JP7134763B2 - モジュール及びその製造方法 - Google Patents

モジュール及びその製造方法 Download PDF

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Publication number
JP7134763B2
JP7134763B2 JP2018137580A JP2018137580A JP7134763B2 JP 7134763 B2 JP7134763 B2 JP 7134763B2 JP 2018137580 A JP2018137580 A JP 2018137580A JP 2018137580 A JP2018137580 A JP 2018137580A JP 7134763 B2 JP7134763 B2 JP 7134763B2
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JP
Japan
Prior art keywords
metal pattern
electrode
electronic device
wiring board
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018137580A
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English (en)
Japanese (ja)
Other versions
JP2020017561A (ja
JP2020017561A5 (enExample
Inventor
智史 野津
悠 青木
幸司 都築
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2018137580A priority Critical patent/JP7134763B2/ja
Priority to US16/511,405 priority patent/US10958860B2/en
Publication of JP2020017561A publication Critical patent/JP2020017561A/ja
Publication of JP2020017561A5 publication Critical patent/JP2020017561A5/ja
Application granted granted Critical
Publication of JP7134763B2 publication Critical patent/JP7134763B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2018137580A 2018-07-23 2018-07-23 モジュール及びその製造方法 Active JP7134763B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018137580A JP7134763B2 (ja) 2018-07-23 2018-07-23 モジュール及びその製造方法
US16/511,405 US10958860B2 (en) 2018-07-23 2019-07-15 Module and method of manufacturing module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018137580A JP7134763B2 (ja) 2018-07-23 2018-07-23 モジュール及びその製造方法

Publications (3)

Publication Number Publication Date
JP2020017561A JP2020017561A (ja) 2020-01-30
JP2020017561A5 JP2020017561A5 (enExample) 2021-09-09
JP7134763B2 true JP7134763B2 (ja) 2022-09-12

Family

ID=69163324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018137580A Active JP7134763B2 (ja) 2018-07-23 2018-07-23 モジュール及びその製造方法

Country Status (2)

Country Link
US (1) US10958860B2 (enExample)
JP (1) JP7134763B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器
JP7508789B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508792B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508793B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508794B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508790B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508791B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7540160B2 (ja) * 2020-02-06 2024-08-27 株式会社三洋物産 遊技機
JP7508795B2 (ja) * 2020-02-06 2024-07-02 株式会社三洋物産 遊技機
JP7540157B2 (ja) * 2020-02-06 2024-08-27 株式会社三洋物産 遊技機
JP7540159B2 (ja) * 2020-02-06 2024-08-27 株式会社三洋物産 遊技機
JP7540158B2 (ja) * 2020-02-06 2024-08-27 株式会社三洋物産 遊技機
JP7458825B2 (ja) * 2020-02-28 2024-04-01 キヤノン株式会社 パッケージおよび半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289747A (ja) 2001-03-26 2002-10-04 Ngk Spark Plug Co Ltd セラミック基板、複合基板、及びセラミック基板の製造方法
JP2008159742A (ja) 2006-12-22 2008-07-10 Fujitsu Component Ltd 半導体素子の実装構造
US20090057860A1 (en) 2007-08-27 2009-03-05 Samsung Electro-Mechanics Co., Ltd. Semiconductor memory package
JP2012221974A (ja) 2011-04-04 2012-11-12 Stanley Electric Co Ltd 半導体モジュール及びその製造方法
JP2017103517A (ja) 2015-11-30 2017-06-08 株式会社ニコン 電子ユニット、撮像装置及びフレキシブル基板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0870017A (ja) * 1994-08-30 1996-03-12 Matsushita Electric Works Ltd 両面基板及びその両面基板を用いた電極接続方法
JP2006303096A (ja) 2005-04-19 2006-11-02 Fuji Photo Film Co Ltd 半導体装置実装基板、半導体装置の実装方法、電子機器、カメラモジュール及び半導体装置実装基板の形成方法
JP5875313B2 (ja) * 2011-09-30 2016-03-02 キヤノン株式会社 電子部品および電子機器ならびにこれらの製造方法。
EP2814063B1 (en) 2012-02-07 2019-12-04 Nikon Corporation Imaging unit and imaging apparatus
JP5885690B2 (ja) 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP6296687B2 (ja) 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP2013243340A (ja) 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
JP2015012211A (ja) 2013-07-01 2015-01-19 株式会社ニコン 撮像ユニット及び撮像装置
JP6281395B2 (ja) * 2013-11-26 2018-02-21 ソニー株式会社 撮像素子
KR20160102556A (ko) 2013-12-27 2016-08-30 가부시키가이샤 니콘 촬상 유닛 및 촬상 장치
JP6423685B2 (ja) 2014-10-23 2018-11-14 キヤノン株式会社 電子部品、モジュール及びカメラ
US9978675B2 (en) 2015-11-20 2018-05-22 Canon Kabushiki Kaisha Package, electronic component, and electronic apparatus
JP6648525B2 (ja) 2015-12-28 2020-02-14 株式会社ニコン 基板、撮像ユニットおよび撮像装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289747A (ja) 2001-03-26 2002-10-04 Ngk Spark Plug Co Ltd セラミック基板、複合基板、及びセラミック基板の製造方法
JP2008159742A (ja) 2006-12-22 2008-07-10 Fujitsu Component Ltd 半導体素子の実装構造
US20090057860A1 (en) 2007-08-27 2009-03-05 Samsung Electro-Mechanics Co., Ltd. Semiconductor memory package
JP2012221974A (ja) 2011-04-04 2012-11-12 Stanley Electric Co Ltd 半導体モジュール及びその製造方法
JP2017103517A (ja) 2015-11-30 2017-06-08 株式会社ニコン 電子ユニット、撮像装置及びフレキシブル基板

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Publication number Publication date
US10958860B2 (en) 2021-03-23
JP2020017561A (ja) 2020-01-30
US20200029039A1 (en) 2020-01-23

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