JP7130564B2 - flux and solder paste - Google Patents

Description

The present invention relates to a flux used for soldering and a solder paste using this flux.

In general, flux used for soldering chemically removes metal oxides present on the metal surface of the solder and the joint object to be soldered, enabling the movement of metal elements at the boundary between the two. have the effect of Therefore, by performing soldering using flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be joined, resulting in a strong joint.

Solder paste is a composite material obtained by mixing solder alloy powder and flux. In soldering using solder paste, the solder paste is printed on the soldering parts such as the electrodes of the board, the parts are mounted on the soldering parts with the solder paste printed, and the board is mounted in a heating furnace called a reflow furnace. Soldering is performed by heating to melt the solder.

Patent Document 1 describes a hydroiodide of an organic amine, a 6-membered aromatic or alicyclic monocarboxylic acid, a 6-membered aromatic or alicyclic dicarboxylic acid, and an imidazole compound. Alternatively, a flux and a solder paste that are suitable for parts having a relatively large bonding area, such as heat sink parts, are described by combining them with carboxylates.

JP 2014-117737 A

Depending on the heat history during soldering, the finish after mounting, for example, the wetting and spreading property may be completely different. Therefore, there is a demand for a flux that enables stable soldering with a good finish regardless of the heat history.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a flux and a solder paste using the flux that are excellent in solder wetting and spreading.

It was found that the wettability of solder to joint parts can be improved by including an isocyanuric acid (carboxyalkyl ) adduct in the flux.

Therefore, the present invention provides any of tris(2-carboxyethyl) isocyanurate, tris(1-carboxymethyl) isocyanurate, tris(3-carboxypropyl) isocyanurate, bis(2-carboxyethyl) isocyanurate, or 0.5 wt% or more and 20.0 wt% or less of a combination of two or more kinds, further containing a resin and a solvent, the resin consisting of rosin or rosin and acrylic resin, and 5.0 wt% or more and 50.0 wt% or less of rosin , containing 0 wt% or more and 30.0 wt% or less of an acrylic resin, containing 28.5 wt% or more and 39.0 wt% or less of a solvent, further containing 0 wt% or more and 10.0 wt% or less of an amine , trans-2,3-dibromo-1, A flux containing 1.0 wt % or more and 5.0 wt % or less of 4-butenediol or triallyl isocyanurate hexabromide .

The present invention also provides any of tris(2-carboxyethyl) isocyanurate, tris(1-carboxymethyl) isocyanurate, tris(3-carboxypropyl) isocyanurate, bis(2-carboxyethyl) isocyanurate, or 0.5 wt% or more and 20.0 wt% or less of a combination of two or more kinds, further containing a resin and a solvent, the resin consisting of rosin or rosin and acrylic resin, and 5.0 wt% or more and 50.0 wt% or less of rosin , contains 0 wt% or more and 30.0 wt% or less of acrylic resin, the ratio of resin and solvent (resin/solvent) is 0.9 or more and 1.58 or less, and more than 0 wt% of amine and 10.0 wt% or less , trans- Flux containing 2,3-dibromo-1,4-butenediol or triallyl isocyanurate hexabromide in an amount of 1.0 wt % or more and 5.0 wt % or less .

Furthermore, the present invention provides any of tris(2-carboxyethyl) isocyanurate, tris(1-carboxymethyl) isocyanurate, tris(3-carboxypropyl) isocyanurate, bis(2-carboxyethyl) isocyanurate, or 0.5 wt% or more and 20.0 wt% or less of a combination of two or more kinds, further containing a resin and a solvent, the resin consisting of rosin or rosin and acrylic resin, and 5.0 wt% or more and 50.0 wt% or less of rosin , 0 wt% or more and 30.0 wt% or less of an acrylic resin, more than 0 wt% or more and 10.0 wt% or less of an amine , trans-2,3-dibromo-1,4-butenediol or triallyl isocyanurate hexabromide 1. A flux containing 0 wt % or more and 5.0 wt % or less.

The flux of the present invention preferably contains 5.0 wt % or more and 30.0 wt % or less of acrylic resin, and the ratio of acrylic resin to rosin is preferably 0.1 or more and 9.0 or less. Furthermore, other organic acids other than tris(2-carboxyethyl)isocyanurate, tris(1-carboxymethyl)isocyanurate, tris(3-carboxypropyl)isocyanurate, and bis(2-carboxyethyl)isocyanurate are 0 wt% or more It preferably contains 10.0 wt % or less, 0 wt % or more and 5.0 wt % or less of an amine hydrohalide, and 0 wt % or more and 10.0 wt % or less of a thixotropic agent.

Further, the present invention is a solder paste containing the above flux and metal powder.

Since the flux of the present invention contains an isocyanuric acid (carboxyalkyl ) adduct, this flux and the solder paste using this flux can be used for soldering in a reflow oven to prevent solder from getting wet. The oxides that are the cause are removed, and the wetting and spreading properties of the solder are improved.

<An example of flux according to the present embodiment>
The flux of this embodiment contains an isocyanuric acid (carboxyalkyl ) adduct. The flux of this embodiment further contains a resin and a solvent.

Isocyanuric acid (carboxyalkyl ) adducts are six-membered (6-membered) heterocyclic compounds, which are expected in soldering compared to organic acids such as straight-chain carboxylic acids and branched carboxylic acids. It has heat resistance in the temperature range and functions as an activator during soldering.

By performing soldering in a reflow furnace using the flux and solder balls of the present embodiment, or the core balls in which the core of metal or the like is coated with solder, oxides that cause non-wetting of the solder are removed, and the solder Wetting and spreadability of is improved. Solder wetting and spreading properties are also improved by performing soldering in a reflow furnace using the solder paste containing the flux and metal powder of the present embodiment.

Examples of isocyanuric acid (carboxyalkyl ) adducts include isocyanuric acid mono (carboxyalkyl ) adducts, isocyanuric acid bis (carboxyalkyl ) adducts, isocyanuric acid tris (carboxyalkyl ) adducts, and the like. mentioned.

Tris (carboxyalkyl ) isocyanuric acid adducts include tris(2-carboxyethyl)isocyanurate, tris( 1 -carboxymethyl)isocyanurate, tris( 3 -carboxypropyl)isocyanurate and the like. Bis (carboxyalkyl ) isocyanurate adducts include bis(2-carboxyethyl) isocyanurate.

The structural formula of tris(2-carboxyethyl)isocyanurate is shown in formula (1) below. The CAS registry number for tris(2-carboxyethyl)isocyanurate is 2904-41-8. The structural formula of tris( 1 -carboxymethyl)isocyanurate is shown in formula (2) below. The CAS registry number for tris( 1 -carboxymethyl)isocyanurate is 1968-52-1. The structural formula of tris( 3 -carboxypropyl)isocyanurate is shown in formula (3) below. The CAS registry number for tris( 3 -carboxypropyl)isocyanurate is 319017-31-7. The structural formula of bis(2-carboxyethyl)isocyanurate is shown in formula (4) below. The CAS registry number for bis(2-carboxyethyl)isocyanurate is 2904-40-7.

An isocyanuric acid (carboxyalkyl ) adduct is an essential component in the flux of the present embodiment for improving solder wettability, and one or more of these can be used. The content of the isocyanuric acid (carboxyalkyl ) adduct is preferably 0.5 wt % or more and 20.0 wt % or less.

The flux of this embodiment contains rosin as a resin. Rosins include, for example, raw rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw rosins. Examples of the derivative include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid-modified rosin, phenol-modified rosin and α,β unsaturated carboxylic acid-modified products (acrylated rosin, maleated rosin, fumarated rosin). rosin, etc.), purified products, hydrides and disproportionated products of the polymerized rosin, and purified products, hydrides and disproportionated products of the α,β unsaturated carboxylic acid-modified products.

Rosin is an essential component in the flux of the present embodiment that improves solder wetting and spreading, and one or more of these can be used. The rosin content is preferably 5.0 wt % or more and 50.0 wt % or less.

Moreover, acrylic resin is included as resin other than rosin. Acrylic resins are made from monomers of acrylic acid, acrylic acid ester (a reaction product of acrylic acid and alcohol), methacrylic acid, and methacrylic acid ester (a reaction product of methacrylic acid and alcohol). Examples include a coalescence, a polymer of acrylic acid and an acrylic acid ester, and the like. In addition, a polymer of methacrylic acid, a polymer of methacrylic acid ester, a polymer of methacrylic acid and methacrylic acid ester, and the like are included. Furthermore, polymers of acrylic acid and methacrylic acid, polymers of acrylic acid and methacrylic acid esters, polymers of methacrylic acid and acrylic acid esters, polymers of acrylic acid esters and methacrylic acid esters, acrylic acid, methacrylic acid and acrylic acid Polymers of esters, polymers of acrylic acid, methacrylic acid and methacrylic acid esters, polymers of acrylic acid, methacrylic acid, acrylic acid esters and methacrylic acid esters, polymers of acrylic acid, acrylic acid esters and methacrylic acid esters, methacrylic acid Polymers of acids, acrylic acid esters, and methacrylic acid esters are included. Examples of acrylic esters include butyl acrylate, and examples of acrylic resins using butyl acrylate as a monomer include polymers of butyl acrylate, acrylic esters other than butyl acrylate, and butyl acrylate. Examples include polymers, polymers of acrylic acid and butyl acrylate, and polymers of acrylic acid, acrylates other than butyl acrylate and butyl acrylate. Examples of methacrylic acid esters include butyl methacrylate. Examples of acrylic resins using butyl methacrylate as a monomer include polymers of butyl methacrylate, methacrylic acid esters other than butyl methacrylate, and butyl methacrylate. Polymers of esters, polymers of methacrylic acid and butyl methacrylate, and polymers of methacrylic acid and methacrylic acid esters other than butyl methacrylate and butyl methacrylate esters are included. Furthermore, polymers of acrylic acid and butyl methacrylate, polymers of acrylic acid and methacrylic acid esters other than butyl methacrylate and butyl methacrylate, polymers of methacrylic acid and butyl acrylate, methacrylic acid and acrylic acid Polymers of acrylates other than butyl esters and butyl acrylates, polymers of butyl acrylates and butyl methacrylates, polymers of acrylates other than butyl acrylates and butyl methacrylates, butyl acrylate Polymers of esters and methacrylic acid esters other than methacrylic acid butyl esters are included. The polymerization reaction may be random copolymerization, block copolymerization, or the like. In addition, the alcohol described above is an alcohol having 1 to 24 carbon atoms and having a straight carbon chain, or an alcohol having 3 to 24 carbon atoms and having a branched carbon chain. Methanol with 1 carbon atom, ethanol with 2 carbon atoms, 1-propanol with 3 carbon atoms, 2-propanol with 3 carbon atoms, ethylene glycol monomethyl ether with 3 carbon atoms, 1-butanol with 4 carbon atoms, 2 with 4 carbon atoms -butanol, isobutanol with 4 carbon atoms, 1-hexanol with 6 carbon atoms, diethylene glycol monoethyl ether with 6 carbon atoms, benzyl alcohol with 7 carbon atoms, 1-octanol with 8 carbon atoms, 2-ethylhexanol with 8 carbon atoms , C8 phenyl glycol, C9 1-decanol, C12 lauryl alcohol, C16 cetyl alcohol, C18 stearyl alcohol, C18 oleyl alcohol, C22 behenyl alcohol, etc. is mentioned.

The molecular weight of the acrylic resin is preferably 5000 to 30000 in polystyrene equivalent weight average molecular weight (Mw) measured by gel permeation chromatography (GPC), more preferably 6000 to 15000. preferable.

Examples of such acrylic resins include poly-2-ethylhexyl acrylate (Mw=8300) and polylauryl methacrylate (Mw=10080).

The flux of the present embodiment may contain resin other than rosin and acrylic resin. Resins other than rosin and acrylic resins include terpene resins, modified terpene resins, terpene phenol resins, modified terpene phenol resins, styrene resins, modified styrene resins, xylene resins, modified xylene resins, polyethylene, polypropylene, polyvinyl acetate, At least one resin selected from polyvinyl alcohol, polyethylene polypropylene copolymer, and polyethylene polyvinyl acetate copolymer may be further included. As modified terpene resins, aromatic modified terpene resins, hydrogenated terpene resins, hydrogenated aromatic modified terpene resins, and the like can be used. A hydrogenated terpene phenol resin or the like can be used as the modified terpene phenol resin. As the modified styrene resin, a styrene acrylic resin, a styrene maleic acid resin, or the like can be used. Examples of modified xylene resins that can be used include phenol-modified xylene resins, alkylphenol-modified xylene resins, phenol-modified resol-type xylene resins, polyol-modified xylene resins, and polyoxyethylene-added xylene resins. Moreover, it may be a copolymer of the acrylic resin described above and another resin, for example, a polymer of each of the acrylic resins described above and polyethylene. Poly 2-ethylhexyl acrylate-polyethylene (Mw=12300) and the like can be mentioned as such an acrylic/polyethylene copolymer resin.

Other resins are optionally added components in the flux of the present embodiment that improves solder wetting and spreadability, and one or more of these can be used. The content of the other resin is preferably 0 wt % or more and 30.0 wt % or less, more preferably 5.0 wt % or more and 30.0 wt % or less. Also, when other resin is included, the ratio of other resin to rosin (other resin/rosin) is preferably 0.1 or more and 9.0 or less. When an acrylic resin is included as another resin, the content of the acrylic resin is preferably 0 wt % or more and 30.0 wt % or less, more preferably 5.0 wt % or more and 30.0 wt % or less. In addition, when acrylic resin is included as another resin, the ratio of acrylic resin to rosin (acrylic resin/rosin) is preferably from 0.1 to 9.0, and the ratio of acrylic resin to rosin (acrylic resin / rosin) is more preferably 0.1 or more and 6.0 or less.

The flux of this embodiment may contain other activators in addition to the isocyanuric acid (carboxyalkyl ) adduct. By including other activators, the effect of removing oxides can be enhanced.

Other active agents include organic acids other than isocyanuric acid (carboxyalkyl ) adducts, amines, organic halogen compounds, amine hydrohalides, and the like.

Other organic acids other than isocyanuric acid (carboxyalkyl ) adducts include glutaric acid, adipic acid, azelaic acid, eicosanedioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylaniline diglycolic acid, suberic acid, sebacic acid, thioglycolic acid, phthalic acid, isophthalic acid, terephthalic acid, dodecanedioic acid, p-hydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, fumaric acid, maleic acid, malonic acid, Lauric acid, benzoic acid, tartaric acid, tris(2-carboxyethyl) isocyanurate, glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis(hydroxymethyl)propionic acid, 2,2-bis(hydroxymethyl)butane acid, 4-tert-butylbenzoic acid, 2,3-dihydroxybenzoic acid, 2,4-diethylglutaric acid, 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid, palmitic acid, stearin acid, 12-hydroxystearic acid, oleic acid, linoleic acid, linolenic acid and the like.

In addition, other organic acids other than isocyanuric acid (carboxyalkyl ) adducts include dimer acid, which is a dimer that is a reaction product of monocarboxylic acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, monocarboxylic acid Trimer acid, which is a trimer of an acid reactant, and hydrogenated trimer acid obtained by adding hydrogen to trimer acid can be mentioned.

A dimer acid is a dimer using, for example, oleic acid and linoleic acid as monomers. A dimer acid using oleic acid and linoleic acid as monomers has 36 carbon atoms. A trimer acid is a trimer using, for example, oleic acid and linoleic acid as monomers. The trimer acid using oleic acid and linoleic acid as monomers has 54 carbon atoms.

Examples of dimer acid, trimer acid, hydrogenated dimer acid and hydrogenated trimer acid include dimer acid which is a reaction product of oleic acid and linoleic acid, trimer acid which is a reaction product of oleic acid and linoleic acid, and oleic acid and linoleic acid. Hydrogenated dimer acid obtained by adding hydrogen to dimer acid, which is a reactant of an acid, or hydrogenated trimer acid, obtained by adding hydrogen to trimer acid which is a reactant of oleic acid and linoleic acid.

As dimer acid, trimer acid, hydrogenated dimer acid and hydrogenated trimer acid, dimer acid other than the reaction product of oleic acid and linoleic acid, trimer acid other than the reaction product of oleic acid and linoleic acid, oleic acid and linol Hydrogenated dimer acid obtained by adding hydrogen to dimer acid other than the reaction product of acid or hydrogenated trimer acid obtained by adding hydrogen to trimer acid other than the reaction product of oleic acid and linoleic acid, dimer acid which is the reaction product of acrylic acid , trimer acid which is the reactant of acrylic acid, dimer acid which is the reactant of methacrylic acid, trimer acid which is the reactant of methacrylic acid, dimer acid which is the reactant of acrylic acid and methacrylic acid, acrylic acid and methacrylic acid trimer acid reactant, dimer acid reactant of oleic acid, trimer acid reactant of oleic acid, dimer acid reactant of linoleic acid, trimer acid reactant of linoleic acid, linolenic acid reactant Reactant dimer acid, trimer acid reactant of linolenic acid, dimer acid reactant of acrylic acid and oleic acid, trimer acid reactant of acrylic acid and oleic acid, reaction of acrylic acid and linoleic acid trimer acid, the reaction product of acrylic acid and linoleic acid; dimer acid, the reaction product of acrylic acid and linolenic acid; trimer acid, the reaction product of acrylic acid and linolenic acid; methacrylic acid and oleic acid trimer acid, the reactant of methacrylic acid and oleic acid; dimer acid, the reactant of methacrylic acid and linoleic acid; trimer acid, the reactant of methacrylic acid and linoleic acid; dimer acid reactant of linolenic acid, trimer acid reactant of methacrylic acid and linolenic acid, dimer acid reactant of oleic acid and linolenic acid, trimer acid reactant of oleic acid and linolenic acid, linoleic acid dimer acid, which is a reaction product of acid and linolenic acid; trimer acid, which is a reaction product of linoleic acid and linolenic acid; A hydrogenated trimer acid obtained by adding hydrogen to a trimer acid other than a reaction product of an acid and linoleic acid can be used.

Organic acids other than the isocyanuric acid (carboxyalkyl ) adduct are optionally added components in the flux of the present embodiment for improving solder wetting and spreading, and one or more of these are used. can do. The content of organic acids other than the isocyanuric acid (carboxyalkyl ) adduct is preferably 0 wt % or more and 10.0 wt % or less.

Amines include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4 -methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2 -undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-undecylimidazolyl-(1′ )]-ethyl-s-triazine, 2,4-diamino-6-[2′-ethyl-4′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[ 2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate, 2-phenylimidazole isocyanurate, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl -5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline , 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl-s-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy - imidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2-(1-ethylpentyl)benzimidazole, 2-nonylbenzimidazole, 2-(4-thiazolyl)benzimidazole, benzo imidazole, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3'-tert- Butyl-5′-methylphenyl)-5-chlorobenzotriazole, 2-(2′-hydroxy-3′,5′-di-tert-amylphenyl)benzotriazole, 2-(2′-hydroxy-5′- tert-octylphenyl)benzotriazole, 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-tert-octylphenol], 6-(2-benzotriazolyl)-4-tert- Octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole, carboxybenzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, 2,2′-[[(methyl-1H-benzotriazol-1-yl)methyl]imino]bisethanol, 1-(1′,2′-dicarboxyethyl)benzotriazole, 1-(2,3-dicarboxypropyl)benzotriazole, 1-[(2-ethylhexylamino)methyl]benzotriazole, 2,6-bis[ (1H-benzotriazol-1-yl)methyl]-4-methylphenol, 5-methylbenzotriazole, 5-phenyltetrazole, polyethylene glycol-polypropylene glycol copolymer having amino groups at both end groups (terminated diamine PEG-PPG) Copolymer, dimethylamine, 1-aminopropane, isopropylamine, trimethylamine, allylamine, n-butylamine, diethylamine, sec-butylamine, tert-butylamine, N,N-dimethylethylamine, isobutylamine, cyclohexylamine, aniline, N-methylaniline , diphenylamine, N-isopropylaniline, p-isopropylaniline, 2-aminoethanol, 2-(ethylamino)ethanol, diethanolamine, diisopropanolamine, triethanolamine, N-butyldiethanolamine, triisopropanolamine, N,N-bis (2-hydroxyethyl)-N-cyclohexylamine, N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine, N,N,N',N'',N''-pentakis(2- hydroxypropyl) diethylenetriamine, alanine, arginine, asparagine, asparagine acid, cysteine hydrochloride, glutamine, glutamic acid, glycine, histidine, isoleucine, leucine, lysine monohydrochloride, methionine, phenylalanine, proline, serine, threonine, tryptophan, tyrosine, valine, beta-alanine, gamma-aminobutyric acid, delta- Aminovaleric acid, ε-aminohexanoic acid, ε-caprolactam, 7-aminoheptanoic acid, dicyandiamide, 1,3-diphenylguanidine, 1,3-di-o-tolylguanidine, tetrakis(2-hydroxydipropyl)ethylenediamine, etc. is mentioned.

Amine is an optional component in the flux of the present embodiment that improves solder wetting and spreadability, and one or more of these can be used. The amine content is preferably 0 wt % or more and 10.0 wt % or less.

Examples of organic halogen compounds include organic bromo compounds such as trans-2,3-dibromo-1,4-butenediol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3 -bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, 3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, trans-2,3-dibromo-2-butene-1,4-diol, cis-2,3 -dibromo-2-butene-1,4-diol, 2,3-dichloro-1-propanol, 1,1,2,2-tetrabromoethane, 2,2,2-tribromoethanol, pentabromoethane, tetra carbon bromide, 2,2-bis(bromomethyl)-1,3-propanediol, meso-2,3-dibromosuccinic acid, chloroalkanes, chlorinated fatty acid esters, n-hexadecyltrimethylammonium bromide, 2,2 -bis[3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]propane, bis[3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]sulfone, ethylenebispentabromobenzene , 2-chloromethyloxirane, brominated bisphenol A type epoxy resin, tetrabromophthalic acid, bromosuccinic acid and the like. In addition, chloroalkanes, chlorinated fatty acid esters, het acid, het acid anhydride, etc., which are organic chloro compounds, can be used. Furthermore, fluorine-based surfactants which are organic fluoro compounds, surfactants having a perfluoroalkyl group, polytetrafluoroethylene, and the like are included.

An organic halogen compound is an optional component in the flux of the present embodiment that improves the solder wetting and spreading properties, and one or more of these can be used. The content of the organic halogen compound is preferably 0 wt % or more and 5.0 wt % or less.

An amine hydrohalide is a compound obtained by reacting an amine with a hydrogen halide, and examples thereof include aniline hydrochloride and aniline hydrobromide. As the amine of the amine hydrohalide, the above-described amines can be used, and examples thereof include ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole, etc. Hydrogen halides include chlorine, Bromine, iodine and fluorine hydrides (hydrogen chloride, hydrogen bromide, hydrogen iodide and hydrogen fluoride) are mentioned. Such amine hydrohalides include stearylamine hydrochloride, diethylaniline hydrochloride, diethanolamine hydrochloride, 2-ethylhexylamine hydrobromide, pyridine hydrobromide, isopropylamine hydrobromide. , cyclohexylamine hydrobromide, diethylamine hydrobromide, monoethylamine hydrobromide, 1,3-diphenylguanidine hydrobromide, dimethylamine hydrobromide, dimethylamine hydrochloride, rosin amine Hydrobromide, 2-ethylhexylamine hydrochloride, isopropylamine hydrochloride, cyclohexylamine hydrochloride, 2-pipecoline hydrobromide, 1,3-diphenylguanidine hydrochloride, dimethylbenzylamine hydrochloride, hydrazine hydrate Hydrobromide, dimethylcyclohexylamine hydrochloride, trinonylamine hydrobromide, diethylaniline hydrobromide, 2-diethylaminoethanol hydrobromide, 2-diethylaminoethanol hydrochloride, ammonium chloride, diallylamine hydrochloride, diallylamine hydrobromide, monoethylamine hydrochloride, monoethylamine hydrobromide, diethylamine hydrochloride, triethylamine hydrobromide, triethylamine hydrochloride, hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine monohydrochloride Hydrobromide, hydrazine dihydrobromide, pyridine hydrochloride, aniline hydrobromide, butylamine hydrochloride, hexylamine hydrochloride, n-octylamine hydrochloride, dodecylamine hydrochloride, dimethylcyclohexylamine odor hydrochloride, ethylenediamine dihydrobromide, rosinamine hydrobromide, 2-phenylimidazole hydrobromide, 4-benzylpyridine hydrobromide, L-glutamic acid hydrochloride, N-methylmorpholine Hydrochloride, betaine hydrochloride, 2-pipecoline hydroiodide, cyclohexylamine hydroiodide, 1,3-diphenylguanidine hydrofluoride, diethylamine hydrofluoride, 2-ethylhexylamine hydrofluoric acid salts, cyclohexylamine hydrofluoride, ethylamine hydrofluoride, rosinamine hydrofluoride, cyclohexylamine tetrafluoroborate, dicyclohexylamine tetrafluoroborate and the like. Further, instead of the amine hydrohalide, or in combination with the amine hydrohalide, a borofluoride may be included, and examples of the borofluoride include hydroborofluoric acid and the like.

The amine hydrohalide is an optional component in the flux of the present embodiment that improves solder wetting and spreadability, and one or more of these can be used. The content of the amine hydrohalide is preferably 0 wt % or more and 5.0 wt % or less.

The flux of this embodiment may further contain a thixotropic agent and a metal deactivator.

The thixotropic agents include ester-based thixotropic agents and amide-based thixotropic agents. Ester-based thixotropic agents include, for example, hardened castor oil. Amide thixotropic agents include lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-toluenemethanamide, Aromatic amide, methylenebisstearic acid amide, ethylenebislauric acid amide, ethylenebishydroxystearic acid amide, saturated fatty acid bisamide, methylenebisoleic acid amide, unsaturated fatty acid bisamide, m-xylylene bisstearic acid amide, aromatic bisamide , saturated fatty acid polyamide, unsaturated fatty acid polyamide, aromatic polyamide, substituted amide, methylol stearamide, methylol amide, fatty acid ester amide and the like.

A thixotropic agent is an optional component in the flux of the present embodiment that improves solder wetting and spreadability, and one or more of these can be used. The content of the thixotropic agent is preferably 0 wt % or more and 10.0 wt % or less.

Examples of metal deactivators include hindered phenol-based metal deactivators and nitrogen compound-based metal deactivators. Hindered phenol-based metal deactivators include bis(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid), N,N'-hexamethylenebis(3-(3, 5-di-tert-butyl-4-hydroxyphenyl)propanamide) and the like. Nitrogen compound-based metal deactivators include N-(2H-1,2,4-triazol-5-yl) salicylamide and the like.

The metal deactivator is an optional component in the flux of the present embodiment that improves solder wetting and spreadability, and one or more of these can be used.

Examples of solvents include water, ester solvents, alcohol solvents, glycol ether solvents, terpineols and the like. Ester solvents include alkyl fatty acids, butyl stearate, 2-ethylhexyl stearate, isotridecyl stearate, methyl oleate, isobutyl oleate, methyl cocoate, methyl laurate, isopropyl myristate, isopropyl palmitate, palmitic acid 2. - ethylhexyl, octyldodecyl myristate and the like. Alcohol-based solvents include ethanol, industrial ethanol (a mixed solvent of ethanol added with methanol and/or isopropyl alcohol), isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1, 5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3 -dimethyl-2,3-butanediol, 1,1,1-tris(hydroxymethyl)ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2′-oxybis(methylene)bis( 2-ethyl-1,3-propanediol), 2,2-bis(hydroxymethyl)-1,3-propanediol, 1,2,6-trihydroxyhexane, bis[2,2,2-tris(hydroxy methyl)ethyl] ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octyne-3 ,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol and the like. Glycol ether solvents include hexyl diglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, and triethylene glycol monobutyl ether. , 1,3-butylene glycol, phenyl glycol, hexylene glycol and the like.

The solvent is an essential component in the flux of the present embodiment that improves solder wetting and spreadability, and one or more of these can be used. The content of the solvent is the remainder of the content of the essential components when only the isocyanuric acid (carboxyalkyl ) adduct, the resin, and the solvent are included as the essential components in the predetermined content.

Furthermore, when any one or a combination of organic acids, amines, organic halogen compounds, amine hydrohalides, and thixotropic agents is contained in the above predetermined content, the balance of the content of the essential components and these optional components be.

In addition, you may contain a nonionic surfactant. The nonionic surfactant functions as a water-soluble resin, and by containing the nonionic surfactant in place of the above-described resin, the flux has excellent water washability. Examples of nonionic surfactants include polyalkylene glycol, alcohol polyalkylene glycol adducts, and carboxylic acid polyalkylene glycol adducts.

Examples of polyalkylene glycol include polyethylene glycol (PEG), polyethylene glycol-polypropylene glycol copolymer (PEG-PPG copolymer), and the like.

Alcohol polyalkylene glycol adducts include alcohol polyalkylene glycol EO adducts obtained by addition polymerization of ethylene oxide to alcohol polyalkylene glycol, and alcohol polyalkylene glycol EO adducts obtained by addition polymerization of ethylene oxide and propylene oxide to alcohol polyalkylene glycol. PO adducts and the like can be mentioned. Examples of such alcohol polyalkylene glycol adducts include cetyl alcohol EO adducts having 16 carbon atoms, cetyl alcohol EO/PO adducts, stearyl alcohol EO adducts having 18 carbon atoms, stearyl alcohol EO/PO adducts, carbon number 22 behenyl alcohol EO adducts, behenyl alcohol EO/PO adducts, and C6 resorcinol EO adducts and resorcinol EO/PO adducts.

Carboxylic acid polyalkylene glycol adducts include carboxylic acid polyalkylene glycol EO adducts, carboxylic acid polyalkylene glycol EO/PO adducts, and the like. Examples of such carboxylic acid polyalkylene glycol adducts include palmitic acid EO adducts having 16 carbon atoms, palmitic acid EO/PO adducts, stearic acid EO adducts having 18 carbon atoms, stearic acid EO/PO adducts, carbon behenic acid EO adducts of number 22, behenic acid EO/PO adducts, and the like.

In order to realize a water-soluble flux, the nonionic surfactant described above is preferably contained in an amount of 5.0 wt% or more and 20.0 wt% or less, and 10.0 wt% or more and 20.0 wt% or less instead of the resin described above. It is more preferable to contain the following. Moreover, 5.0 wt% or less of rosin may be contained.

In order to realize a water-soluble flux, it is preferable to contain an organic acid of 1.0 wt% or more and 10.0 wt% or less. ) containing propionic acid or two or more. In addition, it preferably contains 30.0 wt% or more and 55.0 wt% or less of amine, and as amine, any one or two or more of terminal diamine PEG-PPG copolymer, tetrakis(2-hydroxydipropyl)ethylenediamine, and 2-methylimidazole It is preferable to contain Further, it preferably contains 0 wt % or more and 5.0 wt % or less of amine hydrohalide, and preferably contains ethylamine·HBr as the amine hydrohalide. Moreover, it is preferable to contain one or more of 1,3-butylene glycol, phenyl glycol, and hexylene glycol as the remainder as a solvent.

<An example of solder paste according to the present embodiment>
The solder paste of this embodiment contains the above flux and metal powder. The metal powder is preferably a solder that does not contain Pb, and is Sn alone, or Sn--Ag-based, Sn--Cu-based, Sn--Ag--Cu-based, Sn--Bi-based, Sn--In-based, etc., or Solder powder is formed by adding Sb, Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, etc. to these alloys.

<Examples of effects of flux and solder paste according to the present embodiment>
A flux containing an isocyanuric acid (carboxyalkyl ) adduct of 0.5 wt% or more and 20.0 wt% or less, a rosin of 5.0 wt% or more and 50.0 wt% or less, and a solvent, and solder using this flux With the paste, by performing soldering in a reflow furnace, oxides that cause non-wetting of the solder are removed, and the wetting and spreading properties of the solder are improved.

The fluxes of Examples and Comparative Examples were prepared according to the compositions shown in Tables 1 to 9 below, and solder wetting and spreadability were verified. The composition ratios in Tables 1 to 9 are wt % when the total amount of flux is 100.

<Evaluation of Solder Wetting and Spreading>
(1) Verification method Solderability was evaluated by applying the flux composition of each example and each comparative example on a Cu plate, mounting a solder ball on the flux composition applied on the Cu plate, and performing reflow. After that, the wetting and spreading diameter of the solder was measured. The composition of the solder is a Sn--Ag--Cu solder alloy containing 3.0 wt % Ag, 0.5 wt % Cu, and the balance Sn.

First, a Bare-Cu plate of 30 mm length×30 mm width×0.3 mm thickness was subjected to flux printing with a squeegee using a mask having an opening diameter of φ0.23 mm and a thickness of 0.1 mm for evaluating a φ0.3 mm ball. One solder ball of φ0.3 mm is placed on the flux-printed part of the Cu plate for each printed part of the mask opening, and 10 or more solder balls are placed on each Cu plate. gone. The reflow conditions were as follows: after preheating at 190° C. for 120 sec in an air atmosphere, main heating was performed by raising the temperature from 190° C. to 260° C. at a rate of 1° C./sec.

The wetting and spreading diameter of the solder was measured for one bump in four directions, i.e., the vertical direction, the horizontal direction, the right oblique direction and the left oblique direction, and the arithmetic average value was taken as the solder wetting and spreading diameter of one bump. Then, the arithmetic mean value of N=10 was taken as the wetting spread diameter of the solder.

(2) Judgment Criteria ◯: The solder wetted and spread over 0.4 mm (=400 μm).
x: The solder wetted and spread to less than 0.4 mm.

Tables 1 and 2 show examples containing tris(2-carboxyethyl) isocyanurate as an isocyanuric acid (carboxyalkyl ) adduct, examples containing no tris(2-carboxyethyl) isocyanurate, and other isocyanuric acids ( It is a comparative example that does not include carboxyalkyl ) adducts either. Tables 3 and 4 show examples containing tris( 1 -carboxymethyl)isocyanurate as an isocyanuric acid (carboxyalkyl ) adduct, examples containing no tris( 1 -carboxymethyl)isocyanurate, and other isocyanuric acids ( It is a comparative example that does not include carboxyalkyl ) adducts either. Tables 5 and 6 show examples containing tris( 3 -carboxypropyl)isocyanurate as an isocyanuric acid (carboxyalkyl ) adduct, examples containing no tris( 3 -carboxypropyl)isocyanurate, and other isocyanuric acids ( It is a comparative example that does not include carboxyalkyl ) adducts either. Tables 7 and 8 show examples containing bis(2-carboxyethyl) isocyanurate as an isocyanuric acid (carboxyalkyl ) adduct, examples containing no bis(2-carboxyethyl) isocyanurate, and other isocyanuric acids ( It is a comparative example that does not include carboxyalkyl ) adducts either.

Examples A1 to A3, Examples B1 to B3, Examples C1 to C3, and Examples D1 to D3 differed in the type of rosin. -carboxyethyl)isocyanurate, within the range specified in the present invention, 5.0 wt%. Example B1 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined in the present invention. Example C1 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D1 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A1, Example B1, Example C1, and Example D1, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

In Example A1, Example B1, Example C1, and Example D1, the diameter of solder wetting and spreading met the criteria described above, and a sufficient effect on solder wetting and spreading was obtained.

Example A2 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined in the present invention. Example B2 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C2 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D2 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A2, Example B2, Example C2, and Example D2, 45.0 wt % of hydrogenated rosin was included as the rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

In Example A2, Example B2, Example C2, and Example D2, the solder wetting and spreading diameter satisfied the above criteria, and a sufficient effect was obtained on the solder wetting and spreading properties.

Example A3 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B3 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C3 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D3 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Examples A3, B3, C3, and D3, 45.0 wt % of acid-modified rosin was included as the rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

In Example A3, Example B3, Example C3, and Example D3, the diameter of solder wetting and spreading also satisfied the criteria described above, and a sufficient effect on solder wetting and spreading was obtained.

Example A4, Example B4, Example C4, and Example D4 are those in which rosin was added in combination, and in Example A4, tris(2-carboxyethyl) isocyanurate was Contains 5.0 wt%. Example B4 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C4 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D4 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A4, Example B4, Example C4, and Example D4, polymerized rosin was used as rosin at 25.0 wt% within the range defined by the present invention, and acid-modified rosin was used as defined by the present invention. 20 wt% is included within the range. The total rosin content is within the range defined in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

Also in Example A4, Example B4, Example C4, and Example D4, the solder wetting and spreading diameter satisfied the above criteria, and a sufficient effect was obtained on the solder wetting and spreading properties.

Examples A5 to A8, Examples B5 to B8, Examples C5 to C8, and Examples D5 to D8 differed in the amount of amine. -carboxyethyl)isocyanurate, within the range specified in the present invention, 20.0 wt%. Example B5 contains 20.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C5 contains 20.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D5 contains 20.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A5, Example B5, Example C5, and Example D5, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, the present It contains 5 wt% within the range defined by the invention, and the remainder is 29.0 wt% of hexyl diglycol as a solvent within the range defined by the invention.

In Example A5, Example B5, Example C5, and Example D5, by increasing the content of the tris(2-carboxyalkyl) isocyanurate adduct without containing an amine, the solder wetting and spreading diameter was as described above. The evaluation criteria were met, and a sufficient effect was obtained on solder wetting and spreading.

Example A6 contains 20.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined in the present invention. Example B6 contains 20.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C6 contains 20.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D6 contains 20.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the present invention. Further, in Examples A6, B6, C6, and D6, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 0.1 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of castor hydrogenated oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 28.9 wt% within the range specified in the present invention include.

In Example A6, Example B6, Example C6, and Example D6, the diameter of solder wetting and spreading also satisfied the above-described criterion, and a sufficient effect on solder wetting and spreading was obtained.

Example A7 contains 20.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B7 contains 20.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C7 contains 20.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D7 contains 20.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the present invention. Moreover, in Example A7, Example B7, Example C7, and Example D7, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 0.5 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 28.5 wt% within the range specified in the present invention include.

In Example A7, Example B7, Example C7, and Example D7, the diameter of solder wetting and spreading also satisfied the criteria described above, and a sufficient effect on solder wetting and spreading was obtained.

Example A8 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B8 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C8 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D8 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A8, Example B8, Example C8, and Example D8, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 10.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range defined by the present invention, and the balance of hexyl diglycol as a solvent, 34.0 wt% within the range defined by the present invention include.

In Example A8, Example B8, Example C8, and Example D8, the diameter of solder wetting and spreading also satisfied the criteria described above, and a sufficient effect on solder wetting and spreading was obtained.

Example A9, Example B9, Example C9, and Example D9 contain organic acids other than isocyanuric acid (carboxyalkyl ) adducts, and in Example A9, tris(2-carboxyethyl) isocyanate Contains 0.5 wt% of nurate within the range specified in the present invention. Example B9 contains 0.5 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C9 contains 0.5 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D9 contains 0.5 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A9, Example B9, Example C9, and Example D9, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as an organic acid, 5.0 wt% within the range defined in the present invention, monoethanolamine as an amine, 10.0 wt% within the range defined in the present invention, trans- 1.0 wt% of 2,3-dibromo-1,4-butenediol within the range defined by the present invention, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range defined by the present invention, and the balance contains 33.5 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

In Example A9, Example B9, Example C9, and Example D9, by containing an organic acid other than the isocyanuric acid (carboxyalkyl ) adduct, the content of the isocyanuric acid (carboxyalkyl) adduct was reduced within the range defined by the present invention, the diameter of the solder wetting and spreading met the criteria described above, and a sufficient effect on the wetting and spreading properties of the solder was obtained.

Examples A10 to A12, Examples B10 to B12, Examples C10 to C12, and Examples D10 to D12 contain organic acids other than isocyanuric acid (carboxyalkyl ) adducts. , with different types of amines, Example A10 containing 5.0 wt. Example B10 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C10 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D10 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A10, Example B10, Example C10, and Example D10, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as an organic acid, 5.0 wt% within the range defined in the present invention, diphenylguanidine as an amine, 2.0 wt% within the range defined in the present invention, trans-2 as an organic halogen compound , 3-Dibromo-1,4-butenediol, 1.0 wt% within the range defined in the present invention, castor hydrogenated oil as a thixotropic agent, 5 wt% within the range defined in the present invention, and the balance 37.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

In Example A10, Example B10, Example C10, and Example D10, the diameter of solder wetting and spreading also satisfied the above-described criterion, and a sufficient effect on solder wetting and spreading was obtained.

Example A11 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B11 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C11 contains 5.0 wt % of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D11 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A11, Example B11, Example C11, and Example D11, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as an organic acid, 5.0 wt% within the range defined in the present invention, 2-phenylimidazole as an amine, 2.0 wt% within the range defined in the present invention, trans as an organic halogen compound 1.0 wt% of -2,3-dibromo-1,4-butenediol within the range defined by the present invention, and 5 wt% of hydrogenated castor oil as a thixotropic agent within the range defined by the present invention, 37.0 wt% of hexyl diglycol is included as a solvent within the range specified in the present invention.

Also in Example A11, Example B11, Example C11, and Example D11, the diameter of solder wetting and spreading met the criteria described above, and a sufficient effect on solder wetting and spreading was obtained.

Example A12 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B12 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C12 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D12 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A12, Example B12, Example C12, and Example D12, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as an organic acid, 5.0 wt% within the range defined in the present invention, 2-phenyl-4-methylimidazole as an amine, 2.0 wt% within the range defined in the present invention, organic Trans-2,3-dibromo-1,4-butenediol as a halogen compound, 1.0 wt% within the range defined by the present invention, castor hardened oil as a thixotropic agent, within the range defined by the present invention It contains 5 wt%, and the remainder contains 37.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

Also in Example A12, Example B12, Example C12, and Example D12, the diameter of solder wetting and spreading met the criteria described above, and a sufficient effect on solder wetting and spreading was obtained.

Example A13, Example B13, Example C13, and Example D13 differed in the amount of the organic acid other than the isocyanuric acid (carboxyalkyl ) adduct. In Example A13, tris(2-carboxyethyl ) 5.0 wt% of isocyanurate within the range specified in the present invention. Example B13 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C13 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D13 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A13, Example B13, Example C13, and Example D13, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Further, glutaric acid as an organic acid, 10.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound containing no amine, the present invention. 1.0 wt% within the range specified in , containing castor hydrogenated oil as a thixotropic agent, 5 wt% within the range specified in the present invention, and the balance being hexyl diglycol as a solvent, within the range specified in the present invention 34.0 wt%.

In Example A13, Example B13, Example C13, and Example D13, by increasing the content of the organic acid other than the isocyanuric acid (carboxyalkyl ) adduct within the range specified in the present invention, the amine Even without containing, the diameter of solder wetting and spreading satisfies the criteria described above, and a sufficient effect on the wetting and spreading property of solder was obtained.

Example A14, Example B14, Example C14, and Example D14 differed in the amount of the organic acid other than the isocyanuric acid (carboxyalkyl ) adduct. In Example A14, tris(2-carboxyethyl ) 5.0 wt% of isocyanurate within the range specified in the present invention. Example B14 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C14 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D14 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A14, Example B14, Example C14, and Example D14, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, adipic acid as an organic acid, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound containing no amine at 5.0 wt% within the range defined in the present invention, 1.0 wt% within the range specified in , containing castor hydrogenated oil as a thixotropic agent, 5 wt% within the range specified in the present invention, and the balance being hexyl diglycol as a solvent, within the range specified in the present invention contains 39.0 wt%.

In Example A14, Example B14, Example C14, and Example D14, by changing the type of organic acid other than the isocyanuric acid (carboxyalkyl ) adduct, the wetting and spreading diameter of the solder was increased even without containing an amine. The criteria described above were satisfied, and a sufficient effect on solder wetting and spreading properties was obtained.

Examples A15 to A16, Examples B15 to B16, Examples C15 to C16, and Examples D15 to D16 contain organic acids other than isocyanuric acid (carboxyalkyl ) adducts. , with varying amounts of organohalogen compounds, Example A15 containing 5.0 wt. Example B15 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C15 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D15 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A15, Example B15, Example C15, and Example D15, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as an organic acid, 5.0 wt% within the range defined in the present invention, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, does not contain an organic halogen compound , 5% by weight of hydrogenated castor oil as a thixotropic agent within the range defined by the present invention, and the remainder containing 35.0% by weight of hexyldiglycol as a solvent within the range defined by the present invention.

In Example A15, Example B15, Example C15 , and Example D15, organic Even without containing a halogen compound, the diameter of the solder wetting and spreading met the criteria described above, and a sufficient effect was obtained on the wetting and spreading properties of the solder.

Example A16 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B16 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C16 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D16 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A16, Example B16, Example C16, and Example D16, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as an organic acid, 5.0 wt% within the range defined in the present invention, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans- 5.0 wt% of 2,3-dibromo-1,4-butenediol within the range defined by the present invention, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range defined by the present invention, and the balance contains 30.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

In Example A16, Example B16, Example C16, and Example D16, an organic acid other than an isocyanuric acid (carboxyalkyl ) adduct, an amine, and an organic halogen compound were added within the scope defined by the present invention. Even when it is contained, the diameter of the solder wetting and spreading satisfies the criteria described above, and a sufficient effect on the wetting and spreading properties of the solder was obtained.

Example A17, Example B17, Example C17, and Example D17 contain an organic acid other than the isocyanuric acid (carboxyalkyl ) adduct, and the type of the organic halogen compound is changed. , tris(2-carboxyethyl)isocyanurate in an amount of 5.0 wt % within the range specified in the present invention. Example B17 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C17 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D17 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A17, Example B17, Example C17, and Example D17, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as an organic acid, 5.0 wt% within the range defined in the present invention, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, triallyl as an organic halogen compound Contains 1.0 wt% of isocyanurate hexabromide within the range defined in the present invention, castor hydrogenated oil as a thixotropic agent, 5 wt% within the range defined in the present invention, and the balance is hexyl diglycol as a solvent, It contains 34.0 wt% within the range defined by the present invention.

Also in Example A17, Example B17, Example C17, and Example D17, the solder wetting and spreading diameter satisfied the above-described criterion, and a sufficient effect on the solder wetting and spreading property was obtained.

Example A18, Example B18, Example C18, and Example D18 contain an organic acid other than an isocyanuric acid (carboxyalkyl ) adduct and contain an amine hydrohalide. , tris(2-carboxyethyl)isocyanurate in an amount of 5.0 wt % within the range specified in the present invention. Example B18 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C18 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D18 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A18, Example B18, Example C18, and Example D18, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as the organic acid, 5.0 wt% within the range defined in the present invention, monoethanolamine as the amine, 5.0 wt% within the range defined in the present invention, as amine hydrohalide 1.0 wt% of aniline·HCl within the range defined by the present invention, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range defined by the present invention, and the balance of hexyl diglycol as a solvent, It contains 34.0 wt% within the range defined by the invention.

Also in Example A18, Example B18, Example C18, and Example D18, the solder wetting and spreading diameter satisfied the above-described criterion, and a sufficient effect on the solder wetting and spreading property was obtained.

Example A19, Example B19, Example C19, and Example D19 contain organic acids other than isocyanuric acid (carboxyalkyl ) adducts and differ in the type of amine hydrohalide. A19 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range specified in the present invention. Example B19 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C19 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D19 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A19, Example B19, Example C19, and Example D19, 45.0 wt % of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, glutaric acid as the organic acid, 5.0 wt% within the range defined in the present invention, monoethanolamine as the amine, 5.0 wt% within the range defined in the present invention, as amine hydrohalide 5.0 wt% of aniline HBr within the range defined by the present invention, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range defined by the present invention, and the balance of hexyl diglycol as a solvent, It contains 30.0 wt% within the range defined by the invention.

Also in Example A19, Example B19, Example C19, and Example D19, the solder wetting and spreading diameter satisfied the above-described criterion, and a sufficient effect on the solder wetting and spreading property was obtained.

Examples A20 to A23, Examples B20 to B23, Examples C20 to C23, and Examples D20 to D23 differed in the amount and type of the thixotropic agent. Tris(2-carboxyethyl)isocyanurate is included at 5.0 wt% within the range specified in the present invention. Example B20 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C20 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D20 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A20, Example B20, Example C20, and Example D20, polymerized rosin was used as rosin at 45.0 wt% within the range specified by the present invention, and acid-modified rosin was specified by the present invention. 5 wt% is included within the range. The total rosin content is within the range defined in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt.% of the content, without thixotropic agents, and the remainder containing hexyldiglycol as a solvent, 39.0 wt.% within the range defined in the present invention.

In Example A20, Example B20, Example C20, and Example D20, the diameter of solder wetting and spreading also satisfied the above-described criterion, and a sufficient effect on solder wetting and spreading was obtained.

Example A21 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B21 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C21 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D21 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A21, Example B21, Example C21, and Example D21, 45.0 wt % of polymerized rosin was contained as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% of the thixotropic agent, 5.0 wt% of a polyamide-based thixotropic agent within the range defined by the present invention, and the balance being hexyl diglycol as a solvent, 39 within the range defined by the present invention 0 wt%.

Also in Example A21, Example B21, Example C21, and Example D21, the diameter of solder wetting and spreading met the criteria described above, and a sufficient effect on solder wetting and spreading was obtained.

Example A22 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B22 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C22 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D22 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A22, Example B22, Example C22, and Example D22, 45.0 wt% of polymerized rosin was included as the rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% of the thixotropic agent, a bisamide-based thixotropic agent within the range defined by the present invention, containing 5.0 wt%, and the balance being hexyl diglycol as a solvent, 39 within the range defined by the present invention 0 wt%.

In Example A22, Example B22, Example C22, and Example D22, the diameter of solder wetting and spreading also satisfied the above-described criterion, and a sufficient effect on solder wetting and spreading was obtained.

Example A23 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B23 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C23 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D23 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Moreover, in Example A23, Example B23, Example C23, and Example D23, 45.0 wt % of polymerized rosin was included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5.0 wt% of an amide-based thixotropic agent as a thixotropic agent within the range defined by the present invention, and the balance being hexyl diglycol as a solvent, 39 within the range defined by the present invention 0 wt%.

In Example A23, Example B23, Example C23, and Example D23, the diameter of solder wetting and spreading also satisfied the above-described criterion, and a sufficient effect on solder wetting and spreading was obtained.

Examples A24 to A26, Examples B24 to B26, Examples C24 to C26, and Examples D24 to D26 contain other resins. -carboxyethyl)isocyanurate, within the range specified in the present invention, 5.0 wt%. Example B24 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C24 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D24 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. In Example A24, Example B24, Example C24, and Example D24, polymerized rosin was used as the rosin at 25.0 wt% within the range specified in the present invention, and acrylic resin was used as the other resin in the present invention. It contains 10.0 wt % within the specified range, and 10.0 wt % acrylic/polyethylene copolymer resin within the range specified by the present invention. The total content of other resins is within the range specified in the present invention, and the ratio of acrylic resin to rosin (acrylic resin/rosin) is 0.8 within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range defined in the present invention, 5.0 wt% castor hydrogenated oil as a thixotropic agent within the range defined in the present invention, and the balance hexyl diglycol as a solvent within the range defined in the present invention, 39.0 wt% within the range defined in the present invention. Contains 0 wt%.

In Example A24, Example B24, Example C24, and Example D24, even if an acrylic resin is included as another resin, the solder wetting and spreading diameter satisfies the above-described criteria, and is sufficient for solder wetting and spreading. good effect was obtained.

Example A25 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B25 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C25 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D25 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. In Example A25, Example B25, Example C25, and Example D25, polymerized rosin was used as rosin at 40.0 wt% within the range defined by the present invention, and acrylic resin was used within the range defined by the present invention. contains 5.0 wt%. The ratio of acrylic resin to rosin (acrylic resin/rosin) is 0.125 within the range defined by the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range defined in the present invention, 5.0 wt% castor hydrogenated oil as a thixotropic agent within the range defined in the present invention, and the balance hexyl diglycol as a solvent within the range defined in the present invention, 39.0 wt% within the range defined in the present invention. Contains 0 wt%.

Also in Example A25, Example B25, Example C25, and Example D25, the solder wetting and spreading diameter satisfied the above-described criterion, and a sufficient effect was obtained on the solder wetting and spreading properties.

Example A26 contains 5.0 wt% of tris(2-carboxyethyl)isocyanurate within the range defined by the present invention. Example B26 contains 5.0 wt% of tris( 1 -carboxymethyl)isocyanurate within the range defined by the present invention. Example C26 contains 5.0 wt% of tris( 3 -carboxypropyl)isocyanurate within the range defined by the present invention. Example D26 contains 5.0 wt% of bis(2-carboxyethyl)isocyanurate within the range defined by the invention. Further, in Example A26, Example B26, Example C26, and Example D26, polymerized rosin was used as rosin at 5.0 wt% within the range defined by the present invention, and acrylic resin was used within the range defined by the present invention. 20.0 wt% within the scope of the present invention, and 10.0 wt% of the acrylic-polyethylene copolymer resin within the range defined by the present invention. The total content of other resins is within the range specified in the present invention, and the ratio of acrylic resin to rosin (acrylic resin/rosin) is 6.0 within the range specified in the present invention. In addition, it contains 5.0 wt% of adipic acid as an organic acid within the range defined by the present invention, and 5.0 wt% of hydrogenated dimer acid within the range defined by the present invention. The total organic acid content is within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range defined in the present invention, 5.0 wt% castor hydrogenated oil as a thixotropic agent within the range defined in the present invention, and the balance hexyl diglycol as a solvent within the range defined in the present invention, 39.0 wt% within the range defined in the present invention. Contains 0 wt%.

In Example A26, Example B26, Example C26, and Example D26, even if the rosin content is reduced within the range defined by the present invention, the solder wetting and spreading can be prevented by including an acrylic resin as another resin. The diameter satisfied the criteria described above, and a sufficient effect was obtained on solder wetting and spreading.

In contrast, Comparative Example A1 does not contain tris(2-carboxyethyl)isocyanurate and does not contain other isocyanuric acid (carboxyalkyl ) adducts. Comparative Example B1 does not contain tris( 1 -carboxymethyl)isocyanurate and does not contain other isocyanuric acid (carboxyalkyl ) adducts. Comparative Example C1 contains no tris( 3 -carboxypropyl) isocyanurate and no other isocyanuric acid (carboxyalkyl ) adducts. Comparative Example D1 contains no bis(2-carboxyethyl) isocyanurate and no other isocyanuric acid (carboxyalkyl ) adducts. In Comparative Example A1, Comparative Example B1, Comparative Example C1, and Comparative Example D1, polymerized rosin was used as the rosin at 45.0 wt% within the range defined by the present invention, and glutaric acid was used as the organic acid as defined by the present invention. 5.0 wt% of monoethanolamine as an amine within the range specified in the present invention, and 5.0 wt% of trans-2,3-dibromo-1,4-butenediol as an organic halogen compound within the range specified in the present invention. , containing 1.0 wt% within the range defined in the present invention, castor hydrogenated oil as a thixotropic agent, 5.0 wt% within the range defined in the present invention, and the balance being hexyl diglycol as a solvent, in the present invention Contains 39.0 wt% within the prescribed range.

In Comparative Example A1, Comparative Example B1, Comparative Example C1, and Comparative Example D1, since none of the isocyanuric acid (carboxyalkyl ) adducts is included, rosin, organic acid, amine, organic halogen compound, thixotropic agent, solvent was included within the range defined by the present invention, the solder wetting and spreading diameter did not satisfy the above criteria, and no effect was obtained on the solder wetting and spreading properties.

Comparative Example A2 contains no tris(2-carboxyethyl)isocyanurate and no other isocyanuric acid (carboxyalkyl ) adducts. Comparative Example B2 does not contain tris( 1 -carboxymethyl)isocyanurate and does not contain other isocyanuric acid (carboxyalkyl ) adducts. Comparative Example C2 contains no tris( 3 -carboxypropyl) isocyanurate and no other isocyanuric acid (carboxyalkyl ) adducts. Comparative Example D2 contains no bis(2-carboxyethyl) isocyanurate and no other isocyanuric acid (carboxyalkyl ) adducts. In Comparative Example A1, Comparative Example B1, Comparative Example C1, and Comparative Example D1, polymerized rosin was used as the rosin at 45.0 wt% within the range defined by the present invention, and adipic acid was used as the organic acid, as defined by the present invention. 5.0 wt% of monoethanolamine as an amine within the range specified in the present invention, and 5.0 wt% of trans-2,3-dibromo-1,4-butenediol as an organic halogen compound within the range specified in the present invention. , containing 1.0 wt% within the range defined in the present invention, castor hydrogenated oil as a thixotropic agent, 5.0 wt% within the range defined in the present invention, and the balance being hexyl diglycol as a solvent, in the present invention Contains 39.0 wt% within the prescribed range.

In Comparative Example A2, Comparative Example B2, Comparative Example C2, and Comparative Example D2, since none of the isocyanuric acid (carboxyalkyl ) adducts is included, rosin, organic acid, amine, organic halogen compound, thixotropic agent, solvent is included within the range defined by the present invention, and even if the type of organic acid is changed, the diameter of the solder wetting and spreading does not satisfy the above-described criteria, and the effect on the wetting and spreading property of the solder is not obtained. rice field.

Table 9 shows tris(2-carboxyethyl) isocyanurate, tris( 1 -carboxymethyl) isocyanurate, tris( 3 -carboxypropyl) isocyanurate, bis(2-carboxyl) as isocyanuric acid (carboxyalkyl ) adducts. It is an example in which ethyl) isocyanurate is added in combination, and a comparative example in which neither isocyanuric acid (carboxyalkyl ) adduct is included.

In example E1, tris( 2 -carboxyethyl)isocyanurate was added at 1.25 wt. 1.25% by weight of tris( 3 -carboxypropyl)isocyanurate within the scope defined by the invention, 1.25% by weight of bis(2-carboxyethyl)isocyanurate within the scope defined by the invention Contains 1.25 wt%. The total content of isocyanuric acid (carboxyalkyl ) adducts is 5.0 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

In Example E1, even when the isocyanuric acid (carboxyalkyl ) adduct was added in combination, the solder wetting and spreading diameter satisfied the above-described criteria, and a sufficient effect was obtained on the solder wetting and spreading properties. .

In example E2, tris( 2 -carboxyethyl)isocyanurate at 2.5 wt. Contains 2.5 wt%. The total content of isocyanuric acid (carboxyalkyl ) adducts is 5.0 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

Also in Example E2, the solder wetting and spreading diameter satisfied the criteria described above, and a sufficient effect was obtained on the solder wetting and spreading properties.

In example E3, tris( 2 -carboxyethyl)isocyanurate at 2.5 wt. Contains 2.5 wt%. The total content of isocyanuric acid (carboxyalkyl ) adducts is 5.0 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

Also in Example E3, the diameter of the solder wetting and spreading met the criteria described above, and a sufficient effect was obtained on the wetting and spreading properties of the solder.

In Example E4, tris(2-carboxyethyl)isocyanurate was added at 2.5 wt. Contains 2.5 wt%. The total content of isocyanuric acid (carboxyalkyl ) adducts is 5.0 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

Also in Example E4, the solder wetting and spreading diameter satisfied the above-described criterion, and a sufficient effect was obtained on the solder wetting and spreading properties.

In Example E5, tris( 1 -carboxymethyl)isocyanurate was added at 2.5 wt. Contains 2.5 wt%. The total content of isocyanuric acid (carboxyalkyl ) adducts is 5.0 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

Also in Example E5, the solder wetting and spreading diameter satisfied the criteria described above, and a sufficient effect was obtained on the solder wetting and spreading properties.

In Example E6, tris( 1 -carboxymethyl)isocyanurate was added at 2.5 wt. Contains 2.5 wt%. The total content of isocyanuric acid (carboxyalkyl ) adducts is 5.0 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

Also in Example E6, the solder wetting and spreading diameter satisfied the criteria described above, and a sufficient effect was obtained on the solder wetting and spreading properties.

In Example E7, tris( 3 -carboxypropyl)isocyanurate was added at 2.5 wt. Contains 2.5 wt%. The total content of isocyanuric acid (carboxyalkyl ) adducts is 5.0 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 39.0 wt% within the range specified in the present invention include.

Also in Example E7, the diameter of the solder wetting and spreading met the criteria described above, and a sufficient effect was obtained on the wetting and spreading properties of the solder.

In example E8, tris( 2 -carboxyethyl)isocyanurate at 2.5 wt. 2.5 wt %, containing 2.5 wt % of tris( 3 -carboxypropyl)isocyanurate within the scope defined in the present invention. The total content of isocyanuric acid (carboxyalkyl ) adducts is 7.5 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 3.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 38.5 wt% within the range specified in the present invention include.

Also in Example E8, the solder wetting and spreading diameter satisfied the criteria described above, and a sufficient effect was obtained on the solder wetting and spreading properties.

In Example E9, tris( 2 -carboxyethyl)isocyanurate was added at 2.5 wt. 2.5 wt%, containing 2.5 wt% of bis(2-carboxyethyl)isocyanurate within the range defined in the present invention. The total content of isocyanuric acid (carboxyalkyl ) adducts is 7.5 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 3.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 38.5 wt% within the range specified in the present invention include.

Also in Example E9, the diameter of the solder wetting and spreading met the criteria described above, and a sufficient effect was obtained on the wetting and spreading properties of the solder.

In example E10, tris( 2 -carboxyethyl)isocyanurate was added at 2.5 wt. 2.5 wt%, containing 2.5 wt% of bis(2-carboxyethyl)isocyanurate within the range defined in the present invention. The total content of isocyanuric acid (carboxyalkyl ) adducts is 7.5 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 3.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 38.5 wt% within the range specified in the present invention include.

Also in Example E10, the solder wetting and spreading diameter satisfied the criteria described above, and a sufficient effect on the solder wetting and spreading property was obtained.

In Example E11, tris( 1 -carboxymethyl)isocyanurate was added at 2.5 wt. 2.5 wt%, containing 2.5 wt% of bis(2-carboxyethyl)isocyanurate within the range defined in the present invention. The total content of isocyanuric acid (carboxyalkyl ) adducts is 7.5 wt%, which is within the range defined in the present invention. In addition, 45.0 wt% of polymerized rosin is included as rosin within the range specified in the present invention. Furthermore, monoethanolamine as an amine, 3.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, within the range defined in the present invention 1.0 wt% within the range, 5 wt% of hydrogenated castor oil as a thixotropic agent within the range specified in the present invention, and the balance of hexyl diglycol as a solvent, 38.5 wt% within the range specified in the present invention include.

Also in Example E11, the diameter of the solder wetting and spreading met the criteria described above, and a sufficient effect was obtained on the wetting and spreading properties of the solder.

In contrast, in Comparative Example E1, tris(2-carboxyethyl)isocyanurate, tris( 1 -carboxymethyl)isocyanurate, tris( 3 -carboxypropyl)isocyanurate, bis(2-carboxyethyl)isocyanurate tris( 2-Carboxyethyl) isocyanurate. In addition, polymerized rosin as rosin, 45.0 wt% within the range defined in the present invention, glutaric acid as organic acid, 5.0 wt% within the range defined in the present invention, monoethanolamine as amine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, 1.0 wt% within the range defined in the present invention, a thixotropic agent 5.0 wt% of hydrogenated castor oil within the range defined in the present invention, and the remainder contains 39.0 wt% of hexyl diglycol as the solvent within the range defined in the present invention.

Comparative Example E1 does not contain any isocyanuric acid (carboxyalkyl ) adducts, so that it contains rosin, organic acids, amines, organic halogen compounds, thixotropic agents, and solvents within the scope of the present invention. However, the wetting and spreading diameter of the solder did not satisfy the criteria described above, and no effect was obtained on the wetting and spreading properties of the solder.

Comparative Example E2 contains none of tris(2-carboxyethyl)isocyanurate, tris( 1 -carboxymethyl)isocyanurate, tris( 3 -carboxypropyl)isocyanurate and bis(2-carboxyethyl) isocyanurate . Further, polymerized rosin as rosin, within the range defined in the present invention, 45.0 wt%, organic acid as adipic acid, within the range defined in the present invention, 5.0 wt%, amine monoethanolamine, 5.0 wt% within the range defined in the present invention, trans-2,3-dibromo-1,4-butenediol as an organic halogen compound, 1.0 wt% within the range defined in the present invention, a thixotropic agent 5.0 wt% of hydrogenated castor oil within the range defined in the present invention, and the remainder contains 39.0 wt% of hexyl diglycol as the solvent within the range defined in the present invention.

Comparative Example E2 does not contain any isocyanuric acid (carboxyalkyl ) adducts, so that it contains rosin, organic acids, amines, organic halogen compounds, thixotropic agents, and solvents within the scope of the present invention. Moreover, even when the type of organic acid was changed, the solder wetting and spreading diameter did not satisfy the above criteria, and no effect was obtained on the solder wetting and spreading properties.

From the above, the flux containing 0.5 wt% or more and 20.0 wt% or less of the isocyanuric acid (carboxyalkyl ) adduct, 5.0 wt% or more and 50.0 wt% or less of the rosin, and further containing the solvent has the desired The oxide removal effect was enhanced in the temperature range.

As a result, with this flux and the solder paste using this flux, by performing soldering in a reflow furnace, oxides that cause non-wetting of the solder are removed, and the wettability of the solder is improved.

These effects are due to the addition of organic acids, amines, and organic halogen compounds other than acrylic resins and isocyanuric acid (carboxyalkyl ) adducts, which are optional additives in the flux of the present embodiment for improving solder wetting and spreading. , amine hydrohalides, and thixotropic agents within the scope defined by the present invention were not inhibited.

Claims (6)

Tris (2-carboxyethyl) isocyanurate, tris (1-carboxymethyl) isocyanurate, tris (3-carboxypropyl) isocyanurate, bis (2-carboxyethyl) isocyanurate, or a combination of two or more Including 0.5 wt% or more and 20.0 wt% or less,
In addition, it contains resins and solvents,
Resin consists of rosin or rosin and acrylic resin,
5.0 wt% or more and 50.0 wt% or less of rosin,
0 wt% or more and 30.0 wt% or less of acrylic resin,
Contains 28.5 wt% or more and 39.0 wt% or less of a solvent,
Furthermore, the amine is more than 0 wt% and 10.0 wt% or less ,
A flux containing 1.0 wt % or more and 5.0 wt % or less of trans-2,3-dibromo-1,4-butenediol or triallyl isocyanurate hexabromide . Tris (2-carboxyethyl) isocyanurate, tris (1-carboxymethyl) isocyanurate, tris (3-carboxypropyl) isocyanurate, bis (2-carboxyethyl) isocyanurate, or a combination of two or more Including 0.5 wt% or more and 20.0 wt% or less,
In addition, it contains resins and solvents,
Resin consists of rosin or rosin and acrylic resin,
5.0 wt% or more and 50.0 wt% or less of rosin,
0 wt% or more and 30.0 wt% or less of acrylic resin,
The ratio of resin and solvent (resin/solvent) is 0.9 or more and 1.58 or less,
Furthermore, the amine is more than 0 wt% and 10.0 wt% or less ,
A flux containing 1.0 wt % or more and 5.0 wt % or less of trans-2,3-dibromo-1,4-butenediol or triallyl isocyanurate hexabromide . Tris (2-carboxyethyl) isocyanurate, tris (1-carboxymethyl) isocyanurate, tris (3-carboxypropyl) isocyanurate, bis (2-carboxyethyl) isocyanurate, or a combination of two or more Including 0.5 wt% or more and 20.0 wt% or less,
In addition, it contains resins and solvents,
Resin consists of rosin or rosin and acrylic resin,
5.0 wt% or more and 50.0 wt% or less of rosin,
0 wt% or more and 30.0 wt% or less of acrylic resin,
Furthermore, the amine is more than 0 wt% and 10.0 wt% or less ,
A flux containing 1.0 wt % or more and 5.0 wt % or less of trans-2,3-dibromo-1,4-butenediol or triallyl isocyanurate hexabromide . 5.0 wt% or more and 30.0 wt% or less of acrylic resin, and the ratio of acrylic resin to rosin (acrylic resin/rosin) is 0.1 or more and 9.0 or less. Flux as described in section. Furthermore, other organic acids other than tris(2-carboxyethyl)isocyanurate, tris(1-carboxymethyl)isocyanurate, tris(3-carboxypropyl)isocyanurate, and bis(2-carboxyethyl)isocyanurate are 0 wt% or more 10.0 wt% or less, 0 wt% or more and 5.0 wt% or less of an amine hydrohalide, and 0 wt% or more and 10.0 wt% or less of a thixotropic agent, according to any one of claims 1 to 4. flux. A solder paste containing the flux according to any one of claims 1 to 5 and metal powder.