JP7129369B2 - Antenna device and communication terminal device - Google Patents

Antenna device and communication terminal device Download PDF

Info

Publication number
JP7129369B2
JP7129369B2 JP2019058999A JP2019058999A JP7129369B2 JP 7129369 B2 JP7129369 B2 JP 7129369B2 JP 2019058999 A JP2019058999 A JP 2019058999A JP 2019058999 A JP2019058999 A JP 2019058999A JP 7129369 B2 JP7129369 B2 JP 7129369B2
Authority
JP
Japan
Prior art keywords
antenna
antenna device
heat
heat dissipation
contact surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019058999A
Other languages
Japanese (ja)
Other versions
JP2020161968A (en
Inventor
尚記 外間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2019058999A priority Critical patent/JP7129369B2/en
Priority to US16/821,707 priority patent/US11189903B2/en
Priority to CN202010196641.4A priority patent/CN111755802B/en
Publication of JP2020161968A publication Critical patent/JP2020161968A/en
Application granted granted Critical
Publication of JP7129369B2 publication Critical patent/JP7129369B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Description

本発明は、アンテナ装置および通信端末装置に関する。 The present invention relates to an antenna device and a communication terminal device.

近年、携帯電話等の無線通信システムに用いられるミリ波アンテナモジュールの需要が高まっている。また、ミリ波アンテナモジュールに備えられる集積回路（ＩＣ）から発生する熱を放熱させることも要求されている。 In recent years, the demand for millimeter wave antenna modules used in wireless communication systems such as mobile phones has increased. It is also required to dissipate heat generated from an integrated circuit (IC) provided in the millimeter wave antenna module.

例えば、特許文献１には、第１のヒートパイプの作動液溜まり部となる下部に第１のモジュールが配置され、第２の平板型ヒートパイプの作動液溜まり部となる下部に第２のモジュールが配置されている、アレイモジュールが開示されている。 For example, in Patent Document 1, a first module is arranged in the lower part of a first heat pipe that serves as a working fluid reservoir, and a second module is arranged in the lower part that serves as a working fluid reservoir of a second flat plate heat pipe. Disclosed is an array module in which the .

また、特許文献２には、ヒートシンクを使用してミリ波通信ＩＣの放熱を行い、ヒートシンクの一部を使用してアンテナが形成されることによって、ミリ波通信エリアの拡大と、ミリ波通信ＩＣの放熱とを両立する、ミリ波送受信機が開示されている。 Further, in Patent Document 2, a heat sink is used to dissipate heat from a millimeter wave communication IC, and a part of the heat sink is used to form an antenna, thereby expanding the millimeter wave communication area and improving the millimeter wave communication IC. Disclosed is a millimeter-wave transmitter and receiver that is compatible with heat dissipation.

また、特許文献３には、アンテナ部と放熱部とを備えた、小型のアンテナ装置が開示されている。 Further, Patent Document 3 discloses a small antenna device including an antenna section and a heat radiating section.

特開２０１６－１０９３４７号公報（２０１６年６月２０日公開）Japanese Patent Application Laid-Open No. 2016-109347 (published on June 20, 2016) 特開２０１１－２１１４２４号公報（２０１１年１０月２０日公開）Japanese Patent Application Laid-Open No. 2011-211424 (published on October 20, 2011) 特開２０１７－４６１２１号公報（２０１７年３月２日公開）Japanese Patent Application Laid-Open No. 2017-46121 (published on March 2, 2017)

しかしながら、特許文献１～３に開示されているアンテナ装置は、不要放射による利得低下等のアンテナ性能の劣化抑制については考慮されていない。本発明の一態様は、放熱性の向上とアンテナ性能の劣化抑制とを同時に満たすアンテナ装置を実現することを目的とする。 However, the antenna devices disclosed in Patent Documents 1 to 3 do not consider suppression of deterioration of antenna performance such as gain reduction due to unnecessary radiation. An object of one embodiment of the present invention is to realize an antenna device that simultaneously satisfies improvement in heat dissipation and suppression of deterioration in antenna performance.

上記の課題を解決するために、本発明の一態様に係るアンテナ装置は、
少なくとも片面に熱源を有するアンテナ基板と、
前記熱源において生じた熱を放熱する放熱部材と、を備え、
前記放熱部材は、
前記熱源の少なくとも一部に接しており、
前記アンテナ基板との接触面から当該接触面の法線方向の所定の距離未満においては、前記アンテナ基板と平行な断面積が前記アンテナ基板との接触面の面積以下であり、前記所定の距離以上の少なくとも一部においては、前記アンテナ基板と平行な断面積が前記接触面の面積よりも大きい、
ことを特徴とするアンテナ装置である。 In order to solve the above problems, an antenna device according to one aspect of the present invention includes:
an antenna substrate having a heat source on at least one side;
and a heat dissipation member that dissipates heat generated in the heat source,
The heat dissipation member is
in contact with at least a portion of the heat source;
Within a predetermined distance from the contact surface with the antenna substrate in the normal direction of the contact surface, the cross-sectional area parallel to the antenna substrate is equal to or less than the area of the contact surface with the antenna substrate, and is equal to or greater than the predetermined distance. In at least a part of, the cross-sectional area parallel to the antenna substrate is larger than the area of the contact surface,
An antenna device characterized by:

本発明の一態様によれば、放熱性の向上とアンテナ性能の劣化抑制とを同時に満たすアンテナ装置を実現することができる。 According to one aspect of the present invention, it is possible to realize an antenna device that simultaneously satisfies improvement in heat dissipation and suppression of deterioration in antenna performance.

実施形態１に係るアンテナ装置の要部構成を示す斜視図（ａ）およびＸ方向から見た図（ｂ）である。1A and 1B are a perspective view (a) and a view (b) of the main configuration of the antenna device according to Embodiment 1, as seen from the X direction; 実施形態２に係るアンテナ装置の要部構成を示す斜視図（ａ）およびＸ方向から見た図（ｂ）である。It is the perspective view (a) which shows the principal part structure of the antenna device which concerns on Embodiment 2, and the figure (b) seen from the X direction. 実施形態３に係るアンテナ装置の要部構成を示す斜視図（ａ）および上面図（ｂ）である。13A and 13B are a perspective view (a) and a top view (b) showing the main configuration of an antenna device according to Embodiment 3. FIG. 実施形態３に係るアンテナ装置の要部構成を示す斜視図（ａ）および上面図（ｂ）である。13A and 13B are a perspective view (a) and a top view (b) showing the main configuration of an antenna device according to Embodiment 3. FIG. 製造例３のアンテナ装置の要部構成を示す斜視図（ａ）およびＸ方向から見た図（ｂ）である。10A and 10B are a perspective view (a) and a view (b) of the main configuration of the antenna device of Manufacturing Example 3 as seen from the X direction; 製造例１および３のアンテナ装置におけるゲインの測定結果を示すグラフである。5 is a graph showing measurement results of gains in the antenna devices of Production Examples 1 and 3. FIG. 製造例１～３のアンテナ装置におけるゲインの測定結果を示すグラフである。5 is a graph showing measurement results of gains in the antenna devices of Production Examples 1 to 3. FIG. 製造例２（ａ）および製造例３（ｂ）のアンテナ装置における、２８ＧＨｚでの電流分布を示す図である。It is a figure which shows the current distribution in 28 GHz in the antenna device of manufacture example 2 (a) and manufacture example 3 (b). スリットの深さの変化させたときのゲインの測定結果を示すグラフである。7 is a graph showing measurement results of gain when the depth of the slit is changed. スリットの幅を変化させたときのゲインの測定結果を示すグラフである。7 is a graph showing measurement results of gain when the width of the slit is changed.

〔実施形態１〕
図１に基づいて、本発明の実施形態１に係るアンテナ装置を説明する。図１の（ａ）は、実施形態１のアンテナ装置１の要部構成を示す斜視図である。図１の（ｂ）は実施形態１のアンテナ装置１をＸ方向から見た図である。 [Embodiment 1]
An antenna device according to Embodiment 1 of the present invention will be described based on FIG. (a) of FIG. 1 is a perspective view showing a configuration of a main part of the antenna device 1 of the first embodiment. FIG. 1(b) is a view of the antenna device 1 of Embodiment 1 as seen from the X direction.

図１に示すように、垂直（重力）方向をＺ方向、水平方向をＸ方向およびＹ方向とする。Ｘ方向、Ｙ方向およびＺ方向は、互いに直交している。 As shown in FIG. 1, the vertical (gravitational) direction is the Z direction, and the horizontal directions are the X and Y directions. The X, Y and Z directions are orthogonal to each other.

（アンテナ装置１）
アンテナ装置１は、アンテナ基板２と、放熱部材３とを備える。アンテナ基板２は、放熱部材３の上面に設置されている。アンテナ装置１は、例えば、携帯電話端末、携帯情報端末、スマートフォン、タブレット端末、モバイルＰＣ端末等の通信端末装置が備えるアンテナ装置であり得るが、これらに限定されない。 (Antenna device 1)
An antenna device 1 includes an antenna substrate 2 and a heat dissipation member 3 . The antenna substrate 2 is installed on the top surface of the heat dissipation member 3 . The antenna device 1 may be, for example, an antenna device provided in a communication terminal device such as a mobile phone terminal, a personal digital assistant, a smart phone, a tablet terminal, a mobile PC terminal, but is not limited to these.

（アンテナ基板２）
アンテナ基板２は、アンテナ部２１と、熱源２２とを有する。アンテナ部２１は、複数のアンテナ（放射素子）を備える。放射素子の種類、形状等は特に限定されず、公知の放射素子を適宜用いることができる。また、アンテナ部２１は、放射素子に給電を行う給電部を備えていてもよい。熱源２２はアンテナ基板２の少なくとも片面に備えられる。図１においては、アンテナ部２１の下面と放熱部材３の上面との間に熱源２２が備えられる。図１のアンテナ部２１および熱源２２はそれぞれ直方体形状である。熱源２２の例として、集積回路（ＩＣ）が挙げられる。 (Antenna board 2)
The antenna substrate 2 has an antenna section 21 and a heat source 22 . The antenna section 21 includes a plurality of antennas (radiating elements). The type, shape, etc. of the radiating element are not particularly limited, and known radiating elements can be used as appropriate. Further, the antenna section 21 may include a feeding section that feeds power to the radiating element. A heat source 22 is provided on at least one side of the antenna substrate 2 . In FIG. 1 , a heat source 22 is provided between the lower surface of the antenna section 21 and the upper surface of the heat dissipation member 3 . The antenna section 21 and the heat source 22 in FIG. 1 are each rectangular parallelepiped. Examples of heat sources 22 include integrated circuits (ICs).

（放熱部材３）
放熱部材３は、熱源２２において生じた熱を放熱する。図１においては、熱源２２の下面全体が、放熱部材３の上面と接触しているが、熱源２２の一部と放熱部材３が接触していればよい。放熱部材３の例として、金属から構成される金属部材等が挙げられる。放熱部材３の表面は平坦面であっても、平坦面でなくてもよい。 (Heat dissipation member 3)
The heat radiating member 3 radiates heat generated in the heat source 22 . Although the entire lower surface of the heat source 22 is in contact with the upper surface of the heat radiating member 3 in FIG. Examples of the heat dissipation member 3 include metal members made of metal. The surface of the heat radiating member 3 may or may not be flat.

また、アンテナ基板２と放熱部材３との接触面から当該接触面の法線方向の所定の距離未満においては、アンテナ基板２と平行な断面積がアンテナ基板２との接触面の面積以下である。 Further, the cross-sectional area parallel to the antenna substrate 2 is less than or equal to the area of the contact surface with the antenna substrate 2 within a predetermined distance from the contact surface between the antenna substrate 2 and the heat radiating member 3 in the normal direction of the contact surface. .

本明細書において、接触面の法線方向とは、図１の（ａ）におけるＺ軸下方向である。また、アンテナ基板２と平行な断面積とは、図１の（ａ）におけるＺ方向から見たときの後述する放熱部材部分３１或いは放熱部材部分３２の面積である。 In this specification, the normal direction of the contact surface is the Z-axis downward direction in FIG. 1(a). Further, the cross-sectional area parallel to the antenna substrate 2 is the area of a heat radiation member portion 31 or a heat radiation member portion 32, which will be described later, when viewed from the Z direction in FIG. 1(a).

図１に示すように、放熱部材３は、放熱部材部分３１と放熱部材部分３２が一体となって構成されている。図１のアンテナ装置１の放熱部材３は、上段の放熱部材部分３１と下段の放熱部材部分３２から成る２段構造であるが、３段以上の複数段構造であってもよい。 As shown in FIG. 1, the heat radiating member 3 is configured by integrating a heat radiating member portion 31 and a heat radiating member portion 32 . The heat radiating member 3 of the antenna device 1 in FIG. 1 has a two-stage structure consisting of an upper heat radiating member portion 31 and a lower heat radiating member portion 32, but may have a multi-stage structure of three or more stages.

図１において、放熱部材部分３１において、アンテナ基板２と平行な断面積は、アンテナ基板２との接触面の面積と同じである。また、図１の（ｂ）に示すように、放熱部材部分３１は、アンテナ基板２との接触面の法線方向長さＺ１を有する。アンテナ基板２と放熱部材３との接触面から、当該接触面の法線方向の所定の距離とは、Ｚ１である。Ｚ１は、周波数の共振抑制、アンテナ装置の薄型化等の点で、後述する実施例に示すように１／６波長～１／３波長が好ましく、特に１／４波長程度が好ましい。 In FIG. 1 , the cross-sectional area parallel to the antenna substrate 2 in the heat dissipation member portion 31 is the same as the area of the contact surface with the antenna substrate 2 . Moreover, as shown in FIG. 1(b), the heat dissipation member portion 31 has a length Z1 in the normal direction of the contact surface with the antenna substrate 2. As shown in FIG. The predetermined distance from the contact surface between the antenna substrate 2 and the heat radiating member 3 in the direction normal to the contact surface is Z1. Z1 is preferably 1/6 wavelength to 1/3 wavelength, particularly preferably about 1/4 wavelength, as shown in Examples to be described later, from the viewpoints of suppressing frequency resonance, thinning the antenna device, and the like.

また、アンテナ基板２との接触面から当該接触面の法線方向の所定の距離以上の少なくとも一部においては、アンテナ基板２と平行な断面積が接触面の面積よりも大きい。 Moreover, in at least a part of the contact surface with the antenna substrate 2 that is at least a predetermined distance in the normal direction of the contact surface, the cross-sectional area parallel to the antenna substrate 2 is larger than the area of the contact surface.

図１において、放熱部材部分３２は、アンテナ基板２と平行な断面積が、アンテナ基板２と放熱部材部分３１との接触面の面積よりも大きい。 In FIG. 1 , the heat radiating member portion 32 has a cross-sectional area parallel to the antenna substrate 2 larger than the area of the contact surface between the antenna substrate 2 and the heat radiating member portion 31 .

放熱部材３により、熱源２２において生じた熱を放熱することができる。また、放熱部材３が段差を備え（上段の放熱部材部分３１と下段の放熱部材部分３２を備える）、放熱部材部分３１の断面積が所定の面積であることにより、不要放射による利得低下等のアンテナ性能の劣化を抑制することができる。特に、放熱部材３がアンテナ基板２よりも大きいときに、上記構成により、アンテナ基板２のグランド（ＧＮＤ）面から流れる電流の発生による、不要放射による利得低下を抑制することができる。 Heat generated in the heat source 22 can be dissipated by the heat dissipating member 3 . Further, since the heat radiation member 3 has a stepped portion (having an upper heat radiation member portion 31 and a lower heat radiation member portion 32), and the cross-sectional area of the heat radiation member portion 31 is a predetermined area, there is no reduction in gain due to unnecessary radiation. Degradation of antenna performance can be suppressed. In particular, when the heat dissipation member 3 is larger than the antenna substrate 2 , the above configuration can suppress gain reduction due to unnecessary radiation caused by current flowing from the ground (GND) surface of the antenna substrate 2 .

また、無線通信端末は、アンテナ装置１を備えることによって、放熱性が向上し、不要放射による利得低下等のアンテナ性能の劣化が抑制される。 In addition, since the wireless communication terminal is provided with the antenna device 1, heat dissipation is improved, and degradation of antenna performance such as reduction in gain due to unnecessary radiation is suppressed.

〔実施形態２〕
次に、図２に基づいて、本発明の実施形態２に係る、アンテナ装置１について説明する。なお、説明の便宜上、上記実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。図２の（ａ）は、実施形態２のアンテナ装置１の要部構成を示す斜視図である。図２の（ｂ）は実施形態２のアンテナ装置１をＸ方向から見た図である。 [Embodiment 2]
Next, based on FIG. 2, the antenna device 1 according to Embodiment 2 of the present invention will be described. For convenience of description, members having the same functions as those of the members described in the above embodiments are denoted by the same reference numerals, and description thereof will not be repeated. (a) of FIG. 2 is a perspective view showing a main configuration of the antenna device 1 of Embodiment 2. FIG. FIG. 2(b) is a view of the antenna device 1 of Embodiment 2 as seen from the X direction.

実施形態２において、放熱部材部分３２の上面に、アンテナ基板２と接触している放熱部材部分３１とは別に、放熱部材部分３３を備える点が、実施形態１と相違する。放熱部材部分３３を備えることによって、放熱部材３の上面に、アンテナ基板２と放熱部材３との接触面の周縁に沿ってスリット４が設けられる。すなわち、図２の（ａ）に示すように、放熱部材部分３１の下面に沿ってＸ方向にスリット４が設けられる。スリット４が設けられることによって、表面積が増え、放熱性が向上すると共に、不要放射による利得低下等のアンテナ性能の劣化を抑制することができる。 Embodiment 2 is different from Embodiment 1 in that a heat dissipation member portion 33 is provided on the upper surface of the heat dissipation member portion 32 separately from the heat dissipation member portion 31 in contact with the antenna substrate 2 . By providing the heat radiating member portion 33 , the slit 4 is provided on the upper surface of the heat radiating member 3 along the periphery of the contact surface between the antenna substrate 2 and the heat radiating member 3 . That is, as shown in (a) of FIG. 2, the slit 4 is provided in the X direction along the lower surface of the heat radiating member portion 31 . By providing the slit 4, the surface area is increased, the heat dissipation is improved, and the deterioration of the antenna performance such as the gain reduction due to unnecessary radiation can be suppressed.

スリット４の幅（図２の（ｂ）のＹ３）は、アンテナ性能の劣化抑制等の点で、１／４波長～２／３波長が好ましい。スリット４の高さ（図２の（ｂ）のＺ１）は、周波数の共振抑制、アンテナ装置の薄型化等の点で、後述する実施例に示すように１／６波長～１／３波長が好ましく、特に１／４波長程度が好ましい。 The width of the slit 4 (Y 3 in (b) of FIG. 2) is preferably 1/4 wavelength to 2/3 wavelength from the viewpoint of suppressing deterioration of antenna performance. The height of the slit 4 (Z 1 in FIG. 2B) is 1/6 wavelength to 1/3 wavelength as shown in the examples described later in terms of frequency resonance suppression, thinning of the antenna device, etc. is preferable, and about 1/4 wavelength is particularly preferable.

〔実施形態３〕
次に、図３に基づいて、本発明の実施形態３に係る、アンテナ装置１について説明する。なお、説明の便宜上、上記実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。図３の（ａ）は、実施形態３のアンテナ装置１の要部構成を示す斜視図であり、（ｂ）は実施形態３のアンテナ装置１の要部構成を示す上面図である。 [Embodiment 3]
Next, based on FIG. 3, the antenna device 1 according to Embodiment 3 of the present invention will be described. For convenience of description, members having the same functions as those of the members described in the above embodiments are denoted by the same reference numerals, and description thereof will not be repeated. FIG. 3(a) is a perspective view showing the main configuration of the antenna device 1 of Embodiment 3, and FIG. 3(b) is a top view showing the main configuration of the antenna device 1 of Embodiment 3. FIG.

実施形態３において、図３の（ａ）に示すように、放熱部材部分３１の底面に沿って、Ｘ方向に加え、Ｙ方向にもスリット４が設けられている点が、実施形態２と相違する。すなわち、矩形である、アンテナ基板２と放熱部材３との接触面の４つの辺のうち２つの辺に沿って、スリットが設けられている。この構成により、放熱部材に流れる電流量をより抑制することができ、不要放射による利得低下等のアンテナ性能の劣化を抑制することができる。本明細書において、矩形とは、長方形、正方形、および、平行四辺形を含む。 Embodiment 3 is different from Embodiment 2 in that, as shown in FIG. do. That is, slits are provided along two of the four sides of the rectangular contact surface between the antenna substrate 2 and the heat radiating member 3 . With this configuration, it is possible to further suppress the amount of current flowing through the heat radiating member, and it is possible to suppress deterioration of antenna performance such as reduction in gain due to unnecessary radiation. As used herein, rectangles include rectangles, squares, and parallelograms.

〔実施形態４〕
次に、図４に基づいて、本発明の実施形態４に係る、アンテナ装置１について説明する。なお、説明の便宜上、上記実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。図４の（ａ）は、実施形態４のアンテナ装置１の要部構成を示す斜視図であり、（ｂ）は実施形態４のアンテナ装置１の要部構成を示す上面図である。 [Embodiment 4]
Next, based on FIG. 4, the antenna device 1 according to Embodiment 4 of the present invention will be described. For convenience of description, members having the same functions as those of the members described in the above embodiments are denoted by the same reference numerals, and description thereof will not be repeated. FIG. 4(a) is a perspective view showing the essential configuration of the antenna device 1 of Embodiment 4, and FIG. 4(b) is a top view showing the essential configuration of the antenna device 1 of Embodiment 4. FIG.

実施形態４において、図４の（ｂ）に示すように、矩形である、アンテナ基板２と放熱部材３との接触面の４つの辺のうち３つの辺に沿って、スリットが設けられている点が、実施形態３と相違する。この構成により、放熱部材に流れる電流量をより抑制することができ、不要放射による利得低下等のアンテナ性能の劣化を抑制することができる。 In the fourth embodiment, as shown in FIG. 4B, slits are provided along three of the four sides of the rectangular contact surface between the antenna substrate 2 and the heat radiating member 3. The point is different from the third embodiment. With this configuration, it is possible to further suppress the amount of current flowing through the heat radiating member, and it is possible to suppress deterioration of antenna performance such as reduction in gain due to unnecessary radiation.

〔まとめ〕
本発明の態様１に係るアンテナ装置（１）は、少なくとも片面に熱源（２２）を有するアンテナ基板（２）と、前記熱源（２２）において生じた熱を放熱する放熱部材（３）とを備え、前記放熱部材（３）は、前記熱源（２２）の少なくとも一部に接しており、前記アンテナ基板（２）との接触面から当該接触面の法線方向の所定の距離未満においては、前記アンテナ基板（２）と平行な断面積が前記アンテナ基板（２）との接触面の面積以下であり、前記所定の距離以上の少なくとも一部においては、前記アンテナ基板（２）と平行な断面積が前記接触面の面積よりも大きい、ことを特徴とする。 〔summary〕
An antenna device (1) according to aspect 1 of the present invention comprises an antenna substrate (2) having a heat source (22) on at least one side thereof, and a heat dissipation member (3) for dissipating heat generated in the heat source (22). , the heat radiating member (3) is in contact with at least a part of the heat source (22), and within a predetermined distance from the contact surface with the antenna substrate (2) in the normal direction of the contact surface, the The cross-sectional area parallel to the antenna substrate (2) is equal to or less than the area of the contact surface with the antenna substrate (2), and the cross-sectional area parallel to the antenna substrate (2) is at least partly greater than or equal to the predetermined distance. is larger than the area of the contact surface.

上記の構成によれば、放熱性が向上すると共に、不要放射による利得低下等のアンテナ性能の劣化を抑制することができる。 According to the above configuration, it is possible to improve heat dissipation and suppress deterioration of antenna performance such as reduction in gain due to unnecessary radiation.

本発明の態様２に係るアンテナ装置（１）は、上記態様１において、前記放熱部材（３）の上面に、前記アンテナ基板（２）との接触面の周縁に沿ってスリット（４）が設けられている。 The antenna device (1) according to aspect 2 of the present invention is the antenna device (1) according to aspect 1, wherein slits (4) are provided on the upper surface of the heat dissipation member (3) along the periphery of the contact surface with the antenna substrate (2). It is

上記の構成によれば、表面積が増え、放熱性が向上すると共に、不要放射による利得低下等のアンテナ性能の劣化を抑制することができる。 According to the above configuration, it is possible to increase the surface area, improve heat dissipation, and suppress degradation of antenna performance such as gain reduction due to unnecessary radiation.

本発明の態様３に係るアンテナ装置（１）は、上記態様１において、前記接触面は矩形であり、前記接触面の４つの辺のうちの少なくとも２つの辺に沿って、前記放熱部材（３）の上面にスリット（４）が設けられている。 In the antenna device (1) according to aspect 3 of the present invention, in aspect 1 above, the contact surface is rectangular, and the heat dissipation member (3 ) is provided with a slit (4) on its upper surface.

上記の構成によれば、放熱部材に流れる電流量をより抑制することができ、不要放射による利得低下等のアンテナ性能の劣化を抑制することができる。 According to the above configuration, it is possible to further suppress the amount of current flowing through the heat radiating member, and it is possible to suppress deterioration of antenna performance such as reduction in gain due to unnecessary radiation.

本発明の態様４に係る通信端末装置は、上記態様１～３のいずれかのアンテナ装置（１）を備える。 A communication terminal device according to aspect 4 of the present invention includes the antenna device (1) according to any one of aspects 1 to 3 above.

上記の構成によれば、通信端末装置の放熱性が向上し、不要放射による利得低下等のアンテナ性能の劣化が抑制される。 According to the above configuration, the heat dissipation property of the communication terminal device is improved, and deterioration of antenna performance such as reduction in gain due to unnecessary radiation is suppressed.

本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。さらに、各実施形態にそれぞれ開示された技術的手段を組み合わせることにより、新しい技術的特徴を形成することができる。 The present invention is not limited to the above-described embodiments, but can be modified in various ways within the scope of the claims, and can be obtained by appropriately combining technical means disclosed in different embodiments. is also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

［製造例１］アンテナ装置の製造
図１の（ａ）に示す形状である放熱ブロック（放熱部材３）を用意した。次に、高さＺ１＋Ｚ２における放熱ブロック（放熱部材３）の上面に、アンテナ部２１と熱源２２とを有するアンテナ基板２を図１の（ａ）のように設置して、アンテナ装置１を製造した。アンテナ装置１をＸ方向から見た図を図１の（ｂ）に示す。アンテナ装置１のＹ１は２０ｍｍ、Ｙ２は５ｍｍ、Ｚ１は３ｍｍ、Ｚ２は１３．５ｍｍ、Ｚ３は２０ｍｍだった。 [Production Example 1] Production of Antenna Device A heat dissipation block (heat dissipation member 3) having a shape shown in FIG. 1(a) was prepared. Next, an antenna substrate 2 having an antenna section 21 and a heat source 22 is placed on the upper surface of a heat dissipation block (heat dissipation member 3) at a height of Z 1 +Z 2 as shown in FIG. manufactured. FIG. 1B shows a diagram of the antenna device 1 viewed from the X direction. Y1 of the antenna device 1 was 20 mm, Y2 was 5 mm, Z1 was 3 mm, Z2 was 13.5 mm, and Z3 was 20 mm.

［製造例２］アンテナ装置の製造
図２の（ａ）に示す形状である放熱ブロック（放熱部材３）を用意した。次に、高さＺ１＋Ｚ２における放熱ブロック（放熱部材３）の上面に、アンテナ部２１と熱源２２とを有するアンテナ基板２を図２の（ａ）のように設置して、アンテナ装置１を製造した。アンテナ装置１をＸ方向から見た図を図２の（ｂ）に示す。アンテナ装置１のＹ１は２０ｍｍ、Ｙ２は５ｍｍ、Ｙ３は３ｍｍ、Ｚ１は３ｍｍ、Ｚ２は１０．５ｍｍ、Ｚ３は２０ｍｍだった。 [Production Example 2] Production of Antenna Apparatus A heat dissipation block (heat dissipation member 3) having a shape shown in FIG. 2(a) was prepared. Next, the antenna substrate 2 having the antenna section 21 and the heat source 22 is placed on the upper surface of the heat dissipation block (heat dissipation member 3) at the height Z 1 +Z 2 as shown in FIG. manufactured. FIG. 2B shows a view of the antenna device 1 as seen from the X direction. Y1 of the antenna device 1 was 20 mm, Y2 was 5 mm, Y3 was 3 mm, Z1 was 3 mm , Z2 was 10.5 mm, and Z3 was 20 mm.

［製造例３］アンテナ装置の製造
図５（ａ）に示す形状である放熱ブロック（放熱部材１０３）を用意した。次に、高さＺ２における放熱ブロック（放熱部材１０３）の上面に、アンテナ部１２１と熱源１２２とを有するアンテナ基板１０２を図６の（ａ）のように設置して、アンテナ装置１０１を製造した。アンテナ装置１０１をＸ方向から見た図を図５の（ｂ）に示す。アンテナ装置１０１のＹ１は２０ｍｍ、Ｙ２は５ｍｍ、Ｚ２は１３．５ｍｍ、Ｚ３は２０ｍｍだった。 [Production Example 3] Production of Antenna Device A heat dissipation block (heat dissipation member 103) having a shape shown in FIG. 5A was prepared. Next, the antenna substrate 102 having the antenna section 121 and the heat source 122 is placed on the upper surface of the heat dissipation block (heat dissipation member 103) at the height Z2 as shown in FIG . did. A view of the antenna device 101 viewed from the X direction is shown in FIG. 5(b). Y1 of the antenna device 101 was 20 mm, Y2 was 5 mm , Z2 was 13.5 mm, and Z3 was 20 mm.

［評価例１］ゲインの測定
製造例１と３のアンテナ装置、および放熱ブロック（放熱部材）を備えないアンテナ基板について、ゲインを測定した。結果を図６に示す。 [Evaluation Example 1] Measurement of Gain Gains were measured for the antenna devices of Production Examples 1 and 3 and for the antenna substrate without a heat dissipation block (heat dissipation member). The results are shown in FIG.

図６中の縦軸の正面方向Ｇａｉｎは、図１及び５におけるＸ－Ｙ平面方向のゲインである。 The front direction Gain on the vertical axis in FIG. 6 is the gain in the XY plane direction in FIGS.

図６に示すように、製造例３のアンテナ装置においては、ゲイン（利得）低下が抑制されなかった。一方、製造例１のアンテナ装置においては、利得低下を抑制することができた。 As shown in FIG. 6, in the antenna device of Production Example 3, the decrease in gain was not suppressed. On the other hand, in the antenna device of Production Example 1, it was possible to suppress the decrease in gain.

［評価例２］ゲインの測定
評価例１と同様に、製造例１～３のアンテナ装置、および放熱ブロック（放熱部材）を備えないアンテナ基板について、ゲインを測定した。結果を図７に示す。 [Evaluation Example 2] Measurement of Gain In the same manner as in Evaluation Example 1, gains were measured for the antenna devices of Production Examples 1 to 3 and the antenna substrates having no heat dissipation block (heat dissipation member). The results are shown in FIG.

図７に示すように、スリットが設けられた製造例２のアンテナ装置は、製造例１のアンテナ装置よりもさらに利得低下を抑制することができた。 As shown in FIG. 7, the antenna device of Production Example 2 provided with slits was able to suppress the gain reduction more than the antenna device of Production Example 1. FIG.

［評価例３］電流分布の測定
製造例２と３のアンテナ装置に関し、２８ＧＨｚの電波を送受信した場合における電流分布を測定した。測定結果を図８に示す。図８の（ａ）は製造例２のアンテナ装置、（ｂ）は製造例３のアンテナ装置の電流分布を示す。図８中、白い（明るい）箇所は電流量が多いことを示し、暗い（黒い）箇所は電流量が少ないことを示す。 [Evaluation Example 3] Measurement of Current Distribution Regarding the antenna devices of Production Examples 2 and 3, the current distribution was measured when radio waves of 28 GHz were transmitted and received. FIG. 8 shows the measurement results. 8A shows the current distribution of the antenna device of Production Example 2, and FIG. 8B shows the current distribution of the antenna device of Production Example 3. FIG. In FIG. 8, a white (bright) portion indicates a large amount of current, and a dark (black) portion indicates a small amount of current.

図８に示すように、製造例３のアンテナ装置は、特にアンテナ基板と放熱ブロック（放熱部材）との接触面付近で電流が多く流れていた。一方、製造例２のアンテナ装置は、製造例３のアンテナ装置と比べて、電流量が抑制されていた。 As shown in FIG. 8, in the antenna device of Production Example 3, a large amount of current flowed particularly near the contact surface between the antenna substrate and the heat dissipation block (heat dissipation member). On the other hand, in the antenna device of Production Example 2, the amount of current was suppressed as compared with the antenna device of Production Example 3.

［評価例４］スリットの深さの変化による利得低下抑制への影響
次に、製造例２のアンテナ装置１のスリット４の深さ（図２の（ｂ）のＺ１）を変化させたときの、利得低下抑制への影響を検証した。ゲインの測定は、評価例１と同様に行い、周波数を２８ＧＨｚとして評価した。結果を図９に示す。 [Evaluation Example 4] Influence on Suppression of Gain Decrease by Change in Slit Depth Next, when the depth of the slit 4 (Z 1 in FIG. 2(b)) of the antenna device 1 of Production Example 2 is changed, was verified for its effect on gain reduction suppression. The measurement of the gain was performed in the same manner as in Evaluation Example 1, and the evaluation was performed at a frequency of 28 GHz. The results are shown in FIG.

図９に示すように、スリットの深さを２８ＧＨｚの電波のλ／４である３ｍｍ前後にすると、利得低下を抑制することができることが分かった。 As shown in FIG. 9, it was found that the gain reduction can be suppressed by setting the depth of the slit to about 3 mm, which is λ/4 of the radio wave of 28 GHz.

［評価例５］スリットの幅の変化による利得低下抑制への影響
次に、製造例２のアンテナ装置１のスリット４の幅（図２の（ｂ）のＹ３）を変化させたときの、利得低下抑制への影響を検証した。ゲインの測定は、評価例１と同様に行い、周波数を２８ＧＨｚとして評価した。結果を図１０に示す。 [Evaluation Example 5] Influence of Variation in Slit Width on Suppression of Gain Reduction Next, when the width of the slit 4 (Y 3 in FIG. The effect on gain reduction suppression was verified. The measurement of the gain was performed in the same manner as in Evaluation Example 1, and the evaluation was performed at a frequency of 28 GHz. The results are shown in FIG.

図１０に示すように、スリットの幅を２８ＧＨｚの電波のλ／２である６ｍｍ前後にすると、利得低下を特に抑制することができることが分かった。 As shown in FIG. 10, it was found that the reduction in gain can be particularly suppressed by setting the width of the slit to about 6 mm, which is λ/2 of the radio wave of 28 GHz.

［まとめ］
放熱ブロック（放熱部材）に段差を備える、製造例１のアンテナ装置は、不要放射による利得低下を抑制することができた。さらに、スリットを備える製造例２のアンテナ装置では、不要放射による利得低下が抑制され、放熱性も向上していることが分かった。評価例では、正面（Ｘ－Ｙ平面）方向のゲインを測定しているが、他の方向のゲインの劣化についても抑制されていると考えられる。 [summary]
The antenna device of Production Example 1, in which the heat dissipation block (heat dissipation member) is provided with a step, was able to suppress a decrease in gain due to unnecessary radiation. Furthermore, it was found that the antenna device of Production Example 2, which has slits, suppresses a decrease in gain due to unnecessary radiation and improves heat dissipation. In the evaluation example, the gain in the front (XY plane) direction is measured, but it is considered that the deterioration of the gain in other directions is also suppressed.

１、１０１ アンテナ装置
２、１０２ アンテナ基板
３、１０３ 放熱部材
４ スリット
２１、１２１ アンテナ部
２２、１２２ 熱源
３１、３２、３３ 放熱部材部分 Reference Signs List 1, 101 antenna device 2, 102 antenna substrate 3, 103 heat dissipation member 4 slit 21, 121 antenna section 22, 122 heat source 31, 32, 33 heat dissipation member portion

Claims (4)

少なくとも片面に熱源を有するアンテナ基板と、
前記熱源において生じた熱を放熱する放熱部材とを備え、
前記放熱部材は、
前記熱源の少なくとも一部に接しており、
前記アンテナ基板との接触面から当該接触面の法線方向の所定の距離未満においては、前記アンテナ基板と平行な断面積が前記アンテナ基板との接触面の面積以下であり、前記所定の距離以上の少なくとも一部においては、前記アンテナ基板と平行な断面積が前記接触面の面積よりも大きい、
ことを特徴とするアンテナ装置。 an antenna substrate having a heat source on at least one side;
A heat dissipation member that dissipates heat generated in the heat source,
The heat dissipation member is
in contact with at least a portion of the heat source;
Within a predetermined distance from the contact surface with the antenna substrate in the normal direction of the contact surface, the cross-sectional area parallel to the antenna substrate is equal to or less than the area of the contact surface with the antenna substrate, and is equal to or greater than the predetermined distance. In at least a part of, the cross-sectional area parallel to the antenna substrate is larger than the area of the contact surface,
An antenna device characterized by: 前記放熱部材の上面に、前記アンテナ基板との接触面の周縁に沿ってスリットが設けられている、請求項１に記載のアンテナ装置。 2. The antenna device according to claim 1, wherein the upper surface of said heat radiating member is provided with a slit along the periphery of the contact surface with said antenna substrate. 前記接触面は矩形であり、
前記接触面の４つの辺のうちの少なくとも２つの辺に沿って、前記放熱部材の上面にスリットが設けられている、請求項１に記載のアンテナ装置。 the contact surface is rectangular,
2. The antenna device according to claim 1, wherein slits are provided in the upper surface of said heat radiating member along at least two sides of the four sides of said contact surface. 請求項１～３のいずれか１項に記載のアンテナ装置を備えた通信端末装置。 A communication terminal device comprising the antenna device according to any one of claims 1 to 3.
JP2019058999A 2019-03-26 2019-03-26 Antenna device and communication terminal device Active JP7129369B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019058999A JP7129369B2 (en) 2019-03-26 2019-03-26 Antenna device and communication terminal device
US16/821,707 US11189903B2 (en) 2019-03-26 2020-03-17 Antenna apparatus and communications terminal apparatus
CN202010196641.4A CN111755802B (en) 2019-03-26 2020-03-19 Antenna device and communication terminal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019058999A JP7129369B2 (en) 2019-03-26 2019-03-26 Antenna device and communication terminal device

Publications (2)

Publication Number Publication Date
JP2020161968A JP2020161968A (en) 2020-10-01
JP7129369B2 true JP7129369B2 (en) 2022-09-01

Family

ID=72607711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019058999A Active JP7129369B2 (en) 2019-03-26 2019-03-26 Antenna device and communication terminal device

Country Status (3)

Country Link
US (1) US11189903B2 (en)
JP (1) JP7129369B2 (en)
CN (1) CN111755802B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102444136B1 (en) * 2020-12-07 2022-09-19 주식회사 하우앳 Millimeter wave transceiver with improved heat dissipation
TW202127728A (en) * 2021-03-18 2021-07-16 台灣立訊精密有限公司 Antenna assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008219897A (en) 2001-05-17 2008-09-18 Cypress Semiconductor Corp Ball grid array antenna
JP2011211424A (en) 2010-03-29 2011-10-20 Panasonic Corp Millimeter-wave transmitter/receiver

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274512A (en) * 1995-03-30 1996-10-18 Mitsubishi Electric Corp Microwave semiconductor integrated circuit device
FR2832572B1 (en) * 2001-11-16 2004-01-30 Cit Alcatel RADIO COMMUNICATION DEVICE INCLUDING A THERMAL DISSIPATION SYSTEM
JP4651411B2 (en) * 2005-03-02 2011-03-16 ソニー・エリクソン・モバイルコミュニケーションズ株式会社 ANTENNA DEVICE AND RADIO DEVICE
US8228239B2 (en) * 2006-01-31 2012-07-24 Hewlett-Packard Development Company, L.P. Heat-dissipating wireless communication system
JP2016201580A (en) * 2013-10-01 2016-12-01 古河電気工業株式会社 Mobile electronic device case
JP6617557B2 (en) * 2014-06-30 2019-12-11 東レ株式会社 Laminates and integrated molded products
JP6203165B2 (en) 2014-12-05 2017-09-27 三菱電機株式会社 Array module
JP2016173350A (en) * 2015-03-18 2016-09-29 トヨタ自動車株式会社 On-vehicle radar device
US10506702B2 (en) * 2015-07-24 2019-12-10 Nec Corporation Mounting structure, method for manufacturing mounting structure, and radio device
US10244668B2 (en) * 2015-08-05 2019-03-26 Panasonic Intellectual Property Management Co., Ltd. Heat dissipating structure and electronic apparatus
JP6520568B2 (en) 2015-08-25 2019-05-29 住友電気工業株式会社 Antenna device
US10177441B2 (en) * 2015-10-15 2019-01-08 Asustek Computer Inc. Antenna module
TWM520790U (en) * 2015-12-17 2016-04-21 Morningrich Technology Co Ltd Heat dissipation substrate and housing using the same
CN207124842U (en) * 2017-09-04 2018-03-20 北京小米移动软件有限公司 Heat radiation module and electronic equipment
WO2019167403A1 (en) * 2018-02-28 2019-09-06 株式会社村田製作所 Antenna module
CN108770291B (en) * 2018-06-11 2020-07-31 Oppo广东移动通信有限公司 Heat dissipation assembly and electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008219897A (en) 2001-05-17 2008-09-18 Cypress Semiconductor Corp Ball grid array antenna
JP2011211424A (en) 2010-03-29 2011-10-20 Panasonic Corp Millimeter-wave transmitter/receiver

Also Published As

Publication number Publication date
US11189903B2 (en) 2021-11-30
JP2020161968A (en) 2020-10-01
CN111755802B (en) 2022-03-04
CN111755802A (en) 2020-10-09
US20200313272A1 (en) 2020-10-01

Similar Documents

Publication Publication Date Title
US11075116B2 (en) Integrated antenna on interposer substrate
US7518221B2 (en) Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
JP6297337B2 (en) Antenna assembly and communication device including the antenna assembly
KR101613173B1 (en) Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
US9300055B2 (en) Mobile device with two antennas and antenna switch modules
US20220302592A1 (en) Wideband antenna and antenna module including the same
US20170155198A1 (en) Mobile device
JP2008236710A (en) Antenna element and broadband antenna unit
US10218415B2 (en) Antenna system and wireless access point
CN104137337B (en) Antenna assembly
JP7129369B2 (en) Antenna device and communication terminal device
US20150318616A1 (en) Antenna apparatus
JP2017063288A (en) Antenna system
CN104185926B (en) Antenna installation
US20120114163A1 (en) Speaker system including a speaker device having a speaker unit mounted with an antenna
JP4655095B2 (en) Antenna device
JP2020036297A (en) Antenna device
US10199731B2 (en) Electronic component
Hashimoto et al. Millimeter-wave band slot antenna on shielded BGA package
KR101787263B1 (en) High Sensitivity Receiver Antenna for Mobile Device
TWI509889B (en) Plate-type antenna having a signal-isolating structure
TW201515317A (en) Multi-mode resonant planar antenna
Lai et al. Slot antennas with an extended ground for multiple-antenna systems in compact wireless devices
Rahayu et al. Current distribution characteristics of various T slotted ultra wideband antenna
KR20140100055A (en) Bulk type ceramic chip antenna

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210922

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220711

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220816

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220822

R150 Certificate of patent or registration of utility model

Ref document number: 7129369

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150