JP7101455B2 - Ledパッケージ - Google Patents
Ledパッケージ Download PDFInfo
- Publication number
- JP7101455B2 JP7101455B2 JP2016257016A JP2016257016A JP7101455B2 JP 7101455 B2 JP7101455 B2 JP 7101455B2 JP 2016257016 A JP2016257016 A JP 2016257016A JP 2016257016 A JP2016257016 A JP 2016257016A JP 7101455 B2 JP7101455 B2 JP 7101455B2
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- JP
- Japan
- Prior art keywords
- light
- phosphor
- coating layer
- bonding wire
- led element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
10,20 基板
11,12,21,22 接続電極
23 基板被覆層
30 LED素子
31 ワイヤ
31A,31B,31C 防食ワイヤ
32 被覆層
35A,35B,35C 保護層
40 封止樹脂
Claims (6)
- 1組の接続電極が形成された基板と、
前記基板上に実装されたLED素子と、
前記LED素子を前記1組の接続電極に電気的に接続するボンディングワイヤと、
前記ボンディングワイヤの延伸方向に沿って配置され、前記ボンディングワイヤの表面を被覆し前記ボンディングワイヤの腐食を防止する保護層と、
蛍光体を含有し前記ボンディングワイヤ及び前記保護層の表面を被覆する被覆層と、
前記LED素子、前記ボンディングワイヤおよび前記被覆層の周囲を囲むように配置され、前記LED素子からの出射光により励起されて第2の光を発する第2の蛍光体を含有し、前記LED素子、前記ボンディングワイヤ、前記保護層および前記被覆層を一体的に封止する封止樹脂と、を有し、
前記被覆層の蛍光体は、前記出射光により励起されて、前記ボンディングワイヤでの吸収率が前記出射光よりも低くかつ前記出射光よりも長い波長の光を発し、
前記被覆層の蛍光体は、前記第2の光よりも長い波長の光を発する、ことを特徴とするLEDパッケージ。 - 第3の蛍光体を含有し前記基板上の配線パターンを被覆する基板被覆層をさらに有し、
前記第3の蛍光体は、前記出射光により励起されて、前記配線パターンでの吸収率が前記出射光よりも低くかつ前記出射光および前記第2の光よりも長い波長の光を発する、請求項1に記載のLEDパッケージ。 - 前記LED素子は、前記出射光として青色光を発する素子であり、
前記被覆層の蛍光体は赤色光を発する蛍光体である、請求項1または2に記載のLEDパッケージ。 - 1組の接続電極が形成された基板と、
前記基板上に実装されたLED素子と、
前記LED素子を前記1組の接続電極に電気的に接続するボンディングワイヤと、
蛍光体を含有し前記ボンディングワイヤを被覆する被覆層と、
前記ボンディングワイヤの周囲に設けられ、前記被覆層の表面を被覆し前記ボンディングワイヤの腐食を防止する保護層と、を有し、
前記蛍光体は、前記LED素子からの出射光により励起されて、前記ボンディングワイヤでの吸収率が前記出射光よりも低くかつ前記出射光よりも長い波長の光を発する、
ことを特徴とするLEDパッケージ。 - 1組の接続電極が形成された基板と、
前記基板上に実装されたLED素子と、
前記LED素子を前記1組の接続電極に電気的に接続するボンディングワイヤと、
前記LED素子からの出射光により励起されて、前記ボンディングワイヤでの吸収率が前記出射光よりも低くかつ前記出射光よりも長い波長の光を発する第1の蛍光体を含有し、前記ボンディングワイヤを被覆する被覆層と、
前記ボンディングワイヤの周囲に設けられ、前記被覆層の表面を被覆し前記ボンディングワイヤの腐食を防止する保護層と、
前記出射光により励起されて第2の光を発する第2の蛍光体を含有し、前記LED素子、前記ボンディングワイヤ、前記被覆層及び前記保護層を一体的に封止する封止樹脂と、を有し、
前記第1の蛍光体は、前記第2の光よりも長い波長の光を発し、
前記保護層のうち前記基板および前記LED素子に近い下側部分は、前記封止樹脂よりも屈折率が低い材料で構成されている、
ことを特徴とするLEDパッケージ。 - 前記保護層は二酸化ケイ素で構成され、
前記ボンディングワイヤは銀で構成されている、請求項1~5のいずれか一項に記載のLEDパッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/404,630 US9882107B2 (en) | 2016-01-12 | 2017-01-12 | LED package with covered bonding wire |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2016003663 | 2016-01-12 | ||
JP2016003663 | 2016-01-12 |
Publications (2)
Publication Number | Publication Date |
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JP2017126743A JP2017126743A (ja) | 2017-07-20 |
JP7101455B2 true JP7101455B2 (ja) | 2022-07-15 |
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JP2016257016A Active JP7101455B2 (ja) | 2016-01-12 | 2016-12-28 | Ledパッケージ |
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JP (1) | JP7101455B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7296201B2 (ja) * | 2017-12-18 | 2023-06-22 | ローム株式会社 | 半導体発光装置 |
US10763414B2 (en) | 2017-12-18 | 2020-09-01 | Rohm Co., Ltd. | Semiconductor light-emitting device |
JP7174218B2 (ja) * | 2017-12-27 | 2022-11-17 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
DE102018111610A1 (de) * | 2018-05-15 | 2019-11-21 | Osram Opto Semiconductors Gmbh | Optoelektronische Leuchtvorrichtung, Bonddraht und Verfahren zur Herstellung einer optoelektronischen Leuchtvorrichtung |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001148512A (ja) | 1999-11-18 | 2001-05-29 | Matsushita Electric Works Ltd | 照明光源 |
JP2006295132A (ja) | 2005-03-14 | 2006-10-26 | Toshiba Corp | 発光装置 |
JP2007067183A (ja) | 2005-08-31 | 2007-03-15 | Showa Denko Kk | 化合物半導体発光素子を有するledパッケージ |
JP2009055006A (ja) | 2007-07-27 | 2009-03-12 | Nichia Corp | 発光装置及びその製造方法 |
JP2009135306A (ja) | 2007-11-30 | 2009-06-18 | Panasonic Electric Works Co Ltd | 発光装置 |
JP2010157608A (ja) | 2008-12-26 | 2010-07-15 | Mitsubishi Chemicals Corp | 半導体発光装置 |
JP2010199547A (ja) | 2009-01-30 | 2010-09-09 | Nichia Corp | 発光装置及びその製造方法 |
JP2011146480A (ja) | 2010-01-13 | 2011-07-28 | Nichia Corp | 発光装置および発光装置の製造方法 |
US20130194794A1 (en) | 2012-02-01 | 2013-08-01 | Samsung Electronics Co., Ltd. | Light emitting device |
JP2013172041A (ja) | 2012-02-22 | 2013-09-02 | Sharp Corp | 発光装置 |
JP2015015418A (ja) | 2013-07-08 | 2015-01-22 | シャープ株式会社 | 半導体発光装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6285481A (ja) * | 1985-10-09 | 1987-04-18 | Nippon Telegr & Teleph Corp <Ntt> | 樹脂封止発光ダイオ−ド装置及びその製造方法 |
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- 2016-12-28 JP JP2016257016A patent/JP7101455B2/ja active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001148512A (ja) | 1999-11-18 | 2001-05-29 | Matsushita Electric Works Ltd | 照明光源 |
JP2006295132A (ja) | 2005-03-14 | 2006-10-26 | Toshiba Corp | 発光装置 |
JP2007067183A (ja) | 2005-08-31 | 2007-03-15 | Showa Denko Kk | 化合物半導体発光素子を有するledパッケージ |
JP2009055006A (ja) | 2007-07-27 | 2009-03-12 | Nichia Corp | 発光装置及びその製造方法 |
JP2009135306A (ja) | 2007-11-30 | 2009-06-18 | Panasonic Electric Works Co Ltd | 発光装置 |
JP2010157608A (ja) | 2008-12-26 | 2010-07-15 | Mitsubishi Chemicals Corp | 半導体発光装置 |
JP2010199547A (ja) | 2009-01-30 | 2010-09-09 | Nichia Corp | 発光装置及びその製造方法 |
JP2011146480A (ja) | 2010-01-13 | 2011-07-28 | Nichia Corp | 発光装置および発光装置の製造方法 |
US20130194794A1 (en) | 2012-02-01 | 2013-08-01 | Samsung Electronics Co., Ltd. | Light emitting device |
JP2013172041A (ja) | 2012-02-22 | 2013-09-02 | Sharp Corp | 発光装置 |
JP2015015418A (ja) | 2013-07-08 | 2015-01-22 | シャープ株式会社 | 半導体発光装置 |
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