JP7062767B2 - セル面積を縮小し、チップレベルでのセル配置を改善するための金属０電源接地スタブ経路（ｍｅｔａｌ ｚｅｒｏ ｐｏｗｅｒ ｇｒｏｕｎｄ ｓｔｕｂ ｒｏｕｔｅ） - Google Patents

セル面積を縮小し、チップレベルでのセル配置を改善するための金属０電源接地スタブ経路（ｍｅｔａｌ ｚｅｒｏ ｐｏｗｅｒ ｇｒｏｕｎｄ ｓｔｕｂ ｒｏｕｔｅ） Download PDF

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JP7062767B2
JP7062767B2 JP2020527813A JP2020527813A JP7062767B2 JP 7062767 B2 JP7062767 B2 JP 7062767B2 JP 2020527813 A JP2020527813 A JP 2020527813A JP 2020527813 A JP2020527813 A JP 2020527813A JP 7062767 B2 JP7062767 B2 JP 7062767B2
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power
cell
metal layer
post
metal
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ティー． シュルツ リチャード
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Advanced Micro Devices Inc
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • G06F30/3947—Routing global
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/903—Masterslice integrated circuits comprising field effect technology
    • H10D84/907—CMOS gate arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/903—Masterslice integrated circuits comprising field effect technology
    • H10D84/907—CMOS gate arrays
    • H10D84/968—Macro-architecture
    • H10D84/974—Layout specifications, i.e. inner core regions
    • H10D84/975—Wiring regions or routing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/427—Power or ground buses
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/06—Power analysis or power optimisation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18—Manufacturability analysis or optimisation for manufacturability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Architecture (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2020527813A 2017-11-21 2018-09-24 セル面積を縮小し、チップレベルでのセル配置を改善するための金属０電源接地スタブ経路（ｍｅｔａｌ ｚｅｒｏ ｐｏｗｅｒ ｇｒｏｕｎｄ ｓｔｕｂ ｒｏｕｔｅ） Active JP7062767B2 (ja)

Priority Applications (1)

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JP2022069531A JP7668763B2 (ja) 2017-11-21 2022-04-20 セル面積を縮小し、チップレベルでのセル配置を改善するための金属０電源接地スタブ経路（ｍｅｔａｌ ｚｅｒｏ ｐｏｗｅｒ ｇｒｏｕｎｄ ｓｔｕｂ ｒｏｕｔｅ）

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/819,879 2017-11-21
US15/819,879 US11120190B2 (en) 2017-11-21 2017-11-21 Metal zero power ground stub route to reduce cell area and improve cell placement at the chip level
PCT/US2018/052369 WO2019103783A1 (en) 2017-11-21 2018-09-24 Metal zero power and ground post routing to reduce cell area and improve cell placement at the chip level

Related Child Applications (1)

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JP2022069531A Division JP7668763B2 (ja) 2017-11-21 2022-04-20 セル面積を縮小し、チップレベルでのセル配置を改善するための金属０電源接地スタブ経路（ｍｅｔａｌ ｚｅｒｏ ｐｏｗｅｒ ｇｒｏｕｎｄ ｓｔｕｂ ｒｏｕｔｅ）

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JP2021504941A JP2021504941A (ja) 2021-02-15
JP2021504941A5 JP2021504941A5 (https=) 2021-10-28
JP7062767B2 true JP7062767B2 (ja) 2022-05-06

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JP2020527813A Active JP7062767B2 (ja) 2017-11-21 2018-09-24 セル面積を縮小し、チップレベルでのセル配置を改善するための金属０電源接地スタブ経路（ｍｅｔａｌ ｚｅｒｏ ｐｏｗｅｒ ｇｒｏｕｎｄ ｓｔｕｂ ｒｏｕｔｅ）
JP2022069531A Active JP7668763B2 (ja) 2017-11-21 2022-04-20 セル面積を縮小し、チップレベルでのセル配置を改善するための金属０電源接地スタブ経路（ｍｅｔａｌ ｚｅｒｏ ｐｏｗｅｒ ｇｒｏｕｎｄ ｓｔｕｂ ｒｏｕｔｅ）

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US (2) US11120190B2 (https=)
EP (1) EP3714384A1 (https=)
JP (2) JP7062767B2 (https=)
KR (2) KR20220103208A (https=)
CN (1) CN111373407A (https=)
WO (1) WO2019103783A1 (https=)

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US10747931B2 (en) 2017-07-28 2020-08-18 Advanced Micro Devices, Inc. Shift of circuit periphery layout to leverage optimal use of available metal tracks in periphery logic
US11120190B2 (en) 2017-11-21 2021-09-14 Advanced Micro Devices, Inc. Metal zero power ground stub route to reduce cell area and improve cell placement at the chip level
US10438937B1 (en) 2018-04-27 2019-10-08 Advanced Micro Devices, Inc. Metal zero contact via redundancy on output nodes and inset power rail architecture
US10818762B2 (en) 2018-05-25 2020-10-27 Advanced Micro Devices, Inc. Gate contact over active region in cell
US11055469B2 (en) 2018-07-31 2021-07-06 Taiwan Semiconductor Manufacturing Company Ltd. Power structure with power pick-up cell connecting to buried power rail
US11030372B2 (en) * 2018-10-31 2021-06-08 Taiwan Semiconductor Manufacturing Company Ltd. Method for generating layout diagram including cell having pin patterns and semiconductor device based on same
US10796061B1 (en) * 2019-08-29 2020-10-06 Advanced Micro Devices, Inc. Standard cell and power grid architectures with EUV lithography
US11652050B2 (en) 2020-12-28 2023-05-16 Advanced Micro Devices, Inc. Inset power post and strap architecture with reduced voltage droop
CN113657071B (zh) * 2021-08-31 2023-10-13 杭州广立微电子股份有限公司 一种自动修正mos器件漏电通路的方法
US12205897B2 (en) 2021-09-23 2025-01-21 Advanced Micro Devices, Inc. Standard cell design architecture for reduced voltage droop utilizing reduced contacted gate poly pitch and dual height cells
US11862640B2 (en) 2021-09-29 2024-01-02 Advanced Micro Devices, Inc. Cross field effect transistor (XFET) library architecture power routing
US12308370B2 (en) 2021-09-29 2025-05-20 Advanced Micro Devices, Inc. Cross field effect transistors (XFETs) in integrated circuits
US11848269B2 (en) * 2021-10-04 2023-12-19 Advanced Micro Devices, Inc. Techniques to create power connections from floating nets in standard cells

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KR20220103208A (ko) 2022-07-21
CN111373407A (zh) 2020-07-03
KR102421671B1 (ko) 2022-07-15
US12455999B2 (en) 2025-10-28
EP3714384A1 (en) 2020-09-30
US20210406439A1 (en) 2021-12-30
JP2022101634A (ja) 2022-07-06
JP7668763B2 (ja) 2025-04-25
JP2021504941A (ja) 2021-02-15
US20190155979A1 (en) 2019-05-23
WO2019103783A1 (en) 2019-05-31
KR20200087190A (ko) 2020-07-20
US11120190B2 (en) 2021-09-14

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