JP7062655B2 - ステルスダイシング用粘着シートおよび半導体装置の製造方法 - Google Patents

ステルスダイシング用粘着シートおよび半導体装置の製造方法 Download PDF

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Publication number
JP7062655B2
JP7062655B2 JP2019528342A JP2019528342A JP7062655B2 JP 7062655 B2 JP7062655 B2 JP 7062655B2 JP 2019528342 A JP2019528342 A JP 2019528342A JP 2019528342 A JP2019528342 A JP 2019528342A JP 7062655 B2 JP7062655 B2 JP 7062655B2
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JP
Japan
Prior art keywords
pressure
sensitive adhesive
stealth dicing
adhesive sheet
semiconductor wafer
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Active
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JP2019528342A
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English (en)
Japanese (ja)
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JPWO2019008810A1 (ja
Inventor
孝斉 福元
茂之 山下
優智 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Publication date
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Publication of JPWO2019008810A1 publication Critical patent/JPWO2019008810A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2019528342A 2017-07-03 2018-02-02 ステルスダイシング用粘着シートおよび半導体装置の製造方法 Active JP7062655B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017130301 2017-07-03
JP2017130301 2017-07-03
PCT/JP2018/003594 WO2019008810A1 (ja) 2017-07-03 2018-02-02 ステルスダイシング用粘着シートおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2019008810A1 JPWO2019008810A1 (ja) 2020-04-30
JP7062655B2 true JP7062655B2 (ja) 2022-05-06

Family

ID=64949877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019528342A Active JP7062655B2 (ja) 2017-07-03 2018-02-02 ステルスダイシング用粘着シートおよび半導体装置の製造方法

Country Status (5)

Country Link
JP (1) JP7062655B2 (ko)
KR (1) KR102560374B1 (ko)
CN (1) CN110809815B (ko)
TW (1) TWI799407B (ko)
WO (1) WO2019008810A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171588A (ja) 2010-02-19 2011-09-01 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2014509450A (ja) 2011-03-08 2014-04-17 エルジー・ハウシス・リミテッド ウエハ加工フィルム用粘着剤組成物
WO2016052444A1 (ja) 2014-09-29 2016-04-07 リンテック株式会社 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4623694B2 (ja) * 2000-12-28 2011-02-02 日東電工株式会社 ダイシング用粘着シート
JP4770126B2 (ja) 2003-06-06 2011-09-14 日立化成工業株式会社 接着シート
WO2009063825A1 (ja) * 2007-11-16 2009-05-22 Tokyo Seimitsu Co., Ltd. ウェーハ処理装置
JP2010074136A (ja) * 2008-08-20 2010-04-02 Hitachi Chem Co Ltd 半導体装置の製造方法
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
JPWO2015178369A1 (ja) * 2014-05-23 2017-04-20 日立化成株式会社 ダイボンドダイシングシート
KR102478993B1 (ko) * 2017-07-03 2022-12-19 린텍 가부시키가이샤 스텔스 다이싱용 점착 시트 및 반도체 장치의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171588A (ja) 2010-02-19 2011-09-01 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2014509450A (ja) 2011-03-08 2014-04-17 エルジー・ハウシス・リミテッド ウエハ加工フィルム用粘着剤組成物
WO2016052444A1 (ja) 2014-09-29 2016-04-07 リンテック株式会社 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法

Also Published As

Publication number Publication date
CN110809815B (zh) 2023-10-20
CN110809815A (zh) 2020-02-18
TWI799407B (zh) 2023-04-21
KR20200026179A (ko) 2020-03-10
WO2019008810A1 (ja) 2019-01-10
KR102560374B1 (ko) 2023-07-28
TW201907465A (zh) 2019-02-16
JPWO2019008810A1 (ja) 2020-04-30

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