JP7117127B2 - light emitting device - Google Patents

Description

The present invention relates to a light-emitting device using a light-emitting element such as a light-emitting diode (LED).

A light-emitting device is known that includes a light-emitting element and a translucent member provided on the upper surface of the light-emitting element. By adding a material capable of wavelength conversion of light emitted from the light-emitting element to the light-transmitting member, the emission color of the light-emitting device can be adjusted. For example, Patent Document 1 discloses a light emitting element, a light transmitting member, a light reflective first covering member that covers the side surface of the light transmitting member and surrounds the light emitting element, and the first covering member. and a second covering member for covering the light emitting device.

Further, Patent Literature 2 discloses a light-emitting device including a light-emitting element, a translucent member, and a light-reflective resin covering at least part of the translucent member. In Patent Document 3, one or more light-emitting elements, a light-transmitting member provided in contact with the upper surface of the light-emitting element, and the surface of the light-transmitting member with the upper surface of the light-transmitting member exposed. and a light reflecting member covering the side surface of the light emitting element.

Japanese Patent No. 5521325 Japanese Patent No. 5482378 Japanese Patent Application Laid-Open No. 2017-108091

When the light-emitting devices described in Patent Documents 1 to 3 are combined with, for example, an optical system and used as a lamp body, light leakage from the periphery of the light-emitting element prevents the desired contrast between light and dark from being obtained. was there.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a light-emitting device with high brightness and high contrast, in which leakage of light from the periphery of a light-emitting element is reduced.

A light-emitting device of the present invention comprises a substrate, a light-emitting element mounted on the substrate, a bottom surface disposed on the light-emitting element and covering the entire top surface of the light-emitting element, and a top surface smaller than the bottom surface, A wavelength conversion member having a side surface shape whose width in a direction parallel to the substrate decreases from the bottom surface to the top surface, a first covering member covering the side surface of the wavelength conversion member, and the entire side surface of the light emitting element. and a second coating member having an inner surface extending from the outer periphery of the bottom surface of the wavelength conversion member toward the top surface side, wherein the first coating member and the second coating member The covering members have different light absorptivities, and the first covering member is filled between the second covering member and the wavelength conversion member.

Further, the light emitting device of the present invention comprises: a substrate; an element array composed of a plurality of light emitting elements arranged in alignment on the substrate; and a top surface smaller than the bottom surface, the wavelength converting member having a side surface shape whose width in a direction parallel to the substrate decreases from the bottom surface to the top surface, covering the side surface of the wavelength converting member. A first coating member and a second coating covering the entire array side surface forming the outer edge of the element array and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the top surface side. and a member, wherein the first covering member and the second covering member have different light absorptivities, and the first covering member is separated from the second covering member and the wavelength converting member. It is filled between the members.

1 is a top view of a light emitting device according to Example 1. FIG. 1 is a cross-sectional view of a light emitting device according to Example 1. FIG. FIG. 1B is a cross-sectional view of a part of FIG. 1B; FIG. 4 is a diagram showing part of the manufacturing process of the light emitting device according to Example 1; FIG. 4 is a diagram showing part of the manufacturing process of the light emitting device according to Example 1; FIG. 4 is a diagram showing part of the manufacturing process of the light emitting device according to Example 1; 4 is a diagram showing relative luminance of the light emitting device according to Example 1. FIG. FIG. 10 is a cross-sectional view of a light-emitting device according to Modification 1 of Example 1; FIG. 10 is a cross-sectional view of a light-emitting device according to Modification 2 of Example 1; FIG. 10 is a top view of a light emitting device according to Example 2; FIG. 10 is a cross-sectional view of a light emitting device according to Example 2; FIG. 10 is a top view of an element array according to Example 2; FIG. 10 is a cross-sectional view of a light emitting device according to Example 2; FIG. 11 is a cross-sectional view of a light-emitting device according to a modification of Example 2; FIG. 10 is a diagram showing part of the manufacturing process of a light emitting device according to a modification of Example 2;

Examples of the present invention will be described in detail below. In the following description and accompanying drawings, substantially the same or equivalent parts are denoted by the same reference numerals.

The configuration of the light emitting device 10 according to Example 1 will be described with reference to FIGS. 1A to 1C. FIG. 1A is a top view of the light emitting device 10. FIG. FIG. 1B is a cross-sectional view along line 1B-1B of FIG. 1A.

The substrate 11 is a plate-like substrate having a rectangular shape when viewed from above, as shown in FIG. 1A. The substrate 11 has, on one principal surface, a mounting surface on which electrodes and wiring (not shown) are provided and elements such as LEDs can be mounted. The substrate 11 is, for example, a ceramic substrate such as AlN.

The light emitting element 13 is a light emitting element having a cuboid shape having a rectangular shape when viewed from above. As shown in FIG. 1B, the light emitting element 13 is mounted on the mounting surface of the substrate 11. As shown in FIG. The upper surface 13S of the light emitting element 13 is the light emitting surface of the light emitting element 13. As shown in FIG.

The light emitting element 13 is, for example, a semiconductor light emitting element such as a light emitting diode. The light emitting element 13 includes, for example, an optical semiconductor layer made of a nitride-based semiconductor. In this embodiment, the light emitting element 13 is an element having a metal bonding structure (MB structure or thin film type bonding structure) and is a top emission type element.

The adhesive layer 15 is formed on the light emitting element 13 . The adhesive layer 15 is made of a translucent adhesive that is transparent to the light emitted from the light emitting element 13 . The outer edge of the adhesive layer 15 in top view substantially matches the outer edge of the light emitting surface 13</b>S of the light emitting element 13 .

The wavelength conversion member 17 is arranged on the light emitting element 13 via the adhesive layer 15 . As shown in FIG. 1B, the wavelength conversion member 17 has a bottom surface 17B covering the entire top surface of the light emitting element 13 and a top surface 17T smaller than the bottom surface 17B. The outer edge of the bottom surface 17B substantially coincides with the outer edges of the light emitting surface 13S and the adhesive layer 15 .

Also, the wavelength conversion member 17 has a side shape in which the width in the direction parallel to the substrate 11 decreases from the bottom surface 17B toward the top surface 17T. As shown in FIG. 1A, the top surface 17T and bottom surface 17B of the wavelength conversion member 17 have a rectangular shape when viewed from above. Moreover, the top surface 17T has a similar shape to the bottom surface 17B.

FIG. 1C is a diagram showing only the wavelength conversion member 17 extracted from the portion A surrounded by the dashed line in FIG. 1B. As shown in FIG. 1C, the wavelength converting member 17 includes a first vertical portion 17S1 extending from the bottom surface 17B in a direction perpendicular to the substrate 11, and an inner side extending from the upper end of the first vertical portion 17S1 toward the upper surface 17T. and a second vertical portion 17S3 extending in a direction perpendicular to the substrate 11 from the upper end of the inclined portion 17S2 toward the upper surface 17T. ing.

Accordingly, the portion 17P1 including the bottom surface 17B and the portion 17P3 including the top surface 17T of the wavelength conversion member 17 in FIG. 1C have a prismatic shape, and the portion 17P2 including the inclined portion 17S2 has a truncated pyramid shape. In this manner, the wavelength conversion member 17 has a structure in which the bottom-side prism-shaped portion 17P1, the truncated pyramid-shaped portion 17P2, and the top-side prism-shaped portion 17P3 are integrally formed.

The wavelength conversion member 17 is, for example, a ceramic plate obtained by sintering a fluorescent material, or a resin layer containing fluorescent particles. In this embodiment, for example, the wavelength conversion member 17 is a ceramic plate made by high temperature firing of alumina and YAG phosphor.

As shown in FIG. 1A, the first covering member 19 is formed outside the outer periphery of the wavelength converting member 17 so as to surround the wavelength converting member 17 when viewed from above, and has a rectangular outer shape. . As shown in FIGS. 1B and 1C, the first covering member 19 covers the inclined portion 17S2 and the second vertical portion 17S3 of the side surfaces of the wavelength converting member 17. As shown in FIGS.

The first covering member 19 is, for example, a member made of resin containing light-reflective particles such as titanium oxide. For example, the first covering member 19 can be made of silicone resin mixed with 20 to 50 wt % of titanium oxide particles.

As shown in FIG. 1A, the second covering member 21 is formed outside the outer circumference of the first covering member 19 so as to surround the first covering member 19 when viewed from above, and has a rectangular outer shape. have. As shown in FIG. 1B, the second covering member 21 has an inner surface 21S1 extending from the substrate 11 in a direction perpendicular to the substrate 11 through the outer periphery of the bottom surface 17B. Also, the second covering member 21 has an upper surface.

As shown in FIG. 1B, the second covering member 21 covers the entire side surfaces of the light emitting element 13 . Also, the second covering member 21 covers the side surface of the adhesive layer 15 and the first vertical portion 17S1 of the wavelength converting member 17 . Therefore, the first covering member 19 is filled between the second covering member 21 and the wavelength converting member 17 .

In this embodiment, the inner surface 21S1 of the second covering member 21, the outer surface of the first covering member 19, the outer peripheral portion of the bottom surface 17B of the wavelength conversion member 17, the adhesive layer 15, and the outer edge of the light emitting surface 13S are shown in top view. are substantially identical in

Further, in this embodiment, the upper surface 17T of the wavelength conversion member 17 and the upper surface of the first covering member 19 are flush with each other.

The second covering member 21 is a member having light absorption different from that of the first covering member 19 . For example, the second covering member 21 is a resin member containing light-absorbing particles such as carbon black. For example, the second coating member 21 may be made of a mixture of silicone resin and titanium oxide particles, which is further mixed with carbon black. In this embodiment, the case where the second covering member 21 has a higher light absorptance than the first covering member 19 will be described.

The frame body 23 is a frame body provided on the outer peripheral portion of the substrate 11 and surrounding the second covering member 21 . The frame 23 is made of ceramics such as AlN, for example. In this embodiment, the frame 23 is formed integrally with the substrate 11 . The second covering member 21 is filled between the frame 23 , the light emitting element 13 , the adhesive layer 15 , the wavelength conversion member 17 and the first covering member 19 .

An example of the manufacturing process of the wavelength conversion member 17 and the first covering member 19 will be described with reference to FIGS. 2A to 2C. FIG. 2A is a cross-sectional view showing the dicing sheet 25, the phosphor ceramic plate 17M, and the vicinity of the tip portion of the first blade B1 used when processing the phosphor ceramic plate 17M. As shown in FIG. 2A, the first blade B1 has parallel side surfaces and a tapered tip portion.

In the process of FIG. 2A, the phosphor ceramic plate 17M is placed on the dicing sheet 25, and grooves are formed in the upper surface of the phosphor ceramic plate 17M using the first blade B1. FIG. 2A shows a state in which the first blade B1 is inserted into the phosphor ceramic plate 17M when forming the groove.

For example, the grooves are formed in the X direction and the Y direction perpendicular to the X direction when viewed from the top (not shown) of the phosphor ceramic plate 17M. The interval between the blades is set so that the size of the portion surrounded by the grooves in the X direction and the grooves in the Y direction has a predetermined area. For example, the interval between the groove and the adjacent groove is set according to the dimension of the upper surface 13S of the light emitting element 13. FIG.

As shown in FIG. 2A, when the tip portion of the first blade B1 is inserted vertically into the phosphor ceramic plate 17M, the portion processed by the mutually parallel side surfaces of the first blade B1 becomes the wavelength conversion member 17. , which corresponds to the second vertical portion 17S3. The portion processed by the tapered portion of the first blade B1 corresponds to the inclined portion 17S2 of the wavelength conversion member 17. As shown in FIG.

FIG. 2B is a cross-sectional view showing a phosphor ceramic plate 17M having grooves formed in the process of FIG. 2A and a resin 19M filled in the grooves. The filling of the resin 19M is performed by, for example, filling the groove with a silicone resin containing titanium oxide particles using a dispenser device and curing the resin. Alternatively, a heat-resistant masking tape may be adhered to the upper surface of the phosphor ceramic plate 17M, and the resin 19M may be filled from the end surface using capillary action and cured. Thereby, the upper surface of the phosphor ceramic plate 17M and the upper surface of the resin 19 can be formed on the same plane.

FIG. 2C is a cross-sectional view showing the resin 19M filled in the grooves of the phosphor ceramic plate 17M and the second blade B2. In this embodiment, blades having side surfaces parallel to each other are used as the second blade B2. As shown in FIG. 2C, a second blade B2 is inserted perpendicularly to the phosphor ceramic plate 17M at the center of the groove filled with the resin 19M and corresponding to the bottom surface of the groove. The phosphor ceramic plate 17M is cut into individual pieces.

As a result, the plate piece of the phosphor ceramic plate 17M with the resin 19 filled in the groove becomes the wavelength conversion member 17 having the first coating member 19. As shown in FIG. The inclined portion 17S2 and the second vertical portion 17S3 of the wavelength conversion member 17 are covered with the first covering member 19. As shown in FIG. In addition, the cut surface of the piece by the second blade B2 is perpendicular to the bottom surface 17B of the wavelength conversion member 17, and the outer surface of the first covering member 19 and the first vertical portion 17S1 of the wavelength conversion member 17 are perpendicular to each other. It's becoming

In this way, individual pieces of the wavelength converting portion 17 covered with the first covering member 19 can be formed. As described above, the first vertical portion 17S1 and the second vertical portion 17S3 of the wavelength converting member 17 can be provided depending on the shapes of the first blade B1 and the second blade B2. As a result, the dimensions of the top surface 17T and the bottom surface 17B of the wavelength conversion member 17 are stabilized, and processing accuracy can be ensured.

Each of the wavelength conversion members 17 having the first covering member 19 thus separated is arranged on the light emitting element 13 with the adhesive layer 15 interposed therebetween. After that, a second covering member 21 is filled between the side surfaces of the light emitting element 13, the wavelength converting member 17, the first covering member 19, and the frame 23, thereby fabricating the light emitting device as shown in FIG. be able to.

FIG. 3 is a diagram showing the relative luminance distribution around the light emitting surface of the light emitting device 10. As shown in FIG. In the graph in FIG. 3, the horizontal axis indicates the position on the top surface of the light emitting device 10 with the center of the top surface 17T of the wavelength converting member 17 set to 0 mm. In the graph in FIG. 3, the vertical axis indicates the relative luminance with the luminance at the position 0 mm being 1. As shown in FIG.

"17T" in FIG. 3 indicates a region corresponding to the upper surface 17T of the wavelength converting member 17 with respect to the position on the horizontal axis. “a” in FIG. 3 indicates a region corresponding to the upper surface of the first covering member 19 . “b” in FIG. 3 indicates a region corresponding to the upper surface of the second covering member 21 . Also, the area including the area 17T and the area a corresponds to the area of the light emitting surface of the light emitting element 13 (see FIG. 1B).

In FIG. 3, the relative luminance distribution of the light emitting device 10 is indicated by a solid line as "Example", and the relative luminance distribution of the light emitting device of the comparative example is indicated by a broken line as "Comparative Example". In the comparative example, the second covering member 21 is made of the same material as the first covering member 19 and is formed in the same shape as the second covering member 21 of the light emitting device 10 by the same process. was used.

Specifically, the first covering member 19 of the example was produced using a material (A) in which 25 wt % of titanium oxide was mixed with silicone resin. In addition, the second coating member 21 of the example is composed of a silicone resin mixed with 25 wt% titanium oxide (A) and a silicone resin mixed with 1 wt% carbon black (B). It was prepared using a mixture having a ratio of A:B=97.5:2.5.

As for the comparative example, the first covering member 19 and the second covering member 21 were produced using a material (A) in which 25 wt % of titanium oxide was mixed with silicone resin. Only the second covering member 21 in the example contains carbon black having light absorption, and the second covering member 21 in the example has a higher light absorption than the second covering member 21 in the comparative example. have absorptivity.

As shown in FIG. 3, the relative luminance distributions of the example and the comparative example have similar luminance attenuation curves in the area a corresponding to the upper surface of the first covering member 19. As shown in FIG. On the other hand, in the region b corresponding to the upper surface of the second covering member 21, the attenuation of luminance is steeper in the example than in the comparative example.

In particular, the relative brightness at a position of ±0.7 mm corresponding to a position of 0.2 mm from the end of the upper surface 17T of the wavelength converting member 17 is about 0.02 in the comparative example, whereas it is about 0.02 in the example. It is as low as 0.005. Therefore, it can be said that the light leakage to the region b was suppressed more in the example than in the comparative example.

As described above, the second covering member 21 in the example has a higher light absorptance than the second covering member 21 in the comparative example. However, in the region 17T and the region a, there is no difference in the relative luminance distribution between the example and the comparative example. That is, even if the light absorption rate of the second covering member 21 is increased, the relative brightness within the light emitting surface of the light emitting element 13 does not decrease.

As described above, in the embodiment, in the configuration of the light emitting device 10, the second covering member 21 having a higher light absorption rate than the first covering member 19 is used to maintain the luminance within the light emitting surface of the light emitting element 13. At the same time, it was possible to suppress the leakage of light to the region outside the light emitting surface, thereby enhancing the contrast.

As described above in detail, the light emitting device 10 of this embodiment includes the light emitting element 13, the wavelength converting member 17 arranged on the light emitting element 13, and the first covering member 19 covering the side surface of the wavelength converting member 17. and a second covering member 21 covering them. The outer edge of the bottom surface 17B of the wavelength conversion member 17 and the outer surface of the first covering member 19 match the outer edge of the light emitting surface 13S of the light emitting element 13 when viewed from above.

Also, the second covering member 21 has a higher light absorptance than the first covering member 19 . As a result, it is possible to prevent light from leaking to a region outside the light emitting surface while maintaining the luminance within the light emitting surface of the light emitting element 13 . Therefore, according to the light emitting device 10 of this embodiment, it is possible to provide a high brightness and high contrast light emitting device. For example, when the light emitting device 10 is used as an automotive lamp, glare can be reduced.

[Modification 1]
FIG. 4 is a cross-sectional view of a light emitting device 30 according to Modification 1 of Embodiment 1. As shown in FIG. The light-emitting device 30 has a wavelength conversion member 37 whose side surface shape is different from that of the wavelength conversion member 17 of the light-emitting device 10 of Example 1, and a first covering member 39 whose inner surface shape is different from that of the first covering member 19 . , and the remaining points are configured in the same manner as the light emitting device 10 .

As shown in FIG. 4, the wavelength conversion member 37 has an inclined portion 37S2 having a curved surface. The first covering member 39 has an inner side surface 39S2 along the inclined portion 37S2 of the wavelength converting member 37. As shown in FIG.

For example, the wavelength conversion member 37 can be formed by using a blade having an R-shaped tip when forming grooves in the ceramic plate 17M in the manufacturing process shown in FIG. 2A. The grooves are filled with a resin material that forms the first covering member 39, and the ceramic plate 17M is singulated, thereby forming individual pieces in which the wavelength converting portions 37 are covered with the first covering member 39. can be done.

[Modification 2]
FIG. 5 is a cross-sectional view of a light-emitting device 40 according to Modification 2 of Embodiment 1. As shown in FIG. The light emitting device 40 differs in that the bottom surface 17B of the wavelength conversion member 17 is larger than the top surface 13S of the light emitting element 13 and that the adhesive layer 45 is provided instead of the adhesive layer 15. 1 is configured in the same manner as the light emitting device 10 of FIG.

As shown in FIG. 5 , the bottom surface 17B of the wavelength conversion member 17 is larger than the top surface 13S of the light emitting element 13 and covers the entire top surface 13S of the light emitting element 13 . The adhesive layer 45 covers the entire bottom surface 17B of the wavelength conversion member 17, the entire top surface 13S of the light emitting element 13, and the side surface portion of the light emitting element 13 from the top surface 13S to a position not reaching the substrate 11. there is

That is, the adhesive layer 45 is also formed on part of the side surface of the light emitting element 13 . FIG. 5 shows an example in which a portion 45S of the adhesive layer 45 covering part of the side surface of the light emitting element 13 is formed in a fillet shape up to the intermediate portion of the side surface.

In the light-emitting device 40, the bottom surface 17B of the wavelength conversion member 17 is larger than the top surface 13S of the light-emitting element 13, so that loss of light emitted from the light-emitting element 13 can be prevented, and the light can efficiently pass through the wavelength conversion member 17. is guided to Further, since the adhesive layer 45 has the fillet-shaped portion 45</b>S, the light from the light emitting element 13 can be efficiently guided to the wavelength conversion member 17 .

As shown in FIG. 5, also in this modified example, as in the case of the light emitting device 10, the outer surface of the first covering member 19 and the outer peripheral portion of the bottom surface 17B of the wavelength converting member 17 are separated from each other when viewed from above. are substantially identical in Therefore, the second covering member 21 has an inner side surface extending in a direction perpendicular to the substrate 11 from the outer periphery of the bottom surface 17B of the wavelength conversion member 17 toward the top surface 17T of the wavelength conversion member 17 . .

In the above embodiment, the wavelength conversion member 17 has the first vertical portion 17S1 and the second vertical portion 17S3 on its side surface. good. For example, the wavelength conversion member 17 may have a truncated pyramid shape such as a truncated pyramid shape or a truncated cone shape.

In addition to the light-reflecting particles, a light-absorbing material may be added to the first covering member 19 in the above examples and modifications.

Also, for example, the first covering member 19 may have a higher light absorptance than the second covering member 21 . That is, the first covering member 19 and the second covering member 21 may have different light absorptances. For example, the first covering member 19 and the second covering member 21 contain light-reflective particles such as titanium oxide at a certain ratio or more, and further contain light-absorbing materials such as carbon black at different concentrations. You can stay

As a result, the light leakage from the side surface of the wavelength conversion member 17 or 37 is absorbed by the first covering member 19, the light incident on the second covering member 21 is returned to the first covering member 19, and the light emitting surface A sharp luminance profile can be obtained at the edge of . Such light-emitting devices can be used, for example, in lighting devices that require higher contrast.

In addition, in the above embodiment, the case where the light emitting element 13 is a top emission type element has been described, but the present invention is not limited to this. For example, as the light-emitting element 13, a flip-chip type element in which a semiconductor light-emitting layer is grown on a transparent substrate and mounted reversely may be used. In this case, by reducing the light absorption rate of the second covering member 21, the light from the side surface of the light emitting element 13 can be guided to the wavelength converting member 17, and the light emitting surface can be illuminated without lowering the luminance. Light leakage to the outside can be prevented.

For example, in Modification 2 above, when the light emitting element 13 is flip-chip mounted, the adhesive layer 45 has the fillet-shaped portion 45S so that the light from the side surface of the light emitting element 13 can be efficiently wavelength-converted. Light can be guided to the member 17 .

The configuration of a light emitting device 50 according to Example 2 will be described with reference to FIGS. 6A and 6B. 6A is a top view of the light emitting device 50. FIG. 6B is a cross-sectional view along line 6B-6B of FIG. 6A.

The light-emitting device 50 is configured in the same manner as the light-emitting device 10 except for some configurations. Hereinafter, the description of the same configuration as in the case of the light emitting device 10 will be omitted, and the different configuration will be described.

The element array 13AR is composed of two light emitting elements 13 aligned and arranged on the substrate 11. As shown in FIG. Each of the light emitting elements 13 forming the element array 13AR is mounted side by side on the mounting surface of the substrate 11 . The outer edge of the upper surface of the element array 13AR defines the light emitting surface of the element array 13AR.

In this embodiment, the light-emitting elements 13 have a rectangular parallelepiped shape, and the element array 13AR is arranged so that the side surfaces of the element array 13AR are rectangular parallelepipeds.

The wavelength conversion member 17 is arranged on the element array 13AR. As shown in FIG. 6B, the bottom surface 17B of the wavelength conversion member 17 extends over the entire outer edge of the top surface of the element array 13AR. Further, as in the first embodiment, the wavelength conversion member 17 has a top surface 17T smaller than the bottom surface 17B, and has a side shape in which the width in the direction parallel to the substrate 11 decreases from the bottom surface 17B toward the top surface 17T. have. Also, in this embodiment, the outer edge of the bottom surface 17B substantially coincides with the outer edge of the element array 13AR.

The first covering member 19 covers the side surface of the wavelength converting member 17 as in the case of the first embodiment.

As in the first embodiment, the second covering member 21 has a rectangular parallelepiped inner side surface 21S1 extending from the substrate 11 through the outer periphery of the bottom surface 17B in a direction perpendicular to the substrate 11. . The inner side surface 21S1 covers the entire array side surface forming the outer edge of the element array 13AR.

The second covering member 21 is filled between one light emitting element 13 forming the element array 13AR and another light emitting element 13 adjacent thereto. As shown in FIG. 6B , the second covering member 21 is filled between the adjacent light emitting elements 13 to a height not reaching the upper surfaces of the light emitting elements 13 .

The adhesive layer 55 is formed on the element array 13AR. Like the adhesive layer 15 , the adhesive layer 55 is made of a translucent adhesive that is transparent to the light emitted from the light emitting element 13 . The outer edge of the adhesive layer 55 when viewed from above substantially matches the outer edge of the upper surface of the element array 13AR.

The adhesive layer 55 covers the entire upper surface of the element array 13AR. More specifically, the adhesive layer 55 is continuously formed on the entire top surface of each of the light emitting elements 13 included in the element array 13AR and between adjacent light emitting elements 13 . As shown in FIG. 6B, the adhesive layer 55 is formed in the gap between the adjacent light emitting elements 13 on the second covering member 21 filling the gap.

Light emitted from each of the light emitting elements 13 is guided to the wavelength converting member 17 via the adhesive layer 55 . Therefore, the light emitted from the upper surface of the element array 13AR is emitted from the upper surface of the wavelength conversion member 17 and taken out.

Also in this embodiment, as in the first embodiment, the light absorption rate of the second covering member 21 can be made higher than the light absorption rate of the first covering member 19 . The light emitted from the side surface of the wavelength conversion member 17 is reflected by the first covering member 19 and returned into the wavelength conversion member 17 again. Light not reflected by the first covering member 19 is reflected or absorbed by the second covering member. As a result, it is possible to suppress leakage of light to the outside of the light emitting surface of the element array 13AR defined by the outer edge of the element array 13AR.

In addition, although the example in which the element array 13AR is composed of two light emitting elements 13 has been described in this embodiment, the present invention is not limited to this. The element array 13AR may include a plurality of light emitting elements 13, and may be an element array in which three or more light emitting elements 13 are aligned. In the element array 13AR, for example, a plurality of (m×n) light emitting elements 13 are arranged in m rows and n columns. FIG. 6A shows the case where the light emitting elements 13 are arranged in 1 row and 2 columns (m=1, n=2).

FIG. 7 is a top view showing an example of an element array 13AR in which rectangular light emitting elements 13 are arranged in 3 rows and 4 columns. In this case, the outer edge 13E of the upper surface of the element array 13AR is defined by a straight line connecting the outer surfaces of the light emitting elements 13 positioned on the outer periphery of the element array 13AR, and has a rectangular shape.

In this embodiment, the light emitting elements 13 have a rectangular parallelepiped shape, and the array side surface of the element array 13AR has a rectangular parallelepiped shape by arranging the light emitting elements 13 in m rows and n columns. Therefore, the array side surface forms the outer edge of the element array 13AR.

In this example and Example 1, an example in which the light emitting elements 13 of the element array AR are arranged in m rows and n columns has been described, but the present invention is not limited to this. The light-emitting elements 13 may be arranged in any direction and at any distance from the adjacent light-emitting elements 13, and the outer edge 13E of the upper surface of the element array 13AR is, for example, the light-emitting elements 13 located on the outer periphery of the element array 13AR. may be defined by the encircling line of the shortest length so as to include all of Alternatively, the outer edge 13E of the top surface of the element array 13AR may be defined by a rectangular line that includes all the light emitting elements 13AR.

Moreover, in the present embodiment and the first embodiment, the case where the light emitting element 13 has a rectangular parallelepiped shape and is rectangular when viewed from above has been described, but the present invention is not limited to this. The light-emitting element 13 may have, for example, a polygonal top surface or a curved top surface such as a circle.

In this case, the outer edge 13E of the upper surface of the element array 13AR is, for example, the outer edge of the light emitting elements 13 located in the outer peripheral portion of the element array 13AR on the upper surface so as to include all the light emitting elements 13 included in the element array 13AR. It may be defined by a line encircling the shortest length. Also, for example, the outer edge 13E of the upper surface of the element array 13AR may be defined by a line forming a minimum rectangle or circle that includes all the light emitting elements 13AR.

FIG. 8 is a cross-sectional view along line 8-8 of a light-emitting device 60, which is an example of a light-emitting device having the element array 13AR shown in FIG. The light-emitting device 60 has the same configuration as the light-emitting device 40 shown in FIG. 5 except that it has an element array 13AR. Similar to the case shown in FIG. 5, the light-emitting device 60 has a configuration in which the bottom surface 17B of the wavelength converting member 17 is larger than the outer edge 13E of the upper surface of the element array 13AR.

The second covering member 21 is filled between one light emitting element 13 forming the element array 13AR and another light emitting element 13 adjacent thereto. As shown in FIG. 8 , the second covering member 21 is filled between the adjacent light emitting elements 13 to a height not reaching the upper surfaces of the light emitting elements 13 .

The adhesive layer 65 covers the entire upper surface of the element array 13AR (see FIG. 5). Also, the adhesive layer 65 is continuously formed on the second covering member 21 filled in the gap between the adjacent light emitting elements 13 (see FIG. 6B).

In addition, the adhesive layer 65 includes the entire bottom surface 17B of the wavelength conversion member 17, the entire top surface of the element array 13AR, and the light emitting elements 13 positioned on the outer periphery of the element array 13AR from the top surface to a position not reaching the substrate 11. and a portion of the side surface of the

That is, the adhesive layer 65 is also formed on part of the array side surface, which is the side surface of the element array 13AR. FIG. 8 shows an example in which a portion 65S of the adhesive layer 65 covering a portion of the side surface of the array is formed in a fillet shape up to the intermediate portion of the side surface.

In the light-emitting device 60, the bottom surface 17B of the wavelength conversion member 17 is larger than the outer edge 13E of the top surface of the light-emitting element array 13AR. The light is guided to the conversion member 17 . Since the adhesive layer 65 has the fillet-shaped portion 65</b>S, the light from the light emitting element 13 can be efficiently guided to the wavelength conversion member 17 .

In this embodiment, an example in which the gap between the adjacent light emitting elements 13 is filled with the second covering member 21 has been described, but the present invention is not limited to this. The gap may be filled with, for example, an adhesive layer 65, a first covering member, or another member whose light absorption rate and light reflectance are adjusted. Also, for example, the gap may have a hollow portion that is not filled with anything.

As described above, the light emitting device 60 of this embodiment includes the element array 13AR, the wavelength converting member 17 arranged on the element array 13AR, the first covering member 19 covering the side surface of the wavelength converting member 17, and the has a second covering member 21 covering the . The outer edge of the bottom surface 17B of the wavelength conversion member 17 and the outer surface of the first covering member 19 are larger than the outer edge of the upper surface of the element array 13AR. Also, the second covering member 21 has a higher light absorptance than the first covering member 19 .

As a result, it is possible to suppress the leakage of light to the outside of the light emitting surface while maintaining the luminance within the light emitting surface of the element array 13AR. Therefore, according to the light emitting device 60 of this embodiment, even when the element array 13AR composed of a plurality of light emitting elements 13 is used, a high brightness and high contrast light emitting device can be provided.

[Modification]
FIG. 9 is a cross-sectional view showing a cross section of a light-emitting device 70 according to a modified example of the second embodiment. The light emitting device 70 is configured in the same manner as the light emitting device 50 of Example 2 except that it has an organic film 71 .

The organic film 71 is an organic film formed over the entire top surface 17T of the wavelength conversion member 17 and the top surface of the first covering member 19 . The organic film 71 is made of resin such as fluorine-based resin, for example. The organic film 71 is, for example, a thin film and transmits light from the light emitting element 13 .

For example, when a fluorine-based resin film is used as the organic film 71, the organic film 71 has water repellency, oil repellency, and moisture resistance, and suppresses deterioration of the light emitting device 70 due to the external environment. For example, the organic film 71 prevents hydrolysis of the silicone resin forming the first covering member 19 during humidity-resistant operation or operation in a high-temperature and high-humidity environment during use.

Further, for example, when the second covering member 21 is formed by filling the organic film 71, the second covering member 21 creeps up to the upper surface of the first covering member 19 or the upper surface 17T of the wavelength converting member 17. can be prevented. Therefore, the organic film 71 can prevent the luminance within the light emitting surface of the light emitting device 70 from decreasing.

10A and 10B are cross-sectional views showing a part of the manufacturing process of the light emitting device 70. FIG. FIG. 10 shows a dicing sheet 25, a phosphor ceramic plate 17M having grooves, and a resin 19M filled in the grooves (see FIGS. 2A and 2B). In the process of FIG. 10, after filling the resin 19M, the organic film 71 is coated on the entire upper surface of the ceramic plate 17M and the resin 19M.

After the step of FIG. 10, the phosphor ceramic plate 17M is cut at the bottom of the groove filled with the resin 19M to separate into individual pieces (see FIG. 2C). In this manner, the wavelength conversion member 17 and the first covering member 19 whose upper surfaces are coated with the organic film 71 can be formed.

As described above, the light-emitting device 70 of the present modification includes the organic film 71 covering the upper surface of the wavelength conversion member 17 and the upper surface of the first covering member 19, so that It is possible to eliminate a factor that causes a decrease in luminance within the light emitting surface of the element array 13AR. Therefore, it is possible to provide a light-emitting device capable of stably emitting high-luminance, high-contrast light for a long period of time with little light leakage from the light-emitting surface of the element array 13AR.

It should be noted that the configurations shown in the above examples and modified examples are merely examples, and selection, combination, and modification are possible according to the application. For example, the organic film 71 shown in FIG. 9 in the modified example of the second embodiment may be formed in the light emitting device 10 according to the first embodiment.

6 to 10 in which a plurality of elements are used, the first covering member 19 is provided with a light-reflecting Light absorbing materials may be added in addition to the particles.

Also, the first covering member 19 may have a higher light absorptance than the second covering member 21 . That is, the first covering member 19 and the second covering member 21 may have different light absorptances. For example, the first covering member 19 and the second covering member 21 contain light-reflective particles such as titanium oxide at a certain ratio or more, and further contain light-absorbing materials such as carbon black at different concentrations. You can stay

As a result, the light leakage from the side surface of the wavelength conversion member 17 is absorbed by the first covering member 19, the light incident on the second covering member 21 is returned to the first covering member 19, and the end of the light emitting surface is returned to the first covering member 19. A sharp luminance profile can be obtained at the part. Such light-emitting devices can be used, for example, in lighting devices that require higher contrast.

As described above, in the light-emitting device of the present invention, the wavelength conversion member has a bottom surface and a top surface smaller than the bottom surface, and the first covering member fills the space between the wavelength conversion member and the second covering member. It has a configuration that is The first covering member and the second covering member have different light absorptances. Therefore, according to the light-emitting device of the present invention, leakage of light to the outside of the light-emitting surface of the light-emitting element or element array can be suppressed without lowering the luminance within the light-emitting surface, resulting in high luminance and high contrast. can be provided.

10, 30, 40, 50, 60, 70 Light emitting device 11 Substrate 13 Light emitting element 13AR Element array 15, 45, 55, 65 Adhesive layer 17 Wavelength conversion member 17T Top surface 17B Bottom surface 19 First covering member 21 Second covering member 23 Frame 71 Organic film

Claims (19)

a substrate;
a light emitting element mounted on the substrate;
a side surface shape disposed on the light emitting element and having a bottom surface covering the entire top surface of the light emitting element and an upper surface smaller than the bottom surface, and the width in a direction parallel to the substrate decreases from the bottom surface toward the top surface; a wavelength conversion member having
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire side surface of the light emitting element and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the upper surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The light- emitting device, wherein the inner side surface of the second covering member extends in a direction perpendicular to the substrate from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the upper surface side. a substrate;
a light emitting element mounted on the substrate;
a side surface shape disposed on the light emitting element and having a bottom surface covering the entire top surface of the light emitting element and an upper surface smaller than the bottom surface, and the width in a direction parallel to the substrate decreases from the bottom surface toward the top surface; a wavelength conversion member having
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire side surface of the light emitting element and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the upper surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The wavelength conversion member is a light- emitting device arranged so that an outer edge of the top surface of the light emitting element and an outer edge of the bottom surface of the wavelength conversion member match when viewed from above. a substrate;
a light emitting element mounted on the substrate;
a side surface shape disposed on the light emitting element and having a bottom surface covering the entire top surface of the light emitting element and an upper surface smaller than the bottom surface, and the width in a direction parallel to the substrate decreases from the bottom surface toward the top surface; a wavelength conversion member having
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire side surface of the light emitting element and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the upper surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The wavelength converting member has a first vertical portion extending in a direction perpendicular to the substrate from the outer peripheral portion of the bottom surface, and a portion inclined inwardly from an upper end of the first vertical portion toward the upper surface. A light- emitting device having a side surface comprising a slanted portion and a second vertical portion extending from the upper end of the slanted portion toward the upper surface in a direction perpendicular to the substrate. a substrate;
a light emitting element mounted on the substrate;
a side surface shape disposed on the light emitting element and having a bottom surface covering the entire top surface of the light emitting element and an upper surface smaller than the bottom surface, and the width in a direction parallel to the substrate decreases from the bottom surface toward the top surface; a wavelength conversion member having
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire side surface of the light emitting element and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the upper surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The wavelength conversion member is arranged on the light emitting element via a translucent adhesive layer,
The light-transmitting adhesive layer includes the entire bottom surface of the wavelength conversion member, the entire top surface of the light emitting element, a side surface portion of the light emitting element from the top surface of the light emitting element to a position not reaching the substrate, and A light- emitting device provided to cover the The light emitting device according to any one of claims 1 to 4 , wherein the wavelength conversion member has a truncated cone shape. The light emitting device according to any one of claims 1 to 5, wherein the upper surface of the wavelength conversion member and the upper surface of the first covering member are flush with each other. 7. The light emitting device according to any one of claims 1 to 6, further comprising a fluororesin film covering the upper surface of the wavelength conversion member and the upper surface of the first covering member. The light emitting device according to any one of claims 1 to 7 , wherein the second covering member has a higher light absorptivity than the first covering member. The light emitting device according to any one of claims 1 to 7 , wherein the first covering member has a higher light absorptance than the second covering member. a substrate;
an element array composed of a plurality of light emitting elements arranged in alignment on the substrate;
arranged on the element array and having a bottom surface extending over the entire outer edge of the top surface of the element array and a top surface smaller than the bottom surface, and the width in the direction parallel to the substrate decreases from the bottom surface to the top surface. a wavelength conversion member having a side shape;
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire array side surface forming the outer edge of the element array and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the top surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The light- emitting device, wherein the second covering member is filled between the adjacent light-emitting elements at a height not reaching the upper surfaces of the adjacent light-emitting elements. a substrate;
an element array composed of a plurality of light emitting elements arranged in alignment on the substrate;
arranged on the element array and having a bottom surface extending over the entire outer edge of the top surface of the element array and a top surface smaller than the bottom surface, and the width in the direction parallel to the substrate decreases from the bottom surface to the top surface. a wavelength conversion member having a side shape;
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire array side surface forming the outer edge of the element array and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the top surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The light- emitting device, wherein the inner side surface of the second covering member extends in a direction perpendicular to the substrate from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the upper surface side. a substrate;
an element array composed of a plurality of light emitting elements arranged in alignment on the substrate;
arranged on the element array and having a bottom surface extending over the entire outer edge of the top surface of the element array and a top surface smaller than the bottom surface, and the width in the direction parallel to the substrate decreases from the bottom surface to the top surface. a wavelength conversion member having a side shape;
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire array side surface forming the outer edge of the element array and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the top surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The light- emitting device, wherein the wavelength conversion member is arranged such that an outer edge of the element array and an outer edge of the bottom surface of the wavelength conversion member match when viewed from above. a substrate;
an element array composed of a plurality of light emitting elements arranged in alignment on the substrate;
arranged on the element array and having a bottom surface extending over the entire outer edge of the top surface of the element array and a top surface smaller than the bottom surface, and the width in the direction parallel to the substrate decreases from the bottom surface to the top surface. a wavelength conversion member having a side shape;
a first covering member covering the side surface of the wavelength conversion member;
a second covering member covering the entire array side surface forming the outer edge of the element array and having an inner side surface extending from the outer peripheral portion of the bottom surface of the wavelength conversion member toward the top surface side;
The first covering member and the second covering member have different light absorptances,
The first covering member is filled between the second covering member and the wavelength converting member,
The wavelength conversion member is arranged on the plurality of light emitting elements via a translucent adhesive layer,
The light-transmitting adhesive layer covers the entire bottom surface of the wavelength conversion member, the entire top surface of the element array, and a side surface portion of the array from the top surface of the element array to a position not reaching the substrate. A light- emitting device provided to The plurality of light emitting elements are arranged so that the side surface of the array has a rectangular parallelepiped shape,
14. The light emitting device according to claim 10 , wherein the second covering member has the rectangular parallelepiped inner surface. 15. The light emitting device according to any one of claims 10 to 14 , wherein the top surface of the wavelength converting member and the top surface of the first covering member are flush with each other. 16. The light emitting device according to any one of claims 10 to 15 , further comprising a fluororesin film covering the upper surface of the wavelength conversion member and the upper surface of the first covering member. 17. The light emitting device according to any one of claims 10 to 16 , wherein said second covering member has a higher light absorptance than said first covering member. 17. The light emitting device according to any one of claims 10 to 16 , wherein said first covering member has a higher light absorptance than said second covering member. a substrate;
a light emitting element mounted on the substrate;
a side surface shape disposed on the light emitting element and having a bottom surface covering the entire top surface of the light emitting element and an upper surface smaller than the bottom surface, and the width in a direction parallel to the substrate decreases from the bottom surface toward the top surface; a wavelength conversion member having
a first covering member covering the side surface of the wavelength conversion member;
A second coating that covers the entire side surface of the light emitting element, has an inner surface that extends from the outer periphery of the bottom surface of the wavelength conversion member toward the upper surface side, and covers the lower portion of the side surface of the wavelength conversion member. a member;
The first covering member and the second covering member have different light absorptances,
The light-emitting device, wherein the first covering member is filled between the second covering member and the wavelength conversion member.

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