JP7091035B2 - Multicolor LED luminaires and luminaires - Google Patents

Description

Application of Article 30, Paragraph 2 of the Patent Law From February 17 to 18, 2016, at the lecture hall on the 3rd floor of Mazda Motor Corporation Headquarters Building No. 1 (3-1 Shinchi, Fuchu-cho, Aki-gun, Hiroshima Prefecture), is it a public interest foundation in Kagawa Prefecture? Opened at Kagawa Prefecture New Technology / New Construction Method Exhibition Business Meeting in MAZDA held by the Gawa Industry Support Foundation.

The present invention relates to a multicolor LED lighting device and a lighting fixture having a COB (Chip On Board) structure, and the present invention relates to a multicolor LED lighting device and a lighting fixture having a total light beam of, for example, 10,000 to 50,000 lumens (lm) and a high light intensity and high brightness. Regarding. The term "white" as used herein also includes those having a color temperature range of 1700K to 6500K (generally referred to as amber).

In recent years, many lighting fixtures have been proposed in which the light emitting unit is replaced with an LED (Light Emitting Diode). COB mounting and package mounting are known as LED mounting methods. COB mounting is performed, for example, by mounting a semiconductor element on a flat plate-shaped substrate having a lead electrode pattern formed of a metal film on the surface, electrically connecting the semiconductor element to the lead electrode, and sealing the lead electrode with a resin.

In the LED lighting device having a COB structure, the LED element mounted on the mounting board and the wiring on the mounting board are electrically connected by wire bonding or flip chip mounting, and the LED element mounting area is sealed with a translucent resin. Manufactured. A manufacturing method is also known in which an annular frame is provided around a mounting area on a substrate before resin sealing, and the inside of the frame is filled with a translucent resin and sealed (for example, a patent). Document 1).

Recently, there is a demand for increasing the amount of light in LED lighting devices. However, when a large number of LED chips are COB-mounted on a substrate, if a substrate made of a material having low thermal conductivity such as glass epoxy resin is used, the amount of light in the center of light emission, which deteriorates heat dissipation, is particularly reduced. There is a problem that Therefore, in Patent Document 2, the applicant and the like apply a liquid material containing SiO ₂ particles having an average particle size of several nm to several hundred nm and a white inorganic pigment on the surface of a substrate whose surface is at least a metal, and fire it. By doing so, we have proposed a semiconductor device that can solve the donut phenomenon by forming a laminated structure of a white insulating layer and a metal layer.

In addition, a heat pipe (heat spreader) that cools the heating element by vaporizing and condensing the enclosed refrigerant has also been proposed so that it can be mounted even in a narrow space. In Patent Document 3, one of the upper plate and the lower plate has an arrangement portion for providing a cooling device, and one or a plurality of middle plates are provided between the upper plate and the lower plate for cooling. The main body of the cooling unit is provided, and inside the main body of the cooling unit, a steam diffusion flow path in which the refrigerant becomes steam and heat generated by the cooled device is transferred to the peripheral portion of the main body of the cooling unit, and the middle plate are provided. A capillary flow path is provided so that the refrigerant condensed in the peripheral portion returns to the arrangement portion side, and the arrangement portion is formed to be thinner than other regions and is covered with the cover. A heat pipe having a recess for mounting a cooling device has been proposed.

Japanese Unexamined Patent Publication No. 2009-164157 Japanese Patent No. 5456209 Japanese Patent No. 4119944

When increasing the amount of light in a multi-color LED lighting device, there is a problem that color unevenness occurs and the brightness also decreases when a multi-light source is adopted.
When a single light source is used to increase the amount of light in a multicolor LED lighting device, there are problems that the wiring pattern becomes complicated due to high-density mounting of LED chips, and that short-circuiting is likely to occur if narrow-pitch wiring is used.

Therefore, an object of the present invention is to provide a multicolor LED lighting device and a lighting fixture provided with a large number of LEDs in which the above problems are solved.

The multicolor LED lighting device of the present invention has a mounting board having a light emitting surface, a printed wiring board having an opening hollowed out so as to expose the light emitting surface, and arranged above the mounting board, and the above. A multicolor LED lighting device including a large number of LED chips mounted on a light emitting surface, wherein the large number of LED chips arranges two or more red LED chips along a first linear direction. , A red line connected in series, two or more green LED chips arranged along the first linear direction, a green line connected in series, and two or more blue LED chips. A plurality of sets of blue lines, which are arranged along the linear direction of the above and connected in series, are provided, and the printed wiring board includes a base material on which a wiring pattern connecting the red lines is formed, and the green line. It is characterized in that a base material on which a wiring pattern to be connected is formed and a base material on which a wiring pattern for connecting the blue line is formed are laminated.
In the LED lighting device, the plurality of LED chips are further provided with a plurality of sets of white lines in which two or more white LED chips are arranged along the first linear direction and connected in series. The printed wiring board may be characterized by including a base material on which a wiring pattern connecting the white lines is formed.

In the LED lighting device , the red line is composed of four or more red LED chips , the green line is composed of four or more green LED chips , and the blue line is composed of four or more blue LED chips . The red LED chip , the green LED chip, the blue LED chip and the said A group of unit LED chips made of white LED chips may be continuously arranged in a first linear direction and a second linear direction orthogonal to the first linear direction.

In the LED lighting device, the red LED chip and the blue LED chip are arranged so as to be parallel to the second linear direction, and the green LED chip and the white LED chip are parallel to the second linear direction. The red LED chip and the green LED chip are arranged so as to be arranged in parallel in the second linear direction, and the blue LED chip and the white LED chip are arranged in the second linear direction. The red LED chip and the white LED chip are arranged in parallel in the second linear direction, and the green LED chip and the blue LED chip are arranged in parallel with each other. It may be characterized by being arranged in parallel in two linear directions. In this case, when the minimum distance between the plurality of LED chips determined by the heat dissipation requirement is A, the adjacent color lines are arranged. It may be characterized in that the pitch is A / √2.

In the multicolor LED lighting device provided with the white line, the color temperature range of the white LED chip may be 1700K to 6500K.
In the above-mentioned multicolor LED lighting device, the plurality of sets of red lines each have the same number of LED chips and are connected in parallel, and the plurality of sets of green lines each have the same number of LED chips. The plurality of sets of blue lines are connected in parallel, the plurality of sets of blue lines each have the same number of LED chips and are connected in parallel, and the plurality of sets of white lines each have the same number of LED chips and are connected in parallel. It may be characterized by being done.
In the multicolor LED lighting device, the light emitting surface is a polygon having an even number of angles, and the first straight line is the rightmost and leftmost sides of the light emitting surface, or the uppermost side of the light emitting surface. And may be characterized by being a straight line parallel to the bottom edge.

In the multicolor LED lighting device including the printed wiring board, all of the wiring patterns may be characterized in that they are wiring patterns in which each color line is connected in parallel.
In a multicolor LED lighting device provided with a wiring pattern for connecting each of the above color lines in parallel, the printed wiring board includes cathode electrodes and anode electrodes provided in the same number as the number of colors of the LED chip, and the same color line is the same. It may be characterized by being connected to the cathode electrode and the anode electrode of the above.
In a multicolor LED lighting device provided with a wiring pattern for connecting each of the above color lines in parallel, a connector for connecting the printed wiring board and the mounting board is provided, and the connector is a wiring pattern formed on the mounting board and the printed circuit board. It may be characterized by including wiring for connecting to a wiring pattern formed on the wiring board.

In the multicolor LED lighting device provided with a wiring pattern for connecting each of the above color lines in parallel, the mounting substrate is further formed of metal at least on the surface, and each substrate constituting the printed wiring board is insulating. It may be characterized by being composed of a material.
In a multicolor LED lighting device including a base material made of the above-mentioned insulating material, the printed wiring board may be characterized by including a base material having a wiring pattern formed on both sides.
In the multicolor LED lighting device provided with the above-mentioned printed wiring board, the large number of LED chips may be characterized by being composed of COB-mounted LED bare chips.
In the above -mentioned multicolor LED lighting device, the light emitting surface may be characterized by having an input power of 100 W or more and an adjustable light emitting surface having an average color rendering index Ra of 65 or more.

The multicolor LED lighting fixture of the present invention is characterized by including the above-mentioned multicolor LED lighting device, a reflector, a heat sink, a power supply device, and a control device for controlling the color of the light emitting surface.

According to the present invention, it is possible to provide a multicolor LED lighting device and a lighting fixture having a large amount of light and high brightness that solves the problem of color unevenness.
Further, according to the present invention provided with the printed wiring board having an opening, it is possible to solve the problem of complicated wiring pattern and the problem of short circuit due to narrow pitch wiring that occur when the LED chip is mounted at high density.

It is a top view of the LED lighting apparatus which concerns on 1st Embodiment example. It is a modification of (a) an arrangement example of four-color LED chips, (b) a staggered arrangement of four-color LED chips according to the first embodiment, and (c) a staggered arrangement of four-color LED chips. It is a side sectional view of the LED lighting apparatus which concerns on 1st Embodiment. (A) is a side sectional view showing an example of a module on which a surface electrode LED element is mounted, and (b) is a side sectional view showing an example of a module on which a vertical electrode LED element is mounted. (A) is a spectrum under a clear sky, and (b) is a spectrum of an LED lighting device according to the first embodiment. It is a side sectional view of the main part of the LED lighting apparatus which concerns on 2nd Embodiment. It is a top view of the LED lighting apparatus which concerns on 3rd Embodiment Example. (A) It is a plan view of the LED lighting apparatus which concerns on 4th Embodiment example, and (b) is a side view. It is a top view of the LED lighting apparatus which concerns on 4th Embodiment which showed the connector transparently. It is a side sectional view of the LED lighting fixture equipped with the LED lighting apparatus which concerns on 1st Embodiment. It is a top view of the LED lighting apparatus which concerns on 5th Embodiment example. It is a top view for demonstrating the arrangement of the LED chip which concerns on 5th Embodiment example.

The LED lighting device of the present invention includes a large number (for example, 100 to 2000 or 200 to 2000) of several W class (for example, 0.5 to 4 W) LED chips, and has several hundred W or more (for example, 100 to 100). It constitutes a multicolor light source of 1000 W or 200 to 1000 W).
The light emitting surface is a planar light source in which four-color LED chips are arranged in an array, and is arranged on the same straight line and is on the same straight line as a red line composed of a plurality of red LED chips connected in series. A green line consisting of a plurality of green LED chips arranged and connected in series and a blue line consisting of a plurality of blue LED chips arranged and connected in series on the same straight line are provided. Preferably, it has a white line composed of a plurality of white LED chips arranged on the same straight line and connected in series. The white LED chip also includes an LED chip (generally called amber) having a color temperature range of 1700K to 6500K. The color temperature of the LED lighting device of the present invention can be adjusted in the range of, for example, 3000K to 7000K, and the color rendering property is, for example, an average color rendering index of Ra65 or more (preferably Ra70 or more, more preferably Ra75 or more, still more preferably Ra80 or more). It is adjustable to.

The number of LED chips constituting each color line can be any number (for example, 2 to 50, preferably 4 to 50), and the number of parallel connection of each color line can be any number (for example, 2 to 40, etc.). It can be preferably 4 to 40). From the viewpoint of preventing color unevenness, it is preferable that the number of LED chips constituting each color line and the number of parallel connections are the same.

The LED lighting device of the present invention in a preferred embodiment includes a mounting board on which an LED bare chip (LED die) is COB mounted, and a printed wiring board having an opening for exposing a light emitting surface and arranged on the mounting board. The printed wiring board has a base material (wiring layer) on which a wiring pattern for connecting red lines in parallel, a base material (wiring layer) on which a wiring pattern for connecting green lines is formed in parallel, and a blue line in parallel. It is characterized by laminating a base material (wiring layer) on which a wiring pattern to be connected is formed and a base material (wiring layer) on which a wiring pattern for connecting white lines in parallel is formed.

As will be described later, the LED lighting device is provided with a structure that dissipates heat from the back surface of the mounting substrate to the heat sink, and a lift creta (and / or a lens) is attached to form an LED lighting device. Hereinafter, the present invention will be described with reference to examples.

[Example of the first embodiment]
FIG. 1 is a plan view of the LED lighting device 1 according to the first embodiment of the present invention. The LED lighting device 1 is an LED lighting device mainly including a light emitting surface 2, a mounting board 3, a printed wiring board 4, a cathode electrode 5, and an anode electrode 6.

The light emitting surface 2 is a planar light source in which 416 LED chips are arranged in an array, and has eight sets of red lines extending in the vertical direction (hereinafter referred to as “vertical direction”) in FIG. 1 in the vertical direction. It has 8 sets of green lines extending in the vertical direction, 8 sets of blue lines extending in the vertical direction, and 8 sets of white lines extending in the vertical direction. Each color line is arranged in parallel in the left-right direction (hereinafter referred to as "horizontal direction") of FIG. 1 in the order of red-green-blue-white-red-green-blue-white ... from the left.
The red line is arranged on the same straight line and consists of 13 red LED chips 11 connected in series, and the green line is arranged on the same straight line and consists of 13 green LED chips 12 connected in series. Is composed of 13 blue LED chips 13 arranged on the same straight line and connected in series, and a white line is composed of 13 white LED chips 14 arranged on the same straight line and connected in series. Each color line is connected in parallel to form a color module, and each color module is connected to four power supply devices having the same specifications on a one-to-one basis (13 series for each color x 8 in parallel).

In the row of LED chips arranged in the horizontal direction, the LED chips in the rows adjacent to each other in the vertical direction are arranged in a staggered manner. In the row of LED chips (color lines) arranged in the vertical direction, the LED chips in the rows adjacent to each other in the left-right direction are arranged in a staggered manner. In other words, the unit LED chip group composed of the red LED chip 11, the green LED chip 12, the blue LED chip 13, and the white LED chip 14 substantially constitutes four vertices of a rhombus or a parallelogram. It is arranged to do. By adopting such an arrangement, a high-density arrangement (√2 times the aligned arrangement) at substantially even intervals is realized, and the problem of color unevenness is solved. FIG. 2A shows an example of arranging the four-color LED chips, FIG. 2B shows a staggered arrangement of the four-color LED chips according to the first embodiment, and FIG. 2C shows the four-color LED chips. Here is a modified example of the staggered arrangement of. When it is necessary to set the distance between chips to A in consideration of the heat dissipation of the LED chip, the row pitch in FIGS. 2 (b) and 2 (c) is 1 / √2 as compared with FIG. 2 (a). It can be shortened (however, A is larger than any of the vertical and horizontal widths of each LED chip).

FIG. 3 is a side sectional view of the LED lighting device 1 according to the first embodiment.
The mounting substrate 3 is a substrate made of a material having excellent thermal conductivity that does not cause a donut formation phenomenon, and is made of, for example, a copper plate or an aluminum plate. The mounting substrate 3 is sufficient as long as the surface is made of at least a metal material. For example, a heat spreader having a water-cooled structure having a surface made of copper (a laminated structure made of three types of copper plates of an upper plate, a middle plate, and a lower plate. Patent Document 3 See) may be used.
The back surface of the mounting substrate 3 according to the first embodiment is adhered to a heat sink (not shown) via an adhesive layer. As the adhesive layer, a high thermal conductive adhesive or a bonding sheet having an insulating property can be used.

A printed wiring board 4 having a substantially square shape at the center is fixed to the upper surface of the mounting board 3, and a substantially square LED mounting area constituting the light emitting surface 2 is exposed. A reflective layer 7 that reflects light emitted from the LED chips 11 to 14 is formed on the surface of the LED mounting region that is a flat surface. The reflective layer 7 is, for example, a silver-plated layer or an ink containing white inorganic powder (white inorganic pigment) and silicon dioxide (SiO ₂ ) as main components and mixed with a solvent of diethylene glycol monobutyl ether containing organic phosphoric acid. Is an inorganic white insulating layer formed by coating with screen printing or the like and firing. It should be noted that the LED chips 11 to 14 may be directly die-bonded to the upper surface of the mounting substrate 3 by providing a recess in which the reflective layer 7 is not formed in the place where the LED chips 11 to 14 are placed. In any case, since the LED chips 11 to 14 are not mounted on the printed wiring board 4 described later, which is inferior in thermal conductivity, the above-mentioned problem of donut formation does not occur.

The printed wiring board 4 is composed of four single-sided boards 4a to 4d which are resin boards, and has a substantially square opening in the central portion. The single-sided substrates 4a to 4d according to the first embodiment are all made of a glass epoxy substrate, and a wiring pattern of a one-color LED chip is formed on one single-sided substrate. In the present embodiment, since each of the RGBW color lines is provided with eight sets, a wiring pattern for combining the eight paths into one path is formed on the single-sided substrates 4a to 4d. As will be described later in the second embodiment, the printed wiring board may be configured by a multilayer board formed by combining double-sided boards having wiring patterns formed on both sides.
It is a design matter which color LED chip corresponds to which single-sided substrate. For example, the wiring pattern of the red LED chip 11 is formed on the single-sided substrate 4a, and the wiring pattern of the green LED chip 12 is formed on the single-sided substrate 4b. It is disclosed that the wiring pattern of the blue LED chip 13 is formed on the single-sided substrate 4c and the wiring pattern of the white LED chip 14 is formed on the single-sided substrate 4d.
The opening formed in the printed wiring board 4 is not limited to a substantially square shape, and may be, for example, a circle, an ellipse, a quadrangle, a pentagon, a hexagon, or an octagon.

A cathode electrode 5, an anode electrode 6, a protection diode device (not shown), and a temperature sensor 15 are arranged on the upper surface of the printed wiring board 4.
The cathode electrodes 5 are composed of electrode pads 5a to 5d and are electrically connected to the wiring patterns of the single-sided substrates 4a to 4d via through holes (not shown). The anode electrodes 6 are composed of electrode pads 6a to 6d and are electrically connected to the wiring patterns of the single-sided substrates 4a to 4d via through holes (not shown). A power connector or a socket may be attached to each electrode pad. The protection diode device (not shown) is a backflow prevention device that electrically connects the paired electrode pads 5 and 6, and is composed of one or a plurality of Zener diodes.
The temperature sensors 15a and 15b are temperature sensors for monitoring the substrate temperature, and are composed of, for example, a thin film resistance temperature detector element.

The LED chips 11 to 14 are, for example, LED bare chips using a gallium nitride based semiconductor, and all LED chips of the same color have the same specifications. The LED chips 11 to 13 are surface electrode LED elements connected by wire bonding of gold wires (see FIG. 4A), and the upper electrode of the LED chip 14 is connected by wire bonding of gold wires, and the bottom electrode is a die. It is a vertical electrode LED element connected by bonding (see FIG. 4B). The LED chips 11 to 13 are bonded by applying a die-attaching agent (silicon-based) to the bottom surface, and the LED chips 14 are bonded by applying a silver paste or a solder paste to the bottom surface. The gold wire connected to the terminal LED chips 11 to 14 is connected to the connection pad 10 made of the gold pad.

The connection method of the LED chips 11 to 14 is not limited to the example combination, and for example, all the LED chips may be composed of the surface electrode LED elements, or all the LED chips may be composed of the vertical electrode LED elements. can. In this embodiment, since the types of LED chips on the market are limited, the combination of the illustrated LED chips is adopted.
The LED chips 11 to 14 are mounted at high density in the LED mounting region of the mounting board 3. More specifically, LED chips 11 to 14 having a length and width of 1.15 mm or less are mounted in 32 rows at a pitch of 1.6 mm or less in the horizontal direction in an LED mounting area of 50 mm × 50 mm, and 2.0 mm or less in the vertical direction. It is mounted in 13 rows with a pitch, and the mounting area density is 474 mm ^{2/2500 mm 2 .} The maximum rated current of the LED chips 11 to 14 is 350 mA, and the total emission output is 425.88 W.

The area where the LED chips 11 to 14 are mounted is surrounded by a dam material 8 having at least a surface imparted with light reflectivity. The dam material 8 prevents the sealing resin from flowing during manufacturing, and is made of a resin, a metal material, or the like. The boundary between the inner surface of the printed wiring board 4 and the LED mounting area (or the reflective layer 7) is coated with a dam material including the connection pad 10. Inside the dam material 8, a translucent resin portion 9 formed by filling and curing a translucent resin (for example, epoxy resin, silicone resin, acrylic resin) is provided. The mounting board 3 of the present embodiment has a diameter of 80 mm, and the outer dimensions of the dam material 8 surrounding the LED mounting area are 54 mm × 54 mm.

The LED lighting device 1 of the first embodiment described above can provide a multi-color light source which is a single light source without causing color unevenness like a multi-light source. Further, the problem of color unevenness is solved by arranging a group of four-color LED chips composed of the same number of LED chips in a staggered arrangement at a high density. Further, since the multi-layer wiring is formed on the printed wiring board 4, the problem of short circuit due to the single-layer narrow pitch wiring does not occur, and simple wiring can be realized by reducing the number of external connection electrodes.
Further, since the desired color can be realized with a large amount of light and high brightness by freely combining the wavelengths of RGBW, it can be applied to various applications. For example, when it is used as an inspection light source in a vehicle body or a vehicle. Can also detect scratches, dents, foreign objects, etc. that could not be found with conventional lighting.
Furthermore, since it is possible to realize a spectrum close to that of sunlight, it is possible to carry out a simulation in an outdoor light environment. FIG. 5A shows a spectrum under a clear sky, and FIG. 5B shows a spectrum of an LED lighting device according to an embodiment.

[Example of the second embodiment]
The LED lighting device 20 according to the second embodiment is mainly composed of a light emitting surface 2, a mounting board 3, a printed wiring board 21, a cathode electrode 5, and an anode electrode 6. Is. Since the light emitting surface 2, the mounting substrate 3, the cathode electrode 5, and the anode electrode 6 are the same as those in the first embodiment, the description thereof will be omitted.

FIG. 6 is a side sectional view of a main part of the LED lighting device 20 according to the second embodiment, showing the laminated portion of the mounting board 3 and the printed wiring board 21.
The printed wiring board 21 of the second embodiment is configured to include the base materials 23a to 23c and the insulating layers 24a to 24c, and is laminated on the mounting substrate 3 via the adhesive sheet 22. The base material 23a is a single-sided substrate having wiring 25a formed on the lower surface, the base material 23b is a double-sided substrate having wiring 25b formed on the lower surface and wiring 25c formed on the upper surface, and the base material 23c is a wiring 25d on the upper surface. Is a single-sided substrate on which is formed, and these are composed of, for example, glass epoxy equipment. The insulating layers 24a to 24c are made of a resin composition containing a thermosetting resin such as an epoxy resin as a main component, and secure the insulating property between the wirings 25a to 25d.
In the second embodiment, the printed wiring board 21 is configured by one double-sided board and two single-sided boards, but the printed wiring board 21 may be configured by two double-sided boards.

The upper surface of the wiring 25d formed on the uppermost layer is subjected to surface treatment (for example, solder plating, gold plating) for connecting with solder or the like. A resist 27 is formed on the surface of the printed wiring board 21 except for a portion that needs to be connected to the outside. The resist 27 can be formed by a known method such as screen printing or a photographic method.
The printed wiring board 21 of the second embodiment also has a substantially square opening in the central portion that exposes the light emitting surface 2 as in the first embodiment.
The LED lighting device 20 of the second embodiment described above also has the same effect as that of the first embodiment.

[Example of the third embodiment]
The third embodiment shown in FIG. 7 is an LED lighting device 30 having the same light emitting surface 2 as the LED lighting device 1 according to the first embodiment. That is, the light emitting surface of the LED lighting device 30 of the third embodiment is also composed of 104 red LED chips 31, 104 green LED chips 32, 104 blue LED chips 33, and 104 white LED chips 34. (Each color 13 series x 8 parallel). The LED lighting device 30 of the third embodiment also solves the problem of color unevenness by arranging four-color LED chips at high density in a staggered arrangement. The temperature sensors 38a and 38b are temperature sensors for monitoring the substrate temperature, and are the same as those in the first embodiment.

The LED lighting device 30 of the third embodiment is significantly different from the LED lighting device of the first embodiment in that the wiring pattern is formed on the upper surface of the mounting substrate 37. Similar to the first embodiment, the mounting substrate 37 is made of a substrate whose surface is at least made of a metal material and has excellent heat dissipation.
In the third embodiment, 32 cathode electrodes 35 and 32 anode electrodes 36 are required for the design in which the electrode pads are provided for each color line. In the case of such a design, there are problems that the number of cables to be connected increases, the housing becomes large, and the assembly cost increases.
In this regard, in the first embodiment, the number of pairs of the cathode electrode 5 and the anode electrode 6 can be reduced within the range of multiples of the number of colors (minimum 4 pairs), and a wiring pattern is formed on the base material corresponding to each color. Therefore, it is possible to solve the above-mentioned problems of housing size and assembly cost.

In the LED lighting device 30 of the third embodiment described above, it is possible to provide a multi-color light source which is a single light source without causing color unevenness like a multi-light source. Further, the problem of color unevenness is solved by arranging a group of four-color LED chips composed of the same number of LED chips in a staggered arrangement at a high density.

[Example of the fourth embodiment]
The LED lighting device 40 according to the fourth embodiment is mainly composed of a light emitting surface 2, a mounting board 47, a printed wiring board 48, a cathode electrode 45, and an anode electrode 46. Is. The light emitting surface 2 is the same as that of the first embodiment, and has 104 red LED chips 41 staggered, 104 green LED chips 42, 104 blue LED chips 43, and 104 white LED chips 44. (Each color 13 series x 8 parallel). The temperature sensors 49a and 49b are temperature sensors for monitoring the substrate temperature, and are the same as those in the first embodiment.

The LED lighting device 40 of the fourth embodiment shown in FIG. 8 includes a mounting board 47 and a printed wiring board 48 connected by a female connector 51 and a male connector 52, and the LED lighting device 40 of the first embodiment is provided. It is very different from.
Similar to the first embodiment, the mounting substrate 47 is made of a substrate whose surface is at least made of a metal material and has excellent heat dissipation. On the upper surface of the mounting substrate 47, 32 positive electrode wirings 50 and 32 negative electrode wirings 50 are formed by screen printing or the like. As shown in FIG. 9, the wiring 50 connected to the 32 positive electrodes and 32 negative electrodes is connected via four sets of connecting connectors (51a to 51d, 52a to 52d) without intersecting the printed wiring board 48, and is printed wiring. The substrate 48 is connected in parallel in color units and is integrated into the electrodes 45 and 46 corresponding to each color. That is, a set of male and female connectors 51 and 52 communicates 16 wires to the printed wiring board 48. The male and female connectors 51 and 52 have a width W sufficient for arranging 32 wirings 50 drawn out to the cathode side or the anode side in parallel (for example, 70% or more of the side where the wirings of the light emitting surface 2 are drawn out, preferably 70% or more). Has a width of 80% or more), and also serves as a pillar connecting the upper surface of the mounting board 47 and the bottom surface of the printed wiring board 48. In the present embodiment, the widths of the four sets of connecting connectors (51a to 51d, 52a to 52d) are all set to the same width W, but it is naturally possible to make the widths of the connectors different.

In the present embodiment, the printed wiring board 48 is formed with an opening having a rectangular opening edge 53 sufficiently larger than the light emitting surface 2 so that the printed wiring board 48 does not block the light emitted from the light emitting surface 2. is doing. Each side of the opening edge 53 is preferably set to 1.1 times or more (preferably 1.2 times or more, more preferably 1.3 times or more) the length of the side of the adjacent light emitting surface 2. In order to form a large opening, it is necessary to arrange four sets of connecting connectors (51a to 51d, 52a to 52d) at positions sufficiently distant from the light emitting surface 2.
In this embodiment, the female connector 51 and the male connector 52 form a connecting connector, but the male and female connectors may be arranged in reverse, and the number of connecting connectors is not limited to four pairs. However, from the viewpoint of increasing the degree of freedom of wiring, it is preferable to arrange the connector at least on the cathode side and the anode side, and to provide the connector having a number of sets equal to or larger than the number of colors of the LED chip.

In the LED lighting device 40 of the fourth embodiment described above, it is possible to provide a multi-color light source which is a single light source without causing color unevenness like a multi-light source. Further, the problem of color unevenness is solved by arranging a group of four-color LED chips composed of the same number of LED chips in a staggered arrangement at a high density. In addition, it is possible to realize simple wiring by reducing the number of electrodes for external connection.

[Example of the fifth embodiment]
As shown in FIG. 11, the LED lighting device 60 according to the fifth embodiment mainly includes a light emitting surface 2, a mounting board 67, a printed wiring board 68, a cathode electrode 65, and an anode electrode 66. It is an LED lighting device configured in the above. The temperature sensors 69a and 69b are temperature sensors for monitoring the substrate temperature, and are the same as those in the first embodiment. The mounting mode of the mounting board 67 and the printed wiring board 68 is the same as that of the fourth embodiment, and the printed wiring board 68 of the upper layer blocks the light emitted from the light emitting surface 2 provided on the mounting board 67 of the lower layer. The printed wiring board 68 is formed with an opening having a rectangular opening edge 70 that is sufficiently larger than the light emitting surface 2. The opening formed in the printed wiring board 68 may be configured to have a similar shape (that is, an octagonal shape) to the light emitting surface 2.

The light emitting surface 2 is composed of 36 red LED chips 61, 32 green LED chips 62, 32 blue LED chips 63, and 36 white LED chips 64 staggered in an octagonal area. .. The total luminous flux is 14,481 lumens (lm), and the average color rendering index Ra exceeds 80. In the fifth embodiment, the total value of the input power is 226 W, while the input power to the white LED chip 64 is 74.25 W, which is the largest.
On the upper surface of the mounting board 67, 17 negative electrode wirings 67 and 17 positive electrode wirings 68 are formed by screen printing or the like, and are connected to 17 rows of color-coded LED chip lines.
As shown in FIG. 12, the red LED chip 61, the green LED chip 62, the blue LED chip 63, and the white LED chip 64 are arranged line-symmetrically with respect to the vertical center line and the horizontal center line in the light emitting surface 2. ing. Nine white LED chips 64 are arranged at equal intervals on the vertical center line of the light emitting surface 2.

In the present embodiment, by arranging a row of white LED chips 64 extending in the vertical direction along the left side and the right side of the light emitting surface 2, the left and right boundary portions of the irradiated area (bright part) and the non-irradiated area (dark part) are arranged. Is white. On the other hand, for example, when a row of red LED chips 61 extending in the vertical direction along the left side and the right side of the light emitting surface 2 is arranged, the left and right boundary portions of the bright part and the dark part become red, and the entire bright part becomes red. It turned out to be a dim light (even if the leftmost and rightmost columns were blue or green). Preferably, the majority of the LED chips arranged along the upper side and the lower side of the light emitting surface 2 are white LED chips 64, so that the upper and lower boundary portions between the bright part and the dark part have a color close to the light emission color of the white LED chip. (In this embodiment, three of the five LED chips arranged along the upper side and the lower side are white LED chips 64). More preferably, more than half of the LED chips arranged in the two rows from the top are white LED chips, and more than half of the LED chips arranged in the two rows from the bottom are white LED chips. From another point of view, the majority of the plurality of LED chips arranged along the outer edge (octagonal side) of the octagonal light emitting surface 2 is a white LED chip. In the present embodiment, 20 of the 36 LED chips arranged along the outer edge (eight sides) of the octagonal light emitting surface 2 are configured to be white LED chips 64.

Also in the LED lighting device 60 of the fifth embodiment described above, it is possible to provide a multi-color light source which is a single light source without causing color unevenness like a multi-light source. Further, since the boundary portion between the bright part and the dark part becomes the emission color of the white LED chip or a color close to it, it is possible to realize the irradiation light with a soft impression. It is the same as the first embodiment that it is possible to provide a multicolor light source which is a single light source without causing color unevenness.
In the fifth embodiment, the octagonal light emitting surface 2 is illustrated, but even when the light emitting surface 2 is a polygon such as a quadrangle or a hexagon, or a circle or an ellipse, the boundary portion between the bright part and the dark part is illustrated. It is effective to set the color to be the emission color of the white LED chip or a color close to it. When the light emitting surface 2 is a polygon having an even number of angles, the red LED chip 61, the green LED chip 62, the blue LED chip 63, and the white LED chip 64 are placed in the light emitting surface 2 in the vertical center line and the horizontal center. By arranging the LED chips line-symmetrically with respect to the line so that the majority of the plurality of LED chips arranged along the outer edge of the light emitting surface 2 are white LED chips, the same effect as that of the present embodiment can be obtained. Played.

[LED lighting equipment]
FIG. 10 is a side sectional view of an LED lighting fixture 100 equipped with the LED lighting device 1 according to the first embodiment. The LED lighting fixture 100 includes an LED lighting device 1, a reflector 121, a heat sink 122, a diffuser plate 123, a module holder 124, four power supply devices (not shown), and a control device (not shown). And is configured with. Of course, it is also possible to mount the LED lighting device according to the second to fourth embodiments on the LED lighting fixture 100.
The LED lighting device 1 is fixed by a fixing tool such as a screw in a state where the back surface of the heat spreader (not shown) adhered to the back surface thereof is in contact with the contact surface of the module holder 124. A heat transfer member such as thermal paste or a heat dissipation sheet is interposed between the back surface of the heat spreader and the contact surface of the module holder 124, if necessary. The module holder 124 is made of a metal material such as copper or aluminum having excellent thermal conductivity. The heat from the LED lighting device 1 is heat-conducted to the heat sink 122 via the module holder 124.

As the heat sink 122, a natural air-cooled type, a water-cooled type, or a heat sink equipped with an electric fan can be used. A reflector 121 and a transparent protective cover 125 are joined to the light-irradiating side of the module holder 124. The protective cover 125 is pressed against the module holder 124 via the O-ring 126, and also serves as a waterproof cover. In the example LED lighting fixture 100, a diffuser plate 123 is provided in the opening of the reflector 121.

The power supply device is composed of four unit power supply devices having the same specifications, and each power supply device is connected one-to-one with a color module composed of LED chips of each color. The voltage of each unit power supply device is 54Vmax, and the current is 3Amax. Unlike this, a configuration in which a plurality of routes are output from one power supply device (for example, a configuration in which four routes are output from two unit power supply devices) may be adopted.
The control device controls the unit power supply device to control the current value applied to the LED chips of each color in color units, or controls the amount of light by pulse width modulation (PWM) to control the color of the light emitting surface 2. do.

Although the preferred embodiment of the present invention has been described above, the technical scope of the present invention is not limited to the description of the above embodiment. Various changes and improvements can be added to the above-described embodiments, and those in which such changes or improvements have been made are also included in the technical scope of the present invention.

1 LED lighting device 2 light emitting surface 3 mounting board 4 printed wiring board 5 cathode electrode 6 anode electrode 7 reflective layer 8 dam material 9 translucent resin part 10 connection pad 11 red LED chip 12 green LED chip 13 blue LED chip 14 white LED Chip 15 Temperature Sensor 20 LED Lighting Device 21 Printed Wiring Board 22 Adhesive Sheet 23 Base Material 24 Insulating Layer 25 Wiring 26 Plating Layer 27 Resist 30 LED Lighting Device 31 Red LED Chip 32 Green LED Chip 33 Blue LED Chip 34 White LED Chip 35 Cone Electrode 36 Anode electrode 37 Mounting board 38 Temperature sensor 40 LED lighting device 41 Red LED chip 42 Green LED chip 43 Blue LED chip 44 White LED chip 45 Cathode electrode 46 Anode electrode 47 Mounting board 48 Printed wiring board 49 Temperature sensor 50 Wiring 51 Female Connector 52 Male Connector 53 Opening Edge 60 LED Lighting Device 61 Red LED Chip 62 Green LED Chip 63 Blue LED Chip 64 White LED Chip 65 cathode Electrode 66 Anode Electrode 67 Negative Wire 68 Positive Wire Wiring 69 Temperature Sensor 70 Opening Edge 100 LED Lighting Fixture 121 Reflector 122 Heat sink 123 Diffuse plate 124 Module holder 125 Protective cover 126 O-ring

Claims (15)

A mounted circuit board having a light emitting surface, a printed wiring board having an opening hollowed out so as to expose the light emitting surface and arranged above the mounting board, and a large number of LEDs mounted on the light emitting surface. A multicolor LED lighting device with a chip.
A red line in which a large number of LED chips are formed by arranging two or more red LED chips along a first linear direction and connecting them in series.
A green line formed by arranging two or more green LED chips along the first linear direction and connecting them in series, and
Two or more blue LED chips are arranged along the first linear direction, and a plurality of sets of blue lines connected in series are provided.
The printed wiring board has a base material on which a wiring pattern connecting the red line is formed, a base material on which a wiring pattern connecting the green line is formed, and a wiring pattern connecting the blue line. A multi-color LED lighting device characterized by being configured by laminating base materials. Further, the large number of LED chips are provided with a plurality of sets of white lines in which two or more white LED chips are arranged along the first linear direction and connected in series.
The multicolor LED lighting device according to claim 1, wherein the printed wiring board includes a base material on which a wiring pattern connecting the white lines is formed. The red line consists of four or more red LED chips.
The green line consists of four or more green LED chips.
The blue line consists of four or more blue LED chips.
The white line consists of four or more white LED chips.
The unit LED chip group including the red LED chip, the green LED chip, the blue LED chip, and the white LED chip arranged so that the light emitting surface constitutes the apex of the parallel quadrilateral is the first straight line. The multicolor LED lighting device according to claim 2, wherein the multicolor LED lighting device is continuously arranged in a direction and a second linear direction orthogonal to the first linear direction. The red LED chip and the blue LED chip are arranged in parallel in the second linear direction, and the green LED chip and the white LED chip are arranged in parallel in the second linear direction. thing,
The red LED chip and the green LED chip are arranged so as to be parallel to the second linear direction, and the blue LED chip and the white LED chip are arranged so as to be parallel to the second linear direction. That, or
The red LED chip and the white LED chip are arranged so as to be parallel to the second linear direction, and the green LED chip and the blue LED chip are arranged so as to be parallel to the second linear direction. The multicolor LED lighting device according to claim 3, wherein the LED lighting device is characterized by the above. The multicolor LED according to claim 4, wherein the pitch of adjacent color lines is A / √2 when the minimum distance between the plurality of LED chips determined by the heat dissipation requirement is A. Lighting device. The multicolor LED lighting device according to any one of claims 2 to 5, wherein the color temperature range of the white LED chip is 1700K to 6500K. The plurality of sets of red lines each having the same number of LED chips and connected in parallel.
The plurality of sets of green lines each having the same number of LED chips and connected in parallel.
The plurality of sets of blue lines each having the same number of LED chips and connected in parallel.
The multicolor LED lighting device according to any one of claims 2 to 6, wherein the plurality of sets of white lines each include the same number of LED chips and are connected in parallel. The light emitting surface is a polygon having an even number of angles.
The invention according to any one of claims 2 to 7, wherein the first straight line is a straight line parallel to the rightmost side and the leftmost side of the light emitting surface, or the uppermost side and the lowest side of the light emitting surface. Multicolor LED lighting device. 2. The printed wiring board is provided with the same number of cathode electrodes and anode electrodes as the number of colors of the LED chip, and the same color line is connected to the same cathode electrode and anode electrode. 7. The multicolor LED lighting device according to any one of 7. Further, a connector for connecting the printed wiring board and the mounting board is provided.
The multicolor LED lighting device according to claim 9, wherein the connector includes wiring for connecting a wiring pattern formed on the mounting board and a wiring pattern formed on the printed wiring board. The mounting substrate has at least a surface made of metal, and the surface thereof is made of metal.
The multicolor LED lighting device according to any one of claims 1 to 10, wherein each base material constituting the printed wiring board is made of an insulating material. The multicolor LED lighting device according to claim 11, wherein the printed wiring board includes a base material having a wiring pattern formed on both sides. The multicolor LED lighting device according to any one of claims 1 to 12, wherein the large number of LED chips are composed of COB-mounted LED bare chips. The multicolor LED lighting device according to any one of claims 1 to 13, wherein the light emitting surface comprises a light emitting surface having an input power of 100 W or more and an average color rendering index Ra of 65 or more. .. The multicolor LED lighting device according to any one of claims 1 to 14.
With a reflector,
With a heat sink
Power supply and
A multicolor LED lighting fixture comprising a control device for controlling the color of the light emitting surface.

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