JP7102675B2 - Optical equipment - Google Patents

Optical equipment Download PDF

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JP7102675B2
JP7102675B2 JP2017093152A JP2017093152A JP7102675B2 JP 7102675 B2 JP7102675 B2 JP 7102675B2 JP 2017093152 A JP2017093152 A JP 2017093152A JP 2017093152 A JP2017093152 A JP 2017093152A JP 7102675 B2 JP7102675 B2 JP 7102675B2
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transmitting resin
light transmitting
optical
upright
resin portion
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JP2018190861A (en
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真人 池田
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Rohm Co Ltd
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Rohm Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Description

本開示は、光学装置に関する。 The present disclosure relates to optical devices.

従来から、様々な光学装置が知られている。このような光学装置は、たとえば、受光素子および封止樹脂を含む。封止樹脂は受光素子を覆い、受光素子を保護している。受光素子には、封止樹脂の外表面から封止樹脂に入射した光が入射する。受光素子は、受光した光を電気信号に変換する。封止樹脂は、たとえば金型を用いて製造されることがある。 Conventionally, various optical devices have been known. Such optics include, for example, a light receiving element and a sealing resin. The sealing resin covers the light receiving element and protects the light receiving element. Light incident on the sealing resin is incident on the light receiving element from the outer surface of the sealing resin. The light receiving element converts the received light into an electric signal. The sealing resin may be manufactured using, for example, a mold.

特開２０１６－１３９７３４号公報Japanese Unexamined Patent Publication No. 2016-139734

本開示は、上記した事情のもとで考え出されたものであって、製造しやすく、且つ、光学特性に優れた光学装置を提供することをその課題の１つとする。 The present disclosure has been conceived under the above circumstances, and one of the problems thereof is to provide an optical device that is easy to manufacture and has excellent optical characteristics.

本開示の第１の側面によると、光学機能部位を含む光学素子と、前記光学素子を封止する光透過樹脂部と、を備え、前記光透過樹脂部は、前記光学機能部位とは反対側を向く第１外表面を含み、前記第１外表面は、互いに隣り合う第１部位および第２部位を含み、前記第１部位は、前記外表面の向く方向である第１方向視において、前記光学機能部位に重なる平滑面であり、前記第２部位は、粗面である、光学装置が提供される。 According to the first aspect of the present disclosure, an optical element including an optical functional portion and a light transmitting resin portion for sealing the optical element are provided, and the light transmitting resin portion is on a side opposite to the optical functional portion. The first outer surface includes a first portion and a second portion adjacent to each other, and the first portion is the direction in which the outer surface faces in a first direction. An optical device is provided in which the second portion is a smooth surface that overlaps the optical functional portion and is a rough surface.

本開示の第２の側面によると、光学機能部位を含む光学素子と、前記光学素子を封止する光透過樹脂部と、を備え、前記光透過樹脂部は、第１外表面と、第２外表面と、起立面と、を有し、前記第１外表面は、前記第１外表面の向く方向である第１方向視において前記光学機能部位に重なり、前記起立面は、前記第１外表面あるいは前記第２外表面のいずれか一方から、前記第１外表面および前記第２外表面の他方に向かって起立している、光学装置が提供される。 According to the second aspect of the present disclosure, an optical element including an optical functional portion and a light transmitting resin portion for sealing the optical element are provided, and the light transmitting resin portion has a first outer surface and a second outer surface. It has an outer surface and an upright surface, and the first outer surface overlaps the optical functional portion in the first directional view, which is the direction in which the first outer surface faces, and the upright surface is the first outer surface. An optical device is provided in which either the surface or the second outer surface stands up toward the other of the first outer surface and the second outer surface.

本開示のその他の特徴および利点は、添付図面を参照して以下に行う詳細な説明によって、より明らかとなろう。 Other features and advantages of the present disclosure will become more apparent with the detailed description given below with reference to the accompanying drawings.

第１実施形態の光学装置の斜視図である。It is a perspective view of the optical apparatus of 1st Embodiment. 第１実施形態の光学装置の平面図である。It is a top view of the optical apparatus of 1st Embodiment. 第１実施形態の光学装置の正面図である。It is a front view of the optical apparatus of 1st Embodiment. 第１実施形態の光学装置の左側面図である。It is a left side view of the optical apparatus of 1st Embodiment. 第１実施形態の光学装置の右側面図である。It is a right side view of the optical apparatus of 1st Embodiment. 図２のＶＩ－ＶＩ線に沿う断面図である。It is sectional drawing which follows the VI-VI line of FIG. 第１実施形態の光学装置の製造方法の一工程を示す図である。It is a figure which shows one process of the manufacturing method of the optical apparatus of 1st Embodiment. 第２実施形態の光学装置の斜視図である。It is a perspective view of the optical apparatus of 2nd Embodiment. 第２実施形態の光学装置の平面図である。It is a top view of the optical apparatus of 2nd Embodiment. 第２実施形態の光学装置の正面図である。It is a front view of the optical apparatus of 2nd Embodiment. 第２実施形態の光学装置の左側面図である。It is a left side view of the optical apparatus of 2nd Embodiment. 第２実施形態の光学装置の右側面図である。It is a right side view of the optical apparatus of 2nd Embodiment. 図９のＸＩＩＩ－ＸＩＩＩ線に沿う断面図である。It is sectional drawing which follows the XIII-XIII line of FIG. 第２実施形態の光学装置の製造方法の一工程を示す図である。It is a figure which shows one process of the manufacturing method of the optical apparatus of 2nd Embodiment. 第２実施形態の変形例の光学装置の平面図である。It is a top view of the optical apparatus of the modification of 2nd Embodiment. 図１５のＸＶＩ－ＸＶＩ線に沿う断面図である。It is sectional drawing which follows the XVI-XVI line of FIG. 第３実施形態の光学装置の平面図である。It is a top view of the optical apparatus of 3rd Embodiment. 図１７のＸＶＩＩＩ－ＸＶＩＩＩ線に沿う断面図である。It is sectional drawing which follows the XVIII-XVIII line of FIG.

＜第１実施形態＞
図１は、第１実施形態の光学装置の斜視図である。図２は、第１実施形態の光学装置の平面図である。図３は、第１実施形態の光学装置の正面図である。図４は、第１実施形態の光学装置の左側面図である。図５は、第１実施形態の光学装置の右側面図である。図６は、図２のＶＩ－ＶＩ線に沿う断面図である。 <First Embodiment>
FIG. 1 is a perspective view of the optical device of the first embodiment. FIG. 2 is a plan view of the optical device of the first embodiment. FIG. 3 is a front view of the optical device of the first embodiment. FIG. 4 is a left side view of the optical device of the first embodiment. FIG. 5 is a right side view of the optical device of the first embodiment. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG.

これらの図に示す光学装置Ａ１は、たとえば、受光装置あるいは発光装置である。光学装置Ａ１は、支持体１と、光学素子２と、接合層３と、複数のワイヤ４と、光透過樹脂部５と、を備える。 The optical device A1 shown in these figures is, for example, a light receiving device or a light emitting device. The optical device A1 includes a support 1, an optical element 2, a bonding layer 3, a plurality of wires 4, and a light transmitting resin portion 5.

支持体１は導電性を有する。本実施形態では支持体１はリードと称されるものである。本実施形態とは異なり、支持体１はリードである必要はなく、絶縁基板に形成された配線パターンであってもよい。支持体１を構成する材料は、たとえば、ＣｕまたはＣｕ合金である。支持体１の表面は、Ａｇメッキ層に構成されていてもよい。図６等に示すように、本実施形態の支持体１は、ダイボンディング部１１と、複数のワイヤボンディング部１２と、複数の延出部１５と、を含む。 The support 1 has conductivity. In this embodiment, the support 1 is referred to as a lead. Unlike the present embodiment, the support 1 does not have to be a lead, and may be a wiring pattern formed on an insulating substrate. The material constituting the support 1 is, for example, Cu or a Cu alloy. The surface of the support 1 may be formed of an Ag plating layer. As shown in FIG. 6 and the like, the support 1 of the present embodiment includes a die bonding portion 11, a plurality of wire bonding portions 12, and a plurality of extending portions 15.

ダイボンディング部１１には光学素子２が配置されている。ダイボンディング部１１は、平面視（第１方向Ｘ１とは反対の方向視）において、矩形状である。ダイボンディング部１１は、ダイボンディング部表面１１１およびダイボンディング部裏面１１２を有する。ダイボンディング部表面１１１には光学素子２が配置されている。ダイボンディング部裏面１１２は、ダイボンディング部表面１１１とは反対側を向く。本実施形態では、ダイボンディング部裏面１１２は、光透過樹脂部５から露出している。本実施形態とは異なり、ダイボンディング部裏面１１２が光透過樹脂部５に覆われていても良い。 An optical element 2 is arranged in the die bonding portion 11. The die bonding portion 11 has a rectangular shape in a plan view (a direction view opposite to the first direction X1). The die bonding portion 11 has a die bonding portion front surface 111 and a die bonding portion back surface 112. The optical element 2 is arranged on the surface 111 of the die bonding portion. The back surface 112 of the die bonding portion faces the side opposite to the front surface 111 of the die bonding portion. In the present embodiment, the back surface 112 of the die bonding portion is exposed from the light transmitting resin portion 5. Unlike the present embodiment, the back surface 112 of the die bonding portion may be covered with the light transmitting resin portion 5.

本実施形態では、ダイボンディング部１１には凹み１１４が形成されている。凹み１１４は、ダイボンディング部裏面１１２からダイボンディング部表面１１１に向かって凹む形状である。凹み１１４が形成されていることにより、ダイボンディング部表面１１１の面積は、ダイボンディング部裏面１１２の面積よりも大きくなっている。本実施形態とは異なり、ダイボンディング部１１に凹み１１４が形成されていなくてもよい。 In the present embodiment, the die bonding portion 11 is formed with a recess 114. The recess 114 has a shape that is recessed from the back surface 112 of the die bonding portion toward the front surface 111 of the die bonding portion. Since the recess 114 is formed, the area of the die bonding portion front surface 111 is larger than the area of the die bonding portion back surface 112. Unlike the present embodiment, the die bonding portion 11 does not have to have the recess 114 formed.

複数のワイヤボンディング部１２の各々には複数のワイヤ４のいずれか１つがボンディングされている。ワイヤボンディング部１２は各々、平面視（第１方向Ｘ１とは反対の方向視）において、矩形状である。ワイヤボンディング部１２は各々、ワイヤボンディング部表面１２１およびワイヤボンディング部裏面１２２を有する。ワイヤボンディング部表面１２１には複数のワイヤ４のいずれか１つがボンディングされている。ワイヤボンディング部裏面１２２は、ワイヤボンディング部表面１２１とは反対側を向く。本実施形態では、ワイヤボンディング部裏面１２２は、光透過樹脂部５から露出している。本実施形態とは異なり、ワイヤボンディング部裏面１２２が光透過樹脂部５に覆われていても良い。 Any one of the plurality of wires 4 is bonded to each of the plurality of wire bonding portions 12. Each of the wire bonding portions 12 has a rectangular shape in a plan view (a direction view opposite to the first direction X1). Each of the wire bonding portions 12 has a wire bonding portion front surface 121 and a wire bonding portion back surface 122. Any one of the plurality of wires 4 is bonded to the surface 121 of the wire bonding portion. The back surface 122 of the wire bonding portion faces the side opposite to the front surface 121 of the wire bonding portion. In the present embodiment, the back surface 122 of the wire bonding portion is exposed from the light transmitting resin portion 5. Unlike the present embodiment, the back surface 122 of the wire bonding portion may be covered with the light transmitting resin portion 5.

本実施形態では、ワイヤボンディング部１２には凹み１２４が形成されている。凹み１２４は、ワイヤボンディング部裏面１２２からワイヤボンディング部表面１２１に向かって凹む形状である。凹み１２４が形成されていることにより、ワイヤボンディング部表面１２１の面積は、ワイヤボンディング部裏面１２２の面積よりも大きくなっている。本実施形態とは異なり、ワイヤボンディング部１２に凹み１２４が形成されていなくてもよい。 In the present embodiment, the wire bonding portion 12 is formed with a recess 124. The recess 124 has a shape that is recessed from the back surface 122 of the wire bonding portion toward the front surface 121 of the wire bonding portion. Since the recess 124 is formed, the area of the wire bonding portion front surface 121 is larger than the area of the wire bonding portion back surface 122. Unlike the present embodiment, the recess 124 may not be formed in the wire bonding portion 12.

本実施形態では、ワイヤボンディング部１２は、ワイヤボンディング部側面１２３を有する。ワイヤボンディング部側面１２３は第１方向Ｘ１とは異なる方向（本実施形態では第１方向Ｘ１に直交する第２方向Ｘ２）を向く。ワイヤボンディング部側面１２３は、光透過樹脂部５から露出している。本実施形態とは異なり、ワイヤボンディング部側面１２３は第２方向Ｘ２とは異なる方向を向いていてもよい。また、本実施形態とは異なり、ワイヤボンディング部側面１２３が光透過樹脂部５から露出していなくてもよい。 In the present embodiment, the wire bonding portion 12 has a wire bonding portion side surface 123. The side surface 123 of the wire bonding portion faces in a direction different from the first direction X1 (in the present embodiment, the second direction X2 orthogonal to the first direction X1). The side surface 123 of the wire bonding portion is exposed from the light transmitting resin portion 5. Unlike the present embodiment, the wire bonding portion side surface 123 may face in a direction different from the second direction X2. Further, unlike the present embodiment, the side surface 123 of the wire bonding portion may not be exposed from the light transmitting resin portion 5.

本実施形態では、支持体１は、複数（本実施形態では２つ、図２等を参照）の延出部１５を含む。複数の延出部１５は各々、ダイボンディング部１１につながっている。複数の延出部１５は、ダイボンディング部１１から第３方向Ｘ３（第１方向Ｘ１および第２方向Ｘ２に直交する）に沿って延びている。複数の延出部１５は各々、側面１５１を有する。側面１５１は第１方向Ｘ１とは異なる方向（本実施形態では第３方向Ｘ３）を向く。側面１５１は、光透過樹脂部５から露出している。本実施形態とは異なり、側面１５１は第２方向Ｘ３とは異なる方向を向いていてもよい。また、本実施形態とは異なり、側面１５１が光透過樹脂部５から露出していなくてもよい。 In the present embodiment, the support 1 includes a plurality of (two in the present embodiment, see FIG. 2, etc.) extending portions 15. Each of the plurality of extending portions 15 is connected to the die bonding portion 11. The plurality of extending portions 15 extend from the die bonding portion 11 along the third direction X3 (orthogonal to the first direction X1 and the second direction X2). Each of the plurality of extension portions 15 has a side surface 151. The side surface 151 faces a direction different from the first direction X1 (the third direction X3 in this embodiment). The side surface 151 is exposed from the light transmitting resin portion 5. Unlike the present embodiment, the side surface 151 may face in a direction different from the second direction X3. Further, unlike the present embodiment, the side surface 151 may not be exposed from the light transmitting resin portion 5.

図６等に示す光学素子２は、たとえば半導体よりなる。光学素子２は、たとえば、受光素子あるいは発光素子である。このような受光素子としては、色を認識する素子であってもよく、更に、赤、緑、青のカラーフィルタを含んでいてもよい。このような素子は、光学装置Ａ１が搭載されるシステム（たとえば携帯電話やデジタルカメラ）の外部環境にあわせて、当該システムの表示モニタの表示態様を変化させるために用いられる。光学素子２は、受光する部分（あるいは発光する部分）に加え、制御部を有していてもよい。光学素子２は、光学機能部位２１を有する。光学素子２が受光素子である場合には、光学機能部位２１は受光面である。この場合、受光面である光学機能部位２１は外部からの光を取り込み、光学素子２が当該光を電気信号に変換する。光学素子２が発光素子である場合には、光学機能部位２１は発光面である。この場合、光学素子２が電気信号を光に変換し、発光面である光学機能部位２１からは当該光が放たれる。本実施形態では、光学機能部位２１は、光学素子２において、図６における上部に位置している。 The optical element 2 shown in FIG. 6 and the like is made of, for example, a semiconductor. The optical element 2 is, for example, a light receiving element or a light emitting element. Such a light receiving element may be an element that recognizes a color, and may further include a red, green, and blue color filter. Such an element is used to change the display mode of the display monitor of the system according to the external environment of the system (for example, a mobile phone or a digital camera) on which the optical device A1 is mounted. The optical element 2 may have a control unit in addition to a light receiving portion (or a light emitting portion). The optical element 2 has an optical functional portion 21. When the optical element 2 is a light receiving element, the optical functional portion 21 is a light receiving surface. In this case, the optical functional portion 21 which is a light receiving surface takes in light from the outside, and the optical element 2 converts the light into an electric signal. When the optical element 2 is a light emitting element, the optical functional portion 21 is a light emitting surface. In this case, the optical element 2 converts an electric signal into light, and the light is emitted from the optical functional portion 21 which is a light emitting surface. In the present embodiment, the optical functional portion 21 is located at the upper part in FIG. 6 in the optical element 2.

図６等に示す接合層３は、光学素子２および支持体１の間に介在している。接合層３は、光学素子２を支持体１に接合するためのものである。接合層３は、絶縁性であってもよいし、導電性であってもよい。本実施形態では接合層３は導電性である。導電性の接合層３を構成する材料としては、たとえば、Ａｇである。 The bonding layer 3 shown in FIG. 6 and the like is interposed between the optical element 2 and the support 1. The bonding layer 3 is for bonding the optical element 2 to the support 1. The joining layer 3 may be insulating or conductive. In this embodiment, the bonding layer 3 is conductive. The material constituting the conductive joint layer 3 is, for example, Ag.

複数のワイヤ４は導電性の材料よりなる。このような材料としては、たとえば、Ａｕ、Ａｇ、およびＣｕが挙げられる。複数のワイヤ４は各々、光学素子２と、支持体１（具体的には複数のダイボンディング部１１のいずれか１つ）と、にボンディングされている。 The plurality of wires 4 are made of a conductive material. Examples of such materials include Au, Ag, and Cu. Each of the plurality of wires 4 is bonded to the optical element 2 and the support 1 (specifically, any one of the plurality of die bonding portions 11).

光透過樹脂部５は、支持体１と、光学素子２と、接合層３と、ワイヤ４と、を覆っている。光透過樹脂部５は、支持体１と、光学素子２と、接合層３と、ワイヤ４と、に直接接している。光透過樹脂部５は、支持体１、光学素子２、接合層３、およびワイヤ４を保護するためのものである。光透過樹脂部５は、光を透過させる材料よりなる。具体的には、光学素子２が受光素子の場合、光学素子２の光学機能部位２１（受光面）が取り込み可能な光を透過させる材料によって光透過樹脂部５は構成されている。光学素子２が発光素子の場合、光学素子２の光学機能部位２１（発光面）から放たれる光を透過させる材料によって光透過樹脂部５は構成されている。光学素子２は透明であってもよい。追加的に、光透過樹脂部５に、蛍光材料が混入されていてもよい。光透過樹脂部５の第１方向Ｘ１の寸法は、たとえば、０．５～１．２ｍｍである。 The light transmitting resin portion 5 covers the support 1, the optical element 2, the bonding layer 3, and the wire 4. The light transmitting resin portion 5 is in direct contact with the support 1, the optical element 2, the bonding layer 3, and the wire 4. The light transmitting resin portion 5 is for protecting the support 1, the optical element 2, the bonding layer 3, and the wire 4. The light transmitting resin portion 5 is made of a material that transmits light. Specifically, when the optical element 2 is a light receiving element, the light transmitting resin portion 5 is composed of a material that transmits light that can be taken in by the optical functional portion 21 (light receiving surface) of the optical element 2. When the optical element 2 is a light emitting element, the light transmitting resin portion 5 is composed of a material that transmits light emitted from the optical functional portion 21 (light emitting surface) of the optical element 2. The optical element 2 may be transparent. In addition, a fluorescent material may be mixed in the light transmitting resin portion 5. The dimension of the light transmitting resin portion 5 in the first direction X1 is, for example, 0.5 to 1.2 mm.

図２、図６等に示すように、光透過樹脂部５は、第１外表面５１と、第１外側面５３Ａと、第２外側面５３Ｂと、第３外側面５３Ｃと、第４外側面５３Ｄと、裏面５５と、を含む。 As shown in FIGS. 2 and 6, the light transmitting resin portion 5 includes a first outer surface 51, a first outer surface 53A, a second outer surface 53B, a third outer surface 53C, and a fourth outer surface. Includes 53D and back side 55.

第１外表面５１は、光学機能部位２１とは反対側を向く。具体的には、第１外表面５１は、第１方向Ｘ１を向く。第１外表面５１は、互いに隣り合う第１部位５１１および第２部位５１２を含む。 The first outer surface 51 faces the side opposite to the optical functional portion 21. Specifically, the first outer surface 51 faces the first direction X1. The first outer surface 51 includes a first site 511 and a second site 512 that are adjacent to each other.

第１部位５１１は、第１部位５１１は、第１外表面５１の向く方向である第１方向Ｘ１視において、光学機能部位２１に重なる平滑面である。第１部位５１１には、光学素子２の全体が第１方向Ｘ１視において、重なっている。 The first portion 511 is a smooth surface that overlaps the optical functional portion 21 in the first direction X1 view, which is the direction in which the first outer surface 51 faces. The entire optical element 2 overlaps the first portion 511 in the first direction X1 view.

第２部位５１２は粗面である。そのため、第２部位５１２の最大高低差よりも、第１部位５１１の最大高低差は小さい。第２部位５１２の最大高低差は、たとえば、４～１１μｍである。粗面は、たとえば梨地加工がなされた面である。第２部位５１２を図１、図２等では、砂模様を付して示している。本実施形態では、第２部位５１２は、第１方向Ｘ１視において、第１部位５１１を包囲する枠状である。本実施形態では、第１方向Ｘ１視において第１外表面５１の端縁に至っている。本実施形態では、第１外表面５１の端縁は、第１外側面５３Ａと第１外表面５１との境界５３１Ａ、第２外側面５３Ｂと第１外表面５１との境界５３１Ｂ、第３外側面５３Ｃと第１外表面５１との境界５３１Ｃ、および、第４外側面５３Ｄと第１外表面５１との境界５３１Ｄの少なくともいずれか１つが該当する。本実施形態とは異なり、第２部位５１２が第１外表面５１の端縁まで至っていなくてもよい。 The second portion 512 is a rough surface. Therefore, the maximum height difference of the first part 511 is smaller than the maximum height difference of the second part 512. The maximum height difference of the second site 512 is, for example, 4 to 11 μm. The rough surface is, for example, a surface that has been subjected to satin finish. The second part 512 is shown with a sand pattern in FIGS. 1, 2 and the like. In the present embodiment, the second part 512 has a frame shape surrounding the first part 511 in the first direction X1 view. In the present embodiment, the edge of the first outer surface 51 is reached in the first direction X1 view. In the present embodiment, the edge of the first outer surface 51 is the boundary 531A between the first outer surface 53A and the first outer surface 51, the boundary 531B between the second outer surface 53B and the first outer surface 51, and the third outer surface. At least one of the boundary 531C between the side surface 53C and the first outer surface 51 and the boundary 531D between the fourth outer surface 53D and the first outer surface 51 falls under this category. Unlike the present embodiment, the second portion 512 may not reach the edge of the first outer surface 51.

図２、図６等に示すように、第１外側面５３Ａ、第２外側面５３Ｂ、第３外側面５３Ｃ、および第４外側面５３Ｄは、第１方向Ｘ１とは異なる方向を向く。本実施形態では、第１外側面５３Ａおよび第３外側面５３Ｃは、第２方向Ｘ２を向く。第２外側面５３Ｂおよび第４外側面５３Ｄは、第３方向Ｘ３を向く。第１外側面５３Ａ、第２外側面５３Ｂ、第３外側面５３Ｃ、および第４外側面５３Ｄは、第１外表面５１に直交している。本実施形態とは異なり、第１外側面５３Ａ、第２外側面５３Ｂ、第３外側面５３Ｃ、および第４外側面５３Ｄは、第１外表面５１と直交していなくてもよく、第１外表面５１に対し９０度より大きいあるいは小さい角度で傾斜していてもよい。第１外側面５３Ａおよび第３外側面５３Ｃは、光透過樹脂部５において互いに反対側に位置する。第２外側面５３Ｂおよび第４外側面５３Ｄは、光透過樹脂部５において互いに反対側に位置する。第１外側面５３Ａおよび第２外側面５３Ｂは互いにつながり、第２外側面５３Ｂおよび第３外側面５３Ｃは互いにつながり、第４外側面５３Ｄおよび第１外側面５３Ａは互いにつながる。図２に示すように、本実施形態では、第１外側面５３Ａと第１外表面５１との境界５３１Ａ、第２外側面５３Ｂと第１外表面５１との境界５３１Ｂ、第３外側面５３Ｃと第１外表面５１との境界５３１Ｃ、および第４外側面５３Ｄと第１外表面５１との境界５３１Ｄに、第２部位５１２が至っている。 As shown in FIGS. 2, 6 and the like, the first outer surface 53A, the second outer surface 53B, the third outer surface 53C, and the fourth outer surface 53D face different directions from the first direction X1. In this embodiment, the first outer surface 53A and the third outer surface 53C face the second direction X2. The second outer surface 53B and the fourth outer surface 53D face the third direction X3. The first outer surface 53A, the second outer surface 53B, the third outer surface 53C, and the fourth outer surface 53D are orthogonal to the first outer surface 51. Unlike the present embodiment, the first outer surface 53A, the second outer surface 53B, the third outer surface 53C, and the fourth outer surface 53D do not have to be orthogonal to the first outer surface 51, and the first outer surface 51 may not be orthogonal to the first outer surface 51. It may be tilted at an angle greater than or less than 90 degrees with respect to the surface 51. The first outer surface 53A and the third outer surface 53C are located on opposite sides of each other in the light transmitting resin portion 5. The second outer surface 53B and the fourth outer surface 53D are located on opposite sides of each other in the light transmitting resin portion 5. The first outer surface 53A and the second outer surface 53B are connected to each other, the second outer surface 53B and the third outer surface 53C are connected to each other, and the fourth outer surface 53D and the first outer surface 53A are connected to each other. As shown in FIG. 2, in the present embodiment, the boundary 531A between the first outer surface 53A and the first outer surface 51, the boundary 531B between the second outer surface 53B and the first outer surface 51, and the third outer surface 53C. The second portion 512 reaches the boundary 531C with the first outer surface 51 and the boundary 531D between the fourth outer surface 53D and the first outer surface 51.

裏面５５は、第１外表面５１とは反対側を向く。裏面５５からは支持体１（具体的には、ダイボンディング部１１のダイボンディング部裏面１１２、およびワイヤボンディング部１２のワイヤボンディング部裏面１２２）が露出している。 The back surface 55 faces the side opposite to the first outer surface 51. The support 1 (specifically, the back surface 112 of the die bonding portion of the die bonding portion 11 and the back surface 122 of the wire bonding portion of the wire bonding portion 12) is exposed from the back surface 55.

次に、本実施形態の光学装置Ａ１の製造方法の一工程について説明する。上記と同一または類似の構成については上記と同一の符号を付し、説明を適宜省略する。以下の他の実施形態でも同様である。 Next, one step of the manufacturing method of the optical device A1 of the present embodiment will be described. The same or similar configurations as above are designated by the same reference numerals as above, and the description thereof will be omitted as appropriate. The same applies to the following other embodiments.

図７は、第１実施形態の光学装置の製造方法の一工程を示す図である。 FIG. 7 is a diagram showing one step of the manufacturing method of the optical device of the first embodiment.

図７に示す中間品では、支持体１と、複数の光学素子２と、複数のワイヤ４と、が光透過樹脂部５Ａ（なお、図７では、光透過樹脂部５Ａが複数の光透過樹脂部５へと切断された状態を示している）に覆われている。そして、同図に示すように、治具８１に光透過樹脂部５Ａを載せつつ、好ましくは、光透過樹脂部５Ａをたとえばポンプ（図示略）で吸引する。この状態で、光透過樹脂部５Ａ等をブレード８１３で切断することにより、複数の光学装置Ａ１が製造される。ブレード８１３による光透過樹脂部５Ａの切断面が、上述の第１外側面５３Ａ、第２外側面５３Ｂ、第３外側面５３Ｃ、および、第４外側面５３Ｄとなる。 In the intermediate product shown in FIG. 7, the support 1, the plurality of optical elements 2, and the plurality of wires 4 are in the light transmitting resin portion 5A (note that in FIG. 7, the light transmitting resin portion 5A is a plurality of light transmitting resins. It is covered with (showing the state of being cut into part 5). Then, as shown in the figure, while the light transmitting resin portion 5A is placed on the jig 81, the light transmitting resin portion 5A is preferably sucked by, for example, a pump (not shown). In this state, a plurality of optical devices A1 are manufactured by cutting the light transmitting resin portion 5A and the like with the blade 813. The cut surface of the light transmitting resin portion 5A by the blade 813 becomes the above-mentioned first outer surface 53A, second outer surface 53B, third outer surface 53C, and fourth outer surface 53D.

次に、本実施形態の作用効果について説明する。 Next, the action and effect of this embodiment will be described.

図２に示すように、本実施形態においては、第１外表面５１は、互いに隣り合う第１部位５１１および第２部位５１２を含む。第１部位５１１は、外表面の向く方向である第１方向Ｘ１視において、光学機能部位２１に重なる平滑面である。第２部位５１２は、粗面である。このような構成によると、光透過樹脂部５の平滑面である第１部位５１１を通過する光が、第１部位５１１において反射や屈折や乱反射することを抑制できる。また、光透過樹脂部５に粗面である第２部位５１２が形成されていることにより、光透過樹脂部５Ａを形成する際に用いる金型を、光透過樹脂部５Ａから抜けやすくすることができる。その結果、製造しやすく、且つ、光学特性に優れた光学装置Ａ１を提供することができる。 As shown in FIG. 2, in the present embodiment, the first outer surface 51 includes a first portion 511 and a second portion 512 that are adjacent to each other. The first portion 511 is a smooth surface that overlaps the optical functional portion 21 in the first direction X1 view, which is the direction in which the outer surface faces. The second portion 512 is a rough surface. According to such a configuration, it is possible to prevent the light passing through the first portion 511, which is the smooth surface of the light transmitting resin portion 5, from being reflected, refracted, or diffusely reflected at the first portion 511. Further, since the second portion 512 which is a rough surface is formed in the light transmitting resin portion 5, the mold used when forming the light transmitting resin portion 5A can be easily removed from the light transmitting resin portion 5A. can. As a result, it is possible to provide an optical device A1 that is easy to manufacture and has excellent optical characteristics.

＜第２実施形態＞ <Second Embodiment>

図８は、第２実施形態の光学装置の斜視図である。図９は、第２実施形態の光学装置の平面図である。図１０は、第２実施形態の光学装置の正面図である。図１１は、第２実施形態の光学装置の左側面図である。図１２は、第２実施形態の光学装置の右側面図である。図１３は、図９のＸＩＩＩ－ＸＩＩＩ線に沿う断面図である。 FIG. 8 is a perspective view of the optical device of the second embodiment. FIG. 9 is a plan view of the optical device of the second embodiment. FIG. 10 is a front view of the optical device of the second embodiment. FIG. 11 is a left side view of the optical device of the second embodiment. FIG. 12 is a right side view of the optical device of the second embodiment. FIG. 13 is a cross-sectional view taken along the line XIII-XIII of FIG.

これらの図に示す光学装置Ａ２は、支持体１と、光学素子２と、接合層３と、複数のワイヤ４と、光透過樹脂部５と、を備える。支持体１と、光学素子２と、接合層３と、複数のワイヤ４と、については光学装置Ａ１におけるものと同様であるので、説明を省略する。 The optical device A2 shown in these figures includes a support 1, an optical element 2, a bonding layer 3, a plurality of wires 4, and a light transmitting resin portion 5. The support 1, the optical element 2, the bonding layer 3, and the plurality of wires 4 are the same as those in the optical device A1, and thus the description thereof will be omitted.

光透過樹脂部５は、第１外表面５２と、第２外表面５７と、第１外側面５３Ａと、第２外側面５３Ｂと、第３外側面５３Ｃと、第４外側面５３Ｄと、裏面５５と、第１起立面５８Ａと、第２起立面５８Ｂと、第３起立面５８Ｃと、第４起立面５８Ｄと、を含む。 The light transmitting resin portion 5 includes a first outer surface 52, a second outer surface 57, a first outer surface 53A, a second outer surface 53B, a third outer surface 53C, a fourth outer surface 53D, and a back surface. 55, a first upright surface 58A, a second upright surface 58B, a third upright surface 58C, and a fourth upright surface 58D are included.

第１外表面５２は、光学機能部位２１とは反対側を向く。具体的には、第１外表面５２は、第１方向Ｘ１を向く。第１外表面５２の全体は平滑面であってもよいし、あるいは、粗面であってもよい。 The first outer surface 52 faces the side opposite to the optical functional portion 21. Specifically, the first outer surface 52 faces the first direction X1. The entire first outer surface 52 may be a smooth surface or a rough surface.

第２外表面５７は、第１方向Ｘ１において第１外表面５２とは異なる位置に位置している。本実施形態では、第２外表面５７は、第１方向Ｘ１視において、第１外表面５１を包囲する形状である。第２外表面５７の全体は平滑面であってもよいし、あるいは、粗面であってもよい。第２外表面５７は、第１外側面５３Ａ、第２外側面５３Ｂ、第３外側面５３Ｃ、および第４外側面５３Ｄにつながっている。 The second outer surface 57 is located at a position different from that of the first outer surface 52 in the first direction X1. In the present embodiment, the second outer surface 57 has a shape surrounding the first outer surface 51 in the first direction X1 view. The entire second outer surface 57 may be a smooth surface or a rough surface. The second outer surface 57 is connected to the first outer surface 53A, the second outer surface 53B, the third outer surface 53C, and the fourth outer surface 53D.

第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および、第４起立面５８Ｄは、第１外表面５２あるいは第２外表面５７のいずれか一方から、第１外表面５２および第２外表面５７の他方に向かって起立している。図１０～図１２に示すように、第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および、第４起立面５８Ｄは、第２外表面５７から第１外表面５２に向かって起立している。第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および第４起立面５８Ｄは、第１方向Ｘ１とは異なる方向を向く。本実施形態では、第１起立面５８Ａおよび第３起立面５８Ｃは、第２方向Ｘ２を向く。第２起立面５８Ｂおよび第４起立面５８Ｄは、第３方向Ｘ３を向く。第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および第４起立面５８Ｄは、第１外表面５２に直交している。本実施形態とは異なり、第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および第４起立面５８Ｄは、第１外表面５２と直交していなくてもよく、第１外表面５２に対し９０度より大きいあるいは小さい角度で傾斜していてもよい。第１起立面５８Ａおよび第３起立面５８Ｃは、光透過樹脂部５において互いに反対側に位置する。第２起立面５８Ｂおよび第４起立面５８Ｄは、光透過樹脂部５において互いに反対側に位置する。第１起立面５８Ａおよび第２起立面５８Ｂは互いにつながり、第２起立面５８Ｂおよび第３起立面５８Ｃは互いにつながり、第４起立面５８Ｄおよび第１起立面５８Ａは互いにつながる。第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および、第４起立面５８Ｄは、第１外表面５２および第２外表面５７につながっている。 The first upright surface 58A, the second upright surface 58B, the third upright surface 58C, and the fourth upright surface 58D are formed from either the first outer surface 52 or the second outer surface 57, from the first outer surface 52 and the first outer surface 52. It stands up toward the other side of the second outer surface 57. As shown in FIGS. 10 to 12, the first upright surface 58A, the second upright surface 58B, the third upright surface 58C, and the fourth upright surface 58D are directed from the second outer surface 57 to the first outer surface 52. Standing up. The first upright surface 58A, the second upright surface 58B, the third upright surface 58C, and the fourth upright surface 58D face directions different from the first direction X1. In the present embodiment, the first upright surface 58A and the third upright surface 58C face the second direction X2. The second upright surface 58B and the fourth upright surface 58D face the third direction X3. The first upright surface 58A, the second upright surface 58B, the third upright surface 58C, and the fourth upright surface 58D are orthogonal to the first outer surface 52. Unlike the present embodiment, the first upright surface 58A, the second upright surface 58B, the third upright surface 58C, and the fourth upright surface 58D do not have to be orthogonal to the first outer surface 52, and the first outer surface 52 It may be tilted at an angle greater than or less than 90 degrees with respect to the surface 52. The first upright surface 58A and the third upright surface 58C are located on opposite sides of each other in the light transmitting resin portion 5. The second upright surface 58B and the fourth upright surface 58D are located on opposite sides of each other in the light transmitting resin portion 5. The first upright surface 58A and the second upright surface 58B are connected to each other, the second upright surface 58B and the third upright surface 58C are connected to each other, and the fourth upright surface 58D and the first upright surface 58A are connected to each other. The first upright surface 58A, the second upright surface 58B, the third upright surface 58C, and the fourth upright surface 58D are connected to the first outer surface 52 and the second outer surface 57.

本実施形態では、光透過樹脂部５は、第２外表面５７から隆起する隆起部５９１を含む。隆起部５９１は、第１外表面５１、第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および第４起立面５８Ｄから形成されている。 In the present embodiment, the light transmitting resin portion 5 includes a raised portion 591 that is raised from the second outer surface 57. The raised portion 591 is formed of a first outer surface 51, a first upright surface 58A, a second upright surface 58B, a third upright surface 58C, and a fourth upright surface 58D.

次に、本実施形態の光学装置Ａ２の製造方法の一工程について説明する。 Next, one step of the manufacturing method of the optical device A2 of the present embodiment will be described.

図１４は、第２実施形態の光学装置の製造方法の一工程を示す図である。 FIG. 14 is a diagram showing one step of the manufacturing method of the optical device of the second embodiment.

図１４に示すように、支持体１と、複数の光学素子２と、複数のワイヤ４と、が光透過樹脂部５Ｂ（なお、図１４では、光透過樹脂部５Ｂが複数の光透過樹脂部５へと切断された状態を示している）に覆われている。そして、同図に示すように、治具８１に光透過樹脂部５Ｂを載せつつ、好ましくは、光透過樹脂部５Ｂをたとえばポンプ（図示略）で吸引する。このとき、光透過樹脂部５Ｂにおける隆起部５９１が、治具８１における凹部８１１に配置される。凹部８１１における内側面が、光透過樹脂部５Ｂにおける起立面（第１起立面５８Ａ等）に当接している。この状態で、光透過樹脂部５Ｂ等をブレード８１３で切断することにより、複数の光学装置Ａ１が製造される。ブレード８１３による光透過樹脂部５Ａの切断面が、上述の第１外側面５３Ａ、第２外側面５３Ｂ、第３外側面５３Ｃ、および、第４外側面５３Ｄとなる。 As shown in FIG. 14, the support 1, the plurality of optical elements 2, and the plurality of wires 4 are in the light transmitting resin portion 5B (note that in FIG. 14, the light transmitting resin portion 5B is a plurality of light transmitting resin portions. It is covered with (showing the state of being cut to 5). Then, as shown in the figure, while the light transmitting resin portion 5B is placed on the jig 81, the light transmitting resin portion 5B is preferably sucked by, for example, a pump (not shown). At this time, the raised portion 591 of the light transmitting resin portion 5B is arranged in the recess 811 of the jig 81. The inner surface of the recess 811 is in contact with an upright surface (first upright surface 58A or the like) of the light transmitting resin portion 5B. In this state, the light transmitting resin portion 5B and the like are cut by the blade 813 to manufacture a plurality of optical devices A1. The cut surface of the light transmitting resin portion 5A by the blade 813 becomes the above-mentioned first outer surface 53A, second outer surface 53B, third outer surface 53C, and fourth outer surface 53D.

次に、本実施形態の作用効果について説明する。 Next, the action and effect of this embodiment will be described.

本実施形態においては、光透過樹脂部５は、起立面（第１起立面５８Ａ等）を含む。起立面（第１起立面５８Ａ等）は、第１外表面５１あるいは第２外表面５７のいずれか一方から、第１外表面５１および第２外表面５７の他方に向かって起立している。このような構成によると、たとえばブレード８１３による光透過樹脂部５Ｂの切断（ダイシング）の際（図１４参照）に、治具８１の凹部８１１における内側面を、光透過樹脂部５Ｂにおける起立面（第１起立面５８Ａ等）に当接させることできる。これにより、光透過樹脂部５Ｂのダイシングの際に、光透過樹脂部５Ｂが移動したり、振動したりすることを抑制できる。その結果、切断面（本実施形態では、第１外側面５３Ａ、第２外側面５３Ｂ、第３外側面５３Ｃ、および第４外側面５３Ｄ）の品質の低下を極力防止できる。特に、光透過樹脂部５Ｂが透明樹脂よりなる場合、光透過樹脂部５Ｂが大きく反ることがある。大きく反った光透過樹脂部５Ｂを治具８１に安定的に吸着させることは難しいことがある。したがって、光透過樹脂部５Ｂが透明樹脂よりなる場合に、本実施形態の構成は特に有用である。 In the present embodiment, the light transmitting resin portion 5 includes an upright surface (first upright surface 58A, etc.). The upright surface (first upright surface 58A, etc.) stands up from either the first outer surface 51 or the second outer surface 57 toward the other of the first outer surface 51 and the second outer surface 57. According to such a configuration, for example, when cutting (dicing) the light transmitting resin portion 5B by the blade 813 (see FIG. 14), the inner side surface of the recess 811 of the jig 81 is the upright surface (upright surface) of the light transmitting resin portion 5B. It can be brought into contact with the first upright surface 58A, etc.). As a result, it is possible to prevent the light transmitting resin portion 5B from moving or vibrating during dicing of the light transmitting resin portion 5B. As a result, deterioration of the quality of the cut surfaces (in the present embodiment, the first outer surface 53A, the second outer surface 53B, the third outer surface 53C, and the fourth outer surface 53D) can be prevented as much as possible. In particular, when the light transmitting resin portion 5B is made of a transparent resin, the light transmitting resin portion 5B may be significantly warped. It may be difficult to stably adsorb the greatly warped light transmitting resin portion 5B to the jig 81. Therefore, the configuration of this embodiment is particularly useful when the light transmitting resin portion 5B is made of a transparent resin.

＜第２実施形態の第１変形例＞
図１５は、第２実施形態の変形例の光学装置の平面図である。図１６は、図１５のＸＶＩ－ＸＶＩ線に沿う断面図である。 <First modification of the second embodiment>
FIG. 15 is a plan view of the optical device of the modified example of the second embodiment. FIG. 16 is a cross-sectional view taken along the line XVI-XVI of FIG.

同図に示す光学装置Ａ２１では、光透過樹脂部５に隆起部５９１が形成されておらず、凹部５９３が形成されている点において、光学装置Ａ２とは異なる。本変形例では、第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および、第４起立面５８Ｄは、第１外表面５１から第２外表面５７に向かって起立している。本変形例では、凹部５９３は、第１外表面５１、第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、および第４起立面５８Ｄから形成されている。このような構成によっても、光学装置Ａ２が享受できる利点を奏しうる。 The optical device A21 shown in the figure is different from the optical device A2 in that the raised portion 591 is not formed in the light transmitting resin portion 5 and the concave portion 593 is formed. In this modification, the first upright surface 58A, the second upright surface 58B, the third upright surface 58C, and the fourth upright surface 58D stand up from the first outer surface 51 toward the second outer surface 57. .. In this modification, the recess 593 is formed of a first outer surface 51, a first upright surface 58A, a second upright surface 58B, a third upright surface 58C, and a fourth upright surface 58D. Even with such a configuration, the advantages that the optical device A2 can enjoy can be obtained.

＜第３実施形態＞
図１７は、第３実施形態の光学装置の平面図である。図１８は、図１７のＸＶＩＩＩ－ＸＶＩＩＩ線に沿う断面図である。 <Third Embodiment>
FIG. 17 is a plan view of the optical device of the third embodiment. FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII of FIG.

同図に示す光学装置Ａ３は、第１外表面５２が、第１部位５２１および第２部位５２２を有する点において、第２実施形態の光学装置Ａ２と異なる。第１部位５２１は、平滑面であり、光学装置Ａ１における第１部位５１１の説明を適用できる。第２部位５２２は、粗面であり、光学装置Ａ１における第２部位５１２の説明を適用できる。本実施形態では、起立面（第１起立面５８Ａ、第２起立面５８Ｂ、第３起立面５８Ｃ、第４起立面５８Ｄ）および第２外側面５３Ｂも、粗面である。 The optical device A3 shown in the figure is different from the optical device A2 of the second embodiment in that the first outer surface 52 has the first part 521 and the second part 522. The first portion 521 is a smooth surface, and the description of the first portion 511 in the optical device A1 can be applied. The second portion 522 is a rough surface, and the description of the second portion 512 in the optical device A1 can be applied. In the present embodiment, the upright surface (first upright surface 58A, second upright surface 58B, third upright surface 58C, fourth upright surface 58D) and the second outer surface 53B are also rough surfaces.

本実施形態によると、光学装置Ａ１に関して述べた利点と、光学装置Ａ２に関して述べた利点のいずれの利点も享受できる。 According to the present embodiment, both the advantages described with respect to the optical device A1 and the advantages described with respect to the optical device A2 can be enjoyed.

なお、粗面および平滑面を有する光学装置Ａ１の構成を、第２実施形態の第１変形例にかかる光学装置Ａ２１の装置に適用してもよい。 The configuration of the optical device A1 having a rough surface and a smooth surface may be applied to the device of the optical device A21 according to the first modification of the second embodiment.

本開示は、上述した実施形態に限定されるものではない。本開示の各部の具体的な構成は、種々に設計変更自在である。 The present disclosure is not limited to the embodiments described above. The specific configuration of each part of the present disclosure can be freely redesigned.

上記実施形態および変形例の具体例を以下に付記する。
［付記１］
光学機能部位を含む光学素子と、
前記光学素子を封止する光透過樹脂部と、を備え、
前記光透過樹脂部は、前記光学機能部位とは反対側を向く第１外表面を含み、前記第１外表面は、互いに隣り合う第１部位および第２部位を含み、
前記第１部位は、前記外表面の向く方向である第１方向視において、前記光学機能部位に重なる平滑面であり、
前記第２部位は、粗面である、光学装置。
［付記２］
前記第２部位は、前記第１方向視において、前記第１部位を包囲する枠状であり、且つ、前記第１方向視において、前記外表面の端縁に至っている、付記１に記載の光学装置。
［付記３］
前記光学素子の全体は、前記第１方向視において、前記第１部位に重なっている、付記１または付記２に記載の光学装置。
［付記４］
前記第１部位の最大高低差は、前記第２部位の最大高低差よりも小さい、付記１ないし付記３のいずれかに記載の光学装置。
［付記５］
前記光透過樹脂部は、第１外側面と、第２外側面と、第３外側面と、第４外側面と、を含み、
前記第１外側面、前記第２外側面、前記第３外側面、および前記第４外側面は、前記第１方向とは異なる方向を向き、
前記第１外側面および前記第３外側面は、前記光透過樹脂部において互いに反対側に位置し、前記第２外側面および前記第４外側面は、前記光透過樹脂部において互いに反対側に位置し、
前記第１外側面および前記第２外側面は互いにつながり、前記第２外側面および前記第３外側面は互いにつながり、前記第４外側面および前記第１外側面は互いにつながり、
前記第２部位は、前記第１外側面と前記第１外表面との境界、前記第２外側面と前記第１外表面との境界、前記第３外側面と前記第１外表面との境界、および前記第４外側面と前記第１外表面との境界に至っている、付記１に記載の光学装置。
［付記６］
前記光学素子が配置された導電性の支持体を更に備え、
前記支持体は、前記光透過樹脂部に覆われている、付記１ないし付記５のいずれかに記載の光学装置。
［付記７］
前記支持体は、前記光学素子が配置されたダイボンディング部を含み、
前記ダイボンディング部は、前記光学素子が配置されたダイボンディング部表面と、前記ダイボンディング部表面とは反対側を向くダイボンディング部裏面と、を含み、
前記ダイボンディング部裏面は、前記光透過樹脂部から露出している、付記６に記載の光学装置。
［付記８］
前記光学素子にボンディングされた少なくとも１つのワイヤを更に備え、
前記支持体は、少なくとも１つのワイヤボンディング部を含み、
前記少なくとも１つのワイヤボンディング部の各々には、前記少なくとも１つのワイヤのいずれか１つがボンディングされており、
前記少なくとも１つのワイヤボンディング部のいずれか１つは、前記少なくとも１つのワイヤがボンディングされたワイヤボンディング部表面と、前記ワイヤボンディング部表面とは反対側を向くワイヤボンディング部裏面と、を含み、
前記ワイヤボンディング部裏面は、前記光透過樹脂部から露出している、付記６または付記７に記載の光学装置。
［付記９］
前記光学素子および前記支持体の間に介在する接合層を更に備える、付記６ないし付記８のいずれかに記載の光学装置。
［付記１０］
前記光透過樹脂部は、第２外表面と、起立面と、を含み、
前記第２外表面は、前記第１方向において前記第１外表面とは異なる位置に位置しており、
前記起立面は、前記第１外表面あるいは前記第２外表面のいずれか一方から、前記第１外表面および前記第２外表面の他方に向かって起立している、付記１に記載の光学装置。
［付記１１］
前記第２外表面は、前記第１方向視において、前記第１外表面を包囲する形状である、付記１０に記載の光学装置。
［付記１２］
前記光透過樹脂部は、前記第２外表面から隆起する隆起部を含み、
前記隆起部は、前記第１外表面および前記起立面から形成されている、付記１０または付記１１に記載の光学装置。
［付記１３］
前記光透過樹脂部には、前記第２外表面から凹む凹部が形成され、
前記凹部は、前記第１外表面および前記起立面から形成されている、付記１０または付記１１に記載の光学装置。
［付記１４］
前記起立面および前記第２外表面はいずれも粗面である、付記１０ないし付記１３のいずれかに記載の光学装置。
［付記１５］
光学機能部位を含む光学素子と、
前記光学素子を封止する光透過樹脂部と、を備え、
前記光透過樹脂部は、第１外表面と、第２外表面と、起立面と、を有し、
前記第１外表面は、前記第１外表面の向く方向である第１方向視において前記光学機能部位に重なり、
前記起立面は、前記第１外表面あるいは前記第２外表面のいずれか一方から、前記第１外表面および前記第２外表面の他方に向かって起立している、光学装置。
［付記１６］
前記第２外表面は、前記第１方向視において、前記第１外表面を包囲する形状である、付記１５に記載の光学装置。
［付記１７］
前記光透過樹脂部は、前記第２外表面から隆起する隆起部を含み、
前記隆起部は、前記第１外表面および前記起立面から形成されている、付記１５または付記１６に記載の光学装置。
［付記１８］
前記光透過樹脂部には、前記第２外表面から凹む凹部が形成され、
前記凹部は、前記第１外表面および前記起立面から形成されている、付記１５または付記１６に記載の光学装置。
［付記１９］
前記光透過樹脂部は、第１外側面と、第２外側面と、第３外側面と、第４外側面と、を含み、
前記第１外側面、前記第２外側面、前記第３外側面、および前記第４外側面は、前記第１方向とは異なる方向を向き、
前記第１外側面および前記第３外側面は互いに反対側を向き、前記第２外側面および前記第４外側面は互いに反対側を向き、
前記第１外側面および前記第２外側面は互いにつながり、前記第２外側面および前記第３外側面は互いにつながり、前記第４外側面および前記第１外側面は互いにつながっている、付記１５に記載の光学装置。
［付記２０］
前記光学素子が配置された導電性の支持体を更に備え、
前記支持体は、前記光透過樹脂部に覆われている、付記１５ないし付記１９のいずれかに記載の光学装置。
［付記２１］
前記支持体は、前記光学素子が配置されたダイボンディング部を含み、
前記ダイボンディング部は、前記光学素子が配置されたダイボンディング部表面と、前記ダイボンディング部表面とは反対側を向くダイボンディング部裏面と、を含み、
前記ダイボンディング部裏面は、前記光透過樹脂部から露出している、付記２０に記載の光学装置。
［付記２２］
前記光学素子にボンディングされた少なくとも１つのワイヤを更に備え、
前記支持体は、少なくとも１つのワイヤボンディング部を含み、
前記少なくとも１つのワイヤボンディング部の各々には、前記少なくとも１つのワイヤのいずれか１つがボンディングされており、
前記少なくとも１つのワイヤボンディング部のいずれか１つは、前記少なくとも１つのワイヤがボンディングされたワイヤボンディング部表面と、前記ワイヤボンディング部表面とは反対側を向くワイヤボンディング部裏面と、を含み、
前記ワイヤボンディング部裏面は、前記光透過樹脂部から露出している、付記２０または付記２１に記載の光学装置。
［付記２３］
前記光学素子および前記支持体の間に介在する接合層を更に備える、付記１５ないし付記２２のいずれかに記載の光学装置。 Specific examples of the above-described embodiment and modified examples will be added below.
[Appendix 1]
Optical elements including optical functional parts and
A light transmitting resin portion for sealing the optical element is provided.
The light transmitting resin portion includes a first outer surface facing the side opposite to the optical functional portion, and the first outer surface includes a first portion and a second portion adjacent to each other.
The first portion is a smooth surface that overlaps the optical functional portion in the first directional view, which is the direction in which the outer surface faces.
The second portion is an optical device having a rough surface.
[Appendix 2]
The optics according to Appendix 1, wherein the second portion has a frame shape surrounding the first portion in the first directional view and reaches the edge of the outer surface in the first directional view. Device.
[Appendix 3]
The optical device according to Appendix 1 or Appendix 2, wherein the entire optical element overlaps the first portion in the first directional view.
[Appendix 4]
The optical device according to any one of Supplementary note 1 to Supplementary note 3, wherein the maximum height difference of the first portion is smaller than the maximum height difference of the second portion.
[Appendix 5]
The light transmitting resin portion includes a first outer surface, a second outer surface, a third outer surface, and a fourth outer surface.
The first outer surface, the second outer surface, the third outer surface, and the fourth outer surface face in a direction different from the first direction.
The first outer surface and the third outer surface are located on opposite sides of each other in the light transmitting resin portion, and the second outer surface and the fourth outer surface are located on opposite sides of each other in the light transmitting resin portion. death,
The first outer surface and the second outer surface are connected to each other, the second outer surface and the third outer surface are connected to each other, and the fourth outer surface and the first outer surface are connected to each other.
The second portion includes a boundary between the first outer surface and the first outer surface, a boundary between the second outer surface and the first outer surface, and a boundary between the third outer surface and the first outer surface. , And the optical device according to Appendix 1, which reaches the boundary between the fourth outer surface and the first outer surface.
[Appendix 6]
Further provided with a conductive support on which the optical element is arranged,
The optical device according to any one of Supplementary note 1 to Supplementary note 5, wherein the support is covered with the light transmitting resin portion.
[Appendix 7]
The support includes a die bonding portion in which the optical element is arranged.
The die bonding portion includes a surface of the die bonding portion on which the optical element is arranged and a back surface of the die bonding portion facing the side opposite to the surface of the die bonding portion.
The optical device according to Appendix 6, wherein the back surface of the die bonding portion is exposed from the light transmitting resin portion.
[Appendix 8]
Further comprising at least one wire bonded to the optical element.
The support includes at least one wire bonding portion.
Any one of the at least one wire is bonded to each of the at least one wire bonding portions.
Any one of the at least one wire bonding portion includes a surface of the wire bonding portion to which the at least one wire is bonded and a back surface of the wire bonding portion facing the side opposite to the surface of the wire bonding portion.
The optical device according to Appendix 6 or Appendix 7, wherein the back surface of the wire bonding portion is exposed from the light transmitting resin portion.
[Appendix 9]
The optical device according to any one of Supplementary note 6 to Supplementary note 8, further comprising a bonding layer interposed between the optical element and the support.
[Appendix 10]
The light transmitting resin portion includes a second outer surface and an upright surface.
The second outer surface is located at a position different from that of the first outer surface in the first direction.
The optical device according to Appendix 1, wherein the upright surface is erect from either the first outer surface or the second outer surface toward the other of the first outer surface and the second outer surface. ..
[Appendix 11]
The optical device according to Appendix 10, wherein the second outer surface has a shape surrounding the first outer surface in the first directional view.
[Appendix 12]
The light transmitting resin portion includes a raised portion that rises from the second outer surface, and includes a raised portion.
The optical device according to Appendix 10 or Appendix 11, wherein the raised portion is formed from the first outer surface and the upright surface.
[Appendix 13]
The light transmitting resin portion is formed with a recess recessed from the second outer surface.
The optical device according to Appendix 10 or Appendix 11, wherein the recess is formed from the first outer surface and the upright surface.
[Appendix 14]
The optical device according to any one of Supplementary note 10 to Supplementary note 13, wherein both the upright surface and the second outer surface are rough surfaces.
[Appendix 15]
Optical elements including optical functional parts and
A light transmitting resin portion for sealing the optical element is provided.
The light transmitting resin portion has a first outer surface, a second outer surface, and an upright surface.
The first outer surface overlaps the optical functional portion in the first directional view, which is the direction in which the first outer surface faces.
An optical device in which the upright surface is erect from either the first outer surface or the second outer surface toward the other of the first outer surface and the second outer surface.
[Appendix 16]
The optical device according to Appendix 15, wherein the second outer surface has a shape surrounding the first outer surface in the first directional view.
[Appendix 17]
The light transmitting resin portion includes a raised portion that rises from the second outer surface, and includes a raised portion.
The optical device according to Appendix 15 or Appendix 16, wherein the raised portion is formed from the first outer surface and the upright surface.
[Appendix 18]
The light transmitting resin portion is formed with a recess recessed from the second outer surface.
The optical device according to Appendix 15 or Appendix 16, wherein the recess is formed from the first outer surface and the upright surface.
[Appendix 19]
The light transmitting resin portion includes a first outer surface, a second outer surface, a third outer surface, and a fourth outer surface.
The first outer surface, the second outer surface, the third outer surface, and the fourth outer surface face in a direction different from the first direction.
The first outer surface and the third outer surface face opposite to each other, and the second outer surface and the fourth outer surface face opposite to each other.
The first outer surface and the second outer surface are connected to each other, the second outer surface and the third outer surface are connected to each other, and the fourth outer surface and the first outer surface are connected to each other. The optical device described.
[Appendix 20]
Further provided with a conductive support on which the optical element is arranged,
The optical device according to any one of Supplementary note 15 to Supplementary note 19, wherein the support is covered with the light transmitting resin portion.
[Appendix 21]
The support includes a die bonding portion in which the optical element is arranged.
The die bonding portion includes a surface of the die bonding portion on which the optical element is arranged and a back surface of the die bonding portion facing the side opposite to the surface of the die bonding portion.
The optical device according to Appendix 20, wherein the back surface of the die bonding portion is exposed from the light transmitting resin portion.
[Appendix 22]
Further comprising at least one wire bonded to the optical element.
The support includes at least one wire bonding portion.
Any one of the at least one wire is bonded to each of the at least one wire bonding portions.
Any one of the at least one wire bonding portion includes a surface of the wire bonding portion to which the at least one wire is bonded and a back surface of the wire bonding portion facing the side opposite to the surface of the wire bonding portion.
The optical device according to Appendix 20 or Appendix 21, wherein the back surface of the wire bonding portion is exposed from the light transmitting resin portion.
[Appendix 23]
The optical device according to any one of Supplementary note 15 to Supplementary note 22, further comprising a bonding layer interposed between the optical element and the support.

１ 支持体
１１ ダイボンディング部
１１１ ダイボンディング部表面
１１２ ダイボンディング部裏面
１１４ 凹み
１２ ワイヤボンディング部
１２１ ワイヤボンディング部表面
１２２ ワイヤボンディング部裏面
１２３ ワイヤボンディング部側面
１２４ 凹み
１５ 延出部
１５１ 側面
２ 光学素子
２１ 光学機能部位
３ 接合層
４ ワイヤ
５ 光透過樹脂部
５１ 第１外表面
５１１ 第１部位
５１２ 第２部位
５２ 第１外表面
５２１ 第１部位
５２２ 第２部位
５３１Ａ～５３１Ｄ 境界
５３Ａ 第１外側面
５３Ｂ 第２外側面
５３Ｃ 第３外側面
５３Ｄ 第４外側面
５５ 裏面
５７ 第２外表面
５８Ａ 第１起立面
５８Ｂ 第２起立面
５８Ｃ 第３起立面
５８Ｄ 第４起立面
５９１ 隆起部
５９３ 凹部
５Ａ 光透過樹脂部
５Ｂ 光透過樹脂部
８１ 治具
８１１ 凹部
８１３ ブレード
Ａ１，Ａ２，Ａ２１，Ａ３ 光学装置
Ｘ１ 第１方向
Ｘ２ 第２方向
Ｘ３ 第３方向 1 Support 11 Die bonding part 111 Die bonding part front surface 112 Die bonding part back surface 114 Recess 12 Wire bonding part 121 Wire bonding part front surface 122 Wire bonding part back surface 123 Wire bonding part side surface 124 Recess 15 Extension portion 151 Side surface 2 Optical element 21 Optical functional part 3 Bonding layer 4 Wire 5 Light transmitting resin part 51 1st outer surface 511 1st part 512 2nd part 52 1st outer surface 521 1st part 522 2nd part 531A-531D Boundary 53A 1st outer surface 53B 2 Outer surface 53C Third outer surface 53D Fourth outer surface 55 Back surface 57 Second outer surface 58A First upright surface 58B Second upright surface 58C Third upright surface 58D Fourth upright surface 591 Raised part 593 Recessed part 5A Light transmitting resin part 5B Light transmitting resin part 81 Jig 811 Recess 813 Blades A1, A2, A21, A3 Optical device X1 First direction X2 Second direction X3 Third direction

Claims (8)

光学機能部位を含む受光素子または発光素子である光学素子と、
前記光学素子を封止する光透過樹脂部と、を備え、
前記光学素子が受光素子である場合、前記光学機能部位は受光面であり、
前記光学素子が発光素子である場合、前記光学機能部位は発光面であり、
前記光透過樹脂部は、前記光学機能部位としての前記受光面または前記発光面が向く方向である第１方向を向く第１外表面を含み、前記第１外表面は、互いに隣り合う第１部位および第２部位を含み、
前記第１部位は、前記第１方向視において、前記光学機能部位に重なる平滑面であり、
前記第２部位は、粗面であり、
前記光学素子が配置された導電性の支持体を更に備え、
前記支持体は、前記光透過樹脂部に覆われており、
前記支持体は、前記光学素子が配置されたダイボンディング部を含み、
前記ダイボンディング部は、前記光学素子が配置されたダイボンディング部表面と、前記ダイボンディング部表面とは反対側を向くダイボンディング部裏面と、を含み、
前記ダイボンディング部裏面は、前記光透過樹脂部から露出しており、
前記第２部位は、前記第１方向視において、前記第１部位を包囲する枠状であり、且つ、前記第１方向視において、前記第１外表面の端縁に至っており、
前記光学素子の全体は、前記第１方向視において、前記第１部位に重なっており、
前記第１部位は、平坦であり且つ前記第１方向視において矩形状であり、
前記光透過樹脂部は、第２外表面と、起立面と、を含み、
前記第２外表面は、前記第１方向において前記第１外表面とは異なる位置に位置しており、
前記起立面は、前記第１外表面あるいは前記第２外表面のいずれか一方から、前記第１外表面および前記第２外表面の他方に向かって起立しており、
前記第２外表面は、前記第１方向視において、前記第１外表面を包囲する形状であり、
前記起立面は、前記第１外表面の外端縁と前記第２外表面の内端縁とに繋がり、
前記光透過樹脂部は、前記第２外表面から隆起する隆起部を含み、
前記隆起部は、前記第１外表面および前記起立面から形成されている、光学装置。 An optical element that is a light receiving element or a light emitting element that includes an optical functional part,
A light transmitting resin portion for sealing the optical element is provided.
When the optical element is a light receiving element, the optical functional portion is a light receiving surface.
When the optical element is a light emitting element, the optical functional portion is a light emitting surface.
The light transmitting resin portion includes a first outer surface facing the first direction in which the light receiving surface or the light emitting surface faces as the optical functional portion, and the first outer surface is a first portion adjacent to each other. And the second part, including
The first portion is a smooth surface that overlaps the optical functional portion in the first directional view.
The second part is a rough surface.
Further provided with a conductive support on which the optical element is arranged,
The support is covered with the light transmitting resin portion, and the support is covered with the light transmitting resin portion.
The support includes a die bonding portion in which the optical element is arranged.
The die bonding portion includes a surface of the die bonding portion on which the optical element is arranged and a back surface of the die bonding portion facing the side opposite to the surface of the die bonding portion.
The back surface of the die bonding portion is exposed from the light transmitting resin portion.
The second portion has a frame shape surrounding the first portion in the first directional view, and reaches the edge of the first outer surface in the first directional view.
The entire optical element overlaps the first portion in the first directional view.
The first portion is flat and rectangular in the first direction .
The light transmitting resin portion includes a second outer surface and an upright surface.
The second outer surface is located at a position different from that of the first outer surface in the first direction.
The upright surface stands up from either the first outer surface or the second outer surface toward the other of the first outer surface and the second outer surface.
The second outer surface has a shape surrounding the first outer surface in the first directional view.
The upright surface is connected to the outer edge of the first outer surface and the inner edge of the second outer surface.
The light transmitting resin portion includes a raised portion that rises from the second outer surface, and includes a raised portion.
An optical device in which the raised portion is formed from the first outer surface and the upright surface . 光学機能部位を含む受光素子または発光素子である光学素子と、
前記光学素子を封止する光透過樹脂部と、を備え、
前記発光素子が受光素子である場合、前記光学機能部位は受光面であり、
前記発光素子が発光素子である場合、前記光学機能部位は発光面であり、
前記光透過樹脂部は、前記光学機能部位としての前記受光面または前記発光面が向く方向である第１方向を向く第１外表面を含み、前記第１外表面は、互いに隣り合う第１部位および第２部位を含み、
前記第１部位は、前記第１方向視において、前記光学機能部位に重なる平滑面であり、
前記第２部位は、粗面であり、
前記光学素子が配置された導電性の支持体を更に備え、
前記支持体は、前記光透過樹脂部に覆われており、
前記支持体は、前記光学素子が配置されたダイボンディング部を含み、
前記ダイボンディング部は、前記光学素子が配置されたダイボンディング部表面と、前記ダイボンディング部表面とは反対側を向くダイボンディング部裏面と、を含み、
前記ダイボンディング部裏面は、前記光透過樹脂部から露出しており、
前記第２部位は、前記第１方向視において、前記第１部位を包囲する枠状であり、且つ、前記第１方向視において、前記第１外表面の端縁に至っており、
前記光学素子の全体は、前記第１方向視において、前記第１部位に重なっており、
前記第１部位は、平坦であり且つ前記第１方向視において矩形状であり、
前記光透過樹脂部は、第２外表面と、起立面と、を含み、
前記第２外表面は、前記第１方向において前記第１外表面とは異なる位置に位置しており、
前記起立面は、前記第１外表面あるいは前記第２外表面のいずれか一方から、前記第１外表面および前記第２外表面の他方に向かって起立しており、
前記第２外表面は、前記第１方向視において、前記第１外表面を包囲する形状であり、
前記起立面は、前記第１外表面の外端縁と前記第２外表面の内端縁とに繋がり、
前記光透過樹脂部には、前記第２外表面から凹む凹部が形成され、
前記凹部は、前記第１外表面および前記起立面から形成されている、光学装置。 An optical element that is a light receiving element or a light emitting element that includes an optical functional part,
A light transmitting resin portion for sealing the optical element is provided.
When the light emitting element is a light receiving element, the optical functional portion is a light receiving surface.
When the light emitting element is a light emitting element, the optical functional portion is a light emitting surface.
The light transmitting resin portion includes a first outer surface facing the first direction in which the light receiving surface or the light emitting surface faces as the optical functional portion, and the first outer surface is a first portion adjacent to each other. And the second part, including
The first portion is a smooth surface that overlaps the optical functional portion in the first directional view.
The second part is a rough surface.
Further provided with a conductive support on which the optical element is arranged,
The support is covered with the light transmitting resin portion, and the support is covered with the light transmitting resin portion.
The support includes a die bonding portion in which the optical element is arranged.
The die bonding portion includes a surface of the die bonding portion on which the optical element is arranged and a back surface of the die bonding portion facing the side opposite to the surface of the die bonding portion.
The back surface of the die bonding portion is exposed from the light transmitting resin portion.
The second portion has a frame shape surrounding the first portion in the first directional view, and reaches the edge of the first outer surface in the first directional view.
The entire optical element overlaps the first portion in the first directional view.
The first portion is flat and rectangular in the first direction.
The light transmitting resin portion includes a second outer surface and an upright surface.
The second outer surface is located at a position different from that of the first outer surface in the first direction.
The upright surface stands up from either the first outer surface or the second outer surface toward the other of the first outer surface and the second outer surface.
The second outer surface has a shape surrounding the first outer surface in the first directional view.
The upright surface is connected to the outer edge of the first outer surface and the inner edge of the second outer surface.
The light transmitting resin portion is formed with a recess recessed from the second outer surface.
An optical device in which the recess is formed from the first outer surface and the upright surface . 前記ダイボンディング部の全体は、前記第１方向視において、前記第１部位に重なっている、請求項１または２に記載の光学装置。 The optical device according to claim 1 or 2 , wherein the entire die bonding portion overlaps the first portion in the first directional view. 前記第１部位の最大高低差は、前記第２部位の最大高低差よりも小さい、請求項１ないし請求項３のいずれかに記載の光学装置。 The optical device according to any one of claims 1 to 3 , wherein the maximum height difference of the first portion is smaller than the maximum height difference of the second portion. 前記光透過樹脂部は、第１外側面と、第２外側面と、第３外側面と、第４外側面と、を含み、
前記第１外側面、前記第２外側面、前記第３外側面、および前記第４外側面は、前記第１方向とは異なる方向を向き、
前記第１外側面、前記第２外側面、前記第３外側面、および前記第４外側面は、前記第２外表面の外端縁に繋がっており、
前記第１外側面および前記第３外側面は、前記光透過樹脂部において互いに反対側に位置し、前記第２外側面および前記第４外側面は、前記光透過樹脂部において互いに反対側に位置し、
前記第１外側面および前記第２外側面は互いにつながり、前記第２外側面および前記第３外側面は互いにつながり、前記第４外側面および前記第１外側面は互いにつながり、
前記第２部位は、前記第１外側面と前記第１外表面との境界、前記第２外側面と前記第１外表面との境界、前記第３外側面と前記第１外表面との境界、および前記第４外側面と前記第１外表面との境界に至っている、請求項１または２に記載の光学装置。 The light transmitting resin portion includes a first outer surface, a second outer surface, a third outer surface, and a fourth outer surface.
The first outer surface, the second outer surface, the third outer surface, and the fourth outer surface face in a direction different from the first direction.
The first outer surface, the second outer surface, the third outer surface, and the fourth outer surface are connected to the outer edge of the second outer surface.
The first outer surface and the third outer surface are located on opposite sides of each other in the light transmitting resin portion, and the second outer surface and the fourth outer surface are located on opposite sides of each other in the light transmitting resin portion. death,
The first outer surface and the second outer surface are connected to each other, the second outer surface and the third outer surface are connected to each other, and the fourth outer surface and the first outer surface are connected to each other.
The second portion includes a boundary between the first outer surface and the first outer surface, a boundary between the second outer surface and the first outer surface, and a boundary between the third outer surface and the first outer surface. , And the optical device according to claim 1 or 2 , which reaches the boundary between the fourth outer surface and the first outer surface. 前記起立面および前記第２外表面はいずれも粗面である、請求項１または請求項２に記載の光学装置。 The optical device according to claim 1 or 2 , wherein both the upright surface and the second outer surface are rough surfaces. 前記光学素子にボンディングされた少なくとも１つのワイヤを更に備え、
前記支持体は、少なくとも１つのワイヤボンディング部を含み、
前記少なくとも１つのワイヤボンディング部の各々には、前記少なくとも１つのワイヤのいずれか１つがボンディングされており、
前記少なくとも１つのワイヤボンディング部のいずれか１つは、前記少なくとも１つのワイヤがボンディングされたワイヤボンディング部表面と、前記ワイヤボンディング部表面とは反対側を向くワイヤボンディング部裏面と、を含み、
前記ワイヤボンディング部裏面は、前記光透過樹脂部から露出している、請求項１ないし請求項６のいずれかに記載の光学装置。 Further comprising at least one wire bonded to the optical element.
The support includes at least one wire bonding portion.
Any one of the at least one wire is bonded to each of the at least one wire bonding portions.
Any one of the at least one wire bonding portion includes a surface of the wire bonding portion to which the at least one wire is bonded and a back surface of the wire bonding portion facing the side opposite to the surface of the wire bonding portion.
The optical device according to any one of claims 1 to 6 , wherein the back surface of the wire bonding portion is exposed from the light transmitting resin portion. 前記光学素子および前記支持体の間に介在する接合層を更に備える、請求項１ないし請求項７のいずれかに記載の光学装置。 The optical device according to any one of claims 1 to 7 , further comprising a bonding layer interposed between the optical element and the support.
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