JP7077796B2 - RF tag structure - Google Patents

RF tag structure Download PDF

Info

Publication number
JP7077796B2
JP7077796B2 JP2018109334A JP2018109334A JP7077796B2 JP 7077796 B2 JP7077796 B2 JP 7077796B2 JP 2018109334 A JP2018109334 A JP 2018109334A JP 2018109334 A JP2018109334 A JP 2018109334A JP 7077796 B2 JP7077796 B2 JP 7077796B2
Authority
JP
Japan
Prior art keywords
tag label
tag
dielectric plate
dielectric
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018109334A
Other languages
Japanese (ja)
Other versions
JP2019212153A (en
Inventor
哲治 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2018109334A priority Critical patent/JP7077796B2/en
Publication of JP2019212153A publication Critical patent/JP2019212153A/en
Application granted granted Critical
Publication of JP7077796B2 publication Critical patent/JP7077796B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Details Of Aerials (AREA)

Description

本発明は,無線による個体識別で用いるRFタグ(Radio Frequency)に関し,更に詳しくは,電子部品を実装するプリント基板(PCB: printed circuit board)など,比誘電率の高い電気物性を有する板状の物に適したRFタグに関する。 The present invention relates to an RF tag (Radio Frequency) used for individual identification by radio, and more specifically, a plate-like material having a high relative permittivity, such as a printed circuit board (PCB) on which an electronic component is mounted. Regarding RF tags suitable for things.

無線による個体識別で用いるRFタグラベルが,RFタグラベルを貼付する貼付面の電気物性に適していないと,RFタグラベルの通信性能が著しく悪化することがある。例えば,金属対応を図っていないRFタグラベルを金属面に貼付すると,金属面に貼付したRFタグラベルの通信性能は著しく悪化する。特許文献1で開示されている発明では,金属対応を図ったRFタグラベルとして,放射素子とマッチング回路からなるアンテナをRFタグラベルに実装し,放射素子が金属面と電気的に導通することで,RFタグラベルを貼付した金属面をRFタグラベルのアンテナの一部として利用できるようにしている。 If the RF tag label used for wireless individual identification is not suitable for the electrical characteristics of the surface to which the RF tag label is attached, the communication performance of the RF tag label may be significantly deteriorated. For example, if an RF tag label that is not compatible with metal is attached to a metal surface, the communication performance of the RF tag label attached to the metal surface is significantly deteriorated. In the invention disclosed in Patent Document 1, as an RF tag label for metal correspondence, an antenna consisting of a radiating element and a matching circuit is mounted on the RF tag label, and the radiating element is electrically conducted with a metal surface to perform RF. The metal surface with the tag label attached can be used as a part of the antenna of the RF tag label.

RFタグラベルを貼付する貼付面の電気物性にRFタグラベルが適していないと,RFタグラベルの通信性能が著しく悪化するケースとして,金属面にRFタグラベルを貼付する以外に,誘電体の性質を有する貼付面にRFタグラベルを貼付するケースがある。 If the RF tag label is not suitable for the electrical characteristics of the surface to which the RF tag label is attached, the communication performance of the RF tag label will be significantly deteriorated. There is a case where the RF tag label is attached to.

特許文献2のように,RFタグラベルの一部を誘電体から離間させて,RFタグラベルを誘電体に貼付すれば,平らな状態で誘電体に貼付しても,RFタグラベルの通信性能が著しく悪化しないように構成することが可能であるが,この場合,誘電体から離間するRFタグラベルの長さが問題になることがある。 If a part of the RF tag label is separated from the dielectric and the RF tag label is attached to the dielectric as in Patent Document 2, the communication performance of the RF tag label is significantly deteriorated even if the RF tag label is attached to the dielectric in a flat state. It can be configured so that it does not, but in this case the length of the RF tag label away from the dielectric can be a problem.

例えば,電気機器に内蔵するプリント基板(Printed Circuit Board)にRFタグラベルを貼る場合,プリント基板と電気機器の筐体間の隙間は小さいことが多いため,誘電体から出っ張るRFタグラベルの長さを短くできることが望まれる。 For example, when an RF tag label is attached to a printed circuit board built into an electrical device, the gap between the printed circuit board and the housing of the electrical device is often small, so the length of the RF tag label protruding from the dielectric is shortened. It is hoped that it can be done.

特開2012-104985号公報Japanese Unexamined Patent Publication No. 2012-104985 特開2006-3497号公報Japanese Unexamined Patent Publication No. 2006-3497

そこで,本発明は,誘電体に貼り付けたRFタグラベルの通信性能が著しく悪化せず,誘電体から出っ張るRFタグラベルの長さを短くしたRFタグ構造体を提供することを目的とする。 Therefore, an object of the present invention is to provide an RF tag structure in which the communication performance of the RF tag label attached to the dielectric is not significantly deteriorated and the length of the RF tag label protruding from the dielectric is shortened.

上述した課題を解決する本発明は,ICチップを接続させたループ状素子と,導波線路を利用して前記ループ状素子と接続している面状の結合素子を有する構造のアンテナを実装したRFタグラベルと,比誘電率の高い材料が用いられた誘電体板を備え,前記RFタグラベルに実装する前記アンテナは,縦の長さが表1に従い,横の長さが表2に従い,共振周波数が表3に従うように設計され,前記ループ状素子の一部が前記誘電体板の端から出っ張る長さが表4に従うように,前記ループ状素子の一部が前記誘電体板の端から出っ張り,前記結合素子の全てが前記誘電体板と重なる状態で,前記RFタグラベルが前記誘電体板に貼られていることを特徴とするRFタグ構造体である。なお,本発明では,前記誘電体板をプリント基板とすることが好適である。

Figure 0007077796000001
Figure 0007077796000002
Figure 0007077796000003
Figure 0007077796000004
In the present invention that solves the above-mentioned problems, an antenna having a structure having a loop-shaped element to which an IC chip is connected and a planar coupling element connected to the loop-shaped element by using a dielectric line is mounted. The antenna, which is equipped with an RF tag label and a dielectric plate made of a material having a high specific dielectric constant and is mounted on the RF tag label, has a vertical length according to Table 1 and a horizontal length according to Table 2, and has a resonance frequency. Is designed according to Table 3, and a part of the loop-shaped element protrudes from the end of the dielectric plate so that a part of the loop-shaped element protrudes from the end of the dielectric plate according to Table 4. , The RF tag structure is characterized in that the RF tag label is affixed to the dielectric plate in a state where all of the coupling elements overlap with the dielectric plate. In the present invention, it is preferable to use the dielectric plate as a printed circuit board.
Figure 0007077796000001
Figure 0007077796000002
Figure 0007077796000003
Figure 0007077796000004

本発明に係るRFタグ構造体が備えるRFタグラベルは,誘電体の性質を有する貼付面に適した構造にするために,誘電体が有する波長短縮効果を考慮して設計されている。また,本発明に係るRFタグ構造体において,誘電体から出っ張るRFタグラベルの長さは,通信性能が著しく悪化しない範囲で,誘電体から出っ張る長さが短くなるように規定されている。 The RF tag label included in the RF tag structure according to the present invention is designed in consideration of the wavelength shortening effect of the dielectric in order to make the structure suitable for the sticking surface having the property of the dielectric. Further, in the RF tag structure according to the present invention, the length of the RF tag label protruding from the dielectric is specified so that the length protruding from the dielectric is shortened within a range in which the communication performance is not significantly deteriorated.

本実施形態に係るRFタグ構造体を説明する図。The figure explaining the RF tag structure which concerns on this embodiment. 本実施形態に係るRFタグラベルを説明する図。The figure explaining the RF tag label which concerns on this embodiment. 本実施形態に係るRFタグ構造体の一例を説明する図。The figure explaining an example of the RF tag structure which concerns on this embodiment.

ここから,本発明の好適な実施形態を記載する。なお,以下の記載は本発明の技術的範囲を束縛するものでなく,理解を助けるために記述するものである。 From here, suitable embodiments of the present invention will be described. The following description does not constrain the technical scope of the present invention, but is intended to aid understanding.

図1は,本実施形態に係るRFタグ構造体1を説明する図である。図1で図示したように,本実施形態に係るRFタグ構造体1は,比誘電率の高い材料を用いた板状の部材である誘電体板12と,ICチップ113を接続させたループ状素子110と,導波線路112を利用してループ状素子110と接続している面状の結合素子111を有する構造のアンテナ11を実装したRFタグラベル10を備え,RFタグラベル10のアンテナ11は,通信性能が著しく悪化しないように設計され,RFタグラベル10は,ループ状素子110の一部が誘電体板12の端から出っ張り,結合素子111の全てが誘電体板12と重なる状態で誘電体板12に貼られている。 FIG. 1 is a diagram illustrating an RF tag structure 1 according to the present embodiment. As shown in FIG. 1, the RF tag structure 1 according to the present embodiment has a loop shape in which a dielectric plate 12 which is a plate-shaped member using a material having a high specific dielectric constant and an IC chip 113 are connected to each other. The RF tag label 10 is provided with an RF tag label 10 having an element 110 and an antenna 11 having a structure having a planar coupling element 111 connected to the loop element 110 by using a waveguide 112, and the antenna 11 of the RF tag label 10 is provided. Designed so that the communication performance does not deteriorate significantly, the RF tag label 10 has a dielectric plate in which a part of the loop-shaped element 110 protrudes from the end of the dielectric plate 12 and all of the coupling elements 111 overlap with the dielectric plate 12. It is affixed to 12.

図2は,本実施形態に係るRFタグラベル10を説明する図で,図2(a)は,RFタグラベル10の層構成を説明する図,図2(b)は,RFタグラベル10に実装するアンテナ11を説明する図である。 2A and 2B are diagrams for explaining the RF tag label 10 according to the present embodiment, FIG. 2A is a diagram for explaining the layer structure of the RF tag label 10, and FIG. 2B is an antenna mounted on the RF tag label 10. 11 is a diagram for explaining 11.

RFタグラベル10を使用する周波数帯はUHF帯(860~960Mhz)で,図2(a)で図示したように,RFタグラベル10は,ICチップ113を接続させたアンテナ11を実装したインレイ100と,アンテナ11を実装したインレイ100の面に積層した第1粘着層101と,第1粘着層101を保護する剥離紙102と,アンテナ11を実装したインレイ100の面の裏面に積層した第2粘着層103と,第2粘着層103を利用してインレイ100と接着している表面シート104から少なくとも構成されている。なお,RFタグラベル10は,第2粘着層103と表面シート104を省いた構成にすることもできる。 The frequency band in which the RF tag label 10 is used is the UHF band (860 to 960 Mhz), and as shown in FIG. 2A, the RF tag label 10 includes an inlay 100 on which an antenna 11 to which an IC chip 113 is connected is mounted. The first adhesive layer 101 laminated on the surface of the inlay 100 on which the antenna 11 is mounted, the release paper 102 that protects the first adhesive layer 101, and the second adhesive layer laminated on the back surface of the inlay 100 on which the antenna 11 is mounted. It is composed of at least 103 and a surface sheet 104 that is adhered to the inlay 100 by using the second adhesive layer 103. The RF tag label 10 may be configured without the second adhesive layer 103 and the surface sheet 104.

RFタグラベル10の材料について説明する。インレイ100のベースフィルムと表面シート104には,ポリエチレンテレフタラート(PET),ポリプロピレン(PP)等の合成樹脂製フィルムに加え,アート紙などを用いることができ,インレイ100に形成するアンテナ11にはアルミ箔などの金属箔を利用できる。また,第1粘着層101および第2粘着層103にはアクリル系やゴム系の粘着剤を利用できる。更に,剥離紙102には,シリコーン系などの剥離剤を塗布した合成樹脂製フィルムや剥離剤を塗布した紙を利用できる。なお,結合素子111に対応する箇所の剥離紙102のみを容易に剥がせるようにするための切り込み102aを剥離紙102に設けている。 The material of the RF tag label 10 will be described. For the base film and surface sheet 104 of the inlay 100, in addition to synthetic resin films such as polyethylene terephthalate (PET) and polypropylene (PP), art paper or the like can be used, and the antenna 11 formed on the inlay 100 can be used. Metal foil such as aluminum foil can be used. Further, an acrylic or rubber-based adhesive can be used for the first adhesive layer 101 and the second adhesive layer 103. Further, as the release paper 102, a synthetic resin film coated with a release agent such as silicone or paper coated with a release agent can be used. The release paper 102 is provided with a notch 102a so that only the release paper 102 at the portion corresponding to the coupling element 111 can be easily peeled off.

図2(b)を参照しながら,RFタグラベル10のインレイ100に実装するアンテナ11の構造について説明する。インレイ100に実装するアンテナ11は,ダイポールアンテナで,ICチップ113を接続させたループ状素子110および結合素子111を有し,導波線路112を介してループ状素子110が結合素子111と接続している構造になっている。 The structure of the antenna 11 mounted on the inlay 100 of the RF tag label 10 will be described with reference to FIG. 2 (b). The antenna 11 mounted on the inlay 100 is a dipole antenna, which has a loop-shaped element 110 and a coupling element 111 to which the IC chip 113 is connected, and the loop-shaped element 110 is connected to the coupling element 111 via a waveguide 112. It has a structure that is.

アンテナ11を構成するループ状素子110は,インレイ100に実装するICチップ113とのインピーダンス整合をとるためのアンテナ素子である。ICチップ113の入力端子間には容量性リアクタンス(キャパシタンス)が存在するので,ICチップ113と接続するループ状素子110の形状をループ形状にし,ICチップ113の入力端子間に存在する容量性リアクタンスに対応した誘導性リアクタンス(インダクタンス)をループ状素子110に持たせている。 The loop-shaped element 110 constituting the antenna 11 is an antenna element for impedance matching with the IC chip 113 mounted on the inlay 100. Since there is a capacitive reactance (capacitance) between the input terminals of the IC chip 113, the shape of the loop-shaped element 110 connected to the IC chip 113 is made into a loop shape, and the capacitive reactance existing between the input terminals of the IC chip 113. The loop-shaped element 110 is provided with an inductive reactance (inductance) corresponding to the above.

アンテナ11を構成する結合素子111は,RFタグラベル10を貼付した誘電体板12と電気的に結合し易いように,プレート電極のような板状の導体で構成されている。結合素子111が誘電体板12と重なるように,RFタグラベル10を誘電体板12に貼り付けると,誘電体板12に放射された電波は,誘電体板12を伝播し,結合素子111を介してRFタグラベル10に伝播され,RFタグラベルが放射する電波は,その逆の経路で誘電体板12に伝播される。 The coupling element 111 constituting the antenna 11 is composed of a plate-shaped conductor such as a plate electrode so that it can be easily electrically coupled to the dielectric plate 12 to which the RF tag label 10 is attached. When the RF tag label 10 is attached to the dielectric plate 12 so that the coupling element 111 overlaps with the dielectric plate 12, the radio waves radiated to the dielectric plate 12 propagate through the dielectric plate 12 and pass through the coupling element 111. The radio wave propagated to the RF tag label 10 and radiated by the RF tag label is propagated to the dielectric plate 12 by the reverse route.

図1で図示したように,ループ状素子110の一部が誘電体板12から出っ張り,結合素子111の全てが誘電体板12と重なる状態でRFタグラベル10を誘電体板12に貼ると,結合素子111は,誘電体板12と電気的に結合する。誘電体板12を伝搬する電波の波長は,誘電体板12が有する波長短縮効果により元の波長よりも短くなるので,本発明では,RFタグラベル10に実装するアンテナ11における縦の長さを表5のように規定している。

Figure 0007077796000005
As shown in FIG. 1, when the RF tag label 10 is attached to the dielectric plate 12 in a state where a part of the loop-shaped element 110 protrudes from the dielectric plate 12 and all of the coupling elements 111 overlap with the dielectric plate 12, they are coupled. The element 111 is electrically coupled to the dielectric plate 12. Since the wavelength of the radio wave propagating through the dielectric plate 12 is shorter than the original wavelength due to the wavelength shortening effect of the dielectric plate 12, in the present invention, the vertical length of the antenna 11 mounted on the RF tag label 10 is shown. It is specified as 5.
Figure 0007077796000005

更に,RFタグラベル10を誘電体板12に貼付すると,誘電体板12の影響で大きな寄生容量がRFタグラベル10に発生し,RFタグラベル10の共振周波数が低い方向にシフトしてしまう。RFタグラベル10の共振周波数を容易に変更可能とするために,線状の導線をジグザグ状に折り曲げたアンテナ素子をループ状素子と接続させることも考えられるが,誘電体板12から出っ張る長さが長くなるため,本実施形態では,線状の導線をジグザグ状に折り曲げたアンテナ素子をあえてRFタグラベル10に設けていない。 Further, when the RF tag label 10 is attached to the dielectric plate 12, a large parasitic capacitance is generated on the RF tag label 10 due to the influence of the dielectric plate 12, and the resonance frequency of the RF tag label 10 shifts in a low direction. In order to make it possible to easily change the resonance frequency of the RF tag label 10, it is conceivable to connect an antenna element in which a linear conductor is bent in a zigzag shape to a loop element, but the length protruding from the dielectric plate 12 is long. In this embodiment, the RF tag label 10 is not provided with an antenna element in which a linear conductor is bent in a zigzag shape because of the length.

線状の導線をジグザグ状に折り曲げたアンテナ素子を設けていないRFタグラベル10では,RFタグラベル10の横の長さで,RFタグラベル10の共振周波数を調整できるので,RFタグラベル10の横の長さとRFタグラベル10の共振周波数を表6,7のように規定する。

Figure 0007077796000006
Figure 0007077796000007
In the RF tag label 10 which does not have an antenna element in which a linear lead wire is bent in a zigzag shape, the resonance frequency of the RF tag label 10 can be adjusted by the horizontal length of the RF tag label 10, so that the horizontal length of the RF tag label 10 can be adjusted. The resonance frequency of the RF tag label 10 is specified as shown in Tables 6 and 7.
Figure 0007077796000006
Figure 0007077796000007

また,電気機器に内蔵するプリント基板を誘電体板12として利用する場合,プリント基板と電気機器の筐体間の隙間は小さいことが多いため,本実施形態では,通信性能が著しく悪化しないことを考慮して,ループ状素子110の一部が誘電体板12から出っ張る長さを表8のように規定している。

Figure 0007077796000008
Further, when the printed circuit board built in the electric device is used as the dielectric plate 12, the gap between the printed circuit board and the housing of the electric device is often small, so that the communication performance is not significantly deteriorated in this embodiment. In consideration, the length of a part of the loop-shaped element 110 protruding from the dielectric plate 12 is specified as shown in Table 8.
Figure 0007077796000008

本実施形態に係るRFタグ構造体1の一例について説明する。本実施形態に係るRFタグ構造体1が備える誘電体板12は,誘電体の性質を有する様々な部材に置き換えることができる。 An example of the RF tag structure 1 according to the present embodiment will be described. The dielectric plate 12 included in the RF tag structure 1 according to the present embodiment can be replaced with various members having the properties of a dielectric.

図3は,本実施形態に係るRFタグ構造体1の一例を説明する図である。図3で図示したRFタグ構造体1では,本実施形態に係るRFタグ構造体1が備える誘電体板12を,電子部品を実装するPCB12a(Printed Circuit Board)に置き換えている。図3では,ループ状素子110の全てと導波線路112の一部がPCB12aから出っ張り,結合素子111の全てがPCB12aと重なるように,誘電体材料を基材に用いたPCB12aの一辺にRFタグラベル10を貼り付けている。なお,これ以外の例としては,本実施形態に係るRFタグ構造体1が備える誘電体板12をガラス板に置き換える例が考えられる。 FIG. 3 is a diagram illustrating an example of the RF tag structure 1 according to the present embodiment. In the RF tag structure 1 illustrated in FIG. 3, the dielectric plate 12 included in the RF tag structure 1 according to the present embodiment is replaced with a PCB 12a (Printed Circuit Board) on which electronic components are mounted. In FIG. 3, an RF tag label is provided on one side of the PCB 12a using a dielectric material so that all of the loop-shaped element 110 and a part of the waveguide 112 protrude from the PCB 12a and all of the coupling elements 111 overlap with the PCB 12a. 10 is pasted. As another example, an example in which the dielectric plate 12 included in the RF tag structure 1 according to the present embodiment is replaced with a glass plate can be considered.

1 RFタグ構造体
10 RFタグラベル
100 インレイ
101 第1粘着層
102 剥離紙
103 第2粘着層
104 表面シート
11 アンテナ
110 ループ状素子
111 結合素子
112 導波線路
113 ICチップ
12 誘電体板
12a PCB
1 RF tag structure 10 RF tag label 100 Inlay 101 First adhesive layer 102 Release paper 103 Second adhesive layer 104 Surface sheet 11 Antenna 110 Loop-shaped element 111 Coupling element 112 Waveguide line 113 IC chip 12 Dielectric plate 12a PCB

Claims (2)

ICチップを接続させたループ状素子と,導波線路を利用して前記ループ状素子と接続している面状の結合素子を有する構造のアンテナを実装したRFタグラベルと,比誘電率の高い材料が用いられた誘電体板を備え,前記RFタグラベルに実装する前記アンテナは,縦の長さが表1に従い,横の長さが表2に従い,共振周波数が表3に従うように設計され,前記ループ状素子の一部が前記誘電体板の端から出っ張る長さが表4に従うように,前記ループ状素子の一部が前記誘電体板の端から出っ張り,前記結合素子の全てが前記誘電体板と重なる状態で,前記RFタグラベルが前記誘電体板に貼られていることを特徴とするRFタグ構造体。
Figure 0007077796000009
Figure 0007077796000010
Figure 0007077796000011
Figure 0007077796000012
An RF tag label with a loop-shaped element to which an IC chip is connected and an antenna having a structure having a planar coupling element connected to the loop-shaped element using a waveguide, and a material having a high specific dielectric constant. The antenna, which comprises a dielectric plate in which is used and is mounted on the RF tag label, is designed to have a vertical length according to Table 1, a horizontal length according to Table 2, and a resonance frequency according to Table 3. A part of the loop-shaped element protrudes from the end of the dielectric plate so that a part of the loop-shaped element protrudes from the end of the dielectric plate according to Table 4, and all of the coupling elements are the dielectric. An RF tag structure characterized in that the RF tag label is affixed to the dielectric plate in a state of being overlapped with the plate.
Figure 0007077796000009
Figure 0007077796000010
Figure 0007077796000011
Figure 0007077796000012
前記誘電体板をプリント基板としたことを特徴とする,請求項1に記載したRFタグ構造体。
The RF tag structure according to claim 1, wherein the dielectric plate is used as a printed circuit board.
JP2018109334A 2018-06-07 2018-06-07 RF tag structure Active JP7077796B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018109334A JP7077796B2 (en) 2018-06-07 2018-06-07 RF tag structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018109334A JP7077796B2 (en) 2018-06-07 2018-06-07 RF tag structure

Publications (2)

Publication Number Publication Date
JP2019212153A JP2019212153A (en) 2019-12-12
JP7077796B2 true JP7077796B2 (en) 2022-05-31

Family

ID=68845329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018109334A Active JP7077796B2 (en) 2018-06-07 2018-06-07 RF tag structure

Country Status (1)

Country Link
JP (1) JP7077796B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009011423A1 (en) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Wireless ic device
WO2018012427A1 (en) 2016-07-14 2018-01-18 株式会社村田製作所 Attention tag for retail article and retail article having same attached thereto
WO2019116758A1 (en) 2017-12-15 2019-06-20 株式会社村田製作所 Rfid tag and article to which rfid tag is attached

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009011423A1 (en) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Wireless ic device
WO2018012427A1 (en) 2016-07-14 2018-01-18 株式会社村田製作所 Attention tag for retail article and retail article having same attached thereto
WO2019116758A1 (en) 2017-12-15 2019-06-20 株式会社村田製作所 Rfid tag and article to which rfid tag is attached

Also Published As

Publication number Publication date
JP2019212153A (en) 2019-12-12

Similar Documents

Publication Publication Date Title
JP5703977B2 (en) Metal articles with wireless communication devices
TWI329839B (en) Rfid tag and manufacturing method thereof
JP2006042059A (en) Radio communication apparatus and impedance controlling method thereof
JP2010063017A (en) Rfid tag, rfid tag set and rfid system
KR20100100993A (en) Radio frequency identification tag
JP6583589B2 (en) Wireless communication device
CN109713427B (en) Ultra-thin flexible UHF RFID anti-metal label antenna
WO2018155382A1 (en) Rfid tag
JP6061035B2 (en) RFID tag and RFID system
JP2012253699A (en) Wireless communication device, its manufacturing method, and metal article with wireless communication device
US9378452B2 (en) Radio IC device
JP7077760B2 (en) RF tag structure
JP7155751B2 (en) RF tag label
JP7176226B2 (en) RF tag label and RF tag structure
JP7077796B2 (en) RF tag structure
JP6566558B2 (en) Electronic device and design method thereof
JP6872266B2 (en) RF tag antenna, RF tag and RF tag antenna manufacturing method
JP7014027B2 (en) RF tag label and RF tag structure
US20110074647A1 (en) Antenna module
US20210232888A1 (en) Wireless communication device
JP2012252664A (en) Radio communication device, manufacturing method thereof, and metal article with radio communication device
JP7006441B2 (en) RF tag structure
CN111149114A (en) RFIC module, RFID tag, and article
JP6476514B2 (en) Non-contact data transmitter / receiver
JP2020042605A (en) RF tag label

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210420

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220413

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220419

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220502

R150 Certificate of patent or registration of utility model

Ref document number: 7077796

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150