JP6638841B1 - Flux and solder paste - Google Patents

Abstract

A flux having excellent compatibility and excellent temperature cycle reliability, and a solder paste containing the flux and a metal powder are provided. The flux includes an acrylic resin having a number average molecular weight of 500 or more and less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer, a polyethylene resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin. It contains a resin and a solvent. The flux is an acrylic resin having a weight average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer, and a polyethylene resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin. , A solvent. [Selection diagram] None

Description

  The present invention relates to a flux used for soldering and a solder paste using the flux.

  Generally, the flux used for soldering chemically removes the metal oxides present on the metal surface of the solder and the joining object to be soldered, and enables the movement of metal elements at the boundary between the two. It has the effect of doing. Therefore, by performing soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be joined, and a strong joint can be obtained.

  The solder paste is a composite material obtained by mixing a solder alloy powder and a flux. In soldering using solder paste, solder paste is printed on soldered parts such as electrodes on the board, components are mounted on the soldered part where solder paste is printed, and the board is heated in a heating furnace called a reflow furnace. Heating melts the solder and soldering is performed.

  In a conventional flux, a technology has been proposed in which a residue is made flexible by including a polymer acrylic resin to ensure reliability of a temperature cycle (for example, see Patent Document 1).

JP 2010-515576 A

  However, a high-molecular acrylic resin such as a polymer has poor compatibility with an activator. Therefore, when a high-molecular acrylic resin is applied to the flux, the acrylic resin and the activator are separated in the flux, which may affect the solder wettability. Further, a high-molecular acrylic resin has poor compatibility with a rosin resin. Therefore, when a high-molecular acrylic resin is applied to a flux containing a rosin resin, the acrylic resin and the rosin resin may be separated in the flux, and the residue may be stratified. When the residue is stratified, cracks are likely to occur in a temperature cycle, and even if an acrylic resin is contained, the reliability of the temperature cycle is reduced.

  The present invention has been made to solve such problems, and has excellent compatibility with an activator and a rosin-based resin, excellent temperature cycle reliability, and a flux excellent in solder wettability and this flux. An object of the present invention is to provide a solder paste using the same.

  Acrylic resin having a number average molecular weight of 500 to less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer, and an acrylic resin having a weight average molecular weight of 500 to less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer It has been found that the resin has excellent compatibility with the activator, and that the acrylic resin having a molecular weight in the above-mentioned range, and the polyethylene resin and the polypropylene resin have excellent temperature cycle properties.

Therefore, the present invention provides an acrylic or methacrylic ester, or an acrylic resin containing an acrylic ester and a methacrylic ester, and having a number average molecular weight of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer. and resin, polyethylene resin or polypropylene resin or a polyethylene resin and polypropylene resin (also referred to as polyethylene polypropylene resin), a solvent seen including, 7.0 wt% or more 50.0 wt% of an acrylic resin the following is including flux.

Further, the present invention relates to an acrylate or methacrylate, or an acrylate or methacrylate ester having a weight-average molecular weight of 500 or more and less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer. and resin, polyethylene resin or polypropylene resin or a polyethylene resin and polypropylene resin, and a solvent seen containing a 50.0 wt% less including flux least 7.0 wt% of an acrylic resin.

  The flux of the present invention comprises the weight of one acrylic resin or the total weight of two or more acrylic resins and the weight of one polyethylene resin or polypropylene resin, or two or more polyethylene resins. Alternatively, the ratio (acrylic resin / polyethylene / polypropylene resin) to the weight of the polypropylene resin or the total weight of the polyethylene resin and the polypropylene resin is preferably 1.0 or more and 120.0 or less. The weight ratio between the acrylic resin and the polyethylene / polypropylene resin is more preferably 2.0 or more and 100.0 or less, and still more preferably 4.0 or more and 30.0 or less.

Moreover, positive Riechiren resin or polypropylene resin, or preferably contains a polyethylene resin and polypropylene resin less 0.1 wt% or more 10.0 wt%. The content of the acrylic resin is preferably from 7.0 wt% to 35.0 wt%, and most preferably from 10.0 wt% to 30.0 wt%.

Acrylic resin having a number average molecular weight of 500 to less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer, and an acrylic resin having a weight average molecular weight of 500 to less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer The resin has excellent compatibility with the rosin-based resin. For this reason, the flux of the present invention may contain a rosin-based resin, and preferably contains more than 0 wt% and not more than 30.0 wt% of the rosin-based resin. The content of the rosin-based resin is most preferably 2.0 wt% or more and 15.0 wt% or less.

  The flux of the present invention further contains an activator, and as the activator, one or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide.

  The flux of the present invention comprises, as an organic acid, a dimer acid which is a dimer as a reactant of a monocarboxylic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid, and a trimer which is a reactant of a monocarboxylic acid as a trimer. An acid or hydrogenated trimer acid obtained by adding hydrogen to trimer acid, or a mixture of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid in an amount of 0 wt% or more and 25.0 wt% or less. It is preferable to contain 0% to 15.0% by weight of an organic acid other than hydrogenated dimer acid, trimer acid and hydrogenated trimer acid. Also, any one of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and one or more types The total content of other organic acids is preferably 30.0 wt% or less.

  The flux of the present invention comprises an amine of 0 wt% to 10.0 wt%, an organic halogen compound of 0 wt% to 5.0 wt%, an amine hydrohalide of 0 wt% to 2.0 wt%, and a thixotropic agent of 0 wt%. % Or more and 10.0 wt% or less. The content of the organic halogen compound is preferably from 0 wt% to 2.5 wt%, and the content of the amine hydrohalide is preferably from 0 wt% to 1.2 wt%. It is preferable that the flux of the present invention further contains a hindered phenol-based metal deactivator in an amount of 0 wt% to 10.0 wt% and a nitrogen compound-based metal deactivator in a range of 0 wt% to 5.0 wt%. And the remainder is a solvent.

  Further, the present invention is a solder paste containing the above-mentioned flux and metal powder.

Metal powder
As: 25 to 300 mass ppm, and Sb: at least one of more than 0 mass ppm to 3000 mass ppm, Bi: more than 0 mass ppm to 10,000 mass ppm, and Pb: at least one of more than 0 mass ppm to 5,100 mass ppm, and the balance It has an alloy composition of Sn and satisfies the following equations (1) and (2).
275 ≦ 2As + Sb + Bi + Pb (1)
0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2)
In the above equations (1) and (2), As, Sb, Bi, and Pb each represent the content (ppm by mass) in the above alloy composition.

Further, the alloy composition satisfies the following equation (1a).
275 ≦ 2As + Sb + Bi + Pb ≦ 25200 (1a)
In the formula (1a), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

Further, the alloy composition satisfies the following equation (1b).
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 (1b)
In the formula (1b), As, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

Further, the alloy composition satisfies the following equation (2a).
0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2a)
In the formula (2a), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

  Further, the alloy composition contains at least one of Ag: 0 to 4% by mass and Cu: 0 to 0.9% by mass.

  In the present invention, an acrylic resin having a number average molecular weight (Mn) of 500 to less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) or a time-of-flight mass spectrometer (TOF-MS) ), An acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000, or a number average molecular weight (Mn) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). And an acrylic resin having a weight average molecular weight (Mw) of 500 to less than 2,000 and a flux containing a polyethylene resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin, have excellent temperature cycle reliability and are cured after heating. Cracking of the generated flux residue is suppressed.

  An acrylic resin having a molecular weight in the above-described range has excellent compatibility with the activator and improves solder wettability. Further, the acrylic resin having a molecular weight in the above-mentioned range has excellent compatibility with the rosin resin, and when the flux contains the rosin resin, the rosin resin and the acrylic resin become non-uniform and are layered. Is suppressed.

  Thereby, the flux of the present invention can be used for a solder paste to give flexibility to the residue and to suppress cracking of the residue. Moreover, when a rosin-based resin is contained, stratification of the residue can be suppressed. Furthermore, in the solder paste containing the metal powder having the above-described alloy composition, a sufficient effect is obtained on the effect of suppressing the viscosity increase of the solder paste, in addition to the temperature cycle reliability of the flux residue.

<Example of flux of the present embodiment>
The flux of the present embodiment includes an acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time of flight mass spectrometer (TOF-MS); It contains a resin or a polypropylene resin, or a polyethylene resin and a polypropylene resin, and a solvent.

  The flux according to the present embodiment includes an acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), a polyethylene resin or polypropylene. A resin, or a polyethylene resin and a polypropylene resin, and a solvent.

  Here, the number average molecular weight (Mn) and weight average molecular weight (Mw) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) are the number average molecular weight (Mn) and weight average molecular weight (Mw). ) Is about 1.00 or more and 1.30 or less, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method substantially match.

  Therefore, the flux of the present embodiment is an acrylic resin having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). And a polyethylene-based resin or a polypropylene-based resin, or a polyethylene-based resin and a polypropylene-based resin, and a solvent.

  An acrylic resin having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) is called a so-called acrylic oligomer. The acrylic resin uses acrylic acid, acrylic acid ester, which is a reaction product of acrylic acid and alcohol, methacrylic acid, and methacrylic acid ester, which is a reaction product of methacrylic acid and alcohol, as monomers. And a polymer of acrylic acid and an acrylic acid ester. Further, a polymer of methacrylic acid, a polymer of methacrylic acid ester, a polymer of methacrylic acid and methacrylic acid ester and the like can be mentioned. Furthermore, polymers of acrylic acid and methacrylic acid, polymers of acrylic acid and methacrylic acid ester, polymers of methacrylic acid and acrylic acid ester, polymers of acrylic acid ester and methacrylic acid ester, acrylic acid and methacrylic acid and acrylic acid Ester polymer, acrylic acid, methacrylic acid, methacrylic acid ester polymer, acrylic acid, methacrylic acid, acrylic acid ester, methacrylic acid ester polymer, acrylic acid, acrylic acid ester, methacrylic acid ester polymer, methacrylic acid A polymer of an acid, an acrylic acid ester, and a methacrylic acid ester is exemplified. Examples of the acrylate include butyl acrylate.Examples of the acrylic resin using butyl acrylate as a monomer include polymers of butyl acrylate and acrylates other than butyl acrylate and butyl acrylate. Examples thereof include polymers, polymers of acrylic acid and butyl acrylate, and polymers of acrylic acid and butyl acrylate other than acrylic acid and butyl acrylate. Examples of the methacrylate include butyl methacrylate.Examples of the acrylic resin using butyl methacrylate as a monomer include polymers of butyl methacrylate, methacrylate and butyl methacrylate other than butyl methacrylate. Examples thereof include a polymer of an ester, a polymer of methacrylic acid and butyl methacrylate, and a polymer of methacrylate and butyl methacrylate other than methacrylic acid and butyl methacrylate. Further, a polymer of acrylic acid and butyl methacrylate, a polymer of methacrylate and butyl methacrylate other than acrylic acid and butyl methacrylate, a polymer of methacrylic acid and butyl acrylate, a polymer of methacrylic acid and butyl acrylate Polymers of acrylate and butyl acrylate other than butyl ester, polymers of butyl acrylate and butyl methacrylate, polymers of acrylate and butyl methacrylate other than butyl acrylate, butyl acrylate Polymers of esters and methacrylic esters other than butyl methacrylate are exemplified. The polymerization reaction may be random copolymerization or block copolymerization. Further, the above-mentioned alcohol is an alcohol having 1 to 24 carbon atoms in which the carbon chain is linear or an alcohol having 3 to 24 carbon atoms in which the carbon chain is branched. Methanol having 1 carbon atom, ethanol having 2 carbon atoms, 1-propanol having 3 carbon atoms, 2-propanol having 3 carbon atoms, ethylene glycol monomethyl ether having 3 carbon atoms, 1-butanol having 4 carbon atoms, and 2 having 4 carbon atoms -Butanol, isobutanol having 4 carbon atoms, 1-hexanol having 6 carbon atoms, diethylene glycol monoethyl ether having 6 carbon atoms, benzyl alcohol having 7 carbon atoms, 1-octanol having 8 carbon atoms, 2-ethylhexanol having 8 carbon atoms Phenyl glycol having 8 carbon atoms, 1-decanol having 9 carbon atoms, lauryl alcohol having 12 carbon atoms, 16 carbon atoms Cetyl alcohol, stearyl alcohol having 18 carbon atoms, oleyl alcohol having 18 carbon atoms, behenyl alcohol and the like having a carbon number of 22. Such acrylic resins include butyl acrylate oligomer, alkyl acrylate oligomer, butyl methacrylate oligomer, isotridecanol methacrylate oligomer, acrylic acid / butyl acrylate copolymer oligomer, butyl acrylate Ester / polyethylene copolymer oligomers, and the like, and one or more of these can be used.

  Examples of the polyethylene (PE) resin include a polyethylene resin, an acid-modified polyethylene resin, and a polyethylene oxide resin. Examples of the polypropylene (PP) -based resin include a polypropylene resin, an acid-modified polypropylene resin, and an oxidized polypropylene resin. As the polyethylene-based resin and the polypropylene-based resin, one or more of these can be used. As the polyethylene-based resin and the polypropylene-based resin, a copolymer of the above-described polyethylene-based resin and polypropylene-based resin may be used.

  The flux of the present embodiment is obtained by using an acrylic resin having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). 0.0 wt% or more and 50.0 wt% or less, a polyethylene-based resin or a polypropylene-based resin, or a polyethylene-based resin and a polypropylene-based resin in an amount of 0 wt% or more and 10.0 wt% or less. In addition, the flux of the present embodiment includes the weight of one acrylic resin or the total weight of two or more acrylic resins and the weight of one polyethylene resin or polypropylene resin, or two or more types. It is preferable that the ratio (acrylic resin / polyethylene / polypropylene resin) to the total weight of the polyethylene resin or the polypropylene resin or the total weight of the polyethylene resin and the polypropylene resin is 1.0 to 120.0. . The weight ratio of the acrylic resin to the polyethylene / polypropylene resin is more preferably 2.0 or more and 100.0 or less, and still more preferably 4.0 or more and 30.0 or less. The content of the acrylic resin is preferably from 7.0 wt% to 35.0 wt%, and most preferably from 10.0 wt% to 30.0 wt%.

  The flux of the present embodiment may include a rosin-based resin. Examples of the rosin-based resin include raw rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw rosins. Examples of the derivative include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid-modified rosin, phenol-modified rosin, and α, β unsaturated carboxylic acid-modified products (acrylated rosin, maleated rosin, fumaric rosin, Rosin, etc.), and purified, hydrogenated and disproportionated products of the polymerized rosin, and purified, hydrided and disproportionated products of the α, β unsaturated carboxylic acid-modified product. Two or more can be used.

  The flux of the present embodiment contains a rosin-based resin in an amount of 0 wt% or more and 30.0 wt% or less. The content of the rosin-based resin is most preferably 2.0 wt% or more and 15.0 wt% or less.

  The flux of the present embodiment further contains an activator, and as the activator, one or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide.

  The flux of the present embodiment may further include a thixotropic agent, a hindered phenol-based metal deactivator, and a nitrogen compound-based metal deactivator.

  Examples of the organic acid include dimer acid which is a dimer of monocarboxylic acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, and trimer acid and trimer acid which are trimer of monocarboxylic acid. Examples of hydrogenated trimer acid to which hydrogen has been added include dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, which are a reaction product of oleic acid and linoleic acid, a reaction product of oleic acid and linoleic acid. Dimer acid obtained by adding hydrogen to dimer acid which is a reaction product of oleic acid and linoleic acid, or hydrogenated trimer acid obtained by adding hydrogen to trimer acid which is a reaction product of oleic acid and linoleic acid Is mentioned.

  Examples of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid include dimer acid other than the reaction product of oleic acid and linoleic acid, trimer acid other than the reaction product of oleic acid and linoleic acid, and oleic acid and linoleic acid. As a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid other than the acid reactant or a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid other than the reaction product of oleic acid and linoleic acid, a dimer acid which is a reactant of acrylic acid Acrylic acid reactant trimer acid, methacrylic acid reactant dimer acid, methacrylic acid reactant trimer acid, acrylic acid and methacrylic acid reactant dimer acid, acrylic acid and methacrylic acid The reaction of the reactants trimer acid, oleic acid dimer acid, oleic acid trimer acid and linoleic acid Dimer acid, linoleic acid reactant trimer acid, linolenic acid reactant dimer acid, linolenic acid reactant trimer acid, acrylic acid and oleic acid reactant dimer acid, acrylic Trimer acid which is a reaction product of acid and oleic acid, dimer acid which is a reaction product of acrylic acid and linoleic acid, trimer acid which is a reaction product of acrylic acid and linoleic acid, and dimer acid which is a reaction product of acrylic acid and linolenic acid , A reaction product of acrylic acid and linolenic acid, a dimer acid that is a reaction product of methacrylic acid and oleic acid, a trimer acid that is a reaction product of methacrylic acid and oleic acid, and a reaction product of methacrylic acid and linoleic acid. Dimer acid, trimer acid which is a reaction product of methacrylic acid and linoleic acid, and dimer acid which is a reaction product of methacrylic acid and linolenic acid Trimer acid which is a reaction product of methacrylic acid and linolenic acid, dimer acid which is a reaction product of oleic acid and linolenic acid, trimer acid which is a reaction product of oleic acid and linolenic acid, and a dimer which is a reaction product of linoleic acid and linolenic acid Acid, trimer acid which is a reaction product of linoleic acid and linolenic acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid other than the above-mentioned reaction product of oleic acid and linoleic acid, trimer other than the reaction product of oleic acid and linoleic acid And hydrogenated trimer acid obtained by adding hydrogen to an acid.

  One or more of these can be used as dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid. The content of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid may be one or more of other organic acids, amines, organic halogen compounds, and amine hydrohalides according to the present invention. When it is contained within the range defined by the above, it is preferable that the content is 0 wt% or more and 25.0 wt% or less. Further, the content of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid is more than 0 wt% when none of other organic acids, amines, organic halogen compounds and amine hydrohalides are contained. It is preferably at most 25.0 wt%. The content of one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid is more preferably 1.0 wt% or more and 25.0 wt% or less, and still more preferably 3.0 wt%. At least 25.0 wt%, most preferably at least 5.0 wt% and at most 25.0 wt%.

  Other organic acids other than dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid include glutaric acid, adipic acid, azelaic acid, eicosane diacid, citric acid, glycolic acid, succinic acid, salicylic acid, and diglycol. Acid, dipicolinic acid, dibutylaniline diglycolic acid, suberic acid, sebacic acid, thioglycolic acid, phthalic acid, isophthalic acid, terephthalic acid, dodecane diacid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, fumaric acid, maleic Acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris (2-carboxyethyl) isocyanurate, glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (Hydroxymethyl) butanoic acid, 4-tert-butylbenzoic acid, 2,3-dihydroxybenzoic acid, 2,4-diethylglutaric acid, 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid, palmitic acid, stearic acid, 12-hydroxystearic acid, oleic acid, Linoleic acid, linolenic acid and the like.

  One or more of these can be used as the other organic acid. The content of the other organic acid may be one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, amine, organic halogen compound, and amine hydrohalide according to the present invention. When it is contained within the range defined by the formula, it is preferable that the content is 0 wt% or more and 15.0 wt% or less. The content of the other organic acid is more than 0 wt% when none of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, amine, organic halogen compound and amine hydrohalide is contained. It is preferable that the content is 15.0% by weight or less. The content of the other organic acid is more preferably 1.0 wt% or more and 15.0 wt% or less, further preferably 3.0 wt% or more and 15.0 wt% or less, and most preferably 5.0 wt% or more and 15 wt% or less. 0.0 wt% or less. Further, any one of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and one or more types The total content of other organic acids is preferably 30.0 wt% or less.

  Examples of the amine include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4. -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2 -Undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellite 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6 [2'-Undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s- Triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5- Dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazo 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl -S-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2- (1-ethylpentyl) benzimidazole, 2-nonylbenzimidazole, 2- (4-thiazolyl) benzimidazole, benzimidazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2 ' -Hydroxy-3'-tert- Butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-tert-amylphenyl) benzotriazole, 2- (2'-hydroxy-5'- tert-octylphenyl) benzotriazole, 2,2′-methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol], 6- (2-benzotriazolyl) -4-tert- Octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, Carboxybenzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] methylbenzotria , 2,2 '-[[(methyl-1H-benzotriazol-1-yl) methyl] imino] bisethanol, 1- (1', 2'-dicarboxyethyl) benzotriazole, 1- (2 3-dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [(1H-benzotriazol-1-yl) methyl] -4-methylphenol, 5-methyl Benzotriazole, 5-phenyltetrazole and the like can be mentioned.

  One or more of these amines can be used. The content of the amine is at least one selected from the group consisting of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, organic halogen compounds, and amine hydrohalides. When it is contained within the range specified by the formula, it is preferable that the content is 0 wt% or more and 10.0 wt% or less. Further, the content of the amine is more than 0 wt% when none of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, organic halogen compounds, and amine hydrohalides are contained. It is preferably at most 10.0 wt%. The content of the amine is more preferably 1.0% by weight or more and 10.0% by weight or less, and when the activity by the amine is not required, further preferably 1.0% by weight or more and 3.0% by weight or less. When the activity by the amine is required, the content of the amine is more preferably 3.0 wt% or more and 10.0 wt% or less, and most preferably 5.0 wt% or more and 10.0 wt% or less.

  Examples of the organic halogen compound include trans-2,3-dibromo-1,4-butenediol, triallylisocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, and -Bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, 3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, trans-2,3-dibromo-2-butene-1,4-diol, cis-2,3 -Dibromo-2-butene-1,4-diol, tetrabromophthalic acid, bromosuccinic acid and the like. Examples of the organic chloro compound include chloroalkane, chlorinated fatty acid ester, hetic acid, and hetic anhydride. Further, a fluorine-based surfactant which is an organic fluoro compound, a surfactant having a perfluoroalkyl group, and polytetrafluoroethylene are exemplified.

  One or more of these can be used as the organic halogen compound. The content of the organic halogen compound may be one or two or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, amines and amine hydrohalides according to the present invention. When it is contained within the range defined by the formula, it is preferably 0 wt% or more and 5.0 wt% or less, and more preferably 0 wt% or more and 2.5 wt% or less. The content of the organic halogen compound is more than 0% by weight when none of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, amines and amine hydrohalides are contained. It is preferably 5.0 wt% or less, more preferably more than 0 wt% and 2.5 wt% or less.

  Amine hydrohalide is a compound obtained by reacting an amine with hydrogen halide, and examples thereof include aniline hydrogen chloride and aniline hydrogen bromide. As the amine of the amine hydrohalide, the above-mentioned amines can be used, and examples thereof include ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole, and the like.Examples of hydrogen halide include chlorine, Bromine, iodine, and hydrides of fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride) can be given. Further, a borofluoride may be contained in place of the amine hydrohalide or in combination with the amine hydrohalide, and examples of the borofluoride include borofluoric acid.

  One or more of these amine hydrohalides can be used. The content of the amine hydrohalide may be one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, amines, and organic halogen compounds according to the present invention. When the content is included within the range defined by the formula, the content is preferably 0 wt% or more and 2.0 wt% or less, and more preferably 0 wt% or more and 1.2 wt% or less. In addition, the content of the amine hydrohalide machine is 0 wt% when none of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, other organic acids, amines, and organic halogen compounds are contained. It is preferably more than 2.0 wt%, more preferably more than 0 wt% and 1.2 wt% or less.

  Examples of the thixo agent include a wax thixo agent and an amide thixo agent. Examples of the wax-based thixotropic agent include castor hardened oil. Amide-based thixotropic agents include lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-toluene methane amide, Aromatic amide, methylenebisstearic acid amide, ethylenebislauric acid amide, ethylenebishydroxystearic acid amide, saturated fatty acid bisamide, methylenebisoleic acid amide, unsaturated fatty acid bisamide, m-xylylenebisstearic acid amide, aromatic bisamide , Saturated fatty acid amide, unsaturated fatty acid amide, aromatic polyamide, substituted amide, methylol stearic amide, methylol amide, fatty acid ester Amide, and the like.

  One or more of these can be used as a thixotropic agent. The content of the thixotropic agent is preferably 0 wt% or more and 10.0 wt% or less. The content of the thixotropic agent is preferably more than 0 wt% and not more than 10.0 wt%, more preferably not less than 1.0 wt% and not more than 10.0 wt%, and still more preferably not less than 3.0 wt% and not more than 10.0 wt%. Yes, most preferably 5.0 wt% or more and 10.0 wt% or less.

  Examples of the metal deactivator include a hindered phenol-based metal deactivator and a nitrogen compound-based metal deactivator. As the hindered phenol-based metal deactivator, bis (3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid), N, N′-hexamethylenebis (3- (3,3 5-di-tert-butyl-4-hydroxyphenyl) propanamide) and the like. Examples of the nitrogen compound-based metal deactivator include N- (2H-1,2,4-triazol-5-yl) salicylamide.

  One or more of these can be used as the metal deactivator. The content of the metal deactivator is preferably from 0 wt% to 10.0 wt% for the hindered phenol-based metal deactivator, and from 0 wt% to 5.0 wt% for the nitrogen compound-based metal deactivator. The content is preferably 0% by weight or less. The content of the hindered phenol-based metal deactivator is preferably more than 0 wt% and 10.0 wt% or less, more preferably 1.0 wt% or more and 10.0 wt% or less, and further preferably 2.0 wt%. Or more and 10.0 wt% or less, and most preferably 5.0 wt% or more and 10.0 wt% or less. The content of the nitrogen compound-based metal deactivator is preferably more than 0 wt% and 5.0 wt% or less, more preferably 0.1 wt% or more and 5.0 wt% or less, and further preferably 0.5 wt% or more. It is 5.0 wt% or less, most preferably 1.0 wt% or more and 5.0 wt% or less.

  Examples of the solvent include water, ester solvents, alcohol solvents, glycol ether solvents, terpineols, and the like. Examples of the ester solvent include fatty acid alkyl, butyl stearate, 2-ethylhexyl stearate, isotridecyl stearate, methyl oleate, isobutyl oleate, methyl cocoate, methyl laurate, isopropyl myristate, isopropyl palmitate, and palmitate 2 -Ethylhexyl, octyldodecyl myristate and the like. Examples of the alcohol solvent include ethanol, industrial ethanol (a mixed solvent obtained by adding methanol and / or isopropyl alcohol to ethanol), isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1, 5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3 -Dimethyl-2,3-butanediol, 1,1,1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2'-oxybis (methylene) bis ( 2-ethyl-1,3-propanediol), 2,2-bis (hydroxymethyl) -1,3-pro Diol, 1,2,6-trihydroxyhexane, bis [2,2,2-tris (hydroxymethyl) ethyl] ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexane Dimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octyne-3,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol and the like. No. As glycol ether solvents, hexyl diglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether, 1,3- Butylene glycol, phenyl glycol, hexylene glycol and the like.

  One or more of these can be used as the solvent. The content of the solvent is the balance of the content of the essential component when only the acrylic resin and the activator are included as the essential components at the above-mentioned predetermined content.

  When any of the thixotropic agent and the metal deactivator or a combination thereof is contained in the above-mentioned predetermined content in addition to the essential components, the content of the essential components and the content of these optional components is the balance.

<Example of solder paste of the present embodiment>
The solder paste of the present embodiment contains the above-mentioned flux and metal powder. The metal powder is a Sn solder powder, or Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-In or the like, or an alloy of these, Sb, It is composed of a solder alloy powder to which Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, Pb and the like are added.

  The solder alloy contains As: 25 mass ppm or more and 300 mass ppm or less, Sb: more than 0 mass ppm and 3000 mass ppm or less, Bi: more than 0 mass ppm and 10000 mass ppm or less, and Pb: more than 0 mass ppm and 5100 mass ppm or less. It is preferable to have at least one alloy composition with the balance being Sn. The solder alloy may further contain at least one of Ag: 0% by mass to 4% by mass and Cu: 0% by mass to 0.9% by mass.

  As is an element capable of suppressing a change over time in the viscosity of the solder paste. It is presumed that As has low reactivity with flux and is an element noble to Sn, so that it can exhibit a thickening suppressing effect. The lower limit of the As content is, for example, 25 mass ppm or more, preferably 50 mass ppm or more, and more preferably 100 mass ppm or more. On the other hand, if the content of As is too large, the wettability of the solder alloy deteriorates. The upper limit of the As content is, for example, 300 ppm by mass or less, preferably 250 ppm by mass or less, and more preferably 200 ppm by mass or less.

  Sb is an element having low reactivity with the flux and exhibiting a thickening suppressing effect. When the solder alloy contains Sb, the lower limit of the Sb content is, for example, more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, and still more preferably 100 mass ppm or more. And particularly preferably 300 ppm by mass or more. On the other hand, if the Sb content is too large, the wettability deteriorates, so it is necessary to make the Sb content appropriate. The upper limit of the Sb content is, for example, 3000 mass ppm or less, preferably 1150 mass ppm or less, and more preferably 500 mass ppm or less.

  Bi and Pb, like Sb, are elements having low reactivity with flux and exhibiting a thickening suppressing effect. Bi and Pb are elements that can lower the liquidus temperature of the solder alloy and reduce the viscosity of the molten solder, thereby suppressing the deterioration of wettability due to As.

  If at least one element of Sb, Bi and Pb is present, deterioration of wettability due to As can be suppressed. When the solder alloy contains Bi, the lower limit of the Bi content is, for example, more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, and still more preferably 75 mass ppm or more. And particularly preferably at least 100 ppm by mass, and most preferably at least 250 ppm by mass. When the solder alloy contains Pb, the lower limit of the Pb content is more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, and still more preferably 75 mass ppm or more. It is particularly preferably at least 100 ppm by mass, most preferably at least 250 ppm by mass.

  On the other hand, if the content of the Bi or Pb element is too large, the solidus temperature is remarkably lowered, so that the temperature difference ΔT between the liquidus temperature and the solidus temperature becomes too wide. If ΔT is too wide, a liquid phase Bi or Pb is concentrated in the solidification process of the molten solder because a high melting point crystalline phase having a low content of Bi or Pb is deposited. Thereafter, when the temperature of the molten solder further decreases, a low melting point crystalline phase having a high concentration of Bi or Pb segregates. For this reason, the mechanical strength and the like of the solder alloy are deteriorated, and the reliability is deteriorated. In particular, since the crystal phase having a high Bi concentration is hard and brittle, the segregation in the solder alloy significantly lowers the reliability.

  From such a viewpoint, when the solder alloy contains Bi, the upper limit of the Bi content is, for example, 10000 ppm by mass or less, preferably 1000 ppm by mass or less, more preferably 600 ppm by mass or less. Preferably it is 500 mass ppm or less. When the solder alloy contains Pb, the upper limit of the Pb content is, for example, 5100 mass ppm or less, preferably 5000 mass ppm or less, more preferably 1000 mass ppm or less, and still more preferably 850 mass ppm or less. And particularly preferably 500 ppm by mass or less.

  It is preferable that the solder alloy satisfies the following expression (1).

275 ≦ 2As + Sb + Bi + Pb (1)
In the above formula (1), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

  As, Sb, Bi and Pb are all elements that exhibit a thickening suppressing effect. It is preferable that the sum of these is 275 mass ppm or more. In the expression (1), the reason why the As content is doubled is that As has a higher effect of suppressing thickening than Sb, Bi, or Pb.

  The lower limit of Expression (1) is preferably 350 or more, and more preferably 1200 or more. On the other hand, the upper limit of (1) is not particularly limited from the viewpoint of the effect of suppressing thickening, but is preferably 25200 or less, more preferably 10200 or less, from the viewpoint of setting ΔT in a suitable range. It is more preferably 5300 or less, particularly preferably 3800 or less.

  The following formulas (1a) and (1b) are expressions in which the upper and lower limits are appropriately selected from the above preferred embodiments.

275 ≦ 2As + Sb + Bi + Pb ≦ 25200 (1a)
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 (1b)
In the above equations (1a) and (1b), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

  It is preferable that the solder alloy satisfies the following expression (2).

0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2)
In the above formula (2), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

  If the contents of As and Sb are large, the wettability of the solder alloy deteriorates. On the other hand, Bi and Pb suppress the deterioration of wettability due to containing As, but if the content is too large, ΔT will increase. In particular, in an alloy composition containing Bi and Pb simultaneously, ΔT tends to increase. In view of these, if the content of Bi and Pb is increased to excessively improve the wettability, ΔT will increase. On the other hand, when the content of As or Sb is increased to improve the effect of suppressing thickening, wettability deteriorates. Therefore, the group is divided into As and Sb groups and Bi and Pb groups, and when the total amount of both groups is within an appropriate predetermined range, all of the thickening suppression effect, the narrowing of ΔT, and the wettability are simultaneously performed. It will be satisfied.

  If the expression (2) is less than 0.01, the total content of Bi and Pb becomes relatively larger than the total content of As and Pb, so that ΔT is widened. The lower limit of the formula (2) is preferably 0.02 or more, more preferably 0.41 or more, further preferably 0.90 or more, particularly preferably 1.00 or more, and most preferably. Is 1.40 or more. On the other hand, if the expression (2) exceeds 10.00, the total content of As and Sb becomes relatively larger than the total content of Bi and Pb, and the wettability deteriorates. The upper limit of (2) is preferably 5.33 or less, more preferably 4.50 or less, further preferably 2.67 or less, and particularly preferably 2.30 or less.

  Note that the denominator of Expression (2) is “Bi + Pb”, and Expression (2) does not hold unless these are included. Therefore, the solder alloy preferably contains at least one of Bi and Pb. As described above, the alloy composition containing neither Bi nor Pb has poor wettability.

  The following formula (2a) is a formula in which the upper limit and the lower limit are appropriately selected from the above preferred embodiments.

0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2a)
In the above formula (2a), As, Sb, Bi and Pb each represent the content (mass ppm) in the alloy composition.

  Ag is an optional element that can form Ag3Sn at the crystal interface to improve the reliability of the solder alloy. Ag is an element whose ionization coefficient is noble with respect to Sn, and promotes the effect of suppressing thickening of these elements by coexisting with As, Pb, and Bi. The Ag content is preferably 0% by mass or more and 4% by mass or less, more preferably 0.5% by mass or more and 3.5% by mass or less, and further preferably 1.0% by mass or more and 3.0% by mass or less. It is.

  Cu is an optional element that can improve the bonding strength of the solder joint. Further, Cu is an element whose ionization coefficient is noble with respect to Sn and coexists with As, Pb, and Bi to promote the effect of suppressing thickening of these elements. The Cu content is preferably from 0% by mass to 0.9% by mass, more preferably from 0.1% by mass to 0.8% by mass, further preferably from 0.2% by mass to 0.7% by mass. % Or less.

  The balance of the solder alloy is preferably Sn. The solder alloy may contain unavoidable impurities in addition to the aforementioned elements. Even if unavoidable impurities are contained, the effects described above are not affected. If the content of In is too large, ΔT is widened. Therefore, if the content is 1000 ppm or less, the above-mentioned effect is not affected.

<Function and effect example of flux and solder paste of the present embodiment>
Acrylic resin with number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) Resin having a weight average molecular weight (Mw) of not less than 500 and less than 2000 by a method of measurement, a number average molecular weight (Mn) and a weight average molecular weight (Mw) by a mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). A flux containing not less than 500 and less than 2,000 an acrylic resin and a polyethylene resin or a polypropylene resin, or a flux containing a polyethylene resin and a polypropylene resin has excellent temperature cycle reliability and suppresses cracking of a flux residue cured after heating. Is done.

  In addition, the acrylic resin having a molecular weight in the above-described range has excellent compatibility with the activator, and suppresses the non-uniformity of the activator and the acrylic resin from affecting the solder wettability. improves.

  Further, an acrylic resin having a molecular weight in the above-described range has excellent compatibility with a rosin resin. Thereby, in the flux containing the acrylic resin and the rosin resin having the molecular weights in the above-described range, the rosin resin and the acrylic resin are prevented from being non-uniform and stratified.

  Thereby, the flux of the present embodiment is used for the solder paste, and the solder wettability is improved. Further, stratification of the residue can be suppressed. Furthermore, it is possible to give flexibility to the residue and to suppress the residue from cracking.

  Note that an acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 1,000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) and a time-of-flight mass spectrometer (TOF-MS) were used. Acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 1000 by mass spectrometry, a number average molecular weight (Mn) and a weight average molecular weight (Mw) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) The acrylic resin having a molecular weight of 500 or more and less than 1000 has a low molecular weight, and therefore has a low softening point. On the other hand, an acrylic resin having a number average molecular weight (Mn) of 1,000 or more and less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) and a time-of-flight mass spectrometer (TOF-MS) were used. Acrylic resin having a weight average molecular weight (Mw) of 1,000 or more and less than 2,000 by mass spectrometry, a number average molecular weight (Mn) and a weight average molecular weight (Mw) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) The acrylic resin having a molecular weight of 1000 or more and less than 2000 has an effect of increasing the viscosity of the flux, especially when having a high molecular weight, and functions as a thickener. However, if the viscosity further increases due to a change with time, the printability deteriorates from the viewpoint of workability. Therefore, as a method for suppressing thickening, it is preferable to include a hindered phenol-based metal deactivator and a nitrogen compound-based metal deactivator as the metal deactivator within the range specified in the present invention described above. .

  Further, as the solder paste, it is preferable to use a solder alloy containing As, Sb, Bi and Pb within the range specified in the present invention described above. Further, the solder alloy containing As, Sb, Bi, and Pb within the range defined in the present invention preferably satisfies the above-described equation (1), and preferably satisfies the equation (1a) and the equation (1b). It is more preferable that the formula (1) is satisfied. Further, the solder alloy containing As, Sb, Bi, and Pb within the range specified in the present invention preferably satisfies the above-described equation (2), and satisfies the equation (2a). More preferred.

<Measurement of molecular weight of acrylic resin>
The molecular weight of the acrylic resin used in the examples was measured by a mass spectrometry using a time-of-flight mass spectrometer (TOF-MS).

  A time-of-flight mass spectrometer (TOF-MS) measures the mass number from the time of arrival at a detector, utilizing the fact that the flight time of ions accelerated by an electric field in a vacuum depends on the mass-to-charge ratio. It is. The components are ionized by an electrospray ion (ESI) method. The ionized component is accelerated by the electric field and reaches the detector. At this time, the mass number is determined from the flight time of the ions, that is, the time difference until the ions reach the detector, and the structural analysis of the target component is performed.

  The molecular weight of the acrylic resin used in the examples was measured using JMS-T100LP AccuTOF (registered trademark) LC-PLUS manufactured by JEOL Ltd., and the number average molecular weight (Mn) and weight average molecular weight (Mw) were measured. The determined number average molecular weight (Mn) is determined by the following equation (3), and the mass average molecular weight (Mw) is determined by the following equation (4).

The number (3), in the number (4), M _i is equivalent to molecular weight m / z value of the peak of the desired component to be detected by time-of-flight mass spectrometer (TOF-MS). _Ni is the intensity of the peak and corresponds to the number of molecules.

  The names and molecular weights of the acrylic resins used in Examples and Comparative Examples are shown in Table 1 below.

  The acrylic oligomers A to C are all butyl acrylate oligomers. The acrylic oligomer A used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 853.86, determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate oligomer having a weight average molecular weight (Mw) of 900.42 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.05, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  The acrylic oligomer B used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 982.40, which was determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate oligomer having a weight average molecular weight (Mw) of 1097.53 determined by mass spectrometry. The ratio (Mn / Mw) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.12, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  The acrylic oligomer C used a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 1096.51 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate oligomer having a weight average molecular weight (Mw) of 1236.01 determined by mass spectrometry. The ratio (Mn / Mw) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method is 1.13, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method. It can be seen that approximately matches.

  As described above, the butyl acrylate oligomer used in the examples has the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method within the ranges specified in the present invention.

  The acrylic oligomer D used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 1315.06 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an alkyl acrylate oligomer having a weight average molecular weight (Mw) of 1507.79 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.15, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  As described above, the alkyl acrylate oligomer used in the examples has the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method within the range specified in the present invention.

  For the acrylic oligomer E, a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 757.93 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was used. It is a butyl methacrylate oligomer having a weight average molecular weight (Mw) of 844.62 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.11, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  As described above, the butyl methacrylate oligomer used in the examples has the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method within the ranges specified in the present invention.

  The acrylic oligomer F used a time-of-flight mass spectrometer (TOF-MS) having a number-average molecular weight (Mn) of 1028.82 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a methacrylic acid isotridecanol ester oligomer having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.11, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  As described above, the number average molecular weight (Mn) and the weight average molecular weight (Mw) of the isotridecanol methacrylate oligomer used in the examples are within the ranges specified in the present invention.

  Acrylic oligomers G and H are acrylic acid / butyl acrylate copolymer oligomers. The acrylic oligomer G used a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 518.79 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). An acrylic acid / butyl acrylate copolymer oligomer having a weight average molecular weight (Mw) of 625.29 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method is 1.21, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method. It can be seen that approximately matches.

  As the acrylic oligomer H, a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 846.23 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid / butyl acrylate copolymer oligomer having a weight average molecular weight (Mw) of 925.36 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.09, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  As described above, the acrylic acid / butyl acrylate copolymer oligomer used in the examples has the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method within the ranges specified in the present invention. .

  Acrylic oligomers I and J are butyl acrylate / polyethylene copolymer oligomers. The acrylic oligomer I used a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 841.10 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate / polyethylene copolymer oligomer having a weight average molecular weight (Mw) of 914.14 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.09, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  The acrylic oligomer J used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 921.86 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate / polyethylene copolymer oligomer having a weight average molecular weight (Mw) of 1047.26 determined by mass spectrometry. The ratio (Mw / Mn) between the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method is 1.14, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) obtained by the above method. It can be seen that approximately matches.

  As described above, the butyl acrylate / polyethylene copolymer oligomer used in the examples has the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by the above method within the ranges specified in the present invention.

  The butyl acrylate polymer used in the comparative example is an acrylic polymer having a number average molecular weight (Mn) and a weight average molecular weight (Mw) exceeding 4000.

<Evaluation of solder wettability, compatibility, and temperature cycle reliability>
Fluxes of Examples and Comparative Examples were prepared with the compositions shown in Tables 2 and 3 below, and the solder wettability, compatibility, and temperature cycle reliability were verified. The composition ratios in Tables 2 and 3 are wt (% by weight)% when the total amount of flux is 100.

<Evaluation of solder wettability>
(1) Verification method The solder wettability was evaluated by applying the flux of each example and each comparative example on a Cu plate, mounting solder balls on the flux applied on the Cu plate, and performing reflow. The solder wetting spread diameter was measured. In the reflow step, the temperature is increased from 35 ° C. to 250 ° C. in steps of 1 ° C. every 1 second using a reflow apparatus in which the peak temperature is set to 250 ° C., and after reaching 250 ° C., a heat treatment is performed for 30 seconds. Was. The solder ball has a composition expressed as Sn-3Ag-0.5Cu, contains 3.0% by mass of Ag, 0.5% by mass of Cu, and the rest is Sn (96.5% by mass). The diameter of the solder ball is 0.3 mm.

(2) Criteria 基準: The spread diameter of the solder was 510 μm or more.
×: The spread diameter of the solder was less than 510 μm.

<Evaluation of compatibility>
(1) Verification Method For the evaluation of compatibility, the fluxes of Examples and Comparative Examples were adjusted through heating and stirring, and stored at room temperature for 48 hours. The flux after storage was placed at 25 ° C. and visually checked.

(2) Judgment Criteria: Each material is compatible without being separated.
X: Each material separated into two or more components.

<Evaluation of temperature cycle reliability>
(1) Verification Method For the evaluation of the temperature cycle reliability, the fluxes of Examples and Comparative Examples were applied on a Cu plate, and residues were formed on the Cu plate. The residue formed on the Cu plate was visually inspected for cracks in the residue when 500 cycles of a test in which the process of holding the residue at −30 ° C. and + 110 ° C. for 30 minutes each were performed were performed.

(2) Criteria 〇: No cracks were found in the residue X: Cracks were found in the residue

<Comprehensive evaluation>
〇: Solder wettability evaluation, compatibility evaluation, temperature cycle reliability evaluation were all 〇. ×: Solder wettability evaluation, compatibility evaluation, temperature cycle reliability evaluation, or all were x.

  Examples 1 to 10 are cases where the acrylic resin is changed. Example 1 contains 18.0 wt% of the acrylic oligomer A shown in Table 1 as the acrylic resin within the range specified in the present invention. The acrylic oligomer A used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 853.86, determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate oligomer having a weight average molecular weight (Mw) determined by mass spectrometry of 900.42 and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. .

  In Example 1, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). 2.0 wt% is contained within the range specified by the invention. Ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins ( Weight ratio) is within the range specified in the present invention.

  Furthermore, in Example 1, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, in Example 1, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Furthermore, in Example 1, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  Further, in Example 1, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 1, the spread diameter of the solder satisfied the criteria described above, and a sufficient effect on the solder wettability was obtained. Further, the respective materials were compatible without being separated, and a sufficient effect on the compatibility was obtained. Further, no crack was observed in the residue, and a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 2 contains 18.0 wt% of the acrylic oligomer B shown in Table 1 as an acrylic resin within the range specified in the present invention. The acrylic oligomer B used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 982.40, which was determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate oligomer having a weight average molecular weight (Mw) determined by mass spectrometry of 1097.53 and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. .

  Hereinafter, as in Example 1, in Example 2, acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in a range of 15.0 wt% within the range specified in the present invention, and polyethylene-polypropylene-based resin (PE.PP resin). ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Furthermore, in Example 2, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 2 contains 1.0 wt% of 2-phenylimidazole which is an amine as an activator within the range defined by the present invention. Further, in Example 2, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 2, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis is a hindered phenol-based metal deactivator as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 2, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 3 contains 18.0 wt% of the acrylic oligomer C shown in Table 1 as an acrylic resin within the range specified by the present invention. The acrylic oligomer C used a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 1096.51 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is a butyl acrylate oligomer having a weight average molecular weight (Mw) determined by mass spectrometry of 1236.01 and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. .

  Hereinafter, as in Example 1, in Example 3, acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in an amount of 15.0 wt% within the range specified by the present invention, and a polyethylene-polypropylene resin (PE.PP resin) was used. ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 3, dimer acid as an activator was added in an amount of 10.0 wt% within the range defined in the present invention, and succinic acid as another organic acid was added as an activator in a range defined in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 3 contains 1.0 wt% of 2-phenylimidazole, which is an amine, as an activator within the range defined by the present invention. Further, in Example 3, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was prepared according to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 3, the hindered phenol-based metal deactivator bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 3, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 4 contains 18.0 wt% of the acrylic oligomer D shown in Table 1 as an acrylic resin within the range defined by the present invention. The acrylic oligomer D used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 1315.06 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). It is an alkyl acrylate oligomer having a weight average molecular weight (Mw) determined by mass spectrometry of 1507.79, and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. .

  Hereinafter, as in Example 1, in Example 4, acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and polyethylene-polypropylene-based resin (PE.PP resin). ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 4, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 4 contains 1.0 wt% of 2-phenylimidazole, which is an amine, as an activator within the range defined by the present invention. Further, in Example 4, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 4, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 4, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 5 contains 18.0 wt% of the acrylic oligomer E shown in Table 1 as the acrylic resin within the range specified in the present invention. For the acrylic oligomer E, a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 757.93 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was used. It is a butyl methacrylate oligomer having a weight average molecular weight (Mw) determined by mass spectrometry of 844.62 and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. .

  Hereinafter, as in Example 1, in Example 5, acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and polyethylene-polypropylene-based resin (PE.PP resin). ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 5, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 5, 2-phenylimidazole, which is an amine, was contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 5, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 5, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 5, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 6 contains 18.0 wt% of the acrylic oligomer F shown in Table 1 as the acrylic resin within the range specified by the present invention. The acrylic oligomer F used a time-of-flight mass spectrometer (TOF-MS) having a number-average molecular weight (Mn) of 1028.82 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). Isotridecanol methacrylate having a weight average molecular weight (Mw) determined by mass spectrometry of 1138.20 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It is an oligomer.

  Hereinafter, as in Example 1, in Example 6, acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and polyethylene-polypropylene-based resin (PE.PP resin). ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 6, dimer acid as an activator was used in an amount of 10.0 wt% within the range defined in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 6, 2-phenylimidazole, which is an amine, was contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 6, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 6, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 6, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 7 contains 18.0 wt% of the acrylic oligomer G shown in Table 1 as an acrylic resin within the range defined by the present invention. The acrylic oligomer G used a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 518.79 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). Acrylic acid / butyl acrylate having a weight average molecular weight (Mw) determined by mass spectrometry of 625.29 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. A copolymerized oligomer,

  In Example 7, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). It contains 9.0 wt% within the range specified by the invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 7, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 7 contains 1.0 wt% of 2-phenylimidazole which is an amine as an activator within the range defined by the present invention. Furthermore, in Example 7, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was prepared according to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 7, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, is used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 33.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Increase the content of polyethylene / polypropylene resin, increase the weight of one acrylic resin or the total weight of two or more acrylic resins, and the weight of one polyethylene / polypropylene resin or two or more polyethylene In Example 7 where the ratio to the total weight of the polypropylene-based resin was the lower limit within the more preferable range specified in the present invention, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 8 contains 18.0 wt% of the acrylic oligomer H shown in Table 1 as an acrylic resin within the range defined by the present invention. As the acrylic oligomer H, a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 846.23 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid / butyl acrylate having a weight average molecular weight (Mw) determined by mass spectrometry of 925.36 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It is a copolymerized oligomer.

  In Example 8, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). It contains 7.0 wt% within the range specified by the invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 8, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 8 contains 1.0% by weight of 2-phenylimidazole, which is an amine, as an activator within the range defined by the present invention. Furthermore, in Example 8, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 8, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, is used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. Hexyl diglycol is contained as a solvent in a proportion of 35.0 wt% within the range specified in the present invention.

  Increase the content of polyethylene / polypropylene resin, increase the weight of one acrylic resin or the total weight of two or more acrylic resins, and the weight of one polyethylene / polypropylene resin or two or more polyethylene In Example 8 in which the ratio of the total weight of the polypropylene resin to the total weight exceeded the lower limit of the more preferable range defined in the present invention, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 9 contains 18.0 wt% of the acrylic oligomer I shown in Table 1 as an acrylic resin within the range specified by the present invention. The acrylic oligomer I used a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 841.10 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). Acrylate butyl ester / polyethylene having a weight average molecular weight (Mw) determined by mass spectrometry of 914.14 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It is a polymerized oligomer.

  Hereinafter, as in Example 1, in Example 9, acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene / polypropylene-based resin (PE.PP resin) was used. ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 9, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, in Example 9, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 9, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 9, the hindered phenol-based metal deactivator bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 9, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 10, 18.0 wt% of the acrylic oligomer J shown in Table 1 was contained as an acrylic resin within the range specified by the present invention. The acrylic oligomer J used a time-of-flight mass spectrometer (TOF-MS) with a number average molecular weight (Mn) of 921.86 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). Acrylate butyl ester / polyethylene having a weight average molecular weight (Mw) determined by mass spectrometry of 1047.26 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. It is a polymerized oligomer.

  Hereinafter, as in Example 1, in Example 10, an acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene-polypropylene resin (PE.PP resin). ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Furthermore, in Example 10, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, in Example 10, the content of the amine, 2-phenylimidazole, as an activator was 1.0 wt% within the range specified by the present invention. Further, in Example 10, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  Further, in Example 10, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, is used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 10, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 11 is a case where a plurality of types of acrylic resins are included. In Example 11, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 1.8 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 11, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 982.40, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1097.53, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 1.8 wt% of an acrylic acid butyl ester oligomer (acrylic oligomer B) within the range specified in the present invention.

  In Example 11, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1096.51 and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1236.01, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. A butyl acrylate oligomer (acrylic oligomer C) is contained in an amount of 1.8 wt% within the range specified in the present invention.

  In Example 11, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1315.06, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1507.79, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. The alkyl acrylate oligomer (acrylic oligomer D) was used in an amount of 1.8. wt%.

  Further, in Example 11, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 757.93, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) obtained by mass spectrometry using TOF-MS) is 844.62, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the range specified in the present invention. 1.8 wt% of a butyl methacrylate oligomer (acrylic oligomer E) within the range specified in the present invention.

  In Example 11, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1138.20, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 1.8 wt% of a methacrylic acid isotridecanol ester oligomer (acrylic oligomer F) within the range specified in the present invention.

  In Example 11, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained in an amount of 1.8 wt% within the range specified in the present invention.

  In Example 11, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 846.23, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 925.36, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer H) is contained in an amount of 1.8 wt% within the range specified in the present invention.

  Further, in Example 11, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 841.10, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 914.14, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. 1.8 wt% of butyl acrylate / polyethylene copolymer oligomer (acrylic oligomer I) within the range specified in the present invention.

  In Example 11, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 921.86, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 1047.26, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. 1.8 wt% of butyl acrylate / polyethylene copolymer oligomer (acrylic oligomer J) within the range specified in the present invention.

  The total content of each acrylic resin is within the range specified in the present invention.

  Hereinafter, as in Example 1, in Example 11, acrylic acid-modified hydrogenated rosin was used as a rosin-based resin in an amount of 15.0 wt% within the range specified in the present invention, and a polyethylene-polypropylene resin (PE.PP resin) was used. ) Contains 2.0 wt% of a polyethylene resin within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 11, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid, which is another organic acid, was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 11, 2-phenylimidazole, which is an amine, was contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Furthermore, in Example 11, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 11, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 11 in which the acrylic resin was added in combination, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 12 is a case where the content of the polyethylene / polypropylene resin (PE.PP resin) was changed. In Example 12, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Contains 19.8 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 12, acrylic acid-modified hydrogenated rosin was used as the rosin resin, 15.0 wt% within the range specified in the present invention, and polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin). Contains 0.2 wt% within the range specified by the invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 12, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 12, 2-phenylimidazole, which is an amine, was contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 12, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 12, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 12 in which the content of the polyethylene / polypropylene resin (PE.PP resin) was reduced, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 13 and Example 14 are cases where the type of polyethylene / polypropylene resin (PE.PP resin) was changed. In Example 13, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Contains 19.8 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 13, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin, and 15.0 wt% within the range specified in the present invention, and acid-modified polyethylene resin was used as the polyethylene / polypropylene-based resin (PE.PP resin). , Within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 13, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 13 contains 1.0 wt% of 2-phenylimidazole which is an amine as an activator within a range defined by the present invention. Furthermore, in Example 13, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 13, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 13 in which the type of the polyethylene / polypropylene resin (PE.PP resin) was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 14, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Contains 19.8 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 14, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin, 15.0 wt% within the range defined by the present invention, and polyethylene oxide resin was used as the polyethylene / polypropylene-based resin (PE.PP resin). 0.2 wt% is contained within the range specified in the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 14, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 14, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 14, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was prepared according to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 14, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis is a hindered phenol-based metal deactivator as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 14 in which the type of the polyethylene / polypropylene resin (PE.PP resin) was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Examples 15 to 17 are cases in which a plurality of types of polyethylene / polypropylene resins (PE.PP resins) are included. In Example 15, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Contains 19.7 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 15, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0% by weight within the range specified by the present invention. Furthermore, in Example 15, a polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin) in an amount of 0.1 wt% within the range specified in the present invention, and an acid-modified polyethylene resin was used in the range specified in the present invention. 0.1 wt%, and 0.1 wt% of the oxidized polyethylene resin within the range specified in the present invention. The total content of two or more polyethylene / polypropylene resins (PE.PP resins) is within the range specified in the present invention. The weight of one acrylic resin or the total weight of two or more acrylic resins and the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

  Furthermore, in Example 15, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 15, 2-phenylimidazole, which is an amine, is contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 15, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was prepared according to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 15, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, is used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 15 in which a polyethylene / polypropylene resin (PE.PP resin) was added in combination, a sufficient effect on solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 16, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Contains 19.4 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 16, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0% by weight within the range specified by the present invention. Further, in Example 16, a polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin) in an amount of 0.1 wt% within the range specified in the present invention, and an acid-modified polyethylene resin was added in the range specified in the present invention. Within 0.1 wt%, the oxidized polyethylene resin, 0.1 wt% within the range specified by the present invention, the polypropylene resin, 0.1 wt% within the range specified by the present invention, the acid-modified polypropylene resin, 0.1 wt% within the range specified by the present invention, and 0.1 wt% of the oxidized polypropylene resin within the range specified by the present invention. The total content of two or more polyethylene / polypropylene resins (PE.PP resins) is within the range specified in the present invention. The weight of one acrylic resin or the total weight of two or more acrylic resins and the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

  Further, in Example 16, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 16 contains 1.0 wt% of 2-phenylimidazole, which is an amine, as an activator within the range defined by the present invention. Furthermore, in Example 16, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 16, the hindered phenol-based metal deactivator bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 16 in which a polyethylene / polypropylene resin (PE.PP resin) was added in combination, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 17, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 14.0 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 17, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0 wt% within the range defined by the present invention. Furthermore, in Example 17, a polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin), 3.0 wt% within the range specified by the present invention, and an acid-modified polyethylene resin was used in the range specified by the present invention. Within 3.0 wt%. The total content of two or more polyethylene / polypropylene resins (PE.PP resins) is within the range specified in the present invention. The weight of one acrylic resin or the total weight of two or more acrylic resins and the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

  Further, in Example 17, dimer acid as an activator was used at 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator within a range specified by the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 17, 2-phenylimidazole, which is an amine, was contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 17, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 17, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 17 in which a polyethylene / polypropylene resin (PE.PP resin) was added in combination, a sufficient effect on solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 18, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 14.0 wt% of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  In Example 18, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0% by weight within the range specified in the present invention. Further, in Example 18, a polyethylene resin was used as the polyethylene / polypropylene resin (PE.PP resin) at 2.0 wt% within the range specified by the present invention, and the oxidized polypropylene resin was set within the range specified by the present invention. And 4.0 wt%. The total content of two or more polyethylene / polypropylene resins (PE.PP resins) is within the range specified in the present invention. The weight of one acrylic resin or the total weight of two or more acrylic resins and the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

  Further, in Example 18, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 18, 2-phenylimidazole, which is an amine, was contained as an activator in an amount of 1.0 wt% within the range defined by the present invention. Further, in Example 18, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 18, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, is used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 18 in which a polyethylene / polypropylene resin (PE.PP resin) was added in combination, a sufficient effect on solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 19, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  In Example 19, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained at 15.0% by weight within the range specified in the present invention.

  The total content of each acrylic resin is within the range specified in the present invention. Example 19 does not include a rosin-based resin. Example 19 contains 2.0 wt% of an acid-modified polyethylene resin as the polyethylene / polypropylene resin (PE.PP resin) within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 19, dimer acid as an activator was used in an amount of 10.0 wt% within the range defined in the present invention, and succinic acid as another organic acid was used as an activator in the range specified in the present invention. 2.0 wt%, and 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, in Example 19, 2-phenylimidazole, which is an amine, was used as an activator, 1.0 wt% within the range specified in the present invention, and ethylamine / HBr, which is an amine hydrohalide, was used as an activator. 1.0 wt% within the range specified by the present invention, and 1.0 wt% of N, N-diethylaniline.HBr within the range specified by the present invention. The total content of two or more amine hydrohalides is within the range specified in the present invention.

  Furthermore, in Example 19, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 19, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1 wt% within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 19 which did not contain a rosin-based resin but also contained an amine hydrohalide in addition to a dimer acid, another organic acid and an amine as an activator, a sufficient effect on solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 20, as an acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  In Example 20, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) is 518.79, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained at 15.0% by weight within the range specified in the present invention.

  The total content of each acrylic resin is within the range specified in the present invention. Example 20 does not include a rosin-based resin. Example 20 contains 2.0 wt% of an acid-modified polyethylene resin as a polyethylene / polypropylene resin (PE.PP resin) within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 20, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. It contains 3.5 wt% of adipic acid and 3.0 wt% within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 20, 2-phenylimidazole, which is an amine, was used as an activator in an amount of 1.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2, which is an organic halogen compound, was used as an activator. -1.0% by weight of butene-1,4-diol within the range specified by the present invention, and 1.5% by weight of triallylisocyanurate hexabromide within the range specified by the present invention. The total content of two or more organic halogen compounds is within the range specified in the present invention.

  Furthermore, in Example 20, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  Further, in Example 20, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, is used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 38.0 wt% of hexyldiglycol as a solvent within the range specified in the present invention.

  In Example 20 containing no rosin-based resin and containing an organic halogen compound in addition to a dimer acid, another organic acid, and an amine as an activator, a sufficient effect on solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 21, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 5.0 wt% within the range specified in the present invention.

  In Example 21, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / butyl acrylate copolymer oligomer (acrylic oligomer G) is contained in an amount of 5.0 wt% within the range specified in the present invention.

  The total content of each acrylic resin is within the range specified in the present invention. In Example 21, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 13.0% by weight within the range specified by the present invention. Further, Example 21 contains 2.0 wt% of a polyethylene resin as the polyethylene / polypropylene resin (PE.PP resin) within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 21, dimer acid as an activator was used in an amount of 20.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In addition, Example 21 contains 1.0 wt% of 2-phenylimidazole, which is an amine, as an activator within the range defined by the present invention. Further, in Example 21, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  Further, in Example 21, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1 wt% within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 21 in which the content of the acrylic resin was the lower limit of the more preferred range defined in the present invention, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 22, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained in an amount specified in the present invention at 7.5 wt%.

  In Example 22, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / butyl acrylate copolymer oligomer (acrylic oligomer G) is contained in an amount of 5.0 wt% within the range specified in the present invention.

  The total content of each acrylic resin is within the range specified in the present invention. In Example 22, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin in an amount of 13.0% by weight within the range specified by the present invention. Further, in Example 22, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 22, dimer acid as an activator was used in an amount of 17.5 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In addition, Example 22 contains 1.0% by weight of 2-phenylimidazole, which is an amine, as an activator within the range defined by the present invention. Further, in Example 22, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 22, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis is a hindered phenol-based metal deactivator as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 22 in which the content of the acrylic resin was reduced, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 23 is a case where a plurality of types of rosin-based resins are included. In Example 23, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 853.86, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid whose weight average molecular weight (Mw) determined by mass spectrometry using MS) is 900.42, and whose number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. It contains 18.0% by weight of a butyl ester oligomer (acrylic oligomer A) within the range specified in the present invention.

  Also, in Example 23, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin in an amount of 3.0 wt% within the range specified in the present invention, and maleic acid-modified hydrogenated rosin was added in the range specified in the present invention. 2.0 wt%, phenol-modified rosin, 2.0 wt% within the range specified by the present invention, disproportionated rosin, 2.0 wt% within the range specified by the present invention, hydrogenated rosin, It contains 2.0 wt% within the range specified by the invention, 2.0 wt% of polymerized rosin within the range specified by the present invention, and 2.0 wt% of rosin ester within the range specified by the present invention.

  The total content of each rosin-based resin is within the range specified in the present invention. Further, in Example 23, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 23, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 23 contains 1.0 wt% of 2-phenylimidazole which is an amine as an activator within the range defined by the present invention. Further, in Example 23, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was prepared according to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 23, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 23 in which the rosin-based resin was added in combination, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 24 is a case where the kind of another organic acid was changed. In Example 24, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, Example 24 contains 15.0 wt% of acrylic acid-modified hydrogenated rosin as a rosin-based resin within the range defined by the present invention. Further, in Example 24, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 24, dimer acid as an activator was added in an amount of 10.0 wt% within the range defined in the present invention, and succinic acid as another organic acid was added as an activator in a range defined in the present invention. 4.0 wt%, containing 3.0 wt% of dodecanedioic acid within the range specified in the present invention. The total content of succinic acid and dodecanedioic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 24, the content of the amine, 2-phenylimidazole, as an activator was 1.0 wt% within the range defined by the present invention. Further, in Example 24, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was prepared according to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  Further, in Example 24, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebisbis hindered phenol-based metal deactivator was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 24 in which the kind of the other organic acid was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 25 is a case where no other organic acid is contained. In Example 25, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, in Example 25, 15.0 wt% of acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin within the range specified by the present invention. Further, in Example 25, a polyethylene resin was contained as a polyethylene / polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Furthermore, Example 25 contains 17.0 wt% of dimer acid as an activator within the range specified in the present invention, and does not contain other organic acids.

  Further, in Example 25, 2-phenylimidazole which is an amine as an activator was contained in an amount of 1.0 wt% within the range defined by the present invention. Furthermore, in Example 25, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  Further, in Example 25, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  Also in Example 25 containing no other organic acid, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 26 is a case where no organic acid is contained. In Example 26, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  In Example 26, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. An acrylic acid / butyl acrylate copolymer oligomer (acrylic oligomer G) is contained in an amount of 10.0 wt% within the range specified in the present invention.

  The total content of each acrylic resin is within the range specified in the present invention. Further, in Example 26, 16.0 wt% of acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin within the range specified by the present invention. In Example 26, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Example 26 does not include dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and other organic acids.

  In Example 26, the content of the amine, 2-phenylimidazole, as an activator was 1.0 wt% within the range defined by the present invention. Further, in Example 26, trans-2,3-dibromo-2-butene-1,4-diol, which is an organic halogen compound, was used as an activator in an amount of 2.0 wt% within the range specified in the present invention and triallyl. Isocyanurate hexabromide is contained in an amount of 3.0 wt% within the range specified in the present invention. The total content of two or more organic halogen compounds is within the range specified in the present invention. In Example 26, as an activator, ethylamine / HBr, which is an amine hydrohalide, was added in an amount of 0.5 wt% within the range specified in the present invention, and N, N-diethylaniline / HBr was added in the present invention. 0.5 wt% is contained within the specified range. The total content of two or more amine hydrohalides is within the range specified in the present invention.

  Furthermore, in Example 26, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 26, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis-hindered phenol-based metal deactivator was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 26 which did not contain dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and other organic acids, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Examples 27 to 35, combinations of activators were changed. In Example 27, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) determined by mass spectrometry using MS) of 625.29 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. -Contains 21.0 wt% of acrylate acrylate copolymer oligomer (acrylic oligomer G) within the range specified in the present invention.

  Further, Example 27 contains 15.0 wt% of acrylic acid-modified hydrogenated rosin as a rosin-based resin within the range specified by the present invention. Further, in Example 27, as the polyethylene / polypropylene resin (PE.PP resin), a polyethylene resin is contained in an amount of 2.0 wt% within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 27, dimer acid as an activator was used in an amount of 10.0 wt% within the range defined in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. Contains 3.0 wt%. The total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 27, the content of the amine, 2-phenylimidazoline, as an activator was 2.0 wt% within the range defined by the present invention. Furthermore, in Example 27, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 27, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebisbis hindered phenol-based metal deactivator was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 27 in which the combination of the activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 28, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) determined by mass spectrometry using MS) of 625.29 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. -Contains 21.0 wt% of acrylate acrylate copolymer oligomer (acrylic oligomer G) within the range specified in the present invention.

  In Example 28, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0 wt% within the range specified by the present invention. Further, in Example 28, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 28, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and glutaric acid as another organic acid was used as an activator in a range specified in the present invention. Contains 3.0 wt%. The total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 28 contains 2.0 wt% of 2-phenylimidazole which is an amine as an activator within the range defined by the present invention. Further, in Example 28, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 28, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebisbis hindered phenol-based metal deactivator was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 28 in which the combination of the activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 29, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 518.79, and the time-of-flight mass spectrometer (TOF-MS) was used. Acrylic acid having a weight average molecular weight (Mw) determined by mass spectrometry using MS) of 625.29 and having a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. -Contains 21.0 wt% of acrylate acrylate copolymer oligomer (acrylic oligomer G) within the range specified in the present invention.

  In addition, Example 29 contains 15.0 wt% of acrylic acid-modified hydrogenated rosin as a rosin-based resin within the range specified by the present invention. Further, in Example 29, the polyethylene / polypropylene-based resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range defined by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 29, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and glutaric acid as another organic acid was used as an activator in a range specified in the present invention. Contains 3.0 wt%. The total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In addition, Example 29 contains 2.0 wt% of 2-phenylimidazoline as an activator within the range defined by the present invention. Furthermore, in Example 29, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  Further, in Example 29, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 29 in which the combination of the activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 30, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 21.0 wt% within the range specified in the present invention.

  In Example 30, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin in an amount of 15.0% by weight within the range defined by the present invention. Further, in Example 29, the polyethylene / polypropylene-based resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range defined by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 30, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. It contains 1.5 wt% of glutaric acid and 1.5 wt% within the range specified in the present invention. The total content of succinic acid and glutaric acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 30, the content of the amine, 2-phenylimidazoline, as an activator was 2.0 wt% within the range defined by the present invention. Further, in Example 30, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was prepared according to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 30, the hindered phenol-based metal deactivator bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 30 in which the combination of the activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 31, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 19.0 wt% within the range specified in the present invention.

  In Example 31, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0% by weight within the range specified by the present invention. Further, Example 31 contains 2.0 wt% of a polyethylene resin as the polyethylene / polypropylene resin (PE.PP resin) within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 31, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. It contains 2.5 wt% of glutaric acid in the range specified in the present invention. The total content of succinic acid and glutaric acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 31 contains 2.0 wt% of 2-phenylimidazoline as an activator within the range defined by the present invention. Furthermore, in Example 31, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-type thixotropic agent, which was an amide-type thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 31, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis, which is a hindered phenol-based metal deactivator, is used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 31 in which the combination of the activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 32, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, Example 32 contains 15.0 wt% of acrylic acid-modified hydrogenated rosin as a rosin-based resin within the range specified by the present invention. Further, in Example 32, the polyethylene-polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 32, dimer acid as an activator was used in an amount of 11.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 32, no amine was contained. Further, in Example 32, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bis-amide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 32, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 32 in which the combination of the activators was changed and the amine was not contained, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 33, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, Example 33 contains 15.0 wt% of acrylic acid-modified hydrogenated rosin as a rosin-based resin within the range defined by the present invention. Further, in Example 33, a polyethylene resin was contained as a polyethylene / polypropylene resin (PE.PP resin) in an amount of 2.0 wt% within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 33, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Example 33 contains 1.0 wt% of 2-phenyl-4-methylimidazole which is an amine as an activator within the range defined by the present invention. Furthermore, in Example 33, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Example 33, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 33 in which the combination of activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 34, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, Example 34 contains 15.0 wt% of acrylic acid-modified hydrogenated rosin as a rosin-based resin within the range specified by the present invention. Further, in Example 34, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 34, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 2.0 wt%, and 1.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 34, an amine, 2-phenylimidazole, as an activator, 4.0 wt% within the range defined by the present invention, and an amine, 2-phenyl-4-methylimidazole, were specified in the present invention. 4.0 wt% within the specified range. The content of the total of two or more amines is within the range specified in the present invention. Further, Example 34 contains 2.0 wt% of a castor-hardened oil, which is an ester-based thixotropic agent, as a thixotropic agent within the range specified by the present invention.

  In Example 34, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis-hindered phenol-based metal deactivator was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.0 wt%. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 34 in which the combination of activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 35, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, in Example 35, 15.0 wt% of acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin within the range specified by the present invention. Further, in Example 35, as the polyethylene / polypropylene resin (PE.PP resin), a polyethylene resin is contained in an amount of 2.0 wt% within the range defined by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 35, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 35, an amine, 2-phenylimidazole, was used as an activator in an amount of 2.0 wt% within the range specified in the present invention, and an organic halogen compound, 2,3-dibromo-1,4,4, was used as an activator. -Contains 2.0% by weight of butanediol within the range specified in the present invention. Further, in Example 35, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified by the present invention.

  In Example 35, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.0 wt%. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Example 35 in which the combination of the activators was changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  In Example 36, the amount of the thixotropic agent was changed. In Example 36, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was used. ) Is 1028.82, the weight average molecular weight (Mw) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) is 1138.20, and the number average molecular weight (Mn) and weight average molecular weight (Mn) are Mw) is an isotridecanol methacrylate oligomer (acryl oligomer F) having a content within the range specified in the present invention, and contains 18.0% by weight within the range specified in the present invention.

  In Example 36, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0% by weight within the range specified by the present invention. In Example 36, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Example 36, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 36, the content of the amine, 2-phenylimidazole, as an activator was 1.0 wt% within the range defined by the present invention. Further, in Example 36, the content of castor-hardened oil, which is an ester-based thixotropic agent, as a thixotropic agent was 7.0 wt% within the range specified by the present invention.

  Further, in Example 36, the metal deactivator was not contained, and the remainder was hexyldiglycol as a solvent in an amount of 40.0 wt% within the range specified by the present invention.

  In Example 36 in which the content of the thixotropic agent was increased and the metal deactivator was not contained, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 37 is a case where the types of the thixotropic agent and the solvent were changed. In Example 37, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, in Example 37, 15.0 wt% of acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin within the range specified by the present invention. Further, in Example 37, the polyethylene / polypropylene resin (PE.PP resin) contains 2.0 wt% of a polyethylene resin within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Furthermore, in Example 37, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, in Example 37, the content of the amine, 2-phenylimidazole, as an activator was 1.0 wt% within the range defined by the present invention. Further, in Example 37, a bisamide thixo agent, which is an amide thixo agent, was contained as a thixo agent in an amount of 3.0 wt% within the range specified in the present invention.

  Further, in Example 37, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 41.0% by weight of ethylhexyl diglycol as a solvent within the range specified in the present invention.

  In Example 37 in which the types of the thixotropic agent and the solvent were changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  Example 38 is a case where the types of the thixotropic agent, the metal deactivator and the solvent were changed. In Example 38, as the acrylic resin, the number average molecular weight (Mn) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometer (TOF-MS) was used. Methacrylic acid having a weight average molecular weight (Mw) of 1138.20 determined by mass spectrometry using MS) and a number average molecular weight (Mn) and a weight average molecular weight (Mw) within the ranges specified in the present invention. Isotridecanol ester oligomer (acrylic oligomer F) is contained at 18.0 wt% within the range specified in the present invention.

  Further, Example 38 contains 15.0 wt% of acrylic acid-modified hydrogenated rosin as a rosin-based resin within the range specified by the present invention. Further, in Example 38, a polyethylene resin as a polyethylene / polypropylene resin (PE.PP resin) is contained in an amount of 2.0 wt% within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Furthermore, in Example 38, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  In Example 38, the content of the amine, 2-phenylimidazole, as an activator was 1.0 wt% within the range defined by the present invention. Further, in Example 38, a bisamide thixo agent, which is an amide thixo agent, was contained as a thixo agent in an amount of 3.0 wt% within the range specified in the present invention.

  In Example 38, N, N′-hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl), a hindered phenol-based metal deactivator, was used as the metal deactivator. ) Propanamide] with N- (2H-1,2,4-triazol-5-yl) salicylamide, which is a nitrogen compound-based metal deactivator, in the range specified in the present invention at 2.9 wt%. The total content of two or more metal deactivators containing 0.1 wt% within the range specified by the present invention is within the range specified by the present invention. The remainder contains 41.0% by weight of ethylhexyl diglycol as a solvent within the range specified in the present invention.

  In Example 38 in which the types of the thixotropic agent, the metal deactivator and the solvent were changed, a sufficient effect on the solder wettability was obtained. In addition, a sufficient effect on compatibility was obtained. Furthermore, a sufficient effect was obtained on the reliability of the temperature cycle.

  On the other hand, in Comparative Example 1, as the acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) was 1028.82, and the time-of-flight mass spectrometry was used. Weight average molecular weight (Mw) determined by mass spectrometry using a total analyzer (TOF-MS) is 1138.20, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Methacrylic acid isotridecanol ester oligomer (acrylic oligomer F) which is 25.0% by weight within the range specified in the present invention.

  In Comparative Example 1, the acrylic resin had a number average molecular weight (Mn) of 518.79 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) and a time-of-flight mass spectrometer ( The weight average molecular weight (Mw) determined by mass spectrometry using TOF-MS) is 625.29, and the number average molecular weight (Mn) and weight average molecular weight (Mw) are within the ranges specified in the present invention. Acrylic acid / acrylic acid butyl ester copolymerized oligomer (acrylic oligomer G) is contained at 20.0 wt% within the range specified in the present invention.

  The total content of each acrylic resin is within the range specified in the present invention. In Comparative Example 1, a polyethylene resin was used as a polyethylene / polypropylene resin (PE.PP resin) without containing a rosin resin, 4.0 wt% within the range specified in the present invention, and a polypropylene oxide resin was used as a polyethylene / polypropylene resin. 4.0 wt% is contained within the range specified by the invention. The total content of two or more polyethylene / polypropylene resins (PE.PP resins) is within the range specified in the present invention. The weight of one acrylic resin or the total weight of two or more acrylic resins and the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins The ratio is within the range specified in the present invention.

  Furthermore, Comparative Example 1 does not contain an activator, contains 2.0 wt% of a castor-hardened oil that is an ester-based thixotropic agent as a thixotropic agent within the range specified in the present invention, and contains a bisamide-based amido-based thixotropic agent. A thixotropic agent is contained at 2.0 wt% within the range specified in the present invention. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Comparative Example 1, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Comparative Example 1 containing no activator, effects were obtained with respect to compatibility and reliability of temperature cycle, but no effect was obtained with respect to solder wettability.

  In Comparative Example 2, as the acrylic resin, the number average molecular weight (Mn) and the weight average molecular weight (Mw) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) are defined in the present invention. 18.0% by weight of a butyl acrylate polymer as an acrylic polymer having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of more than 4000 without containing an acrylic oligomer within a range of

  In Comparative Example 2, acrylic acid-modified hydrogenated rosin was contained as a rosin-based resin at 15.0 wt% within the range specified in the present invention. Further, Comparative Example 2 contains 2.0 wt% of a polyethylene resin as the polyethylene / polypropylene resin (PE.PP resin) within the range specified by the present invention. The ratio of the weight of one acrylic resin or the total weight of two or more acrylic resins to the weight of one polyethylene / polypropylene resin or the total weight of two or more polyethylene / polypropylene resins is , Within the range defined by the present invention.

  Further, in Comparative Example 2, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Comparative Example 2 contains 1.0% by weight of 2-phenylimidazole which is an amine as an activator within the range defined by the present invention. Further, in Comparative Example 2, a castor-hardened oil, which is an ester-based thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention, and a bisamide-based thixotropic agent, which was an amide-based thixotropic agent, was added to the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Comparative Example 2, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylene bis is a hindered phenol-based metal deactivator as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1 wt% within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  The number-average molecular weight (Mn) and weight-average molecular weight (Mw) determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) do not include acrylic oligomers within the range specified in the present invention. In Comparative Example 2 including an acrylic polymer having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of more than 4000, an effect on solder wettability was obtained, but each material was separated into two or more components. No effect was obtained for compatibility. In addition, the residue was not sufficiently cured, and the reliability of the temperature cycle could not be evaluated.

  In Comparative Example 3, neither the acrylic oligomer nor the acrylic polymer was included as the acrylic resin. Further, in Comparative Example 3, acrylic acid-modified hydrogenated rosin was used as the rosin-based resin, 34.8 wt% exceeding the range specified in the present invention, and polyethylene resin was used as the polyethylene-polypropylene resin (PE.PP resin). 0.2 wt% is contained within the range specified in the present invention.

  Further, in Comparative Example 3, dimer acid as an activator was used in an amount of 10.0 wt% within the range specified in the present invention, and succinic acid as another organic acid was used as an activator in a range specified in the present invention. 4.0 wt%, and contains 3.0 wt% of adipic acid within the range specified in the present invention. The total content of succinic acid and adipic acid is within the range of other organic acids defined in the present invention. Further, the total content of the dimer acid and the other organic acid is within the range specified in the present invention.

  Further, Comparative Example 3 contains 1.0 wt% of 2-phenylimidazole, which is an amine, as an activator within the range defined by the present invention. Further, in Comparative Example 3, a castor-hardened oil, which is an ester-type thixotropic agent, was contained as a thixotropic agent in an amount of 2.0 wt% within the range specified in the present invention. 2.0 wt% within the range specified by. The total content of the two or more thixotropic agents is within the range specified in the present invention.

  In Comparative Example 3, bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid], which is a hindered phenol-based metal deactivator, was used as the metal deactivator. (Oxyethylene)] within the range specified in the present invention by 2.9 wt%, N- (2H-1,2,4-triazol-5-yl) salicylamide which is a nitrogen compound-based metal deactivator. Is 0.1% by weight within the range specified by the present invention, and the total content of two or more metal deactivators is within the range specified by the present invention. The remainder contains 40.0 wt% of hexyl diglycol as a solvent within the range specified in the present invention.

  In Comparative Example 3 containing no acrylic resin, an effect was obtained on the solder wettability. However, although the residue was cured, cracking was observed in the residue, and no effect was obtained on the reliability of the temperature cycle. In addition, compatibility was not evaluated because no acrylic resin was contained.

<Evaluation of thickening suppression effect of solder paste>
The effect of suppressing the viscosity increase of the solder paste prepared using the flux of Example 1 described above and the solder alloys having the compositions shown in Tables 4 to 9 below was also examined. A solder having the flux of Example 1 shown in Table 2 and the alloy composition shown in Tables 4 to 9 and having a size (particle size distribution) satisfying symbol 4 in the powder size classification (Table 2) in JIS Z 3284-1: 2014. The mixture was mixed with powder to prepare a solder paste. The mass ratio of the flux to the solder powder is flux: solder powder = 11: 89.

(1) Verification method A rotational viscometer (PCU-205, manufactured by Malcom Co., Ltd.) was used for the obtained solder paste in accordance with the method described in “4.2 Viscosity characteristic test” of JIS Z 3284-3: 2014. The viscosity was continuously measured for 12 hours at a rotation speed of 10 rpm and a measurement temperature of 25 ° C. Then, the initial viscosity (viscosity after 30 minutes of stirring) and the viscosity after 12 hours were compared, and the effect of suppressing the thickening was evaluated based on the following criteria.
(2) Judgment Criteria: Viscosity after 13 hours ≦ initial viscosity × 1.2: small increase in viscosity over time and good x: viscosity after 13 hours> initial viscosity × 1.2: large increase in viscosity over time Bad

  In the flux of Example 1 shown in Table 2 and the solder paste using the solder alloys of Examples 1A to 108A shown in Tables 4 to 9 that satisfy the above equations (1) and (2), the flux residue In addition to the temperature cycle reliability described above, all the alloy compositions satisfy all the requirements of the present invention, and thus a sufficient effect was obtained with respect to the effect of suppressing the thickening of the solder paste. In addition, about the solder powder of Examples 1A-108A before mixing with a flux, using SII Nanotechnology Co., Ltd., model number: EXSTAR DSC7020, sample amount: about 30 mg, heating rate: 15 ° C./min A DSC measurement was performed to obtain a solidus temperature and a liquidus temperature, and the solidus temperature was subtracted from the obtained liquidus temperature to obtain ΔT. In each example, ΔT was 10 ° C. or less. And ΔT was in a suitable range.

  On the other hand, in the solder paste using the flux of Example 1 shown in Table 2 and the solder alloys of Comparative Examples 1A, 3A, 5A, 7A, 9A and 11A shown in Tables 4 to 9, the solder alloy is As , The effect of suppressing thickening was not exhibited.

  In the solder paste using the flux of Example 1 shown in Table 2 and the solder alloys of Comparative Examples 2A, 4A, 6A, 8A, 10A and 12A shown in Tables 4 to 9, the expression (1) is less than the lower limit. Therefore, the effect of suppressing thickening was not exhibited.

  Next, among the examples shown in Tables 2 and 3, Example 11 in which an acrylic resin was compositely added, Example 23 in which rosin was compositely added, dimer acid as an organic acid, and other organic acids were used. The effect of suppressing the thickening of the solder paste prepared by using the solder alloy having the composition shown in Table 10 below was also verified with Example 25 containing no organic acid and Example 26 containing no organic acid.

  In Table 10, Example 1A in Example 4A to Example A1, Example A2 in Example A2, Example 15A in Example A3, Example 18A in Example A4, and Comparative Example 1A in Tables 4 to 9 described above were compared. Example A1 and Comparative Example 2A were designated as Comparative Example A2. Further, the embodiment 19A is replaced with the embodiment B1. Example 20A was Example B2, Example 33A was Example B3, Example 36A was Example B4, Comparative Example 3A was Comparative Example B1, and Comparative Example 4A was Comparative Example B2. Further, Example 73A was replaced with Example C1. Example 74A was Example C2, Example 86A was Example C3, Example 87A was Example C4, Example 90 was Example C5, Comparative Example 9A was Comparative Example C1, and Comparative Example 10A was Comparative Example C2. .

  Not only the flux of Example 1 shown in Table 2 but also the flux of each Example shown in Tables 2 and 3 and the flux of each Example shown in Table 10 satisfying the above equations (1) and (2) In the solder paste using the solder alloy, a sufficient effect was obtained on the effect of suppressing the viscosity increase of the solder paste in addition to the temperature cycle reliability of the flux residue.

  On the other hand, in the fluxes of the examples shown in Tables 2 and 3 and the solder paste using the solder alloys of Comparative Examples A1, B1 and C1 shown in Table 10, the solder alloy does not contain As, so No viscosity suppressing effect was exhibited.

  In the flux of each example shown in Tables 2 and 3, and the solder paste using the solder alloys of Comparative Examples A2, B2, and C2 shown in Table 10, since the formula (1) is less than the lower limit, the effect of suppressing thickening is obtained. Was not demonstrated.

  From the above, an acrylic resin having a number average molecular weight (Mn) of 500 to less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) or a time-of-flight mass spectrometer (TOF-MS) Acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a mass spectrometer (MS) or a number average molecular weight (Mn) by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS). ) And a flux containing an acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2,000, an activator, and a solvent, the solder sufficiently wets and spreads.

  Further, in a flux containing an acrylic resin, an activator and a solvent having a molecular weight in the range described above, the compatibility between the acrylic resin and the activator, and when the resin contains a rosin resin, the acrylic resin, the rosin resin and the activator are used. Is excellent in compatibility, and it is suppressed that each component becomes non-uniform and is stratified.

  Furthermore, a flux containing an acrylic resin having a molecular weight in the above-mentioned range, an activator, and a solvent has excellent heat cycle reliability, and suppresses cracking of a flux residue cured after heating.

  Thus, the flux of the present embodiment can be used for a solder paste to obtain solder wettability. Further, stratification of the residue can be suppressed. Furthermore, it is possible to give flexibility to the residue and to suppress the residue from cracking.

  These effects were not inhibited by the inclusion of other resins, thixotropic agents, and metal deactivator activators within the range specified in the present invention.

  In addition, as an acrylic resin, the number average molecular weight (Mn) obtained by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) is 1028.82, and a time-of-flight mass spectrometer (TOF-MS) is used. The weight average molecular weight (Mw) determined by the mass spectrometry used is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are 1000 or more. Isotridecanol methacrylate oligomer (acryl oligomer) Even when a flux containing F) within the range specified in the present invention is used, the hindered phenol-based metal deactivator and the nitrogen compound-based metal deactivator are specified in the present invention described above. By containing it in the range, a sufficient effect on the thickening suppression effect was obtained.

  Furthermore, this flux, As: 25 mass ppm or more and 300 mass ppm or less, Sb: more than 0 mass ppm to 3000 mass ppm, Bi: more than 0 mass ppm to 10,000 mass ppm, and Pb: more than 0 mass ppm to 5100 mass ppm At least one of the following, Ag: 0% by mass to 4% by mass, Cu: 0% by mass to 0.9% by mass, and the balance being Sn, and the formula (1) and the formula (2) In the case of a solder paste using a solder alloy that satisfies the formula, an acrylic resin having a number average molecular weight (Mn) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), or Acrylic resin having a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS), or flight time Solder wettability, compatibility, and temperature cycle due to containing an acrylic resin having a number average molecular weight (Mn) and a weight average molecular weight (Mw) of 500 or more and less than 2000 by mass spectrometry using a mass spectrometer (TOF-MS) The reliability was not impaired, and a sufficient effect was obtained on the effect of suppressing thickening.

  In particular, as an acrylic resin, a time-of-flight mass spectrometer (TOF-MS) having a number average molecular weight (Mn) of 1028.82 determined by mass spectrometry using a time-of-flight mass spectrometer (TOF-MS) is used. The weight average molecular weight (Mw) determined by the mass spectrometry used is 1138.20, and the number average molecular weight (Mn) and the weight average molecular weight (Mw) are 1000 or more. Isotridecanol methacrylate oligomer (acryl oligomer) A solder paste containing As, Sb, Bi and Pb within the range specified in the present invention as described above, even in a solder paste using a flux containing F) in the range specified in the present invention. Thus, a sufficient effect was obtained with respect to the effect of suppressing thickening.

Claims (16)

Acrylic resin containing acrylate or methacrylate, or containing acrylate and methacrylate, the number average molecular weight of which is 500 or more and less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer,
Polyethylene resin or polypropylene resin, or polyethylene resin and polypropylene resin,
And a solvent seen including,
Flux, wherein the acrylic 7.0 wt% or more 50.0 wt% or less including that the resin. Acrylic or methacrylic acid ester, or an acrylic resin containing an acrylate and a methacrylic acid ester, and having a weight average molecular weight of 500 or more and less than 2,000 by mass spectrometry using a time-of-flight mass spectrometer,
Polyethylene resin or polypropylene resin, or polyethylene resin and polypropylene resin,
And a solvent seen including,
Flux, wherein the acrylic 7.0 wt% or more 50.0 wt% less including that the resin. And the sum of the weight of one of the acrylic resin having a weight or more of the acrylic resin, by weight of one polyethylene resin or polypropylene resin, or two or more polyethylene resin or polypropylene resin 3. The flux according to claim 1, wherein a ratio with respect to a total weight of the polyethylene resin and the polypropylene resin is 1.0 or more and 120.0 or less. 4. Po Riechiren resin or polypropylene resin, or according to any one of claims 1 to 3, characterized in that it comprises a polyethylene resin and polypropylene resin less 0.1 wt% or more 10.0 wt% flux. The flux according to claim 1, further comprising a rosin-based resin. The flux according to claim 5, wherein the flux contains more than 0 wt% and not more than 30.0 wt% rosin-based resin. 7. The method according to claim 1, further comprising an activator, wherein the activator includes one or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide. Or the flux according to item 1. Organic acids include dimer acid which is a dimer of a monocarboxylic acid, hydrogenated dimer acid obtained by adding hydrogen to a dimer acid, and trimer acid which is a trimer of a reactant of monocarboxylic acid and hydrogen which is a trimer. , Or at least two kinds of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, from 0 wt% to 25.0 wt%, dimer acid, hydrogenated dimer acid, Containing from 0 wt% to 15.0 wt% of organic acids other than trimer acid and hydrogenated trimer acid,
Any of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and one or more other The flux according to claim 7, wherein the total content of the organic acids is 30.0 wt% or less. 8. The composition according to claim 7, wherein the composition contains 0 wt% to 10.0 wt% of an amine, 0 wt% to 5.0 wt% of an organic halogen compound, and 0 wt% to 2.0 wt% of an amine hydrohalide. Item 10. The flux according to item 8, Further, a thixotropic agent is contained in an amount of 0 wt% to 10.0 wt%, a hindered phenol-based metal deactivator is contained in a range of 0 wt% to 10.0 wt%, and a nitrogen compound-based metal deactivator is contained in a range of 0 wt% to 5.0 wt%. The flux according to any one of claims 1 to 9, wherein: A solder paste comprising the flux according to any one of claims 1 to 10 and a metal powder. Metal powder
As: 25 to 300 mass ppm, and Sb: at least one of more than 0 mass ppm to 3000 mass ppm, Bi: more than 0 mass ppm to 10,000 mass ppm, and Pb: at least one of more than 0 mass ppm to 5,100 mass ppm, and the balance The solder paste according to claim 11, which has an alloy composition of Sn and satisfies the following equations (1) and (2).
275 ≦ 2As + Sb + Bi + Pb (1)
0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2)
In the above equations (1) and (2), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition. 13. The solder paste according to claim 12, wherein the alloy composition satisfies the following equation (1a).
275 ≦ 2As + Sb + Bi + Pb ≦ 25200 (1a)
In the formula (1a), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition. The solder paste according to claim 12, wherein the alloy composition satisfies the following equation (1b).
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 (1b)
In the formula (1b), As, Bi, and Pb each represent the content (mass ppm) in the alloy composition. The solder paste according to any one of claims 12 to 14, wherein the alloy composition satisfies the following equation (2a).
0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2a)
In the equation (2a), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.   The solder paste according to any one of claims 12 to 15, wherein the alloy composition contains at least one of Ag: 0 to 4% by mass and Cu: 0 to 0.9% by mass.