JP7135734B2 - Panel temperature detection device and method for detecting temperature in detection area of panel - Google Patents

Panel temperature detection device and method for detecting temperature in detection area of panel Download PDF

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JP7135734B2
JP7135734B2 JP2018205691A JP2018205691A JP7135734B2 JP 7135734 B2 JP7135734 B2 JP 7135734B2 JP 2018205691 A JP2018205691 A JP 2018205691A JP 2018205691 A JP2018205691 A JP 2018205691A JP 7135734 B2 JP7135734 B2 JP 7135734B2
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temperature
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temperature sensor
light irradiation
positioning member
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JP2020071141A (en
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伊彦 小川
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Omron Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B3/00—Apparatus specially adapted for the manufacture, assembly, or maintenance of boards or switchgear

Description

本開示は、盤温度検出装置、および、盤の機器に設けられた検出領域の温度を検出する方法に関する。 TECHNICAL FIELD The present disclosure relates to a board temperature detection device and a method for detecting the temperature of a detection area provided on board equipment.

特許文献１には、盤筺体と、盤筺体の内部に収納された収納機器とを備える配電盤が開示されている。 Patent Literature 1 discloses a switchboard including a board housing and a storage device housed inside the board housing.

特開２０１６－０９３０２８号公報JP 2016-093028 A

ところで、収納機器の一部の領域の温度を検出可能な温度センサを用いて前記配電盤内の収納機器の温度を監視する場合、配電盤の内部を撮影可能なカメラにより温度センサを位置決めして、配電盤の所定の領域の温度を監視することが考えられる。しかし、通常、カメラは高価であるため、製造コストの増加を招くおそれがある。 By the way, in the case of monitoring the temperature of the stored equipment in the switchboard using a temperature sensor capable of detecting the temperature of a part of the stored equipment, the temperature sensor is positioned by a camera capable of photographing the inside of the switchboard. It is conceivable to monitor the temperature of a predetermined region of the . However, cameras are typically expensive, which can lead to increased manufacturing costs.

本開示は、製造コストを抑制可能な盤温度検出装置、および、製造コストを抑制しつつ盤の機器に設けられた検出領域の温度を検出可能な方法を提供することを課題とする。 An object of the present disclosure is to provide a panel temperature detection device capable of suppressing manufacturing costs, and a method capable of detecting the temperature of a detection area provided in a device of the panel while suppressing manufacturing costs.

本開示の一例の盤温度検出装置は、
開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する盤温度検出装置であって、
前記検出領域の温度を検出可能な温度センサと、
前記対向面に光を照射可能な光照射装置と、
前記温度センサおよび前記光照射装置のいずれか一方を保持した状態で、前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材と
を備え、
前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に配置した前記位置決定部材に前記温度センサを保持させて、前記検出領域の温度を検出する。 An example board temperature detection device of the present disclosure includes:
A detection area provided on a surface facing the lid of the device of a board comprising a housing having an opening, a lid capable of opening and closing the opening, and a device placed inside the housing. A board temperature detection device for detecting temperature,
a temperature sensor capable of detecting the temperature of the detection region;
a light irradiation device capable of irradiating the facing surface with light;
a positioning member attached movably along the extending direction of the facing surface with respect to the lid while holding either one of the temperature sensor and the light irradiation device;
The temperature sensor is held by the positioning member arranged at the detection position where the irradiation area of the light emitted from the light irradiation device to the facing surface overlaps the detection area, and the temperature of the detection area is detected.

また、本開示の一例の方法は、
開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する方法であって、
前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材に、前記対向面に光を照射可能な光照射装置を保持させ、
前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に、前記位置決定部材を移動させて固定し、
前記位置決定部材から前記光照射装置を取り外すと共に、前記検出領域の温度を検出可能な温度センサを前記位置決定部材に保持させて、
前記温度センサで前記検出領域の温度を検出する。 Also, an example method of the present disclosure includes:
A detection area provided on a surface facing the lid of the device of a board comprising a housing having an opening, a lid capable of opening and closing the opening, and a device placed inside the housing. A method of detecting temperature, comprising:
holding a light irradiation device capable of irradiating light onto the facing surface in a positioning member attached movably along the extending direction of the facing surface with respect to the lid;
moving and fixing the positioning member to a detection position where the irradiation area of the light irradiated from the light irradiation device to the facing surface overlaps the detection area;
Detaching the light irradiation device from the positioning member and holding a temperature sensor capable of detecting the temperature of the detection region on the positioning member,
The temperature sensor detects the temperature of the detection area.

前記盤温度検出装置によれば、検出領域の温度を検出可能な温度センサと、機器に光を照射可能な光照射装置と、温度センサおよび光照射装置のいずれか一方を保持した状態で移動可能に取り付けられた位置決定部材とを備えている。このような構成により、カメラなどの高価な機器を用いることなく、検出領域の温度を検出することが可能な盤温度検出装置を実現できる。 According to the disk temperature detection device, the temperature sensor capable of detecting the temperature of the detection area, the light irradiation device capable of irradiating the device with light, and the temperature sensor and the light irradiation device can be moved while holding either one of the temperature sensor and the light irradiation device. and a locating member attached to the . With such a configuration, it is possible to realize a board temperature detection device capable of detecting the temperature of the detection area without using an expensive device such as a camera.

また、前記方法によれば、蓋体に対して移動可能に取り付けられた位置決定部材に光照射装置を保持させ、光照射装置から機器に照射された光の照射領域と検出領域とが重なる検出位置に位置決定部材を移動させて固定し、位置決定部材から光照射装置を取り外すと共に温度センサを位置決定部材に保持させて、温度センサで検出領域の温度を検出する。このような構成により、カメラなどの高価な機器を用いることなく盤の機器に設けられた検出領域の温度を検出することができる。すなわち、製造コストを抑制しつつ、盤の機器に設けられた検出領域の温度を検出可能な方法を実現できる。 Further, according to the above method, the light irradiation device is held by the positioning member movably attached to the lid, and the irradiation region of the light irradiated from the light irradiation device to the device and the detection region overlap each other. The positioning member is moved to a position and fixed, the light irradiation device is removed from the positioning member, the temperature sensor is held by the positioning member, and the temperature of the detection region is detected by the temperature sensor. With such a configuration, it is possible to detect the temperature in the detection area provided on the device on the board without using expensive equipment such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection area provided in the device on the board while suppressing the manufacturing cost.

本開示の一実施形態の盤温度検出装置の適用例を示す盤の正面図。1 is a front view of a board showing an application example of a board temperature detection device according to an embodiment of the present disclosure; FIG. 図１のII-II線に沿った断面図。Sectional drawing along the II-II line of FIG. 本開示の一実施形態の盤温度検出装置の温度センサおよび光照射装置の平面図。FIG. 2 is a plan view of the temperature sensor and the light irradiation device of the disc temperature detection device according to the embodiment of the present disclosure; 本開示の一実施形態の盤温度検出装置の位置決定部材を示す斜視図。1 is a perspective view showing a positioning member of a board temperature detection device according to an embodiment of the present disclosure; FIG. 本開示の一実施形態の盤温度検出装置を用いた検出領域の温度の検出方法を説明するためのフローチャート。4 is a flowchart for explaining a method of detecting temperature in a detection area using the board temperature detection device according to the embodiment of the present disclosure; 本開示の一実施形態の盤温度検出装置を用いた検出領域の温度の検出方法を説明するための第１の断面図。FIG. 2 is a first cross-sectional view for explaining a method of detecting temperature in a detection area using the board temperature detection device of one embodiment of the present disclosure; 本開示の一実施形態の盤温度検出装置を用いた検出領域の温度の検出方法を説明するための第２の断面図。FIG. 2 is a second cross-sectional view for explaining a method of detecting temperature in a detection area using the board temperature detection device according to one embodiment of the present disclosure;

以下、本開示の一例を添付図面に従って説明する。なお、以下の説明では、必要に応じて特定の方向あるいは位置を示す用語（例えば、「上」、「下」、「右」、「左」を含む用語）を用いるが、それらの用語の使用は図面を参照した本開示の理解を容易にするためであって、それらの用語の意味によって本開示の技術的範囲が限定されるものではない。また、以下の説明は、本質的に例示に過ぎず、本開示、その適用物、あるいは、その用途を制限することを意図するものではない。さらに、図面は模式的なものであり、各寸法の比率等は現実のものとは必ずしも合致していない。 An example of the present disclosure will be described below with reference to the accompanying drawings. In the following description, terms indicating specific directions or positions (for example, terms including “upper”, “lower”, “right”, and “left”) are used as necessary, but the use of these terms is are intended to facilitate understanding of the present disclosure with reference to the drawings, and the technical scope of the present disclosure is not limited by the meanings of these terms. Also, the following description is merely exemplary in nature and is not intended to limit the present disclosure, its applications, or its uses. Furthermore, the drawings are schematic, and the ratio of each dimension does not necessarily match the actual one.

本開示の一実施形態の盤温度検出装置１０は、例えば、図１に示す盤１に適用できる。この盤１は、図２に示すように、開口部５を有する筺体２と、開口部５を開閉可能な蓋体３と、筺体２の内部に配置された機器４とを備える。なお、図１では、蓋体３を省略している。 A board temperature detection device 10 according to an embodiment of the present disclosure can be applied to the board 1 shown in FIG. 1, for example. As shown in FIG. 2, the board 1 includes a housing 2 having an opening 5, a lid 3 capable of opening and closing the opening 5, and a device 4 arranged inside the housing 2. As shown in FIG. Note that the lid 3 is omitted in FIG.

筺体２は、一例として、略直方体状を有し、開口部５は、略矩形状を有している。図２に示すように、筺体２の内部に収容されている機器４と蓋体３との間には、隙間６が形成されている。この隙間６に、盤温度検出装置１０が配置されている。また、筺体２および蓋体３は、一例として、磁性体で構成されている。 As an example, the housing 2 has a substantially rectangular parallelepiped shape, and the opening 5 has a substantially rectangular shape. As shown in FIG. 2 , a gap 6 is formed between the device 4 housed inside the housing 2 and the lid 3 . A disk temperature detection device 10 is arranged in the gap 6 . Moreover, the housing 2 and the lid 3 are made of a magnetic material, for example.

盤温度検出装置１０は、図２に示すように、温度センサ１１と、光照射装置１２（図６および図７に示す）と、温度センサ１１および光照射装置１２のいずれか一方を保持可能な位置決定部材２０とを備えている。 As shown in FIG. 2, the disc temperature detection device 10 can hold a temperature sensor 11, a light irradiation device 12 (shown in FIGS. 6 and 7), and one of the temperature sensor 11 and the light irradiation device 12. and a positioning member 20 .

温度センサ１１は、例えば、熱画像センサであり、図２に示すように、機器４の蓋体３に対向する対向面７に設けられた検出領域３０の温度を検出可能に配置されている。検出領域３０は、例えば、機器４の設計などにより予め定められた対向面７上の略円形状の領域であり、温度を検出したい対向面７上の領域を含むように（例えば、温度を検出したい対向面７上の領域と略同等の大きさに）設定される。この検出領域３０は、１つに限らず、複数設けることもできる。 The temperature sensor 11 is, for example, a thermal image sensor, and as shown in FIG. The detection area 30 is, for example, a substantially circular area on the facing surface 7 that is predetermined by the design of the device 4 or the like, and includes an area on the facing surface 7 where the temperature is to be detected (for example, a is set to a size approximately equal to the desired area on the facing surface 7). The number of detection areas 30 is not limited to one, and a plurality of areas can be provided.

光照射装置１２は、ＬＥＤなどの可視光を照射可能な発光素子（図示せず）を有し、図６および図７に示すように、機器４の対向面７に光を照射可能に配置されている。光照射装置１２から対向面７に照射された光は、照射領域５０を形成する（図６および図７参照）。この照射領域５０は、例えば、検出領域３０と略同等の大きさの略円形状を有している。 The light irradiation device 12 has a light emitting element (not shown) capable of irradiating visible light such as an LED, and is arranged so as to irradiate the facing surface 7 of the device 4 with light as shown in FIGS. ing. Light irradiated from the light irradiation device 12 to the facing surface 7 forms an irradiation region 50 (see FIGS. 6 and 7). This irradiation area 50 has, for example, a substantially circular shape with a size substantially equal to that of the detection area 30 .

また、温度センサ１１および光照射装置１２の各々には、図３に示すように、後述する位置決定部材２０の一対のレール部２２１、２２２に係合可能な係合部４０が設けられている。この実施形態では、温度センサ１１および光照射装置１２の各々における略直方体状のハウジング１１１、１２１の一面における４つの角部に、４つの係合部４０がそれぞれ配置されている。 Further, as shown in FIG. 3, each of the temperature sensor 11 and the light irradiation device 12 is provided with an engaging portion 40 that can be engaged with a pair of rail portions 221 and 222 of the positioning member 20, which will be described later. . In this embodiment, four engaging portions 40 are arranged at four corners on one surface of substantially rectangular parallelepiped housings 111 and 121 in each of the temperature sensor 11 and the light irradiation device 12 .

各係合部４０は、ハウジング１１１、１２１の厚さ方向（すなわち、図３の紙面貫通方向）から見て、略Ｌ字状を有し、一対のレール部２２１、２２２に係合された温度センサ１１および光照射装置１２の各々が、ハウジング１１１、１２１の厚さ方向において係止されるように構成されている。 Each engaging portion 40 has a substantially L shape when viewed from the thickness direction of the housings 111 and 121 (that is, the penetrating direction through the plane of FIG. 3), and is engaged with the pair of rail portions 221 and 222. Each of the sensor 11 and the light irradiation device 12 is configured to be locked in the thickness direction of the housings 111 and 121 .

位置決定部材２０は、図２に示すように、温度センサ１１および光照射装置１２のいずれか一方を保持した状態で、蓋体３に対して対向面７の延在方向に沿って移動可能に取り付けられている。 As shown in FIG. 2, the positioning member 20 is movable along the extending direction of the facing surface 7 with respect to the lid 3 while holding either the temperature sensor 11 or the light irradiation device 12. installed.

詳しくは、位置決定部材２０は、図４に示すように、蓋体３に取り外し可能に固定される固定部２１と、光照射装置１２および温度センサ１１のいずれか一方を取り外し可能に保持する保持部２２と、固定部２１および保持部２２に接続されて保持部２２を対向面７に沿って移動可能な接続部２３とを有している。 Specifically, as shown in FIG. 4, the positioning member 20 includes a fixing portion 21 that is detachably fixed to the lid 3 and a holding portion that detachably holds either the light irradiation device 12 or the temperature sensor 11 . and a connecting portion 23 that is connected to the fixing portion 21 and the holding portion 22 so that the holding portion 22 can move along the facing surface 7 .

固定部２１は、一例として、略矩形の板状を有し、その内部に永久磁石（図示せず）が設けられている。すなわち、固定部２１は、永久磁石を介して磁性体の蓋体３に固定される。 As an example, the fixing portion 21 has a substantially rectangular plate shape, and a permanent magnet (not shown) is provided inside thereof. In other words, the fixed portion 21 is fixed to the magnetic cover 3 via a permanent magnet.

保持部２２は、並列に延びる一対のレール部２２１、２２２を有している。この一対のレール部２２１、２２２は、温度センサ１１および光照射装置１２のいずれか一方の係合部４０が係合されて、温度センサ１１および光照射装置１２のいずれか一方を保持可能に構成されている。 The holding portion 22 has a pair of rail portions 221 and 222 extending in parallel. The pair of rail portions 221 and 222 are configured to be able to hold either the temperature sensor 11 or the light irradiation device 12 by being engaged with the engaging portion 40 of either the temperature sensor 11 or the light irradiation device 12. It is

なお、相互に直交する２つの方向（図３の矢印Ａ方向および矢印Ｂ方向）のいずれか一方から、一対のレール部２２１、２２２を係合部４０に対してスライド移動させることで、各係合部４０を一対のレール部２２１、２２２に係合させ、また、各係合部４０の一対のレール部２２１に対する係合を解除させることができる。 By sliding the pair of rail portions 221 and 222 with respect to the engaging portion 40 from either one of two mutually orthogonal directions (arrow A direction and arrow B direction in FIG. 3), each engaging portion can be moved. The joining portion 40 can be engaged with the pair of rail portions 221 and 222, and the engagement of each engaging portion 40 with the pair of rail portions 221 can be released.

接続部２３は、一例として、略円柱状で、その延在方向の両端部の各々が、ボールジョイントを介して固定部２１および保持部２２に接続されている。この接続部２３により、ある程度の範囲であれば、位置決定部材２０全体を移動させることなく保持部２２を移動させることができる。 As an example, the connecting portion 23 has a substantially cylindrical shape, and both ends in the extending direction thereof are connected to the fixing portion 21 and the holding portion 22 via ball joints. The connecting portion 23 allows the holding portion 22 to be moved within a certain range without moving the entire positioning member 20 .

次に、盤温度検出装置１０を用いた検出領域３０の温度の検出方法について、図５～図７を参照して説明する。 Next, a method of detecting the temperature of the detection area 30 using the board temperature detection device 10 will be described with reference to FIGS. 5 to 7. FIG.

図５に示すように、まず、位置決定部材２０に光照射装置１２を保持させて、光照射装置１２から機器４の対向面７に光を照射して照射領域５０（図６参照）を形成し（ステップＳ１）、形成された照射領域５０と検出領域３０とが重なっているか否かを判定する（ステップＳ２）。照射領域５０と検出領域３０とが重なっているか否かは、例えば、ユーザの目視により、照射領域５０と検出領域３０とが概ね重なっていることが確認できれば、「照射領域５０と検出領域３０とが重なっている」と判定する。 As shown in FIG. 5, first, the light irradiation device 12 is held by the positioning member 20, and light is irradiated from the light irradiation device 12 to the facing surface 7 of the device 4 to form an irradiation region 50 (see FIG. 6). (step S1), and it is determined whether or not the formed irradiation region 50 and the detection region 30 overlap (step S2). Whether or not the irradiation region 50 and the detection region 30 overlap can be determined by, for example, the user's visual observation that the irradiation region 50 and the detection region 30 substantially overlap. are overlapped."

照射領域５０と検出領域３０とが重なっていないと判定された場合、位置決定部材２０全体あるいは保持部２２のみを移動させることで光照射装置１２を移動させて（ステップＳ３）、照射領域５０と検出領域３０とが重なっていると判定されるまで、ステップＳ２およびステップＳ３を繰り返す。位置決定部材２０の移動は、例えば、ユーザにより手動で行われる。 If it is determined that the irradiation region 50 and the detection region 30 do not overlap, the light irradiation device 12 is moved by moving the entire positioning member 20 or only the holding portion 22 (step S3), and the irradiation region 50 and the detection region 30 are moved. Steps S2 and S3 are repeated until it is determined that the detection area 30 overlaps. Movement of the positioning member 20 is performed manually by a user, for example.

照射領域５０と検出領域３０とが重なっていると判定された場合、照射領域５０と検出領域３０とが重なっていると判定された検出位置Ｐ（図７参照）に位置決定部材２０を固定する（ステップＳ４）。そして、位置決定部材２０から光照射装置１２を取り外すと共に、温度センサ１１を位置決定部材２０に保持させる（ステップＳ５）。これにより、温度センサ１１が検出領域３０の温度を検出する（ステップＳ６）。なお、ステップＳ４およびステップＳ６は、例えば、ユーザにより手動で行われる。 When it is determined that the irradiation region 50 and the detection region 30 overlap, the positioning member 20 is fixed at the detection position P (see FIG. 7) at which it is determined that the irradiation region 50 and the detection region 30 overlap. (Step S4). Then, the light irradiation device 12 is removed from the positioning member 20, and the temperature sensor 11 is held by the positioning member 20 (step S5). Thereby, the temperature sensor 11 detects the temperature of the detection area 30 (step S6). Note that steps S4 and S6 are manually performed by the user, for example.

このように、盤温度検出装置１０によれば、検出領域３０の温度を検出可能な温度センサ１１と、機器４に光を照射可能な光照射装置１２と、温度センサ１１および光照射装置１２のいずれか一方を保持した状態で移動可能に取り付けられた位置決定部材２０とを備えている。このような構成により、カメラなどの高価な機器を用いることなく、検出領域３０の温度を検出することが可能な盤温度検出装置１０を実現できる。 As described above, according to the board temperature detection device 10, the temperature sensor 11 capable of detecting the temperature of the detection area 30, the light irradiation device 12 capable of irradiating the device 4 with light, and the temperature sensor 11 and the light irradiation device 12 and a positioning member 20 movably attached while holding one of them. With such a configuration, the board temperature detection device 10 capable of detecting the temperature of the detection area 30 can be realized without using an expensive device such as a camera.

また、盤温度検出装置１０を用いることで、カメラなどの高価な機器を用いることなく盤１の機器４に設けられた検出領域３０の温度を検出することができる。すなわち、製造コストを抑制しつつ、盤１の機器４に設けられた検出領域３０の温度を検出可能な方法を実現できる。 Moreover, by using the board temperature detection device 10, the temperature of the detection area 30 provided in the device 4 of the board 1 can be detected without using an expensive device such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection area 30 provided in the device 4 of the board 1 while suppressing the manufacturing cost.

また、位置決定部材２０が、蓋体３に取り外し可能に固定される固定部２１と、光照射装置１２および温度センサ１１のいずれか一方を取り外し可能に保持する保持部２２と、固定部２１および保持部２２に接続されて保持部２２を機器４の対向面７に沿って移動可能な接続部２３とを有している。このような構成により、位置決定部材２０全体を移動させることなく、照射領域５０を検出領域３０に重ならせることができる。その結果、位置決定部材２０を検出位置Ｐに容易に移動させることができる。 Further, the positioning member 20 includes a fixing portion 21 detachably fixed to the lid 3, a holding portion 22 detachably holding one of the light irradiation device 12 and the temperature sensor 11, the fixing portion 21 and and a connecting portion 23 that is connected to the holding portion 22 so that the holding portion 22 can move along the facing surface 7 of the device 4 . With such a configuration, the irradiation area 50 can be overlapped with the detection area 30 without moving the entire positioning member 20 . As a result, the positioning member 20 can be moved to the detection position P easily.

また、保持部２２が、並列に延びる一対のレール部２２１、２２２を有し、光照射装置１２および温度センサ１１の各々が、一対のレール部２２１、２２２に係合可能な係合部４０を有している。これにより、簡単な構成で、温度センサ１１および光照射装置１２の各々を位置決定部材２０に容易に保持させることができる。 Further, the holding portion 22 has a pair of rail portions 221 and 222 extending in parallel, and each of the light irradiation device 12 and the temperature sensor 11 has an engaging portion 40 that can be engaged with the pair of rail portions 221 and 222. have. Thereby, each of the temperature sensor 11 and the light irradiation device 12 can be easily held by the positioning member 20 with a simple configuration.

なお、位置決定部材２０は、温度センサ１１および光照射装置１２のいずれか一方を保持した状態で、蓋体３に対して機器４の対向面７の延在方向に沿って移動可能に取り付けることができればよく、前記実施形態に限らない。 The positioning member 20 is attached to the lid 3 so as to be movable along the extending direction of the facing surface 7 of the device 4 while holding either one of the temperature sensor 11 and the light irradiation device 12. is possible, and is not limited to the above embodiment.

例えば、固定部２１は、繰り返し使用可能な接着剤あるいは両面テープを用いて、蓋体３に固定してもよい。また、保持部２２は、磁石あるいは雲台を用いて、温度センサ１１および光照射装置１２のいずれか一方を保持するように構成してもよい。また、接続部２３は、保持部２２を移動不可能に固定部２１に接続するように構成してもよい。 For example, the fixed portion 21 may be fixed to the lid 3 using a reusable adhesive or double-sided tape. Moreover, the holding part 22 may be configured to hold either the temperature sensor 11 or the light irradiation device 12 using a magnet or a pan head. Also, the connecting portion 23 may be configured to connect the holding portion 22 to the fixing portion 21 in a non-movable manner.

また、盤温度検出装置１０が、温度センサ１１の検出位置Ｐに対する位置ずれを検出する位置ずれ検出センサと、温度センサ１１の検出位置Ｐに対する位置ずれが検出されたことを表示する表示部とを有する位置ずれ表示装置をさらに備えてもよい。このような構成により、検出領域３０の温度をより正確に検出することができる。 Further, the board temperature detection device 10 includes a positional deviation detection sensor for detecting a positional deviation from the detection position P of the temperature sensor 11 and a display unit for displaying that a positional deviation from the detection position P of the temperature sensor 11 is detected. A misalignment indicator may be further provided. With such a configuration, the temperature of the detection area 30 can be detected more accurately.

以上、図面を参照して本開示における種々の実施形態を詳細に説明したが、最後に、本開示の種々の態様について説明する。なお、以下の説明では、一例として、参照符号も添えて記載する。 Various embodiments of the present disclosure have been described in detail above with reference to the drawings. Finally, various aspects of the present disclosure will be described. In addition, in the following description, reference numerals are also attached as an example.

本開示の第１態様の盤温度検出装置１０は、
開口部５を有する筺体２と、前記開口部５を開閉可能な蓋体３と、前記筺体２の内部に配置された機器４とを備える盤１の前記機器４の前記蓋体３に対向する対向面７に設けられた検出領域３０の温度を検出する盤温度検出装置１０であって、
前記検出領域３０の温度を検出可能な温度センサ１１と、
前記対向面７に光を照射可能な光照射装置１２と、
前記温度センサ１１および前記光照射装置１２のいずれか一方を保持した状態で、前記蓋体３に対して前記対向面７の延在方向に沿って移動可能に取り付けられた位置決定部材２０と
を備え、
前記光照射装置１２から前記対向面７に照射された光の照射領域５０と前記検出領域３０とが重なる検出位置Ｐに配置した前記位置決定部材２０に前記温度センサ１１を保持させて、前記検出領域３０の温度を検出する。 The board temperature detection device 10 of the first aspect of the present disclosure is
A board 1 comprising a housing 2 having an opening 5, a lid 3 capable of opening and closing the opening 5, and a device 4 arranged inside the housing 2, facing the lid 3 of the device 4. A board temperature detection device 10 that detects the temperature of a detection area 30 provided on the facing surface 7,
a temperature sensor 11 capable of detecting the temperature of the detection area 30;
a light irradiation device 12 capable of irradiating the facing surface 7 with light;
a positioning member 20 attached movably along the extending direction of the facing surface 7 with respect to the lid 3 while holding either one of the temperature sensor 11 and the light irradiation device 12; prepared,
The temperature sensor 11 is held by the positioning member 20 arranged at the detection position P where the irradiation region 50 of the light irradiated from the light irradiation device 12 to the facing surface 7 overlaps the detection region 30, and the detection is performed. The temperature of area 30 is detected.

第１態様の盤温度検出装置１０によれば、カメラなどの高価な機器を用いることなく、検出領域３０の温度を検出することが可能な盤温度検出装置１０を実現できる。 According to the disc temperature detection device 10 of the first aspect, the disc temperature detection device 10 capable of detecting the temperature of the detection area 30 can be realized without using an expensive device such as a camera.

本開示の第２態様の盤温度検出装置１０は、
前記位置決定部材２０が、
前記蓋体３に取り外し可能に固定される固定部２１と、前記光照射装置１２および前記温度センサ１１のいずれか一方を取り外し可能に保持する保持部２２と、前記固定部２１および前記保持部２２に接続されて前記保持部２２を前記対向面７の延在方向に沿って移動可能な接続部２３とを有する。 The board temperature detection device 10 of the second aspect of the present disclosure is
The positioning member 20 is
A fixing portion 21 detachably fixed to the lid 3, a holding portion 22 detachably holding one of the light irradiation device 12 and the temperature sensor 11, the fixing portion 21 and the holding portion 22. and a connecting portion 23 that is connected to the holding portion 22 and that allows the holding portion 22 to move along the extending direction of the facing surface 7 .

第２態様の盤温度検出装置１０によれば、位置決定部材２０全体を移動させることなく、照射領域５０を検出領域３０に重ならせることができる。その結果、位置決定部材２０を検出位置Ｐに容易に移動させることができる。 According to the board temperature detection device 10 of the second aspect, the irradiation area 50 can be overlapped with the detection area 30 without moving the positioning member 20 as a whole. As a result, the positioning member 20 can be moved to the detection position P easily.

本開示の第３態様の盤温度検出装置１０は、
前記保持部２２が、並列に延びる一対のレール部２２１、２２２を有し、
前記光照射装置１２および前記温度センサ１１の各々が、前記一対のレール部２２１、２２２に係合可能な係合部４０を有し、
前記係合部４０が前記一対のレール部２２１、２２２に係合することにより、前記光照射装置１２および前記温度センサ１１の各々が、前記保持部２２に保持される。 The board temperature detection device 10 of the third aspect of the present disclosure is
The holding portion 22 has a pair of rail portions 221 and 222 extending in parallel,
Each of the light irradiation device 12 and the temperature sensor 11 has an engaging portion 40 that can be engaged with the pair of rail portions 221 and 222,
Each of the light irradiation device 12 and the temperature sensor 11 is held by the holding portion 22 by engaging the engaging portion 40 with the pair of rail portions 221 and 222 .

第３態様の盤温度検出装置１０によれば、簡単な構成で、温度センサ１１および光照射装置１２の各々を位置決定部材２０に容易に保持させることができる。 According to the board temperature detection device 10 of the third aspect, each of the temperature sensor 11 and the light irradiation device 12 can be easily held by the positioning member 20 with a simple configuration.

本開示の第４態様の盤温度検出装置１０は、
前記温度センサ１１の前記検出位置Ｐに対する位置ずれを検出する位置ずれ検出センサと、前記温度センサ１１の前記検出位置Ｐに対する位置ずれが検出されたことを表示する表示部とを有する位置ずれ表示装置をさらに備える。 The board temperature detection device 10 of the fourth aspect of the present disclosure is
A positional deviation display device having a positional deviation detection sensor for detecting a positional deviation of the temperature sensor 11 with respect to the detection position P, and a display section displaying that a positional deviation of the temperature sensor 11 with respect to the detection position P is detected. further provide.

第４態様の盤温度検出装置１０によれば、検出領域３０の温度をより正確に検出することができる。 According to the board temperature detection device 10 of the fourth aspect, the temperature of the detection area 30 can be detected more accurately.

本開示の第５態様の方法は、
開口部５を有する筺体２と、前記開口部５を開閉可能な蓋体３と、前記筺体２の内部に配置された機器４とを備える盤１の前記機器４の前記蓋体３に対向する対向面７に設けられた検出領域３０の温度を検出する方法であって、
前記蓋体３に対して前記対向面７の延在方向に沿って移動可能に取り付けられた位置決定部材２０に、前記対向面７に光を照射可能な光照射装置１２を保持させ、
前記光照射装置１２から前記対向面７に照射された光の照射領域５０と前記検出領域３０とが重なる検出位置Ｐに、前記位置決定部材２０を移動させて固定し、
前記位置決定部材２０から前記光照射装置１２を取り外すと共に、前記検出領域３０の温度を検出可能な温度センサ１１を前記位置決定部材２０に保持させて、
前記温度センサ１１で前記検出領域３０の温度を検出する。 The method of the fifth aspect of the present disclosure comprises:
A board 1 comprising a housing 2 having an opening 5, a lid 3 capable of opening and closing the opening 5, and a device 4 arranged inside the housing 2, facing the lid 3 of the device 4. A method for detecting the temperature of a detection area 30 provided on the facing surface 7, comprising:
A positioning member 20 attached movably along the extending direction of the facing surface 7 with respect to the lid 3 holds a light irradiation device 12 capable of irradiating the facing surface 7 with light,
moving and fixing the positioning member 20 to a detection position P where the irradiation region 50 of the light irradiated from the light irradiation device 12 to the facing surface 7 and the detection region 30 overlap;
The light irradiation device 12 is removed from the positioning member 20, and the temperature sensor 11 capable of detecting the temperature of the detection region 30 is held by the positioning member 20,
The temperature sensor 11 detects the temperature of the detection area 30 .

第５態様の方法によれば、カメラなどの高価な機器を用いることなく盤１の機器４に設けられた検出領域３０の温度を検出することができる。すなわち、製造コストを抑制しつつ、盤１の機器４に設けられた検出領域３０の温度を検出可能な方法を実現できる。 According to the method of the fifth aspect, the temperature of the detection area 30 provided in the device 4 of the board 1 can be detected without using expensive equipment such as a camera. That is, it is possible to realize a method capable of detecting the temperature of the detection area 30 provided in the device 4 of the board 1 while suppressing the manufacturing cost.

なお、前記様々な実施形態または変形例のうちの任意の実施形態または変形例を適宜組み合わせることにより、それぞれの有する効果を奏するようにすることができる。また、実施形態同士の組み合わせまたは実施例同士の組み合わせまたは実施形態と実施例との組み合わせが可能であると共に、異なる実施形態または実施例の中の特徴同士の組み合わせも可能である。 By appropriately combining any of the various embodiments or modifications described above, the respective effects can be obtained. In addition, combinations of embodiments, combinations of examples, or combinations of embodiments and examples are possible, as well as combinations of features in different embodiments or examples.

本開示の盤温度検出装置は、例えば、配電盤に適用できる。 The board temperature detection device of the present disclosure can be applied to, for example, a switchboard.

本開示の方法は、例えば、配電盤の温度検出に適用できる。 The method of the present disclosure can be applied, for example, to temperature detection of switchboards.

１ 盤
２ 筺体
３ 蓋体
４ 機器
５ 開口部
６ 隙間
７ 対向面
１０ 盤温度検出装置
１１ 温度センサ
１１１ ハウジング
１２ 光照射装置
１２１ ハウジング
２０ 位置決定部材
２１ 固定部
２２ 保持部
２２１、２２２ レール部
２３ 接続部
３０ 検出領域
４０ 係合部
５０ 照射領域
Ｐ 検出領域 1 board 2 housing 3 lid 4 device 5 opening 6 gap 7 facing surface 10 board temperature detection device 11 temperature sensor 111 housing 12 light irradiation device 121 housing 20 positioning member 21 fixing portion 22 holding portions 221, 222 rail portion 23 connection Part 30 Detection area 40 Engagement part 50 Irradiation area P Detection area

Claims (5)

開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する盤温度検出装置であって、
前記検出領域の温度を検出可能な温度センサと、
前記対向面に光を照射可能な光照射装置と、
前記温度センサおよび前記光照射装置のいずれか一方を保持した状態で、前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材と
を備え、
前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に配置した前記位置決定部材に前記温度センサを保持させて、前記検出領域の温度を検出すると共に、
前記位置決定部材が、
前記蓋体に取り外し可能に固定される固定部と、前記光照射装置および前記温度センサのいずれか一方を取り外し可能に保持する保持部と、前記固定部および前記保持部に接続されて前記保持部を前記対向面の延在方向に沿って移動可能な接続部とを有する、盤温度検出装置。 A detection area provided on a surface facing the lid of the device of a board comprising a housing having an opening, a lid capable of opening and closing the opening, and a device placed inside the housing. A board temperature detection device for detecting temperature,
a temperature sensor capable of detecting the temperature of the detection region;
a light irradiation device capable of irradiating the facing surface with light;
a positioning member attached movably along the extending direction of the facing surface with respect to the lid while holding either one of the temperature sensor and the light irradiation device;
Detecting the temperature of the detection area by holding the temperature sensor on the positioning member arranged at the detection position where the irradiation area of the light emitted from the light irradiation device to the facing surface overlaps the detection area, and ,
The positioning member is
a fixing portion detachably fixed to the lid; a holding portion detachably holding one of the light irradiation device and the temperature sensor; and the holding portion connected to the fixing portion and the holding portion. and a connecting portion movable along the extending direction of the facing surface . 前記保持部が、並列に延びる一対のレール部を有し、
前記光照射装置および前記温度センサの各々が、前記一対のレール部に係合可能な係合部を有し、
前記係合部が前記一対のレール部に係合することにより、前記光照射装置および前記温度センサの各々が、前記保持部に保持される、請求項１の盤温度検出装置。 The holding portion has a pair of rail portions extending in parallel,
each of the light irradiation device and the temperature sensor has an engaging portion that can be engaged with the pair of rail portions;
2. The board temperature detecting device according to claim 1 , wherein each of said light irradiation device and said temperature sensor is held by said holding portion by engaging said engaging portion with said pair of rail portions. 前記光照射装置および前記温度センサの各々が、四角形の頂点にそれぞれ位置する４つの前記係合部を有し、隣接する前記係合部の間に前記一対のレール部が位置可能に構成されている、請求項２の盤温度検出装置。Each of the light irradiation device and the temperature sensor has four engaging portions positioned at vertexes of a quadrangle, and the pair of rail portions is configured to be positionable between the adjacent engaging portions. 3. The board temperature detection device of claim 2, wherein 前記温度センサの前記検出位置に対する位置ずれを検出する位置ずれ検出センサと、前記温度センサの前記検出位置に対する位置ずれが検出されたことを表示する表示部とを有する位置ずれ表示装置をさらに備える、請求項１から３のいずれか１つの盤温度検出装置。 Further comprising a positional deviation display device having a positional deviation detection sensor that detects a positional deviation of the temperature sensor with respect to the detection position, and a display unit that displays that a positional deviation of the temperature sensor with respect to the detection position is detected, The board temperature detection device according to any one of claims 1 to 3. 開口部を有する筺体と、前記開口部を開閉可能な蓋体と、前記筺体の内部に配置された機器とを備える盤の前記機器の前記蓋体に対向する対向面に設けられた検出領域の温度を検出する方法であって、
前記蓋体に対して前記対向面の延在方向に沿って移動可能に取り付けられた位置決定部材に、前記対向面に光を照射可能な光照射装置を保持させ、
前記光照射装置から前記対向面に照射された光の照射領域と前記検出領域とが重なる検出位置に、前記位置決定部材を移動させて固定し、
前記位置決定部材から前記光照射装置を取り外すと共に、前記検出領域の温度を検出可能な温度センサを前記位置決定部材に保持させて、
前記温度センサで前記検出領域の温度を検出すると共に、
前記位置決定部材が、
前記蓋体に取り外し可能に固定される固定部と、前記光照射装置および前記温度センサのいずれか一方を取り外し可能に保持する保持部と、前記固定部および前記保持部に接続されて前記保持部を前記対向面の延在方向に沿って移動可能な接続部とを有する、方法。 A detection area provided on a surface facing the lid of the device of a board comprising a housing having an opening, a lid capable of opening and closing the opening, and a device placed inside the housing. A method of detecting temperature, comprising:
holding a light irradiation device capable of irradiating light onto the facing surface in a positioning member attached movably along the extending direction of the facing surface with respect to the lid;
moving and fixing the positioning member to a detection position where the irradiation area of the light irradiated from the light irradiation device to the facing surface overlaps the detection area;
Detaching the light irradiation device from the positioning member and holding a temperature sensor capable of detecting the temperature of the detection region on the positioning member,
Detecting the temperature of the detection area with the temperature sensor ,
The positioning member is
a fixing portion detachably fixed to the lid; a holding portion detachably holding one of the light irradiation device and the temperature sensor; and the holding portion connected to the fixing portion and the holding portion. and a connecting portion movable along the extending direction of the facing surface .
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