JP7055010B2 - Optical equipment - Google Patents

Description

The present invention relates to an optical device including a light emitting part and a light receiving part of a laser beam.

Optical modules are known by utilizing the reflection of light such as a laser beam that detects and measures an object. The optical module has a light emitting part such as a laser beam, a reflecting part that reflects the emitted light and guides it toward an object located outside the optical module, and a light receiving part that receives the light reflected by the object. Have. The light receiving unit receives the light radiated to the outside and reflected by the object, and the existence of the object, the distance to the object, and the like can be measured.

In the conventional optical module, for example, as shown in Patent Document 1, a MEMS mirror for reflection and a light receiver are mounted on one substrate. Further, for example, as shown in Patent Document 2, the light emitting portion and the reflecting portion are arranged separately.

JP-A-2015-148654 Japanese Unexamined Patent Publication No. 2001-108758

In an optical device that detects the position of an object by emitting and receiving laser light, it is required to reduce the number of components constituting the optical device and improve the workability of alignment between the components.

The optical device of one aspect of the present invention is positioned with a light emitting unit including a light emitting element of laser light and a MEMS element having a movable reflecting surface located facing the light emitting element, and facing the movable reflecting surface. A substrate having a light receiving element including a light receiving element having a light receiving surface inclined with respect to the movable reflecting surface, a substrate having at least one recess in which the movable reflecting surface and the opening overlap in a plan view, and the above. A lid that closes the recess is included, and a positioning portion for the light emitting portion and the light receiving portion is provided on the inner surface of the substrate in the recess, and the light emitting element and the MEMS element are located close to the positioning portion. And a container portion to which the light receiving element is positioned and fixed, and the recesses have a first inner side surface and a second inner side surface which face each other and are inclined outward from the lower part to the upper part. The light emitting element and the light receiving element are located on the first inner surface surface, and the MEMS element is located on the second inner surface surface .

According to the optical device of one aspect of the present invention, it has the above-mentioned configuration, and the light emitting portion and the light receiving portion are mounted so as to be aligned with each other in the container portion having the positioning portion. Therefore, the need for the light emitting unit and the light receiving unit to be aligned with each other and set and fixed is effectively reduced. Therefore, it is easy to reduce the labor and parts required for alignment. Therefore, it is possible to provide an optical device effective for reducing the number of parts and improving the workability of alignment between parts.

It is sectional drawing which shows the optical apparatus of embodiment of this invention. It is a top view which shows the optical apparatus of embodiment of this invention. It is sectional drawing which shows the example of the part A of FIG. 1 enlarged. It is sectional drawing which shows the modification of the optical apparatus shown in FIG. (A) is a cross-sectional view showing another modification of the optical device shown in FIG. 1, and (b) is a plan view thereof. It is a schematic diagram which shows the operation example of the optical apparatus of embodiment of this invention. It is a top view which shows the optical apparatus of another embodiment of this invention.

The optical device of the embodiment of the present invention will be described with reference to the drawings. The figures used in the following description are schematic, and some parts may be omitted for the sake of clarity. Further, the distinction between upper and lower in the following description is for convenience of explanation and does not regulate the upper and lower when the optical device is actually used. Further, the "incident angle" in the following description is an angle formed by the surface of an object (a lid and a light receiving element described later) to which light is incident and the optical axis of light, and is 0 to 90 degrees for convenience of explanation. Is. That is, the angle of incidence when light is incident along a perpendicular or normal to the surface of an object is defined as 90 degrees.

FIG. 1 is a cross-sectional view showing an optical device according to an embodiment of the present invention. FIG. 2 is a plan view showing an optical device according to an embodiment of the present invention. FIG. 3 is an enlarged cross-sectional view showing an example of the D portion of FIG. FIG. 4 is a cross-sectional view showing a modified example of the optical device shown in FIG. 5 (a) is a cross-sectional view showing another modification of the optical device shown in FIG. 1, and FIG. 5 (b) is a plan view showing an example of a form when FIG. 5 (a) is viewed from above. be. FIG. 6 is a schematic view showing an operation example of the optical device according to the embodiment of the present invention, and the optical device is shown in a cross-sectional view.

In the examples shown in FIGS. 1 to 5, the optical device 10 returns after being reflected by a light emitting unit A that emits laser light (hereinafter, also referred to as synchrotron radiation) L to the outside and an object to be detected that exists outside. It also includes a light receiving unit B that receives the laser light (hereinafter, also referred to as reflected light) R, and a container unit C that holds and seals the light emitting unit A and the light receiving unit B in a predetermined positional relationship. .. In FIG. 2, in order to make the structure of the container portion C easier to see, a part of the light emitting portion A and the light receiving portion B is shown by a broken line. For example, as shown in FIG. 6, based on the information of the reflected light R received by the light receiving unit B, information such as the presence / absence of the object to be detected E, the shape, the dimensions, the moving speed, and the like is calculated and detected. The object to be detected E is, for example, a pedestrian E1 and a vehicle E2.

The light emitting unit A includes a light emitting element 1 for laser light and a MEMS (Micro Electro Mechanical Systems) element 2 having a movable reflecting surface 2a. Further, the light receiving unit B includes a light receiving element 3 having a light receiving surface 3a that is located facing the movable reflecting surface 2a and is inclined with respect to the movable reflecting surface 2a. The light emitting element 1 and the reflecting surface 2a of the MEMS element 2 face each other. That is, the laser beam L emitted from the light emitting element 1 is reflected by the movable reflecting surface 2a located facing each other. This reflection is performed on the movable reflecting surface 2a at different angles in terms of diameter, and is radiated to the outside as synchrotron radiation L from the optical device 10 at a wide angle.

The container portion C includes a substrate 4 having at least one recess 4a and a lid 5 for closing the recess 4a. Further, the positioning portion 6 of the light emitting portion A and the light receiving portion B is provided on the inner surface of the substrate 4 in one recess 4a. The light emitting element 1, the MEMS element 2, and the light receiving element 3 are positioned and fixed in the vicinity of these positioning portions 6. By this positioning, as described above, the laser beam L can be easily and accurately reflected from the light emitting element 1 to the movable reflecting surface 2a of the MEMS element 2 and guided. Further, the reflected light R can be accurately received by the light receiving element 3. In this case, in a plan view, the movable reflective surface 2a and the opening 4b of the recess 4a of the substrate 4 included in the container portion C overlap. Therefore, the laser beam L reflected upward from the movable reflecting surface 2a can be radiated to the outside from the opening 4b.

Since the optical device 10 of the embodiment has the above-described configuration, the need for the light emitting unit A and the light receiving unit B to be aligned with each other and set and fixed is effectively reduced. In addition, it is easy to improve the positional accuracy of each other. This facilitates the reduction of labor and parts required for alignment. Therefore, it is possible to provide an optical device 10 that is effective in reducing the number of parts and improving the workability of alignment between parts.

The light emitting element 1 is a semiconductor element or the like that emits a laser beam L, and is, for example, a semiconductor laser (laser diode). The light emitting device 1 is configured by laminating compound semiconductor materials such as GaN (gallium nitride) or Ga-As (gallium-arsenide) to form a plurality of layers, p-layers and n-layers. In the example shown in FIG. 1 and the like, the interface between the p layer and the n layer is located on the side surface of the block-shaped light emitting element 1, and light is emitted from this portion. That is, the side surface of the light emitting element 1 can be regarded as a light emitting surface. The light emitting device 1 is not limited to the above-mentioned material, and may contain a compound semiconductor material appropriately selected from Al-Ga-As, In-Ga-Al-P, In-Ga-N, ZnO and the like.

The laser beam L emitted from the light emitting element 1 is not limited to visible light (for example, purple to blue or red), and may be ultraviolet rays or infrared rays. Further, the laser beam L may be pulsed light. For example, if the optical device 10 and the optical module 20 measure the distance to the object to be detected E, a light emitting element 1 that emits modulated pulsed light is used. The selection of these laser beams L can be appropriately determined according to conditions such as the use, function, type and quantity of the object E to be detected, and economic efficiency of the optical device 10 and the optical module 20.

The light emitting element 1 is joined to and fixed to the inner surface of the recess 4a (in the example of FIG. 1, a stepped portion 4c located on the inner surface of the recess 4a) with a first bonding material such as a gold-tin brazing material. .. The surface (upper surface of the step portion) to which the light emitting element 1 of the stepped portion 4c is fixed is a horizontal surface in FIG. 1 and is parallel to the opening portion 4b. Since it is such a mounting position, the height position of the laser beam L radiated from the side surface of the light emitting element 1 can be separated upward from the bottom surface of the recess 4a. Further, the height position of the laser beam L can be adjusted to substantially the center of the height position of the reflecting surface 2a of the reflector 2, which will be described later.

The MEMS element 2 has a fine circuit conductor and a mechanically movable mechanism formed on the surface of a semiconductor substrate such as a silicon substrate. The MEMS element in the example of this embodiment has the above-mentioned movable reflecting surface 2a as a mechanically movable mechanism. The movable reflective surface 2a faces the light emitting element 1. That is, the MEMS element 2 has a movable reflection surface 2a located facing the light emitting element 1 and constitutes a part of the light emitting unit A.

The movable reflective surface 2a is a micromirror manufactured by applying the medical technique for forming a semiconductor integrated circuit. A micromirror is arranged on the upper surface of the MEMS element 2. The micromirror is held by a biaxial holding portion, a so-called beam, provided on the semiconductor substrate, and can be tilted according to the tilt of the shaft. In the micromirror, the reflection surface can move (change the reflection angle) as described above according to information such as an electric signal transmitted via a circuit conductor located on the upper surface of the MEMS element 2 or the like. That is, the incident laser beam L can be reflected by changing the reflection angle with time. In other words, the MEMS element 2 makes it possible to radiate the laser beam L so as to scan the outside of the optical device 10 at a wide angle.

The MEMS element 2 can be manufactured by applying a microfabrication technique such as a photolithography to an exposed surface such as the upper surface of a semiconductor substrate such as a silicon substrate as described above to form an integrated circuit. Further, the MEMS element 2 may be joined and fixed to the inner surface of the recess 4a (inclined inner surface in the example of FIG. 1) by the second joining material having a lower joining temperature than the first joining material. In this case, since the first joining material is not melted at the time of joining with the second joining material, misalignment of the previously fixed light emitting element 1 is unlikely to occur. That is, it is effective for improving the position accuracy of the light emitting unit A. Examples of the second bonding material include a bonding material in which metal submicron level fine particles (so-called nanoparticles) are mixed with an organic binder.

As described above, the laser beam L that has reached the MEMS element 2 from the light emitting element 1 is reflected by the movable reflecting surface 2a and radiated to the outside of the optical device 10 and the light emitting module 20. Since the radiation angle of the emitted laser light L changes with time as described above, the outside can be scanned by the laser light L to obtain the reflected light R including information on the object to be detected E. ..

The MEMS element 2 also has a function of reflecting the reflected light R reflected by the object to be detected E again and causing the light receiving element 3 located in the same recess 4a to receive the reflected light R. .. That is, the reflected light R from the outside is specularly reflected by the movable reflecting surface 2a and received by the light receiving element 3. Also in this case, since the reflecting surface of the MEMS element 2 is movable, the reflected light R returning at different angles can be reflected in the direction of the light receiving element 3 at any time. Therefore, the MEMS element 2 also has a function of assisting the light receiving function of the light receiving unit B, which will be described later.

For example, when the optical device 10 is used for the purpose of assisting automatic driving of an automobile (detection of pedestrians and vehicles, distance measurement, etc.), the angle of incidence of the laser beam L on the lid 5 (that is, radiation to the outside). Angle) is set to about 30 degrees. In this case, the incident angle is set to be in the range of about 30 degrees on both sides of the optical axis of the laser beam L.

As described above, in the optical device 10 of the embodiment, the light emitting unit A and the light receiving unit B are located in the same recess 4a. The light receiving unit B has a light receiving element 3 that receives the reflected light R and converts it into an electric signal. The light receiving surface 3a of the light receiving element 3 is located facing the movable reflecting surface 2a and is inclined with respect to the movable reflecting surface 2a. That is, for example, as shown in FIG. 6, when the reflected light R incident on the recess 4a from the outside is specularly reflected by the movable reflecting surface 2a, the specularly reflected reflected light R advances in the direction of the light receiving surface 3a. , The light receiving surface 3a can efficiently receive light.

In other words, the movable reflective surface 2a, the light receiving surface, and 3a are positioned at the same angle (for example, both 45 degrees) with respect to the direction orthogonal to the opening 4b, and effectively reflect the reflected light R. And it is arranged so that it can receive light. The angle of incidence of the reflected light R with respect to the light receiving surface 3a can be arbitrarily set. If the light receiving surface 3a is located within the reach of the reflected light R, the reflected light R can be received by the light receiving surface 3a.

The movable reflection surface 2a and the light receiving surface 3a may be tilted at an angle other than 45 degrees with respect to the direction orthogonal to the opening 4b, or may be tilted at different angles from each other. For example, the inclination of the light receiving surface 3a may be smaller than 45 degrees with respect to the direction orthogonal to the opening 4b (that is, it is closer to perpendicular to the opening of the recess 4a and the inclination is small). As a result, the optical device 10 can be miniaturized in a plan view. Further, the inclination of the movable reflecting surface 2a may be reduced so that the incident angle of the laser beam L emitted from the light emitting element 1 is close to 90 degrees. As a result, it is possible to improve the utilization efficiency of the laser beam L to make it easier to detect the object to be detected E, and to make the optical device 10 effective for reducing power consumption and the like.

The light receiving element 3 is, for example, a photodiode, and has a function of converting light (reflected light R) incident on the light receiving surface 3a into an electric signal. This light is emitted by the light emitting element 1, and is not limited to visible light (for example, purple to blue or red), and may be ultraviolet rays or infrared rays. The reflected light R is, for example, pulsed light, like the laser light L. The light receiving element 3 is made of a compound semiconductor material such as Si (silicon), InGaAs (indium-gallium-arsenide), GaN (gallium nitride) or ZnO (zinc oxide). In the example shown in FIG. 1 and the like, the light receiving surface 3a is located on the upper surface of the plate-shaped compounded semiconductor material.

In the example shown in FIG. 1, since the stepped portion 4c is located in the central portion in the height direction in the recess 4a, the light receiving elements 3 are arranged above and below the stepped portion 4c. .. As a result, the light emitting element 1 is positioned so as to face the central portion of the movable reflective surface 2a, and light can be received in a wide range in the vertical direction. Therefore, it is possible to radiate the laser beam L from the light emitting element 1 to the outside through the movable reflecting surface 2a and to receive the reflected light R from the outside in a relatively wide range, and the external object E to be detected is effective. It can be an optical device 10 that can be detected.

The container portion C has a function of aligning and fixing the light emitting portion A and the light receiving portion B with each other. Further, the container portion C has a function of protecting the light emitting portion A and the light receiving portion B from an external environment such as the atmosphere. The container portion C includes a substrate 4 having at least one recess 4a and a lid 5 for closing the recess 4a. As described above, the movable reflection surface 2a and the opening 4b overlap each other in a plan view. Further, the positioning portion 6 of the light emitting portion A and the light receiving portion B is provided on the inner surface of the substrate 1 in the recess 4a. The light emitting element 1, the MEMS element 2, and the light receiving element 3 are positioned and fixed in the vicinity of the positioning unit 6.

The substrate 4 has a pair of inner surfaces facing each other in order to enable the arrangement of the light emitting element 1, the MEMS element 2, and the light receiving element 3 as described above. The pair of inner surfaces are tilted from each other. The angle of inclination is, for example, the same angle with respect to the direction perpendicularly incident on the opening 4b of the recess 4a as described above, and is set to 45 degrees or the like. That is, the substrate 4 has a pair of inner side surfaces facing each other, each having a recess 4a inclined outward from the lower part to the upper part of each inner side surface.

In other words, the recesses 4a have a first inner side surface 41 and a second inner side surface 42 that face each other and are inclined outward from the lower part to the upper part, and the light emitting element 1 and the light receiving light are received on the first inner side surface 41. The element 3 is located, and the MEMS element 2 is located on the second inner side surface 42. With such a configuration, the laser light L is radiated from the light emitting unit A to the outside and the reflected light R returned from the outside into the recess 4a is efficiently received by the light receiving unit B.

The inner surface of the recess 4a, such as the inner surface, is different from the above as long as the movable reflection surface 2a and the opening 4b can overlap each other (that is, the laser beam L can be emitted to the outside). It may be in the form. For example, a part of the bottom surface of the recess 4a may be inclined in the direction of the movable reflection surface 2a, and the light emitting element 1 may be mounted on the inclined portion. That is, the stepped portion 4 may be omitted. Further, only one light receiving element 3 may be arranged on the inner surface of the recess 4a, or the inner surface on which the light receiving element 3 is located may be a surface that does not include an inclined surface.

As described above, the substrate 4 has a recess 4a, and has a function as a container body for accommodating the light emitting portion A in the recess 4a. The substrate 4 is formed of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride material sintered body, a silicon nitride material sintered body, a mullite material sintered body, or a glass ceramic sintered body. The substrate 4 can be manufactured as follows, for example, if it is made of an aluminum oxide sintered body. first. Raw material powders such as aluminum oxide, silicon oxide and calcium oxide are kneaded with a suitable organic solvent and binder to prepare a slurry. Next, this slurry is formed into a sheet by a method such as a doctor blade method, and then cut into a predetermined shape (a shape having an opening to be a recess 4a, etc.) and dimensions to prepare a plurality of sheets. After that, the substrate 1 can be manufactured by laminating these sheets and firing them.

In this case, the size of the opening to be the recess 4a can be gradually increased from the lower layer to the upper layer at the time of laminating to form the recess 4a having a stepped inner side surface. If this stepped portion is filled with, for example, a ceramic paste having the same composition as the above slurry (those having a relatively high viscosity), it can be processed into an inclined inner side surface. The stepped portion can be left as the stepped portion 4c without being filled with the ceramic paste.

Further, the substrate 4 can also be manufactured by a method of molding the above-mentioned ceramic raw material into a predetermined shape of the substrate 4 by a method such as press working and firing. Further, the substrate 4 can also be manufactured by a method in which the above-mentioned sheet is embossed, formed into a predetermined substrate 4 shape, and fired. Further, the substrate 4 may be made of an organic resin such as an epoxy resin. In this case, the substrate 4 can be manufactured by a method in which a resin material such as an uncured epoxy resin is molded into a predetermined shape by means such as a molding die and then heat-cured. In such a mold at the time of molding, if a stepped portion corresponding to the stepped portion 4c is provided, it can be an inner surface surface (first inner side surface 41 or the like) having the stepped portion 4c.

The substrate 4 has a wiring conductor (not shown) for supplying electric power and electric signals necessary for operation such as supply of electric power to the light emitting element 10 and inclination of the movable reflective surface 2a (micromirror) of the MEMS element 2. It may be arranged. Wiring conductors are provided in a predetermined pattern at predetermined positions such as the surface (inner surface of the recess 4a) located in the recess 4a and the inside of the substrate 4 in the substrate 4. The wiring conductor may include a through conductor (so-called via conductor or the like) that penetrates at least a part of the substrate 4 in the thickness direction.

As an example of the wiring conductor, those located from the inner surface such as the inner surface of the recess 4a to the outer surface such as the lower surface or the outer surface of the substrate 4 can be mentioned. The light emitting element 1 and the light receiving element 3 are electrically connected to a portion of the wiring conductor located on the first inner side surface 41 of the recess 4a by a conductive connecting material such as a bonding wire or solder. As a result, the light emitting element 1, the MEMS element 2, and the light receiving element 3 can be electrically connected to each other via the wiring conductor in the external electric circuit.

Further, in the example shown in FIG. 4, the substrate 4 has another recess 4d. When an electronic component 7 such as a capacitive element, a resistor or an inductor element is mounted in the other recess 4d, any one of the light emitting element 1, the MEMS element 2 and the light receiving element 3 and the electronic component 7 are connected to the wiring conductor. Some parts may be electrically connected.

The wiring conductor can be formed of, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, titanium, nickel and cobalt, or a metal material of an alloy containing these as a main component. Further, the wiring conductor can be formed in various forms such as a metallized layer, a plating layer and a thin film layer. If the wiring conductor is made of a tungsten metallized layer, for example, a method of printing a metal paste prepared by kneading tungsten powder with an organic solvent and a binder on a predetermined portion of a sheet to be a substrate 4 and firing it. Can be formed with. The exposed surface of the metallized layer may be covered with a plating layer such as nickel and gold.

The lid 5 has a function of closing the recess 4a and airtightly sealing the light emitting portion A and the light receiving portion B. Further, the lid body 5 emits the laser beam L from the light emitting portion A to the outside and the reflected light R returned from the object to be detected E is incident on the recess 4a while enabling such airtight sealing. It is made of a material capable of transmitting the laser beam L so that the laser beam L can be transmitted. In the examples shown in FIGS. 1 to 4, the lid 5 is formed of a translucent glass material. In FIGS. 1 to 4, the lid 5 made of a translucent material is not hatched.

The lid 5 may be provided with an optical film such as an anti-reflective film (AR: Anti-reflective_coating) on the upper surface or the lower surface thereof. The antireflection film is, for example, a dielectric multilayer thin film including a SiO ₂ film, a TiO ₂ film, and a Ta ₂ O ₅ film sequentially laminated on the lower surface of the lid 5. The antireflection film can effectively prevent the laser beam L emitted from the light emitting unit A to the outside from being reflected by the lid 5. If the antireflection film in this case is located on the side of the lid on which the laser beam L is incident (the concave portion 4a side and the lower surface), the above effect can be obtained more reliably.

As described above, the positioning unit 6 included in the container unit C has a function of facilitating and highly accurate positioning of the light emitting unit A and the light receiving unit B in the container unit C. Examples of the positioning portion 6 include marks 6a and convex portions 6b located on the inner side surface and the bottom surface of the concave portion 4a, as in the examples shown in FIGS. 1 and 2.

The mark 6a is, for example, a metal layer, and can be provided on the inner surface of the recess 4a in the form of a metallized layer, a plating layer, a metal foil, a thin film layer, or the like. The positioning portion 6 is not limited to these examples, and may be a protruding portion or a combination of a plurality of types.

The mark 6a located on the second inner side surface 42 indicates a position corresponding to two corners (upper end side of the inclined inner side surface) of the mounting range of the MEMS element 2 to be mounted. By aligning the two corners of the MEMS element 2 with the position of the mark 6a, the MEMS element 2 can be mounted at a predetermined position on the bottom surface of the recess 4a. Further, among the marks 6a, those located on the upper surface of the stepped portion 4c indicate the positions corresponding to the two corner portions of the mounted light emitting element 1. As in the case of the MEMS element 2, the light emitting element 1 can be positioned in the recess 4a by aligning the two corners of the light emitting element 1 with the mark 6a. As described above, the light emitting element 1 and the MEMS element 2 can be mounted with the mark 6a as a reference and fixed at a predetermined position by the joining material or the like.

Further, in the optical device 10 of the embodiment, the positioning portion 6 includes a convex portion 6b in contact with the lower end portions of the MEMS element 2 and the light receiving element 3. An example of the convex portion 6b is shown as an enlarged schematic diagram of FIG. In the form in which the positioning portion 6 includes the convex portion 6b, the inner surface of the concave portion 4a includes the first inner side surface 41 and the second inner side surface 42 inclined as described above. An example of the convex portion 6b is shown as an enlarged schematic diagram of FIG.

When the MEMS element 2 and the light receiving element 3 are mounted on the inclined inner surface surface and joined, the convex portion 6b suppresses the MEMS element 2 and the light receiving element 3 from slipping off. The convex portion 6b is formed of, for example, the same material as the substrate 4. For example, when the substrate 4 is made of an aluminum oxide sintered body, the convex portion 6b can be formed as follows. First, a powder of a ceramic material such as aluminum oxide similar to that forming the substrate 4 is kneaded with an organic solvent and a binder to prepare a paste. Then, this paste is applied to a predetermined shape and position of the convex portion 6b and simultaneously fired with the green sheet to be the substrate 4. By the above steps, the convex portion 6b can be formed.

According to such an optical device 10, the need to align and set and fix the light emitting unit A and the light receiving unit B with each other is effectively reduced. Therefore, it is easy to reduce the labor and parts required for alignment. Therefore, it is possible to provide an optical device 10 that is effective in reducing the number of parts and improving the workability of alignment between parts.

In the modified example optical device 10 shown in FIG. 4, the lid 5 has a light-shielding portion 5a in a region overlapping the light-receiving element 3 in a plan view. The light-shielding portion 5a is made of a material (light-shielding material) having a transmittance of, for example, laser light L and reflected light R of about 10% or less (including 0%) at an incident angle of about 45 to 90 degrees. Examples of such a material include various organic resin films to which a light-shielding material such as carbon is added, a ceramic material to which a pigment such as molybdenum oxide is added, and a metal material. Further, the light-shielding portion 5a may be a glass material similar to the lid 5, which may be processed to reduce the transmittance by adding a pigment such as a metal oxide or roughening the surface. The light-shielding portion 5a made of such a light-shielding material can be bonded to the lid 5 with, for example, a resin adhesive or a bonding material such as glass.

In the optical device 10 of the modified example shown in FIG. 5, the lid 5 is located in the frame of the frame-shaped light-shielding portion 5a. In this case, it can be considered that the translucent main body is held by the light-shielding frame material to form the combined type lid 5A. In this example, the light-shielding portion 5a of the combined type lid 5A is actually joined to the substrate 4 to close the recess 4a. The frame-shaped light-shielding portion 5a is formed of, for example, a material having relatively high mechanical strength and rigidity, such as a ceramic material or a metal material, among the above-mentioned light-shielding materials.

When the optical device 10 includes a light-shielding portion 5a as shown in FIGS. 4 and 5, the possibility that the light receiving element 3 receives light from the outside other than the reflected light R is effectively reduced. Can be done. That is, it is possible to obtain an optical device 10 having high detection accuracy, in which the possibility of erroneously detecting the presence or absence of the object to be detected E is reduced. Therefore, for example, when the optical device 10 is used in an application for supporting the automatic driving of an automobile, the driving safety can be improved.

The present invention is not limited to the examples of the above embodiments, and various modifications can be made within the scope of the gist of the present invention. For example, as in the example shown in FIG. 7, a plurality of optical devices 10A in which a plurality of optical devices 10 are arranged side by side may be used. FIG. 7 is a plan view showing the optical device 10A of another embodiment of the present invention. In FIG. 7, the same parts as those in FIGS. 1 to 6 are designated by the same reference numerals. In this case as well, since the light emitting portion A and the light receiving portion B are located in the same recess 4 in each of the two recesses, the number of parts is reduced and the positional accuracy between the light emitting portion A and the light receiving portion B is improved. The effect of can be obtained.

Further, in this case, for example, it is possible to detect the object to be detected by the laser beam in each pair of the light emitting unit A and the light receiving unit B, which is advantageous for improving the detection accuracy and the like. Further, it is also possible to increase the degree of freedom in dealing with various objects to be detected or the external environment (day / night, weather, etc.) by making the wavelengths of light such as laser light emitted by each light emitting element 1 different from each other. ..

1 ... Light emitting element 2 ... MEMS element 2a ... Movable reflective surface 3 ... Light receiving element 4 ... Base
41 ... 1st inner surface
42 ... 2nd inner side surface 4a ... recess 4b ... opening 4c ... stepped portion 4d ... other recesses 5, 5A ... lid 5a ... light-shielding portion 6 ...・ Positioning part 6a ・ ・ ・ Mark 6b ・ ・ ・ Convex part
10 ・ ・ ・ Optical equipment
10A ... Multiple optical devices A ... Light emitting part B ... Light receiving part C ... Container part

Claims (4)

A light emitting unit including a laser light emitting element and a MEMS element having a movable reflecting surface located facing the light emitting element, and a light emitting unit.
A light receiving unit including a light receiving element that is located facing the movable reflecting surface and has a light receiving surface that is inclined with respect to the movable reflecting surface.
A substrate having at least one recess in which the movable reflective surface and the opening overlap in a plan view and a lid for closing the recess are included, and the light emitting portion and the light receiving portion are formed on the inner surface of the substrate in the recess. It has a positioning unit, and is provided with a container unit in which the light emitting element, the MEMS element, and the light receiving element are positioned and fixed in the vicinity of the positioning unit .
The recesses have a first inner side surface and a second inner side surface that face each other and are inclined outward from the lower part to the upper part.
An optical device in which the light emitting element and the light receiving element are located on the first inner surface surface, and the MEMS element is located on the second inner surface surface . The first inner surface has a stepped portion between the lower part and the upper part of the first inner surface.
The optical device according to claim 1 , wherein the light emitting element is located in the stepped portion. The optical device according to claim 1 or 2 , wherein the positioning portion includes a convex portion in contact with the lower end portion of the MEMS element and the light receiving element. The optical device according to any one of claims 1 to 3 , wherein the lid has a light-shielding portion in a region where the lid body overlaps with the light-receiving element in a plan view.

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