JP6544498B1 - Flux and solder paste - Google Patents

Abstract

Provided is a flux and a solder paste using a flux capable of suppressing the generation of voids, improving the wettability of solder in addition to suppressing the generation of voids, and further improving the temperature cycle reliability Do. SOLUTION: Flux includes 5.0 wt% or more and 25.0 wt% or less of acrylic resin, 2.0 wt% or more and 15.0 wt% or less of tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, dimer acid Hydrogenated dimer acid obtained by adding hydrogen to hydrogen, hydrogenated trimer acid obtained by adding hydrogen to trimer acid, or hydrogenated dimer acid obtained by adding hydrogen to dimer acid, trimer acid, dimer acid, or hydrogen to trimer acid Two or more kinds of added hydrogenated trimer acid are contained in an amount of 5.0 wt% to 25.0 wt%, with the balance being the solvent. 【Selection chart】 None

Description

  The present invention relates to a flux used for soldering and a solder paste using the flux.

  In general, the flux used for soldering chemically removes the metal oxides present on the metal surface of the soldering object to be soldered and allows the movement of metal elements at the boundary between the two. Have the effect of For this reason, by soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the bonding object, and a strong bonding can be obtained.

  Solder paste is a composite material obtained by mixing powder of solder alloy and flux. In soldering using solder paste, solder paste is printed on the soldered parts such as electrodes of the substrate, parts are mounted on the soldered part where the solder paste is printed, and the substrate is placed in a heating furnace called a reflow furnace. Heating is performed to melt the solder and soldering is performed.

  Patent Document 1 discloses a hydroiodic acid salt of an organic amine, a six-membered aromatic or alicyclic monocarboxylic acid, a six-membered aromatic or alicyclic dicarboxylic acid, and an imidazole compound. Alternatively, in combination with the carboxylate, reduction of the void area ratio of the heat sink component and evaluation of wetting of the solder to the side surface of the heat sink component are performed.

JP, 2014-117737, A

  However, as the reduction requirement of the void becomes severe, the generation of the void can not be sufficiently suppressed by the improvement of the activity by adding the conventional organic acid, amine and halogen.

  The present invention has been made to solve such problems, and it is an object of the present invention to provide a flux capable of suppressing the generation of voids and a solder paste using the flux.

  In solder paste containing flux and metal powder, the wettability of the solder to joined parts can be improved by adding acrylic resin, tris (2-carboxyethyl) isocyanurate and dimer acids to the flux in a predetermined amount, and It has been found that the generation of voids can be suppressed, and furthermore, the temperature cycle reliability is improved.

Therefore, the present invention provides an acrylic resin in an amount of 5.0 wt% or more and 25.0 wt% or less, tris (2-carboxyethyl) isocyanurate in an amount of 2.0 wt% or more and 15.0 wt% or less, dimer acid, trimer acid, dimer acid Either hydrogenated hydrogenated dimer acid or hydrogenated trimer acid obtained by adding hydrogen to trimer acid, or dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, or hydrogen added to trimer acid and it includes 25.0 wt% or more 5.0 wt% of two or more of the hydrogenated trimer acid below was further viewed contains a solvent, tris (2-carboxyethyl) isocyanurate and dimer acid, trimer acid, hydrogenated dimer acid, water The ratio of one or more of the added trimer acids, or a dimer acid, a trimer acid, a hydrogenated dimer acid, and a hydrogenated trimer acid of 0.1 or more 1 5 is a flux is less than or equal to.

  Further, the flux of the present invention preferably further contains 0 wt% or more and 30.0 wt% or less of rosin, and when the content of rosin is more than 0 wt%, the ratio of acrylic resin to rosin is 0.5 or more to 9. It is preferable that it is 0 or less.

  Furthermore, the flux of the present invention is 0 wt% or more and 10.0 wt% or less of another organic acid, 0 wt% or more and 10.0 wt% or less of a thixotropic agent, and 0 wt% or more of a hindered phenol metal deactivator. 0 wt% or less, 0 wt% to 5.0 wt% of nitrogen compound metal deactivator, 0 wt% to 5.0 wt% of amine, 0 wt% to 5.0 wt% of organic halogen compound content, amine It is preferable to contain 0 wt% or more and 5.0 wt% or less of a hydrohalide salt and 0 wt% or more and 10 wt% or less of another resin.

  Moreover, this invention is a solder paste containing the flux mentioned above and metal powder.

  In the flux of the present invention, a predetermined amount of acrylic resin, tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, water obtained by adding hydrogen to trimer acid Soldering with a reflow furnace using a solder paste containing this flux and metal powder by containing one or two or more of a trimer acid, a dimer acid, a trimer acid, a hydrogenated dimer acid, and a hydrogenated trimer acid To remove oxides that cause non-wetting of the solder and improve the wettability of the solder. In addition, the oxide that causes the void is removed, and the generation of the void can be suppressed. Furthermore, the flux residue becomes a soft residue, and the temperature cycle reliability is improved.

It is the figure which looked at the terminal of the part which verifies solder wettability to the end face of a terminal seen from the front. It is sectional drawing which looked at the terminal of the components which verify solder wettability to the end face of a terminal from the front. It is the figure which looked at the terminal and electrode of the components which inspect solder wettability to the end face of a terminal from the upper surface. It is explanatory drawing which shows the evaluation method of the wettability of the solder with respect to the end surface of a terminal. It is the figure which looked at the terminal of the part which verifies solder wettability to the upper surface of a terminal seen from the front. It is sectional drawing which looked at the terminal of the components which verify solder wettability to the upper surface of a terminal seen from the front. It is the figure which looked at the terminal and electrode of the components which verify solder wettability to the upper surface of a terminal from the upper surface.

<An example of the flux of the present embodiment>
The flux of this embodiment includes acrylic resin, tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, and hydrogenated trimer acid with hydrogen added. The solvent contains any one of trimer acid, dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, hydrogenated trimer acid obtained by adding hydrogen to trimer acid, and a solvent.

  By performing soldering in a reflow furnace using the solder paste containing the flux and metal powder of the present embodiment, oxides that cause non-wetting of the solder are removed, and the wettability of the solder is improved. Moreover, the oxide which is a factor of a void is removed, and generation of a void can be suppressed. Furthermore, the addition of the acrylic resin makes the flux residue a soft residue, and the temperature cycle reliability is improved.

  Acrylic resin is acrylic acid, acrylic acid ester which is a reaction product of acrylic acid and alcohol, methacrylic acid, methacrylic acid ester which is a reaction product of methacrylic acid and alcohol as a monomer, a polymer of acrylic acid, heavy weight of acrylic acid ester And polymers of acrylic acid and acrylic ester, and the like. Further, polymers of methacrylic acid, polymers of methacrylic acid esters, polymers of methacrylic acid and methacrylic acid esters, and the like can be mentioned. Further, polymers of acrylic acid and methacrylic acid, polymers of acrylic acid and methacrylic acid ester, polymers of methacrylic acid and acrylic acid ester, polymers of acrylic acid ester and methacrylic acid ester, acrylic acid and methacrylic acid and acrylic acid Polymers of ester, polymers of acrylic acid, methacrylic acid and methacrylic acid ester, polymers of acrylic acid, methacrylic acid, acrylic acid ester and methacrylic acid ester, polymers of acrylic acid, acrylic acid ester and methacrylic acid ester, methacrylic Examples thereof include polymers of acids, acrylic esters and methacrylic esters. As acrylic acid ester, for example, acrylic acid butyl ester may be mentioned, and as acrylic resin using acrylic acid butyl ester as a monomer, a polymer of acrylic acid butyl ester, acrylic acid ester other than acrylic acid butyl ester and acrylic acid butyl ester Examples thereof include polymers, polymers of acrylic acid and acrylic acid butyl ester, and polymers of acrylic acid and acrylic acid butyl ester other than acrylic acid and acrylic acid butyl ester, and the like. Moreover, as methacrylic acid ester, for example, methacrylic acid butyl ester may be mentioned, and as acrylic resin using methacrylic acid butyl ester as a monomer, polymers of methacrylic acid butyl ester, methacrylic acid esters other than methacrylic acid butyl ester and butyl methacrylate Examples thereof include polymers of esters, polymers of methacrylic acid and methacrylic acid butyl ester, and polymers of methacrylic acid esters and methacrylic acid butyl ester other than methacrylic acid and methacrylic acid butyl ester. Furthermore, polymers of acrylic acid and methacrylic acid butyl ester, polymers of methacrylic acid esters and methacrylic acid butyl ester other than acrylic acid and methacrylic acid butyl ester, polymers of methacrylic acid and acrylic acid butyl ester, methacrylic acid and acrylic acid Polymers of acrylic acid esters and acrylic acid butyl esters other than butyl esters, polymers of acrylic acid butyl esters and methacrylic acid butyl esters, polymers of acrylic acid esters and methacrylic acid butyl esters other than acrylic acid butyl esters, butyl acrylate Polymers of methacrylic acid esters other than ester and methacrylic acid butyl ester, etc. may be mentioned. The polymerization reaction may be random copolymerization, block copolymerization or the like. The above-mentioned alcohol is an alcohol having 1 to 24 carbon atoms in which the carbon chain is linear, or an alcohol having 3 to 24 carbon atoms in which the carbon chain is branched. C1 methanol, C2 ethanol, C3 1-propanol, C3 3 2-propanol, C3 ethylene glycol monomethyl ether, C4 1-butanol, C4 2 -Butanol, isobutanol having 4 carbon atoms, 1-hexanol having 6 carbon atoms, diethylene glycol monoethyl ether having 6 carbon atoms, benzyl alcohol having 7 carbon atoms, 1-octanol having 8 carbon atoms, 2-ethyl hexanol having 8 carbon atoms , Phenyl glycol having 8 carbon atoms, 1-decanol having 9 carbon atoms, lauryl alcohol having 12 carbon atoms, 16 carbon atoms Cetyl alcohol, stearyl alcohol having 18 carbon atoms, oleyl alcohol having 18 carbon atoms, behenyl alcohol and the like having a carbon number of 22.

  Acrylic resin is an essential component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids, and further improves the temperature cycle reliability, and one or more of these are used. can do. The content of the acrylic resin is preferably 5.0 wt% or more and 25.0 wt% or less, and more preferably 10.0 wt% or more and 20.0 wt% or less.

  The weight average molecular weight (Mw) in terms of polystyrene measured by gel permeation chromatography (GPC) of the acrylic resin is preferably 5,000 to 30,000, and the weight average molecular weight (Mw) is 6,000 to 15,000 more preferable.

  As such an acrylic resin, poly 2-ethylhexyl acrylate (Mw = 8300), polylauryl methacrylate (Mw = 10080), etc. may be mentioned. Moreover, as an acrylic resin, the polymer of the acrylic resin mentioned above and other resin may be sufficient, for example, the copolymer of each acrylic resin mentioned above and polyethylene may be sufficient. Examples of such acrylic / polyethylene copolymer resins include poly 2-ethylhexyl acrylate-polyethylene (Mw = 12300).

  Tris (2-carboxyethyl) isocyanurate is a six-membered (six-membered) heterocyclic compound, which is supposed to be soldered in comparison with organic acids such as linear carboxylic acid and branched carboxylic acid. It has heat resistance in the temperature range and functions as an activator during soldering. Tris (2-carboxyethyl) isocyanurate is an essential component in the flux of the present embodiment which improves the wettability of the solder, suppresses the occurrence of voids, and further improves the temperature cycle reliability, The content of -carboxyethyl) isocyanurate is preferably 2.0 wt% or more and 15.0 wt% or less.

  The dimer acid is a dimer in which, for example, oleic acid and linoleic acid are used as monomers. A dimer acid having oleic acid and linoleic acid as monomers has 36 carbon atoms. The trimer acid is a trimer in which, for example, oleic acid and linoleic acid are used as monomers. A trimer acid having oleic acid and linoleic acid as monomers has 54 carbon atoms.

  As dimer acid, trimer acid, hydrogenated dimer acid and hydrogenated trimer acid, dimer acid which is a reaction product of oleic acid and linoleic acid, trimer acid which is a reaction product of oleic acid and linoleic acid, oleic acid and linole A hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reactant of an acid, or a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction of oleic acid and linoleic acid can be mentioned.

  Moreover, as dimer acid, trimer acid, hydrogenated dimer acid and hydrogenated trimer acid, dimer acids other than the reaction product of oleic acid and linoleic acid, trimer acids other than the reaction product of oleic acid and linoleic acid, oleic acid and linole A hydrogenated dimer acid obtained by adding hydrogen to a dimer acid other than the acid reactant or a dimer acid obtained as a reactant of acrylic acid as a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid other than the reactant of oleic acid and linoleic acid Acrylic acid, trimer acid which is a reactant of acrylic acid, dimer acid which is a reactant of methacrylic acid, trimer acid which is a reactant of methacrylic acid, dimer acid which is a reactant of acrylic acid and methacrylic acid, acrylic acid and methacrylic acid Reactants of trimer acid, dimer acid of oleic acid, trimer acid of oleic acid, linoleic acid Resistant dimer acid, trimer acid as a reactant of linoleic acid, dimer acid as a reactant of linolenic acid, trimer acid as a reactant of linolenic acid, dimer acid as a reactant of acrylic acid and oleic acid, acrylic A trimer acid which is a reaction product of acid and oleic acid, a dimer acid which is a reaction product of acrylic acid and linoleic acid, a trimer acid which is a reaction product of acrylic acid and linoleic acid, a dimer acid which is a reaction product of acrylic acid and linolenic acid A trimer acid which is a reaction product of acrylic acid and linolenic acid, a dimer acid which is a reaction product of methacrylic acid and oleic acid, a trimer acid which is a reaction product of methacrylic acid and oleic acid, a reaction product of methacrylic acid and linoleic acid Dimer acid, reaction product of methacrylic acid and linoleic acid Trimer acid, reaction product of methacrylic acid and linolenic acid A trimer acid which is a reaction product of methacrylic acid and linolenic acid, a dimer acid which is a reaction product of oleic acid and linolenic acid, a trimer acid which is a reaction product of oleic acid and linolenic acid, a reaction product of linoleic acid and linolenic acid Dimer acid, trimer acid which is a reaction product of linoleic acid and linolenic acid, hydrogenated dimer acid obtained by adding hydrogen to a dimer acid other than the reaction product of oleic acid and linoleic acid described above, reaction product of oleic acid and linoleic acid Hydrogenated trimer acid etc. which added hydrogen to trimer acid are mentioned.

  Dimer acid, trimer acid, hydrogenated dimer acid and hydrogenated trimer acid improve the wettability of the solder, suppress the generation of voids, and further, the essential components in the flux of the present embodiment which improves the temperature cycle reliability. And one or more of these can be used. The content of the dimer acid, trimer acid, hydrogenated dimer acid and hydrogenated trimer acid is preferably 5.0 wt% or more and 25.0 wt% or less. In addition, dimer acid, trimer acid, hydrogenated dimer acid and hydrogenated trimer acid are generically referred to as dimer acids. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acids (tris (2-carboxyethyl) isocyanurate / dimer acid) is preferably 0.1 or more and 1.5 or less.

  The flux of the present embodiment may contain rosin as a resin other than the acrylic resin. Examples of the rosin include raw material rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw material rosin. Examples of such derivatives include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid modified rosin, phenol modified rosin and α, β unsaturated carboxylic acid modified product (acrylated rosin, maleated rosin, fumarized And rosins, etc., and purified products, hydrides and disproportionates of the polymerized rosins, and purified products, hydrides and disproportionates of the α, β-unsaturated carboxylic acid modified products, and the like.

  Rosin is an optional component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids, and further improves the temperature cycle reliability, and one or more of these are used. can do. The rosin content is preferably 0 wt% or more and 30.0 wt% or less, and more preferably 2.0 wt% or more and 15.0 wt% or less. Moreover, when it contains rosin, it is preferable that the ratio (acrylic resin / rosin) of an acrylic resin and rosin is 0.5 or more and 9.0 or less.

  The flux of the present embodiment may contain other resins besides acrylic resin and rosin. Other resins include terpene resin, modified terpene resin, terpene phenol resin, modified terpene phenol resin, styrene resin, modified styrene resin, xylene resin, modified xylene resin, polyethylene, polypropylene, polyvinyl acetate, polyvinyl alcohol, polyethylene polypropylene It may further comprise at least one or more resins selected from polymers and polyethylene-polyvinyl acetate copolymers. As a modified terpene resin, aromatic modified terpene resin, hydrogenated terpene resin, hydrogenated aromatic modified terpene resin etc. can be used. A hydrogenated terpene phenol resin etc. can be used as a modified terpene phenol resin. As the modified styrene resin, styrene acrylic resin, styrene maleic acid resin and the like can be used. As the modified xylene resin, a phenol modified xylene resin, an alkylphenol modified xylene resin, a phenol modified resol type xylene resin, a polyol modified xylene resin, a polyoxyethylene addition xylene resin, and the like can be used.

  Another resin is an optional component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids, and further improves the temperature cycle reliability, and one or more of these are added. Can be used. The content of the other resin is preferably 0 wt% or more and 10.0 wt% or less.

  The flux of this embodiment is added to tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, hydrogenated trimer acid obtained by adding hydrogen to trimer acid And other active agents may be included. By including other activators, the oxide removal effect can be enhanced.

  Other activators include tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, and hydrogenated trimer acid obtained by adding hydrogen to trimer acid Organic acids, amines, organic halogen compounds, amine hydrohalides and the like can be mentioned.

  Other organic acids include glutaric acid, adipic acid, azelaic acid, eicosane diacid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutyl aniline diglycolic acid, suberic acid, sebacic acid, Thioglycolic acid, phthalic acid, isophthalic acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, trisocyanate isocyanurate 2-Carboxyethyl), glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (hydroxymethyl) butanoic acid, 4-tert-butylbenzoic acid, 2, 3-dihydroxybenzoic acid, 2,4-diethyl glutaric acid, 2 Quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p- anisic acid, palmitic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, and linolenic acid.

  Other organic acids are optional components in the flux of the present embodiment for improving the wettability of the solder, suppressing the generation of voids, and further improving the temperature cycle reliability, and one or two of these are used. The above can be used. The content of the other organic acid is preferably 0 wt% or more and 10.0 wt% or less.

  Examples of amines include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4 -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2 Undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellite 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s- Triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5- Dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazo 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl -S-Triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2- (1-ethyl pentyl) benzimidazole, 2-nonyl benzimidazole, 2- (4-thiazolyl) benzimidazole, benzimidazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2 ') -Hydroxy-3'-tert- Butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-tert-amylphenyl) benzotriazole, 2- (2'-hydroxy-5'-) tert-Octylphenyl) benzotriazole, 2,2'-methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol], 6- (2-benzotriazolyl) -4-tert- Octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, Carboxybenzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] methylbenzotria , 2,2 '-[[(methyl-1H-benzotriazol-1-yl) methyl] imino] bisethanol, 1- (1', 2'-dicarboxyethyl) benzotriazole, 1- (2,2, 3-dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [(1H-benzotriazol-1-yl) methyl] -4-methylphenol, 5-methyl Benzotriazole, 5-phenyltetrazole, polyethylene glycol-polypropylene glycol copolymer having terminal amino groups (terminal diamine PEG-PPG) copolymer, dimethylamine, 1-aminopropane, isopropylamine, trimethylamine, allylamine, n-butylamine, Diethylamine, s c-Butylamine, tert-butylamine, N, N-dimethylethylamine, isobutylamine, cyclohexylamine, aniline, N-methylaniline, diphenylamine, N-isopropylaniline, p-isopropylaniline, 2-aminoethanol, 2- (ethylamino) ) Ethanol, diethanolamine, diisopropanolamine, triethanolamine, N-butyldiethanolamine, triisopropanolamine, N, N-bis (2-hydroxyethyl) -N-cyclohexylamine, N, N, N ', N'-tetrakis (2-hydroxypropyl) ethylenediamine, N, N, N ', N' ', N' '-pentakis (2-hydroxypropyl) diethylenetriamine, alanine, arginine, asparagine, aspartic acid, cyste Hydrochloride, glutamine, glutamic acid, glycine, histidine, isoleucine, leucine, lysine monohydrochloride, methionine, phenylalanine, proline, serine, threonine, tryptophan, tyrosine, valine, β-alanine, γ-aminobutyric acid, δ-aminobutyric acid Herbal acids, ε-aminohexanoic acid, ε-caprolactam, 7-aminoheptanoic acid, dicyandiamide, 1,3-diphenylguanidine, 1,3-di-o-tolylguanidine, tetrakis (2-hydroxydipropyl) ethylenediamine and the like Be

  Amine is an optional component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids and further improves the temperature cycle reliability, and one or more of these are used. can do. The content of the amine is preferably 0 wt% or more and 5.0 wt% or less.

  Examples of the organic halogen compounds include trans-2,3-dibromo-1,4-butenediol which is an organic bromo compound, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3 -Bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, 3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, trans-2,3-dibromo-2-butene-1,4-diol, cis-2,3 Dibromo-2-butene-1,4-diol, 2,3-dichloro-1-propanol, 1,1,2,2-tetrabromoethane, 2,2,2-tri- Lomoethanol, pentabromoethane, carbon tetrabromide, 2,2-bis (bromomethyl) -1,3-propanediol, meso-2,3-dibromosuccinic acid, chloroalkane, chlorinated fatty acid ester, bromide n- Hexadecyltrimethylammonium, 2,2-bis [3,5-dibromo-4- (2,3-dibromopropoxy) phenyl] propane, bis [3,5-dibromo-4- (2,3-dibromopropoxy) phenyl Sulfone, ethylenebispentabromobenzene, 2-chloromethyl oxirane, brominated bisphenol A epoxy resin, tetrabromophthalic acid, bromosuccinic acid and the like. In addition, chlorochloroalkanes which are organic chloro compounds, chlorinated fatty acid esters, hetic acid, hetic acid anhydride and the like can be mentioned. Further, fluorine-based surfactants which are organic fluoro compounds, surfactants having a perfluoroalkyl group, polytetrafluoroethylene and the like can be mentioned.

  The organic halogen compound is an optional component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids, and further improves the temperature cycle reliability, and one or more of these are added. Can be used. The content of the organic halogen compound is preferably 0 wt% or more and 5.0 wt% or less, and more preferably 0 wt% or more and 2.5 wt% or less.

  The amine hydrohalide is a compound obtained by reacting an amine with a hydrogen halide, and includes aniline hydrogen chloride, aniline hydrogen bromide and the like. As the amine of the amine hydrohalide salt, the above-mentioned amine can be used, and ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole and the like can be mentioned, and as the hydrogen halide, chlorine, Examples thereof include bromine, iodine and hydrides of fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride). As such amine hydrohalide, stearylamine hydrochloride, diethylaniline hydrochloride, diethanolamine hydrochloride, 2-ethylhexylamine hydrobromide, pyridine hydrobromide, isopropylamine hydrobromide , Cyclohexylamine hydrobromide, diethylamine hydrobromide, monoethylamine hydrobromide, 1,3-diphenylguanidine hydrobromide, dimethylamine hydrobromide, dimethylamine hydrochloride, rosin amine Hydrobromide, 2-ethylhexylamine hydrochloride, isopropylamine hydrochloride, cyclohexylamine hydrochloride, 2-pipecoline hydrobromide, 1,3-diphenylguanidine hydrochloride, dimethylbenzylamine hydrochloride, hydrazine hydrate Hydrobromide, dimethylcyclohexylamine hydrochloride , Torinylamine hydrobromide, diethylaniline hydrobromide, 2-diethylaminoethanol hydrobromide, 2-diethylaminoethanol hydrochloride, ammonium chloride, diallylamine hydrochloride, diallylamine hydrobromide, mono Ethylamine hydrochloride, monoethylamine hydrobromide, diethylamine hydrochloride, triethylamine hydrobromide, triethylamine hydrochloride, hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine monohydrobromide, hydrazine dihydrobromide Acid salt, pyridine hydrochloride, aniline hydrobromide, butylamine hydrochloride, hexylamine hydrochloride, n-octylamine hydrochloride, dodecylamine hydrochloride, dimethylcyclohexylamine hydrobromide, ethylenediaminedihydrobromide Salt, rosin amine hydrobromide, 2-f Nylimidazole hydrobromide, 4-benzylpyridine hydrobromide, L-glutamic acid hydrochloride, N-methylmorpholine hydrochloride, betaine hydrochloride, 2-pipecoline hydroiodide, cyclohexylamine hydroiodide 1,3-Diphenylguanidine hydrofluoride, diethylamine hydrofluoride, 2-ethylhexylamine hydrofluoride, cyclohexylamine hydrofluoride, ethylamine hydrofluoride, rosin amine hydrogen fluoride And acid salts, cyclohexylamine tetrafluoroborate, dicyclohexylamine tetrafluoroborate and the like. Moreover, it may replace with an amine hydrohalide salt, or it may combine with an amine hydrohalide salt, and a borofluoride may be included, and boro hydrofluoric acid etc. are mentioned as a borofluoride.

  The amine hydrohalide salt is an optional component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids, and further improves the temperature cycle reliability, and one of these or Two or more types can be used. The content of the amine hydrohalide is preferably 0 wt% or more and 5.0 wt% or less, more preferably 0 wt% or more and 1.2 wt% or less.

  The flux of the present embodiment may further contain a thixotropic agent and a metal deactivator.

  Examples of thixotropic agents include wax-type thixotropic agents and amide-type thixotropic agents. Examples of wax-based thixotropic agents include castor hydrogenated oils and the like. Amide-based thixotropic agents include lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-toluenemethaneamide, Aromatic amide, methylenebisstearic acid amide, ethylenebislauric acid amide, ethylenebishydroxystearic acid amide, saturated fatty acid bisamide, methylenebisoleic acid amide, unsaturated fatty acid bisamide, m-xylylene bisstearic acid amide, aromatic bisamide Saturated fatty acid polyamide, unsaturated fatty acid polyamide, aromatic polyamide, substituted amide, methylol stearic acid amide, methylol amide, fatty acid ester Amide, and the like.

  The thixotropic agent is an optional component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids, and further improves the temperature cycle reliability, and one or more of these may be used. It can be used. The content of the thixotropic agent is preferably 0 wt% or more and 10.0 wt% or less.

  Examples of the metal deactivator include hindered phenol metal deactivators, nitrogen compound metal deactivators and the like. As hindered phenol metal deactivators, bis (3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid), N, N′-hexamethylene bis (3- (3, (3, 5-di-tert-butyl-4-hydroxyphenyl) propanamide) etc. are mentioned. Examples of nitrogen compound metal deactivators include N- (2H-1,2,4-triazol-5-yl) salicylamide and the like.

  The metal deactivator is an optional component in the flux of the present embodiment that improves the wettability of the solder, suppresses the generation of voids, and further improves the temperature cycle reliability, and one or two of these are used. More than a species can be used. The content of the metal deactivator is preferably 0 wt% or more and 10.0 wt% or less for the hindered phenol metal deactivator, and 0 wt% or more for the nitrogen compound metal deactivator. It is preferable that it is 0 wt% or less.

  Examples of the solvent include water, ester solvents, alcohol solvents, glycol ether solvents, terpineols and the like. As ester solvents, fatty acid alkyl, butyl stearate, 2-ethylhexyl stearate, isotridecyl stearate, methyl oleate, isobutyl oleate, methyl coconut fatty acid, methyl laurate, isopropyl myristate, isopropyl palmitate, palmitic acid 2 -Ethylhexyl, octyldodecyl myristate and the like can be mentioned. As alcohol solvents, ethanol, industrial ethanol (a mixed solvent obtained by adding methanol and / or isopropyl alcohol to ethanol), isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1, 5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3 -Dimethyl-2,3-butanediol, 1,1,1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2'-oxybis (methylene) bis ( 2-ethyl-1,3-propanediol), 2,2-bis (hydroxymethyl) -1,3-pro Diol, 1,2,6-trihydroxyhexane, bis [2,2,2-tris (hydroxymethyl) ethyl] ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexane Dimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octin-3,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol etc. It can be mentioned. Examples of glycol ether solvents include hexyl diglycol, diethylene glycol mono-2-ethyl hexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether And 1,3-butylene glycol, phenyl glycol, hexylene glycol and the like.

  The solvent is an essential component in the flux of the present embodiment which improves the wettability of the solder, suppresses the generation of voids and further improves the temperature cycle reliability, and one or more of these are used. be able to. The content of the solvent is acrylic resin, tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, hydrogenated trimer acid obtained by adding hydrogen to trimer acid Or the dimer acid, the trimer acid, the hydrogenated dimer acid obtained by adding hydrogen to the dimer acid, or the hydrogenated trimer acid obtained by adding the hydrogen to the trimer acid as the essential components; When included, it is the balance of the content of essential components.

  Furthermore, when any or a combination of an organic acid, an amine, an organic halogen compound, an amine hydrohalide, a thixo agent, a metal deactivator, or a combination thereof is contained in the above-mentioned predetermined content, essential components and optional components thereof The remainder of the content of

<One example of solder paste of the present embodiment>
The solder paste of the present embodiment contains the above-described flux and metal powder. The metal powder is preferably a solder that does not contain Pb, and is Sn alone, or Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-In, or the like. These alloys are composed of solder powder obtained by adding Sb, Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P and the like.

<The effect example of the flux and solder paste of this embodiment>
Hydrogenation of 5.0 wt% to 25.0 wt% of acrylic resin, 2.0 wt% to 15.0 wt% of tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, and dimer acid with hydrogen added Either dimer acid, hydrogenated trimer acid obtained by adding hydrogen to trimer acid, or dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, hydrogenated trimer acid obtained by adding hydrogen to trimer acid In the flux which contains 5.0 wt% or more and 25.0 wt% or less of 2 or more types and the balance is a solvent, and solder paste using this flux, the cause of non-wetting of the solder by soldering in a reflow furnace The oxide which is to be removed is removed, and the wettability of the solder is improved. In addition, the oxide that causes the void is removed, and the generation of the void can be suppressed. Furthermore, the flux residue becomes a soft residue, and the temperature cycle reliability is improved.

  The fluxes of the examples and comparative examples were prepared using the compositions shown in Tables 1 to 4 below, and solder pastes were prepared using this flux to verify solder wettability, temperature cycle reliability, and void suppression properties. . The composition ratio in Tables 1 to 4 is wt% when the total amount of flux is 100.

<Evaluation of solderability>
(1) Verification method As the solder wettability, the solder wettability to the end face of the terminal and the solder wettability to the upper surface of the terminal were evaluated.

  FIG. 1A is a front view of a terminal 10 of a component for verifying solderability to the end face of the terminal, and FIG. 1B is a cross-sectional view of the terminal 10 of a component for verifying solder wettability to the end face of the terminal from the front FIG. 1C is a top view of the terminal 10 and the electrode 100 of the component whose solder wettability to the end face of the terminal is to be verified. Moreover, FIG. 1D is explanatory drawing which shows the evaluation method of the wettability of the solder with respect to the end surface of a terminal.

  The terminal 10 of the component has a width X10 of 0.2 mm and a height Z10 of 0.12 mm as shown in FIG. 1A. In the terminal 10, the plated layer 12 of Cu is formed on the core material 11 of Fe, and the plated layer 13 of Sn-based alloy is formed on the plated layer 12. The thickness of the plating layer 12 is 5 μm on one side. The thickness of the plating layer 13 is 2 μm on one side.

  The composition of the core material 11 is 100 wt% of Fe. In addition, the core material 11 may contain unavoidable impurities other than Fe. The composition of the plating layer 12 is 100 wt% of Cu. The plating layer 12 may contain unavoidable impurities other than Cu. Furthermore, the composition of the plating layer 13 is 3.0 wt% of Ag, 0.5 wt% of Cu, and the balance is Sn. The plating layer 13 may include unavoidable impurities other than Sn, Ag, and Cu.

  The electrode 100 has a length Y100 of 1.25 mm and a width X100 of 0.25 mm. In the electrode 100, the surface of the Cu layer is treated with OSP (Organic Solderability Preservative). The length Y10 of the portion of the terminal 10 in contact with the electrode 100 is 0.5 mm.

  FIG. 2A is a front view of a terminal 20 of a component for verifying solderability with respect to the upper surface of the terminal, and FIG. 2B is a cross-sectional view of the terminal 20 of a component for verifying solderability with respect to the upper surface of the terminal from the front FIG. 2C is a top view of the terminal 20 and the electrode 200 of the component whose solder wettability to the upper surface of the terminal is to be verified.

  As shown in FIG. 2A, the terminal 20 of the component has a width X20 of 0.3 mm and a height Z20 of 0.13 mm. In the terminal 20, the plated layer 22 of Cu is formed on the core material 21 of Fe-based alloy, and the plated layer 23 of Sn-based alloy is formed on the plated layer 22. The thickness of the plating layer 22 is 5 μm on one side. The thickness of the plating layer 23 is 2 μm on one side.

  The composition of the core material 21 is Fe and Ni. In addition, the core material 21 may contain unavoidable impurities other than Fe and Ni. The composition of the plating layer 22 is 100 wt% of Cu. The plating layer 22 may contain unavoidable impurities other than Cu. Further, the composition of the plating layer 23 is 3.0 wt% of Ag, 0.5 wt% of Cu, and the balance is Sn. The plating layer 23 may contain unavoidable impurities other than Sn, Ag, and Cu.

  The electrode 200 has a length Y20 of 0.8 mm and a width X20 of 0.9 mm. In the electrode 200, an OSP process is performed on the surface of the Cu layer. The length Y10 of the portion of the terminal 20 in contact with the electrode 200 is 0.5 mm.

  In the evaluation of the solder wettability to the end face of the terminal 10, a solder paste using the flux described in each example and each comparative example is printed on the electrode 100. The printing thickness is 0.15 mm. After printing solder paste, place the part and perform reflow.

  In the evaluation of the solder wettability on the upper surface of the terminal 20, solder paste using the flux described in each example and each comparative example is printed on the electrode 200. The printing thickness is 0.15 mm. After printing solder paste, place the part and perform reflow.

As the reflow conditions, preheating was performed at a temperature rising rate of 30 ° C./80 sec so that the temperature would be 180 ° C. from 150 ° C. to 80 sec in an N ₂ atmosphere with an oxygen concentration of 1500 ppm. After preheating, the temperature was raised from 180 ° C. to 240 ° C. at a heating rate of 2 ° C./sec. After raising the temperature to 240 ° C., the temperature was maintained and main heating was performed for 40 seconds.

(2) Judgment criteria The evaluation of the solder wettability to the end face of the terminal 10 is as shown in FIG. 1D, and the evaluation of the solder wettability to the end face of the terminal 10 is as shown in FIG. When the state in which the solder (fillet) got wet to H was taken as 100%, it was judged by the ratio of the wetness of the solder to the end face height.
:: Wetting of solder (fillet) not more than 100% of end face height 75% or more ○: Wetting of solder (fillet) not more than 75% of face height 50% or more ×: Wetting of solder (fillet) Less than 50% of end face height

Evaluation of the solder wettability rising to the upper surface of the terminal 20: solder spreads over the entire upper surface of the terminal x: solder does not spread over the entire upper surface of the terminal

<Evaluation of temperature cycle reliability>
(1) Verification Method In the evaluation of the temperature cycle reliability, the flux of the example and the comparative example was applied on a Cu plate to form a residue on the Cu plate. The residue formed on the Cu plate was visually evaluated for the presence or absence of cracking of the residue when 500 cycles of a test of repeating treatment of holding each at -30 ° C and + 110 ° C for 30 minutes were repeated.

(2) Judgment criteria :: No cracks were found in the residue ×: Cracks were found in the residue

<Evaluation of void suppression properties>
(1) Verification method In evaluation of the suppression property of a void, the solder paste using the flux as described in each Example and each comparative example is printed on the electrode of a board | substrate. The printing thickness is 0.12 mm. After the solder paste is printed, a quad flat non-lead package (QFN) is placed and reflow is performed. The QFN is a square having a side length of 8 mm, and the lower electrode is a square having a side length of 5 mm. The conditions for reflow are preheating at 118 ° C. to 200 ° C. for 118 seconds in an N ₂ atmosphere, and then the peak temperature is 247 ° C., and main heating at 220 ° C. or more for 42 seconds is performed. After reflow, the part mounting part is photographed with an X-ray observation device (XVR-160 manufactured by Uni-Height Systems Co., Ltd.), and the number of pixels of the entire lower surface electrode portion of QFN is denominator and the number of pixels of void portion is numerator The void area ratio was calculated by equation (1) as
(Total pixel number of void portion / pixel number of entire electrode portion) × 100 (%) (1)

(2) Judgment criteria O: void area ratio ≦ 15%
X: void area ratio> 15%

<Overall evaluation>
:: Evaluation of solder wettability was ◎ or 、, and both of temperature cycle reliability evaluation and void suppression were ボ イ ド: Evaluation of solder wettability, temperature cycle reliability evaluation, void suppression Any or all were x

  Examples 1 to 3 are different in the kind of acrylic resin, and Example 1 uses poly 2-ethylhexyl acrylate (Mw = 8300) as the acrylic resin within the range defined in the present invention. It contains 0 wt% and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 1 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 1 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%. The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 1, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 2 contains 15.0 wt% of polylauryl methacrylate (Mw = 10080) as an acrylic resin within the range specified in the present invention, and polymerized rosin as the rosin, within the range specified in the present invention. Contains 0 wt%. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 2 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 2 contains succinic acid as another organic acid, 1.0 wt% within the range defined in the present invention, and 2.5 wt% of suberic acid within the range defined in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 2, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 3 contains 15.0 wt% of poly 2-ethylhexyl acrylate-polyethylene as an acrylic resin within the range specified in the present invention, and polymerized rosin as the rosin 3.0 wt% within the range specified in the present invention % Included. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 3 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 3 contains 1.0 wt% of succinic acid as another organic acid in the range specified in the present invention, and 2.5 wt% of suberic acid in the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 3, the wetting and rising of the solder (fillet) was 75% or more of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 4, the acrylic resin is compounded and added at a content within the range specified in the present invention, and as the acrylic resin, 5.0 wt% of poly 2-ethylhexyl acrylate within the range specified in the present invention, 5.0 wt% of polylauryl methacrylate in the range specified in the present invention, 5.0 wt% of poly 2-ethylhexyl acrylate-polyethylene in the range specified in the present invention, total content of acrylic resin Is within the range defined in the present invention, and further, 3.0 wt% of the polymerized rosin as the rosin is included within the range defined in the present invention. The ratio of the total of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 4 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 4 contains 1.0 wt% of succinic acid as another organic acid in the range specified in the present invention, and contains 2.5 wt% of suberic acid in the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 4, even when the acrylic resin is compounded with the content within the range specified in the present invention, the solder (fillet) wet-up is 75% or more of the end face height, and the solder wettability to the end face of the terminal A sufficient effect was obtained for the evaluation of Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Examples 5 to 10, the content of the acrylic resin is the upper limit or the lower limit of the range defined in the present invention, and in Example 5, the poly 2-ethylhexyl acrylate is specified as the acrylic resin in the present invention. The polymer rosin is contained at an upper limit of 25.0 wt% at the upper limit of the above range, and 3.0 wt% as a rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 8.3 within the range specified in the present invention.

  In addition, Example 5 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. It contains 10.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.6 within the range specified in the present invention.

  Furthermore, Example 5 contains succinic acid as another organic acid, 1.0 wt% within the range defined in the present invention, and 2.5 wt% of suberic acid within the range defined in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 5, even when the content of the acrylic resin is the upper limit of the range specified in the present invention, the solder (fillet) wet-up is 50% or more of the end face height, and the evaluation of the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 6 contains 5.0 wt% of poly 2-ethylhexyl acrylate as the acrylic resin at the lower limit of the range defined in the present invention, and 8.0 wt% of the polymerized rosin as the rosin in the range defined in the present invention % Included. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 0.6 within the range specified in the present invention.

  In addition, Example 6 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. In 25.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.2 within the range specified in the present invention.

  Furthermore, Example 6 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 6, even when the content of the acrylic resin is the lower limit of the range specified in the present invention, the solder (fillet) wet-up is 75% or more of the end face height, and the evaluation of the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 7 contains 25.0 wt% of polylauryl methacrylate as the acrylic resin at the upper limit within the range specified in the present invention, and 3.0 wt% of the polymerized rosin as the rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 8.3 within the range specified in the present invention.

  In addition, Example 7 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. It contains 10.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.6 within the range specified in the present invention.

  Furthermore, Example 7 contains succinic acid as another organic acid, 1.0 wt% within the range defined in the present invention, and 2.5 wt% of suberic acid within the range defined in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] may be used as a metal deactivator within the scope defined in the present invention. It contains 5.0 wt% and the remainder is 43.5 wt% in the range specified in the present invention, with hexyl diglycol as a solvent.

  In Example 7, even when the content of the acrylic resin is the upper limit in the range specified in the present invention, the solder (fillet) wet-up is 50% or more of the end face height, and the evaluation of the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 8 contains 5.0 wt% of polylauryl methacrylate as an acrylic resin at the lower limit of the range specified in the present invention, and 8.0 wt% of polymerized rosin as the rosin in the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 0.6 within the range specified in the present invention.

  In addition, Example 8 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. In 25.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.2 within the range specified in the present invention.

  Furthermore, Example 8 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%. The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 8, even when the content of the acrylic resin is the lower limit of the range specified in the present invention, the solder (fillet) wet-up is 75% or more of the end face height, and the evaluation of the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 9 contains 25.0 wt% of poly 2-ethylhexyl acrylate-polyethylene as the acrylic resin at the upper limit within the range defined in the present invention, and polymerized rosin as the rosin 3 within the range defined in the present invention .0 wt% included. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 8.3 within the range specified in the present invention.

  In addition, Example 9 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. It contains 10.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.6 within the range specified in the present invention.

  Furthermore, Example 9 contains 1.0 wt% of succinic acid as another organic acid in the range specified in the present invention, and contains 2.5 wt% of suberic acid in the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. Further, it contains 2.0 wt% of castor hydrogenated oil as an ester-based thixotropic agent within the range defined in the present invention, and 2.0 wt% of an amide-based bisamide-based thixotropic agent within the range defined in the present invention, The total content of thixotropic agents is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 9, even when the content of the acrylic resin is the upper limit in the range specified in the present invention, the solder (fillet) wetting ascent is 75% or more of the end face height, and the evaluation of the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 10 contains 5.0 wt% of poly 2-ethylhexyl acrylate-polyethylene as the acrylic resin at the lower limit of the range specified in the present invention, and polymerized rosin as the rosin, 8 within the range specified in the present invention .0 wt% included. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 0.6 within the range specified in the present invention.

  In addition, Example 10 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. In 25.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.2 within the range specified in the present invention.

  Furthermore, Example 10 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 10, even when the content of the acrylic resin is the lower limit of the range specified in the present invention, the solder (fillet) wet-up evaluation of the solder wettability to the end face of the terminal is at 75% or more of the end face height Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppression property was obtained.

  Examples 11 and 12 are composite addition of rosin at a content within the range specified in the present invention, and Example 11 is within the range specified in the present invention for poly 2-ethylhexyl acrylate as an acrylic resin. In the range specified in the present invention, 0.4 wt% in the range specified in the present invention, and 0. 5% in the range specified in the present invention. 4 wt%, 0.4 wt% of phenol modified rosin within the range defined in the present invention, disproportionated rosin, 0.4 wt% within the range defined in the present invention, hydrogenated rosin, defined in the present invention 0.4 wt% within the specified range, 0.4 wt% within the range specified in the present invention, 0.6 wt% of the rosin ester within the range specified according to the present invention, the total of rosin In the present invention, the content of It is within a constant range. The ratio of the total of acrylic resin and rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 11 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 11 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 11, even when the rosin is added in a composite content within the range specified in the present invention, the solder (fillet) wet-up is 75% or more of the end face height and the solder wettability to the end face of the terminal is Sufficient effects were obtained for the evaluation. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 12 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and acrylic acid modified hydrogenated rosin as a rosin 1 within the range specified in the present invention. .5 wt%, hydrogenated rosin is contained in the range specified in the present invention at 1.5 wt%, and the total content of rosin is in the range specified in the present invention. The ratio of the total of acrylic resin and rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  Further, Example 12 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 12 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] may be used as a metal deactivator within the scope defined in the present invention. It contains 5.0 wt% and the remainder is 43.5 wt% in the range specified in the present invention, with hexyl diglycol as a solvent.

  In Example 12, even when the rosin is added in a composite content within the range specified in the present invention, the solder (fillet) is wetted up to 75% or more of the end face height and has solder wettability to the end face of the terminal. Sufficient effects were obtained for the evaluation. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 13, the content of rosin is increased within the range defined in the present invention, and 15.0 wt% of poly (2-ethylhexyl acrylate) is included as the acrylic resin within the range defined in the present invention, and the rosin is And 10.0 wt% of the polymerized rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 1.5 within the range specified in the present invention.

  Further, Example 13 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. Contains 13.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.5 within the range specified in the present invention.

  Furthermore, Example 13 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%. The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 13, even if the content of rosin is increased within the range specified in the present invention, the solder (fillet) wet-up is 50% or more of the end face height, for evaluation of the solder wettability to the end face of the terminal. A sufficient effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 14 contains no rosin, contains 17.0 wt% of poly (2-ethylhexyl acrylate) as an acrylic resin within the range defined in the present invention, and contains no rosin.

  Further, Example 14 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 14 contains succinic acid as another organic acid, 2.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. % Included. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 14, even when the optional additive rosin is not included, the solder (fillet) wet-up is 75% or more of the end face height, and a sufficient effect can be obtained for the evaluation of the solder wettability to the end face of the terminal. It was done. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppression property was obtained.

  In Example 15, the content of tris (2-carboxyethyl) isocyanurate and dimer acid was increased or decreased within the range defined in the present invention, and poly 2-ethylhexyl acrylate was specified as the acrylic resin according to the present invention. It contains 15.0 wt% within the specified range, and contains 3.0 wt% of the polymerized rosin as rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 15 contains 15.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention Contains 11.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 1.4 within the range specified in the present invention.

  Furthermore, Example 15 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. % Included. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 15, even if the content of tris (2-carboxyethyl) isocyanurate and dimer acid is increased or decreased within the range specified in the present invention, the amount of wetting of the solder (fillet) is 50% or more of the end face height Thus, sufficient effects were obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Examples 16 to 19 differ in the kind and combination of dimer acids, and Example 16 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range defined in the present invention. And 3.0 wt% of rosin as polymerized rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 16 contains 2.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.1 within the range specified in the present invention.

  Furthermore, Example 16 contains succinic acid as another organic acid, 5.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 16, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 17 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 17 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a dimer acid as dimer acids in the range specified in the present invention. .0 wt% included. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 17 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 17, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 18 contains 15 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 18 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and hydrogenated trimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 18 contains succinic acid as another organic acid in an amount specified in the present invention at 1.0 wt%, and suberic acid in an amount specified in the present invention at 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 18, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 19 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 19 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and trimer acid as dimer acids in the range specified in the present invention. .0 wt% included. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 19 contains succinic acid as another organic acid in an amount specified in the present invention at 1.0 wt%, and suberic acid in an amount specified in the present invention at 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 19, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 20, dimer acids are compounded and added at a content within the range specified in the present invention, and 15.0 wt% of poly 2-ethylhexyl acrylate is contained as an acrylic resin within the range specified in the present invention. And 3.0 wt% of rosin as polymerized rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 20 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention. Furthermore, hydrogenated dimer acid as dimer acids, 5.0 wt% within the range defined in the present invention, 5.0 wt% dimer acid within the range defined in the present invention, hydrogenated trimer acid 5.0 wt% of trimer acid in the range specified in the invention, 5.0 wt% in the range specified in the present invention, and the total content of dimer acids is in the range specified in the present invention is there. The ratio of the total of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range defined in the present invention.

  Furthermore, Example 20 contains succinic acid as another organic acid in an amount specified in the present invention at 1.0 wt%, and suberic acid in an amount specified in the present invention at 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 20, even when the dimer acids are compounded with the content within the range specified in the present invention, the solder (fillet) wet-up is 75% or more of the end face height and the solder wettability to the end face of the terminal A sufficient effect was obtained for the evaluation of Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 21 and Example 22, the content of the dimer acid was the upper limit or the lower limit of the range defined in the present invention, and in Example 21, the poly 2-ethylhexyl acrylate as the acrylic resin was specified in the present invention. It contains 10.0 wt% within the specified range, and 3.0 wt% of the polymerized rosin as rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 3.3 within the range specified in the present invention.

  In addition, Example 21 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. The upper limit of 25.0wt% is included. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.2 within the range specified in the present invention.

  Furthermore, Example 21 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 21, even when the content of the dimer acids is the upper limit in the range specified in the present invention, the solder (fillet) wet-up is 75% or more of the end face height, and the evaluation of the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 22 contains 25.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 8.3 within the range specified in the present invention.

  In addition, Example 22 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Containing 5.0 wt% at the lower limit of The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 1.2 within the scope specified in the present invention.

  Furthermore, Example 22 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 5.0 wt% of glutaric acid within the range specified in the present invention, The suberic acid is contained in the range specified in the present invention at 2.5 wt%, and the total content of the other organic acids is in the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 22, even when the content of dimer acids is at the lower limit of the range specified in the present invention, the solder (fillet) wet-up is 50% or more of the end face height, and the evaluation of the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Examples 23 to 25 are different in type of organic acid, and Example 23 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range defined in the present invention, and rosin And 3.0 wt% of the polymerized rosin within the range defined in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 23 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 23 contains glutaric acid as another organic acid in an amount specified in the present invention at 1.0 wt% and suberic acid in an amount specified in the present invention at 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 23, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 24 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 24 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 24 contains 1.0% by weight of diglycolic acid as another organic acid within the range specified in the present invention, and contains 2.5% by weight of suberic acid within the range specified by the present invention. The total content of other organic acids is within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 24, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 25 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 25 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 25 contains 1.0 wt% of adipic acid as another organic acid in the range specified in the present invention, and 2.5 wt% of suberic acid in the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 25, the wetting and rising of the solder (fillet) was at least 75% of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 26 is what combined and added the organic acid by content in the range prescribed | regulated by this invention, and Example 26 poly-ethylhexyl acrylate as an acrylic resin, in the range prescribed | regulated by this invention It contains 15.0 wt% and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 26 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Further, Example 26 is succinic acid as another organic acid, 0.5 wt% within the range defined in the present invention, 0.5 wt% glutaric acid within the range defined in the present invention, diglycol The acid is 0.5 wt% in the range specified in the present invention, 0.5 wt% in the range specified in the present invention, and 0.5 wt% in the range specified in the present invention. The total content of the other organic acids is 5 wt%, and is within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 42.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 26, even when the organic acid is compounded with the content within the range specified in the present invention, the wettability of the solder (fillet) is 75% or more of the end face height, and the solder wettability to the end face of the terminal A sufficient effect was obtained for the evaluation of Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Examples 27 to 29, the content of the organic acid is increased or decreased within the range defined in the present invention, and in Example 27, the range defined in the present invention is poly 2-ethylhexyl acrylate as an acrylic resin. It contains 15.0 wt%, and as the rosin, the polymerized rosin is 3.0 wt% within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 27 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 27 contains 0.5% by weight of diglycolic acid as another organic acid in the range specified in the present invention, and contains 2.5% by weight of suberic acid in the range specified in the present invention The total content of other organic acids is within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 44.0 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 27, even if the content of the organic acid is reduced within the range specified in the present invention, the solder (fillet) wet-up is evaluated at 75% or more of the end face height, the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 28 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 28 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Further, Example 28 contains glutaric acid as another organic acid, 3.0 wt% within the range defined in the present invention, and 2.5 wt% of suberic acid within the range defined in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 28, even if the content of the organic acid is increased within the range specified in the present invention, the solder (fillet) wet-up is evaluated at 75% or more of the end face height, the solder wettability to the end face of the terminal Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 29 contains 11.5 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 3.8 within the range specified in the present invention.

  In addition, Example 29 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 29 contains glutaric acid as another organic acid, 10.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. In the above range, the content is 5.0% by weight, and the balance is hexyl diglycol as a solvent in the range specified in the present invention, 38.0% by weight.

  In Example 29, even if the content of the organic acid is increased within the range specified in the present invention, the solder (fillet) wet-up evaluation of the solder wettability to the end face of the terminal is at 75% or more of the end face height. Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 30, 15.0 wt% of poly 2-ethylhexyl acrylate is contained as an acrylic resin within the range defined in the present invention, and polymerized rosin is defined in the present invention as rosin. Within 3.0 wt% included. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 30 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 15.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.4 within the range specified in the present invention.

  Furthermore, Example 30 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. Further, it contains 5.0 wt% of 2-undecylimidazole as an amine within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 30, even if the amine which is an optional additive is added, the solder (fillet) wet-up is 75% or more of the end face height, and the effect is sufficient for the evaluation of the solder wettability to the end face of the terminal. It was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Examples 31 to 34 have different types of amines, and Example 31 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range defined in the present invention, and as rosin It contains 3.0 wt% of the polymerized rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 31 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 31 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Moreover, 2.0 wt% of 2-phenyl imidazole is contained as an amine within the range prescribed | regulated by this invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 31, the wetting and rising of the solder (fillet) was 75% or more of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 32 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 32 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 32 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Moreover, 2.0 wt% of 2-phenyl imidazolines are included as an amine within the range prescribed | regulated by this invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 32, the wetting and rising of the solder (fillet) was 75% or more of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 33 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  Further, Example 33 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 33 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Further, it contains 2.0 wt% of diethanolamine as an amine within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 33, when the wetting and rising of the solder (fillet) was 75% or more of the end face height, a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 34 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 34 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 34 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. Further, it contains 2.0 wt% of diethylethylenediamine as an amine within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 34, when the solder (fillet) wet-up was 75% or more of the end face height, a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 35, an organic halogen compound is added, and 10.0% by weight of poly 2-ethylhexyl acrylate is contained as an acrylic resin within the range defined in the present invention, and polymerized rosin is specified in the present invention as rosin. The content is 3.0 wt% within the above range. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 3.3 within the range specified in the present invention.

  In addition, Example 35 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 35 contains succinic acid as another organic acid, 1.0 wt% within the range defined in the present invention, and 2.5 wt% of suberic acid within the range defined in the present invention, The total content of other organic acids is within the range specified in the present invention. Further, it contains 5.0% by weight of triallyl isocyanurate hexabromide as the organic halogen compound within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 35, even if the optional additive organic halogen compound is added, the solder (fillet) wet-up is 75% or more of the end face height, which is sufficient for the evaluation of the solder wettability to the end face of the terminal. The effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Examples 36 to 38 are different in the kind of organic halogen compound, and Example 36 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range defined in the present invention, It contains 3.0 wt% of polymerized rosin as rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 36 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Further, Example 36 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, 2.0 wt% of 2,3-dibromo-1,4-butanediol is contained as the organic halogen compound within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 36, even if the type of organic halogen compound is changed, a sufficient effect can be obtained for the evaluation of the solder wettability to the end face of the terminal when the solder (fillet) wet-up is 75% or more of the end face height The Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 37 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  Further, Example 37 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 37 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Moreover, 2.0 wt% of trans-2,3-dibromo-2-butene-1,4-diol is contained as an organic halogen compound within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 37, even when the type of the organic halogen compound is changed, the solder (fillet) wet-up is 75% or more of the end face height, and a sufficient effect is obtained for the evaluation of the solder wettability to the end face of the terminal. The Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 38 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  Further, Example 38 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 38 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Further, it contains 2.0 wt% of triallyl isocyanurate hexabromide as the organic halogen compound within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 41.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 38, even if the type and content of the organic halogen compound are changed, the solder (fillet) wet-up is 75% or more of the end face height, which is sufficient for the evaluation of the solder wettability to the end face of the terminal was gotten. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 39, an amine halogen hydrohalide was added, and 10.0 wt% of poly 2-ethylhexyl acrylate was contained as an acrylic resin within the range specified in the present invention, and polymerized rosin was used as a rosin in the present invention It contains 3.0 wt% within the specified range. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 3.3 within the range specified in the present invention.

  In addition, Example 39 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 39 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, ethylamine · HBr is contained as an amine halogen hydrogen salt in an amount of 5.0 wt% within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 39, even if the amine hydrohalide salt which is an optional additive is added, the solder (fillet) wet-up is 75% or more of the end face height, for the evaluation of the solder wettability to the end face of the terminal. Enough effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 40 and Example 41, the type of amine hydrohalide was changed, and Example 40 contained 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range defined in the present invention. %, And as the rosin, 3.0 wt% of the polymerized rosin is within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 40 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 40 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Further, it contains 1.0 wt% of diphenyl guanidine · HBr as an amine halogen hydrogen salt within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 42.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 40, even if the type of amine hydrohalide is changed, the solder (fillet) wet-up is 75% or more of the end face height, which is sufficient for the evaluation of the solder wettability to the end face of the terminal was gotten. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 41 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 41 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 41 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Further, it contains 1.0 wt% of ethylamine · HBr as an amine halogen hydrogen salt within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 42.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 41, the wettability of the solder (fillet) is 75% or more of the end face height even if the type and the content of the amine hydrohalide salt are changed, for the evaluation of the solder wettability to the end face of the terminal. Sufficient effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Examples 42 to 44, the type and content of the thixotropic agent were changed, and Example 42 was 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range defined in the present invention. It contains 3.0 wt% of a polymerized rosin as a rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 42 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 15.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.4 within the range specified in the present invention.

  Furthermore, Example 42 contains succinic acid as another organic acid in an amount specified in the present invention at 1.0 wt%, and suberic acid in an amount specified in the present invention at 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Further, it does not contain an ester-based thixotropic agent, and contains 10.0% by weight of a bisamide-based thixotropic agent as an amide-based thixotropic agent within the range defined in the present invention. It contains no metal deactivator and contains 47.5 wt% of hexyl diglycol in the range specified in the present invention, using the balance as a solvent.

  In Example 42, even if the type and content of the thixotropic agent are changed, the solder (fillet) wet-up is 75% or more of the end face height, which is sufficient for the evaluation of the solder wettability to the end face of the terminal. It was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 43 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 43 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as dimer acids within the range defined in the present invention. Contains 15.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.4 within the range specified in the present invention.

  Furthermore, Example 43 contains 1.0 wt% of succinic acid as another organic acid in the range specified in the present invention, and contains 2.5 wt% of suberic acid in the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, castor hydrogenated oil as an ester-based thixotropic agent is contained in an amount of 10.0% by weight within the range defined in the present invention, and no amide-based thixotropic agent is contained. In addition, the metal deactivator is not contained, and 47.5 wt% of hexyl diglycol is contained as a solvent in the range specified in the present invention.

  In Example 43, even if the type and content of the thixotropic agent are changed, the solder (fillet) wet-up is 75% or more of the end face height, which is sufficient for the evaluation of the solder wettability to the end face of the terminal. It was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 44 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 44 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. In 25.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.2 within the range specified in the present invention.

  Furthermore, Example 44 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Further, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as a polyamide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. In addition, the metal deactivator is not contained, and 43.5 wt% of hexyl diglycol is contained as a solvent in the range specified in the present invention.

  In Example 44, even if the type and content of the thixotropic agent are changed, the solder (fillet) wet-up is 75% or more of the end face height, and the effect is sufficient for the evaluation of the solder wettability to the end face of the terminal. It was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 45 and Example 46, the content of the metal deactivator was changed, and Example 45 contained 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention. %, And as the rosin, 3.0 wt% of the polymerized rosin is within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 45 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. In 25.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.2 within the range specified in the present invention.

  Furthermore, Example 45 contains succinic acid as another organic acid in an amount specified in the present invention at 1.0 wt%, and suberic acid in an amount specified in the present invention at 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. Further, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixo agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent %, And the total content of the thixotropic agent is within the range defined in the present invention. In addition, the metal deactivator is not contained, and 43.5 wt% of hexyl diglycol is contained as a solvent in the range specified in the present invention.

  In Example 45, even if the optional additive metal deactivator is not included, the solder (fillet) wet-up is 75% or more of the end face height, which is sufficient for the evaluation of the solder wettability to the end face of the terminal. Effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 46 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 46 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 15.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.4 within the range specified in the present invention.

  Further, Example 46 contains succinic acid as another organic acid, 1.0 wt% within the range defined in the present invention, and 2.5 wt% of suberic acid within the range defined in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 10.0 wt% within the above range, and 43.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In Example 46, even if the content of the metal deactivator is increased within the range specified in the present invention, the solder (fillet) wets up to 75% or more of the end face height and solder wets the end face of the terminal. Sufficient effect was obtained for sex evaluation. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Examples 47 to 50, a metal deactivator was compounded and added at a content within the range defined in the present invention, and in Example 47, poly 2-ethylhexyl acrylate was used as an acrylic resin. And 10.0 wt% as a rosin, and 3.0 wt% as rosin according to the invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 3.3 within the range specified in the present invention.

  In addition, Example 47 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 47 contains succinic acid as another organic acid in an amount specified in the present invention at 1.0 wt%, and suberic acid in an amount specified in the present invention at 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. Contained 5.0 wt% of N, N'-hexamethylene bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propanamide] within the scope of the present invention. It contains 5.0 wt%. The remaining portion is a solvent and hexyl diglycol is contained at 43.5 wt% within the range specified in the present invention.

  In Example 47, even when the metal deactivator is added in a composite content within the range specified in the present invention, the solder (fillet) wets up to 75% or more of the end face height relative to the end face of the terminal. A sufficient effect was obtained for the evaluation of solderability. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 48 contains 14.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 4.7 within the range specified in the present invention.

  In addition, Example 48 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 48 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. Contained in the range of 5.0 wt%, and N- (2H-1,2,4-triazol-5-yl) salicylamide as a nitrogen compound metal deactivator was contained in the range specified in the present invention. .0 wt% included. The remaining portion is a solvent and hexyl diglycol is contained at 43.5 wt% within the range specified in the present invention.

  In Example 48, even when the metal deactivator is compounded in a content within the range specified in the present invention, the solder (fillet) wet-up is 75% or more of the end face height, with respect to the end face of the terminal. A sufficient effect was obtained for the evaluation of solderability. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 49 contains 12.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 4.0 within the range specified in the present invention.

  Further, Example 49 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 49 contains succinic acid as another organic acid, 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. N- (2H-1,2,4-triazol-5-yl) salicylamide as a nitrogen compound metal deactivator containing 5.0 wt% of .0 wt% included. The remaining portion is a solvent and hexyl diglycol is contained at 43.5 wt% within the range specified in the present invention.

  In Example 49, even when the metal deactivator is compounded in a content within the range specified in the present invention, the solder (fillet) wets up to 75% or more of the end face height relative to the end face of the terminal. A sufficient effect was obtained for the evaluation of solderability. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 50 contains 10.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and contains 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 3.3 within the range specified in the present invention.

  In addition, Example 50 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 50 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The nitrogen compound metal deactivator N- (2H-1,2,4-triazol-5-yl) salicylamide is contained in the range specified in the present invention. .0 wt% included. The remaining portion is a solvent and hexyl diglycol is contained at 43.5 wt% within the range specified in the present invention.

  In Example 50, even when the metal deactivator is added in a composite content within the range specified in the present invention, the wetting (up) of the solder (fillet) is 75% or more of the end face height to the end face of the terminal. A sufficient effect was obtained for the evaluation of solderability. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 51, the type of solvent was changed, and 15.0 wt% of poly 2-ethylhexyl acrylate was contained as an acrylic resin within the range specified in the present invention, and polymerized rosin was specified in the present invention as rosin. The content is 3.0 wt% within the above range. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Example 51 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Example 51 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and contains suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. In the above range, the content is 5.0 wt%, and the balance is 43.5 wt% in the range specified in the present invention with ethylhexyl diglycol as a solvent.

  In Example 51, even if the type of the solvent was changed, the solder (fillet) wet-up was 75% or more of the end face height, and a sufficient effect was obtained for the evaluation of the solder wettability to the end face of the terminal. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  Example 52 contains other resin and contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range defined in the present invention, and polymerized rosin as the rosin according to the present invention. The content is 3.0 wt% within the above range. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention. In addition, as the other resin, the polyethylene resin is contained at 8.0 wt% within the range defined in the present invention.

  In addition, Example 52 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 12.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.5 within the range specified in the present invention.

  Furthermore, Example 52 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Example 52, even when another resin which is an optional additive is added, the solder (fillet) wet-up is 75% or more of the end face height, which is sufficient for the evaluation of the solder wettability to the end face of the terminal. The effect was obtained. Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  In Example 53, 15.0 wt% of polylauryl methacrylate as an acrylic resin was contained in the range specified in the present invention, and polymerized rosin was specified in the present invention as a rosin. It contains 3.0 wt% within the range. The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention. In addition, polyethylene resin as the other resin, 8.0 wt% in the range specified in the present invention, polypropylene resin, 1.0 wt% in the range specified in the present invention, acid-modified polyethylene resin, the present invention It contains 1.0 wt% within the range specified in The total content of the other resins is within the range specified in the present invention.

  In addition, Example 53 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range specified in the present invention, and a hydrogenated dimer acid as the dimer acid within the range specified in the present invention. Contains 15.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.4 within the range specified in the present invention.

  Further, Example 53 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt%, and suberic acid in an amount specified herein of 2.5 wt%, The total content of other organic acids is within the range specified in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. %, And the total content of the thixotropic agent is within the range defined in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. In the above range, the content is 5.0 wt%, and the balance is hexyl diglycol as a solvent, and 38.5 wt% in the range specified in the present invention.

  In Example 53, even if other resins are added in combination, the solder (fillet) wet-up is 75% or more of the end face height, and a sufficient effect can be obtained for the evaluation of the solder wettability to the end face of the terminal. The Also, the solder wetted and spread over the entire top surface of the terminal, and a sufficient effect was obtained for the evaluation of the solder wettability to the top surface of the terminal. Furthermore, no crack was observed in the residue, and a sufficient effect on temperature cycle reliability was obtained. In addition, when the void area ratio ≦ 15%, a sufficient effect on the void suppressing property was obtained.

  With respect to each Example mentioned above, in Comparative Example 1, it does not contain an acrylic resin, but contains 18.0 wt% of polymer rosin as rosin within the range specified in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is outside the range defined in the present invention because it does not contain acrylic resin.

  In addition, Comparative Example 1 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and a hydrogenated dimer acid as the dimer acid within the range defined in the present invention. Contains 20.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.3 within the range specified in the present invention.

  Furthermore, Comparative Example 1 contains succinic acid as another organic acid in an amount specified in the present invention of 1.0 wt% and suberic acid in an amount specified herein of 2.5 wt%. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. % Included. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Comparative Example 1, an effect was obtained on the evaluation of the solder wettability to the end face of the terminal. In addition, an effect was obtained for the evaluation of the solder wettability to the upper surface of the terminal. However, cracking of the residue was observed, and no effect was obtained on temperature cycle reliability. In addition, when the void area ratio> 15%, no effect was obtained on void suppression.

  Comparative Example 2 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  In addition, Comparative Example 2 contains 0.5 wt% of tris (2-carboxyethyl) isocyanurate below the range specified in the present invention, and the hydrogenated dimer acid as the dimer acid is within the range specified in the present invention. In 25.0 wt%. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 0.02 outside the range specified in the present invention.

  Furthermore, Comparative Example 2 contains succinic acid as another organic acid in the range specified in the present invention at 3.5 wt%, and suberic acid in the range specified in the present invention at 2.5 wt%. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. % Included. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In the comparative example 2, when the wetting up of the solder (fillet) was less than 50% of the end face height, no effect was obtained on the evaluation of the solder wettability to the end face of the terminal. An effect was obtained for the evaluation of solder wettability to the upper surface of the terminal. In addition, an effect was obtained on temperature cycle reliability. Moreover, the effect was acquired with respect to the suppression property of a void.

  Comparative Example 3 contains 20.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 6.7 within the range specified in the present invention.

  In addition, Comparative Example 3 contains 15.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, a hydrogenated dimer acid as dimer acids, and a range defined in the present invention. Below 3.0 wt% included. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is 5.0 outside the range specified in the present invention.

  Furthermore, Comparative Example 3 contains succinic acid as another organic acid at 1.0 wt% within the range defined in the present invention and 2.5 wt% of suberic acid within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. % Included. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. It contains 5.0 wt% within the above range, and 46.5 wt% hexyl diglycol as the solvent within the range specified in the present invention.

  In the comparative example 3, the effect was acquired with respect to evaluation of the solder wettability with respect to the end surface of a terminal. However, no effect was obtained for the evaluation of the solder wettability to the upper surface of the terminal. Moreover, an effect was obtained on temperature cycle reliability. Moreover, the effect was acquired with respect to the suppression property of a void.

  Comparative Example 4 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and 3.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 5.0 within the range specified in the present invention.

  Moreover, the comparative example 4 does not contain tris (2-carboxyethyl) isocyanurate, and contains 20.0 wt% of hydrogenated dimer acids as dimer acids in the range prescribed | regulated by this invention. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is defined in the present invention as it does not contain tris (2-carboxyethyl) isocyanurate It is out of range.

  Furthermore, Comparative Example 4 contains succinic acid as another organic acid, 7.0 wt% within the range defined in the present invention, and 2.5 wt% of suberic acid within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. % Included. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Comparative Example 4, no effect was obtained on the evaluation of the solder wettability to the end face of the terminal. In addition, no effect was obtained on the evaluation of the solder wettability to the upper surface of the terminal. An effect was obtained on temperature cycle reliability. Moreover, the effect was acquired with respect to the suppression property of a void.

  Comparative Example 5 contains 15.0 wt% of poly 2-ethylhexyl acrylate as an acrylic resin within the range specified in the present invention, and 23.0 wt% of a polymerized rosin as rosin within the range specified in the present invention . The ratio of acrylic resin to rosin (acrylic resin / rosin) is 0.7 outside the range specified in the present invention.

  Further, Comparative Example 5 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and does not contain dimer acids. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is outside the range defined in the present invention because it does not contain dimer acids.

  Furthermore, Comparative Example 5 contains succinic acid as another organic acid at 1.0 wt% within the range defined in the present invention and 2.5 wt% of suberic acid within the range defined in the present invention. In addition, it contains 2.0 wt% castor hydrogenated oil as an ester-based thixotropic agent within the range specified in the present invention, and 2.0 wt-% within the range specified in the present invention as bisamide-based thixo agent as an amide-based thixo agent. % Included. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Comparative Example 5, no effect was obtained on the evaluation of the solder wettability to the end face of the terminal. In addition, no effect was obtained on the evaluation of the solder wettability to the upper surface of the terminal. An effect was obtained on temperature cycle reliability. Moreover, the effect was acquired with respect to the suppression property of a void.

  Comparative Example 6 does not contain an acrylic resin, and contains 38.0 wt% of polymerized rosin as a rosin beyond the range defined in the present invention. The ratio of acrylic resin to rosin (acrylic resin / rosin) is outside the range defined in the present invention because it does not contain acrylic resin.

  Further, Comparative Example 6 contains 6.0 wt% of tris (2-carboxyethyl) isocyanurate within the range defined in the present invention, and does not contain dimer acids. The ratio of tris (2-carboxyethyl) isocyanurate to dimer acid (tris (2-carboxyethyl) isocyanurate / dimer acid) is outside the range defined in the present invention because it does not contain dimer acids.

  Furthermore, Comparative Example 6 contains succinic acid as another organic acid at 1.0 wt% within the range specified in the present invention, and 2.5 wt% of suberic acid within the range specified in the present invention. Further, it contains 2.0 wt% of castor hydrogenated oil as an ester-based thixo agent within the range specified in the present invention, and 2.0 wt% of an amide bisamide-based thixo agent within the range specified in the present invention. Furthermore, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (oxyethylene)] is defined in the present invention as a hindered phenolic metal deactivator. The content is 5.0 wt% within the above range, and the remainder is 43.5 wt% within the range specified in the present invention, using hexyl diglycol as a solvent.

  In Comparative Example 6, an effect was obtained on the evaluation of the solder wettability to the end face of the terminal. In addition, an effect was obtained for the evaluation of the solder wettability to the upper surface of the terminal. However, no effect was obtained on temperature cycle reliability. In addition, no effect was obtained on void suppression.

  From the above, 5.0 wt% or more and 25.0 wt% or less of acrylic resin, 2.0 wt% or more and 15.0 wt% or less of tris (2-carboxyethyl) isocyanurate, dimer acid, trimer acid, hydrogen to dimer acid Either hydrogenated dimer acid added with hydrogen or hydrogenated trimer acid obtained by adding hydrogen to trimer acid, or dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, hydrogen added to trimer acid With a flux containing 5.0 wt% or more and 25.0 wt% or less of hydrogenated trimer acid and the balance being a solvent, the oxide removal effect is enhanced in a desired temperature range.

  As a result, in the solder paste using this flux, the oxide that causes the non-wetting of the solder is removed, and the wettability of the solder is improved. Moreover, the oxide which is a factor of a void was removed, and it was able to control generation of a void. Furthermore, the addition of the acrylic resin made it possible to suppress the generation of cracks in the residue due to the flexibility of the flux residue and temperature cycling.

  These effects include rosins, acrylic resins and resins other than rosins which are optional additives, tris (2-carboxyethyl) isocyanurate and other organic acids other than dimer acids, amines, organic halogen compounds, amine halides The inclusion of a hydrogen salt, a thixotropic agent, and a metal deactivator within the scope defined in the present invention was not inhibited.

Claims (8)

5.0 wt% or more and 25.0 wt% or less of acrylic resin,
2.0 wt% or more and 15.0 wt% or less of tris (2-carboxyethyl) isocyanurate,
Any of dimer acid, trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, hydrogenated trimer acid obtained by adding hydrogen to trimer acid, or hydrogenation obtained by adding hydrogen to dimer acid, trimer acid, or dimer acid dimer acid comprises less 25.0 wt% of two or more than 5.0 wt% of the hydrogenated trimer acid in which hydrogen is added to trimer acid, further look-containing solvent,
Any of tris (2-carboxyethyl) isocyanurate and dimer acid, trimer acid, hydrogenated dimer acid, hydrogenated trimer acid, or two or more of dimer acid, trimer acid, hydrogenated dimer acid, hydrogenated trimer acid The ratio of flux is 0.1 or more and 1.5 or less . The flux according to claim 1, further comprising 0 wt% or more and 30.0 wt% or less of rosin . The flux according to claim 2 , wherein when the content of rosin is more than 0 wt%, the ratio of the acrylic resin to the rosin is 0.5 or more and 9.0 or less . Furthermore, 0 wt% or more and 10.0 wt% or less of another organic acid and 0 wt% or more and 10.0 wt% or less of a thixotropic agent
Flux according to any one of claims 1 to 3. Furthermore, 0 wt% or more and 10.0 wt% or less of a hindered phenol metal deactivator and 0 wt% or more and 5.0 wt% or less of a nitrogen compound metal deactivator are included. The flux described in. Furthermore, 0 wt% or more and 5.0 wt% or less of an amine, 0 wt% or more and 5.0 wt% or less of an organic halogen compound content, and 0 wt% or more and 5.0 wt% or less of an amine hydrohalide salt. The flux as described in any one of 5. The flux according to any one of claims 1 to 6, further comprising 0 wt% or more and 10 wt% or less of another resin . A flux according to any one of claims 1 to 7 and metal powder.
Solder paste.

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