JP2020163456A - Flux and solder paste - Google Patents

Abstract

To provide a flux which is excellent in compatibility and is excellent in temperature cycle reliability, and a solder paste containing the flux and metallic powder.SOLUTION: A flux contains an acrylic resin having a number average molecular weight of 500 or more and less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer, a polyethylene-based resin or a polypropylene-based resin, or a polyethylene-based resin and a polypropylene-based resin. The flux contains an acrylic resin having a weight average molecular weight of 500 or more and less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer, a polyethylene-based resin or a polypropylene-based resin, or a polyethylene-based resin and a polypropylene-based resin.SELECTED DRAWING: None

Description

The present invention relates to a flux used for soldering and a solder paste using this flux.

Generally, the flux used for soldering chemically removes metal oxides present on the metal surface of the solder and the object to be soldered, allowing the movement of metal elements at the boundary between the two. Has the effect of soldering. Therefore, by performing soldering using flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be bonded, and a strong bond can be obtained.

Solder paste is a composite material obtained by mixing solder alloy powder and flux. In soldering using solder paste, the solder paste is printed on the soldering parts such as the electrodes of the board, the parts are mounted on the soldering part on which the solder paste is printed, and the board is placed in a heating furnace called a reflow furnace. Soldering is performed by heating to melt the solder.

In the conventional flux, a technique has been proposed in which a polymer acrylic resin is contained to give flexibility to the residue and ensure the reliability of the temperature cycle (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2010-515576

However, a high molecular weight acrylic resin called a polymer has poor compatibility with an activator. Therefore, when a high molecular weight acrylic resin is applied to the flux, the acrylic resin and the activator are separated in the flux, which may affect the solder wettability. Further, the high molecular weight acrylic resin has poor compatibility with the rosin resin. Therefore, when the high molecular weight acrylic resin is applied to the flux containing the rosin resin, the acrylic resin and the rosin resin may be separated in the flux and the residue may be stratified. When the residue is stratified, cracks are likely to occur in the temperature cycle, and even if the acrylic resin is contained, the reliability of the temperature cycle is lowered.

The present invention has been made to solve such a problem, and is a flux having excellent compatibility with an activator and a rosin-based resin, excellent temperature cycle reliability, and excellent solder wettability, and this flux. It is an object of the present invention to provide a solder paste using.

Acrylic resin with a number average molecular weight of 500 or more and less than 2000 by mass spectrometry using a flight time type mass spectrometer, acrylic resin with a weight average molecular weight of 500 or more and less than 2000 by mass spectrometry using a flight time type mass spectrometer It has been found that the resin has excellent compatibility with the activator, and that the acrylic resin having the above-mentioned molecular weight and the polyethylene resin and the polypropylene resin have excellent temperature cycle properties.

Therefore, in the present invention, an acrylic resin having a number average molecular weight of 500 or more and less than 2000 by a mass analysis method using a time-of-flight mass analyzer, a polyethylene resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin It is a flux containing (also referred to as polyethylene / polypropylene resin) and a solvent.

Further, the present invention relates to an acrylic resin having a weight average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer, a polyethylene resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin. And a flux containing a solvent.

The flux of the present invention is the weight of one kind of acrylic resin or the total weight of two or more kinds of acrylic resins, the weight of one kind of polyethylene resin or polypropylene resin, or two or more kinds of polyethylene resins. Alternatively, the ratio (acrylic resin / polyethylene / polypropylene resin) to the total weight of the polypropylene resin, or the polyethylene resin and the polypropylene resin is preferably 1.0 or more and 120.0 or less. The weight ratio of the acrylic resin and the polyethylene / polypropylene resin described above is more preferably 2.0 or more and 100.0 or less, and further preferably 4.0 or more and 30.0 or less.

Further, it is preferable that the acrylic resin is 7.0 wt% or more and 50.0 wt% or less, the polyethylene resin or polypropylene resin, or the polyethylene resin and polypropylene resin is 0.1 wt% or more and 10.0 wt% or less. The content of the acrylic resin is preferably 7.0 wt% or more and 35.0 wt% or less, and most preferably 10.0 wt% or more and 30.0 wt% or less.

Acrylic resin with a number average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer, acrylic resin with a weight average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer The resin is also excellent in compatibility with the rosin-based resin. Therefore, the flux of the present invention may contain a rosin-based resin, and preferably contains 0 wt% or more and 30.0 wt% or less of the rosin-based resin. The content of the rosin-based resin is most preferably 2.0 wt% or more and 15.0 wt% or less.

The flux of the present invention further contains an activator, and the activator includes one or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide.

The flux of the present invention is a dimer acid which is a dimer of a reaction product of a monocarboxylic acid, a hydrogenated dimer acid obtained by adding hydrogen to the dimer acid, and a trimmer which is a trimer of a reaction product of a monocarboxylic acid as an organic acid. Either acid or hydrogenated trimeric acid obtained by adding hydrogen to trimeric acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimeric acid of 0 wt% or more and 25.0 wt% or less, dimer acid. , It is preferable to contain 0 wt% or more and 15.0 wt% or less of organic acids other than hydrogenated dimer acid, trimer acid and hydrogenated trimer acid. In addition, any one of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid, and one or more kinds. The total content of the other organic acids is preferably 30.0 wt% or less.

The flux of the present invention contains 0 wt% or more and 10.0 wt% or less for amines, 0 wt% or more and 5.0 wt% or less for organic halogen compounds, 0 wt% or more and 2.0 wt% or less for amine halide hydrolates, and 0 wt% for thixo agents. It is preferable to contain% or more and 10.0 wt% or less. The content of the organic halogen compound is preferably 0 wt% or more and 2.5 wt% or less, and the content of the amine hydrohalide is preferably 0 wt% or more and 1.2 wt% or less. The flux of the present invention further preferably contains 0 wt% or more and 10.0 wt% or less of the hindered phenol-based metal inactivating agent and 0 wt% or more and 5.0 wt% or less of the nitrogen compound-based metal inactivating agent. And the rest is the solvent.

Further, the present invention is a solder paste containing the above-mentioned flux and metal powder.

Metal powder
As: 25 to 300 mass ppm, and Sb: more than 0 mass ppm and less than 3000 mass ppm, Bi: more than 0 mass ppm and less than 10000 mass ppm, and Pb: more than 0 mass ppm and less than 5100 mass ppm, and the balance It has an alloy composition consisting of Sn and satisfies the following equations (1) and (2).
275≤2As + Sb + Bi + Pb ... (1)
0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2)
In the above equations (1) and (2), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

Further, the alloy composition satisfies the following equation (1a).
275 ≦ 2As + Sb + Bi + Pb ≦ 25200 ... (1a)
In the above number (1a) formula, As, Sb, Bi, and Pb each represent the content (mass ppm) in the above alloy composition.

Further, the alloy composition satisfies the following equation (1b).
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 ... (1b)
In the above formula (1b), As, Bi, and Pb each represent the content (mass ppm) in the above alloy composition.

Further, the alloy composition satisfies the following equation (2a).
0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2a)
In the above formula (2a), As, Sb, Bi, and Pb each represent the content (mass ppm) in the above alloy composition.

Further, the alloy composition contains at least one of Ag: 0 to 4% by mass and Cu: 0 to 0.9% by mass.

In the present invention, an acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), or a time-of-flight mass spectrometer (TOF-MS). ) Is an acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000, or a number average molecular weight (Mn) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). And the flux containing an acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000, a polyethylene resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin has excellent temperature cycle reliability and is cured after heating. Cracking of the resulting flux residue is suppressed.

In addition, the acrylic resin having the above-mentioned molecular weight has excellent compatibility with the activator, and the solder wettability is improved. Further, the acrylic resin having the above-mentioned molecular weight has excellent compatibility with the rosin resin, and when the flux contains the rosin resin, the rosin resin and the acrylic resin become non-uniform and stratified. Is suppressed.

Thereby, the flux of the present invention can be used in the solder paste to make the residue flexible and prevent the residue from cracking. Further, when a rosin-based resin is contained, it is possible to suppress the stratification of the residue. Further, in the solder paste containing the metal powder having the alloy composition described above, in addition to the temperature cycle reliability of the flux residue, a sufficient effect on the thickening suppressing effect of the solder paste can be obtained.

<Example of flux of this embodiment>
The flux of the present embodiment is an acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time of flight mass spectrometer (TOF-MS), and polyethylene. Includes based resin or polypropylene based resin, polyethylene resin, polypropylene resin, and solvent.

The flux of the present embodiment includes an acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000 by a mass analysis method using a time-of-flight mass analyzer (TOF-MS), and a polyethylene resin or polypropylene. It contains a based resin, a polyethylene resin, a polypropylene resin, and a solvent.

Here, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) are the number average molecular weight (Mn) and the weight average molecular weight (Mw). ) Is about 1.00 or more and 1.30 or less, and the number average molecular weight (Mn) obtained by the above method and the weight average molecular weight (Mw) substantially match.

Therefore, the flux of the present embodiment is an acrylic resin having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). , Polyethylene resin or polypropylene resin, or polyethylene resin, polypropylene resin, and solvent.

Acrylic resins having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) are so-called acrylic oligomers. The acrylic resin is a polymer of acrylic acid and a weight of acrylic acid ester, using acrylic acid, acrylic acid ester which is a reaction product of acrylic acid and alcohol, methacrylic acid, and methacrylic acid ester which is a reaction product of methacrylic acid and alcohol as a monomer. Examples thereof include coalescence, a polymer of acrylic acid and acrylic acid ester. Examples thereof include a polymer of methacrylic acid, a polymer of methacrylic acid ester, and a polymer of methacrylic acid and methacrylic acid ester. Further, a polymer of acrylic acid and methacrylic acid, a polymer of acrylic acid and methacrylic acid ester, a polymer of methacrylic acid and methacrylic acid ester, a polymer of acrylic acid ester and methacrylic acid ester, a polymer of acrylic acid, methacrylic acid and acrylic acid. Ester polymer, acrylic acid, methacrylic acid, and methacrylic acid ester polymer, acrylic acid, methacrylic acid, acrylic acid ester, and methacrylic acid ester polymer, acrylic acid, methacrylic acid ester, and methacrylic acid ester polymer, methacrylic acid. Examples thereof include a polymer of an acid, an acrylic acid ester and a methacrylic acid ester. Examples of the acrylate ester include butyl acrylate, and examples of the acrylate resin using butyl acrylate as a monomer include a polymer of butyl acrylate, an acrylate other than butyl acrylate, and butyl acrylate. Examples thereof include a polymer, a polymer of acrylate and butyl acrylate, a polymer of acrylate and butyl acrylate other than acrylate and butyl acrylate, and the like. Examples of the methacrylic acid ester include butyl methacrylic acid ester, and examples of the acrylic resin using the butyl methacrylic acid ester as a monomer include a polymer of butyl methacrylate ester, a methacrylic acid ester other than the butyl methacrylic acid ester, and butyl methacrylate. Examples thereof include a polymer of an ester, a polymer of a methacrylate and a butyl methacrylate ester, and a polymer of a methacrylate ester and a butyl methacrylate ester other than the methacrylate and the butyl methacrylate ester. Further, a polymer of acrylic acid and butyl methacrylate ester, a polymer of methacrylic acid ester and butyl methacrylate ester other than acrylic acid and butyl methacrylate ester, a polymer of methacrylic acid and butyl acrylate ester, methacrylic acid and acrylic acid. Polymers of acrylic acid ester and butyl acrylate ester other than butyl ester, polymer of butyl ester of acrylic acid and butyl methacrylate ester, polymer of acrylic acid ester and butyl methacrylate ester other than butyl ester of acrylic acid, butyl acrylate Examples thereof include a polymer of a methacrylate ester other than the ester and the butyl methacrylate ester. The polymerization reaction may be random copolymerization, block copolymerization or the like. Further, the above-mentioned alcohol is an alcohol having 1 to 24 carbon atoms having a linear carbon chain, or an alcohol having 3 to 24 carbon atoms having a branched carbon chain. Methanol with 1 carbon, ethanol with 2 carbons, 1-propanol with 3 carbons, 2-propanol with 3 carbons, ethylene glycol monomethyl ether with 3 carbons, 1-butanol with 4 carbons, 2 with 4 carbons -Butanol, isobanol with 4 carbons, 1-hexanol with 6 carbons, diethylene glycol monoethyl ether with 6 carbons, benzyl alcohol with 7 carbons, 1-octanol with 8 carbons, 2-ethylhexanol with 8 carbons , 8 carbon phenyl glycol, 9 carbon 1-decanol, 12 carbon lauryl alcohol, 16 carbon cetyl alcohol, 18 carbon stearyl alcohol, 18 carbon oleyl alcohol, 22 carbon behenyl alcohol, etc. Can be mentioned. Examples of such acrylic resins include acrylic acid butyl ester oligomer, acrylic acid alkyl ester oligomer, methacrylate butyl ester oligomer, methacrylate isotridecanol ester oligomer, acrylic acid / acrylic acid butyl ester copolymer oligomer, and butyl acrylate. Examples thereof include ester-polyethylene copolymer oligomers, and one or more of these can be used.

Examples of the polyethylene (PE) -based resin include polyethylene resin, acid-modified polyethylene resin, and polyethylene oxide resin. Examples of the polypropylene (PP) -based resin include polypropylene resin, acid-modified polypropylene resin, and polypropylene oxide resin. As the polyethylene-based resin and polypropylene-based resin, one or more of these can be used. The polyethylene-based resin and polypropylene-based resin may be a copolymer of the above-mentioned polyethylene-based resin and polypropylene-based resin.

The flux of the present embodiment is an acrylic resin having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 by a mass analysis method using a flight time type mass analyzer (TOF-MS). It contains 0 wt% or more and 50.0 wt% or less, polyethylene resin or polypropylene resin, or polyethylene resin and polypropylene resin in an amount of 0 wt% or more and 10.0 wt% or less. Further, the flux of the present embodiment is the weight of one kind of acrylic resin or the total weight of two or more kinds of acrylic resins, the weight of one kind of polyethylene resin or polypropylene resin, or two or more kinds. The ratio (acrylic resin / polyethylene / polypropylene resin) to the total weight of the polyethylene resin or the polypropylene resin, or the polyethylene resin and the polypropylene resin is preferably 1.0 or more and 120.0 or less. .. The weight ratio of the acrylic resin to the polyethylene / polypropylene resin is more preferably 2.0 or more and 100.0 or less, and further preferably 4.0 or more and 30.0 or less. The content of the acrylic resin is preferably 7.0 wt% or more and 35.0 wt% or less, and most preferably 10.0 wt% or more and 30.0 wt% or less.

The flux of the present embodiment may contain a rosin-based resin. Examples of the rosin-based resin include raw material rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw material rosin. Examples of the derivative include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid-modified rosin, phenol-modified rosin and α, β-unsaturated carboxylic acid-modified products (acrylicized rosin, maleated rosin, and fumarized products). (Rosin, etc.), and purified products, hydrogenated products and disproportionated products of the polymerized rosin, and purified products, hydrogenated products and disproportionated products of the α, β unsaturated carboxylic acid modified products, and one of them or Two or more types can be used.

The flux of the present embodiment contains 0 wt% or more and 30.0 wt% or less of the rosin-based resin. The content of the rosin-based resin is most preferably 2.0 wt% or more and 15.0 wt% or less.

The flux of the present embodiment further contains an activator, and the activator contains one or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide.

The flux of the present embodiment may further contain a thixo agent, a hindered phenol-based metal inactivating agent, and a nitrogen compound-based metal inactivating agent.

Organic acids include dimer acid, which is a reaction product of monocarboxylic acid and is a dimer, hydrogenated dimer acid, which is a reaction product of dimer acid with hydrogen added, and trimeric acid and trimeric acid, which are trimeric compounds of monocarboxylic acid. Hydrogenated trimeric acid to which hydrogen is added can be mentioned, and examples of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid include dimer acid, which is a reaction product of oleic acid and linoleic acid, and reaction of oleic acid and linoleic acid. Hydrogenated dimer acid obtained by adding hydrogen to dimer acid which is a reaction product of trimeric acid, oleic acid and linoleic acid, or hydrogenated trimeric acid obtained by adding hydrogen to trimeric acid which is a reaction product of oleic acid and linoleic acid, etc. Can be mentioned.

The dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid include dimer acid other than the reaction product of oleic acid and linoleic acid, trimer acid other than the reaction product of oleic acid and linoleic acid, and oleic acid and linole. Dimeric acid, which is a reaction product of acrylic acid, as hydrogenated dimer acid obtained by adding hydrogen to dimer acid other than the reaction product of acid or hydrogenated trimer acid obtained by adding hydrogen to trimer acid other than the reaction product of oleic acid and linoleic acid. , Trimeric acid which is a reaction product of acrylic acid, Dimeric acid which is a reaction product of methacrylic acid, Trimmer acid which is a reaction product of methacrylic acid, Dimeric acid which is a reaction product of acrylic acid and methacrylic acid, Dimeric acid which is a reaction product of acrylic acid and methacrylic acid, Reactant trimeric acid, oleic acid reaction product dimer acid, oleic acid reaction product trimer acid, linoleic acid reaction product dimer acid, linoleic acid reaction product trimer acid, linolenic acid Reaction of dimer acid, which is a reaction product, trimeric acid, which is a reaction product of linolenic acid, dimer acid, which is a reaction product of acrylic acid and oleic acid, trimer acid, which is a reaction product of acrylic acid and oleic acid, and reaction of acrylic acid and linoleic acid. Dimeric acid, which is a reaction product of acrylic acid and linoleic acid, trimeric acid, which is a reaction product of acrylic acid and linolenic acid, dimer acid, which is a reaction product of acrylic acid and linolenic acid, trimeric acid, which is a reaction product of acrylic acid and linolenic acid, and methacrylic acid and oleic acid. Dimeric acid, which is a reaction product of methacrylic acid, trimeric acid, which is a reaction product of methacrylic acid and oleic acid, dimer acid, which is a reaction product of methacrylic acid and linoleic acid, trimer acid, which is a reaction product of methacrylic acid and linoleic acid, and methacrylic acid. Dimeric acid, which is a reaction product of linolenic acid, trimeric acid, which is a reaction product of methacrylic acid and linolenic acid, dimer acid, which is a reaction product of oleic acid and linolenic acid, trimeric acid, which is a reaction product of oleic acid and linolenic acid, and linole. Dimeric acid, which is a reaction product of acid and linolenic acid, trimeric acid, which is a reaction product of linoleic acid and linolenic acid, and hydrogenated dimer acid and olein obtained by adding hydrogen to dimer acids other than the above-mentioned reaction product of oleic acid and linolenic acid. Examples thereof include hydrogenated trimeric acid obtained by adding hydrogen to trimeric acid other than the reaction product of acid and linoleic acid.

As the dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, one or more of these can be used. The contents of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid are one or more of other organic acids, amines, organic halogen compounds, and amine halide hydrolates. When it is included within the range specified in the above, it is preferably 0 wt% or more and 25.0 wt% or less. The content of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid exceeds 0 wt% when none of other organic acids, amines, organic halogen compounds, or amine hydrohalide is contained. It is preferably 25.0 wt% or less. The content of one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid is more preferably 1.0 wt% or more and 25.0 wt% or less, still more preferably 3.0 wt%. It is 25.0 wt% or less, and most preferably 5.0 wt% or more and 25.0 wt% or less.

Other organic acids other than dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid include glutaric acid, adipic acid, azelaic acid, eicosandioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, and diglycol. Acids, dipicolinic acid, dibutylaniline diglycolic acid, suberic acid, sebacic acid, thioglycolic acid, phthalic acid, isophthalic acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, fumaric acid, malein Acid, malonic acid, lauric acid, benzoic acid, tartrate, tris isocyanurate (2-carboxyethyl), glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (Hydroxymethyl) butanoic acid, 4-tert-butyl benzoic acid, 2,3-dihydroxybenzoic acid, 2,4-diethylglutaric acid, 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid , Palmitic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, linolenic acid and the like.

As the other organic acid, one or more of these can be used. As the content of other organic acids, one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, amine, organic halogen compound, and amine hydrohalide are used in the present invention. When it is included within the range specified in the above, it is preferably 0 wt% or more and 15.0 wt% or less. The content of other organic acids is more than 0 wt% when none of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, amine, organic halogen compound, or amine hydrohalide is contained. It is preferably 15.0 wt% or less. The content of other organic acids is more preferably 1.0 wt% or more and 15.0 wt% or less, further preferably 3.0 wt% or more and 15.0 wt% or less, and most preferably 5.0 wt% or more and 15 It is 0.0 wt% or less. Further, any one of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid, and one or more kinds. The total content of the other organic acids is preferably 30.0 wt% or less.

Examples of amines include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4. -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2 − Undecyl imidazole, 1-cyanoethyl-2-ethyl-4-methyl imidazole, 1-cyanoethyl-2-phenyl imidazole, 1-cyanoethyl-2-undecyl imidazolium trimerite, 1-cyanoethyl-2-phenyl imidazolium Trimeritate, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1') )]-Ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [ 2'-methylimidazolyl- (1')] -ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl -5-Hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline , 2,4-Diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl-s-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy -Imidazole adduct, 2-methylbenzoimidazole, 2-octylbenzoimidazole, 2-pentylbenzoimidazole, 2- (1-ethylpentyl) benzoimidazole, 2-nonylbenzoimidazole, 2- (4-thiazolyl) benzoimidazole, benzo Imidazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2'-hydroxy-3'-tert- Butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3', 5'-di-tert-amylphenyl) benzotriazole, 2- (2'-hydroxy-5'- tert-octylphenyl) benzotriazole, 2,2'-methylenebis [6- (2H-benzotriazole-2-yl) -4-tert-octylphenol], 6- (2-benzotriazolyl) -4-tert- Octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, Carboxybenzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] methylbenzotriazole, 2,2'-[[(methyl-1H-benzotriazole-1-yl) methyl] imino] bisethanol, 1- (1', 2'-dicarboxyethyl) benzotriazole, 1- (2,3-dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [ (1H-benzotriazole-1-yl) methyl] -4-methylphenol, 5-methylbenzotriazole, 5-phenyltetrazole and the like can be mentioned.

As the amine, one or more of these can be used. The present invention comprises one or more amine contents of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, organic halogen compounds, and amine hydrohalide. When it is included within the range specified in the above, it is preferably 0 wt% or more and 10.0 wt% or less. The amine content is more than 0 wt% when none of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, organic halogen compounds, or amine hydrohalide is contained. It is preferably 10.0 wt% or less. The amine content is more preferably 1.0 wt% or more and 10.0 wt% or less, and further preferably 1.0 wt% or more and 3.0 wt% or less when the activity by amine is not required. When the activity by amine is required, the amine content is more preferably 3.0 wt% or more and 10.0 wt% or less, and most preferably 5.0 wt% or more and 10.0 wt% or less.

Examples of the organic halogen compound include organic bromo compounds such as trans-2,3-dibromo-1,4-butenediol, triallyl isocyanurate 6 bromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3 −Bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, 3-Dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, trans-2,3-dibromo-2-butene-1,4-diol, cis-2,3 -Dibromo-2-butene-1,4-diol, tetrabromophthalic acid, bromosuccinic acid and the like can be mentioned. Further, examples thereof include chloroalkane, which is an organic chloro compound, chlorinated fatty acid ester, het acid, and het acid anhydride. Further, a fluorine-based surfactant which is an organic fluorocompound, a surfactant having a perfluoroalkyl group, polytetrafluoroethylene and the like can be mentioned.

As the organic halogen compound, one or more of these can be used. The content of the organic halogen compound is one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, amines, and amine hydrohalide according to the present invention. When it is contained within the range specified in the above, it is preferably 0 wt% or more and 5.0 wt% or less, and more preferably 0 wt% or more and 2.5 wt% or less. The content of the organic halogen compound is more than 0 wt% when none of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acid, amine, or amine hydrohalide is contained. It is preferably 5.0 wt% or less, and more preferably more than 0 wt% and 2.5 wt% or less.

The amine hydrogen halide is a compound obtained by reacting an amine with hydrogen halide, and examples thereof include aniline hydrogen chloride and aniline hydrogen bromide. As the amine of the amine halogenated hydride, the above-mentioned amine can be used, and examples thereof include ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole, and the hydrogen halide includes chlorine. Examples thereof include bromine, iodine, and hydrides of fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride). Further, borofluoric acid may be contained in place of the amine hydrohalide or in combination with the amine halide hydride, and examples of the borofluoric acid include borohydrofluoric acid.

As the amine hydrohalide, one or more of these can be used. The content of the amine hydrohalide is one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, amines, and organic halogen compounds. When it is contained within the range specified in the above, it is preferably 0 wt% or more and 2.0 wt% or less, and more preferably 0 wt% or more and 1.2 wt% or less. The content of the amine hydrohalide machine is 0 wt% when none of dimer acid, hydrogenated dimer acid, trimeric acid, hydrogenated trimeric acid, other organic acids, amines and organic halogen compounds is contained. It is preferably more than 2.0 wt% and more preferably more than 0 wt% and 1.2 wt% or less.

Examples of the thixotropy include wax-based thixotropy and amide-based thixotropy. Examples of the wax-based thixotropy include castor oil and the like. As amide-based thixo agents, lauric acid amide, palmitate amide, stearic acid amide, bechenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-toluenemethane amide, Aromatic amide, methylene bisstearic acid amide, ethylene bislauric acid amide, ethylene bishydroxystearate amide, saturated fatty acid bis amide, methylene bisoleic acid amide, unsaturated fatty acid bis amide, m-xylylene bisstearate amide, aromatic bis amide , Saturated fatty acid polyamide, unsaturated fatty acid polyamide, aromatic polyamide, substituted amide, methylol stearic acid amide, methylol amide, fatty acid ester amide and the like.

As the thixotropy, one or more of these can be used. The content of the thixotropic agent is preferably 0 wt% or more and 10.0 wt% or less. The content of the thixotropic agent is preferably more than 0 wt% and 10.0 wt% or less, more preferably 1.0 wt% or more and 10.0 wt% or less, and further preferably 3.0 wt% or more and 10.0 wt% or less. Most preferably, it is 5.0 wt% or more and 10.0 wt% or less.

Examples of the metal inactivating agent include a hindered phenol-based metal inactivating agent and a nitrogen compound-based metal inactivating agent. Examples of the hindered phenol-based metal inactivating agent include bis (3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid) and N, N'-hexamethylenebis (3- (3,3). 5-di-tert-butyl-4-hydroxyphenyl) propanamide) and the like can be mentioned. Examples of the nitrogen compound-based metal inactivating agent include N- (2H-1,2,4-triazole-5-yl) salicylamide.

As the metal inactivating agent, one or more of these can be used. The content of the metal inactivating agent is preferably 0 wt% or more and 10.0 wt% or less for the hindered phenol-based metal inactivating agent, and 0 wt% or more for the nitrogen compound-based metal inactivating agent. It is preferably 0 wt% or less. The content of the hindered phenolic metal inactivating agent is preferably more than 0 wt% and 10.0 wt% or less, more preferably 1.0 wt% or more and 10.0 wt% or less, and further preferably 2.0 wt%. The above is 10.0 wt% or less, and most preferably 5.0 wt% or more and 10.0 wt% or less. The content of the nitrogen compound-based metal inactivating agent is preferably more than 0 wt% and 5.0 wt% or less, more preferably 0.1 wt% or more and 5.0 wt% or less, and further preferably 0.5 wt% or more. It is 5.0 wt% or less, and most preferably 1.0 wt% or more and 5.0 wt% or less.

Examples of the solvent include water, ester solvents, alcohol solvents, glycol ether solvents, terpineols and the like. Examples of the ester solvent include alkyl fatty acid, butyl stearate, 2-ethylhexyl stearate, isotridecyl stearate, methyl oleate, isobutyl oleate, methyl coconut fatty acid, methyl laurate, isopropyl myristate, isopropyl palmitate, and 2 palmitate. -Ethylhexyl, octyldodecyl myristate and the like can be mentioned. As alcohol-based solvents, ethanol, industrial ethanol (mixed solvent in which methanol and / or isopropyl alcohol is added to ethanol), isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1, 5-Pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexine-2,5-diol, 2,3 -Dimethyl-2,3-butanediol, 1,1,1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2'-oxybis (methylene) bis ( 2-Ethyl-1,3-propanediol), 2,2-bis (hydroxymethyl) -1,3-propanediol, 1,2,6-trihydroxyhexane, bis [2,2,2-tris (hydroxy) Methyl) ethyl] ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, erythritol, treitol, guayacol glycerol ether, 3,6-dimethyl-4-octin-3 , 6-diol, 2,4,7,9-tetramethyl-5-decine-4,7-diol and the like. Glycol ether-based solvents include hexyl diglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether, 1,3-. Examples thereof include butylene glycol, phenyl glycol and hexylene glycol.

As the solvent, one or more of these can be used. The content of the solvent is the balance of the content of the essential component when the acrylic resin and the activator are contained as the essential components in the above-mentioned predetermined content.

Further, when any or a combination of the thixotropic agent and the metal inactivating agent is contained in the above-mentioned predetermined content in addition to the essential component, it is the balance of the content of the essential component and these optional added components.

<Example of solder paste of this embodiment>
The solder paste of the present embodiment contains the above-mentioned flux and metal powder. The metal powder is a solder powder of Sn alone, Sn-Ag type, Sn-Cu type, Sn-Ag-Cu type, Sn-Bi type, Sn-In type, etc., or Sb, an alloy thereof. It is composed of a powder of a solder alloy to which Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, Pb and the like are added.

The solder alloy has As: 25 mass ppm or more and 300 mass ppm or less, Sb: 0 mass ppm or more and 3000 mass ppm or less, Bi: 0 mass ppm or more and 10000 mass ppm or less, and Pb: 0 mass ppm or more and 5100 mass ppm or less. It is preferable to have an alloy composition of at least one type and the balance of Sn. The solder alloy may further contain at least one of Ag: 0% by mass or more and 4% by mass or less and Cu: 0% by mass or more and 0.9% by mass or less.

As is an element capable of suppressing the change in viscosity of the solder paste with time. It is presumed that As has low reactivity with flux and is a noble element for Sn, so that it can exert an effect of suppressing thickening. The lower limit of the As content is, for example, 25 mass ppm or more, preferably 50 mass ppm or more, and more preferably 100 mass ppm or more. On the other hand, if the amount of As is too large, the wettability of the solder alloy deteriorates. The upper limit of the As content is, for example, 300 mass ppm or less, preferably 250 mass ppm or less, and more preferably 200 mass ppm or less.

Sb is an element that has low reactivity with flux and exhibits an effect of suppressing thickening. When the solder alloy contains Sb, the lower limit of the Sb content is, for example, more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, still more preferably 100 mass ppm or more. It is particularly preferably 300 mass ppm or more. On the other hand, if the Sb content is too large, the wettability deteriorates, so it is necessary to set the content to an appropriate level. The upper limit of the Sb content is, for example, 3000 mass ppm or less, preferably 1150 mass ppm or less, and more preferably 500 mass ppm or less.

Like Sb, Bi and Pb are elements that have low reactivity with flux and exhibit an effect of suppressing thickening. Further, Bi and Pb are elements that can suppress deterioration of wettability due to As because the liquidus temperature of the solder alloy is lowered and the viscosity of the molten solder is reduced.

If at least one element of Sb, Bi and Pb is present, deterioration of wettability due to As can be suppressed. When the solder alloy contains Bi, the lower limit of the Bi content is, for example, more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, still more preferably 75 mass ppm or more. It is particularly preferably 100 mass ppm or more, and most preferably 250 mass ppm or more. When the solder alloy contains Pb, the lower limit of the Pb content is more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, and further preferably 75 mass ppm or more. , Especially preferably 100 mass ppm or more, and most preferably 250 mass ppm or more.

On the other hand, if the content of the elements of Bi and Pb is too large, the solidus temperature is remarkably lowered, so that ΔT, which is the temperature difference between the liquidus temperature and the solidus temperature, becomes too wide. If ΔT is too wide, the liquid phase Bi and Pb will be concentrated because a high melting point crystal phase having a low content of Bi and Pb is precipitated in the solidification process of the molten solder. After that, when the temperature of the molten solder is further lowered, the low melting point crystal phase having a high concentration of Bi and Pb is segregated. Therefore, the mechanical strength and the like of the solder alloy are deteriorated, and the reliability is deteriorated. In particular, since the crystal phase having a high Bi concentration is hard and brittle, segregation in the solder alloy significantly lowers the reliability.

From this point of view, when the solder alloy contains Bi, the upper limit of the Bi content is, for example, 10000 mass ppm or less, preferably 1000 mass ppm or less, more preferably 600 mass ppm or less, and further. It is preferably 500 mass ppm or less. When the solder alloy contains Pb, the upper limit of the Pb content is, for example, 5100 mass ppm or less, preferably 5000 mass ppm or less, more preferably 1000 mass ppm or less, and further preferably 850 mass ppm or less. It is particularly preferably 500 mass ppm or less.

The solder alloy preferably satisfies the following equation (1).

275≤2As + Sb + Bi + Pb ... (1)
In the above formula (1), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

As, Sb, Bi and Pb are all elements that have an effect of suppressing thickening. The total of these is preferably 275 mass ppm or more. The reason why the As content is doubled in the formula (1) is that As has a higher effect of suppressing thickening than Sb, Bi and Pb.

The lower limit of the equation (1) is preferably 350 or more, more preferably 1200 or more. On the other hand, the upper limit of (1) is not particularly limited from the viewpoint of the thickening suppressing effect, but is preferably 25200 or less, more preferably 10200 or less, from the viewpoint of setting ΔT in a suitable range. It is more preferably 5300 or less, and particularly preferably 3800 or less.

The following equations (1a) and (1b) are those in which the upper limit and the lower limit are appropriately selected from the above preferred embodiments.

275 ≦ 2As + Sb + Bi + Pb ≦ 25200 ... (1a)
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 ... (1b)
In the above equations (1a) and (1b), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

The solder alloy preferably satisfies the following equation (2).

0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2)
In the above number (2), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

If the contents of As and Sb are large, the wettability of the solder alloy deteriorates. On the other hand, Bi and Pb suppress the deterioration of wettability due to the inclusion of As, but if the content is too large, ΔT increases. In particular, in an alloy composition containing Bi and Pb at the same time, ΔT tends to increase. In view of these, if the contents of Bi and Pb are increased to excessively improve the wettability, ΔT will spread. On the other hand, if the content of As and Sb is increased to improve the effect of suppressing thickening, the wettability is deteriorated. Therefore, it is divided into As and Sb groups, Bi and Pb groups, and when the total amount of both groups is within an appropriate predetermined range, the thickening suppressing effect, the narrowing of ΔT, and the wettability are all simultaneously. It will be satisfied.

If the number (2) is less than 0.01, the total content of Bi and Pb is relatively large as compared with the total content of As and Pb, so that ΔT spreads. The lower limit of the number (2) is preferably 0.02 or more, more preferably 0.41 or more, further preferably 0.90 or more, particularly preferably 1.00 or more, and most preferably. Is 1.40 or more. On the other hand, when the number (2) exceeds 10.00, the total content of As and Sb becomes relatively larger than the total content of Bi and Pb, so that the wettability deteriorates. The upper limit of (2) is preferably 5.33 or less, more preferably 4.50 or less, further preferably 2.67 or less, and particularly preferably 2.30 or less.

The denominator of the number (2) is "Bi + Pb", and the number (2) cannot be established unless these are included. Therefore, the solder alloy preferably contains at least one of Bi and Pb. The alloy composition containing no Bi and Pb is inferior in wettability as described above.

The following equation (2a) is obtained by appropriately selecting the upper limit and the lower limit from the above preferred embodiments.

0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2a)
In the above equation (2a), As, Sb, Bi and Pb each represent the content (mass ppm) in the alloy composition.

Ag is an optional element capable of forming Ag3Sn at the crystal interface to improve the reliability of the solder alloy. In addition, Ag is an element whose ionization coefficient is noble with respect to Sn, and when it coexists with As, Pb, and Bi, it promotes the effect of suppressing thickening of these elements. The Ag content is preferably 0% by mass or more and 4% by mass or less, more preferably 0.5% by mass or more and 3.5% by mass or less, and further preferably 1.0% by mass or more and 3.0% by mass or less. Is.

Cu is an optional element that can improve the joint strength of solder joints. Further, Cu is an element whose ionization coefficient is noble with respect to Sn, and when it coexists with As, Pb, and Bi, it promotes the effect of suppressing thickening of these elements. The Cu content is preferably 0% by mass or more and 0.9% by mass or less, more preferably 0.1% by mass or more and 0.8% by mass or less, and further preferably 0.2% by mass or more and 0.7% by mass. % Or less.

The balance of the solder alloy is preferably Sn. The solder alloy may contain unavoidable impurities in addition to the above-mentioned elements. Even if it contains unavoidable impurities, it does not affect the above-mentioned effects. If the content of In is too large, ΔT spreads, so if it is 1000 mass ppm or less, the above-mentioned effect is not affected.

<Example of action and effect of flux and solder paste of this embodiment>
Acrylic resin with a number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) Acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000, and a number average molecular weight (Mn) and a weight average molecular weight (Mw) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). A flux containing 500 or more and less than 2000 acrylic resin and polyethylene resin or polypropylene resin, or polyethylene resin and polypropylene resin has excellent temperature cycle reliability and suppresses cracking of the flux residue cured after heating. Will be done.

In addition, the acrylic resin having the molecular weight in the above-mentioned range has excellent compatibility with the activator, and it is suppressed that the activator and the acrylic resin become non-uniform and affect the solder wettability, so that the solder wettability is improved. improves.

Further, the acrylic resin having the above-mentioned molecular weight has excellent compatibility with the rosin resin. As a result, the flux containing the acrylic resin and the rosin-based resin having the above-mentioned molecular weights is prevented from being layered due to the non-uniformity of the rosin-based resin and the acrylic resin.

As a result, the flux of the present embodiment is used for the solder paste to improve the solder wettability. In addition, it is possible to suppress the stratification of the residue. Further, the residue can be made flexible and the residue can be prevented from cracking.

An acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 1000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) and a time-of-flight mass spectrometer (TOF-MS) were used. Acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 1000 by mass spectrometry, number average molecular weight (Mn) and weight average molecular weight (Mw) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) ) Is 500 or more and less than 1000, since the molecular weight is small, the softening point is lowered. On the other hand, an acrylic resin having a number average molecular weight (Mn) of 1000 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) and a time-of-flight mass spectrometer (TOF-MS) were used. Acrylic resin with a weight average molecular weight (Mw) of 1000 or more and less than 2000 by mass spectrometry, number average molecular weight (Mn) and weight average molecular weight (Mw) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) ) Is 1000 or more and less than 2000, the acrylic resin has an effect of increasing the viscosity of the flux due to its particularly high molecular weight, and functions as a thickener. However, if the thickness is further increased with time, the printability is deteriorated and the workability is deteriorated. Therefore, as a method for suppressing thickening, it is preferable to contain a hindered phenol-based metal inactivating agent and a nitrogen compound-based metal inactivating agent as the metal inactivating agent within the range specified in the present invention described above. ..

Further, as the solder paste, it is preferable to use a solder alloy containing As, Sb, Bi and Pb within the range specified in the present invention described above. Further, the solder alloy containing As, Sb, Bi and Pb within the range specified in the present invention preferably satisfies the above-mentioned number (1), and the number (1a) and number (1b). ) Is more preferable. Further, the solder alloy containing As, Sb, Bi and Pb within the range specified in the present invention preferably satisfies the above-mentioned number (2), and preferably satisfies the above-mentioned number (2a). More preferred.

<Measurement of molecular weight of acrylic resin>
The molecular weight of the acrylic resin used in the examples was measured by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS).

The time-of-flight mass spectrometer (TOF-MS) is a device that measures the mass number from the time of arrival at the detector by utilizing the fact that the flight time of ions accelerated by an electric field in a vacuum differs depending on the mass-to-charge ratio. Is. The electrospray ion (ESI) method is used for ionization of the components. The ionized component is accelerated by the electric field and reaches the detector. The mass number is obtained from the flight time of the ions at this time, that is, the time difference until the ions reach the detector, and the structural analysis of the target component is performed.

The molecular weight of the acrylic resin used in the examples was measured using JMS-T100LP AccuTOF (registered trademark) LC-PLUS manufactured by Nippon Denshi Co., Ltd., and the number average molecular weight (Mn) and the weight average molecular weight (Mw) were measured. The obtained number average molecular weight (Mn) is obtained by the following number (3) formula, and the mass average molecular weight (Mw) is obtained by the following number (4) formula.

The number (3), in the number (4), M _i is equivalent to molecular weight m / z value of the peak of the desired component to be detected by time-of-flight mass spectrometer (TOF-MS). In addition, _Ni is the intensity of the peak and corresponds to the number of molecules.

Table 1 below shows the names and molecular weights of the acrylic resins used in Examples and Comparative Examples.

Acrylic oligomers A to C are all acrylic acid butyl ester oligomers. Acrylic oligomer A used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 853.86 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid butyl ester oligomer having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.05, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

Acrylic oligomer B used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 982.40 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid butyl ester oligomer having a weight average molecular weight (Mw) of 109753 determined by mass spectrometry. The ratio (Mn / Mw) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.12, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are It turns out that is almost the same.

Acrylic oligomer C used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 1096.51 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid butyl ester oligomer having a weight average molecular weight (Mw) of 1236.01 determined by mass spectrometry. The ratio (Mn / Mw) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.13, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

As described above, in the acrylic acid butyl ester oligomer used in the examples, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are within the ranges specified in the present invention.

Acrylic oligomer D used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 1315.06 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid alkyl ester oligomer having a weight average molecular weight (Mw) of 1507.79 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.15, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

As described above, in the acrylic acid alkyl ester oligomer used in the examples, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are within the ranges specified in the present invention.

Acrylic oligomer E used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 757.93 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a methacrylic acid butyl ester oligomer having a weight average molecular weight (Mw) of 844.62 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.11 and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

As described above, in the butyl methacrylic acid ester oligomer used in the examples, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are within the ranges specified in the present invention.

As the acrylic oligomer F, a time-of-flight mass spectrometer (TOF-MS) was used, with a number average molecular weight (Mn) of 1028.82 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an isotridecanol ester methacrylate oligomer having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.11 and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

As described above, in the methacrylic acid isotridecanol ester oligomer used in the examples, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are within the ranges specified in the present invention.

Acrylic oligomers G and H are acrylic acid / acrylic acid butyl ester copolymer oligomers. As the acrylic oligomer G, a time-of-flight mass spectrometer (TOF-MS) was used, with a number average molecular weight (Mn) of 518.79 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid / acrylic acid butyl ester copolymerized oligomer having a weight average molecular weight (Mw) of 625.29 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.21, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are It turns out that is almost the same.

As the acrylic oligomer H, a time-of-flight mass spectrometer (TOF-MS) was used, with a number average molecular weight (Mn) of 846.23 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid / acrylic acid butyl ester copolymerized oligomer having a weight average molecular weight (Mw) of 925.36 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.09, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

As described above, in the acrylic acid / acrylic acid butyl ester copolymer oligomer used in the examples, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are within the ranges specified in the present invention. ..

Acrylic oligomers I and J are acrylic acid butyl ester / polyethylene copolymer oligomers. Acrylic oligomer I used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 841.10 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid butyl ester / polyethylene copolymerized oligomer having a weight average molecular weight (Mw) of 914.14 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.09, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

Acrylic oligomer J used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 921.86 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid butyl ester / polyethylene copolymerized oligomer having a weight average molecular weight (Mw) of 1047.26 determined by mass spectrometry. The ratio (Mw / Mn) of the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.14, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It turns out that is almost the same.

As described above, in the butyl acrylate / polyethylene copolymer oligomer used in the examples, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method are within the ranges specified in the present invention.

The acrylic acid butyl ester polymer used in the comparative example is an acrylic polymer having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of more than 4000.

<Evaluation of solder wettability, compatibility, and temperature cycle reliability>
The fluxes of Examples and Comparative Examples were prepared with the compositions shown in Tables 2 and 3 below, and the solder wettability, compatibility and temperature cycle reliability were verified. The composition ratios in Tables 2 and 3 are wt (weight)% when the total amount of flux is 100.

<Evaluation of solder wettability>
(1) Verification method To evaluate the solder wettability, the fluxes of each example and each comparative example are applied on a Cu plate, a solder ball is mounted on the flux applied on the Cu plate, and after reflowing, the solder balls are reflowed. The solder wet spread diameter was measured. In the reflow process, the temperature is raised from 35 ° C. to 250 ° C. by 1 ° C. every second using a reflow device whose peak temperature is set to 250 ° C., and after reaching 250 ° C., heat treatment is performed for 30 seconds. It was. The solder ball has a composition described as Sn-3Ag-0.5Cu, contains 3.0% by mass of Ag and 0.5% by mass of Cu, and the balance is Sn (96.5% by mass). The diameter of the solder ball is 0.3 mm.

(2) Judgment Criteria ◯: The spread diameter of the solder was 510 μm or more.
X: The spread diameter of the solder was less than 510 μm.

<Evaluation of compatibility>
(1) Verification method In the evaluation of compatibility, the fluxes of Examples and Comparative Examples were adjusted through heating and stirring, and stored at room temperature for 48 hours. The flux after storage was placed at 25 ° C. and visually confirmed.

(2) Judgment criteria 〇: Each material is compatible without separation.
X: Each material was separated into two or more components.

<Evaluation of temperature cycle reliability>
(1) Verification method In the evaluation of temperature cycle reliability, the fluxes of Examples and Comparative Examples were applied onto a Cu plate to form a residue on the Cu plate. The presence or absence of cracks in the residue was visually evaluated after 500 cycles of repeating the process of holding the residue formed on the Cu plate at −30 ° C. and + 110 ° C. for 30 minutes each.

(2) Judgment criteria 〇: No cracks were found in the residue ×: Rhagades were found in the residue

<Comprehensive evaluation>
〇: All of the solder wettability evaluation, compatibility evaluation, and temperature cycle reliability evaluation were 〇. ×: Any or all of the solder wettability evaluation, compatibility evaluation, and temperature cycle reliability evaluation were ×.

Examples 1 to 10 are cases where the acrylic resin is changed. In Example 1, the acrylic oligomer A shown in Table 1 is contained as an acrylic resin in an amount of 18.0 wt% within the range specified in the present invention. Acrylic oligomer A had a number average molecular weight (Mn) of 853.86 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), and a time-of-flight mass spectrometer (TOF-MS) was used. It is an acrylic acid butyl ester oligomer in which the weight average molecular weight (Mw) determined by mass spectrometry is 900.42, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. ..

Further, in Example 1, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% was used as the polyethylene / polypropylene resin (PE.PP resin) within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). Includes 2.0 wt% within the range specified in the invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin ( The weight ratio) is within the range specified in the present invention.

Further, in Example 1, dimer acid is used as an activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, is used as an activator within the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 1, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 1, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 1, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

In Example 1, the spread diameter of the solder satisfied the above-mentioned determination criteria, and a sufficient effect on the solder wettability was obtained. In addition, each material was compatible without separation, and a sufficient effect on compatibility was obtained. Furthermore, no cracks were observed in the residue, and a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 2, the acrylic oligomer B shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. Acrylic oligomer B used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 982.40 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an acrylic acid butyl ester oligomer in which the weight average molecular weight (Mw) determined by mass spectrometry is 109753, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. ..

Hereinafter, as in Example 1, in Example 2, acrylic acid-modified hydrogenated rosin was used as the rosin resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene / polypropylene resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 2, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 2, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 2, the present invention comprises 2.0 wt% of castor oil, which is an ester thixotropy, as a thixotropy within the range specified in the present invention, and bisamide thixotropy, which is an amide thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 2, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Also in this Example 2, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 3, the acrylic oligomer C shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. Acrylic oligomer C had a number average molecular weight (Mn) of 1096.51 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), and a time-of-flight mass spectrometer (TOF-MS) was used. It is an acrylic acid butyl ester oligomer in which the weight average molecular weight (Mw) determined by mass spectrometry is 1236.01 and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. ..

Hereinafter, as in Example 1, in Example 3, acrylic acid-modified hydrogenated rosin was used as the rosin resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene / polypropylene resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 3, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 3, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 3, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 3, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Also in this Example 3, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 4, the acrylic oligomer D shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. Acrylic oligomer D had a number average molecular weight (Mn) of 1315.06 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), and a time-of-flight mass spectrometer (TOF-MS) was used. It is an acrylic acid alkyl ester oligomer in which the weight average molecular weight (Mw) determined by mass spectrometry is 1507.79, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. ..

Hereinafter, as in Example 1, in Example 4, acrylic acid-modified hydrogenated rosin was used as the rosin resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene / polypropylene resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 4, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 4, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 4, the present invention comprises 2.0 wt% of castor oil, which is an ester thixotropy, as a thixotropy within the range specified in the present invention, and bisamide thixotropy, which is an amide thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 4, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Also in this Example 4, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 5, the acrylic oligomer E shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. As the acrylic oligomer E, a number average molecular weight (Mn) of 757.93 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was used, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry is 844.62, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the range specified in the present invention. ..

Hereinafter, as in Example 1, in Example 5, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene-polypropylene-based resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 5, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 5, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 5, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 5, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Also in this Example 5, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 6, the acrylic oligomer F shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. As the acrylic oligomer F, a number average molecular weight (Mn) of 1028.82 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was used, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. It is an oligomer.

Hereinafter, as in Example 1, in Example 6, acrylic acid-modified hydrogenated rosin was used as the rosin resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene / polypropylene resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 6, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 6, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 6, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 6, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Also in this Example 6, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 7, the acrylic oligomer G shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. As the acrylic oligomer G, a number average molecular weight (Mn) of 518.79, which was determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), was used, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Copolymerization oligomer,

Further, in Example 7, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% was used as the polyethylene / polypropylene resin (PE.PP resin) within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). Contains 9.0 wt% within the range specified in the invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 7, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 7, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 7, the present invention comprises 2.0 wt% of castor oil, which is an ester thixotropy, as a thixotropy within the range specified in the present invention, and bisamide thixotropy, which is an amide thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 7, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. Hexyldiglycol is contained in an amount of 33.0 wt% within the range specified in the present invention with the balance as a solvent.

Increase the content of polyethylene / polypropylene resin, the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin, and the weight of one type of polyethylene / polypropylene resin or two or more types of polyethylene. Even in Example 7, in which the ratio to the total weight of the polypropylene-based resin is the lower limit within the more preferable range specified in the present invention, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 8, the acrylic oligomer H shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. Acrylic oligomer H had a number average molecular weight (Mn) of 846.23 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry is 925.36, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. It is a copolymerization oligomer.

Further, in Example 8, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% was used as the polyethylene / polypropylene resin (PE.PP resin) within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). Contains 7.0 wt% within the range specified in the invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 8, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 8, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 8, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 8, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. Hexyldiglycol is contained in an amount of 35.0 wt% within the range specified in the present invention with the balance as a solvent.

Increase the content of polyethylene / polypropylene resin, the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin, and the weight of one type of polyethylene / polypropylene resin or two or more types of polyethylene. Even in Example 8 in which the ratio to the total weight of the polypropylene-based resin exceeded the lower limit within the more preferable range specified in the present invention, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 9, the acrylic oligomer I shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. Acrylic oligomer I used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 841.10 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). Both acrylic acid butyl ester and polyethylene have a weight average molecular weight (Mw) of 914.14 determined by mass spectrometry, and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It is a polymerized oligomer.

Hereinafter, as in Example 1, in Example 9, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene-polypropylene-based resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 9, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 9, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 9, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 9, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Also in this Example 9, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 10, the acrylic oligomer J shown in Table 1 as an acrylic resin is contained in an amount of 18.0 wt% within the range specified in the present invention. Acrylic oligomer J used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 921.86 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). Both acrylic acid butyl ester and polyethylene have a weight average molecular weight (Mw) of 1047.26 determined by mass spectrometry, and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It is a polymerized oligomer.

Hereinafter, as in Example 1, in Example 10, acrylic acid-modified hydrogenated rosin was used as the rosin resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene / polypropylene resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 10, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 10, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 10, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 10, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in this Example 10, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 11 is a case where a plurality of types of acrylic resins are contained. In Example 11, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 1.8 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 982.40, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 109753, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid butyl ester oligomer (acrylic oligomer B) is contained in an amount of 1.8 wt% within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1096.51, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1236.01, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid butyl ester oligomer (acrylic oligomer C) is contained in an amount of 1.8 wt% within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as the acrylic resin was 1315.06, and the time-of-flight mass spectrometer (TOF-MS). The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1507.79, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid alkyl ester oligomer (acrylic oligomer D) is provided within the range specified in the present invention by 1.8. Including wt%.

Further, in Example 11, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 757.93, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 844.62, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 1.8 wt% of butyl methacrylate ester oligomer (acrylic oligomer E) within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 1.8 wt% of isotridecanol ester methacrylate (acrylic oligomer F) within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylate butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 1.8 wt% within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 846.23, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 925.36, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylate butyl ester copolymerized oligomer (acrylic oligomer H) is contained in an amount of 1.8 wt% within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 841.10, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 914.14, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid butyl ester / polyethylene copolymerized oligomer (acrylic oligomer I) is contained in an amount of 1.8 wt% within the range specified in the present invention.

Further, in Example 11, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 921.86, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1047.26, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid butyl ester / polyethylene copolymerized oligomer (acrylic oligomer J) is contained in an amount of 1.8 wt% within the range specified in the present invention.

The total content of each acrylic resin is within the range specified in the present invention.

Hereinafter, as in Example 1, in Example 11, acrylic acid-modified hydrogenated rosin was used as the rosin resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene / polypropylene resin (PE.PP resin). ), Polyethylene resin is contained in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 11, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 11, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 11, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 11, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 11 in which the acrylic resin was compositely added, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 12 is a case where the content of the polyethylene-polypropylene resin (PE.PP resin) is changed. In Example 12, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 19.8 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 12, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% was used as the polyethylene / polypropylene resin (PE.PP resin) within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). Includes 0.2 wt% within the range specified in the invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 12, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 12, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 12, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 12, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 12 in which the content of the polyethylene / polypropylene resin (PE.PP resin) was reduced, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Examples 13 and 14 are cases where the type of polyethylene / polypropylene resin (PE.PP resin) is changed. In Example 13, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 19.8 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 13, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin, 15.0 wt% was used as the polyethylene-polypropylene-based resin (PE.PP resin) within the range specified in the present invention, and acid-modified polyethylene resin was used as the polyethylene-polypropylene-based resin (PE.PP resin). , 0.2 wt% is included within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 13, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 13, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 13, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 13, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 13 in which the type of the polyethylene / polypropylene resin (PE.PP resin) was changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 14, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 19.8 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 14, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin, 15.0 wt% was used within the range specified in the present invention, and polyethylene oxide resin was used as the polyethylene-polypropylene-based resin (PE.PP resin). It contains 0.2 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 14, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 14, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 14, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 14, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 14 in which the type of polyethylene / polypropylene resin (PE.PP resin) was changed, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Examples 15 to 17 are cases where a plurality of types of polyethylene-polypropylene resins (PE.PP resins) are contained. In Example 15, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 19.7 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 15, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 15, the polyethylene resin as the polyethylene-polypropylene resin (PE.PP resin) is 0.1 wt% within the range specified by the present invention, and the acid-modified polyethylene resin is the range specified by the present invention. Contains 0.1 wt% of polyethylene oxide resin and 0.1 wt% within the range specified in the present invention. The total content of two or more types of polyethylene-polypropylene resins (PE.PP resins) is within the range specified in the present invention. Further, the weight of one kind of acrylic resin or the total weight of two or more kinds of acrylic resins and the weight of one kind of polyethylene / polypropylene resin or the total weight of two or more kinds of polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

Further, in Example 15, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 15, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 15, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 15, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 15 in which a polyethylene / polypropylene resin (PE.PP resin) was compoundly added, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 16, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 19.4 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 16, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 16, the polyethylene resin as the polyethylene-polypropylene resin (PE.PP resin) is 0.1 wt% within the range specified in the present invention, and the acid-modified polyethylene resin is used in the range specified in the present invention. Within 0.1 wt%, polyethylene oxide resin, 0.1 wt% within the range specified in the present invention, polypropylene resin, 0.1 wt% within the range specified in the present invention, acid-modified polypropylene resin. It contains 0.1 wt% within the range specified in the present invention and 0.1 wt% within the range specified in the present invention. The total content of two or more types of polyethylene-polypropylene resins (PE.PP resins) is within the range specified in the present invention. Further, the weight of one kind of acrylic resin or the total weight of two or more kinds of acrylic resins and the weight of one kind of polyethylene / polypropylene resin or the total weight of two or more kinds of polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

Further, in Example 16, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 16, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 16, the present invention comprises 2.0 wt% of castor oil, which is an ester thixotropy, as a thixotropy within the range specified in the present invention, and bisamide thixotropy, which is an amide thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 16, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 16 in which a polyethylene / polypropylene resin (PE.PP resin) was compoundly added, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 17, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 14.0 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 17, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 17, the polyethylene resin as the polyethylene-polypropylene resin (PE.PP resin) is 3.0 wt% within the range specified by the present invention, and the acid-modified polyethylene resin is the range specified by the present invention. Including 3.0 wt%. The total content of two or more types of polyethylene-polypropylene resins (PE.PP resins) is within the range specified in the present invention. Further, the weight of one kind of acrylic resin or the total weight of two or more kinds of acrylic resins and the weight of one kind of polyethylene / polypropylene resin or the total weight of two or more kinds of polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

Further, in Example 17, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 17, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 17, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 17, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 17 in which a polyethylene / polypropylene resin (PE.PP resin) was added in a composite manner, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 18, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 14.0 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 18, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 18, the polyethylene resin as the polyethylene-polypropylene resin (PE.PP resin) is 2.0 wt% within the range specified by the present invention, and the polypropylene oxide resin is within the range specified by the present invention. Includes 4.0 wt%. The total content of two or more types of polyethylene-polypropylene resins (PE.PP resins) is within the range specified in the present invention. Further, the weight of one kind of acrylic resin or the total weight of two or more kinds of acrylic resins and the weight of one kind of polyethylene / polypropylene resin or the total weight of two or more kinds of polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

Further, in Example 18, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 18, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 18, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 18, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 18 in which a polyethylene / polypropylene resin (PE.PP resin) was compoundly added, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 19, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 19, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylate butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 15.0 wt% within the range specified in the present invention.

The total content of each acrylic resin is within the range specified in the present invention. Further, in Example 19, the rosin-based resin is not contained. In Example 19, an acid-modified polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 19, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 2.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 19, 2-phenylimidazole, which is an amine, was used as an activator at 1.0 wt% within the range specified in the present invention, and ethylamine / HBr, which is an amine hydrohalide, was used as an activator. It contains 1.0 wt% within the range specified by the present invention and 1.0 wt% within the range specified by the present invention, containing N, N-diethylaniline / HBr. The total content of two or more amine hydrohalide salts is within the range specified in the present invention.

Further, in Example 19, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 19, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 19 which did not contain a rosin-based resin and contained an amine hydrohalide in addition to dimer acid, another organic acid, and amine as an activator, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 20, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 20, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylate butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 15.0 wt% within the range specified in the present invention.

The total content of each acrylic resin is within the range specified in the present invention. Further, in Example 20, the rosin-based resin is not contained. In Example 20, an acid-modified polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 20, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 3.5 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 20, 2-phenylimidazole which is an amine as an activator is 1.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2 which is an organic halogen compound as an activator. It contains 1.0 wt% of −butene-1,4-diol within the range specified in the present invention and 1.5 wt% of triallyl isocyanurate 6 bromide within the range specified in the present invention. The total content of two or more organic halogen compounds is within the range specified in the present invention.

Further, in Example 20, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 20, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 38.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 20 which does not contain a rosin-based resin and contains an organic halogen compound in addition to dimer acid, other organic acids, and amines as an activator, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 21, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 5.0 wt% within the range specified in the present invention.

Further, in Example 21, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 5.0 wt% within the range specified in the present invention.

The total content of each acrylic resin is within the range specified in the present invention. Further, in Example 21, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 13.0 wt% within the range specified in the present invention. Further, in Example 21, polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 21, dimer acid is used as an activator in an amount of 20.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, is used as an activator within the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 21, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 21, the present invention comprises 2.0 wt% of castor oil, which is an ester thixotropy, as a thixotropy within the range specified in the present invention, and bisamide thixotropy, which is an amide thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 21, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 21, in which the content of the acrylic resin is the lower limit of the more preferable range specified in the present invention, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 22, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 7.5 wt% within the range specified in the present invention.

Further, in Example 22, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylate butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 5.0 wt% within the range specified in the present invention.

The total content of each acrylic resin is within the range specified in the present invention. Further, in Example 22, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 13.0 wt% within the range specified in the present invention. Further, in Example 22, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 22, dimer acid was used as the activator in an amount of 17.5 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 22, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 22, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 22, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 22 in which the content of the acrylic resin was reduced, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 23 is a case where a plurality of types of rosin-based resins are contained. In Example 23, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 853.86, and a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry using MS), and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It contains 18.0 wt% of butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

Further, in Example 23, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin in an amount of 3.0 wt% within the range specified in the present invention, and maleic acid-modified hydrogenated rosin was used in the range specified in the present invention. 2.0 wt%, phenol-modified rosin, 2.0 wt% within the range specified in the present invention, disproportionated rosin, 2.0 wt% within the range specified in the present invention, hydrogenated rosin. It contains 2.0 wt% within the range specified in the invention, 2.0 wt% polymerized rosin, 2.0 wt% within the range specified in the present invention, and 2.0 wt% within the range specified in the present invention.

The total content of each rosin-based resin is within the range specified in the present invention. Further, in Example 23, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 23, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 23, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 23, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 23, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 23 in which the rosin-based resin was added in combination, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 24 is a case where the type of other organic acid is changed. In Example 24, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 24, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 24, 2.0 wt% of polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 24, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% dodecanedioic acid within the range specified in the present invention. The total content of succinic acid and dodecanedioic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 24, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 24, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 24, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 24 in which the types of other organic acids were changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 25 is a case where other organic acids are not contained. In Example 25, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 25, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 25, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 25, dimer acid is contained as an activator in an amount of 17.0 wt% within the range specified in the present invention, and other organic acids are not contained.

Further, in Example 25, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 25, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 25, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 25, which does not contain other organic acids, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 26 is a case where no organic acid is contained. In Example 26, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 26, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 10.0 wt% within the range specified in the present invention.

The total content of each acrylic resin is within the range specified in the present invention. Further, in Example 26, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 16.0 wt% within the range specified in the present invention. Further, in Example 26, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

In Example 26, dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and other organic acids are not included.

Further, in Example 26, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 26, trans-2,3-dibromo-2-butene-1,4-diol, which is an organic halogen compound, is used as an activator in an amount of 2.0 wt%, triallyl within the range specified in the present invention. It contains 3.0 wt% of isocyanurate hexabromide within the range specified in the present invention. The total content of two or more organic halogen compounds is within the range specified in the present invention. Further, in Example 26, ethylamine / HBr, which is an amine hydrohalide, is used as an activator in an amount of 0.5 wt% within the range specified in the present invention, and N, N-diethylaniline / HBr is used in the present invention. Includes 0.5 wt% within the specified range. The total content of two or more amine hydrohalide salts is within the range specified in the present invention.

Further, in Example 26, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 26, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 26, which did not contain dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or other organic acids, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Examples 27 to 35 are different combinations of activators. In Example 27, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. -Acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 21.0 wt% within the range specified in the present invention.

Further, in Example 27, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 27, 2.0 wt% of polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 27, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. Includes 3.0 wt%. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 27, 2-phenylimidazoline, which is an amine, is contained as an activator in an amount of 2.0 wt% within the range specified in the present invention. Further, in Example 27, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 27, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 27 in which the combination of activators was changed, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 28, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. -Acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 21.0 wt% within the range specified in the present invention.

Further, in Example 28, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 28, a polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 28, dimer acid as an activator is used in 10.0 wt% within the range specified in the present invention, and glutaric acid, which is another organic acid, is used as the activator in the range specified in the present invention. Includes 3.0 wt%. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 28, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 2.0 wt% within the range specified in the present invention. Further, in Example 28, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 28, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 28 in which the combination of activators was changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 29, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. -Acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 21.0 wt% within the range specified in the present invention.

Further, in Example 29, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 29, 2.0 wt% of polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 29, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and glutaric acid, which is another organic acid, was used as the activator within the range specified in the present invention. Includes 3.0 wt%. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 29, 2-phenylimidazoline, which is an amine, is contained as an activator in an amount of 2.0 wt% within the range specified in the present invention. Further, in Example 29, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 29, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 29 in which the combination of activators was changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 30, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 21.0 wt% within the range specified in the present invention.

Further, in Example 30, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 29, 2.0 wt% of polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 30, dimer acid is used as the activator within the range specified in the present invention by 10.0 wt%, and succinic acid, which is another organic acid, is used as the activator within the range specified by the present invention. It contains 1.5 wt% and 1.5 wt% of glutaric acid within the range specified in the present invention. The total content of succinic acid and glutaric acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 30, 2-phenylimidazoline, which is an amine, is contained as an activator in an amount of 2.0 wt% within the range specified in the present invention. Further, in Example 30, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 30, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 30 in which the combination of activators was changed, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 31, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 19.0 wt% within the range specified in the present invention.

Further, in Example 31, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 31, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 31, dimer acid was used as the activator within the range specified in the present invention, 10.0 wt%, and succinic acid, which is another organic acid, was used as the activator within the range specified in the present invention. It contains 2.5 wt% and glutaric acid within the range specified in the present invention. The total content of succinic acid and glutaric acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 31, 2-phenylimidazoline, which is an amine, is contained as an activator in an amount of 2.0 wt% within the range specified in the present invention. Further, in Example 31, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 31, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 31 in which the combination of activators was changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 32, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as the acrylic resin was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 32, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 32, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 32, dimer acid was used as the activator in an amount of 11.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 32, amine is not contained. Further, in Example 32, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 32, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 32 in which the combination of the activators was changed and the amine was not contained, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 33, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 33, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 33, the polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 33, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 33, 2-phenyl-4-methylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 33, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropic agent within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Example 33, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 33 in which the combination of activators was changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 34, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 34, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 34, the polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 34, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 2.0 wt% and 1.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 34, 2-phenylimidazole, which is an amine, is specified as an activator in an amount of 4.0 wt% within the range specified in the present invention, and 2-phenyl-4-methylimidazole, which is an amine, is specified in the present invention. It contains 4.0 wt% within the range indicated. The total content of two or more amines is within the range specified in the present invention. Further, in Example 34, castor oil, which is an ester-based thixotropy, is contained as a thixotropy in an amount of 2.0 wt% within the range specified in the present invention.

Further, in Example 34, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] is contained in an amount of 2.0 wt% within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 34 in which the combination of activators was changed, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

In Example 35, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 35, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 35, the polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 35, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 35, 2-phenylimidazole, which is an amine, was added as an activator to 2.0 wt% within the range specified in the present invention, and 2,3-dibromo-1,4, which is an organic halogen compound, was used as an activator. -Butandiol is contained in an amount of 2.0 wt% within the range specified in the present invention. Further, in Example 35, castor oil, which is an ester-based thixotropy, is contained as a thixotropy in an amount of 2.0 wt% within the range specified in the present invention.

Further, in Example 35, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] is contained in an amount of 2.0 wt% within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 35 in which the combination of activators was changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 36 is a case where the amount of the thixo agent is changed. In Example 36, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin. ) Is 1028.82, and the weight average molecular weight (Mw) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mn) Mw) contains 18.0 wt% of isotridecanol ester methacrylate ester oligomer (acrylic oligomer F) within the range specified in the present invention.

Further, in Example 36, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 36, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 36, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 36, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 36, 7.0 wt% of castor oil, which is an ester-based thixotropy, is contained as a thixotropy within the range specified in the present invention.

Further, in Example 36, the metal inactivating agent is not contained, and the balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

Even in Example 36 in which the content of the thixotropic agent was increased and the metal inactivating agent was not included, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 37 is a case where the types of thixotropic agent and solvent are changed. In Example 37, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 37, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 37, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 37, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 37, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 37, the thixotropic agent contains 3.0 wt% of the bisamide thixotropy, which is an amide-based thixotropy, within the range specified in the present invention.

Further, in Example 37, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The remainder contains ethylhexyl diglycol as a solvent in an amount of 41.0 wt% within the range specified in the present invention.

Even in Example 37 in which the types of thixotropy and solvent were changed, a sufficient effect on solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

Example 38 is a case where the types of the thixotropic agent, the metal inactivating agent and the solvent are changed. In Example 38, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount of 18.0 wt% within the range specified in the present invention.

Further, in Example 38, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Example 38, 2.0 wt% of polyethylene resin is contained as the polyethylene-polypropylene resin (PE.PP resin) within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Example 38, dimer acid as an activator is used in 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, is used as the activator in the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Example 38, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Example 38, the thixotropic agent contains 3.0 wt% of the bisamide thixotropy, which is an amide-based thixotropy, within the range specified in the present invention.

Further, in Example 38, N, N'-hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl), which is a hindered phenol-based metal inactivating agent, is used as the metal inactivating agent. ) Propanamide] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents, including 0.1 wt% within the range specified in the present invention, is within the range specified in the present invention. The remainder contains ethylhexyl diglycol as a solvent in an amount of 41.0 wt% within the range specified in the present invention.

Even in Example 38 in which the types of the thixotropic agent, the metal inactivating agent, and the solvent were changed, a sufficient effect on the solder wettability was obtained. Moreover, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect on the reliability of the temperature cycle was obtained.

On the other hand, in Comparative Example 1, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 1028.82, and time-of-flight mass spectrometry. The weight average molecular weight (Mw) determined by mass spectrometry using a meter (TOF-MS) is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 25.0 wt% of isotridecanol ester methacrylate (acrylic oligomer F), which is, within the range specified in the present invention.

Further, in Comparative Example 1, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) as an acrylic resin was 518.79, and a time-of-flight mass spectrometer (TOF-MS) was used. The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 20.0 wt% within the range specified in the present invention.

The total content of each acrylic resin is within the range specified in the present invention. Further, in Comparative Example 1, a polyethylene resin was used as the polyethylene-polypropylene resin (PE.PP resin) without containing the rosin-based resin, and 4.0 wt% of the polypropylene oxide resin was used within the range specified in the present invention. It contains 4.0 wt% within the range specified in the invention. The total content of two or more types of polyethylene-polypropylene resins (PE.PP resins) is within the range specified in the present invention. Further, the weight of one kind of acrylic resin or the total weight of two or more kinds of acrylic resins and the weight of one kind of polyethylene / polypropylene resin or the total weight of two or more kinds of polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

Further, in Comparative Example 1, the activator is not contained, and the castor oil, which is an ester-based thixotropy, is contained in an amount of 2.0 wt% within the range specified in the present invention, and the amide-based thixotropy, bisamide-based. The thixotropy is contained in an amount of 2.0 wt% within the range specified in the present invention. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Comparative Example 1, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

In Comparative Example 1 containing no activator, an effect was obtained on compatibility and reliability of the temperature cycle, but no effect was obtained on solder wettability.

In Comparative Example 2, as the acrylic resin, the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) are defined in the present invention. It does not contain an acrylic oligomer within the above range, and contains 18.0 wt% of an acrylic acid butyl ester polymer as an acrylic polymer having a number average molecular weight (Mn) and a weight average molecular weight (Mw) exceeding 4000.

Further, in Comparative Example 2, acrylic acid-modified hydrogenated rosin is contained as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention. Further, in Comparative Example 2, a polyethylene resin is contained as a polyethylene-polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified in the present invention. The ratio of the weight of one type of acrylic resin or the total weight of two or more types of acrylic resin to the weight of one type of polyethylene / polypropylene resin or the total weight of two or more types of polyethylene / polypropylene resin is , Within the range specified in the present invention.

Further, in Comparative Example 2, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator within the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Comparative Example 2, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Comparative Example 2, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Comparative Example 2, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] was used as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

The number average molecular weight (Mn) and weight average molecular weight (Mw) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) do not contain acrylic oligomers within the range specified in the present invention. In Comparative Example 2 containing an acrylic polymer having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of more than 4000, an effect on solder wettability was obtained, but each material was separated into two or more components. No effect was obtained on compatibility. In addition, the residue did not cure sufficiently, and the reliability of the temperature cycle could not be evaluated.

In Comparative Example 3, neither the acrylic oligomer nor the acrylic polymer is contained as the acrylic resin. Further, in Comparative Example 3, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin, and polyethylene resin was used as the polyethylene-polypropylene-based resin (PE.PP resin) at 34.8 wt% beyond the range specified in the present invention. It contains 0.2 wt% within the range specified in the present invention.

Further, in Comparative Example 3, dimer acid was used as the activator in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as the activator within the range specified in the present invention. It contains 4.0 wt% and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of the content of other organic acids specified in the present invention. The total content of dimer acid and other organic acids is within the range specified in the present invention.

Further, in Comparative Example 3, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range specified in the present invention. Further, in Comparative Example 3, the present invention comprises 2.0 wt% of castor oil, which is an ester-based thixotropy, as a thixotropy within the range specified in the present invention, and bisamide-based thixotropy, which is an amide-based thixotropy. Includes 2.0 wt% within the range specified in. The total content of two or more thixotropic agents is within the range specified in the present invention.

Further, in Comparative Example 3, the hindered phenol-based metal inactivating agent bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis] as the metal inactivating agent. (Oxyethylene)] in 2.9 wt% within the range specified in the present invention, N- (2H-1,2,4-triazole-5-yl) salicylamide, which is a nitrogen compound-based metal inactivating agent. The total content of two or more metal inactivating agents containing 0.1 wt% within the range specified in the present invention is within the range specified in the present invention. The balance contains 40.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

In Comparative Example 3 containing no acrylic resin, an effect on solder wettability was obtained. However, although the residue was cured, cracks were observed in the residue, and no effect was obtained on the reliability of the temperature cycle. Moreover, since it does not contain acrylic resin, compatibility was not evaluated.

<Evaluation of the thickening inhibitory effect of solder paste>
The effect of suppressing thickening of the solder paste prepared by using the flux of Example 1 described above and the solder alloy having the compositions shown in Tables 4 to 9 below was also verified. Solder having the flux of Example 1 shown in Table 2 and the alloy composition shown in Tables 4 to 9 and having a size (particle size distribution) satisfying symbol 4 in the powder size classification (Table 2) in JIS Z 3284-1: 2014. The powder was mixed to prepare a solder paste. The mass ratio of the flux to the solder powder is flux: solder powder = 11:89.

(1) Verification method For the obtained solder paste, a rotational viscometer (PCU-205, manufactured by Malcolm Co., Ltd.) was used according to the method described in "4.2 Viscosity Characteristic Test" of JIS Z 3284-3: 2014. The viscosity was continuously measured for 12 hours at a rotation speed of 10 rpm and a measurement temperature of 25 ° C. Then, the initial viscosity (viscosity after 30 minutes of stirring) and the viscosity after 12 hours were compared, and the thickening suppressing effect was evaluated based on the following criteria.
(2) Judgment criteria 〇: Viscosity after 13 hours ≤ Initial viscosity × 1.2: Good with small increase in viscosity over time ×: Viscosity after 13 hours> Initial viscosity × 1.2: Large increase in viscosity over time Bad

In the solder paste using the flux of Example 1 shown in Table 2 and the solder alloy of Examples 1A to 108A shown in Tables 4 to 9 satisfying the above equations (1) and (2), the flux residue In addition to the temperature cycle reliability of the above, since all the requirements of the present invention are satisfied in any alloy composition, a sufficient effect on the thickening suppressing effect of the solder paste was obtained. For the solder powders of Examples 1A to 108A before being mixed with the flux, SII Nanotechnology Co., Ltd., model number: EXSTAR DSC7020 was used, the sample amount was about 30 mg, and the temperature rise rate was 15 ° C./min. DSC measurement was performed to obtain the solidus temperature and the liquidus temperature, and the solidus temperature was subtracted from the obtained liquidus temperature to obtain ΔT. In all the examples, ΔT was 10 ° C. or less. Yes, ΔT was in the suitable range.

On the other hand, in the solder paste using the flux of Example 1 shown in Table 2 and the solder alloys of Comparative Examples 1A, 3A, 5A, 7A, 9A and 11A shown in Tables 4 to 9, the solder alloy is As. Since it does not contain the above, the effect of suppressing thickening was not exhibited.

In the solder paste using the flux of Example 1 shown in Table 2 and the solder alloys of Comparative Examples 2A, 4A, 6A, 8A, 10A and 12A shown in Tables 4 to 9, the formula (1) is less than the lower limit. Therefore, the effect of suppressing thickening was not exhibited.

Next, among the examples shown in Tables 2 and 3, Example 11 to which the acrylic resin was compositely added, Example 23 to which the rosin was compositely added, Dimer acid was contained as the organic acid, and other organic acids were added. The thickening suppressing effect of the solder paste prepared by using the solder alloy having the composition shown in Table 10 below was also verified with Example 25 not containing the organic acid and Example 26 not containing the organic acid.

In Table 10, Example 1A in Tables 4 to 9 described above is designated as Example A1, Example 2A is designated as Example A2, Example 15A is designated as Example A3, and Example 18A is designated as Example A4, and Comparative Example 1A is compared. Example A1 and Comparative Example 2A were designated as Comparative Example A2. In addition, Example 19A is referred to as Example B1. Example 20A was designated as Example B2, Example 33A was designated as Example B3, Example 36A was designated as Example B4, Comparative Example 3A was designated as Comparative Example B1, and Comparative Example 4A was designated as Comparative Example B2. Further, Example 73A is referred to as Example C1. Example 74A was designated as Example C2, Example 86A was designated as Example C3, Example 87A was designated as Example C4, Example 90 was designated as Example C5, Comparative Example 9A was designated as Comparative Example C1, and Comparative Example 10A was designated as Comparative Example C2. ..

Not only the flux of Example 1 shown in Table 2, but also the flux of each Example shown in Tables 2 to 3 and each of the Examples shown in Table 10 satisfying the above equations (1) and (2). In the solder paste using the solder alloy, in addition to the temperature cycle reliability of the flux residue, a sufficient effect on the thickening suppressing effect of the solder paste was obtained.

On the other hand, in the solder paste using the flux of each example shown in Tables 2 to 3 and the solder alloys of Comparative Examples A1, B1 and C1 shown in Table 10, the solder alloy does not contain As, so that the amount is increased. The stickiness suppressing effect was not exhibited.

In the solder paste using the flux of each example shown in Tables 2 to 3 and the solder alloy of Comparative Examples A2, B2, and C2 shown in Table 10, since the formula (1) is less than the lower limit, the thickening suppressing effect is obtained. Was not demonstrated.

Based on the above, an acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), or a time-of-flight mass spectrometer (TOF- Acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using MS), or number average molecular weight (Mn) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). ) And a flux containing an acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000, an activator, and a solvent, the solder is sufficiently wetted and spread.

Further, in the flux containing the acrylic resin, the activator and the solvent having the molecular weight in the above range, the compatibility between the acrylic resin and the activator, and when the rosin resin is contained, the acrylic resin, the rosin resin and the activator are used. It has excellent compatibility with and suppresses the non-uniformity and stratification of each component.

Further, the flux containing the acrylic resin having the molecular weight in the above-mentioned range, the activator and the solvent has excellent thermal cycle reliability, and the flux residue cured after heating is suppressed from cracking.

As a result, the flux of the present embodiment can be used for the solder paste to obtain the wettability of the solder. In addition, it is possible to suppress the stratification of the residue. Further, the residue can be made flexible and the residue can be prevented from cracking.

These effects were not inhibited by the inclusion of other resins, thixotropic agents, and metal inactivating agent activators within the range specified in the present invention.

As the acrylic resin, a number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) is 1028.82, and a time-of-flight mass spectrometer (TOF-MS) is used. The weight average molecular weight (Mw) determined by the mass spectrometry used was 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) were 1000 or more. Even when a flux containing F) within the range specified in the present invention is used, a hindered phenol-based metal inactivating agent and a nitrogen compound-based metal inactivating agent are specified in the above-mentioned invention. By containing it within the range, a sufficient effect on the thickening suppressing effect was obtained.

Further, with this flux, As: 25 mass ppm or more and 300 mass ppm or less, Sb: 0 mass ppm or more and 3000 mass ppm or less, Bi: 0 mass ppm or more and 10000 mass ppm or less, and Pb: 0 mass ppm or more and 5100 mass ppm or less. At least one of the following, Ag: 0% by mass or more and 4% by mass or less, Cu: 0% by mass or more and 0.9% by mass or less, and the balance consisting of Sn, and the above number (1) and number (2). For solder paste using a solder alloy satisfying the formula), an acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), or flying Acrylic resin with a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), or mass using a time-of-flight mass spectrometer (TOF-MS) By containing an acrylic resin having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 according to the analytical method, solder wettability, compatibility, and temperature cycle reliability are not impaired, and the thickening is suppressed. On the other hand, a sufficient effect was obtained.

In particular, as an acrylic resin, a time-of-flight mass spectrometer (TOF-MS) has a number average molecular weight (Mn) of 1028.82 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). The weight average molecular weight (Mw) determined by the mass spectrometry used was 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) were 1000 or more. Even in a solder paste using a flux containing F) within the range specified in the present invention, a solder alloy containing As, Sb, Bi and Pb within the range specified in the present invention should be used. Therefore, a sufficient effect was obtained for the thickening suppressing effect.

Therefore, the present invention contains an acrylic acid ester or a methacrylic acid ester, or an acrylic acid ester and a methacrylic acid ester, and an acrylic system having a number average molecular weight of 500 or more and less than 2000 by a mass analysis method using a flight time type mass analyzer. and resin, polyethylene resin or polypropylene resin or a polyethylene resin and polypropylene resin (also referred to as polyethylene polypropylene resin), a solvent seen including, 7.0 wt% or more 50.0 wt% of an acrylic resin the following is including flux.

Further, the present invention is an acrylic system containing an acrylic acid ester or a methacrylic acid ester, or an acrylic acid ester and a methacrylic acid ester, and having a weight average molecular weight of 500 or more and less than 2000 by a mass analysis method using a flight time type mass analyzer. and resin, polyethylene resin or polypropylene resin or a polyethylene resin and polypropylene resin, and a solvent seen containing a 50.0 wt% or less including flux least 7.0 wt% of an acrylic resin.

Moreover, positive Riechiren resin or polypropylene resin, or preferably contains a polyethylene resin and polypropylene resin less 0.1 wt% or more 10.0 wt%. The content of the acrylic resin is preferably 7.0 wt% or more and 35.0 wt% or less, and most preferably 10.0 wt% or more and 30.0 wt% or less.

Acrylic resin with a number average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer, acrylic resin with a weight average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer The resin is also excellent in compatibility with the rosin-based resin. Therefore, the flux of the present invention may contain a rosin-based resin, and preferably contains a rosin-based resin in an amount of more than 0 wt% and 30.0 wt% or less. The content of the rosin-based resin is most preferably 2.0 wt% or more and 15.0 wt% or less.

Claims (16)

Acrylic resin with a number average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer,
Polyethylene resin or polypropylene resin, or polyethylene resin and polypropylene resin,
A flux characterized by containing a solvent. Acrylic resin with a weight average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer,
Polyethylene resin or polypropylene resin, or polyethylene resin and polypropylene resin,
A flux characterized by containing a solvent. The weight of one type of acrylic resin or the total weight of two or more types of acrylic resin and the weight of one type of polyethylene resin or polypropylene resin, or two or more types of polyethylene resin or polypropylene resin, or The flux according to claim 1 or 2, wherein the ratio to the total weight of the polyethylene-based resin and the polypropylene-based resin is 1.0 or more and 120.0 or less. A claim characterized by containing 7.0 wt% or more and 50.0 wt% or less of an acrylic resin, 0.1 wt% or more and 10.0 wt% or less of a polyethylene resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin. The flux according to any one of items 1 to 3. The flux according to any one of claims 1 to 4, further comprising a rosin-based resin. The flux according to claim 5, wherein the rosin-based resin is contained in an amount of 0 wt% or more and 30.0 wt% or less. Any of claims 1 to 6, further comprising an activator, wherein the activator contains one or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide. The flux according to item 1. Organic acids are dimer acid, which is a reaction product of monocarboxylic acid and is a dimer, hydrogenated dimer acid, which is a reaction product of monocarboxylic acid with hydrogen added, trimeric acid, which is a trimerate of monocarboxylic acid, and hydrogen to trimer acid. 0 wt% or more and 25.0 wt% or less of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or dimer acid, hydrogenated dimer acid, Contains 0 wt% or more and 15.0 wt% or less of organic acids other than trimer acid and hydrogenated trimer acid.
Any of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and one or more kinds of others. The flux according to claim 7, wherein the total content of the organic acids in the above is 30.0 wt% or less. Claim 7 or claim, which comprises 0 wt% or more and 10.0 wt% or less of amine, 0 wt% or more and 5.0 wt% or less of an organic halogen compound, and 0 wt% or more and 2.0 wt% or less of an amine halogenated hydroxide. Item 8. The flux according to Item 8. Further, it contains 0 wt% or more and 10.0 wt% or less of the thixo agent, 0 wt% or more and 10.0 wt% or less of the hindered phenol-based metal inactivating agent, and 0 wt% or more and 5.0 wt% or less of the nitrogen compound-based metal inactivating agent. The flux according to any one of claims 1 to 9, wherein the flux is characterized by the above. A solder paste comprising the flux according to any one of claims 1 to 10 and a metal powder. Metal powder
As: 25 to 300 mass ppm, and Sb: more than 0 mass ppm and less than 3000 mass ppm, Bi: more than 0 mass ppm and less than 10000 mass ppm, and Pb: more than 0 mass ppm and less than 5100 mass ppm, and the balance The solder paste according to claim 11, which has an alloy composition consisting of Sn and satisfies the following equations (1) and (2).
275≤2As + Sb + Bi + Pb ... (1)
0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2)
In the above equations (1) and (2), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition. The solder paste according to claim 12, wherein the alloy composition satisfies the following equation (1a).
275 ≦ 2As + Sb + Bi + Pb ≦ 25200 ... (1a)
In the above formula (1a), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition. The solder paste according to claim 12, wherein the alloy composition satisfies the following equation (1b).
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 ... (1b)
In the above equation (1b), As, Bi, and Pb each represent the content (mass ppm) in the alloy composition. The solder paste according to any one of claims 12 to 14, wherein the alloy composition satisfies the following formula (2a).
0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2a)
In the above formula (2a), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition. The solder paste according to any one of claims 12 to 15, wherein the alloy composition contains at least one of Ag: 0 to 4% by mass and Cu: 0 to 0.9% by mass.