JP7155658B2 - Hermetic package and method for manufacturing hermetic package - Google Patents

Description

The present invention relates to a hermetic package and a method for manufacturing a hermetic package.

2. Description of the Related Art Conventionally, an airtight package in which an element (photoelectric element) such as an LED is mounted inside is known for the purpose of improving the reliability of the element (photoelectric element). For example, Patent Document 1 discloses a container (package base material) having a recess for housing an element (package base material), a glass lid (cover member) for sealing the recess, and a sealing material layer (bonding material) for sealing the container and the glass lid. A hermetic package is described comprising:

WO2017/199491

In the airtight package as described above, light incident on the device and light emitted from the device pass through the central portion (translucent portion) of the glass lid. For this reason, it is preferable to prevent objects such as human hands and tools from coming into contact with the central portion of the glass lid during manufacture and handling of the hermetic package. SUMMARY OF THE INVENTION It is an object of the present invention to provide an airtight package and a method of manufacturing an airtight package in which objects are less likely to come into contact with the translucent portion of the cover member during manufacture and handling.

An airtight package that solves the above problems has a bottom wall and a peripheral wall extending from the bottom wall, a package base capable of accommodating a photoelectric element in a recess surrounded by the bottom wall and the peripheral wall, and a light-transmitting package base material. and a cover member that closes the recess, the cover member having a translucent portion facing the recess and a joint portion joined to the peripheral wall, wherein the peripheral wall is positioned against the bottom wall. When the extending direction is defined as an extending direction, the joint portion has a protruding portion that protrudes in the extending direction more than the light-transmitting portion.

In the airtight package configured as described above, since the joint portion of the cover member has the projecting portion, even if an object such as a human hand or a tool comes into contact with the projecting portion, the object is less likely to come into contact with the translucent portion. Therefore, the airtight package can prevent an object from coming into contact with the translucent portion of the cover member.

In the airtight package described above, the thickness of the translucent portion is preferably less than the thickness of the joint portion.
If the thickness of the translucent part is greater than or equal to the thickness of the joint part, the transmittance of the translucent part tends to decrease as the translucent part becomes thicker, and the strength of the joint part becomes less secure as the joint becomes thinner. Hateful. In this respect, in the airtight package having the above configuration, the thickness of the transparent portion is less than the thickness of the joint portion, so the above-described problem can be avoided.

In the cover member, when the surface facing the package base is defined as the inner surface, it is preferable that the inner surface of the translucent portion and the inner surface of the joint portion are on the same plane.
In the hermetic package having the above configuration, the cover member can be easily manufactured. For example, the inner surfaces of the translucent portion and the joint portion can be formed at once through a polishing process or the like.

The airtight package includes a bonding layer that bonds the peripheral wall of the package base material and the cover member, and when the cover member and the bonding layer are viewed from the extending direction, the formation range of the bonding layer is the It is preferable that it overlaps with the formation range of the projecting portion.

According to the above configuration, the airtight package can increase the joint strength between the joint portion and the peripheral wall when an object comes into contact with the projecting portion.
In the above airtight package, it is preferable that the translucent portion has a flat plate shape.

According to the above configuration, the light incident on the translucent portion passes through the translucent portion as it is. Therefore, in the airtight package, the translucent portion can function as a mere cover that covers the concave portion.
In the above airtight package, it is preferable that the translucent section has an optical element.

According to the above configuration, the hermetic package can provide the translucent portion with an optical function such as condensing, dispersing, or refracting incident light.
In the above airtight package, it is preferable that the cover member is made of glass, and that the thickness of the translucent portion is 0.1 mm or more and 2.0 mm or less.

According to the above configuration, when the cover member is made of glass, the translucency of the translucent portion can be improved.
A method for manufacturing an airtight package that solves the above problems is the above-described method for manufacturing an airtight package, wherein the cover member is arranged on the peripheral wall of the package base so that the projecting portion faces the extending direction. and a pressing step of pressing the cover member against the package base via the projecting portion.

According to the manufacturing method having the above configuration, there is no need to press the cover member against the package base material via the translucent portion of the cover member in the pressing step. Therefore, the manufacturing method described above can prevent an object from coming into contact with the translucent portion of the cover member during manufacturing of the airtight package.

In the airtight package manufacturing method, it is preferable that the pressing step presses the cover member against the package base material by pressing a plate-like body against the projecting portion.

According to the manufacturing method having the above configuration, it is not necessary to prepare a member having a special shape in order to press the cover member against the package base material without touching the light transmitting portion. Therefore, the manufacturing method described above can prevent the manufacturing process from becoming complicated.

According to the present invention, it is possible to prevent objects such as human hands and tools from coming into contact with the translucent portion of the cover member during manufacturing and handling.

(a) is a plan view of an electronic device, and (b) is an end view taken along line 1b-1b. (a) to (c) are end views for explaining a method for manufacturing an electronic device. (a) is an end view of an electronic device according to a first modification, and (b) is an end view of an electronic device according to a second modification.

An embodiment of an airtight package (electronic device) will be described below with reference to the drawings.
As shown in FIGS. 1A and 1B, the electronic device 10 includes a photoelectric element 11 and an airtight package 12 that seals the photoelectric element 11 . The airtight package 12 includes a package base 20 that houses the photoelectric element 11, a cover member 30 that seals the photoelectric element 11 together with the package base 20, a bonding layer 40 that bonds the package base 20 and the cover member 30, Prepare. In this embodiment, the electronic device 10 has a box-like shape with a side of several millimeters to several centimeters.

The photoelectric element 11 may be a light-emitting element such as a light-emitting diode or a semiconductor laser, or a light-receiving element such as a photodiode, a phototransistor, or a phototube. The photoelectric element 11 handles, for example, light with a wavelength such as deep ultraviolet. One or more photoelectric elements 11 may be sealed in the airtight package 12, or a set of a light emitting element and a light receiving element may be sealed.

The package substrate 20 is made of, for example, ceramics such as aluminum oxide, aluminum nitride, zirconia or mullite, glass ceramics such as low temperature co-fired ceramics, or glass. Low-temperature co-fired ceramics are, for example, sintered bodies of inorganic powder such as titanium oxide or niobium oxide and glass powder.

The package base 20 has a bottom wall 21 having a rectangular shape in plan view and a peripheral wall 22 extending from the bottom wall 21 . The height of the peripheral wall 22 is constant in the direction in which the peripheral wall 22 extends with respect to the bottom wall 21 (extending direction Dy). In other words, the distal end surface 23 of the peripheral wall 22 is planar. A recess 24 is formed in the package base 20 as a space surrounded by the bottom wall 21 and the peripheral wall 22 . The recess 24 is a space for accommodating the photoelectric element 11 .

The cover member 30 is made of a transparent material that is transparent to the wavelength of light handled by the photoelectric element 11, such as deep ultraviolet rays. As an example, the cover member 30 is preferably made of a transparent material having a transmittance of 70% or more for light of wavelengths handled by the photoelectric element 11 when formed into a plate with a thickness of 0.5 mm. Transparent materials include, for example, SiO ₂ —B ₂ O ₃ —RO (R is Mg, Ca, Sr or Ba) glass, SiO ₂ —B ₂ O ₃ —R′ ₂ O (R′ is Li, Na or Ka ) type glass, SiO ₂ —B ₂ O ₃ —RO—R′ ₂ O type glass, SnO—P ₂ O ₅ type glass, TeO ₂ type glass, Bi ₂ O ₃ type glass, or the like.

The cover member 30 is a plate-like member that is rectangular in plan view, and has a size that can close the recess 24 . The cover member 30 has a translucent portion 31 through which light passes, and a joint portion 32 joined to the peripheral wall 22 of the airtight package 12 . The translucent portion 31 is a central portion of the cover member 30 and faces the recess 24 . The joint portion 32 is a peripheral edge portion of the cover member 30 and faces the tip surface 23 of the peripheral wall 22 of the package base material 20 . In the cover member 30, when the surface facing the package base 20 is defined as an inner surface and the surface opposite to the inner surface is defined as an outer surface, the inner surface of the translucent portion 31 and the inner surface of the joint portion 32 can be said to exist on the same plane. . The shape of the cover member 30 is formed by, for example, mold pressing, grinding, polishing, etching, or the like.

The translucent portion 31 has a flat plate shape. The thickness of the translucent portion 31 is preferably about 0.1 mm to 2.0 mm so as not to reduce translucency. The joint portion 32 has a rectangular frame shape in plan view, and has a shape corresponding to the peripheral wall 22 of the package base material 20 .

The joint portion 32 has a protruding portion 33 that protrudes in the extending direction Dy. The projecting portion 33 has a flat tip surface and projects more than the translucent portion 31 in the extending direction Dy. The thickness T<b>1 of the translucent portion 31 is less than the thickness T<b>2 of the joint portion 32 because the joint portion 32 is provided with the projecting portion 33 . As an example, the joint portion 32 preferably has a thickness of about 0.3 mm to 3.0 mm.

The bonding layer 40 is formed, for example, by heating a glass paste containing low melting point glass powder. The low melting point glass powder may be, for example, Bi ₂ O ₃ -based glass powder, SnO—P ₂ O ₅ -based glass powder, or V ₂ O ₅ -TeO ₂ -based glass powder. The glass paste may contain a low-expansion refractory filler, a laser light absorbing material, and the like in addition to the low-melting-point glass powder.

The bonding layer 40 is formed along the entire circumference of the peripheral wall 22 between the front end surface 23 of the package base material 20 and the bonding portion 32 of the cover member 30 . In a plan view of the airtight package 12 , the formation range of the bonding layer 40 overlaps the front end surface 23 of the peripheral wall 22 of the package base 20 and overlaps the formation range of the joint portion 32 (protruding portion 33 ) of the cover member 30 . Specifically, the formation range of the bonding layer 40 is narrower than the tip surface 23 of the peripheral wall 22 and narrower than the formation range of the bonding portion 32 (projection portion 33). Therefore, as shown in FIG. 1A, the width W1 of the bonding layer 40 is less than the width W2 of the peripheral wall 22 and the projecting portion 33 . The bonding layer 40 preferably has a thickness of several μm to several tens of μm.

Next, a method of manufacturing the electronic device 10 (hermetic package 12) will be described with reference to FIGS. It is assumed that the photoelectric element 11, the package substrate 20 and the cover member 30 have already been prepared.

As shown in FIG. 2A, a glass paste 41 is applied in a ring shape (frame shape in this embodiment) on the inner surface of the joint portion 32 of the cover member 30 (application step). The glass paste 41 may be applied to the cover member 30 by, for example, screen printing, offset printing, letterpress printing, inkjet printing, or the like.

After applying the glass paste 41 to the cover member 30, a so-called calcination process may be performed. Specifically, the cover member 30 coated with the glass paste 41 is put into a heating furnace or the like to be heated, and the binder contained in the glass paste 41 is removed while the glass paste 41 is temporarily solidified. good too.

Then, as shown in FIG. 2B, the photoelectric element 11 is accommodated in the concave portion 24 of the package base material 20 . After that, the cover member 30 is arranged on the peripheral wall 22 of the package base 20 so that the projecting portion 33 faces the extension direction Dy (placement step). At this time, the cover member 30 is arranged so that the glass paste 41 is in contact with the tip surface 23 of the peripheral wall 22 of the package base material 20 . Thereafter, the glass paste 41 is heated to soften the glass paste 41 (heating step). The heating of the glass paste 41 is performed, for example, by irradiating the glass paste 41 with a laser beam. The glass paste 41 may be softened to a viscosity that allows it to flow, or may be softened to a viscosity that allows it to spread.

Finally, as shown in FIG. 2C, the cover member 30 is pressed against the package substrate 20 by the plate-like body 100 (pressing step). Here, in the cover member 30 of the present embodiment, the joint portion 32 has a protruding portion 33 that protrudes in the extension direction Dy from the translucent portion 31 . Therefore, in the pressing step, the plate-like body 100 is in contact with the joint portion 32 of the cover member 30 but is not in contact with the translucent portion 31 of the cover member 30 . That is, the plate-like body 100 presses the cover member 30 against the package base material 20 via the projecting portion 33 .

Thereafter, the electronic device 10 (airtight package 12) is slowly cooled, and the softened bonding layer 40 is solidified. As a result, the package base material 20 and the cover member 30 are bonded via the bonding layer 40 , and the photoelectric element 11 is sealed within the recess 24 .

The action and effect of this embodiment will be described.
(1) The hermetic package 12 is surrounded by the projecting portion 33 extending from the joint portion 32 around the translucent portion 31 of the cover member 30 . Therefore, even if an object such as a human hand or a tool comes into contact with the projecting portion 33 , the object is less likely to come into contact with the translucent portion 31 . Therefore, the airtight package 12 can prevent an object from coming into contact with the translucent portion 31 of the cover member 30 during manufacturing and handling.

(2) When the thickness of the light-transmitting portion 31 is set to be the same as that of the joint portion 32 which is set to a thickness that can ensure the strength, the transmittance of the light-transmitting portion 31 decreases in that the light-transmitting portion 31 becomes thicker. Cheap. On the other hand, if the thickness of the joint portion 32 is set to be the same as that of the translucent portion 31 that is set to a thickness that ensures translucency, the joint portion 32 becomes thin, making it difficult to ensure the strength of the joint portion 32 . In this respect, since the airtight package 12 makes the thickness of the translucent portion 31 smaller than the thickness of the joint portion 32, the above problem can be avoided. In other words, the airtight package 12 can improve both the transmittance of the translucent portion 31 and the strength of the joint portion 32 .

(3) In the cover member 30, since the inner surface of the translucent portion 31 and the inner surface of the joint portion 32 are on the same plane, the cover member 30 can be manufactured easily. For example, the inner surface of the translucent portion 31 and the inner surface of the joint portion 32 of the cover member 30 can be formed at once through a polishing process or the like.

(4) When the cover member 30 and the bonding layer 40 are viewed from the extension direction Dy, the formation range of the bonding layer 40 overlaps the formation range of the projecting portion 33 . Therefore, the airtight package 12 can increase the joint strength between the joint portion 32 and the peripheral wall 22 when an object contacts the projecting portion 33 .

(5) Since the light-transmitting portion 31 has a flat plate shape, the light incident on the light-transmitting portion 31 passes through the light-transmitting portion 31 as it is. Therefore, in the airtight package 12, the translucent portion 31 can function as a mere glass cover that only covers the concave portion 24. As shown in FIG.

(6) Since the thickness of the light-transmitting portion 31 of the cover member 30 is about 0.1 mm to 2.0 mm, the light-transmitting property of the light-transmitting portion 31 of the airtight package 12 can be improved.
(7) In the method for manufacturing the airtight package 12 of the present embodiment, it is not necessary to press the cover member 30 against the package base material 20 via the translucent portion 31 of the cover member 30 in the pressing step. Therefore, the manufacturing method described above can prevent an object from coming into contact with the translucent portion 31 of the cover member 30 when manufacturing the airtight package 12 .

(8) Specifically, in the pressing step, the cover member 30 is pressed against the package base 20 by pressing the plate-like body 100 against the projecting portion 33 of the cover member 30 . Therefore, the manufacturing method described above does not require preparation of a member having a special shape in order to press the cover member 30 against the package base material 20 . In this respect, the manufacturing method described above can prevent the manufacture of the airtight package 12 from becoming complicated.

This embodiment can be implemented with the following modifications. This embodiment and the following modified examples can be implemented in combination with each other within a technically consistent range.
- As shown in FIG. 3A, the electronic device 10 (airtight package 12) may be an electronic device 10A (airtight package 12A) according to the first modified example. A cover member 30A of the airtight package 12A has an optical element 34 such as a diffraction grating or a moth-eye structure in the translucent portion 31A. According to this, the airtight package 12 can provide the light transmitting portion 31A with an optical function such as dispersing, refracting, or diffracting incident light. In this case, since the optical element 34 is formed on the transparent portion 31A of the cover member 30, the transparent portion 31A is not formed in a flat plate shape.

- In the 1st modification shown to Fig.3 (a), the optical element 34 is good also as a lens. In this case, the lens is preferably a thin lens such as a Fresnel lens in order to suppress the protrusion amount of the joint portion 32 of the cover member 30 . Furthermore, in this case, if the light-transmitting portion 31A does not protrude more than the projecting portion 33 in the extending direction Dy, the thickness T1 of the light-transmitting portion 31A is equal to or greater than the thickness T2 of the joint portion 32. good too. The optical element 34 may be configured integrally with the cover member 30A by integral molding or post-processing, or may be configured by attaching a separate component to the translucent portion 31A.

- As shown in FIG. 3B, the electronic device 10 (airtight package 12) may be an electronic device 10B (airtight package 12B) according to the second modified example. The joint portion 32B of the cover member 30B of the airtight package 12B has a first projecting portion 35 corresponding to the projecting portion 33 of the above embodiment, and a second projecting portion 36 projecting in a direction opposite to the extending direction Dy. . With this configuration as well, the effects of the above embodiment can be obtained.

- As shown in FIGS. 1(a) and 1(b), in the present embodiment, when the airtight package 12 is viewed from above, the joint portion 32 (protruding portion 33) between the peripheral wall 22 of the package base material 20 and the cover member 30 is They are formed in equal sizes, but may be formed in different sizes.

- For example, in plan view of the airtight package 12 , the size of the projecting portion 33 of the cover member 30 may be smaller than the size of the peripheral wall 22 of the package base 20 . That is, the width of the projecting portion 33 of the cover member 30 may be less than the width of the peripheral wall 22 of the package base material 20 .

Further, when the airtight package 12 is viewed from above, the size of the projecting portion 33 of the cover member 30 may be equal to or larger than the size of the peripheral wall 22 of the package base material 20 . That is, the width of the projecting portion 33 of the cover member 30 may be greater than the width of the peripheral wall 22 of the package base material 20 .

- Moreover, the projecting portion 33 of the cover member 30 may be formed in plural at predetermined intervals in the circumferential direction of the joint portion 32 .
- The electronic device 10 (airtight package 12) does not have to be manufactured by pressing the cover member 30 against the package substrate 20 with the plate-like body 100.

- The size and shape of the electronic device 10 (airtight package 12) may be changed as appropriate. For example, the electronic device 10 (airtight package 12) may be circular in plan view.

- The cover member 30 may be made of a transparent material such as resin or ceramic. In this case, the bonding layer 40 may be formed using an adhesive, solder, or the like.
- In the heating process, the glass paste 41 may not be heated using a laser beam. For example, in the heating step, an electric heater or the like may be used to heat the glass paste 41 .

DESCRIPTION OF SYMBOLS 10, 10A, 10B... Electronic device, 11... Photoelectric element, 12, 12A, 12B... Airtight package, 20... Package base material, 21... Bottom wall, 22... Peripheral wall, 23... Tip surface, 24... Recessed part, 30, 30A , 30B... cover member, 31, 31A... translucent part, 32, 32B... joining part, 33... protruding part, 34... optical element, 35... first protruding part, 36... second protruding part, 40... joining layer, 41... Glass paste, 100... Plate-like body, Dy... Extension direction, T1, T2... Thickness, W1, W2... Width.

Claims (9)

a package base having a bottom wall and a peripheral wall extending from the bottom wall and capable of accommodating a photoelectric element in a recess surrounded by the bottom wall and the peripheral wall;
A cover member that has translucency and closes the recess,
The cover member has a translucent portion facing the recess and a joint portion joined to the tip surface of the peripheral wall,
When the direction in which the peripheral wall extends with respect to the bottom wall is defined as the extension direction,
The joint portion includes a first projecting portion projecting in the extending direction from the light transmitting portion ;
a second projecting portion that projects in a direction opposite to the extending direction and is joined to the tip surface of the peripheral wall . 2. The hermetic package according to claim 1, wherein the thickness of the translucent portion is less than the thickness of the joint portion. In the cover member, when the surface facing the package substrate is the inner surface,
3. The airtight package according to claim 1, wherein the inner surface of the translucent portion and the inner surface of the joint portion are on the same plane. a bonding layer for bonding the peripheral wall of the package base material and the cover member;
The formation range of the joining layer overlaps with the formation range of the first projecting portion when the cover member and the joining layer are viewed from the extending direction. airtight package. The airtight package according to any one of claims 1 to 4, wherein the translucent portion has a flat plate shape. The airtight package according to any one of claims 1 to 4, wherein the translucent portion has an optical element. The cover member is glass,
The airtight package according to any one of claims 1 to 6, wherein the transparent portion has a thickness of 0.1 mm or more and 2.0 mm or less. A method for manufacturing an airtight package according to any one of claims 1 to 7,
an arrangement step of arranging the cover member on the peripheral wall of the package base so that the first protrusion faces the extension direction;
A method of manufacturing an airtight package, comprising: a pressing step of pressing the cover member against the package base via the first protrusion. 9. The method of manufacturing an airtight package according to claim 8, wherein the pressing step presses the cover member against the package base by pressing a plate-like body against the first projecting portion.

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