negative directions. Change can be made accessible. Since the magnetoresistive elements 23 and 24 constituting one magnetic sensor circuit MC are half-bridge-connected to take out the output voltage Vout, the change in the output voltage Vout is less than that in the case of using one magnetoresistive element. can be increased.

上記実施形態では、前述のように、1つの磁気センサ回路MCを構成する磁気抵抗素子23,24をハーフブリッジ接続して出力電圧Voutを取り出すようにした。しかし、これに代えて、1つの磁気センサ回路MCを4つの磁気抵抗素子23-1,23-2,24-1,24-2で構成して、これらの磁気抵抗素子23-1,23-2,24-1,24-2をフルブリッジ接続して出力電圧Voutを取出すようにしてもよい。この場合、図14(A)に示すように、1つの基板22の表面に、磁気抵抗素子23-1,23-2,24-1,24-2が設けられている。磁気抵抗素子23-1,24-1は上記磁気抵抗素子23,24と同様に形成され、基板上の導体に関しても上記磁気抵抗素子23,24の場合と同じである。そして、端子に関しては、端子27a-1,27b-1,27c-1が上記端子27a,27b、27cにそれぞれ対応する。また、磁気抵抗素子23-2,24-2、端子27a-2,27b-2,27c-2及びこれらを接続する導体は、磁気抵抗素子23-1,24-1、端子27a-1,27b-1,27c-1及びこれらを接続する導体と同様に構成されて左右方向に対称に設けられる。すなわち磁気抵抗素子23-2,24-2は基板22の表面において、磁気抵抗素子23-1,24-1をそれぞれ左右方向に延長した位置にて、基板22の表面上に左右方向にほぼ沿って延設されるとともに互いに対向して配置されている。なお、磁気抵抗素子23-1,24-1、端子27a-1,27b-1,27c-1及びこれらを接続する導体と、磁気抵抗素子23-2,24-2、端子27a-2,27b-2,27c-2及びこれらを接続する導体とを独立した基板22にそれぞれ設けるようにしてもよい。 In the above embodiment, as described above, the magnetoresistive elements 23 and 24 forming one magnetic sensor circuit MC are half-bridge connected to take out the output voltage Vout. However, instead of this, one magnetic sensor circuit MC is composed of four magnetoresistive elements 23-1, 23-2, 24-1, 24-2, and these magnetoresistive elements 23-1, 23- 2, 24-1 and 24-2 may be connected in a full bridge to take out the output voltage Vout. In this case, magnetoresistive elements 23-1, 23-2, 24-1 and 24-2 are provided on the surface of one substrate 22, as shown in FIG. 14(A). The magnetoresistive elements 23-1 and 24-1 are formed in the same manner as the magnetoresistive elements 23 and 24, and the conductors on the substrate are the same as those of the magnetoresistive elements 23 and 24 described above. As for the terminals, the terminals 27a-1, 27b-1 and 27c-1 correspond to the terminals 27a, 27b and 27c, respectively. The magnetoresistive elements 23-2, 24-2, the terminals 27a-2, 27b-2, 27c-2 and the conductors connecting them are the magnetoresistive elements 23-1, 24-1, the terminals 27a-1, 27b. -1, 27c-1 and the conductors connecting them, and arranged symmetrically in the horizontal direction. That is, the magneto-resistive elements 23-2 and 24-2 are arranged on the surface of the substrate 22 at positions extending in the lateral direction from the magneto-resistive elements 23-1 and 24-1, respectively. and are arranged facing each other. The magnetoresistive elements 23-1, 24-1, the terminals 27a-1, 27b-1, 27c-1 and the conductors connecting them, the magnetoresistive elements 23-2, 24-2, the terminals 27a-2, 27b -2, 27c-2 and conductors connecting them may be provided on independent substrates 22, respectively.

そして、フレキシブルプリント基板25上にて、端子27a-1,27b-1,27c-1及び端子27a-2,27b-2,27c-2は次のように電気的に接続されている。端子27c-1に直流電圧Vbが印加され、端子27c-2は接地されている(GND)。そして、端子27a-1と端子27b-2とが接続されて、その接続点が増幅器32の非反転入力に接続されている。端子27b-1と端子27a-2とが接続されて、その接続点が増幅器32の反転入力に接続されている。これにより、磁気抵抗素子23-1,24-2が直列に接続されるとともに、その両端に電圧Vb-GNDが印加されて、磁気抵抗素子23-1,24-2の接続点の電圧が増幅器32の非反転入力に供給される。また、磁気抵抗素子24-1,23-2が直列に接続されるとともに、その両端に電圧Vb-GNDが印加されて、磁気抵抗素子24-1,23-2の接続点の電圧が増幅器32の反転入力に供給される。増幅器32は、非反転入力と反転入力の差電圧を出力電圧Voutとして出力する。 On the flexible printed circuit board 25, the terminals 27a-1, 27b-1, 27c-1 and the terminals 27a-2, 27b-2, 27c-2 are electrically connected as follows. A DC voltage Vb is applied to the terminal 27c-1, and the terminal 27c-2 is grounded (GND). The terminal 27a-1 and the terminal 27b-2 are connected, and the connection point is connected to the non-inverting input of the amplifier 32. FIG. The terminal 27b-1 and the terminal 27a-2 are connected, and the connection point is connected to the inverting input of the amplifier 32. FIG. As a result, the magnetoresistive elements 23-1 and 24-2 are connected in series, and the voltage Vb-GND is applied to both ends thereof, and the voltage at the connection point of the magnetoresistive elements 23-1 and 24-2 is amplified. 32 non-inverting inputs. The magnetoresistive elements 24-1 and 23-2 are connected in series, and a voltage Vb-GND is applied to both ends of the magnetoresistive elements 24-1 and 23-2. to the inverting input of The amplifier 32 outputs the differential voltage between the non-inverting input and the inverting input as the output voltage Vout.

このような接続はフルブリッジ回路を構成するもので、磁性体MSの移動に伴い、磁気抵抗素子23-1,24-2の電気抵抗値は正負反対に変化するとともに、磁気抵抗素子23-2,24-1の電気抵抗値は正負反対に変化し、磁気抵抗素子23-1と磁気抵抗素子24-2の接続点の電圧と、磁気抵抗素子24-1と磁気抵抗素子23-2の接続点の電圧も正負反対方向に変化する。そして、前記両接続点の電圧が増幅器31の非反転入力と反転入力に供給されて増幅器31は前記両接続点の電圧差を出力するので、増幅器31は実質的には前記両接続点の電圧変化を加算合成した出力電圧Voutを出力する。その結果、上述したハーフブリッジ接続の場合よりも、2倍大きな出力電圧Voutを得ることができる。 Such a connection constitutes a full-bridge circuit. As the magnetic body MS moves, the electrical resistance values of the magnetoresistive elements 23-1 and 24-2 change in opposite directions, and the magnetoresistive element 23-2 , 24-1 change positively and negatively, and the voltage at the connection point between the magnetoresistive elements 23-1 and 24-2 and the connection point between the magnetoresistive elements 24-1 and 23-2 The voltage at the point also changes in opposite directions. Since the voltages at the two connection points are supplied to the non-inverting input and the inverting input of the amplifier 31 and the amplifier 31 outputs the voltage difference between the two connection points, the voltage at the two connection points is substantially equal to the voltage at the two connection points. An output voltage Vout obtained by adding and synthesizing the changes is output. As a result, it is possible to obtain an output voltage Vout that is twice as high as in the case of the half-bridge connection described above.

また、増幅器32が前記両接続点の電圧差を出力することにより、磁気抵抗素子23-1,23-2の電気抵抗値の変化をもたらす成分H1x及び磁気抵抗素子24-1,24-2の電気抵抗値の変化をもたらす成分H2xにそれぞれノイズが含まれていても、これらのノイズがもたらす抵抗値変化が互いに相殺されて、出力電圧VoutのS/N比が向上する。 Further, when the amplifier 32 outputs the voltage difference between the two connection points, the component H1x that causes changes in the electrical resistance values of the magnetoresistive elements 23-1 and 23-2 and the voltage difference between the magnetoresistive elements 24-1 and 24-2. Even if noise is included in each of the components H2x that cause changes in the electrical resistance value, the resistance value changes caused by these noises cancel each other out, improving the S/N ratio of the output voltage Vout.

さらに、前記図14(A)のフルブリッジ接続に代えて、磁気抵抗素子23-1,23-2,24-1,24-2及び増幅器32を図14(B)のようにフルブリッジ接続してもよい。すなわち、端子27b-1,27a-2に直流電圧Vbが印加され、端子27a-1,27b-2は接地されている(GND)。そして、端子27c-1が増幅器32の反転入力に接続され、端子27c-2が増幅器32の非反転入力に接続されている。これにより、磁気抵抗素子24-1,23-1が直列に接続されるとともに、その両端に電圧Vb-GNDが印加されて、磁気抵抗素子24-1,23-1の接続点の電圧が増幅器32の反転入力に供給される。また、磁気抵抗素子23-2,24-2が直列に接続されるとともに、その両端に電圧Vb-GNDが印加されて、磁気抵抗素子23-1,24-2の接続点の電圧が増幅器32の非反転入力に供給される。増幅器32は、非反転入力と反転入力の差電圧を出力電圧Voutとして出力する。 Further, instead of the full bridge connection shown in FIG. 14(A), the magnetoresistive elements 23-1, 23-2, 24-1, 24-2 and the amplifier 32 are connected in a full bridge as shown in FIG. 14(B). may That is, a DC voltage Vb is applied to the terminals 27b-1 and 27a-2, and the terminals 27a-1 and 27b-2 are grounded (GND). The terminal 27c-1 is connected to the inverting input of the amplifier 32, and the terminal 27c-2 is connected to the non-inverting input of the amplifier 32. FIG. As a result, the magnetoresistive elements 24-1 and 23-1 are connected in series, and the voltage Vb-GND is applied to both ends thereof, and the voltage at the connection point of the magnetoresistive elements 24-1 and 23-1 is amplified. 32 inverting inputs. The magnetoresistive elements 23-2 and 24-2 are connected in series, and a voltage Vb-GND is applied to both ends of the magnetoresistive elements 23-1 and 24-2. to the non-inverting input of The amplifier 32 outputs the differential voltage between the non-inverting input and the inverting input as the output voltage Vout.

このような接続もフルブリッジ回路を構成するもので、磁性体MSの移動に伴い、磁気抵抗素子23-2,24-2の電気抵抗値は正負反対に変化するとともに、磁気抵抗素子24-1,23-1の電気抵抗値は正負反対に変化し、磁気抵抗素子23-2と磁気抵抗素子24-2の接続点の電圧と、磁気抵抗素子24-1と磁気抵抗素子23-1の接続点の電圧も正負反対方向に変化する。そして、前記両接続点の電圧が増幅器31の非反転入力と反転入力に供給されて増幅器31は前記両接続点の電圧差を出力するので、この場合も、増幅器31は実質的には前記両接続点の電圧変化を加算合成した出力電圧Voutを出力し、前述の場合と同様に、上述したハーフブリッジ接続の場合よりも、2倍大きな出力電圧Voutを得ることができる。 Such a connection also constitutes a full bridge circuit. , 23-1 change positively and negatively. The voltage at the point also changes in opposite directions. Since the voltages of the two connection points are supplied to the non-inverting input and the inverting input of the amplifier 31 and the amplifier 31 outputs the voltage difference between the two connection points, An output voltage Vout obtained by adding and synthesizing the voltage changes at the connection points is output, and an output voltage Vout twice as large as that in the above-described half-bridge connection can be obtained as in the case described above.

また、この場合も、増幅器32が前記両接続点の電圧差を出力することにより、磁気抵抗素子23-1,23-2の電気抵抗値の変化をもたらす成分H1x及び磁気抵抗素子24-1,24-2の電気抵抗値の変化をもたらす成分H2xにそれぞれノイズが含まれていても、これらのノイズは互いに相殺されて、出力電圧VoutのS/N比が向上する。 Also in this case, the amplifier 32 outputs the voltage difference between the two connection points, and the component H1x and the magnetoresistive elements 24-1 and 24-1, which cause changes in the electrical resistance values of the magnetoresistive elements 23-1 and 23-2. Even if noise is included in each of the components H2x that cause a change in the electrical resistance value of 24-2, these noises cancel each other out, improving the S/N ratio of the output voltage Vout.

さらに、1つの磁気センサを複数の磁気抵抗素子23,24(又は23-1,23-2,24-1,24-2)で構成しなくてもよく、1つの磁気抵抗素子のみで構成するようにしてもよい。この場合、図15に示すように、基板22の上面に磁気抵抗素子23のみを設け、端子27cに直流電圧+Vbを印加する。磁気抵抗素子23、導体及び端子27a,27cは上記実施形態の場合と同様に構成されている。そして、端子27aをフレキシブルプリント基板25上に設けた固定抵抗33の一端に接続し、固定抵抗33の他端を接地する(GND)。そして、磁気抵抗素子23と固定抵抗33の接続点を増幅器31に入力し、増幅器31から出力電圧Voutを取り出すようにする。 Furthermore, one magnetic sensor does not have to be configured with a plurality of magnetoresistive elements 23, 24 (or 23-1, 23-2, 24-1, 24-2), and is configured with only one magnetoresistive element. You may do so. In this case, as shown in FIG. 15, only the magnetoresistive element 23 is provided on the upper surface of the substrate 22, and the DC voltage +Vb is applied to the terminal 27c. The magnetoresistive element 23, conductors and terminals 27a and 27c are constructed in the same manner as in the above embodiment. Then, the terminal 27a is connected to one end of the fixed resistor 33 provided on the flexible printed circuit board 25, and the other end of the fixed resistor 33 is grounded (GND). Then, the connection point between the magnetoresistive element 23 and the fixed resistor 33 is input to the amplifier 31 and the output voltage Vout is taken out from the amplifier 31 .

このように構成しても、磁性体MSの移動に伴う、磁気抵抗素子23の電気抵抗値の変化に応じて変化する出力電圧Voutを取出すことができるので、検証物OBに含まれる磁性体MSを検出することは可能である。ただし、この場合の出力電圧Voutは、上記実施形態の場合の1/2程度である。 Even with this configuration, it is possible to extract the output voltage Vout that changes according to the change in the electrical resistance value of the magnetoresistive element 23 accompanying the movement of the magnetic body MS. It is possible to detect However, the output voltage Vout in this case is about half that in the above embodiment.

なお、上記実施形態の変形例である図14A、図14B及び図15の磁気抵抗素子23,24,23-1,23-2,24-1,24-2を、上記図6A、図6Bを用いて説明したように、3つ以上の線状部分をそれぞれ有するように分割したり、一本の線状部分でそれぞれ構成したりするようにしてもよい。また、図6Cを用いて説明したように、磁気抵抗素子23,24,23-1,23-2,24-1,24-2を左右方向に延設した部分を折り返して2本以上の線状部分を有するように構成してもよい。 14A, 14B, and 15, which are modifications of the above embodiment, and the magnetoresistive elements 23, 24, 23-1, 23-2, 24-1, and 24-2 shown in FIGS. 6A and 6B. As described above, it may be divided so as to have three or more linear portions, or each may be composed of a single linear portion. Further, as described with reference to FIG. 6C, two or more lines are formed by folding back portions in which the magnetoresistive elements 23, 24, 23-1, 23-2, 24-1, and 24-2 are extended in the horizontal direction. It may be configured to have a shaped portion.

また、図16に示すように、磁石M3の磁化方向を磁性体検出装置1とは反対方向に設定した磁性体検出装置1Aとしてもよい。磁性体検出装置1Aの構成のうち、磁石M3の磁化方向を除く構成は、磁性体検出装置1と同一である。 Further, as shown in FIG. 16, a magnetic body detection device 1A may be provided in which the magnetization direction of the magnet M3 is set in the direction opposite to that of the magnetic body detection device 1. FIG. The configuration of the magnetic body detection device 1A is the same as that of the magnetic body detection device 1 except for the magnetization direction of the magnet M3.

つぎに、磁性体検出装置1Aの動作について説明する。まず、図17に示すように、検証物OBを、前方(つまり、搬送路Lの後端(入口側)から前端(出口側))へ移動させたときの磁気抵抗素子23,24の電気抵抗値の変化について説明する。 Next, the operation of the magnetic body detection device 1A will be described. First, as shown in FIG. 17, the electrical resistance of the magnetoresistive elements 23 and 24 when the verification object OB is moved forward (that is, from the rear end (entrance side) to the front end (exit side) of the transport path L) Explain the value change.

磁性体検出装置1Aでは、硬磁性体部MS1の磁気ベクトルの向きが、下記の通りになるように(図17(A)参照)、各種パラメータ(磁石M1,M2,M3の磁力及び配置など)が設定されている。硬磁性体部MS1が位置P1にあるとき、硬磁性体部MS1の磁気ベクトルの向きは略「45°」である。硬磁性体部MS1がさらに前方へ移動して位置A1及び位置A2にあるとき、硬磁性体部MS1の磁気ベクトルの向きは、略「0°」である。そして、硬磁性体部MS1が位置P2にあるとき、硬磁性体部MS1の磁気ベクトルの向きは、略「-45°」である。 In the magnetic body detection device 1A, various parameters (magnetic force and arrangement of the magnets M1, M2, M3, etc.) are adjusted so that the direction of the magnetic vector of the hard magnetic body part MS1 is as follows (see FIG. 17A). is set. When the hard magnetic body part MS1 is at the position P1, the direction of the magnetic vector of the hard magnetic body part MS1 is approximately "45°". When the hard magnetic body part MS1 moves further forward and is at positions A1 and A2, the direction of the magnetic vector of the hard magnetic body part MS1 is substantially "0°". Then, when the hard magnetic body part MS1 is at the position P2, the direction of the magnetic vector of the hard magnetic body part MS1 is approximately "-45°".

硬磁性体部MS1が、その磁気ベクトルの向きを上記のように変化させながら磁気抵抗素子23,24の上方を通過する際、磁力線ベクトルH1,H2が硬磁性体部MS1の影響を受けて、成分H1x,H2xが変化して、磁気抵抗素子23,24の電気抵抗値が変化する。 When the hard magnetic body part MS1 passes over the magnetoresistive elements 23 and 24 while changing the direction of its magnetic vector as described above, the magnetic force line vectors H1 and H2 are affected by the hard magnetic body part MS1, The components H1x and H2x change, and the electrical resistance values of the magnetoresistive elements 23 and 24 change.

具体的には、図17(B)に示すように、硬磁性体部MS1が、位置P1から位置A1に向かうに従って、磁力線が、硬磁性体部MS1の影響を受けて、上方へ徐々に引き寄せられる。これにより、磁気抵抗素子23を通過する磁力線ベクトルH1の成分H1xはバイアス磁界Hbよりも大きくなり、磁気抵抗素子23の電気抵抗値は基準抵抗値Rbより小さくなる。つまり、図17(D)の実線グラフのように、磁気抵抗素子23の電気抵抗値が徐々に減少し、位置A1にて最小値になる。そして、硬磁性体部MS1が、位置A1からさらに前方へ移動するに従って、磁気抵抗素子23の電気抵抗値が徐々に増大し、基準抵抗値Rbに戻る。 Specifically, as shown in FIG. 17B, as the hard magnetic body part MS1 moves from the position P1 to the position A1, the lines of magnetic force are gradually drawn upward under the influence of the hard magnetic body part MS1. be done. As a result, the component H1x of the magnetic line vector H1 passing through the magnetoresistive element 23 becomes larger than the bias magnetic field Hb, and the electrical resistance value of the magnetoresistive element 23 becomes smaller than the reference resistance value Rb. That is, as shown by the solid line graph in FIG. 17(D), the electrical resistance value of the magnetoresistive element 23 gradually decreases and reaches the minimum value at position A1. Then, as the hard magnetic body portion MS1 moves further forward from the position A1, the electrical resistance value of the magnetoresistive element 23 gradually increases and returns to the reference resistance value Rb.

硬磁性体部MS1がさらに前方に移動するに従って、図17(C)に示すように、磁力線が、硬磁性体部MS1の影響を受けて、下方へ徐々に押される。これにより、磁気抵抗素子23を通過する磁力線ベクトルH1の成分H1xはバイアス磁界Hbよりも小さくなり、磁気抵抗素子23の電気抵抗値は基準抵抗値Rbより大きくなる。つまり、図17(D)の実線グラフのように、磁気抵抗素子23の電気抵抗値が徐々に増大し、位置A2にて最大値になる。そして、硬磁性体部MS1がさらに前方に移動するに従って、電気抵抗値が徐々に減少し、磁力線への硬磁性体部MS1の影響がなくなると、成分H1xはバイアス磁界+Hbに戻り、磁気抵抗素子23の電気抵抗値は基準抵抗値Rbに戻る。 As the hard magnetic body part MS1 moves further forward, the lines of magnetic force are gradually pushed downward under the influence of the hard magnetic body part MS1, as shown in FIG. 17(C). As a result, the component H1x of the magnetic line vector H1 passing through the magnetoresistive element 23 becomes smaller than the bias magnetic field Hb, and the electrical resistance value of the magnetoresistive element 23 becomes greater than the reference resistance value Rb. That is, as shown by the solid line graph in FIG. 17(D), the electrical resistance value of the magnetoresistive element 23 gradually increases and reaches the maximum value at position A2. Then, as the hard magnetic body part MS1 moves further forward, the electric resistance value gradually decreases, and when the influence of the hard magnetic body part MS1 on the magnetic lines of force disappears, the component H1x returns to the bias magnetic field +Hb, and the magnetoresistive element The electrical resistance value of 23 returns to the reference resistance value Rb.

また、磁気抵抗素子24の電気抵抗値は、磁気抵抗素子23の電気抵抗値の変化(図17(D)における実線グラフ)を基準抵抗値Rbに対して反転した、図17(D)の破線グラフのように変化する。 The electrical resistance value of the magnetoresistive element 24 is the dashed line in FIG. It changes like a graph.

一方、上記のように、軟磁性体部MS2は、常に、磁力線を引き寄せる。よって、磁気抵抗素子23,24の電気抵抗値の変化は、図11(B)の変化と同一である。 On the other hand, as described above, the soft magnetic body part MS2 always attracts magnetic lines of force. Therefore, changes in the electrical resistance values of the magnetoresistive elements 23 and 24 are the same as those in FIG. 11(B).

つぎに、検証物OBを、後方(つまり、搬送路Lの前端(出口側)から後端(入口側))へ移動させたときの磁気抵抗素子23,24の電気抵抗値の変化について説明する。 Next, changes in the electrical resistance values of the magnetoresistive elements 23 and 24 when the verification object OB is moved backward (that is, from the front end (exit side) to the rear end (entrance side) of the transport path L) will be described. .

この場合、図18(A)に示すように、硬磁性体部MS1が位置P2にあるとき、硬磁性体部MS1の磁気ベクトルの向きは略「―45°」である。硬磁性体部MS1がさらに後方へ移動して位置A2及び位置A1にあるとき、硬磁性体部MS1の磁気ベクトルの向きは、略「0°」である。そして、硬磁性体部MS1が位置P1にあるとき、硬磁性体部MS1の磁気ベクトルの向きは、略「45°」である。図17(A)及び図18(A)に示すように、磁性体検証装置1Aでは、硬磁性体部MS1が前方へ移動する際の各位置における磁気ベクトルの向きと、後方へ移動する際の各位置における磁気ベクトルの向きが同一である。したがって、図18(B)及び図18(C)に示すように、硬磁性体部MS1が後方へ移動する際には、硬磁性体部MS1が前方へ移動する際と同様の影響を磁力線が受ける。よって、図18(D)及び図17(D)に示すように、硬磁性体部MS1が後方へ移動する際の磁気抵抗素子23,24の電気抵抗値の変化は、硬磁性体部MS1が前方へ移動する際と同一である。 In this case, as shown in FIG. 18A, when the hard magnetic body part MS1 is at the position P2, the direction of the magnetic vector of the hard magnetic body part MS1 is approximately "-45°". When the hard magnetic body part MS1 moves further rearward and is at positions A2 and A1, the direction of the magnetic vector of the hard magnetic body part MS1 is approximately "0°". Then, when the hard magnetic body part MS1 is at the position P1, the direction of the magnetic vector of the hard magnetic body part MS1 is approximately "45°". As shown in FIGS. 17A and 18A, in the magnetic material verification device 1A, the direction of the magnetic vector at each position when the hard magnetic part MS1 moves forward and the direction of the magnetic vector when moving backward The direction of the magnetic vector at each position is the same. Therefore, as shown in FIGS. 18B and 18C, when the hard magnetic body part MS1 moves backward, the magnetic lines of force exert the same influence as when the hard magnetic body part MS1 moves forward. receive. Therefore, as shown in FIGS. 18(D) and 17(D), the change in the electrical resistance values of the magnetoresistive elements 23 and 24 when the hard magnetic body portion MS1 moves backward is Same as when moving forward.

一方、上記のように、軟磁性体部MS2は、常に、磁力線を引き寄せる。よって、磁気抵抗素子23,24の電気抵抗値の変化は、図11(B)の変化と同一である。 On the other hand, as described above, the soft magnetic body part MS2 always attracts magnetic lines of force. Therefore, changes in the electrical resistance values of the magnetoresistive elements 23 and 24 are the same as those in FIG. 11(B).

上記の磁性体検出装置1Aによっても、磁性体検出装置1と同等の効果が得られる。ただし、この場合、硬磁性体部MS1が前方へ移動する際の検出波形と、後方へ移動する際の検出波形は同一である(図17(D)及び図18(D)参照)。 The effect equivalent to that of the magnetic substance detection device 1 can also be obtained by the magnetic substance detection device 1A. However, in this case, the detected waveform when the hard magnetic body part MS1 moves forward is the same as the detected waveform when it moves backward (see FIGS. 17(D) and 18(D)).

さらに、この変形例に係る磁性体検出装置1Aにおいても、磁性体検出装置1の項で説明した各種変形は適用されるものである。 Furthermore, the various modifications described in the section on the magnetic material detection device 1 are also applied to the magnetic material detection device 1A according to this modification.

以上、本発明の一実施形態について説明したが、本発明の実施にあたっては、上記実施形態に限定されるものではなく、本発明の目的を逸脱しない限りにおいて種々の変形も可能である。 Although one embodiment of the present invention has been described above, the implementation of the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the object of the present invention.

例えば、上記実施形態における磁石M2は永久磁石であるが、磁石M1及び磁石M3と協働して磁界を形成する磁性体であってもよい。また、検証物OBを前方へ移動させた際の検出波形と後方へ移動させた際の検出波形とを比較する必要がなければ、上記実施形態の磁石M3を省略しても良い。また、上記実施形態では、磁石M1,M2,M3の磁化方向(上下方向)が、検証物OBの搬送方向(前後方向)に直交しているが、磁石M1,M2,M3の磁化方向が、検証物OBの搬送方向に対して傾斜していてもよい。 For example, although the magnet M2 in the above embodiment is a permanent magnet, it may be a magnetic body that forms a magnetic field in cooperation with the magnets M1 and M3. Also, if there is no need to compare the detected waveform when the verification object OB is moved forward and the detected waveform when it is moved backward, the magnet M3 in the above embodiment may be omitted. In the above embodiment, the magnetization directions (vertical direction) of the magnets M1, M2, and M3 are perpendicular to the conveying direction (backward direction) of the verification object OB. You may incline with respect to the conveyance direction of verification object OB.

11…ケース、M1,M2,M3…磁石、13…カバー、21…基板支持部材、22…基板、23,24,23-1,23-2,24-1,24-2…磁気抵抗素子(強磁性体薄膜磁気抵抗素子)、23A,23B…線状部分、23a~23d,24a~24d…分割線状部分、25…フレキシブルプリント基板、31,32…増幅器、33…固定抵抗、L…搬送路、MS…磁性体、MS1…硬磁性体部、MS2…軟磁性体部、OB…検証物 11... Case, M1, M2, M3... Magnet, 13... Cover, 21... Substrate support member, 22... Substrate, 23, 24, 23-1, 23-2, 24-1, 24-2... Magnetoresistive element ( Ferromagnetic thin film magnetoresistive element), 23A, 23B linear portions 23a to 23d, 24a to 24d dividing linear portions 25 flexible printed circuit board 31, 32 amplifier 33 fixed resistor L conveying path, MS... magnetic material, MS1... hard magnetic material part, MS2... soft magnetic material part, OB... object to be verified

Claims (8)

所定の搬送路に沿って第1方向へ移動する検証物に含まれる磁性体を検出するための磁性体検出装置であって、
前記第1方向に直交する第2方向に延設された第1磁石であって、前記第1方向に交差し、且つ前記第2方向に直交する方向に磁化され、その一方の磁極面が前記搬送路に対面配置されている第1磁石と、
前記第1磁石から見て前記第1方向に離間した位置にて前記第2方向に延設されていて、前記第1磁石とは反対方向に磁化された第2磁石であって、前記第1磁石の一方の磁極面の磁極とは反対の磁極である磁極面が前記搬送路に対面配置され、前記第1磁石と協働して、前記第1磁石との間の所定の空間に磁界を形成する第2磁石と、
前記第1磁石と前記第2磁石との間の所定の空間に形成された前記磁界の磁力線経路内に配置された基板、及び前記基板の表面にて前記第2方向に対して所定の角度だけ傾斜した方向へ延びる線状部分を有するように形成されていて、前記基板の表面内における前記第2方向に直交する方向の前記磁界の変化に対して電気抵抗値が変化する磁気抵抗効果素子を有する磁気センサ回路と、を備え、
前記第1磁石と前記第2磁石とが協働して形成された前記磁界により、前記磁気抵抗効果素子の飽和磁界より小さな強さのバイアス磁界であって、前記磁気抵抗効果素子に対して前記基板の表面内の前記第2方向に直交する方向へ向けられたバイアス磁界が付与され、且つ前記第1磁石の近傍の所定の領域内にて前記検証物の磁性体が前記第1磁石と前記第2磁石とが協働して形成された前記磁界の影響を受けて所定の状態に磁化されるように、前記第1磁石と前記第2磁石との間の空間に前記磁気センサ回路を配置するとともに、前記第1磁石の前記磁極面と前記検証物の搬送路との距離を前記第2磁石の前記磁極面と前記搬送路との距離よりも小さく設定した ことを特徴とする磁性体検出装置。
A magnetic body detection device for detecting a magnetic body contained in a verification object moving in a first direction along a predetermined transport path,
a first magnet extending in a second direction orthogonal to the first direction, the first magnet being magnetized in a direction that intersects the first direction and is orthogonal to the second direction;One of the magnetic pole faces is arranged to face the conveying patha first magnet;
extending in the second direction at a position spaced apart in the first direction when viewed from the first magnet,A second magnet magnetized in a direction opposite to that of the first magnet, wherein a magnetic pole surface opposite to the magnetic pole of one magnetic pole surface of the first magnet is arranged to face the conveying path,Cooperating with the first magnet,between the first magneta second magnet that forms a magnetic field in a predetermined space;
a substrate arranged in a magnetic force line path of the magnetic field formed in a predetermined space between the first magnet and the second magnet; andthe surface of the substrateis formed to have a linear portion extending in a direction inclined by a predetermined angle with respect to the second direction,the surface of the substratea magnetic sensor circuit having a magnetoresistive effect element whose electric resistance value changes with respect to a change in the magnetic field in the direction orthogonal to the second direction in the
By the magnetic field formed by the cooperation of the first magnet and the second magnet, a bias magnetic field having a strength smaller than the saturation magnetic field of the magnetoresistive element is applied to the magnetoresistive element. A bias magnetic field directed in a direction orthogonal to the second direction is applied within the surface of the substrate, and the magnetic material of the verification object is positioned within a predetermined region near the first magnet and the first magnet. The magnetic sensor circuit is arranged in the space between the first magnet and the second magnet so that the second magnet is magnetized in a predetermined state under the influence of the magnetic field formed in cooperation with the second magnet. Further, the distance between the magnetic pole surface of the first magnet and the conveying path of the verification object is set smaller than the distance between the magnetic pole surface of the second magnet and the conveying path. A magnetic body detection device characterized by:
請求項1に記載した磁性体検出装置において、
前記検証物の磁性体の磁化状態が前記第2磁石の近傍の所定の領域内にて変化しないように、前記搬送路と前記第2磁石との距離を設定したことを特徴とする磁性体検出装置。
In the magnetic body detection device according to claim 1,
Magnetic substance detection, wherein the distance between the conveying path and the second magnet is set so that the magnetization state of the magnetic substance of the verification object does not change within a predetermined region near the second magnet. Device.
請求項1又は2に記載した磁性体検出装置において、
前記第2磁石から見て前記第1磁石とは反対方向に離間した位置にて前記第2方向に延設された第3磁石であって、前記第1方向に交差し、且つ前記第2方向に直交する方向に磁化され、その一方の磁極面が前記搬送路に対面配置されていて、前記第1磁石及び前記第2磁石と協働して、前記第2磁石との間の所定の空間に磁界を形成するとともに、前記第1磁石と前記第2磁石との間の所定の空間に磁界を形成する第3磁石をさらに備え、
前記第1磁石乃至前記第3磁石が協働して前記第1磁石と前記第2磁石との間に形成された磁界により、前記磁気抵抗効果素子の飽和磁界より小さな強さのバイアス磁界であって、前記磁気抵抗効果素子に対して前記基板の表面内の前記第2方向に直交する方向へ向けられたバイアス磁界が付与され、且つ前記第1磁石の近傍の所定の領域内にて前記検証物の磁性体が前記第1磁石と前記第2磁石との間に形成された前記磁界の影響を受けて所定の状態に磁化され、さらに、前記第3磁石の近傍の所定の領域内にて前記検証物の磁性体が前記第2磁石と前記第3磁石との間に形成された前記磁界の影響を受けて所定の状態に磁化されるように、前記第1磁石と前記第2磁石の間の空間に前記磁気センサ回路を配置するとともに、前記第1磁石の前記磁極面と前記搬送路との距離、及び前記第3磁石の前記磁極面と前記搬送路との距離を前記第2磁石の前記磁極面と前記搬送路との距離よりも小さく設定したことを特徴とする磁性体検出装置。
In the magnetic body detection device according to claim 1 or 2,
A third magnet extending in the second direction at a position spaced apart in a direction opposite to the first magnet when viewed from the second magnet, crossing the first direction and in the second direction one of the magnetic pole faces is arranged to face the conveying path, cooperates with the first magnet and the second magnet, and forms a predetermined space between the second magnet and a third magnet that forms a magnetic field in a predetermined space between the first magnet and the second magnet,
A magnetic field formed between the first magnet and the second magnet by cooperation of the first to third magnets provides a bias magnetic field having a strength smaller than the saturation magnetic field of the magnetoresistive effect element. a bias magnetic field directed in a direction perpendicular to the second direction in the surface of the substrate is applied to the magnetoresistive element, and the verification is performed in a predetermined region near the first magnet. A magnetic body of an object is magnetized in a predetermined state under the influence of the magnetic field formed between the first magnet and the second magnet, and furthermore, in a predetermined region near the third magnet. The first magnet and the second magnet are arranged so that the magnetic material of the verification object is magnetized in a predetermined state under the influence of the magnetic field formed between the second magnet and the third magnet. The magnetic sensor circuit is arranged in the space between the second magnet and the distance between the magnetic pole surface of the first magnet and the conveying path, and the distance between the magnetic pole surface of the third magnet and the conveying path. , wherein the distance between the magnetic pole surface and the conveying path is set to be smaller than that of the magnetic material detecting device.
請求項3に記載した磁性体検出装置において、
前記第1磁石の磁化方向と前記第3磁石の磁化方向とが同一方向であることを特徴とする、磁性体検出装置。
In the magnetic body detection device according to claim 3,
A magnetic body detection device, wherein the magnetization direction of the first magnet and the magnetization direction of the third magnet are the same.
請求項1乃至4のうちのいずれか1つに記載した磁性体検出装置において、
前記磁気抵抗効果素子は、前記基板の表面内における前記第2方向の同一位置にて互いに対向する第1磁気抵抗素子及び第2磁気抵抗素子を有し、
前記第1磁気抵抗素子及び前記第2磁気抵抗素子に対する前記バイアス磁界が反対方向になるように、前記磁界を設定するとともに前記磁気センサ回路を配置したことを特徴とする磁性体検出装置。
In the magnetic body detection device according to any one of claims 1 to 4,
The magnetoresistive element has a first magnetoresistive element and a second magnetoresistive element facing each other at the same position in the second direction within the surface of the substrate ,
A magnetic body detection device, wherein the magnetic field is set and the magnetic sensor circuit is arranged so that the bias magnetic field for the first magnetoresistive element and the second magnetoresistive element are directed in opposite directions.
請求項5に記載した磁性体検出装置において、さらに、
前記第1磁気抵抗素子と前記第2磁気抵抗素子とを直列に接続し、その両端に所定電圧を印加して前記第1磁気抵抗素子と前記第2磁気抵抗素子の接続点の電圧を取り出す電気回路を備えたことを特徴とする磁性体検出装置。
The magnetic body detection device according to claim 5, further comprising:
Electricity in which the first magnetoresistive element and the second magnetoresistive element are connected in series and a predetermined voltage is applied to both ends thereof to take out the voltage at the connection point between the first magnetoresistive element and the second magnetoresistive element A magnetic body detection device comprising a circuit.
請求項5に記載した磁性体検出装置において、
前記磁気抵抗効果素子は、さらに、前記基板の表面内において、前記第1磁気抵抗素子及び前記第2磁気抵抗素子から見て前記第2方向に離間した位置にそれぞれ設けられ、前記基板の表面内における前記第2方向の同一位置にて互いに対向する第3磁気抵抗素子及び第4磁気抵抗素子であって、前記基板の表面内における前記第2方向と直交する方向の磁界の変化に対して電気抵抗値が変化する第3磁気抵抗素子及び第4磁気抵抗素子を有し、
前記第3磁気抵抗素子及び前記第4磁気抵抗素子に対する前記バイアス磁界が反対方向になるように構成し、さらに、
前記第1磁気抵抗素子の前記第3磁気抵抗素子側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子側の端子を接続し、前記第2磁気抵抗素子の前記第4磁気抵抗素子側の端子と前記第3磁気抵抗素子の前記第1磁気抵抗素子側の端子を接続し、前記第1磁気抵抗素子の前記第3磁気抵抗素子と反対側の端子と前記第2磁気抵抗素子の前記第4磁気抵抗素子と反対側の端子を接続し、かつ前記第3磁気抵抗素子の前記第1磁気抵抗素子と反対側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子と反対側の端子を接続し、前記第1磁気抵抗素子と前記第2磁気抵抗素子の接続点と、前記第3磁気抵抗素子と前記第4磁気抵抗素子の接続点との間に所定電圧を印加して、前記第1磁気抵抗素子と前記第4磁気抵抗素子の接続点の電圧と、前記第2磁気抵抗素子と前記第3磁気抵抗素子の接続点の電圧との差電圧を取り出す電気回路を備えたことを特徴とする磁性体検出装置。
In the magnetic body detection device according to claim 5,
The magnetoresistive effect elements are further provided within the surface of the substrate at positions spaced apart in the second direction when viewed from the first magnetoresistive element and the second magnetoresistive element. a third magneto-resistive element and a fourth magneto-resistive element facing each other at the same position in the second direction in the surface of the substrate , wherein the electric Having a third magnetoresistive element and a fourth magnetoresistive element whose resistance value changes,
The bias magnetic fields for the third magneto-resistive element and the fourth magneto-resistive element are arranged in opposite directions, and
The terminal of the first magnetoresistance element on the side of the third magnetoresistance element and the terminal of the fourth magnetoresistance element on the side of the second magnetoresistance element are connected, and the fourth magnetoresistance element of the second magnetoresistance element is connected. side terminal and the terminal of the third magnetoresistive element on the side of the first magnetoresistive element, and the terminal of the first magnetoresistive element opposite to the third magnetoresistive element and the terminal of the second magnetoresistive element A terminal opposite to the fourth magnetoresistive element is connected, and a terminal of the third magnetoresistive element opposite to the first magnetoresistive element and a terminal of the fourth magnetoresistive element opposite to the second magnetoresistive element side terminals are connected, and a predetermined voltage is applied between the connection point between the first magnetoresistive element and the second magnetoresistive element and the connection point between the third magnetoresistive element and the fourth magnetoresistive element. and an electric circuit for extracting a difference voltage between a voltage at a connection point between the first magnetoresistive element and the fourth magnetoresistive element and a voltage at a connection point between the second magnetoresistive element and the third magnetoresistive element. A magnetic body detection device characterized by:
請求項5に記載した磁性体検出装置において、
前記磁気抵抗効果素子は、さらに、前記基板の表面内において、前記第1磁気抵抗素子及び前記第2磁気抵抗素子から見て前記第2方向に離間した位置にそれぞれ設けられ、前記基板の表面内における前記第2方向の同一位置にて互いに対向する第3磁気抵抗素子及び第4磁気抵抗素子であって、前記基板の表面内における前記第2方向と直交する方向の磁界の変化に対して電気抵抗値が変化する第3磁気抵抗素子及び第4磁気抵抗素子を有し、
前記第3磁気抵抗素子及び前記第4磁気抵抗素子に対する前記バイアス磁界が反対方向になるように構成し、さらに、
前記第1磁気抵抗素子の前記第3磁気抵抗素子と反対側の端子と前記第2磁気抵抗素子の前記第4磁気抵抗素子と反対側の端子を接続し、前記第3磁気抵抗素子の前記第1磁気抵抗素子の反対側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子と反対側の端子を接続し、前記第1磁気抵抗素子の前記第3磁気抵抗素子側の端子と前記第4磁気抵抗素子の前記第2磁気抵抗素子側の端子を接続し、かつ前記第2磁気抵抗素子の前記第4磁気抵抗素子側の端子と前記第3磁気抵抗素子の前記第1磁気抵抗素子側の端子を接続し、前記第1磁気抵抗素子と前記第4磁気抵抗素子の接続点と、前記第2磁気抵抗素子と前記第3磁気抵抗素子の接続点との間に所定電圧を印加して、前記第1磁気抵抗素子と前記第2磁気抵抗素子の接続点の電圧と、前記第3磁気抵抗素子と前記第4磁気抵抗素子の接続点の電圧との差電圧を取り出す電気回路を備えたことを特徴とする磁性体検出装置。
In the magnetic body detection device according to claim 5,
The magnetoresistive effect elements are further provided within the surface of the substrate at positions spaced apart in the second direction when viewed from the first magnetoresistive element and the second magnetoresistive element. a third magneto-resistive element and a fourth magneto-resistive element facing each other at the same position in the second direction in the surface of the substrate , wherein the electric Having a third magnetoresistive element and a fourth magnetoresistive element whose resistance value changes,
The bias magnetic fields for the third magneto-resistive element and the fourth magneto-resistive element are arranged in opposite directions, and
The terminal of the first magnetoresistive element opposite to the third magnetoresistive element and the terminal of the second magnetoresistive element opposite to the fourth magnetoresistive element are connected, and the third magnetoresistive element of the third magnetoresistive element is A terminal opposite to the first magnetoresistive element and a terminal of the fourth magnetoresistive element opposite to the second magnetoresistive element are connected, and a terminal of the first magnetoresistive element on the side of the third magnetoresistive element is connected to the terminal of the fourth magnetoresistive element. connecting a terminal of a fourth magnetoresistive element on the second magnetoresistive element side, and connecting a terminal of the second magnetoresistive element on the side of the fourth magnetoresistive element and the first magnetoresistive element of the third magnetoresistive element; side terminals are connected, and a predetermined voltage is applied between the connection point between the first magnetoresistive element and the fourth magnetoresistive element and the connection point between the second magnetoresistive element and the third magnetoresistive element. and an electric circuit for extracting a difference voltage between a voltage at a connection point between the first magnetoresistive element and the second magnetoresistive element and a voltage at a connection point between the third magnetoresistive element and the fourth magnetoresistive element. A magnetic body detection device characterized by:
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