JP7034635B2 - Manufacturing method of detector module, radiation detector, X-ray computed tomography equipment and radiation detector - Google Patents

Description

An embodiment of the present invention relates to a detector module, a radiation detector, an X-ray computed tomography apparatus, and a method for manufacturing a radiation detector.

In the X-ray detector of the X-ray computed tomography apparatus, the photodiode chip is becoming more multifunctional and thinner. However, as the number of functions of the photodiode chip increases, the number of wires increases, and the wiring load of the control board of the X-ray detector and the wiring board that relays the control board and the photodiode chip increases.

Japanese Unexamined Patent Publication No. 2006-150079 Japanese Unexamined Patent Publication No. 2006-296856

The problem to be solved by the invention is to reduce the wiring load in the radiation detector.

The detector module according to the present embodiment is a photodiode having a scintillator that converts radiation into visible light and a photodiode that is connected to the back surface of the scintillator via an adhesive sheet and converts light from the scintillator into an electrical signal. The chip, the support board connected to the back surface of the photodiode chip, the wiring board connected to the back surface of the support board, and the back surface portion of the wiring board facing the connection surface of the support board are connected to each other. A fixing component having screw holes arranged perpendicular to the back surface portion is provided.

FIG. 1 is a diagram showing a configuration of an X-ray computed tomography apparatus according to the present embodiment. FIG. 2 is a schematic plan view of the X-ray detector of FIG. FIG. 3 is a perspective view of the single detector module of FIG. FIG. 4 is a diagram showing a 4-4'cross section of FIG. FIG. 5 is a schematic plan view of the single detector pack of FIG. FIG. 6 is a diagram showing a 6-6'cross section of FIG. FIG. 7 is a perspective view of the detector pack of FIG. FIG. 8 is a schematic plan view of the support plates of FIGS. 5, 6 and 7. 9 is a diagram showing an example of the shape of the support plate of FIGS. 6 and 7, and is a diagram showing a screwed detector module and the support plate. FIG. 10 is a diagram showing a vertical cross section of the fixed component of FIG. FIG. 11 is a diagram showing a cross section of the fixed component of FIG. FIG. 12 is a diagram showing an example of a manufacturing process of a fixed part according to the present embodiment. FIG. 13 is a diagram showing a vertical cross section of a non-lead component type fixed component according to the present embodiment. FIG. 14 is a diagram showing a manufacturing process of the detector module according to the present embodiment. FIG. 15 is a diagram showing a manufacturing process of the X-ray detector according to the present embodiment.

Hereinafter, a method of manufacturing a detector module, a radiation detector, an X-ray computed tomography apparatus, and a radiation detector according to the present embodiment will be described with reference to the drawings.

The radiation detector according to the present embodiment can be applied to a detector that detects arbitrary radiation such as X-rays and gamma rays. Hereinafter, the radiation detector according to the present embodiment is assumed to be an X-ray detector mounted by an X-ray computed tomography apparatus.

FIG. 1 is a diagram showing a configuration of an X-ray computed tomography apparatus 1 according to the present embodiment. The X-ray computed tomography apparatus 1 irradiates the subject P with X-rays from the X-ray tube 11, and detects the irradiated X-rays with the X-ray detector 12. The X-ray computed tomography apparatus 1 generates a CT image of the subject P based on the output from the X-ray detector 12.

As shown in FIG. 1, the X-ray computed tomography apparatus 1 has a gantry 10, a sleeper 30, and a console 40. The gantry 10 is a scanning device having a configuration for X-ray CT imaging of the subject P. The sleeper 30 is a transport device for placing the subject P, which is the target of X-ray CT imaging, and positioning the subject P. The console 40 is a computer that controls the gantry 10. For example, the gantry 10 and the sleeper 30 are installed in the CT examination room, and the console 40 is installed in the control room adjacent to the CT examination room. The gantry 10, the sleeper 30, and the console 40 are connected by wire or wirelessly so as to be able to communicate with each other. The console 40 does not necessarily have to be installed in the control room. For example, the console 40 may be installed in the same room together with the gantry 10 and the bed 30. Further, the console 40 may be incorporated in the gantry 10.

As shown in FIG. 1, the gantry 10 includes an X-ray tube 11, an X-ray detector 12, a rotating frame 13, an X-ray high voltage device 14, a control device 15, a wedge 16, a collimator 17, and a data acquisition circuit (DAS: Data). Acquisition System) 18.

The X-ray tube 11 irradiates the subject P with X-rays. Specifically, the X-ray tube 11 includes a cathode that generates thermions, an anode that receives thermions flying from the cathode and generates X-rays, and a vacuum tube that holds the cathode and the anode. The X-ray tube 11 is connected to the X-ray high voltage device 14 via a high voltage cable. A tube voltage is applied between the cathode and the anode by the X-ray high voltage device 14. Thermions fly from the cathode to the anode by applying the tube voltage. Tube current flows as thermions fly from the cathode to the anode. By applying a high voltage from the X-ray high voltage device 14 and supplying a filament current, thermions fly from the cathode toward the anode, and the thermions collide with the anode to generate X-rays.

The X-ray detector 12 detects the X-rays irradiated from the X-ray tube 11 and passed through the subject P, and outputs an electric signal corresponding to the detected X-ray dose to the DAS 18. The X-ray detector 12 has a structure in which a plurality of X-ray detection element sequences in which a plurality of X-ray detection elements are arranged in the channel direction are arranged in a slice direction (column direction). The X-ray detector 12 is an indirect conversion type detector having, for example, a grid, a scintillator array, and an optical sensor array. The scintillator array has a plurality of scintillators. The scintillator outputs an amount of light corresponding to the incident X dose. The grid is arranged on the X-ray incident surface side of the scintillator array and has an X-ray shielding plate that absorbs scattered X-rays. The optical sensor array converts an electric signal according to the amount of light from the scintillator. As the optical sensor, for example, a photodiode is used.

The rotating frame 13 is an annular frame that rotatably supports the X-ray tube 11 and the X-ray detector 12 around the rotation axis Z. Specifically, the rotating frame 13 supports the X-ray tube 11 and the X-ray detector 12 so as to face each other. The rotating frame 13 is rotatably supported around a rotation axis Z by a fixed frame (not shown). The rotation frame 13 is rotated around the rotation axis Z by the control device 15, so that the X-ray tube 11 and the X-ray detector 12 are rotated around the rotation axis Z. The rotating frame 13 receives power from the drive mechanism of the control device 15 and rotates at a constant angular velocity around the rotation axis Z. An image field of view (FOV) is set in the opening 19 of the rotating frame 13.

In the present embodiment, the rotation axis of the rotation frame 13 in the non-tilt state or the longitudinal direction of the top plate 33 of the bed 30 is orthogonal to the Z-axis direction and the Z-axis direction, and the axial direction horizontal to the floor surface is X. The axial direction orthogonal to the axial direction and the Z-axis direction and perpendicular to the floor surface is defined as the Y-axis direction.

The X-ray high voltage device 14 has an electric circuit such as a transformer and a rectifier, and is a high voltage generator that generates a high voltage applied to the X-ray tube 11 and a filament current supplied to the X-ray tube 11. It also has an X-ray control device that controls an output voltage according to the X-rays emitted by the X-ray tube 11. The high voltage generator may be a transformer type or an inverter type. The X-ray high voltage device 14 may be provided on the rotating frame 13 in the gantry 10 or on a fixed frame (not shown) in the gantry 10.

The wedge 16 regulates the dose of X-rays applied to the subject P. Specifically, the wedge 16 attenuates X-rays so that the dose of X-rays radiated from the X-ray tube 11 to the subject P has a predetermined distribution. For example, as the wedge 16, a metal plate such as aluminum such as a wedge filter or a bow-tie filter is used.

The collimator 17 limits the irradiation range of X-rays transmitted through the wedge 16. The collimator 17 slidably supports a plurality of lead plates that shield X-rays, and adjusts the form of a slit formed by the plurality of lead plates.

The DAS 18 reads an electric signal corresponding to the dose of X-rays detected by the X-ray detector 12 from the X-ray detector 12, amplifies the read electric signal, and integrates the electric signal over a view period. Collect detection data with digital values depending on the dose of X-rays over the view period. The detected data is called projection data. The DAS 18 is realized by, for example, an application specific integrated circuit (ASIC) equipped with a circuit element capable of generating projection data. The projection data is transmitted to the console 40 via a non-contact data transmission device or the like.

The control device 35 controls the X-ray high voltage device 14 and the DAS 18 in order to execute X-ray CT imaging according to the image pickup control function 441 of the processing circuit 44 of the console 40. The control device 15 has a processing circuit having a CPU (Central Processing Unit) or an MPU (Micro Processing Unit), and a drive mechanism such as a motor and an actuator. The processing circuit has a processor such as a CPU and a memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory) as hardware resources. Further, the control device 15 includes an ASIC, a field programmable gate array (FPGA), another complex programmable logic device (CPLD), and a simple programmable logic device (Simple Programmable Logic Device: CPLD). It may be realized by SPLD).

The sleeper 30 includes a base 31, a support frame 32, a top plate 33, and a sleeper drive device 34. The base 31 is installed on the floor. The base 31 is a housing that supports the support frame 32 so as to be movable in the direction perpendicular to the floor surface (Y-axis direction). The support frame 32 is a frame provided on the upper part of the base 31. The support frame 32 slidably supports the top plate 33 along the central axis Z. The top plate 33 is a plate having flexibility on which the subject P is placed.

The sleeper drive device 34 is housed in the housing of the sleeper 30. The sleeper drive device 34 is a motor or an actuator that generates power for moving the support frame 32 on which the subject P is placed and the top plate 33. The sleeper drive device 34 operates according to the control of the console 40 or the like.

The console 40 has a memory 41, a display 42, an input interface 43, and a processing circuit 44. Data communication between the memory 41, the display 42, the input interface 43, and the processing circuit 44 is performed via a bus (BUS).

The memory 41 is a storage device such as an HDD (Hard Disk Drive), an SSD (Solid State Drive), or an integrated circuit storage device that stores various information. The memory 41 stores, for example, projection data and reconstructed image data. In addition to HDDs and SSDs, the memory 41 is located between a portable storage medium such as a CD (Compact Disc), a DVD (Digital Versatile Disc), and a flash memory, and a semiconductor memory element such as a RAM (Random Access Memory). It may be a drive device that reads and writes various information. Further, the storage area of the memory 41 may be in the X-ray CT device 1 or in an external storage device connected by a network.

The display 42 displays various information. For example, the display 42 outputs a medical image (CT image) generated by the processing circuit 44, a GUI (Graphical User Interface) for receiving various operations from the operator, and the like. For example, the display 42 may be, for example, a liquid crystal display (LCD), a CRT (Cathode Ray Tube) display, an organic EL display (OELD), a plasma display, or any other display. , Can be used.

The input interface 43 receives various input operations from the operator, converts the received input operations into electric signals, and outputs the received input operations to the processing circuit 44. As the input interface 43, for example, a mouse, a keyboard, a trackball, a switch, a button, a joystick, a touch pad, a touch panel display, and the like can be appropriately used. In the present embodiment, the input interface 43 is not limited to the one provided with physical operation parts such as a mouse, a keyboard, a trackball, a switch, a button, a joystick, a touch pad, and a touch panel display. For example, an example of the input interface 43 includes an electric signal processing circuit that receives an electric signal corresponding to an input operation from an external input device provided separately from the device and outputs the electric signal to the processing circuit 44. ..

The processing circuit 44 controls the operation of the entire X-ray computed tomography apparatus 1 according to the electric signal of the input operation output from the input interface 43. For example, the processing circuit 44 has a processor such as a CPU, MPU, and GPU (Graphics Processing Unit) and a memory such as a ROM or RAM as hardware resources. The processing circuit 44 executes an image pickup control function 441, a preprocessing function 442, a reconstruction processing function 443, an image processing function 444, and the like by a processor that executes a program expanded in a memory. It should be noted that each function 441 to 444 is not limited to the case where it is realized by a single processing circuit. A processing circuit may be formed by combining a plurality of independent processors, and each processor may execute a program to realize each function 441 to 444.

In the image pickup control function 441, the processing circuit 44 controls the X-ray high voltage device 14, the control device 15, and the DAS 18 for performing X-ray CT imaging.

In the pre-processing function 442, the processing circuit 44 performs pre-processing such as logarithmic conversion processing, offset correction processing, sensitivity correction processing between channels, and beam hardening correction on the projection data output from the DAS 18.

In the reconstruction processing function 443, the processing circuit 44 performs reconstruction processing using the filter correction back projection method, the successive approximation reconstruction method, etc. on the projection data after the preprocessing by the preprocessing function 442, and obtains CT image data. Generate.

In the image processing function 444, the processing circuit 44 converts the CT image data generated by the reconstruction processing function 443 based on the input operation received from the operator via the input interface 43 into tomographic image data of an arbitrary cross section or three-dimensional. Convert to image data.

Next, the details of the X-ray detector 12 according to the present embodiment will be described.

FIG. 2 is a schematic plan view of the X-ray detector 12. As shown in FIG. 2, the X-ray detector 12 has a plurality of detector packs 121 that are densely arranged with respect to the channel direction. Each detector pack 121 is individually and detachably provided with respect to the X-ray detector 12. The detector pack 121 has a plurality of detector modules 122 that are densely arranged in the channel direction and the column direction.

Each detector module 122 is individually and detachably provided with respect to the detector pack 121. The number of detector packs 121 mounted on the X-ray detector 12 and the number of detector modules 122 mounted on the detector pack 121 are not particularly limited. For example, the detector pack 121 includes 4 rows x 20 columns = 80 detector modules tiled in the channel and column directions. For example, assuming that the number of channels of the detector module 122 is 6 and the number of rows of the X-ray detection element is 16, the number of output channels of the single detector module 122 is 96 channels. In this case, in the single detector pack 121, the number of columns of the single X-ray detector 12 is 320, and the number of output channels is 24 channels × 320 columns = 7,680 channels. When the number of columns of the single X-ray detector 12 is 80, the number of output channels is 24 channels × 80 columns = 1,920 channels.

FIG. 3 is a perspective view of a single detector module 122, and FIG. 4 is a diagram showing a 4-4'cross section of FIG. The direction orthogonal to the channel direction and the column direction is referred to as a thickness direction. As shown in FIGS. 3 and 4, the detector module 122 has a scintillator array 51. The scintillator array 51 has a plurality of scintillator crystals 511. The scintillator crystal 511 outputs a light amount corresponding to the dose of X-rays incident from the surface. The photodiode chip 52 is connected to the surface (back surface) of the scintillator array 51 opposite to the X-ray incident surface via the adhesive sheet 512. The photodiode chip 52 is an electronic circuit in which a plurality of photodiodes are coupled. The photodiode converts the light generated in the scintillator crystal 511 into an electric signal having a peak value corresponding to the amount of light of the light. The dimensions of the scintillator array 51 and the photodiode chip 52 in the channel direction and the column direction are designed to be about 6 mm × 16 mm, which is smaller than the conventional large format size (24 mm × 80 mm). A light guide or the like may be provided between the scintillator array 51 and the photodiode chip 52.

As shown in FIGS. 3 and 4, a ceramic substrate 54 is connected to the back surface of the photodiode chip 52 via an adhesive layer 53. The ceramic substrate 54 is a substrate that supports the photodiode chip 52. A flexible wiring board 55 is connected to the back surface of the ceramic substrate 54. The flexible wiring board 55 is a flexible wiring board. The flexible wiring board 55 is formed with wiring for drawing out the signal line formed on the photodiode chip 52. A central portion 551 of the flexible wiring board 55 with respect to the channel direction is arranged on the ceramic substrate 54 so as to be soldered, thermocompression bonded to an ACF (Anisotropic Conductive Film), or connected to a connector. Hereinafter, the central portion 551 is referred to as a connection portion 551. The portion 552 of the flexible wiring board 55 other than the connection portion 551 is bent downward in the thickness direction (the side opposite to the ceramic substrate 54) for tiling of the detector module 122. Hereinafter, the portion of the flexible wiring board 55 other than the connection portion 551 is referred to as an end portion 552.

As shown in FIGS. 3 and 4, in the flexible wiring board 55, a fixing component 57 is connected to a part of the back surface 551B facing the connection surface 551A with the ceramic substrate 54 in the connection portion 551 of the flexible wiring board 55. Will be done. The fixing part 57 has a screw hole 570. The fixing component 57 is connected to the back surface 551B so that the central axis A1 of the screw hole 570 faces perpendicular to the back surface 551B. The fixing part 57 is used for screwing the detector module 122.

The configuration of the detector module 122 is not limited to the structure shown in FIGS. 3 and 4. For example, the detector module 122 may be provided with a control board for controlling the photodiode included in the photodiode chip 52. In the control board, for example, the control board is connected to the tip of the flexible wiring board 55 via a connector. The control board is an electronic circuit on which an ASIC that controls a photodiode is mounted. The flexible wiring board 55 and the control board may be ACF-connected instead of the connector connection.

Further, not only the photodiode but also electronic components for executing some or all functions of the DAS 18 such as an integrated circuit and an A / D converter may be mounted on the photodiode chip 52. Further, the photodiode chip 52 may be equipped with an electronic component that executes a function for a photon counting detector such as a wave height discriminator or a counter circuit. Further, a SiPM having a plurality of APD (Avalanche Photo Diode) cells may be mounted on the photodiode chip 52.

Further, the wiring board connected to the back surface of the ceramic substrate 54 is not limited to the flexible wiring board 55 as long as the signal line of the photodiode chip 52 can be drawn out, and any wiring board may be used. For example, instead of the flexible wiring board 55, a rigid flexible wiring board in which a rigid board and a flexible board are connected, or a multilayer flexible wiring board in which the flexible boards are multi-layered may be used.

FIG. 5 is a schematic plan view of a single detector pack 121, and FIG. 6 is a diagram showing a 6-6'cross section of FIG. FIG. 7 is a perspective view of the detector pack 121 of FIG. In FIG. 7, for the sake of clarity, the flexible wiring board 55 of the detector module 122 in front of the drawing is omitted, and the inside of the fixed component 57 is shown. The support plate 61 is also shown transparent for the sake of clarity.

As shown in FIGS. 5, 6 and 7, a plurality of detector modules 122 included in a single detector pack 121 are supported by a support plate 61. One support plate 61 is provided for one detector pack 121. For example, about 80 detector modules 122 are attached to one support plate 61. In this case, for example, four detector modules 122 in the channel direction and 20 detector modules 122 in the row direction are arranged on the support plate 61. The support plate 61 is made of any material such as ceramics. The plurality of detector modules 122 and the support plate 61 are fixed by screwing the screw 63 into the screw hole 570 of the fixing component 57.

FIG. 8 is a schematic plan view of the support plate 61. As shown in FIG. 8, the support plate 61 is provided with a plurality of through holes 611 and 612 for each of the plurality of detector modules 122. The through hole 611 is provided so that the screw 63 screwed into the screw hole 570 of the fixing component 57 penetrates the support plate 61. The through hole 612 is provided so that the flexible wiring board 55 of the detector module 122 penetrates the support plate 61. Therefore, the through holes 612 are provided at two positions in the channel direction with the through holes 611 interposed therebetween. The plurality of detector modules 122 and the support plate 61 pass a pair of ends 552 of the flexible wiring board 55 through the through hole 612 from the front surface 551A side toward the back surface 551B side, and the fixing component 57 is passed through the through hole 611. The screw 63 is fixed to the screw hole 570 by screwing the screw 63 from the back surface 551B side to the front surface 551A side. Therefore, the through hole 611 in the support plate 61 is formed at a position corresponding to the screw hole 570 of the fixing component 57 of the detector module 122, and the through hole 612 is the end portion 552 of the flexible wiring board 55 of the detector module 122. It is formed at the position corresponding to.

In a state where the detector module 122 and the support plate 61 are fixed, the support plate 61 and the fixing component 57 come into contact with each other. Since the fixed component 57 is attached not to the entire back surface 511B of the connection portion 551 of the flexible wiring board 55 but to a part of the back surface 511B, a gap is provided between the support plate 61 and the non-contact surface of the fixed component 57 of the 511B. May be done. The support plate 61 according to the present embodiment has a shape capable of filling the gap.

FIG. 9 is a diagram showing an example of the shape of the support plate 61, and is a diagram showing a screwed detector module 122 and a support plate 61. As shown in FIG. 9, the shape of the support plate 61 is designed so as to fill the gap between the support plate 61 and the non-contact surface between the support plate 61 and the fixed component 57 of the flexible wiring board 55. More specifically, the shape of the support plate 61 is designed so as to fill the gap formed by the support plate 61, the non-contact surface, and the flexible wiring board 55.

In addition to the fixed component 57, other electronic components or mechanical components may be provided on the back surface of the flexible wiring board 55. In this case, the shape of the support plate 61 is designed so as to fill the void in consideration of the occupied range of the other electronic component or mechanical component.

As shown in FIGS. 6 and 7, the detector module 122 may be provided with a control board 58 for controlling the photodiode included in the photodiode chip 52. The control board 58 is mounted as, for example, an ASIC. In this case, the control board 58 is attached via the ASIC board 71 attached to the flexible wiring board 55. The ASIC board 71 and the flexible wiring board 55 are connected by a connector or ACF. The control board 58 is attached via the connector 59 after passing the end portion of the flexible wiring board 55 through the through hole 612 of the support plate 61 and fixing the detector module 122 and the support plate 61 with screws.

FIG. 10 is a diagram showing a vertical cross section of the fixed component 57 of FIG. FIG. 11 is a diagram showing a cross section of the fixed component 57 of FIG. As shown in FIGS. 10 and 11, the fixing part 57 has a resin part 571 having a ring shape. The resin component 571 may have a cylindrical shape or a square cylinder shape as long as it has a hollow portion. A through-hole tap 572 is inserted into the hollow portion of the resin component 571. The through-hole tap 572 is a metal component having a ring shape. The hollow portion of the through-hole tap 572 is provided in the screw hole 570. That is, on the inner peripheral surface of the through-hole tap 572, a female screw matching the male screw formed on the screw used for screwing the support plate 61 and the detector module 122 is formed. The resin component 571 and the through-hole tap 57 2 are attached so that the central axis of the resin component 571 spatially coincides with the central axis A1 of the through-hole tap 572. A lead frame 573 is provided on the outer peripheral surface of the resin component 571. The lead frame 573 is a thin metal wire for attaching the fixing component 57 to the flexible wiring board 55 by soldering or the like.

FIG. 12 is a diagram showing an example of a manufacturing process of the fixed part 57. As shown in FIG. 12, first, dies 81 and 82 for forming the resin component 571 having an annular shape are prepared. The molds 81 and 82 are composed of, for example, an upper mold 81 and a lower mold 82 divided in the thickness direction. A resin material 574 is poured between the upper mold 81 and the lower mold 82 to form the resin component 571 (step SA1). At this time, the resin material 574 is poured between the upper mold 81 and the lower mold 82 with the thin metal wire (lead frame) 573 sandwiched between the upper mold 81 and the lower mold 82. A resin component 571 to which the lead frame 573 is attached is formed. The lead frame 573 is provided so as to penetrate the resin component 571 from the outer surface on one side to the outer surface on the opposite side.

Next, the through-hole tap 571 generated in advance is inserted into the hollow portion of the resin component 571, so that the through-hole tap 572 is attached to the resin component 571 (step SA2). Then, the lead frame 573 is bent into an L shape so that it can be easily attached to the flexible wiring board, so that the lead frame 573 is formed (step SA3). As a result, the fixed part 57 is completed.

The method for manufacturing the fixed part 57 is an example, and the present embodiment is not limited to this. For example, although the through-hole tap 572 is said to be formed of metal, it may be formed of resin. In this case, the resin through-hole tap and the resin component 571 fitted to the through-hole tap may be formed individually or integrally.

Further, the fixing component 57 is a type provided so that the lead frame 573 projects from the outer periphery of the resin component 571, that is, a lead component type. However, this embodiment is not limited to this. If the fixed component 57 can be attached to the flexible wiring board 55 by a component other than the lead frame 573, the QFP type is not bound. For example, the fixed component 57 according to the present embodiment may be a non-lead component type.

FIG. 13 is a diagram showing a vertical cross section of a non-lead component type fixed component 57'according to the present embodiment. As shown in FIG. 13, the fixing component 57'has a resin component 571 and a through-hole tap 572, similar to the fixing component 57 of FIG. 11 and FIG. An electrode pad 575 is provided on the connection surface of the resin component 571 with the flexible wiring board 55. The electrode pad 575 is connected to the flexible wiring board 55 by soldering or the like.

Next, the manufacturing process of the detector module 122 will be described.

FIG. 14 is a diagram showing a manufacturing process of the detector module 122. As shown in FIG. 14, first, a detector module main body 123 having a scintillator array 51, a photodiode chip 52, a ceramics substrate 54, and a flexible wiring board 55 is manufactured (step SB1). The scintillator array 51 and the photodiode chip 52 are connected via an adhesive sheet 512. As the adhesive sheet 512, for example, OCA (Optically Clear Pressure-sensitive Adhesive) is used. The photodiode chip 52 and the ceramic substrate 54 are connected by, for example, Ag paste printing. The ceramic substrate 54 and the flexible wiring board 55 may be soldered, for example, or may be thermocompression bonded via an anisotropic conductive film (ACF).

Next, the fixing component 57 is attached to the back surface 511B of the adhesive portion 511 of the flexible wiring board 55 of the detector module main body 123 (step SB2). This completes the detector module 122. The installation location of the fixing component 57 is not particularly limited as long as it is the back surface 511B. For example, the fixing component 57 may be a central portion or an end portion of the back surface 511B with respect to the channel direction and the column direction. Further, the number of the fixing parts 57 attached to the back surface 511B may be one or a plurality of two or more. When one fixing component 57 is attached, the cost can be reduced as compared with the case where a plurality of fixed parts 57 are attached. Further, it is possible to secure a space for attaching a component other than the fixed component 57 on the back surface 511B. When a plurality of fixing parts 57 are attached, the detector module 122 can be attached more firmly to the support plate 61 than when one is attached.

A control board may be attached to the detector module 122 via a connector at an end portion.

FIG. 15 is a diagram showing a manufacturing process of the X-ray detector 12. As shown in FIG. 15, first. The detector module 122 is arranged on the support plate 61 (step SC1). Specifically, the detector module 122 is arranged on the support plate 61 so that the central axis of the through hole 611 of the support plate 61 and the central axis of the screw hole 570 of the fixing component 57 coincide with each other. The placement should be done automatically by a machine such as a mounter. Then, a screw 63 is screwed into the screw hole 570 through the through hole 611 by a machine such as a mounter to fix the support plate 61 and the detector module 122 (step SC2). By repeating the steps SC1 and SC2 for each detector module 122, the plurality of detector modules 122 are densely tiled on the support plate 61. The arrangement (step SC1) and the screwing (step SC2) may be performed in order for each detector module 122, or after the arrangement (step SC1) is performed for the plurality of detector modules 122, the said Screwing (step SC2) may be performed on the plurality of detector modules 122. This completes the detector pack 121. Then, the X-ray detector 12 is completed by arranging the plurality of detector packs 121 densely with respect to the channel direction.

As described above, the X-ray detector 12 according to the present embodiment has a plurality of detector packs 121 densely arranged in the channel direction, and each detector pack 121 is densely arranged in the channel direction and the column direction. It has a plurality of detector modules 122. As described above, the X-ray detector 12 according to the present embodiment subdivides the detector pack 121 into smaller detector modules 122. Due to the subdivision into the detector module 122, the photodiode chip 52 also becomes smaller. By downsizing the photodiode chip 52, the number of output channels of each photodiode chip 52 can be reduced. Therefore, the number of wirings formed on the photodiode chip 52 can be reduced, and the wiring load on the control board 58 or the wiring board 55 that relays the control board 58 and the photodiode chip 52 can be reduced. Further, by providing the fixing component 57 in the detector module 122, dense tiling of the detector module 122 can be easily and accurately performed. Therefore, by providing the fixed component 57 in the detector module 122, the small detector module 122 can be realistically mounted on the X-ray detector 12, and the wiring load on the X-ray detector 12 can be reduced. Contribute.

As described above, according to at least one embodiment described above, the wiring load on the radiation detector can be reduced.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and the equivalent scope thereof.

1 ... X-ray computer tomography device, 10 ... gantry, 11 ... X-ray tube, 12 ... X-ray detector (radiation detector), 13 ... rotating frame, 14X-ray high voltage device, 15 ... control device, 16 ... wedge , 17 ... collimeter, 18 ... data acquisition circuit (DAS), 30 ... sleeper, 31 ... base, 32 ... support frame, 33 ... top plate, 34 ... sleeper drive device, 35 ... control device, 40 ... console, 41 ... Memory, 42 ... display, 43 ... input interface, 44 ... processing circuit, 51 ... scintillator array, 52 ... photodiode chip, 53 ... adhesive sheet, 54 ... ceramics substrate, 55 ... flexible wiring board, 57 ... fixed parts, 57' ... Fixed parts, 58 ... Control board, 59 ... Connector, 61 ... Support plate, 71 ... ASIC board, 121 ... Detector pack, 122 ... Detector module, 441 ... Imaging control function, 442 ... Preprocessing function, 443 ... Re Configuration processing function, 444 ... image processing function, 511 ... scintillator crystal, 551 ... connection part, 551A ... front surface, 551B ... back surface, 552 ... end part, 570 ... screw hole, 571 ... resin part, 571 ... through hole tap, 573 ... Metal wire, 575 ... Electrode pad, 611 ... Through hole, 612 ... Through hole.

Claims (11)

A scintillator that converts radiation into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
A fixing component having a screw hole connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicularly to the back surface portion.
Equipped with
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
The fixed parts are
With the metal parts having the screw holes,
The metal part has a resin part attached to the hollow portion.
Detector module. A scintillator that converts radiation into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
A fixing component having a screw hole connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicularly to the back surface portion.
Equipped with
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
The fixed parts are
With the metal parts having the screw holes,
Resin parts with the metal parts attached to the hollow part, and
It has a connecting component provided on the resin component and for connecting the fixing component to the back surface portion.
Detector module. Multiple detector modules arranged two-dimensionally in the channel and column directions ,
A support plate for supporting the plurality of detector modules, and a support plate .
Each of the plurality of detector modules
A scintillator that converts radiation into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
It has a fixing component having screw holes connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicular to the back surface portion.
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
A through hole is formed in the support plate at a position corresponding to the screw hole.
The plurality of detector modules and the support plate are fixed by screwing a screw into the screw hole through the through hole.
Radiation detector. It comprises a plurality of detector modules arranged two-dimensionally in the channel direction and the column direction.
Each of the plurality of detector modules
A scintillator that converts radiation into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
It has a fixing component having screw holes connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicular to the back surface portion.
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
The fixed parts are
With the metal parts having the screw holes,
The metal part has a resin part attached to the hollow portion.
Radiation detector. It comprises a plurality of detector modules arranged two-dimensionally in the channel direction and the column direction.
Each of the plurality of detector modules
A scintillator that converts radiation into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
It has a fixing component having screw holes connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicular to the back surface portion.
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
The fixed parts are
With the metal parts having the screw holes,
Resin parts with the metal parts attached to the hollow part, and
It has a connecting component provided on the resin component and for connecting the fixing component to the back surface portion.
Radiation detector. An X-ray tube that irradiates X-rays and
An X-ray detector for detecting X-rays irradiated from the X-ray tube and transmitted through the subject is provided.
The X-ray detector has a plurality of detector modules arranged two-dimensionally with respect to a channel direction and a column direction, and a support plate for supporting the plurality of detector modules .
Each of the plurality of detector modules
A scintillator that converts X-rays into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
It has a fixing component having screw holes connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicular to the back surface portion .
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
A through hole is formed in the support plate at a position corresponding to the screw hole.
The plurality of detector modules and the support plate are fixed by screwing a screw into the screw hole through the through hole.
X-ray computed tomography equipment. An X-ray tube that irradiates X-rays and
An X-ray detector for detecting X-rays irradiated from the X-ray tube and transmitted through the subject is provided.
The X-ray detector has a plurality of detector modules arranged two-dimensionally in the channel direction and the column direction.
Each of the plurality of detector modules
A scintillator that converts X-rays into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
It has a fixing component having screw holes connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicular to the back surface portion.
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
The fixed parts are
With the metal parts having the screw holes,
The metal part has a resin part attached to the hollow portion.
X-ray computed tomography equipment. An X-ray tube that irradiates X-rays and
An X-ray detector for detecting X-rays irradiated from the X-ray tube and transmitted through the subject is provided.
The X-ray detector has a plurality of detector modules arranged two-dimensionally in the channel direction and the column direction.
Each of the plurality of detector modules
A scintillator that converts X-rays into visible light,
An optical sensor that is connected to the back surface of the scintillator via an adhesive portion and converts light from the scintillator into an electric signal.
A support substrate connected to a surface of the optical sensor opposite to the surface on which the scintillator is arranged,
The wiring board connected to the back surface of the support board and
It has a fixing component having screw holes connected to a back surface portion of the wiring board facing the connection surface with the support substrate and arranged perpendicular to the back surface portion.
The wiring board is connected to the control board that controls the optical sensor via a connector, and is connected to the control board.
The fixed parts are
With the metal parts having the screw holes,
Resin parts with the metal parts attached to the hollow part, and
It has a connecting component provided on the resin component and for connecting the fixing component to the back surface portion.
X-ray computed tomography equipment. A step of manufacturing a fixed part having a step of producing a resin part having a ring shape and a step of inserting a metal part having a screw formed on an inner peripheral surface into a hollow portion of the resin part.
A scintillator, an optical sensor connected to the back surface of the scintillator via an adhesive portion, a support board connected to the back surface of the optical sensor, a wiring board connected to the back surface of the support board, and the wiring board. A step of assembling each of a plurality of detector modules having the fixing component connected so that the screw holes are arranged perpendicular to the back surface portion on the back surface portion facing the connection surface with the support substrate. ,
A step of fixing the plurality of detector modules and a support plate having a through hole formed at a position corresponding to the screw hole by screwing a screw into the screw hole through the through hole.
A method for manufacturing a radiation detector. The assembly process is
A process of assembling a module portion having the scintillator, the optical sensor, the support board, and the wiring board, and
The back surface portion comprises a step of connecting the fixing component so that the screw holes are arranged perpendicular to the back surface portion.
The method for manufacturing a radiation detector according to claim 9 . The assembly process is
A step of connecting the fixing component to the back surface portion so that the screw hole is arranged perpendicular to the back surface portion.
A process of assembling a module portion having the scintillator, the optical sensor, and the support substrate, and
It has a step of connecting the wiring board to which the fixing component is connected to the back surface portion and the module portion.
The method for manufacturing a radiation detector according to claim 9 .

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