JP7365801B2 - Substrate, X-ray detector substrate, and method for manufacturing an X-ray detector - Google Patents

Description

Embodiments of the present invention relate to a substrate, a substrate for an X-ray detector, and a method for manufacturing an X-ray detector.

2. Description of the Related Art There are medical image diagnostic apparatuses that generate medical image data in which internal tissues of a subject are imaged. Examples of the medical image diagnostic apparatus include an X-ray CT (Computed Tomography) apparatus and an X-ray diagnostic apparatus. An X-ray CT apparatus includes a two-dimensional array of detector packs each having an optical sensor and a scintillator mounted on a substrate, and an X-ray detector having a grid attached to the front surface of the detector pack. An X-ray CT device irradiates a subject placed on a bed with X-rays, and an X-ray detector detects the X-rays that have passed through the subject. Then, reconstructed image data such as CT image data and volume data of an axial tomogram of the subject is generated. The X-ray diagnostic device also includes an X-ray detector.

Each detector pack constituting an X-ray detector is manufactured by filling a mounting board in which an optical sensor and a scintillator are mounted on the board with an underfill as a hardening agent. As a method of filling the mounting board with underfill, there is a method of filling the mounting board by injecting the underfill from the gap between adjacent optical sensors using a dispenser with a small diameter needle. Furthermore, if an area for application of the underfill cannot be secured on the substrate, there is a method of filling the gap by tilting the mounting substrate itself and injecting the underfill into the gap between the optical sensor and the substrate from above.

Japanese Patent Application Publication No. 2019-041046

The problem to be solved by the present invention is to provide a substrate that can be efficiently and effectively filled with a curing agent.

The substrate according to the embodiment is a substrate having a first surface electrically connectable to a plurality of pads for electrically connecting to an electronic device. The substrate has holes provided between the plurality of pads on a first surface, and the holes are provided so as to penetrate through a second surface opposite to the first surface.

FIG. 1 is a schematic diagram showing the configuration of a substrate according to the first embodiment. FIG. 2 is a schematic diagram showing the configuration of a substrate according to a comparative example. FIG. 3 is a schematic diagram showing the configuration of a substrate according to the second embodiment. FIG. 4 is a schematic diagram showing the configuration of a substrate according to the third embodiment. FIG. 5 is a schematic diagram showing the configuration of a substrate according to the fourth embodiment. FIG. 6 is a schematic diagram showing the configuration of a substrate according to the fifth embodiment. FIG. 7 is a top view showing first and second modified examples of the substrate according to the fifth embodiment. FIG. 8 is a top view showing a third modification of the substrate according to the fifth embodiment. FIG. 9 is a schematic diagram showing a fourth modification of the substrate according to the fifth embodiment. FIG. 10 is a schematic diagram showing the configuration of an X-ray CT apparatus to which the substrate according to the embodiment is applied. FIG. 11 is a diagram showing the X-ray detector before each substrate is filled with underfill. FIG. 12 is a diagram showing an X-ray detector manufactured from an X-ray detector before filling. FIG. 13 is a flow chart showing a method for manufacturing an X-ray detector according to an embodiment.

Hereinafter, embodiments of a substrate, a substrate for an X-ray detector, and a method for manufacturing an X-ray detector will be described in detail with reference to the drawings.

(Substrate according to the first embodiment)
FIG. 1 is a schematic diagram showing the configuration of a substrate according to the first embodiment. FIG. 1A shows a top view of the substrate according to the first embodiment. FIGS. 1(B) to (D) show cross-sectional views taken along line II in FIG. 1(A).

FIGS. 1A and 1B show a mounting board 60A including a board 61A according to the first embodiment. The mounting board 60A includes a substrate 61A, an optical sensor 62 as an electronic device, a scintillator 63 as an electronic device, and a plurality of pads (also called "metal bumps") 64.

The substrate 61A is a single layer substrate. The substrate 61A has a first surface P1 that can be electrically connected to a plurality of pads 64 for electrically connecting to the optical sensor 62, and a second surface P2 that faces the first surface P1. For example, the substrate 61A is a ceramic substrate made of alumina.

The optical sensor 62 has a function of generating an electric signal according to the amount of light from a scintillator 63, which will be described later, and is an ASIC (Application Specific Integrated Circuit) having a photoelectric conversion element such as a photodiode. That is, the optical sensor 62 converts light into an electrical signal. The optical sensor 62 is arranged on the first surface P1 of the substrate 61A. In this specification, the optical sensors 62 will be described as being arranged in an array on the first surface P1 with two rows in the channel direction and two columns in the column direction with a predetermined gap. However, it is not limited to that case. Further, the number may be different between the channel direction and the column direction.

A collection of multiple optical sensors 62 is also called an optical sensor array. The pad 64 formed on the electrode of the optical sensor 62 and the electrode on the first surface P1 are electrically connected by flip chip bonding using a conductive adhesive. Thereby, the plurality of optical sensors 62 and the first surface P1 of the substrate 61A are connected. Note that the optical sensor 62 includes a configuration such as a photomultiplier tube (PMT).

The scintillator 63 has a scintillator crystal that outputs light with an amount of photons corresponding to the amount of incident X-rays. That is, the scintillator 63 converts the incident X-rays into light. The scintillator 63 is laminated on the plurality of optical sensors 62 (ie, optical sensor array) via a transparent adhesive film (not shown).

Here, in the detector pack, the optical sensor is generally mounted on the substrate in many cases by flip-chip bonding, but sufficient strength may not be obtained only by the bonding force between the electrodes. Therefore, a process is performed to improve reliability by filling the gap between the optical sensor and the substrate with underfill and curing it.

A method for filling underfill into a mounted board with multiple electronic devices mounted on the board is to use a dispenser with a small diameter needle to inject underfill from the gap between adjacent optical sensors. There is a method. Furthermore, if an area for application of the underfill cannot be secured on the substrate, there is a method of filling the gap by tilting the mounting substrate itself and injecting the underfill into the gap between the optical sensor and the substrate from above.

However, for example, on a mounting board used in an X-ray CT device, adjacent optical sensors are mounted with an extremely narrow gap of 100 μm or less, and furthermore, a scintillator is installed on the optical sensor. It is extremely difficult to inject underfill directly through the gap between the optical sensors. Furthermore, when injecting underfill by tilting the mounting board, there is a problem that the underfill adheres to the scintillator and the transparent adhesive film, and the performance of the detector pack after the underfill is cured deteriorates.

Therefore, in the first embodiment, a through hole HA for underfill injection is provided in the substrate 61A. Specifically, the substrate 61A has holes provided between the plurality of pads 64 on the first surface P1, and the holes are provided so as to penetrate through the second surface P2 opposite to the first surface P1. . A through hole HA is formed by the hole on the first surface P1 and the hole on the second surface P2. Note that the shape of the hole is not limited to a circle, but may be an ellipse, a square, or the like.

It is preferable that the diameter of the hole formed in the first surface P1 of the through hole HA is a maximum diameter (maximum area) that does not overlap the arrangement position of the electrode to which the pad 64 is connected, and The diameter of the hole formed in the surface P2 is preferably such that the tip side of the dispenser needle N (shown in FIG. 1(C)) can be inserted to a predetermined depth. For example, the through hole HA is arranged at a position on the first surface P1 corresponding to between the four pads located at the center of the first surface P1, and the diameter of the hole on the first surface P1 is The diameter of the hole in the second surface P2 may be made equal to the diameter of the hole.

A plurality of mounting boards 60A each having a photosensor array and a scintillator 63 mounted on the board 61A are two-dimensionally arranged on the base of the X-ray detector (reference numeral "" in FIG. 11A, which will be described later). 60E" is replaced with "60A").

With a plurality of mounting boards 60A arranged two-dimensionally on the base of the X-ray detector, the tip of the needle N is inserted into each board 61A from the second surface of the through hole HA (see FIG. 1). (Illustrated in C)). Then, the underfill U is injected into the through hole HA from the tip of the needle N. Underfill U is a general term for liquid curable resins (curing agents) used for sealing integrated circuits, and the main material is a composite resin mainly composed of epoxy resin. The underfill U injected into the through hole HA from the tip of the needle N flows into the gap between the optical sensor 62 and the substrate 61A from within the through hole HA, and is cured (as shown in FIG. 1(D)). The detector pack 70A is manufactured by providing the hardened underfill U on the mounting board 60A.

By providing an underfill U on the mounting board 60A for each of the plurality of detector packs 70A on the base, the X-ray detector 12 described later is manufactured (reference numeral "70E" in FIG. 12(A) described later). is replaced with "70A").

As described above, according to the substrate 61A, the arrangement position of the electrode can be determined by considering both the relationship with the arrangement position of the electrode on the first surface P1 and the relationship with the diameter of the needle N of the dispenser. An appropriate through hole HA having a position and diameter depending on the diameter of the needle N can be provided in the substrate 61A. Thereby, the underfill U can be efficiently and effectively filled into the substrate.

(Substrate according to comparative example)
FIG. 2 is a schematic diagram showing the structure of a substrate according to a comparative example. FIG. 2A shows a top view of a substrate according to a comparative example. FIGS. 2(B) and 2(C) show cross-sectional views taken along line II-II in FIG. 2(A).

FIGS. 2A and 2B show a mounting board 80 including a board 81 according to a comparative example. The mounting board 80 is provided in an X-ray detector included in an X-ray CT device, an X-ray diagnostic device, etc., which will be described later.

The mounting board 80 includes a board 81, a photosensor 82, a scintillator 83, and a pad 84. Note that the optical sensor 82, scintillator 83, and pad 84 are assumed to have the same structure and the same function as the optical sensor 62, scintillator 63, and pad 64 shown in FIG. 1, respectively, and a description thereof will be omitted.

The substrate 81 has a first surface Q1 on the optical sensor 82 side and a second surface Q2 opposite to the first surface Q1. The substrate 81 is provided with a through hole I for injecting underfill. Specifically, the substrate 81 has holes provided between the plurality of pads 84 on the first surface Q1, and the holes are provided so as to penetrate through the second surface Q2 facing the first surface Q1. . A through hole I is formed by the hole in the first surface Q1 and the hole in the second surface Q2.

The first surface Q1 of the through hole I is provided at a position that does not overlap the arrangement position of the electrode to which the pad 64 is connected. However, regarding the diameter of the hole on the second surface, the relationship between the diameter of the hole on the first surface Q1 and the diameter on the second surface Q2 (i.e., the shape of the through hole I), and the position of the through hole I, is not taken into account. Therefore, there is no through hole that does not interfere with the arrangement of the electrodes and into which the needle N can be inserted.

On the other hand, according to the substrate 61A shown in FIGS. 1(A) and 1(B) (the same applies to substrates 61B to 61E described later), the relationship between the electrode arrangement position on the first surface P1 and the diameter of the needle N By considering both the relationship between the two, it is possible to provide the substrate 61A with an appropriate through hole HA having a position and diameter that correspond to the electrode arrangement position and the diameter of the needle N. Thereby, the underfill U can be filled into the substrate more efficiently and effectively than in the comparative example.

Next, substrates according to second to fifth embodiments of the substrates according to the embodiments will be described in order.

(Substrate according to second embodiment)
The substrate according to the second embodiment differs from the substrate 61A according to the first embodiment in that the diameter of the first surface P1 and the diameter of the second surface P2 are different.

FIG. 3 is a schematic diagram showing the configuration of a substrate according to the second embodiment. FIG. 3(A) shows a top view of the substrate according to the second embodiment. 3(B) to (D) show cross-sectional views taken along line III-III in FIG. 3(A).

FIGS. 3A and 3B show a mounting board 60B including a board 61B according to the second embodiment.

The mounting board 60B includes a board 61B, a scintillator 63, an optical sensor 62, and a plurality of pads 64. Note that in FIG. 3, the same members as those shown in FIG.

The substrate 61B is a single layer substrate. The substrate 61B has a first surface P1 on the optical sensor 62 side and a second surface P2 opposite to the first surface P1. For example, the substrate 61B is a ceramic substrate made of alumina.

In the second embodiment, a through hole HB for underfill injection is provided in the substrate 61B. Specifically, the substrate 61B has holes provided between the plurality of pads 64 on the first surface P1, and the holes are provided so as to penetrate through the second surface P2 opposite to the first surface P1. . A through hole HB is formed by the hole on the first surface P1 and the hole on the second surface P2. Note that the shape of the hole is not limited to a circle, but may be an ellipse, a square, or the like.

It is preferable that the diameter of the hole formed on the first surface P1 of the through hole HB is a maximum diameter that does not overlap the arrangement position of the electrode to which the pad 64 is connected, and The diameter of the hole to be formed is preferably such that the tip side of the needle N (shown in FIG. 3(C)) of the dispenser can be inserted to a predetermined depth. For example, the through hole HB is arranged at a position on the first surface P1 corresponding to between the four pads located at the center of the first surface P1, and the diameter of the hole on the second surface P2 is It is sufficient that the diameter of the hole is larger than the diameter of the hole on the surface P1 of FIG. For example, the through hole HB is formed so that its diameter gradually increases from the first surface P1 to the second surface P2.

A plurality of mounting boards 60B each having a photosensor array and a scintillator 63 mounted on the board 61B are two-dimensionally arranged on the base of the X-ray detector (symbol " 60E" is replaced with "60B").

With a plurality of mounting boards 60B arranged two-dimensionally on the base of the X-ray detector, the tip of the needle N is inserted into each board 61B from the second surface of the through hole HB (see FIG. 3). (Illustrated in C)). Then, the underfill U is injected into the through hole HB from the tip of the needle N. The underfill U injected into the through hole HB from the tip of the needle N flows into the gap between the optical sensor 62 and the substrate 61B from the through hole HB, and hardens (shown in FIG. 3(D)). The detector pack 70B is manufactured by providing the hardened underfill U on the mounting board 60B.

By providing an underfill U on the mounting board 60B for each of the plurality of detector packs 70B on the base, the X-ray detector 12 described later is manufactured (symbol "70E" in FIG. 12(A) described later). is replaced with "70B").

As described above, the substrate 61B can be expected to have the same effects as the substrate 61A described above.

Next, a case will be described in which the substrate has a multilayer laminated structure consisting of a plurality of substrate elements (a substrate element is also a type of substrate). In that case, either a through hole is formed by providing a hole with the same size and center position for all the substrate elements constituting the multilayer laminated structure (as shown in FIG. 4, which will be described later), or Through-holes are formed by providing holes of different sizes in the top layer substrate element and the bottom layer substrate element, respectively (as shown in FIG. 5, which will be described later), or through holes are formed by providing holes of different sizes in the top layer substrate element and the bottom layer substrate element, respectively (as shown in FIG. 5, which will be described later). A through-hole is formed such that the center position of the hole in at least one of the board elements is different from the center position of the hole in the other board elements (not shown), or a through-hole is formed by a combination of these (described later). (Illustrated in Figure 6). Those cases will be explained below.

(Substrate according to third embodiment)
The substrate according to the third embodiment differs from the substrate 61A according to the first embodiment in that the substrate has a multilayer laminated structure.

FIG. 4 is a schematic diagram showing the configuration of a substrate according to the third embodiment. FIG. 4(A) shows a top view of the substrate according to the third embodiment. 4(B) to (D) show cross-sectional views taken along the line IV-IV in FIG. 4(A).

FIGS. 4A and 4B show a mounting board 60C including a board 61C according to the third embodiment. The mounting board 60C includes a board 61C, a scintillator 63, an optical sensor 62, and a plurality of pads 64. Note that in FIG. 4, the same members as those shown in FIG.

The substrate 61C is a multilayer, for example, a four-layer laminated substrate. The substrate 61C has a first surface P1 of the fourth layer (top layer) provided on the optical sensor 62 side and a second surface P2 of the first layer (bottom layer) opposite to the first surface P1. have For example, the substrate elements constituting each layer of the substrate 61C are ceramic substrates made of alumina.

In the third embodiment, a through hole HC for injecting underfill is provided in the substrate 61C. Specifically, the substrate 61C has holes provided between the plurality of pads 64 on the first surface P1, and the holes are provided so as to penetrate through the second surface P2 opposite to the first surface P1. . A through hole HC is formed by the hole on the first surface P1 and the hole on the second surface P2. Note that the shape of the hole is not limited to a circle, but may be an ellipse, a square, or the like.

It is preferable that the diameter of the hole formed in the first surface P1 of the through hole HC is a maximum diameter that does not overlap the arrangement position of the electrode to which the pad 64 is connected, and The diameter of the hole to be formed is preferably such that the tip side of the needle N (shown in FIG. 4C) of the dispenser can be inserted to a predetermined depth. For example, the through hole HC is arranged at a position on the first surface P1 corresponding to between the four pads located at the center of the first surface P1, and the diameter of the hole on the first surface P1 is The diameter of the hole in the second surface P2 may be made equal to the diameter of the hole.

Then, a plurality of mounting boards 60C in which the optical sensor array and the scintillator 63 are mounted on the board 61C are arranged in a two-dimensional array on the base of the X-ray detector (reference numeral "" in FIG. 11(A) to be described later). 60E" is replaced with "60C").

With a plurality of mounting boards 60C arranged two-dimensionally on the base of the X-ray detector, the tip of the needle N is inserted into each board 61C from the second surface of the through hole HC (see FIG. 4). (Illustrated in C)). Then, the underfill U is injected into the through hole HC from the tip of the needle N. The underfill U injected into the through hole HC from the tip of the needle N flows into the gap between the optical sensor 62 and the substrate 61C from the through hole HC, and is cured (as shown in FIG. 4(D)). The detector pack 70C is manufactured by providing the hardened underfill U on the mounting board 60C.

By providing an underfill U on the mounting board 60C for each of the plurality of detector packs 70C on the base, the X-ray detector 12 described later is manufactured (reference numeral "70E" in FIG. 12(A) described later). is replaced with "70C").

As described above, the substrate 61C can be expected to have the same effects as the substrate 61A described above.

(Substrate according to fourth embodiment)
The substrate according to the fourth embodiment differs from the substrate 61C according to the third embodiment in that the diameter of the first surface P1 and the diameter of the second surface P2 are different.

FIG. 5 is a schematic diagram showing the configuration of a substrate according to the fourth embodiment. FIG. 5A shows a top view of the substrate according to the fourth embodiment. 5(B) to (D) show cross-sectional views taken along the line VV in FIG. 5(A).

FIGS. 5A and 5B show a mounting board 60D including a board 61D according to the fourth embodiment. The mounting board 60D includes a board 61D, a scintillator 63, an optical sensor 62, and a plurality of pads 64. In FIG. 5, the same members as those shown in FIG. 1 are designated by the same reference numerals, and their explanations will be omitted.

The substrate 61D is a multilayer, for example, a four-layer laminated substrate. The substrate 61D has a first surface P1 of the uppermost layer provided on the optical sensor 62 side and a second surface P2 of the lowermost layer opposite to the first surface P1. For example, the substrate elements constituting each layer of the substrate 61D are ceramic substrates made of alumina.

In the fourth embodiment, a through hole HD for underfill injection is provided in the substrate 61D. Specifically, the substrate 61D has holes provided between the plurality of pads 64 on the first surface P1, and the holes are provided so as to penetrate through the second surface P2 opposite to the first surface P1. . A through hole HD is formed by the hole on the first surface P1 and the hole on the second surface P2. Note that the shape of the hole is not limited to a circle, but may be an ellipse, a square, or the like.

The diameter of the hole formed on the first surface P1 of the through hole HD is preferably a maximum diameter that does not overlap the arrangement position of the electrode to which the pad 64 is connected, and The diameter of the hole to be formed is preferably such that the tip side of the needle N (shown in FIG. 5C) of the dispenser can be inserted to a predetermined depth. For example, the through hole HD is arranged at a position on the first surface P1 corresponding to between the four pads located at the center of the first surface P1, and the diameter of the hole on the second surface P2 is It is sufficient that the diameter of the hole is larger than the diameter of the hole on the surface P1 of FIG. For example, the through hole HD is formed so that its diameter gradually increases from the first surface P1 to the second surface P2.

A plurality of mounting boards 60D each having a photosensor array and a scintillator 63 mounted on the board 61D are two-dimensionally arranged on the base of the X-ray detector (reference numeral "" in FIG. 11A to be described later). 60E" is replaced with "60D").

With a plurality of mounting boards 60D arranged two-dimensionally on the base of the X-ray detector, the tip of the needle N is inserted into each board 61D from the second surface of the through hole HD (see FIG. 5). (Illustrated in C)). Then, the underfill U is injected into the through hole HD from the tip of the needle N. The underfill U injected into the through hole HD from the tip of the needle N flows into the gap between the optical sensor 62 and the substrate 61D from the through hole HD, and is cured (as shown in FIG. 5(D)). The detector pack 70D is manufactured by providing the hardened underfill U on the mounting board 60D.

By providing an underfill U on the mounting board 60D for each of the plurality of detector packs 70D on the base, the X-ray detector 12 described later is manufactured (reference numeral "70E" in FIG. 12(A) described later). is replaced with "70D").

As described above, the substrate 61D can be expected to have the same effects as the substrate 61A described above.

(Substrate according to the fifth embodiment)
The substrate according to the fifth embodiment differs from the substrate 61D according to the fourth embodiment in that the positions of the holes are different.

FIG. 6 is a schematic diagram showing the configuration of a substrate according to the fifth embodiment. FIG. 6(A) shows a top view of the substrate according to the fifth embodiment. 6(B) to (D) show cross-sectional views taken along VI-VI in FIG. 6(A).

FIGS. 6A and 6B show a mounting board 60E including a board 61E according to the fifth embodiment. The mounting board 60E includes a board 61E, a scintillator 63, an optical sensor 62, and a plurality of pads 64. Note that in FIG. 6, the same members as those shown in FIG.

The substrate 61E is a multilayer, for example, a four-layer laminated substrate. The substrate 61E has a first surface P1 of the uppermost layer provided on the optical sensor 62 side and a second surface P2 of the lowermost layer opposite to the first surface P1. For example, the substrate elements constituting each layer of the substrate 61E are ceramic substrates made of alumina.

In the fifth embodiment, a through hole HE for underfill injection is provided in the substrate 61E. Specifically, the substrate 61E has holes provided between the plurality of pads 64 on the first surface P1, and the holes are provided so as to penetrate through the second surface P2 opposite to the first surface P1. . A through hole HE is formed by the hole on the first surface P1 and the hole on the second surface P2. Note that the shape of the hole is not limited to a circle, but may be an ellipse, a square, or the like.

It is preferable that the diameter of the hole formed on the first surface P1 of the through hole HE is a maximum diameter that does not overlap the arrangement position of the electrode to which the pad 64 is connected, and The diameter of the hole to be formed is preferably such that the tip side of the needle N (shown in FIG. 6(C)) of the dispenser can be inserted to a predetermined depth. For example, the through hole HE is arranged at a position on the first surface P1 corresponding to between the four pads located at the center of the first surface P1, and the diameter of the hole on the second surface P2 is It is sufficient that the diameter of the hole is larger than the diameter of the hole on the surface P1 of FIG. For example, the through holes HE are formed so that the diameter gradually increases from the first surface P1 to the second surface P2, and the centers of each hole are formed at different positions.

A plurality of mounting boards 60E each having a photosensor array and a scintillator 63 mounted on the board 61E are two-dimensionally arranged on the base of the X-ray detector (the state shown in FIG. 11, which will be described later).

With a plurality of mounting boards 60C arranged two-dimensionally on the base of the X-ray detector, the tip of the needle N is inserted into each board 61E from the second surface of the through hole HE (see FIG. 6). (Illustrated in C)). Then, the underfill U is injected into the through hole HE from the tip of the needle N. The underfill U injected into the through hole HE from the tip of the needle N flows into the gap between the optical sensor 62 and the substrate 61E from the through hole HE, and is cured (shown in FIG. 6(D)). The detector pack 70E is manufactured by providing the hardened underfill U on the mounting board 60E.

By providing underfill U on the mounting board 60E for each of the plurality of detector packs 70E on the base, the X-ray detector 12 described later is manufactured (state in FIG. 12 described later).

As described above, the substrate 61E can be expected to have the same effects as the substrate 61A described above.

(Modified example)
Although the description has been made using FIGS. 1 and 3 to 6 on the assumption that the through holes are arranged between the four electrodes located at the center of the first surface P1, the present invention is not limited to that case. For example, a through hole may be arranged between four electrodes located other than the center of the substrate, or a through hole may be arranged between four electrodes, and a through hole may be arranged between another four electrodes. may be placed. A modified example of the substrate 61E in the former case is shown in FIG. 7(A), and a modified example of the substrate 61E in the latter case is shown in FIG. 7(B).

FIG. 7 is a top view showing first and second modified examples of the substrate according to the fifth embodiment. FIG. 7A shows a configuration in which through holes are arranged between four electrodes located other than the center of the substrate 61E (shown in FIG. 6). FIG. 7(B) shows a configuration in which a through hole is arranged between four electrodes and a through hole is arranged between another four electrodes.

Further, for example, a through hole may be arranged between two electrodes located at the ends of the substrate and the end of the substrate. In that case, between the four electrodes, two electrodes located at the end of the first substrate and two electrodes on the adjacent second substrate that are close to the two electrodes, A through hole will be placed.

FIG. 8 is a top view showing a third modification of the substrate according to the fifth embodiment. FIG. 8 shows a configuration in which through holes are arranged between two electrodes located at the ends of the substrate 61E and the ends of the substrate.

As described above, according to the first to third modified examples of the substrates 61A to 61E shown in FIGS. 7 and 8, effects equivalent to those of the substrate 61A described above can be expected.

Furthermore, a groove may be provided at a position spaced a predetermined distance from the hole on the second surface P2. A modification of the substrate 61E in this case is shown in FIG.

FIG. 9 is a schematic diagram showing a fourth modification of the substrate according to the fifth embodiment. FIG. 9A shows a bottom view of the substrate according to the fifth embodiment. FIG. 9(B) shows a sectional view taken along line IX-IX in FIG. 9(A).

A groove G is provided at a position spaced a predetermined distance from the hole on the second surface P2. Thereby, the groove G can prevent leakage of the underfill U, which is injected by inserting the tip of the needle N into the hole of the substrate, from the hole. Note that the shape of the groove G when viewed from the bottom surface is not limited to a circular shape provided at a position spaced a certain distance from the hole in the second surface P2, but may be an elliptical shape or a square shape.

As described above, according to the fourth modified example of the substrates 61A to 61E shown in FIG. You can also stop it with G.

(Application example of the substrate according to the first to fifth embodiments)
Next, a case where the substrates 61A to 61E described in FIGS. 1 and 3 to 9 are applied to an X-ray detector will be described below. Note that, although a case will be described below taking as an example a case where the substrate 61E shown in FIG. 6 among FIGS. 1 and 3 to 9 is applied to an X-ray detector, the present invention is not limited to that case. For example, any one of FIGS. 1, 3 to 5, and 7 to 9 may be applied to the X-ray detector. Further, although a case where the X-ray detector is provided in an X-ray CT apparatus will be described below, the present invention is not limited to this case. For example, the X-ray detector may be provided in a diagnostic device such as an X-ray diagnostic device or a PET (Positron Emission Tomography)-CT device.

Data acquisition methods using X-ray CT devices include the Rotate/Rotate (R-R) method, in which the X-ray source and X-ray detector rotate around the subject as a single unit, and the ring-shaped There are various methods such as a stationary/rotate (SR) method in which a large number of detection elements are arrayed in the X-ray tube and only the X-ray tube rotates around the subject. The present invention is applicable to either method. Hereinafter, an X-ray CT apparatus according to an embodiment will be described, taking as an example a case where the third generation rotation/rotation method, which is currently the mainstream, is adopted.

FIG. 10 is a schematic diagram showing the configuration of an X-ray CT apparatus to which the substrate according to the embodiment is applied.

FIG. 10 shows an X-ray CT apparatus 1 to which a substrate 61E (shown in FIG. 6) according to the embodiment is applied. The X-ray CT apparatus 1 includes a gantry device 10, a bed device 30, and a console device 40. The gantry device 10 and the bed device 30 are installed in an examination room. The gantry device 10 acquires X-ray detection data (also referred to as "pure raw data") regarding the subject (eg, patient) P placed on the bed device 30. The console device 40 generates raw data by performing preprocessing on the detection data for a plurality of views, and reconstructs and displays CT image data by performing reconstruction processing on the raw data.

In FIG. 10, for convenience of explanation, a plurality of gantry devices 10 are drawn above and below the left side, but in actual configuration, there is only one gantry device 10.

The gantry device 10 includes an X-ray source (for example, an X-ray tube) 11, an X-ray detector 12, a rotating section (for example, a rotating frame) 13, an X-ray high voltage device 14, a control device 15, and a wedge 16, a collimator 17, and a data acquisition circuit (DAS: Data Acquisition System) 18. Note that the pedestal device 10 is an example of a pedestal section.

The X-ray tube 11 is provided on a rotating frame 13. The X-ray tube 11 is a vacuum tube that generates X-rays by applying a high voltage from the X-ray high-voltage device 14 to irradiate thermoelectrons from a cathode (filament) toward an anode (target). For example, the X-ray tube 11 includes a rotating anode type X-ray tube that generates X-rays by irradiating a rotating anode with thermoelectrons.

In addition, in the embodiment, it can be applied to both a single-tube type X-ray CT device and a so-called multi-tube type X-ray CT device in which multiple pairs of X-ray tubes and X-ray detectors are mounted on a rotating ring. Applicable. Furthermore, the X-ray source that generates X-rays is not limited to the X-ray tube 11. For example, in place of the X-ray tube 11, examples include a focus coil that converges the electron beam generated from the electron gun, a deflection coil that electromagnetically deflects it, and a target that surrounds half the patient P and generates X-rays when the deflected electron beam collides with it. X-rays may be generated by a fifth generation system including a ring. Note that the X-ray tube 11 is an example of an X-ray irradiation unit.

The X-ray detector 12 is provided on the rotating frame 13 so as to face the X-ray tube 11 . The X-ray detector 12 detects the X-rays irradiated from the X-ray tube 11, and outputs detection data corresponding to the X-ray dose to the DAS 18 as an electrical signal. The X-ray detector 12 has, for example, a plurality of X-ray detection element rows in which a plurality of X-ray detection elements are arranged in the channel direction along one circular arc centered on the focal point of the X-ray tube. The X-ray detector 12 has, for example, a two-dimensional array structure in which a plurality of X-ray detection element rows in which a plurality of X-ray detection elements are arranged in a channel direction are arranged in a column direction (slice direction, row direction). In this embodiment, a configuration is assumed in which the X-ray detection element array is realized by a plurality of detector packs 70E. Note that the detector pack is one of the detector pack 70A in FIG. 1(D), the detector pack 70B in FIG. 3(D), the detector pack 70C in FIG. 4(D), and the detector pack 70D in FIG. Needless to say, it may be.

Each of the plurality of detector packs 70E is an indirect conversion type detector having a photosensor array and a scintillator 63, as described above using FIG. The grid is an X-ray shielding plate that is arranged on the X-ray incident side surface of a scintillator array made up of a plurality of scintillators and has a function of absorbing scattered X-rays.

Here, a method for manufacturing the X-ray detector 12 will be outlined using FIGS. 11 and 12.

FIG. 11 is a diagram showing the X-ray detector 12' of the X-ray detector 12 before each mounting board is filled with the underfill U (hereinafter referred to as "X-ray detector before filling"). . FIG. 11(A) shows a top view of the X-ray detector 12' before filling. FIG. 11(B) shows a cross-sectional view taken along line XI-XI in FIG. 11(A).

As shown in FIGS. 11A and 11B, the X-ray detector 12' before filling is composed of a plurality of mounting boards 60E arranged in the channel direction and the column direction. The mounting board 60E is also shown in FIGS. 6(A) and 6(B).

A needle of a dispenser is inserted from the lower side of the through hole HE of the substrate 61E constituting the mounting board 60E, and the underfill U is injected into the through hole HE through the needle. As described above, the underfill U is also filled into the gap between the substrate 61E and the optical sensor 62 via the through hole HE and hardened. When the filled underfill U is cured, an X-ray detector 12 consisting of a plurality of detector packs 70E as shown in FIGS. 12(A) and 12(B) is manufactured.

In this way, with the mounting board 60E, there is no need to directly inject underfill through the extremely narrow gap between adjacent optical sensors. Furthermore, since the mounting board 60E is not tilted to inject underfill, there is no possibility that the underfill will adhere to the scintillator and the transparent adhesive film and deteriorate the performance of the detector pack manufactured later. Furthermore, since there is no need to inject underfill through the gap between the adjacent mounting boards 60E, there is no need to form such a gap, and the side surface of the optical sensor 62 and the side surface of the scintillator 63 are flush with each other, and multiple It is also possible to arrange the detector packs 70E closely together without any gaps.

FIG. 12 is a diagram showing an X-ray detector 12 manufactured from an X-ray detector 12' before filling. FIG. 12(A) shows a top view of the X-ray detector 12. FIG. 12(B) shows a cross-sectional view taken along line XII-XII of FIG. 12(A). Before filling the substrate 61E with the underfill U or after the underfill U is hardened, the X-ray detector 12 is manufactured by disposing a grid on the X-ray incident side.

Note that the X-ray detector 12 may be a direct conversion type detector having a semiconductor element that converts incident X-rays into electrical signals. Furthermore, the X-ray detector 12 is an example of an X-ray detection section.

Returning to the explanation of FIG. 10, the rotating frame 13 supports the X-ray tube 11 and the X-ray detector 12 facing each other. The rotating frame 13 is an annular frame that rotates the X-ray tube 11 and the X-ray detector 12 together under the control of a control device 15, which will be described later. Note that, in addition to the X-ray tube 11 and the X-ray detector 12, the rotating frame 13 may further include and support an X-ray high voltage device 14 and a DAS 18. Furthermore, the rotating frame 13 is an example of a rotating section.

In this way, the X-ray CT apparatus 1 rotates the rotating frame 13, which supports the X-ray tube 11 and the X-ray detector 12 facing each other, around the patient P, thereby providing multiple views of the patient P. Collects 360° worth of detection data. Note that the reconstruction method for CT image data is not limited to the full scan reconstruction method using 360° worth of detection data. For example, the X-ray CT apparatus 1 may employ a half-reconstruction method in which CT image data is reconstructed based on detection data for a half-circle (180°) + fan angle.

The X-ray high voltage device 14 is provided on the rotating frame 13 or a non-rotating portion (for example, a fixed frame, not shown) that rotatably supports the rotating frame 13. The X-ray high voltage device 14 has electric circuits such as a transformer and a rectifier. The X-ray high voltage device 14 includes a high voltage generator (not shown) that has a function of generating a high voltage to be applied to the X-ray tube 11 under the control of a control device 15 that will be described later, and a high voltage generator (not shown) that has a function of generating a high voltage to be applied to the Below, it has an X-ray control device (not shown) that controls the output voltage according to the X-rays irradiated by the X-ray tube 11. The high voltage generator may be of a transformer type or an inverter type. Note that in FIG. 10, for convenience of explanation, the X-ray high voltage device 14 is placed at a position in the positive direction of the x-axis with respect to the X-ray tube 11; It may be placed at a position in the direction.

The control device 15 includes a processing circuit, a memory, and a drive mechanism such as a motor and an actuator. The configurations of the processing circuit and memory are the same as the processing circuit 44 and memory 41 of the console device 40, which will be described later, so a description thereof will be omitted.

The control device 15 has a function of receiving input signals from an input interface, which will be described later, attached to the console device 40 or the gantry device 10, and controlling the operations of the gantry device 10 and the bed device 30. For example, the control device 15 receives an input signal and performs control to rotate the rotating frame 13, control to tilt the gantry device 10, and control to operate the bed device 30 and the top plate 33. Note that the control for tilting the gantry device 10 is performed by the control device 15 tilting the rotating frame 13 about an axis parallel to the This is achieved by rotating the . Note that the control device 15 may be provided on the gantry device 10 or may be provided on the console device 40. Note that the control device 15 is an example of a control section.

The control device 15 also controls the rotation angle of the X-ray tube 11 and the rotation angle of the wedge 16 and collimator 17, which will be described later, based on imaging conditions input from an input interface, which will be described later, attached to the console device 40 and the gantry device 10. Control behavior.

The wedge 16 is provided on the rotating frame 13 so as to be disposed on the X-ray emission side of the X-ray tube 11. The wedge 16 is a filter for adjusting the amount of X-rays irradiated from the X-ray tube 11 under the control of the control device 15. Specifically, the wedge 16 is a filter that transmits and attenuates the X-rays irradiated from the X-ray tube 11 so that the X-rays irradiated from the X-ray tube 11 to the patient P have a predetermined distribution. It is. For example, the wedge 16 (wedge filter or bow-tie filter) is a filter made of aluminum processed to have a predetermined target angle and a predetermined thickness.

The collimator 17 is also called an X-ray diaphragm or a slit, and is provided on the rotating frame 13 so as to be disposed on the X-ray emission side of the X-ray tube 11. The collimator 17 is a lead plate or the like for narrowing down the irradiation range of the X-rays transmitted through the wedge 16 under the control of the control device 15, and forms an X-ray irradiation aperture by combining a plurality of lead plates or the like.

The DAS 18 is provided on the rotating frame 13. The DAS 18 includes an amplifier that performs amplification processing on the electrical signals output from each X-ray detection element of the X-ray detector 12 under the control of the control device 15, and an amplifier that amplifies the electrical signals under the control of the control device 15. It has an A/D (Analog to Digital) converter that converts into a signal, and generates detection data after amplification and digital conversion. Detection data for multiple views generated by the DAS 18 is transferred to the console device 40.

Here, the detection data generated by the DAS 18 is transmitted from a transmitter having a light emitting diode (LED) provided in the rotating frame 13 to a receiver having a photodiode provided in the fixed frame of the gantry device 10 by optical communication. and is transferred to the console device 40. Note that the method of transmitting the detection data from the rotating frame 13 to the fixed frame of the gantry device 10 is not limited to the above-mentioned optical communication, but any method may be used as long as it is a non-contact data transmission method. Furthermore, the rotating frame 13 is an example of a rotating section.

The bed device 30 includes a base 31, a bed driving device 32, a top plate 33, and a support frame 34. The bed device 30 is a device on which a patient P to be scanned is placed and moves the patient P under the control of the control device 15.

The base 31 is a casing that supports the support frame 34 so as to be movable up and down in the vertical direction (y-axis direction).

The bed driving device 32 is a motor or actuator that moves the base 31 in the vertical direction (y-axis direction).

The top plate 33 is a plate provided on the upper surface of the support frame 34 and has a shape on which the patient P can be placed. The top plate 33 can be moved by a top drive device (shown in FIG. 3), which is a motor or actuator that moves the top plate 33 in the longitudinal direction (z-axis direction) of the top plate 33.

In addition to the top plate 33, the top drive device may move the support frame 34 in the longitudinal direction (z-axis direction) of the top plate 33. Further, the top drive device may move the base 31 of the bed device 30 together. When the present invention is applied to standing CT, a method may be adopted in which a patient moving mechanism corresponding to the top plate 33 is moved. Furthermore, when performing imaging that involves a relative change in the positional relationship between the imaging system of the gantry device 10 and the top plate 33, such as scano-imaging for helical scanning or positioning, the relative change in the positional relationship is This may be performed by driving the top plate 33, by moving the fixed portion of the gantry device 10, or by a combination thereof.

In the embodiment, the rotation axis of the rotation frame 13 in a non-tilted state or the longitudinal direction of the top plate 33 of the bed device 30 is the z-axis direction, and the axial direction perpendicular to the z-axis direction and horizontal to the floor surface is the z-axis direction. The axial direction that is perpendicular to the x-axis direction and the z-axis direction and perpendicular to the floor surface is defined as the y-axis direction.

The console device 40 is configured as a computer and includes a memory 41, a display 42, an input interface 43, and a processing circuit 44. Although the console device 40 will be described as being separate from the gantry device 10, the gantry device 10 may include the console device 40 or a part of each component of the console device 40. Further, in the following description, it is assumed that the console device 40 executes all functions with a single console, but these functions may be executed with a plurality of consoles. Note that the console device 40 is an example of a medical image processing device.

The memory 41 is configured by, for example, a semiconductor memory element such as a RAM (Random Access Memory), a flash memory, a hard disk, an optical disk, or the like. The memory 41 may be configured by a portable medium such as a USB (Universal Serial Bus) memory and a DVD (Digital Video Disk). The memory 41 stores various processing programs (including application programs as well as an OS (Operating System), etc.) used in the processing circuit 44 and data necessary for executing the programs. Further, the OS may include a GUI (Graphic User Interface) that makes extensive use of graphics to display information on the display 42 to the operator and allows basic operations to be performed using the input interface 43.

The memory 41 stores, for example, detection data before preprocessing, raw data after preprocessing and before reconstruction, and reconstructed image data based on the raw data. Pre-processing means at least one of logarithmic conversion processing, offset correction processing, inter-channel sensitivity correction processing, beam hardening processing, etc. on the detected data. In addition, a cloud server that can be connected to the X-ray CT apparatus 1 via a communication network such as the Internet stores detected data, raw data, or reconstructed image data upon receiving a storage request from the X-ray CT apparatus 1. may be configured. Note that the memory 41 is an example of a storage section.

The display 42 displays various information. For example, the display 42 is a monitor that outputs reconstructed image data generated by the processing circuit 44 and a GUI (Graphical User Interface) for accepting various operations from the user. For example, the display 42 is a liquid crystal display, a CRT (Cathode Ray Tube) display, an OLED (Organic Light Emitting Diode) display, or the like. Further, the display 42 may be of a desktop type, or may be constituted by a tablet terminal or the like that can communicate wirelessly with the main body of the console device 40. Note that the display 42 is an example of a display section.

The input interface 43 includes an input device that can be operated by an operator such as a technician, and an input circuit that inputs signals from the input device. Input devices include mice, keyboards, trackballs, switches, buttons, joysticks, touchpads that perform input operations by touching the operating surface, touchscreens that integrate the display screen and touchpad, and non-controllers that use optical sensors. This is realized by a touch input circuit, a voice input circuit, etc. When the input device receives an input operation from the operator, the input circuit generates an electrical signal according to the input operation and outputs it to the processing circuit 44 . Further, the input interface 43 may be provided in the gantry device 10. Furthermore, the input interface 43 may be configured with a tablet terminal or the like that can communicate wirelessly with the console device 40 main body. Note that the input interface 43 is an example of an input section.

Note that the console device 40 may include a network interface (not shown). The network interface is composed of connectors that meet parallel connection specifications and serial connection specifications. When the X-ray CT apparatus 1 is installed on a medical imaging system, the network interface sends and receives information to and from external devices on the network. For example, under the control of the processing circuit 44, the network interface receives an examination order related to a CT examination from an external device, and also receives detection data acquired by the X-ray CT apparatus 1, raw data generated, or reconstructed data. Send image data to an external device.

The processing circuit 44 controls the overall operation of the X-ray CT apparatus 1. The processing circuit 44 means a dedicated or general-purpose processor such as a CPU (Central Processing Unit), an MPU (Micro Processor Unit), or a GPU (Graphics Processing Unit), as well as an ASIC, a programmable logic device, and the like. Examples of programmable logic devices include simple programmable logic devices (SPLDs), complex programmable logic devices (CPLDs), and field programmable gate arrays (FPGAs). Can be mentioned.

Further, the processing circuit 44 may be configured by a single circuit, or may be configured by a combination of a plurality of independent processing circuit elements. In the latter case, a memory may be provided individually for each processing circuit element, or a single memory may store programs corresponding to the functions of a plurality of processing circuit elements.

The console device 40 executes a CT scan including X-ray irradiation and detection by controlling the gantry device 10, bed device 30, etc. via the control device 15 according to preset scan conditions, and generates reconstructed image data. As a result, CT image data, which is a tomographic image, and three-dimensional image data are generated. For example, the scan conditions include tube current mA, tube voltage kV, X-ray intensity control conditions (X-ray modulation conditions), rotation speed of the X-ray tube 11 (or rotating frame 13), etc. regarding irradiated X-rays.

The console device 40 also has a function of storing reconstructed image data in the memory 41, a function of displaying the reconstructed image data as a reconstructed image on a display 42, and a function of displaying the reconstructed image data on a network interface (not shown). It may also include the ability to send data to an external device via an external device.

Next, a method for manufacturing the X-ray detector 12 will be described in detail.

FIG. 13 is a flowchart showing a method for manufacturing the X-ray detector 12. As shown in FIG. In FIG. 13, the symbol "ST" with a number indicates each step of the flowchart. Note that, unless otherwise specified, the case where the substrate is the substrate 61E shown in FIGS. 6, 11, and 12 will be described, but the present invention is not limited to that case. The substrate may be the substrates 61A to 61E shown in FIGS. 1, 3 to 5, and 7 to 9.

First, holes having different diameters and center positions are formed in a plurality of base materials, for example, four unfired green sheets, which are appropriately cut and become the basis of the substrate 61E (step ST1). For example, the holes may be formed when forming vias connecting upper and lower layer circuits in the green sheet.

The green sheet with the smallest diameter among the four green sheets is the one that is laminated on the fourth layer (top layer), so the hole is placed at the center position between the four electrodes on the first surface P1. It is formed. Since the green sheet with the second smallest diameter is laminated on the third layer, which is the layer below the fourth layer, the holes are formed at positions that partially overlap the holes in the fourth layer. Since the green sheet with the second largest diameter is laminated on the second layer, which is the layer below the third layer, the holes are formed at positions that partially overlap the holes in the third layer. Since the green sheet with the largest diameter is the first layer below the second layer, the holes are formed at positions that partially overlap the holes in the second layer. Further, the diameter of the hole in the first layer green sheet is larger than the diameter of the tip of the needle of the dispenser.

In addition, when the board is a single-layer board shown in FIGS. 1 and 3, the first surface P1 and the second surface P2 of one green sheet, which can be electrically connected to the plurality of pads 64, are What is necessary is to form a penetrating hole. Further, when the substrate is a single layer substrate shown in FIG. 3, the through hole may be formed so that the diameter increases from the first surface P1 to the second surface P2.

Next, a green sheet with a small hole diameter is used as an upper layer, a green sheet with a large hole diameter is used as a lower layer, and a circuit pattern is printed on each green sheet (step ST2).

The green sheets with small holes on which circuit patterns are printed are stacked on top, and the green sheets with large holes on which circuit patterns are printed are stacked on the bottom layer (step ST3). The substrate 61E is manufactured by pressure sintering the laminate (step ST4).

The optical sensor 62 and the scintillator 63 are mounted on the substrate 61E having the through holes HE formed by holes in each layer of the substrate 61E, thereby manufacturing the mounting substrate 60E (step ST5). A plurality of mounting boards 60E are two-dimensionally arranged on the base of the X-ray detector 12' along the channel direction and the column direction (step ST6). The state in which the plurality of mounting boards 60E are two-dimensionally arranged on the base of the X-ray detector 12' has already been explained using FIG. 11.

For each of the plurality of mounting boards 60E arranged two-dimensionally, the tip of the needle N is inserted into the second surface P2 side of the through hole HE (step ST7). For each of the plurality of two-dimensionally arranged mounting boards 60E, underfill U is injected into the through hole HE from the tip of the needle N, and the underfill U is injected into the through hole HE and the gap between the optical sensor 62 and the board 61E. is filled (step ST8).

The filled underfill U is cured for each of the plurality of two-dimensionally arranged mounting boards 60E, and the detector pack 70E is manufactured (step ST9). The state of the plurality of detector packs 70E after each of the plurality of mounting boards 60E is filled with underfill has already been explained using FIG. 12. A grid is installed in front of the plurality of detector packs 70E to manufacture the X-ray detector 12 (step ST10).

As described above, according to the method for manufacturing the X-ray detector 12, by considering both the relationship with the arrangement position of the electrode on the first surface P1 and the relationship with the diameter of the needle N of the dispenser. Appropriate through holes HA to HE having positions and diameters corresponding to the arrangement positions of the electrodes and the diameters of the needles N can be provided in the substrates 61A to 61E. Thereby, the underfill U can be efficiently and effectively filled into the substrate. Furthermore, according to the method for manufacturing the X-ray detector 12, there is no need to form gaps between the adjacent mounting boards 60A to 60E, so the side surface of the optical sensor 62 and the side surface of the scintillator 63 are flush with each other, and multiple It is also possible to arrange the detector packs 70A to 70E densely without any gaps.

According to at least one embodiment described above, it is possible to provide a substrate that can be efficiently and effectively filled with a curing agent.

Although several embodiments of the invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included within the scope and gist of the invention as well as within the scope of the invention described in the claims and its equivalents.

1 X-ray CT device 12 X-ray detector 60A to 60E Mounting board 61A to 61E Board 62 Optical sensor 63 Scintillator 64 Pad 70A to 70E Detector pack N Needle HA to HE Through hole U Underfill

Claims (9)

A laminated board consisting of a plurality of substrate elements, having a first surface electrically connectable to a plurality of pads for electrically connecting with an electronic device , and a second surface opposite to the first surface. There it is,
The uppermost substrate element among the plurality of substrate elements has the first surface,
The lowest substrate element among the plurality of substrate elements has the second surface,
A through hole is provided between the plurality of pads so as to penetrate between the first surface and the second surface ,
The through hole is formed such that the center position of the hole in at least one of the plurality of board elements is different from the center position of the hole in the other board elements.
substrate. The hole on the second surface is provided with a size that allows the tip of a needle for underfill injection to be inserted to a predetermined depth.
The substrate according to claim 1. The hole in the second surface is provided to be larger than the hole in the first surface.
The substrate according to claim 1 or 2. A through hole is formed such that the size thereof gradually increases from the first surface to the second surface.
The substrate according to any one of claims 1 to 3. A through hole is formed by providing holes of different sizes in the uppermost layer substrate element and the lowermost layer substrate element, respectively.
The substrate according to claim 1. a groove is provided at a position spaced a predetermined distance from the hole in the second surface;
The substrate according to any one of claims 1 to 5 . A groove is provided at a position spaced apart from the hole of the second surface by the predetermined distance so as to surround the hole with the hole as the center.
The substrate according to claim 6. A plurality of the substrates according to any one of claims 1 to 7 are arranged.
Substrate for X-ray detector. A first surface of a laminated base material consisting of a plurality of substrate elements , which is electrically connectable to a plurality of pads for electrically connecting to an electronic device, and is the uppermost substrate element among the plurality of substrate elements. and a second surface opposite to the first surface and provided on the lowest substrate element among the plurality of substrate elements. a through hole is formed such that the center position of the hole in at least one of the plurality of substrate elements is different from the center position of the hole in the other substrate elements,
manufacturing a plurality of mounting boards by mounting electronic devices on the board having the through hole;
two-dimensionally arranging the plurality of mounting boards on a base;
For each of the plurality of two-dimensionally arranged mounting boards, inserting the tip of a needle into the second surface side of the through hole and injecting and filling the hardening agent.
A method for manufacturing an X-ray detector.

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