JP7132454B1 - SiC基板及びSiCエピタキシャルウェハ - Google Patents
SiC基板及びSiCエピタキシャルウェハ Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 174
- 230000002093 peripheral effect Effects 0.000 claims abstract description 35
- 238000012545 processing Methods 0.000 abstract description 41
- 238000000034 method Methods 0.000 abstract description 33
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 195
- 229910010271 silicon carbide Inorganic materials 0.000 description 194
- 239000010410 layer Substances 0.000 description 27
- 238000004088 simulation Methods 0.000 description 25
- 239000013078 crystal Substances 0.000 description 20
- 239000002344 surface layer Substances 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000005092 sublimation method Methods 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000001069 Raman spectroscopy Methods 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000001237 Raman spectrum Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/025—Epitaxial-layer growth characterised by the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/20—Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
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Abstract
Description
ここで式(1)は、F=K×exp(a+b×ln(σ)+c×ln(R)+d×ln(ts))・・・(1)で表される。
式(1)において、K、a、b、c、dは、K=1.3373、a=-11.67123、b=1.4030953、c=1.8050972、d=-1.585898を満たす定数であり、σは、σ=60(MPa)-2/3×S(MPa)を満たし、Sは前記第1外周端の円周方向と同じ方向である<1-100>方向に係る内部応力であり、引張応力を正、圧縮応力を負としたものであり、tsは前記厚み(mm)であり、Rは前記直径(mm)である。
F=K×exp(a+b×ln(σ)+c×ln(R)+d×ln(ts))・・・(1)
式(1)において、K、a、b、c、dは、定数である。K=1.3373、a=-11.67123、b=1.4030953、c=1.8050972、d=-1.585898を満たす。σは、σ=60(MPa)-2/3×S(MPa)を満たす。Sは、第1外周端1における応力である。tsはSiC基板10の厚み(mm)であり、RはSiC基板10の直径(mm)である。
SiC基板の表面に、処理層を積層した際の反りをシミュレーションにより求めた。シミュレーションは、有限要素法シミュレータANSYSを用いて行った。有限要素法シミュレータANSYSを用いたシミュレーションが、実際に作製した物の結果と一致することは別途確認した。
実施例2は、SiC基板の直径を100mmとした点が実施例1と異なる。その他の条件は、実施例1と同じとして、シミュレーションでSiC基板の反り量を求めた。
実施例3は、SiC基板の直径を150mmとした点が実施例1と異なる。その他の条件は、実施例1と同じとして、シミュレーションでSiC基板の反り量を求めた。
実施例4は、SiC基板の直径を200mmとした点が実施例1と異なる。その他の条件は、実施例1と同じとして、シミュレーションでSiC基板の反り量を求めた。
実施例5は、SiC基板の直径を250mmとした点が実施例1と異なる。その他の条件は、実施例1と同じとして、シミュレーションでSiC基板の反り量を求めた。
実施例6は、SiC基板の直径を300mmとした点が実施例1と異なる。その他の条件は、実施例1と同じとして、シミュレーションでSiC基板の反り量を求めた。
Claims (11)
- 厚みと、直径と、中心から[11-20]方向で外周端から10mm内側の第1外周端に係る応力と、から求められる以下の式(1)で表される反りファクターFが、300μm以下である、SiC基板。
F=K×exp(a+b×ln(σ)+c×ln(R)+d×ln(ts))・・・(1)
式(1)において、
K、a、b、c、dは、K=1.3373、a=-11.67123、b=1.4030953、c=1.8050972、d=-1.585898を満たす定数であり、
σは、σ=60(MPa)-2/3×S(MPa)を満たし、
Sは前記第1外周端の円周方向と同じ方向である<1-100>方向に係る内部応力であり、引張応力を正、圧縮応力を負としたものであり、tsは前記厚み(mm)であり、Rは前記直径(mm)である。 - 前記反りファクターFが、200μm以下である、請求項1に記載のSiC基板。
- 前記反りファクターFが、100μm以下である、請求項1に記載のSiC基板。
- 前記反りファクターFが、50μm以下である、請求項1に記載のSiC基板。
- 前記直径が145mm以上で、前記厚みが300μm以下である、請求項1に記載のSiC基板。
- 前記直径が195mm以上で、前記厚みが600μm以下である、請求項1に記載のSiC基板。
- 前記厚みが400μm以下である、請求項6に記載のSiC基板。
- 前記直径が210mm以上で、前記厚みが600μm以下である、請求項1に記載のSiC基板。
- 前記直径が290mm以上で、前記厚みが800μm以下である、請求項1に記載のSiC基板。
- 前記厚みが600μm以下である、請求項9に記載のSiC基板。
- 請求項1~10のいずれか一項に記載のSiC基板と、前記SiC基板の一面に積層されたSiCエピタキシャル層とを有する、SiCエピタキシャルウェハ。
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JP2022089095A JP7132454B1 (ja) | 2022-05-31 | 2022-05-31 | SiC基板及びSiCエピタキシャルウェハ |
JP2022134546A JP7216244B1 (ja) | 2022-05-31 | 2022-08-25 | 半導体デバイスの製造方法 |
US18/114,632 US20230387214A1 (en) | 2022-05-31 | 2023-02-27 | SiC SUBSTRATE AND SiC EPITAXIAL WAFER |
CN202310173851.5A CN117144468A (zh) | 2022-05-31 | 2023-02-28 | SiC基板以及SiC外延晶片 |
EP23175775.8A EP4286568A1 (en) | 2022-05-31 | 2023-05-26 | Sic substrate and sic epitaxial wafer |
KR1020230068128A KR102606186B1 (ko) | 2022-05-31 | 2023-05-26 | SiC 기판 및 SiC 에피택셜 웨이퍼 |
TW112119937A TWI831700B (zh) | 2022-05-31 | 2023-05-29 | 碳化矽基板及碳化矽磊晶晶圓 |
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US11866846B2 (en) * | 2022-05-31 | 2024-01-09 | Resonac Corporation | SiC substrate and SiC epitaxial wafer |
Citations (4)
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JP2007290880A (ja) | 2006-04-21 | 2007-11-08 | Nippon Steel Corp | 炭化珪素単結晶インゴット及びその製造方法 |
JP2017069334A (ja) | 2015-09-29 | 2017-04-06 | 新日鐵住金株式会社 | 炭化珪素単結晶基板の製造方法 |
US20210198804A1 (en) | 2019-12-27 | 2021-07-01 | Cree, Inc. | Large diameter silicon carbide wafers |
JP2021102533A (ja) | 2019-12-25 | 2021-07-15 | 昭和電工株式会社 | SiC単結晶の製造方法 |
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EP2196566A4 (en) * | 2007-09-12 | 2011-11-30 | Showa Denko Kk | EPITACTIC SIC-INCREDIBLE SUBSTRATE AND METHOD FOR PRODUCING EPICTIC SIC-INCREDIBLE SUBSTRATE |
JP5304712B2 (ja) * | 2010-04-07 | 2013-10-02 | 新日鐵住金株式会社 | 炭化珪素単結晶ウェハ |
JP5944873B2 (ja) * | 2013-09-20 | 2016-07-05 | 新日鉄住金マテリアルズ株式会社 | 炭化珪素単結晶ウェハの内部応力評価方法、及び炭化珪素単結晶ウェハの反りの予測方法 |
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JP6981505B2 (ja) * | 2015-10-15 | 2021-12-15 | 住友電気工業株式会社 | 炭化珪素エピタキシャル基板の製造方法 |
CN111433394B (zh) | 2017-12-08 | 2022-06-21 | 住友电气工业株式会社 | 碳化硅衬底 |
JP7422479B2 (ja) * | 2017-12-22 | 2024-01-26 | 株式会社レゾナック | SiCインゴット及びSiCインゴットの製造方法 |
US10879359B2 (en) * | 2018-03-02 | 2020-12-29 | National Institute Of Advanced Industrial Science And Technology | Silicon carbide epitaxial wafer having a thick silicon carbide layer with small wrapage and manufacturing method thereof |
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JP2007290880A (ja) | 2006-04-21 | 2007-11-08 | Nippon Steel Corp | 炭化珪素単結晶インゴット及びその製造方法 |
JP2017069334A (ja) | 2015-09-29 | 2017-04-06 | 新日鐵住金株式会社 | 炭化珪素単結晶基板の製造方法 |
JP2021102533A (ja) | 2019-12-25 | 2021-07-15 | 昭和電工株式会社 | SiC単結晶の製造方法 |
US20210198804A1 (en) | 2019-12-27 | 2021-07-01 | Cree, Inc. | Large diameter silicon carbide wafers |
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US11866846B2 (en) * | 2022-05-31 | 2024-01-09 | Resonac Corporation | SiC substrate and SiC epitaxial wafer |
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