JP7098425B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP7098425B2 JP7098425B2 JP2018108798A JP2018108798A JP7098425B2 JP 7098425 B2 JP7098425 B2 JP 7098425B2 JP 2018108798 A JP2018108798 A JP 2018108798A JP 2018108798 A JP2018108798 A JP 2018108798A JP 7098425 B2 JP7098425 B2 JP 7098425B2
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- 239000010410 layer Substances 0.000 description 228
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- 238000005401 electroluminescence Methods 0.000 description 32
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- 238000007789 sealing Methods 0.000 description 14
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- 239000004642 Polyimide Substances 0.000 description 5
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- 238000000034 method Methods 0.000 description 5
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- 230000008569 process Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 229910052804 chromium Inorganic materials 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
表示領域を有する第1領域と、実装領域を有する第2領域と、前記第1領域と前記第2領域との間に位置する第3領域と、を有する基板と、前記第1領域及び前記第2領域において前記基板の上に設けられた第1無機絶縁層と、前記第1無機絶縁層の上に形成され、前記第1領域、前記第2領域、及び前記第3領域に亘って延出した配線と、前記配線の上に設けられた第2無機絶縁層と、を備え、前記第2無機絶縁層は、少なくとも前記第1無機絶縁層と重畳する領域に延在している、表示装置が提供される。
Claims (6)
- 支持基板と、
前記支持基板上に設けられ、表示領域を有する第1領域と、実装領域を有する第2領域と、前記第1領域と前記第2領域との間に位置する折り曲げ可能な第3領域と、を有する基板と、
前記第1領域及び前記第2領域において前記基板の上に設けられた第1無機絶縁層と、
前記第1無機絶縁層の上に形成され、前記第1領域、前記第2領域、及び前記第3領域に亘って延出した配線と、
前記配線の上に設けられた第2無機絶縁層と、
を備え、
前記支持基板は、前記第1領域と前記第2領域に対応する位置に設けられており、
前記第2無機絶縁層は、少なくとも前記第1無機絶縁層と重畳する領域に延在し、
前記第1無機絶縁層は、前記第2領域側の第1端部を有し、
前記第2無機絶縁層は、前記第2領域側の第2端部を有し、
前記第1領域に設けられた前記支持基板は、前記第2領域側の第3端部を有し、
前記第2端部の位置は、前記第1端部の位置より前記第2領域に近接し、前記第3端部の位置と揃っている、表示装置。 - 前記第2無機絶縁層の上に位置する第3無機絶縁層をさらに備え、
前記第2無機絶縁層は、前記第3無機絶縁層よりも前記第2領域側に延出している、請求項1に記載の表示装置。 - 前記第3無機絶縁層は、前記第1無機絶縁層よりも前記第2領域側に延出している、請求項2に記載の表示装置。
- 前記第1無機絶縁層と前記配線との間に位置する第4無機絶縁層をさらに備え、
前記第1無機絶縁層は、前記第4無機絶縁層より前記第2領域側に延出している、請求項1乃至3のいずれか1項に記載の表示装置。 - 前記基板と前記配線との間に設けられた第1有機絶縁層と、
前記配線と前記第2無機絶縁層との間に設けられた第2有機絶縁層と、
前記第2有機絶縁層と前記第2無機絶縁層との間に設けられた第3有機絶縁層と、
をさらに備える、請求項1乃至4のいずれか1項に記載の表示装置。 - 前記表示領域に設けられた偏光板をさらに備え、
前記第1無機絶縁層及び前記第2無機絶縁層は、前記偏光板よりも前記第2領域側に延出している、請求項1乃至5のいずれか1項に記載の表示装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108798A JP7098425B2 (ja) | 2018-06-06 | 2018-06-06 | 表示装置 |
PCT/JP2019/019405 WO2019235154A1 (ja) | 2018-06-06 | 2019-05-15 | 表示装置 |
US16/953,628 US11849609B2 (en) | 2018-06-06 | 2020-11-20 | Display device |
US18/503,242 US20240074264A1 (en) | 2018-06-06 | 2023-11-07 | Display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108798A JP7098425B2 (ja) | 2018-06-06 | 2018-06-06 | 表示装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019211676A JP2019211676A (ja) | 2019-12-12 |
JP2019211676A5 JP2019211676A5 (ja) | 2021-07-26 |
JP7098425B2 true JP7098425B2 (ja) | 2022-07-11 |
Family
ID=68770127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018108798A Active JP7098425B2 (ja) | 2018-06-06 | 2018-06-06 | 表示装置 |
Country Status (3)
Country | Link |
---|---|
US (2) | US11849609B2 (ja) |
JP (1) | JP7098425B2 (ja) |
WO (1) | WO2019235154A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7098425B2 (ja) * | 2018-06-06 | 2022-07-11 | 株式会社ジャパンディスプレイ | 表示装置 |
CN110634402A (zh) * | 2019-08-28 | 2019-12-31 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其折弯方法及显示装置 |
WO2022018799A1 (ja) * | 2020-07-20 | 2022-01-27 | シャープ株式会社 | 表示装置 |
CN115275045B (zh) * | 2022-07-19 | 2023-07-04 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示终端 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160174304A1 (en) | 2014-12-10 | 2016-06-16 | Lg Display Co., Ltd. | Flexible display device with multiple types of micro-coating layers |
JP2017111435A (ja) | 2015-12-15 | 2017-06-22 | エルジー ディスプレイ カンパニー リミテッド | フレキシブル表示装置 |
US20170237025A1 (en) | 2016-02-12 | 2017-08-17 | Samsung Display Co., Ltd. | Display device |
US20170262109A1 (en) | 2016-03-11 | 2017-09-14 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
US20180083072A1 (en) | 2016-09-19 | 2018-03-22 | Samsung Display Co., Ltd. | Display device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3000659A1 (en) | 2014-09-26 | 2016-03-30 | Manucher Azmudeh | Interior rear view mirror assembly |
JP6396879B2 (ja) | 2015-11-20 | 2018-09-26 | 株式会社ジャパンディスプレイ | 表示装置 |
JP7098425B2 (ja) * | 2018-06-06 | 2022-07-11 | 株式会社ジャパンディスプレイ | 表示装置 |
-
2018
- 2018-06-06 JP JP2018108798A patent/JP7098425B2/ja active Active
-
2019
- 2019-05-15 WO PCT/JP2019/019405 patent/WO2019235154A1/ja active Application Filing
-
2020
- 2020-11-20 US US16/953,628 patent/US11849609B2/en active Active
-
2023
- 2023-11-07 US US18/503,242 patent/US20240074264A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160174304A1 (en) | 2014-12-10 | 2016-06-16 | Lg Display Co., Ltd. | Flexible display device with multiple types of micro-coating layers |
JP2017111435A (ja) | 2015-12-15 | 2017-06-22 | エルジー ディスプレイ カンパニー リミテッド | フレキシブル表示装置 |
US20170237025A1 (en) | 2016-02-12 | 2017-08-17 | Samsung Display Co., Ltd. | Display device |
US20170262109A1 (en) | 2016-03-11 | 2017-09-14 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
US20180083072A1 (en) | 2016-09-19 | 2018-03-22 | Samsung Display Co., Ltd. | Display device |
Also Published As
Publication number | Publication date |
---|---|
WO2019235154A1 (ja) | 2019-12-12 |
US11849609B2 (en) | 2023-12-19 |
JP2019211676A (ja) | 2019-12-12 |
US20240074264A1 (en) | 2024-02-29 |
US20210074795A1 (en) | 2021-03-11 |
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