JP7055567B2 - Tape sticking device - Google Patents

Description

The present invention relates to a tape attaching device for attaching an adhesive tape to a work piece.

Devices such as ICs (Integrated Circuits), LSIs (Large Scale Integration), and MEMS (Micro Electro Mechanical Systems) are used when processing plate-shaped workpieces represented by semiconductor wafers formed on the surface. Adhesive tape for protection is applied so as to cover the area where the device is formed (device area). Adhesive tape prevents damage and contamination of the device during processing of the workpiece. Then, after the processing of the workpiece is completed, the adhesive tape is peeled off from the workpiece.

When the adhesive tape is peeled off from the workpiece, a part of the adhesive layer of the adhesive tape may remain on the surface of the workpiece. The residue of this adhesive layer causes the electrodes (bumps, bonding pads, etc.) of the device exposed on the surface of the workpiece to be contaminated. Further, when a device having a fine three-dimensional structure such as MEMS is formed on the surface of the workpiece, the device may be pulled by the adhesive layer of the adhesive tape and damaged when the adhesive tape is peeled off.

Therefore, a method has been proposed in which an adhesive tape having a region in which an adhesive layer is formed (adhesive region) and a region in which an adhesive layer is not formed (non-adhesive region) is used. The adhesive tape is attached so that the non-adhesive region is in contact with the device region of the workpiece and the adhesive region is in contact with the region where the device of the workpiece is not formed. As a result, contact between the adhesive layer of the adhesive tape and the device can be avoided, and contamination or damage to the device can be prevented.

When an adhesive tape having an adhesive region and a non-adhesive region is attached to a work piece, it is necessary to align the work piece and the adhesive tape so that the device area and the non-adhesive area overlap with each other. be. In Patent Document 1, a mark is attached to the center of the adhesive tape, and the adhesive tape is positioned so that the position of the mark attached to the adhesive tape and the position of the mark indicating the center of the workpiece coincide with each other. A tape sticking device for sticking an adhesive tape to a work piece is disclosed.

Japanese Unexamined Patent Publication No. 2013-243290

When the above-mentioned tape attaching device is used, an additional step of marking the center of the adhesive tape for alignment is required, which increases the labor and cost required for preparing the adhesive tape. In addition, if there is a large error in the position of the mark attached to the adhesive tape or the formation range of the adhesive layer, the position of the device area and the position of the non-adhesive area when the adhesive tape is actually attached to the work piece. There is a risk that the adhesive layer will come into contact with the device area.

The present invention has been made in view of such a problem, and provides a tape attaching device capable of accurately aligning an adhesive tape with a work piece without performing special processing on the adhesive tape. That is the issue.

According to one aspect of the present invention, a device provided in a region partitioned by a grid-like division schedule line, or a device region having an electrode connected to the device on the surface, and an outer peripheral surplus surrounding the device region. A non-adhesive region having no adhesive layer on the substrate and an adhesive region surrounding the non-adhesive region and having the adhesive layer on the substrate on the surface of the plate-shaped workpiece including the region. A tape sticking device for sticking an adhesive tape comprising the above, the boundary position detecting unit for detecting the position of the boundary between the non-adhesive region and the adhesive region of the adhesive tape, and the boundary position detecting unit for detecting the position. A sticking unit for sticking the adhesive tape to the workpiece so that the non-adhesive region is superimposed on the device region and the adhesive region is superimposed on the outer peripheral surplus region based on the position of the boundary. The boundary position detecting unit measures the thickness of the adhesive tape with an optical thickness measuring device, and detects the position of the boundary from the difference in the thickness of the adhesive tape depending on the presence or absence of the adhesive layer. Adhesive devices are provided.

In one aspect of the present invention, the device region and the non-adhesive region are circular, and the boundary position detection unit detects the coordinates of the boundary at three or more points, and the center of the non-adhesive region is detected from the detected coordinates. The sticking unit may stick the adhesive tape to the workpiece by detecting the coordinates and aligning the center coordinates of the non-adhesive region with the center coordinates of the device region.

The tape attaching device according to one aspect of the present invention includes a boundary position detecting unit that detects the position of the boundary between the non-adhesive region and the adhesive region of the adhesive tape. Then, based on the position of the boundary detected by the boundary position detection unit, the adhesive tape is attached to the workpiece so that the non-adhesive region is superimposed on the device region and the adhesive region is superimposed on the outer peripheral surplus region. This makes it possible to accurately align the work piece and the adhesive tape without performing a process such as marking the adhesive tape for alignment.

It is a perspective view which shows the workpiece. FIG. 2A is a plan view showing the adhesive tape, and FIG. 2B is a cross-sectional view showing the adhesive tape. It is a top view which shows the frame unit. FIG. 4A is a partial cross-sectional front view schematically showing the tape application device, and FIG. 4B shows a state in which the boundary position between the non-adhesive region and the adhesive region is detected by the boundary position detection unit. It is a partial cross-sectional front view which shows. FIG. 5A is a partial cross-sectional front view showing how the adhesive tape is attached to the workpiece, and FIG. 5B is a partial cross-sectional front view showing a state in which the adhesive tape is in close contact with the workpiece. It is a figure.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. First, an example of a plate-shaped workpiece to which an adhesive tape is attached by the tape attaching device according to the present embodiment will be described. FIG. 1 is a perspective view showing the workpiece 11.

The workpiece 11 is formed in a disk shape by a material such as silicon, and has a front surface 11a and a back surface 11b. The workpiece 11 is divided into a plurality of regions by a plurality of planned division lines (streets) 13 arranged in a grid pattern so as to intersect each other, and ICs (Integrated) are provided on the surface 11a side of the plurality of regions. A device 15 composed of a circuit), an LSI (Large Scale Integration), a MEMS (Micro Electro Mechanical Systems), or the like is formed. By dividing the workpiece 11 along the planned division line 13, a plurality of device chips including the device 15 can be obtained.

In this embodiment, a disk-shaped workpiece 11 made of a material such as silicon is used, but the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a wafer made of a material other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, etc. can also be used. Further, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device 15.

As shown in FIG. 1, the workpiece 11 has a circular device forming region 17 in which a plurality of devices 15 are formed on the surface, and an annular outer peripheral surplus region surrounding the device region 17 and having no device 15 formed on the surface. Has 19 and. Then, when various processes are applied to the workpiece 11, an adhesive tape is attached to the workpiece 11 in order to protect the device 15. This adhesive tape is attached to the surface 11a side of the workpiece 11 so as to cover the device region 17. A configuration example of the adhesive tape according to this embodiment will be described with reference to FIG.

FIG. 2A is a plan view showing the adhesive tape 21, and FIG. 2B is a cross-sectional view showing the adhesive tape. The adhesive tape 21 is a flexible circular base material 23 made of resin or the like, and is formed in an annular shape on the surface 23a of the base material 23 along the outer periphery of the base material 23, and has a circular opening 25a in the center. A layer 25 is provided.

As shown in FIG. 2B, the adhesive tape 21 surrounds a circular non-adhesive region 31 having no adhesive layer 25 on the base material 23 and a non-adhesive region 31 having an adhesive layer 25 on the base material 23. It has an annular adhesive region 33 to be formed. The adhesive layer 25 is formed so that the diameter of the non-adhesive region 31 (diameter of the opening 25a) is equal to or larger than the diameter of the device region 17 of the workpiece 11 and smaller than the diameter of the workpiece 11.

The adhesive layer 25 side of the adhesive tape 21 is made of resin or the like and is attached to a flexible release sheet 27. A cylindrical roll 29 is obtained by winding the release sheet 27 to which the plurality of adhesive tapes 21 are attached.

When the annular frame is attached to the outer peripheral portion of the adhesive tape 21 and the workpiece 11 is attached to the central portion of the adhesive tape 21, the workpiece 11 is supported by the annular frame via the adhesive tape 21. Is configured. For example, the machining of the workpiece 11 is carried out in a state where the frame unit is held by the chuck table of the machining apparatus.

FIG. 3 is a plan view showing the frame unit 39. When configuring the frame unit 39, first, the adhesive tape 21 is peeled off from the release sheet 27 (see FIG. 2). The peeling of the adhesive tape 21 can be carried out, for example, by winding the peeling sheet 27 with a roller or the like while holding the adhesive tape 21.

The adhesive force of the adhesive layer 25 to the release sheet 27 is weaker than the adhesive force of the adhesive layer 25 to the base material 23. Therefore, by moving the release sheet 27 away from the adhesive layer 25 while holding the adhesive tape 21, the adhesive tape 21 is peeled from the release sheet 27. After that, the adhesive tape 21 is attached to the annular frame 37 having the circular opening 37a formed in the central portion. Specifically, the outer peripheral portion of the adhesive region 33 is adhered to the annular frame 37 so that the opening 37a is covered by the adhesive tape 21.

Then, the surface 11a side of the workpiece 11 is attached to the central portion of the adhesive tape 21 exposed by the opening 37a of the annular frame 37. As a result, a frame unit 39 in which the workpiece 11 is supported by the annular frame 37 via the adhesive tape 21 is obtained, and the plurality of devices 15 formed on the workpiece 11 are covered and protected by the adhesive tape 21. To.

As shown in FIG. 3, in the adhesive tape 21, the non-adhesive region 31 is superimposed on the device region 17 of the workpiece 11, and the adhesive region 33 is superimposed on the outer peripheral surplus region 19 of the workpiece 11. It is attached to the workpiece 11. That is, only the outer peripheral surplus region 19 of the workpiece 11 comes into contact with the adhesive layer 25 and is attached to the adhesive tape 21, and the plurality of devices 15 formed on the workpiece 11 come into contact with the adhesive layer 25 of the adhesive tape 21. do not.

When the device region 17 is covered with the non-adhesive region 31 of the adhesive tape 21, the adhesive layer 25 remains in the device region 17 when the adhesive tape 21 is peeled from the workpiece 11 after the workpiece 11 is processed. And the contamination of the device 15 is avoided. Further, since the device 15 is not pulled by the adhesive layer 25 when the adhesive tape 21 is peeled off, damage to the device 15 due to the peeling of the adhesive tape 21 is avoided.

When the adhesive tape 21 is attached to the workpiece 11 as described above, the non-adhesive region 31 is superimposed on the device region 17, and the adhesive region 33 is adhered to the workpiece 11 so as to be superimposed on the outer peripheral surplus region 19. Align with the tape 21.

This alignment is performed using, for example, a mark attached to the adhesive tape 21 as a mark. However, when this method is used, an additional step of marking the adhesive tape 21 is required. Further, if there is a large error in the position of the mark attached to the adhesive tape 21 or the formation range of the adhesive layer 25, the position of the device region 17 when the adhesive tape 21 is actually attached to the workpiece 11 The position of the non-adhesive region 31 may be displaced, and the adhesive layer 25 may come into contact with the device region 17.

The tape attaching device according to the present embodiment includes a boundary position detecting unit that detects the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33 when the adhesive tape 21 is attached to the workpiece 11. Then, the adhesive tape 21 is positioned so that the non-adhesive region 31 is superimposed on the device region 17 and the adhesive region 33 is superimposed on the outer peripheral surplus region 19 based on the position of the boundary 35 detected by the boundary position detection unit.

In this way, by detecting the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33 by the boundary position detection unit, a step of marking the adhesive tape 21 for alignment becomes unnecessary, and the adhesive tape becomes unnecessary. The labor and cost required for the preparation of 21 can be reduced. Further, since the alignment between the workpiece 11 and the adhesive tape 21 is performed based on the position of the boundary 35 directly detected by the boundary position detecting unit instead of the position of the mark attached to the adhesive tape 21. It is possible to avoid a decrease in bonding accuracy due to misalignment of the marks and the like.

Hereinafter, a configuration example of the tape attaching device according to the present embodiment will be described. FIG. 4A is a partial cross-sectional front view schematically showing a tape sticking device 2 capable of sticking an adhesive tape 21 having a non-adhesive region 31 and an adhesive region 33 to a workpiece 11. Is. The tape attaching device 2 includes a rectangular parallelepiped chamber 4 composed of a main body portion 4a having an opening on the upper surface side and a chamber lid 4b for opening and closing the opening of the main body portion 4a.

The chamber 4 is connected to an air supply unit 6 that supplies gas (air) into the chamber 4 and an exhaust unit 12 that discharges gas (air) in the chamber 4. The air supply unit 6 has a supply source 8 for supplying gas (air) and a valve 10 connected to the supply source 8, and the supply source 8 is connected to the inside of the chamber 4 via the valve 10. .. Further, the exhaust unit 12 has a suction source 14 for sucking the gas in the chamber 4 and a valve 16 connected to the suction source 14, and the suction source 14 is connected to the inside of the chamber 4 via the valve 16. ing.

Inside the chamber 4, a sticking unit 18 for sticking the adhesive tape 21 to the workpiece 11 is provided. The sticking unit 18 includes a chuck table 20 for holding the workpiece 11. The chuck table 20 is formed in a circular shape in a plan view, and the upper surface of the chuck table 20 constitutes a circular holding surface 20a for holding the workpiece 11. However, the shape of the chuck table 20 can be appropriately changed according to the shape of the workpiece 11 held by the chuck table 20 and the like.

The holding surface 20a is formed substantially horizontally, and is connected to a suction source (not shown) such as an ejector via a suction path (not shown) provided inside the chuck table 20. Further, the chuck table 20 is connected to a moving mechanism (not shown) that controls the movement of the chuck table 20 in the vertical direction (vertical direction).

The workpiece 11 is suction-held by the chuck table 20 by applying the negative pressure of the suction source to the holding surface 20a in a state where the workpiece 11 is arranged on the holding surface 20a of the chuck table 20. Further, the position (height) of the workpiece 11 is controlled by moving the chuck table 20 holding the workpiece 11 in the vertical direction by the moving mechanism.

Further, the attachment unit 18 includes an annular frame support portion 22 that is arranged so as to surround the chuck table 20 and supports the annular frame 37 to which the adhesive tape 21 is attached. The upper surface of the frame support portion 22 constitutes an annular support surface 22a that holds the annular frame 37. The frame support portion 22 is positioned so that the support surface 22a is arranged above the holding surface 20a of the chuck table 20.

The annular frame 37 to which the adhesive tape 21 is attached is supported by the frame support portion 22 so that the adhesive layer 25 side is exposed downward (see FIG. 4B). As a result, the adhesive tape 21 is arranged above the workpiece 11 held by the chuck table 20.

The frame support portion 22 is connected to a movement mechanism (not shown) that controls the horizontal movement of the frame support portion 22. In a state where the annular frame 37 to which the adhesive tape 21 is attached is supported by the frame support portion 22, the frame support portion 22 is moved horizontally by the moving mechanism in the horizontal direction with respect to the workpiece 11 of the adhesive tape 21. The position is controlled.

Further, the sticking unit 18 includes a cylindrical roller 24 arranged on the upper side of the chuck table 20 and the frame support portion 22. The roller 24 is configured so that the length in the direction perpendicular to the circumferential direction is larger than the diameter of the workpiece 11, and the upper surface side (base material 23) of the adhesive tape 21 supported by the frame support portion 22 is provided. The back surface 23b side of the above (see FIG. 4B) is pressed toward the workpiece 11 held by the chuck table 20. Further, the roller 24 is connected to a moving mechanism (not shown) that controls the movement of the roller 24, and the horizontal and vertical positions of the roller 24 are controlled by the moving mechanism.

The adhesive tape 21 attached to the annular frame 37 is attached to the workpiece 11 by the attachment unit 18. As shown in FIG. 3, the adhesive tape 21 is attached to the workpiece 11 so that the non-adhesive region 31 covers the device region 17 and the adhesive region 33 is in contact with the outer peripheral surplus region 19. Therefore, when the adhesive tape 21 is attached to the workpiece 11, it is necessary to first position the adhesive tape 21 so that the non-adhesive region 31 overlaps with the device region 17 and the adhesive region 33 overlaps with the outer peripheral surplus region 19. be.

The tape attaching device 2 includes a boundary position detecting unit 26 that detects the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33. Then, the position of the adhesive tape 21 is adjusted by the moving mechanism connected to the frame support portion 22 so that the device region 17 of the workpiece 11 is superimposed on the inside of the boundary 35 detected by the boundary position detection unit 26. The work piece 11 and the adhesive tape 21 are aligned with each other.

The boundary position detection unit 26 is connected to a movement mechanism (not shown) that controls the movement of the boundary position detection unit 26. This movement mechanism controls the horizontal and vertical positions of the boundary position detection unit 26.

The position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33 can be detected by photographing the adhesive tape 21 with, for example, a camera or the like. However, the adhesive layer 25 of the adhesive tape 21 is mainly formed of a transparent or translucent resin, and it is often difficult to detect the position of the boundary 35 by a camera.

Therefore, the boundary position detection unit 26 includes an optical thickness measuring instrument 28 for measuring the thickness of the adhesive layer 21, and the non-adhesive region 31 is based on the thickness of the adhesive layer 21 measured by the thickness measuring instrument 28. The position of the boundary 35 between the adhesive region 33 and the adhesive region 33 is detected. FIG. 4B is a partial cross-sectional front view showing how the boundary position detection unit 26 detects the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33.

As shown in FIG. 4B, since the adhesive layer 25 is not formed in the non-adhesive region 31 and the adhesive layer 25 is formed in the adhesive region 33, the non-adhesive region 31 is formed from the adhesive region 33. Is also thin. Therefore, the thickness of the adhesive tape 21 is measured by the thickness measuring device 28, and the difference in the thickness of the adhesive tape 21 depending on the presence or absence of the adhesive layer 25 is detected, so that the boundary 35 between the non-adhesive region 31 and the adhesive region 33 is 35. The position of can be specified.

The boundary position detection unit 26 is arranged, for example, on the upper side of the adhesive tape 21 (on the back surface 23b side of the base material 23), and moves horizontally along the adhesive tape 21 while being moved horizontally along the adhesive tape 21 to the thickness of the adhesive tape 21 by the thickness measuring instrument 28. To measure. As the thickness measuring instrument 28, for example, a spectroscopic interferometry type thickness measuring instrument capable of measuring the thickness of a transparent or translucent material in a non-contact manner can be used.

In FIGS. 4A and 4B, the boundary position detection unit 26 is provided on the upper side of the adhesive tape 21, but the boundary position detection unit 26 is on the lower side of the adhesive tape 21 (adhesive layer 25 side). It may be provided in. In this case, as the thickness measuring instrument 28, for example, a laser displacement meter that does not transmit through the adhesive layer 25 or measures the displacement by irradiating the adhesive layer 25 with a laser beam having low permeability can be used. With this thickness measuring instrument 28, the thickness of the adhesive layer 21 can be detected by measuring the distance from the thickness measuring instrument 28 to the lower surface of the adhesive layer 21.

The measurement of the thickness of the adhesive tape 21 is carried out with the adhesive tape 21 placed on the workpiece 11. For example, the thickness is measured while moving the boundary position detection unit 26 from the outside of the workpiece 11 through the device region 17 and again along the path (arrow A in FIG. 3) to the outside of the workpiece 11. The thickness of the adhesive tape 21 is measured with the vessel 28.

Then, the boundary position detection unit 26 identifies a position where the thickness of the adhesive tape 21 differs by the thickness of the adhesive layer 25 based on the thickness of the adhesive tape 21 measured by the thickness measuring device 28. This position corresponds to the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33.

After that, the position of the frame support portion 22 is controlled so that the region inside the boundary 35 detected by the boundary position detection unit 26 and the device region 17 of the workpiece 11 overlap. Thereby, the position of the adhesive tape 21 can be adjusted so that the device region 17 is covered with the non-adhesive region 31.

Next, a specific example of the method of attaching the adhesive tape 21 using the tape attaching device 2 will be described. First, an adhesive tape 21 whose outer peripheral portion is attached to the annular frame 37 and a workpiece 11 to which the adhesive tape 21 is attached are prepared. Then, as shown in FIG. 4A, the chamber lid 4b is opened, and the workpiece 11 and the adhesive tape 21 are carried into the chamber 4.

The workpiece 11 is sucked and held by the chuck table 20 so that the surface 11a side (see FIG. 1) on which the device 15 is formed is exposed upward. Further, the annular frame 37 is supported by the frame support portion 22 so that the adhesive layer 25 side of the adhesive tape 21 faces the surface 11a of the workpiece 11. The position (height) of the chuck table 20 is adjusted so that the adhesive tape 21 does not come into contact with the workpiece 11.

Then, the position information in the horizontal direction of the workpiece 11 sucked and held by the chuck table 20 is acquired. As the position information of the workpiece 11, for example, the center coordinates of the device region 17 in the state where the workpiece 11 is sucked and held by the chuck table 20 are acquired. The acquisition of the position information can be performed by a method such as photographing the workpiece 11 with a camera.

The method of acquiring the center coordinates of the device area 17 is not limited to the above. For example, before the workpiece 11 is conveyed onto the chuck table 20, information on the center position of the device region 17 with respect to the entire workpiece 11 is acquired in advance, and after the workpiece 11 is conveyed, the device region 17 The center coordinates may be calculated. In this case, the workpiece 11 is sucked and held by the chuck table 20 based on the information on the center position of the device region 17 acquired before the transfer and the angle and the transport distance of the workpiece 11 during the transfer. The center coordinates of the device area 17 in the above are calculated.

Next, the boundary position detection unit 26 detects the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33 of the adhesive tape 21. Specifically, first, the thickness of the adhesive tape 21 is measured by the thickness measuring device 28. The thickness of the adhesive tape 21 is measured, for example, by measuring the thickness of the adhesive tape 21 with the thickness measuring device 28 while moving the boundary position detecting unit 26 along the path indicated by the arrow A in FIG. ..

Then, the boundary position detecting unit 26 identifies a position where the thickness of the adhesive tape 21 differs by the thickness of the adhesive layer 25 based on the thickness of the adhesive tape 21 measured by the thickness measuring device 28. This position corresponds to the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33.

Next, the work piece 11 and the adhesive tape 21 are aligned based on the position of the boundary 35 detected by the boundary position detection unit 26. Specifically, the device region 17 of the workpiece 11 is superimposed on the region inside the detected boundary 35, and the outer peripheral surplus region 19 of the workpiece 11 is superimposed on the region outside the detected boundary 35. The position of the adhesive tape 21 is adjusted so as to be used. The position of the adhesive tape 21 is adjusted by a moving mechanism connected to the frame support portion 22.

The above alignment can be performed, for example, by aligning the center coordinates of the non-adhesive region 31 of the adhesive tape 21 with the center coordinates of the device region 17 of the workpiece 11. Specifically, the boundary position detection unit 26 detects the coordinates of the boundary 35 at three or more points, and calculates the center coordinates of the non-adhesive region 31 from these coordinates.

Then, the frame support portion 22 is moved so that the center coordinates of the non-adhesive region 31 are aligned with the center coordinates of the device region 17. As a result, the adhesive tape 21 is arranged so that the non-adhesive region 31 overlaps with the device region 17 of the workpiece 11.

Next, the adhesive tape 21 is attached to the workpiece 11. FIG. 5A is a partial cross-sectional front view showing how the adhesive tape 21 is attached to the workpiece 11. First, the valve 16 is opened with the chamber lid 4b closed and the inside of the chamber 4 is a closed space, and the gas in the chamber 4 is discharged by the suction source 14 to reduce the pressure in the chamber 4.

Then, the chuck table 20 is raised to a position where the surface 11a of the workpiece 11 and the adhesive tape 21 come into contact with each other. As a result, the device region 17 is covered with the non-adhesive region 31, and the outer peripheral surplus region 19 is in contact with the adhesive region 33. At this time, a part of the non-adhesive region 31 may be in contact with the outer peripheral surplus region 19.

After that, the roller 24 is moved to the end portion of the workpiece 11, and the outer peripheral surface of the roller 24 is brought into contact with the back surface 23b of the base material 23 of the adhesive tape 21. Then, the roller 24 is rolled along the workpiece 11 while maintaining the state in which the outer peripheral surface of the roller 24 and the adhesive tape 21 are in contact with each other. As a result, the adhesive tape 21 is pressed against the workpiece 11, and the adhesive tape 21 is attached to the workpiece 11.

Next, the valve 16 is closed and the valve 10 is opened, and gas is introduced into the chamber 4 from the supply source 8 to increase the pressure in the chamber 4. After that, the chamber lid 4b is opened to release the chamber 4 to the atmosphere. As a result, atmospheric pressure acts on the adhesive tape 21, and the adhesive tape 21 comes into close contact with the surface 11a of the workpiece 11. FIG. 5B is a partial cross-sectional front view showing a state in which the adhesive tape 21 is in close contact with the workpiece 11.

In this way, by using the tape attaching device 2, the adhesive tape 21 is attached to the workpiece 11 so that the non-adhesive region 31 corresponds to the device region 17 and the adhesive region 33 corresponds to the outer peripheral surplus region 19. Will be done.

As described above, the tape attaching device 2 according to the present embodiment includes a boundary position detecting unit 26 that detects the position of the boundary 35 between the non-adhesive region 31 and the adhesive region 33 of the adhesive tape 21. Then, based on the position of the detected boundary 35, the adhesive tape 21 is attached to the workpiece 11 so that the non-adhesive region 31 is superimposed on the device region 17 and the adhesive region 33 is superimposed on the outer peripheral surplus region 19. This makes it possible to accurately align the work piece 11 and the adhesive tape 21 without performing a step such as marking the adhesive tape 21 for alignment.

Although the case where the disk-shaped workpiece 11 having the device 15 formed on the surface 11a side is used in the above description, the adhesive tape 21 is attached by the tape attaching device 2 according to the present embodiment. There are no restrictions on the type of work piece. For example, the workpiece 11 may be a package substrate such as a CSP (Chip Size Package) substrate formed by covering a plurality of devices provided in a region partitioned by a planned division line with a resin layer (mold resin). ..

The package substrate has a device region in which the above device is formed and an outer peripheral surplus region surrounding the device region. An electrode connected to the device is exposed on the surface of the device region. When processing the package substrate, an adhesive tape 21 may be attached to protect the electrodes.

The adhesive tape 21 can also be attached to the package substrate by using the tape attaching device 2 according to the present embodiment. In this case, the adhesive tape 21 is attached to the surface of the package substrate so that the device region of the package substrate overlaps with the non-adhesive region 31, and the outer peripheral excess region of the package substrate overlaps with the adhesive region 33. As a result, the electrode can be protected while preventing the adhesive layer 25 of the adhesive tape 21 from adhering to the electrode exposed on the surface of the package substrate.

In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented as long as they do not deviate from the scope of the object of the present invention.

11 Work piece 11a Front surface 11b Back surface 13 Scheduled division line 15 Device 17 Device area 19 Outer peripheral surplus area 21 Adhesive tape 23 Base material 23a Front surface 23b Back surface 25 Adhesive layer 25a Opening 27 Peeling sheet 29 roll 31 Non-adhesive area 33 Adhesive area 35 Boundary 37 Circular frame 37a Opening 39 Frame unit 2 Tape sticking device 4 Chamber 4a Main body 4b Chamber lid 6 Air supply unit 8 Supply source 10 Valve 12 Exhaust unit 14 Suction source 16 Valve 18 Sticking unit 20 Chuck table 20a Holding surface 22 Frame Support part 22a Support surface 24 Roller 26 Boundary position detection unit 28 Thickness measuring instrument

Claims (2)

A plate-like cover having a device provided in a region partitioned by a grid-shaped scheduled division line, or a device region having an electrode connected to the device on the surface, and an outer peripheral surplus region surrounding the device region. A tape to which an adhesive tape having a non-adhesive region having no adhesive layer on the substrate and an adhesive region having the adhesive layer on the substrate surrounding the non-adhesive region is attached to the surface of the processed product. It ’s a sticking device,
A boundary position detecting unit that detects the position of the boundary between the non-adhesive region and the adhesive region of the adhesive tape, and
The adhesive tape is applied to the workpiece so that the non-adhesive region is superimposed on the device region and the adhesive region is superimposed on the outer peripheral surplus region based on the position of the boundary detected by the boundary position detection unit. Equipped with a sticking unit to stick,
The boundary position detecting unit is characterized in that the thickness of the adhesive tape is measured by an optical thickness measuring device, and the position of the boundary is detected from the difference in the thickness of the adhesive tape depending on the presence or absence of the adhesive layer. Tape sticking device. The device area and the non-adhesive area are circular and are circular.
The boundary position detection unit detects the coordinates of the boundary at three or more points, calculates the center coordinates of the non-adhesive region from the detected coordinates, and calculates the coordinates of the non-adhesive region.
The tape sticking device according to claim 1, wherein the sticking unit aligns the center coordinates of the non-adhesive region with the center coordinates of the device region and sticks the adhesive tape to the workpiece.

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