JP2015049123A - Detector module manufacturing method, detector module and medical image diagnostic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield.SOLUTION: The detector module manufacturing method is a method to manufacture a detector module. The detector module optically couples a scintillator array which emits light generated by an X-ray and a photodiode array which converts the light generated by the scintillator array into an electrical signal with each other. In the detector module manufacturing method, the photodiode array is adhered to one adhesive face of a transparent adhesive sheet which has an adhesive face on both sides. When the photodiode array is formed of a material having slight flexibility, the scintillator array is adhered to the other adhesive face of the transparent adhesive sheet in a state that the photodiode array protrudes due to warpage.

Description

  Embodiments described herein relate generally to a detector module manufacturing method, a detector module, and a medical image diagnostic apparatus.

  Conventionally, solid-state detectors are mounted on many X-ray computed tomography (CT) apparatuses as detectors that convert the intensity of X-rays that have passed through a subject into electrical signals. The solid state detector is a detector that photoelectrically converts scintillator light emitted from a scintillator by the incidence of X-rays by a photodiode, and is configured by a plurality of detector modules.

  Such a detector module is manufactured by optically joining a scintillator array and a photodiode array. In general, a detector module is manufactured by bonding a scintillator array and a photodiode array with a liquid adhesive such as an ultraviolet (UV) curable adhesive.

  However, the adhesive layer formed of the adhesive may become non-uniform due to warpage of the scintillator array or the like. Moreover, this manufacturing method requires a complicated manufacturing process by using an adhesive. For this reason, in such a manufacturing method, for example, the manufacturing process may be stopped for a long time due to a mechanical failure of the facility (doker stop), or the running cost may increase. Thus, the conventional manufacturing method using an adhesive may have a low yield.

JP-A-9-54162

  The problem to be solved by the present invention is to provide a detector module manufacturing method, a detector module, and a medical image diagnostic apparatus capable of improving the yield.

  The detector module manufacturing method of the embodiment is a method of manufacturing a detector module. In the detector module, a scintillator array that emits light by X-rays and a photodiode array that converts light generated by the scintillator array into an electrical signal are optically joined. In the detector module manufacturing method of the embodiment, one of the adhesive surfaces of a transparent adhesive sheet having adhesive surfaces on both sides is bonded to the photodiode array. When the photodiode array is made of a material having some flexibility, the other adhesive surface of the transparent adhesive sheet is bonded to the scintillator array in a state where the other adhesive surface protrudes due to warpage of the photodiode array. .

FIG. 1 is a diagram illustrating a configuration example of an X-ray CT apparatus according to the present embodiment. 2A is a diagram (1) illustrating a configuration example of the detector illustrated in FIG. 1. FIG. 2B is a diagram (2) illustrating a configuration example of the detector illustrated in FIG. 1. FIG. 3A is a diagram (1) illustrating an example of a method of manufacturing a scintillator array. FIG. 3B is a diagram (2) illustrating an example of a method of manufacturing the scintillator array. FIG. 3C is a diagram (3) illustrating an example of a method of manufacturing the scintillator array. FIG. 3D is a diagram (4) illustrating an example of a method of manufacturing a scintillator array. FIG. 4 is a diagram illustrating an example of a conventional detector module manufacturing method. FIG. 5 is a diagram showing an outline of the detector module manufacturing method according to the present embodiment. FIG. 6 is a view for explaining the transparent adhesive sheet shown in FIG. 5. FIG. 7A is a diagram (1) for explaining the first step. FIG. 7B is a diagram (2) for explaining the first step. FIG. 8 is a diagram (1) for explaining the second step. FIG. 9A is a diagram (2) for explaining the second step. FIG. 9B is a diagram (3) for explaining the second step. FIG. 10A is a diagram (4) for explaining the second step. FIG. 10B is a diagram (5) for explaining the second step. FIG. 10C is a diagram (6) for explaining the second step. FIG. 10D is a diagram (7) for explaining the second step. FIG. 11 is a diagram (8) for explaining the second step. FIG. 12 is a view showing a detector module manufactured by the detector module manufacturing method according to the present embodiment.

  Hereinafter, an embodiment of a detector module manufacturing method will be described in detail with reference to the accompanying drawings. In the detector module manufactured in the following embodiment, a scintillator array and a photodiode array are optically bonded. The scintillator array emits light by X-rays, and the photodiode array converts light generated by the scintillator array into an electrical signal.

  Hereinafter, a case where the medical image diagnostic apparatus on which the detector module manufactured by the detector module manufacturing method is mounted is an X-ray computed tomography (CT) apparatus will be described as an example.

(Embodiment)
First, the configuration of an X-ray CT apparatus on which a detector module manufactured by the detector module manufacturing method according to the present embodiment is mounted will be described. FIG. 1 is a diagram illustrating a configuration example of an X-ray CT apparatus according to the present embodiment. As shown in FIG. 1, the X-ray CT apparatus according to the present embodiment includes a gantry device 10, a bed device 20, and a console device 30.

  The gantry device 10 is a device that irradiates the subject P with X-rays and collects projection data from X-ray detection data transmitted through the subject P. The gantry device 10 includes an X-ray irradiation control unit 11, an X-ray generation device 12, and the like. The detector 13, the collection unit 14, the rotating frame 15, and the gantry driving unit 16.

  The rotating frame 15 supports an X-ray generator 12 having an X-ray tube 12a, which will be described later, and a detector 13 so as to be rotatable around the subject P. The rotating frame 15 supports the X-ray generator 12 and the detector 13 opposite to each other with the subject P interposed therebetween, and is rotated in a circular orbit around the subject P by a gantry driving unit 16 described later at a high speed. It is a frame.

  The X-ray generator 12 is an apparatus that generates X-rays and irradiates the subject P with the generated X-rays, and includes an X-ray tube 12a, a wedge 12b, and a collimator 12c.

  The X-ray tube 12a emits X-rays. Specifically, the X-ray tube 12a is a vacuum tube that generates an X-ray beam on the subject P by a high voltage supplied by an X-ray irradiation control unit 11 described later. The X-ray tube 12 a exposes the X-ray beam to the subject P as the rotating frame 15 rotates. The X-ray tube 12a generates an X-ray beam that spreads with a fan angle and a cone angle.

  The wedge 12b is an X-ray filter for adjusting the X-ray dose of X-rays emitted from the X-ray tube 12a. The collimator 12c is a slit for narrowing the X-ray irradiation range in which the X-ray dose is adjusted by the wedge 12b under the control of the X-ray irradiation control unit 11 described later.

  The X-ray irradiation control unit 11 is a device that supplies a high voltage to the X-ray tube 12 a as a high voltage generation unit. The X-ray tube 12 a uses the high voltage supplied from the X-ray irradiation control unit 11 to perform X Generate a line. The X-ray irradiation control unit 11 adjusts the X-ray dose irradiated to the subject P by adjusting the tube voltage and tube current supplied to the X-ray tube 12a. The X-ray irradiation control unit 11 adjusts the X-ray irradiation range (fan angle and cone angle) by adjusting the aperture of the collimator 12c.

  The gantry driving unit 16 rotates the rotary frame 15 to rotate the X-ray generator 12 and the detector 13 on a circular orbit around the subject P.

  The detector 13 detects X-rays that have been exposed from the X-ray tube 12a and transmitted through the subject P. Specifically, the detector 13 detects X-rays that have been exposed from the X-ray tube 12a and transmitted through the subject P by using two-dimensionally arranged detection elements. The detector 13 shown in FIG. 1 is a two-dimensional array type detector (surface detector) that outputs X-ray intensity distribution data indicating the intensity distribution of X-rays transmitted through the subject P. In the detector 13, a plurality of detection elements (detection element rows) arranged in the channel direction (Y-axis direction shown in FIG. 1) are along the body axis direction (Z-axis direction shown in FIG. 1) of the subject P. Are arranged in multiple columns. The body axis direction is also called the slice direction. For example, the detector 13 has detection element rows arranged in 320 rows along the body axis direction of the subject P, and detects X-ray intensity distribution data transmitted through the subject P over a wide range.

  2A and 2B are diagrams showing a configuration example of the detector shown in FIG. As illustrated in FIG. 2A, the detector 13 has a configuration in which a plurality of detector modules 130 are arranged. The detector 13 illustrated in FIG. 2A is a surface in which detector modules 130 are arranged in N rows in the channel direction (Y-axis direction in FIG. 1) and M rows in the body axis direction (Z-axis direction in FIG. 1). It is a detector. In the detector module 130, as illustrated in FIG. 2B, the scintillator array 131 and the photodiode array 132 are optically bonded via an adhesive layer.

  The scintillator array 131 is divided into a plurality of sections by a reflective material. As a result, the scintillator array 131 has a configuration in which a plurality of scintillators are arranged at high density in a lattice shape in the channel direction and the body axis direction. The scintillator in each section generates light (scintillator light) with a light amount corresponding to the energy of the incident X-ray.

  In the photodiode array 132, a plurality of photodiodes are arranged on the substrate at a high density in a lattice shape in the channel direction and the body axis direction. The photodiode array 132 is formed on a substrate and attached to a base. Each photodiode outputs an electrical signal corresponding to the energy of the received light. Each section (each scintillator) of the scintillator array 131 and each photodiode of the photodiode array 132 are arranged at opposing positions. As a result, the scintillator and the photodiode arranged at the opposed positions are optically joined to form one detection element. The reflecting material is formed of a material that shields and reflects the scintillator light, and is formed so that light generated by each scintillator is efficiently received by the photodiode at the opposing position.

  Here, an example of a method for manufacturing the scintillator array 131 will be described with reference to FIGS. 3A to 3D are diagrams illustrating an example of a method of manufacturing a scintillator array. First, as illustrated in FIG. 3A, a plurality of scintillator blocks and reflectors in which scintillator members are cut into rectangular parallelepiped blocks are alternately arranged in the channel direction. The scintillator block and the reflective material are fixed by an adhesive.

  And as shown to FIG. 3B, the groove | channel parallel to a channel direction is formed in the product manufactured by the manufacturing process of FIG. 3A along the body-axis direction. And as shown to FIG. 3C, a reflecting material is inserted in the groove | channel formed in the manufacturing process of FIG. 3B. For example, in FIG. 3C, after the adhesive is injected into the groove formed in the manufacturing process of FIG. 3B, the reflective material is inserted. Hereinafter, the product manufactured in the manufacturing process of FIG. 3C is referred to as a scintillator block 1311.

  Then, the surface where the groove is cut by the scintillator block 1311 is polished. Further, the surface opposite to the surface where the groove is cut by the scintillator block 1311 is cut off by polishing so that the reflective material is exposed. Thereby, the scintillator array 131 shown in FIG. 3D is manufactured. A reflective layer (surface reflector) is finally formed on the X-ray incident surface of the scintillator array 131 by white paint or the like. Warpage may occur in the scintillator array 131 manufactured by the manufacturing method illustrated in FIG. Specifically, when the reflecting material is bonded to the scintillator of each section with an adhesive, the scintillator array 131 is warped by a surface (cut-off surface) opposite to the surface where the groove is cut out. There is a case.

  Note that the manufacturing method of the scintillator array 131 is not limited to the manufacturing method illustrated in FIGS. For example, the reflective material may be a liquid reflective material that does not require the use of an adhesive. Further, the scintillator array 131 may be manufactured by forming a lattice-like groove in a flat scintillator member and injecting a liquid reflecting material into the lattice-like groove.

  Returning to FIG. 1, the collection unit 14 is a DAS (data acquisition system), collects X-ray detection data detected by the detector 13, and generates projection data. For example, the collection unit 14 generates projection data by performing amplification processing, A / D conversion processing, or the like on the X-ray intensity distribution data detected by the detector 13, and a console device described later on the generated projection data 30.

  The couch device 20 is a device on which the subject P is placed, and includes a couchtop 22 and a couch driving device 21. The top plate 22 is a plate on which the subject P is placed. The bed driving device 21 moves the subject P in the rotating frame 15 (in the imaging space) by moving the top plate 22 in the Z-axis direction under the control of a scan control unit 33 described later.

  For example, the gantry device 10 performs a helical scan that rotates the rotating frame 15 while moving the top plate 22 to scan the subject P in a spiral shape. Alternatively, the gantry device 10 performs a conventional scan in which the subject P is scanned in a circular orbit by rotating the rotating frame 15 while moving the top plate 22 while the position of the subject P is fixed. Alternatively, the gantry device 10 executes a step-and-shoot method in which a conventional scan is performed in a plurality of scan areas by moving the position of the top plate 22 at regular intervals.

  The console device 30 is a device that receives an operation of the X-ray CT apparatus by an operator and generates X-ray CT image data using data output from the detector 13. That is, the console device 30 is a device that reconstructs X-ray CT image data from projection data collected by the gantry device 10, and includes an input device 31, a display device 32, a scan control unit 33, and a preprocessing unit 34. A projection data storage unit 35, an image reconstruction unit 36, an image storage unit 37, and a control unit 38.

  The input device 31 includes a mouse, a keyboard, buttons, pedals (foot switches), etc., used by an operator of the X-ray CT apparatus for inputting various instructions and various settings, and receives instructions and setting information received from the operator. The data is transferred to the control unit 38.

  The display device 32 is a monitor that is referred to by the operator, displays X-ray CT image data to the operator under the control of the control unit 38, and provides various instructions and various settings from the operator via the input device 31. For example, a GUI (Graphical User Interface) for accepting and the like is displayed.

  The scan control unit 33 controls the operations of the X-ray irradiation control unit 11, the gantry driving unit 16, the collection unit 14, and the bed driving device 21 under the control of the control unit 38 to be described later, thereby projecting on the gantry device 10. Control the data collection process.

  The preprocessing unit 34 performs sensitivity correction processing between channels, logarithmic conversion processing, correction processing such as offset correction, sensitivity correction, and beam hardening correction on the projection data generated by the collection unit 14. Then, corrected projection data is generated. Hereinafter, the corrected projection data generated by the preprocessing unit 34 will be referred to as reconstruction projection data.

  The projection data storage unit 35 stores the reconstruction projection data generated by the preprocessing unit 34. The image reconstruction unit 36 reconstructs X-ray CT image data using the reconstruction projection data stored in the projection data storage unit 35. As the reconstruction method, there are various methods, for example, back projection processing. Further, as the back projection process, for example, a back projection process by an FBP (Filtered Back Projection) method can be cited. Alternatively, the image reconstruction unit 36 may reconstruct X-ray CT image data using a successive approximation method.

  In addition, the image reconstruction unit 36 uses a projection data collected by a helical scan, a conventional scan using the detector 13 which is a surface detector, or a step-and-shoot conventional scan to obtain a three-dimensional X-ray CT image. Data can be reconstructed. For example, the image reconstruction unit 36 reconstructs 3D X-ray CT image data as tomographic image data of a plurality of axial planes. Further, the image reconstruction unit 36 performs various rendering processes from the 3D X-ray CT image data to generate 2D image data for display. The image storage unit 37 stores various image data generated by the image reconstruction unit 36.

  The control unit 38 performs overall control of the X-ray CT apparatus by controlling operations of the gantry device 10, the couch device 20, and the console device 30. Specifically, the control unit 38 controls the scan performed by the gantry device 10 by controlling the scan control unit 33. The control unit 38 also controls the image reconstruction process and the image generation process in the console device 30 by controlling the preprocessing unit 34 and the image reconstruction unit 36. The control unit 38 controls the display device 32 to display various image data stored in the image storage unit 37.

  The overall configuration of the X-ray CT apparatus according to the present embodiment has been described above. Under such a configuration, the X-ray CT apparatus according to the present embodiment generates X-ray CT image data using data detected by the detector 13. Here, as described above, the detector 13 includes a plurality of detector modules 130, and each detector module 130 is manufactured by optically joining the scintillator array 131 and the photodiode array 132. . FIG. 4 is a diagram illustrating an example of a conventional detector module manufacturing method.

  In the conventional detector module manufacturing method, as shown in FIG. 4, the scintillator array 131 and the photodiode array 132 are bonded with an adhesive. Such an adhesive is, for example, a liquid adhesive such as a UV (ultraviolet) curable adhesive.

  However, the adhesive layer formed of an adhesive may become non-uniform due to warpage of the scintillator array 131 or the like. Moreover, this manufacturing method requires a complicated manufacturing process by using an adhesive. For example, when an adhesive is used, a positioning step for making the distance (inter-array distance) between the scintillator array 131 and the photodiode array 132 before bonding a certain range, or between arrays positioned in a certain range A process for maintaining the distance is required. Moreover, when using an adhesive agent, the process of performing temporary hardening and main hardening of an adhesive agent, and the process of removing an excess adhesive agent are needed, for example.

  For this reason, in the conventional manufacturing method, for example, the manufacturing process may be stopped for a long time due to a mechanical failure of the facility (doker stop), or the running cost may increase. Thus, the conventional manufacturing method may have a low yield.

  Therefore, the detector module 130 according to the present embodiment is manufactured by the following manufacturing method in order to improve the yield. FIG. 5 is a diagram showing an outline of the detector module manufacturing method according to the present embodiment. In the detector module manufacturing method according to the present embodiment, as shown in FIG. 5, the scintillator array 131 and the photodiode array 132 are bonded by a transparent adhesive sheet 133 having adhesive surfaces on both sides. Specifically, the transparent adhesive sheet 133 is a tape-type adhesive, for example, OCA (Optical Clear Adhesive).

  In this embodiment, by using the transparent adhesive sheet 133 as an adhesive layer, the distance between the scintillator array 131 and the photodiode array 132 is determined by the thickness of the transparent adhesive sheet 133 as compared with the conventional method using an adhesive. Easy to control. In other words, in this embodiment, the distance between the scintillator array 131 and the photodiode array 132 can be controlled only by manufacturing or purchasing a transparent adhesive sheet 133 having a suitable thickness in terms of detection performance.

  For example, in the present embodiment, the thickness of the transparent adhesive sheet 133 is set such that the distance between the scintillator array 131 and the photodiode array 132 falls within an optimal predetermined range in terms of the performance of the detector 13. Specifically, in the present embodiment, the thickness of the transparent adhesive sheet 133 is such that substantially all of the light generated by the scintillators in each section of the scintillator array 131 divided into a plurality of sections by the reflector is generated in the photodiode array 132. The thickness is incident on the photodiode at the opposite position. When the adhesive layer is thick, there is a possibility that the light generated by the scintillator is received by a photodiode different from the photodiode at the opposite position. In the present embodiment, the detection characteristics of the detector module 130 can be stabilized by using the transparent adhesive sheet 133 having a thickness that hardly has such a possibility.

  Further, when the scintillator array 131 is warped by the manufacturing method illustrated in FIGS. 3A to 3D, the detection characteristics of the individual detector modules 130 vary, and the image quality is deteriorated. Further, when the scintillator array 131 is warped, artifacts are generated due to the generation of scattered rays, and the image quality is degraded. However, in the present embodiment, the warpage of the scintillator array 131 can be corrected to some extent by adhering the scintillator array 131 and the photodiode array 132 with the transparent adhesive sheet 133, and the detection characteristics of the individual detector modules 130. Becomes uniform, and further, the generation of scattered radiation is reduced and the image quality can be improved. Moreover, since the manufacturing method which concerns on this embodiment is a simple method of sticking the transparent adhesive sheet 133, an installation and a process can also be simplified and cost can be reduced. For this reason, in this embodiment, the yield in manufacturing the detector module 130 is improved.

  Hereinafter, a specific example of the detector module manufacturing method according to the present embodiment will be described. This manufacturing method is roughly divided into two steps, a first step and a second step. In the first step according to this embodiment, the photodiode array 132 and one adhesive surface of the transparent adhesive sheet 133 are bonded. In the second step according to the present embodiment, the scintillator array 131 and the other adhesive surface of the transparent adhesive sheet 133 are bonded.

  First, the transparent adhesive sheet 133 will be described with reference to FIG. FIG. 6 is a view for explaining the transparent adhesive sheet shown in FIG. 5. As shown in FIG. 6, the transparent adhesive sheet 133 is protected on both sides by a release sheet 133a and a release sheet 133b. By peeling the release sheet 133a, one adhesive surface of the transparent adhesive sheet 133 is exposed, and by releasing the release sheet 133b, the other adhesive surface of the transparent adhesive sheet 133 is exposed. The release sheet 133a and the release sheet 133b can be easily removed manually using a cellophane tape, for example. The transparent adhesive sheet 133 is “a state in which the adhesive layers on both sides are protected by the release sheet 133a and the release sheet 133b”, “the release sheet 133a is peeled to expose one adhesive surface, and the other adhesive surface is the release sheet 133b. ”Protected state”, “Peeling sheet 133b is peeled off and one adhesive surface is exposed, and the other adhesive surface is protected by peeling sheet 133a” and “Peeling sheet 133a and peeling sheet 133b are peeled off” The state is either “the state where the adhesive layers on both sides are exposed”.

  Next, the first step will be described with reference to FIGS. 7A and 7B. 7A and 7B are diagrams for explaining the first step.

  In the first step, the photodiode array 132 and one adhesive surface of the transparent adhesive sheet 133 are bonded. For example, in the first step, as shown in FIG. 7A, the operator peels the release sheet 133a by sticking the cellophane tape to the end of the release sheet 133a and lifting the cellophane tape. Then, the operator attaches the adhesive surface exposed by peeling the release sheet 133a and the photodiode array 132 together. At this time, the operator performs bonding so that the substrate of the photodiode array 132 and the transparent adhesive sheet 133 trimmed to approximately the same size as the substrate face each other.

  Thereby, as shown in FIG. 7B, the attachment of the photodiode array 132 and the transparent adhesive sheet 133 is completed. In the second step to be described later, the scintillator array 131 is bonded to the adhesive surface exposed by peeling the release sheet 133b from the transparent adhesive sheet 133.

  The first step may be performed manually by an operator, but in order to increase work efficiency, the first step is performed using a “jig (bonding jig)” produced for the first step. Also good. This bonding jig has, for example, a “sticking side” stage and a “sticking side” stage, and the “sticking side” stage is brought into close contact with the “sticking side” stage by rotational movement. Configured to do. Further, an attachment capable of fixing the base of the photodiode array 132 is provided on the “attached side” stage, and an attachment capable of fixing the transparent adhesive sheet 133 is provided on the “attachment side” stage. The positions of these two attachments were trimmed to approximately the same size as the substrate of the photodiode array 132 when the “paste side” stage was rotated and brought into close contact with the “paste side” stage. The transparent adhesive sheet 133 is adjusted so as to face each other.

  The operator sets the photodiode array 132 on the “sticking side” stage, and sets the transparent adhesive sheet 133 on the “sticking side” stage. And an operator peels the peeling sheet 133a of the transparent adhesive sheet 133, for example. Then, the operator rotates the “sticking side” stage toward the “sticking side” stage. Then, the operator presses the “sticking side” stage against the “sticking side” stage by applying a slight force. Thereby, the first step is completed.

  Alternatively, the first step may be performed semi-automatically or automatically using a “bonding device” in order to further increase the work efficiency. For example, the bonding apparatus adsorbs the transparent adhesive sheet 133 to the pad by suction. For example, the bonding apparatus or the operator peels off the release sheet 133a of the transparent adhesive sheet 133. For example, the bonding apparatus moves the stage on which the photodiode array 132 is arranged and presses it against the adhesive surface exposed by the transparent adhesive sheet 133. Thereby, the first step is completed. Note that the position of the pad and the position of the stage are adjusted so that the suction surface to which the transparent adhesive sheet 133 is sucked and the substrate of the photodiode array 132 face each other.

  Next, a 2nd process is demonstrated using FIG. 8, FIG. 9A-B, FIG. 10A-D, and FIG. 8, 9A-B, 10A-D, and FIG. 11 are diagrams for explaining the second step.

  In the second step, as shown in FIG. 8, the scintillator array 131 is bonded to the other bonding surface of the transparent bonding sheet 133 bonded to the photodiode array 132. In the second step of bonding the scintillator array 131 and the transparent adhesive sheet 133, it is necessary to perform positioning so that each photodiode of the photodiode array 132 and each scintillator of each section of the scintillator array 131 face each other. . When the second step is performed manually, the operator peels the release sheet 133b from the transparent adhesive sheet 133 bonded to the photodiode array 132 to expose the adhesive surface. Then, the operator performs positioning by visual observation, and then mounts the scintillator array 131 on the adhesive surface of the transparent adhesive sheet 133.

  In the second step, positioning using image processing may be performed in order to increase work efficiency. In such a case, in the second step, for example, an image of the scintillator array 131 is taken on the stage, and an image processing device such as a PC (Personal Computer) is used to analyze the scintillator array 131 from the image of the scintillator array 131 by image analysis. The lattice pattern of the scintillator in each section is extracted. Then, an image of the photodiode array 132 is taken on the stage, and the image processing apparatus extracts a lattice pattern of each photodiode of the photodiode array 132 from the image of the photodiode array 132 by image analysis.

  Then, the image processing apparatus or the operator positions the scintillator array 131 and the photodiode array 132 on the stage from the lattice pattern of the scintillator array 131 and the lattice pattern of the photodiode array 132. Thereafter, the image processing apparatus or the operator bonds the scintillator array 131 to the other bonding surface of the transparent bonding sheet 133 bonded to the photodiode array 132. Thereby, the second step is completed.

  Furthermore, said 2nd process may be performed by the method illustrated to FIG. 9A-B and FIG. 10A-D from a viewpoint of bubble suppression. The method illustrated in FIGS. 9A and 9B is a method of performing bubble suppression using a warp that may occur in the scintillator array 131. Also, the method illustrated in FIGS. 10A to 10D is a method of performing bubble suppression using the material of the photodiode array 132.

  In the first step, one adhesive surface of the transparent adhesive sheet 133 and the photodiode array 132 are bonded. 9A to 9B, when the scintillator array 131 is bonded to the other bonding surface of the transparent adhesive sheet 133, the bonding surface and the scintillator array 131 protrude due to warpage. Glue the surface. Specifically, this protruding surface is a surface determined by the manufacturing process of the scintillator array 131 described with reference to FIGS. More specifically, this projecting surface is used to expose the reflective material after bonding the reflective material to a groove formed to divide the scintillator array 131 into a plurality of sections in the manufacturing process of the scintillator array 131. It is the surface that was cut off.

  That is, the scintillator array 131 is warped with the cut-out surface protruding as shown in FIG. Therefore, in the modification of the second step, as shown in FIG. 9B, the cut-off surface of the scintillator array 131 is pressure-bonded toward the transparent adhesive sheet 133 bonded to the photodiode array 132. As a result, the air between the scintillator array 131 and the photodiode array 132 is allowed to escape from the central portion toward both ends, and the scintillator array 131 and the photodiode array 132 can be bonded without entering bubbles. As a result, the detection characteristics of the detector module 130 can be further stabilized.

  10A to 10D, when the photodiode array 132 is made of a material having some flexibility, the opposite side to which the photodiode array 132 is bonded with the transparent adhesive sheet 133. Are bonded to the scintillator array 131 in a state where the bonding surface is protruded by warpage of the photodiode array 132.

  For example, the substrate of the photodiode array 132 may be a ceramic substrate or a printed circuit board (PCB) depending on the standard of the detector 13 (for example, 16 columns, 80 columns, 320 columns, etc.). It may be used. When a printed circuit board is used, the photodiode array 132 has some flexibility. Therefore, in the modified example of the second step, the photodiode array 132 is pushed up by a pad whose central portion is convex upward as shown in FIG. 10A, for example. As a result, as shown in FIG. 10B, the photodiode array 132 to which the transparent adhesive sheet 133 having the adhesive surface exposed on the upper surface is warped with the upper side slightly protruding. In this state, the mounting jig is moved from the top to the bottom of the scintillator array 131 toward the photodiode array 132 (see FIG. 10C). As a result, the second step can be performed while air between the scintillator array 131 and the photodiode array 132 is released from the central portion toward both ends, and as a result, bubbles can be suppressed.

  In addition, the modification example of the second step using the slight flexibility of the photodiode array 132 can be combined with the modification example using the warpage of the scintillator array 131 (see FIGS. 9A to 9B). In such a case, in the second step, the adhesive surface exposed by the transparent adhesive sheet 133 attached to the photodiode array 132 is a protruding surface (cut off) from which the scintillator array 131 protrudes due to warping as shown in FIG. 10D. Surface). Thereby, the second step can be performed while the air between the scintillator array 131 and the photodiode array 132 is more efficiently released from the center toward both ends, and as a result, bubbles can be suppressed. .

  10A to 10D, it is necessary to perform the second step using the flexibility of the substrate using the photodiode array 132 with the base removed, and then attach the base.

  In the present embodiment, the following process may be further performed as the final process of the second process. In the final step of the second step, the structure in which the scintillator array 131 and the photodiode array 132 are stacked via the transparent adhesive sheet 133 is pressed by pressure. Specifically, this structure is pressure-bonded by a roller as shown in FIG. Note that the structure (scintillator array 131 + transparent adhesive sheet 133 + photodiode array 132) shown in FIG. 11 may be bonded by a compression pad formed of a flexible material.

  By performing the final step of the second step, the adhesive strength between the scintillator array 131 and the photodiode array 132 can be increased to suppress bubbles, and the detection characteristics can be further stabilized. The final step of the second step may be performed manually or automatically.

  FIG. 12 is a view showing a detector module manufactured by the detector module manufacturing method according to the present embodiment.

  The detector module 130 illustrated in FIG. 12 is manufactured by performing the first step and the second step described above. The detector modules 130 illustrated in FIG. 12 are arranged in the channel direction and the body axis direction (slice direction), for example, as illustrated in FIG. Such a detector 13 is incorporated in the X-ray CT apparatus illustrated in FIG. 1 and used to generate X-ray CT image data. In the first step and the second step described above, whether to use the scintillator array 131 with the surface reflector or to form the surface reflector last by using the scintillator array 131 without the surface reflector depends on the manufacturing method. It is determined.

  As described above, in this embodiment, the transparent adhesive sheet 133 is used as an adhesive layer that optically bonds the scintillator array 131 and the photodiode array 132. In the present embodiment, by using the transparent adhesive sheet 133, the distance between the arrays can be easily controlled as compared with the conventional method using an adhesive. Can be easily suppressed.

  In addition, the conventional method requires a positioning step and an inter-array distance maintaining step in a state in which the distance between the arrays is secured before the injection of the adhesive. After the injection of the adhesive, the excess adhesive is removed and UV irradiation is performed. An adhesive curing step is required. On the other hand, in the method according to the present embodiment, the inter-array distance maintaining step, the excess adhesive removing step, and the curing step are not required. Furthermore, in the method according to the present embodiment, since the positioning step can be performed in a state where the transparent adhesive sheet is attached to one of the bonding objects, the positioning step can be easily performed.

  Further, in the method according to the present embodiment, since bubbles and warpage can be easily suppressed, the detection characteristics of the detector module 130 can be stabilized and the image quality can be stabilized. Therefore, in the method according to the present embodiment, the occurrence rate of defective products can be kept low, and the yield can be improved.

  In addition, OCA and the like used in this embodiment are less expensive than UV curable adhesives, and the method according to this embodiment is easily detected with a smaller number of steps than the conventional method. Since the instrument module 130 can be manufactured, the time required for manufacturing can be reduced. In addition, since the method according to the present embodiment can reduce the time required for manufacturing, it is possible to reduce the number of personnel required for the manufacturing process. Therefore, in the method according to the present embodiment, the manufacturing cost can be reduced.

  In addition, the detector module manufacturing method demonstrated by said embodiment is applicable also as a manufacturing method of the detector module of an X-ray diagnostic apparatus, for example. In addition, the detector module manufacturing method described in the above embodiment can also be used as a detector module manufacturing method for a nuclear medicine imaging apparatus by using a scintillator array 131 manufactured from a scintillator member that efficiently emits light with gamma rays. Applicable.

  Of the processes described in the above embodiment, all or part of the processes described as being performed automatically can be performed manually, or the processes described as being performed manually. All or a part of the above can be automatically performed by a known method. In addition, the processing procedure, control procedure, specific name, and information including various data and parameters shown in the above-described document and drawings can be arbitrarily changed unless otherwise specified.

  As described above, according to the present embodiment, the yield can be improved.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

131 Scintillator array 132 Photodiode array 133 Transparent adhesive sheet

Claims (5)

A detector module manufacturing method for manufacturing a detector module in which a scintillator array that emits light by X-rays and a photodiode array that converts light generated by the scintillator array into an electrical signal are optically joined,
Adhering one adhesive surface of the transparent adhesive sheet having an adhesive surface on both sides, and the photodiode array,
When the photodiode array is made of a material having a slight flexibility, the other adhesive surface of the transparent adhesive sheet is bonded to the scintillator array in a state of protruding due to warpage of the photodiode array.
The detector module manufacturing method characterized by the above-mentioned.   2. The detector module manufacturing method according to claim 1, wherein when the scintillator array is bonded to the other bonding surface, the bonding surface is bonded to a protruding surface from which the scintillator array protrudes due to warpage. .   The projecting surface is a surface that is cut off to expose the reflective material after the reflective material is bonded to a groove formed to divide the scintillator array into a plurality of sections in the manufacturing process of the scintillator array. The detector module manufacturing method according to claim 2, wherein the detector module is provided.   A detector module manufactured by the detector module manufacturing method according to claim 1. A detector in which a plurality of detector modules, wherein the detector module is manufactured by the detector module manufacturing method according to claim 1,
A console device that generates medical image data using data output by the detector;
A medical image diagnostic apparatus comprising:

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