JP7034388B1 - Active particle supply device and water treatment system using it - Google Patents

Abstract

A contact portion (13) is provided in a space where the pressure around the water to be treated (2), in which the water to be treated (2) is sprayed from the nozzle (12) and is jetted due to the Venturi effect, is reduced, and the contact portion (13) is provided. An ejector (10) having a supply port (16) in which a dielectric (15) is arranged on the upper surface of the surface and an oxygen gas is supplied to a contact portion (13), and a plasma (100) that generates active particles in the oxygen gas. The active particle supply device (4) including the plasma generation device (11) for generating the contact portion (13).

Description

The present application relates to an active particle supply device and a water treatment system using the active particle supply device.

A water treatment system that decomposes and removes pollutants is equipped with an ozone generator, and a gas containing ozone with high oxidizing power is injected into the water to be treated using an ejector for purification treatment. There are two basic challenges with this system. (1) When high-concentration ozone is generated, the ozone generation efficiency is lowered and the water treatment efficiency is lowered. (2) An expensive dielectric barrier discharge generator with a complicated structure is required as an ozone generator.

To solve this problem, the water pipe to be treated (inner pipe) and the oxygen gas pipe (outer pipe) are arranged coaxially, the water pipe to be treated is used as a ground electrode, the oxygen gas pipe is used as a feeding electrode, and the feeding electrode is used. A system is disclosed in which a dielectric barrier discharge is generated by applying a high AC voltage between the ground electrodes to generate oxygen plasma (for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 4-222693

In the configuration of Patent Document 1, since the water pipe to be treated is used as a ground electrode, the discharge space for generating oxygen atoms is restricted only to the outer peripheral portion of the water pipe to be treated (inner pipe). Therefore, the discharge space that generates oxygen atoms and the contact portion where oxygen atoms are supplied to the water to be treated have a structure separated from each other. Since the rate of returning to oxygen molecules by the recombination reaction increases while the oxygen atoms are transported, there is a problem that the oxygen atoms are not effectively supplied to the water to be treated and the water treatment efficiency is lowered.

The present application discloses a technique for solving the above-mentioned problems, an active particle supply device capable of efficiently supplying active particles to water to be treated and efficiently purifying the water to be treated, and an active particle supply device thereof. The purpose is to obtain a water treatment system using.

The active particle supply device disclosed in the present application is provided with a contact portion in a space where the first fluid is jetted from a nozzle and the pressure around the first fluid jetted by the venturi effect is reduced, and the contact portion is the first. It includes an ejector provided with a supply port to which the second fluid is supplied, and a plasma generator for generating plasma that generates active particles in the second fluid in a region in contact with the first fluid .
The water treatment system disclosed in the present application includes the above-mentioned active particle supply device, and supplies active particles to water to be treated, which is the first fluid.

According to the active particle supply device and the water treatment system disclosed in the present application, the water to be treated can be efficiently purified.

It is a block diagram of the water treatment system provided with the active particle supply apparatus which concerns on Embodiment 1. FIG. It is a perspective view of the ejector of the active particle supply device which concerns on Embodiment 1. FIG. It is sectional drawing of the ejector of the active particle supply apparatus which concerns on Embodiment 1. FIG. It is a block diagram of the active particle supply apparatus which concerns on Embodiment 2. FIG. It is a perspective view of the ejector of the active particle supply device which concerns on Embodiment 2. FIG. It is sectional drawing of the ejector of the active particle supply apparatus which concerns on Embodiment 2. FIG. It is a block diagram of the water treatment system provided with the active particle supply apparatus which concerns on Embodiment 3. FIG. It is a block diagram of the water treatment system provided with the active particle supply apparatus which concerns on Embodiment 4. FIG. It is a perspective view of the ejector of the active particle supply device which concerns on Embodiment 4. FIG. It is sectional drawing of the ejector of the active particle supply apparatus which concerns on Embodiment 4. FIG. It is a block diagram of the active particle supply apparatus which concerns on Embodiment 5. It is a perspective view of the ejector of the active particle supply device which concerns on Embodiment 5. It is sectional drawing of the ejector of the active particle supply apparatus which concerns on Embodiment 5. FIG.

Embodiment 1.
The first embodiment includes a plasma generator and an ejector that injects water to be treated from a nozzle and lowers the pressure around the water to be treated that is jetted by the venturi effect, and the ejector reduces the pressure of the water to be treated. A contact part is provided in the space to be used, a dielectric is placed on the upper surface of the contact part, a supply port for supplying oxygen gas is provided to the contact part, and a high electric field is applied through the dielectric using a plasma generator. The present invention relates to an active particle supply device that generates plasma in a contact portion to generate active particles in oxygen gas, and a water treatment system that purifies water to be treated using the active particle supply device.

Hereinafter, with respect to the configuration and operation of the active particle supply device and the water treatment system according to the first embodiment, FIG. 1 which is a configuration diagram of a water treatment system provided with the active particle supply device, and a perspective view of an ejector of the active particle supply device. This will be described with reference to FIG. 2A, which is a cross-sectional view of the ejector, and FIG. 2B, which is a cross-sectional view of the ejector.

The configuration of the water treatment system 1 and the active particle supply device 4 of the first embodiment will be described with reference to the configuration diagram of FIG.
First, the configuration of the water treatment system 1 will be described.
The water treatment system 1 includes a treatment water tank 3 for storing the water to be treated 2 (first fluid), an active particle supply device 4 for purifying the water to be treated 2, and a circulation pump 5. The circulation pump 5 circulates the water to be treated 2 between the treated water tank 3 and the active particle supply device 4.
The treated water tank 3, the active particle supply device 4, and the circulation pump 5 are connected by a water to be treated pipe 6. In FIG. 1, the arrow (Y) indicates the direction in which the water to be treated 2 flows.
A valve 7 and a flow rate regulator 8 are connected to a water pipe 6 to be treated on the downstream side of the circulation pump 5, that is, on the upstream side of the active particle supply device 4. A valve 9 is connected to the water pipe 6 to be treated on the downstream side of the active particle supply device 4.

Next, the configuration of the active particle supply device 4 will be described.
The active particle supply device 4 is composed of an ejector 10 which is a mixing unit and a plasma generation device 11 which generates a plasma 100 which is an active particle generation means.
The ejector 10 in FIG. 1 shows a vertical cross section including a central axis in the direction in which the water to be treated 2 of the ejector 10 flows, except for a part, in order to make the configuration of the water treatment system 1 easy to understand.

First, the configuration of the ejector 10 will be described with reference to FIGS. 2A and 2B.
2A is a perspective view of the ejector 10, and FIG. 2B is a cross-sectional view. 2A and 2B are conceptual diagrams for making the configuration of the ejector 10 easy to understand.
In FIG. 2A, the direction in which the water to be treated 2 supplied to the ejector 10 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The distribution axis through which the water to be treated 2 flows coincides with the central axis of the ejector 10 in the Y-axis direction.
FIG. 2B is a cross-sectional view taken along the line AA of FIG. 2A, which is a cross-sectional view taken along a vertical plane including the central axis of the ejector 10. In the cross-sectional view of FIG. 2B, the gas supply port 16 does not originally exist, but it is described as a virtual line (dotted line) in order to make the positional relationship easy to understand.
In FIGS. 2A and 2B, "MW" indicates microwaves and "OG" indicates oxygen gas O2.
Hereinafter, when FIG. 2A and FIG. 2B are described together, FIG. 2 is appropriately described. The same applies to the description of the second and subsequent embodiments.

The ejector 10 is composed of a nozzle 12, a contact portion 13, a diffuser 14, and a dielectric 15. The nozzle 12 has a configuration in which the reduction angle is about 45 degrees and the cross-sectional area of the pipeline is gradually reduced toward the downstream side. The diffuser 14 has a configuration in which the pipe cross-sectional area is gradually expanded with an expansion angle of 5 to 10 degrees toward the downstream side.
The contact portion 13 refers to the entire region of the rectangular parallelepiped below the dielectric 15 in FIG. 2A.

In the ejector 10, the water to be treated 2 pressurized by the circulation pump 5 is supplied from the upstream of the nozzle 12. The water to be treated 2 having an increased flow velocity passes through the contact portion 13, and the pressure is recovered by the diffuser 14. The pressure-recovered water 2 to be treated is discharged from the downstream of the diffuser 14.
The contact portion 13 is in a negative pressure (negative pressure) state of several kPa to 50 kPa (absolute pressure) due to the Venturi effect of the water to be treated 2 sprayed from the nozzle 12.
The contact portion 13 includes a gas supply port 16 for supplying oxygen gas (second fluid) from a direction intersecting the flow axis of the water to be treated 2. Here, it is desirable that the intersecting directions are arranged at an angle of, for example, about 90 ° ± 30 °, preferably about 90 ° ± 5 °, with respect to the flow axis of the water to be treated 2.

In FIGS. 1 and 2, the position of the gas supply port 16 in the ejector 10 is arranged at a position eccentric upward from the distribution axis of the water to be treated 2. However, the position of the gas supply port 16 may be arranged on the distribution axis.
The contact portion 13 becomes a negative pressure due to the Venturi effect, oxygen gas supplied from the gas supply port 16 is sucked into the water to be treated 2, and the water to be treated 2 and the oxygen gas are mixed.
In FIG. 1, a dielectric 15 is arranged on the upper surface of the contact portion 13. The dielectric 15 has a property of transmitting a part of microwaves and reflecting the rest.
Quartz and alumina are preferably used for the dielectric 15, but other materials may be used. The plasma generator 11 is connected to the upper part of the dielectric 15, that is, the upper surface side of the contact portion 13 of the ejector 10.

Next, the configuration of the plasma generation device 11 will be described.
The plasma generator 11 includes a microwave oscillator 17, a rectangular waveguide 18, an isolator 19, a directional coupler 20, a matching unit 21, a reactor 22, a short plunger 23, and a slot antenna 24.
The plasma generation device 11 generates the plasma 100 in the oxygen gas supplied from the gas supply port 16 to the contact portion 13 of the ejector 10.
The microwave oscillator 17, the isolator 19, the directional coupler 20, and the matching unit 21 are connected by a rectangular waveguide 18.
The configuration of the plasma generator 11 is an example and may be different from the above.

The microwave oscillator 17 is a device for generating microwaves, and it is assumed that a magnetron is used to generate microwaves. However, a semiconductor method or another method may be used.
The microwave frequency used in the microwave oscillator 17 is about 2.45 GHz, but other frequencies may be used.

The isolator 19 is connected to the subsequent stage of the microwave oscillator 17. The isolator 19 propagates the microwave (incident wave) generated by the microwave oscillator 17 with low loss, but sufficiently attenuates the microwave (reflected wave) reflected from the short plunger 23. That is, the isolator 19 is installed for the purpose of protecting the microwave oscillator 17 from the reflected wave.

The directional coupler 20 is connected to the subsequent stage of the isolator 19, separates the incident wave and the reflected wave, detects each of them, and measures the electric power (incident wave-reflected wave) consumed by the plasma 100. The output of the microwave oscillator 17 is adjusted using the measured value of the power consumption of the plasma 100.
The matching unit 21 is connected to the subsequent stage of the directional coupler 20 and matches the entire circuit impedance of the plasma generator 11.
The reactor 22 connected to the subsequent stage of the matching unit 21 has a rectangular parallelepiped shape, and the material is aluminum, copper, steel, or other metal. Further, the inner surface or the outer surface of the reactor 22 may be plated.

A slot antenna 24 having a slot cut is arranged on the lower surface of the reactor 22. Microwaves are radiated from the slot antenna 24 toward the dielectric 15 of the ejector 10.
The width of the slot antenna 24 is preferably 1 mm or less. The slot antenna 24 blocks the current flowing on the lower surface of the reactor 22 to generate a high electric field in the slot portion, and the plasma 100 is excited in the contact portion 13 of the ejector 10.

The short plunger 23 is connected to the rear stage of the reactor 22 and reflects microwaves. A reflector (not shown) is installed in the short plunger 23. By adjusting the distance from the reactor 22 to the reflector, a standing wave is generated in the space from the reactor 22 to the short plunger 23. By using this standing wave, plasma 100 is likely to be generated in the contact portion 13 of the ejector 10.

Next, the generation of plasma 100, the generation of oxygen atoms, and the purification of the water to be treated at the contact portion 13 of the ejector 10 will be described.
The plasma generator 11 introduces microwaves from the microwave oscillator 17 and generates a high electric field at the slot antenna 24 in the reactor 22 to generate plasma 100 at the contact portion 13 of the ejector 10.
In this plasma 100, oxygen atoms (O), which are active particles, are generated from oxygen gas by electron collision (O2 + e → O + O + e, where e indicates an electron).
As can be seen in FIG. 2B, in the first embodiment, the plasma 100 is generated in the upper part of the contact portion 13, that is, the region between the lower surface of the dielectric 15 and the upper surface of the flow path of the water to be treated 2.

The active particle supply device 4 supplies the active gas containing oxygen atoms generated by the plasma 100 to the water to be treated 2 flowing through the contact portion 13 in the ejector 10. In this way, the water treatment system 1 purifies the water to be treated 2 by oxidatively decomposing organic components and the like in the water to be treated 2.

The plasma generation device 11 generates plasma 100 by microwaves. For this reason, it is possible to generate a higher density plasma 100 with the same input power as compared with the conventionally used plasma using a high frequency of several hundred kHz or more (for example, inductively coupled plasma, capacitively coupled plasma, etc.). Can be done. As a result, when oxygen gas is used, high-density oxygen atoms can be generated.

The oxygen atom generated by the plasma 100 is rapidly deactivated when it leaves the plasma 100 (O + O → O2). Therefore, it is necessary to supply the active gas containing the oxygen atom to the water to be treated 2 before the oxygen atom is deactivated. Therefore, it is necessary to set the time from when the oxygen atom leaves the plasma 100 to when it reaches the water to be treated 2 to 1 msec or less.
In the active particle supply device 4 of the first embodiment, since the plasma 100 is generated in the contact portion 13 of the ejector 10, the deactivation of oxygen atoms can be suppressed and the water can be immediately supplied to the water to be treated 2. As a result, the water treatment performance of the active particle supply device 4 can be dramatically improved.

In the first embodiment, the water to be treated 2 is shown as the first fluid, but oxygen-containing gas such as oxygen gas or air may be used as the first fluid. At this time, the oxygen atom generated in the contact portion 13 in the ejector 10 is mixed with the oxygen-containing gas and converted into ozone, and the plasma generator 11 functions as a highly efficient ozone generator.

Further, in the first embodiment, it is assumed that oxygen gas is used as the second fluid. However, an inert gas (for example, helium gas, argon gas, etc.) may be used, or the inert gas may be added to the oxygen gas.
In this case, helium gas and argon gas can generate plasma relatively easily as compared with oxygen gas which is electron-adhering.
When the plasma 100 is generated with an inert gas, hydroxyl radicals are generated at the contact portion 13.

By controlling the flow rate of the inert gas in the first embodiment, the plasma 100 can be easily generated. That is, after the inert gas is flowed through the gas supply port 16 to generate the plasma 100, the flow rate of the inert gas is gradually reduced and the flow rate of the oxygen gas is increased. Finally, by controlling the plasma 100 to be maintained only by the oxygen gas, the plasma 100 can be easily generated.

The plasma 100 can be easily generated by controlling the flow rate of the oxygen gas before and after the plasma generation without using the inert gas.
The flow rate of oxygen gas supplied from the gas supply port 16 to the contact portion 13 is throttled, and in that state, the introduction of microwaves from the microwave oscillator 17 is started. As a result, since the gas pressure in the contact portion 13 is low, the plasma 100 can be easily generated. Then, after the plasma 100 is generated, the flow rate of the oxygen gas is gradually increased to increase the gas pressure of the contact portion 13, and the plasma 100 can be stably maintained.

The ejector 10 is exposed to active gases such as oxygen atom (O), ozone (O3), hydrogen peroxide (H2O2), and hydroxyl radical (OH). Therefore, it is desirable to use a material having high corrosion resistance as the material of the ejector 10.
As the material of the ejector 10, for example, a metal material such as stainless steel (SUS (stainless steel) 316, SUS304, etc.), fluorine such as PTFE (polytetrafluoroethylene) (polytetrafluoroethylene), PFA (p-fluorophenylalane) (perfluoroalkoxy alkane), etc. A resin or a material whose surface is coated with a fluororesin can be used.

Further, in the water treatment system 1 of the first embodiment, the treated water 2 that passes through the active particle supply device 4 and returns to the treated water tank 3 may contain ozone generated from oxygen atoms. be. Therefore, as shown in FIG. 1, it is desirable that the treated water tank 3 is provided with an exhaust port 25 and an ozone decomposition treatment device 26 using activated carbon or the like.

The water treatment system 1 of FIG. 1 includes a treated water tank 3 for storing the water to be treated 2, an active particle supply device 4 for purifying the water to be treated 2, and a circulation pump 5, and the water to be treated 2 is a so-called closed loop. Is purifying.
It is also possible to apply the active particle supply device 4 to a so-called open loop system in which the water to be treated to be purified is supplied to the active particle supply device 4 and the water to be treated is purified and then discharged.

As described above, the active particle supply device of the first embodiment includes an ejector that injects the first fluid from the nozzle and lowers the pressure around the first fluid ejected by the venturi effect, and the ejector is provided. A contact part is provided in the space where the pressure of the first fluid drops, a supply port for supplying the second fluid is provided in the contact part, and a plasma that generates active particles in the second fluid is generated in the contact part. Is. Further, the water treatment system purifies the water to be treated by using this active particle supply device.
Therefore, the water treatment system and the active particle supply device of the first embodiment can efficiently purify the water to be treated.

Embodiment 2.
In the active particle supply device of the second embodiment, dielectrics are arranged on the lower surface and both side surfaces in addition to the upper surface of the contact portion.

Regarding the configuration and operation of the active particle supply device according to the second embodiment, FIG. 3 is a configuration diagram of the active particle supply device, FIG. 4A is a perspective view of an ejector of the active particle supply device, and a cross-sectional view of the ejector. Based on 4B, the differences from the first embodiment will be mainly described.
In FIGS. 3 and 4 of the second embodiment, the same or corresponding parts as those of the first embodiment are designated by the same reference numerals.
In order to distinguish it from the first embodiment, the active particle supply device 204, the ejector 210, and the contact portion 213 are used.

In the second embodiment, the difference from the first embodiment is the structure of the contact portion 213 of the ejector 210. Therefore, in FIG. 3, the treated water tank 3 for storing the water to be treated 2 (first fluid) of the water treatment system, And the circulation pump 5 and the like are omitted.
First, the configuration of the active particle supply device 204 will be described.
The active particle supply device 204 includes an ejector 210 which is a mixing unit and a plasma generation device 11 which generates a plasma 100 which is an active particle generation means.
The ejector 210 in FIG. 3 shows a vertical cross section including the central axis in the direction in which the water to be treated of the ejector 210 flows, except for a part.

Next, the configuration of the ejector 210 will be described with reference to FIGS. 4A and 4B.
4A is a perspective view of the ejector 210, and FIG. 4B is a sectional view.
In FIG. 4A, the direction in which the water to be treated 2 supplied to the ejector 210 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The distribution axis through which the water to be treated 2 flows coincides with the central axis of the ejector 210 in the Y-axis direction.
FIG. 4B is a cross-sectional view taken along the line AA of FIG. 4A, which is a cross-sectional view taken along a vertical plane including the central axis of the ejector 210. In the cross-sectional view of FIG. 4B, the gas supply port 16 does not originally exist, but it is described as a virtual line (dotted line) so that the positional relationship can be easily understood.
In FIGS. 4A and 4B, "MW" indicates microwaves and "OG" indicates oxygen gas O2.

In the second embodiment, the method of generating the plasma 100 in the contact portion 213 of the plasma generator 11 and the ejector 210 is the same as that of the first embodiment.
The difference from the first embodiment, that is, the difference in the structure of the contact portion 213 and the difference in the generation region of the plasma 100 will be described.
As can be seen in FIG. 4A, the dielectric 15 is arranged on the contact portion 213 of the ejector 210 on all four surfaces, the lower surface, the right side surface, and the left side surface, in addition to the upper surface surface.
As a result, as can be seen in FIG. 4B, the plasma 100 is a region between the lower surface of the dielectric 15 at the upper part of the contact portion 213 and the upper surface of the flow path of the water to be treated, and further the dielectric 15 at the lower part of the contact portion 213. It also occurs in the area between the top surface and the bottom of the flow path of the water to be treated.

In the active particle supply device 204 of the second embodiment, by arranging the dielectrics 15 on the upper surface, the lower surface, and both side surfaces of the contact portion 213, the plasma 100 is spread over the entire outer periphery of the water to be treated 2 flowing through the contact portion 213. It can be generated and high-density oxygen atoms can be supplied to the water to be treated 2.

As described above, the active particle supply device of the second embodiment has dielectrics arranged on the lower surface and both side surfaces in addition to the upper surface of the contact portion.
Therefore, the active particle supply device of the second embodiment can efficiently purify the water to be treated. Further, the water to be treated can be purified with high-density oxygen atoms.

Embodiment 3.
The active particle supply device and the water treatment system of the third embodiment are provided with a swirling flow generator in front of the ejector of the active particle supply device.

The configuration and operation of the water treatment system and the active particle supply device according to the third embodiment are different from those of the first embodiment based on FIG. 5, which is a configuration diagram of the water treatment system including the active particle supply device. I will explain mainly.
In FIG. 5 of the third embodiment, the same or corresponding parts as those of the first embodiment are designated by the same reference numerals.
In order to distinguish it from the first embodiment, the water treatment system 301 and the active particle supply device 304 are used.

First, the configuration of the water treatment system 301 will be described.
The water treatment system 301 includes a treatment water tank 3 for storing the water to be treated 2 (first fluid), an active particle supply device 304 for purifying the water to be treated 2, a circulation pump 5, and a swirling flow generator 27. .. The swirling flow generator 27 is connected to the front stage of the active particle supply device 304 at the rear stage of the circulation pump 5. The circulation pump 5 circulates the water to be treated 2 between the treated water tank 3, the swirling flow generator 27, and the active particle supply device 304.
The treated water tank 3, the active particle supply device 304, the circulation pump 5, and the swirling flow generator 27 are connected by a water to be treated pipe 6. In FIG. 5, the arrow (Y) indicates the direction in which the water to be treated 2 flows.
A valve 7 and a flow rate regulator 8 are connected to a water pipe 6 to be treated on the downstream side of the circulation pump 5, that is, on the upstream side of the active particle supply device 304. A valve 9 is connected to the water pipe 6 to be treated on the downstream side of the active particle supply device 304.
Further, the water treatment system 301 includes an exhaust port 25 and an ozone decomposition treatment device 26.

Next, the configuration of the active particle supply device 304 will be described.
The active particle supply device 304 includes an ejector 10 which is a mixing unit and a plasma generation device 11 which generates a plasma 100 which is an active particle generation means.
The ejector 10 in FIG. 5 shows a vertical cross section including a central axis in the direction in which the water to be treated 2 of the ejector 10 flows, except for a part, in order to make the configuration of the water treatment system 301 easy to understand.
Further, since the configuration of the ejector 10 is the same as that of the first embodiment, the perspective view and the cross-sectional view of the ejector 10 are omitted.

Next, the function of the swirl flow generator 27 and its effect will be described.
The swirling flow generator 27 includes a mechanism for swirling the water to be treated 2. By providing the swirling flow generator 27 in front of the nozzle 12 of the ejector 10 of the active particle supply device 304, the water to be treated 2 is supplied to the nozzle 12 of the ejector 10 in a state of being swirled in a spiral shape. As a result, the flow velocity of the water to be treated 2 becomes high, and the inside of the contact portion 13 can be made into a stronger negative pressure state due to the Venturi effect. Therefore, it becomes easy to generate the plasma 100, and the oxygen atoms generated in the contact portion 13 can be efficiently supplied to the water to be treated 2.
Although the swirling flow generator 27 has been described as the device inside the active particle supply device 304 in the third embodiment, it may be a device outside the active particle supply device 304.
Further, in the third embodiment, the swirling flow generator 27 is provided in the active particle supply device 4 of the first embodiment, but the same effect can be obtained by providing the active particle supply device 204 of the second embodiment. Play.

As described above, the active particle supply device and the water treatment system of the third embodiment are provided with a swirling flow generator in front of the ejector of the active particle supply device.
Therefore, the water treatment system and the active particle supply device of the third embodiment can efficiently purify the water to be treated. Further, plasma can be easily generated, and oxygen atoms can be efficiently supplied to the water to be treated.

Embodiment 4.
In the active particle supply device and the water treatment system of the fourth embodiment, a constraint for preventing water droplet adhesion is added directly under the dielectric of the ejector.

Regarding the configuration and operation of the water treatment system and the active particle supply device according to the fourth embodiment, FIG. 6 is a configuration diagram of a water treatment system provided with the active particle supply device, and FIG. 6 is a perspective view of an ejector of the active particle supply device. 7A and FIG. 7B, which is a cross-sectional view of the ejector, will be mainly described with reference to the difference from the first embodiment.
In FIGS. 6 and 7 of the fourth embodiment, the same or corresponding parts as those of the first embodiment are designated by the same reference numerals.
In order to distinguish it from the first embodiment, the water treatment system 401, the active particle supply device 404, the ejector 410, and the contact portion 413 are used.

First, the configuration of the water treatment system 401 will be described.
The water treatment system 401 includes a treatment water tank 3 for storing the water to be treated 2 (first fluid), an active particle supply device 404 for purifying the water to be treated 2, and a circulation pump 5. The circulation pump 5 circulates the water to be treated 2 between the treated water tank 3 and the active particle supply device 404.
The treated water tank 3, the active particle supply device 404, and the circulation pump 5 are connected by a water to be treated pipe 6. In FIG. 6, the arrow (Y) indicates the direction in which the water to be treated 2 flows.
A valve 7 and a flow rate regulator 8 are connected to a water pipe 6 to be treated on the downstream side of the circulation pump 5, that is, on the upstream side of the active particle supply device 404. A valve 9 is connected to the water pipe 6 to be treated on the downstream side of the active particle supply device 404.
Further, the water treatment system 401 includes an exhaust port 25 and an ozone decomposition treatment device 26.

Next, the configuration of the active particle supply device 404 will be described.
The active particle supply device 404 includes an ejector 410 which is a mixing unit and a plasma generation device 11 which generates a plasma 100 which is an active particle generation means.
The ejector 410 of FIG. 6 shows a vertical cross section including a central axis in the direction in which the water to be treated 2 of the ejector 410 flows, except for a part, in order to make the configuration of the water treatment system 401 easy to understand.

Next, the configuration of the ejector 410 will be described with reference to FIGS. 7A and 7B.
7A is a perspective view of the ejector 410, and FIG. 7B is a cross-sectional view.
In FIG. 7A, the direction in which the water to be treated 2 supplied to the ejector 410 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The distribution axis through which the water to be treated 2 flows coincides with the central axis of the ejector 410 in the Y-axis direction.
FIG. 7B is a cross-sectional view taken along the line AA of FIG. 7A, which is a cross-sectional view taken along a vertical plane including the central axis of the ejector 410. In the cross-sectional view of FIG. 7B, the gas supply port 16 does not originally exist, but it is described as a virtual line (dotted line) so that the positional relationship can be easily understood.
In FIGS. 7A and 7B, "MW" indicates microwaves and "OG" indicates oxygen gas O2.

In the fourth embodiment, the method of generating the plasma 100 in the contact portion 413 of the plasma generator 11 and the ejector 410 is the same as that of the first embodiment.
In the fourth embodiment, the difference from the first embodiment is the structure of the contact portion 413 of the ejector 410.
The difference from the first embodiment, that is, the strictor 28 for preventing water droplet adhesion added to the contact portion 413 and its effect will be described.

As can be seen in FIGS. 6 and 7, in the contact portion 413, a restrictor 28 for preventing water droplet adhesion is provided directly under the dielectric 15.
When plasma 100 is generated by microwaves via the dielectric 15, if water adheres to the dielectric 15, it becomes difficult to stably maintain the plasma 100.
In the water treatment system 401 of the fourth embodiment, the restrictor 28 is arranged directly under the dielectric 15 in the contact portion 413 of the ejector 410 of the active particle supply device 404. By adding the constrictor 28 to the contact portion 413, it is possible to prevent the water scattered from the water to be treated 2 flowing through the contact portion 413 of the ejector 410 from adhering to the dielectric 15.

As can be seen in FIG. 7B, the plasma 100 is generated in the region between the lower surface of the dielectric 15 at the top of the contact portion 413 and the upper surface of the constrictor 28 installed on the upper surface of the flow path of the water to be treated. There is.

As a result of adding the restrictor 28 for preventing water droplets from adhering to the contact portion 413 of the ejector 410, the active particle supply device 404 of the fourth embodiment stably produces the plasma 100 without being affected by the water content of the water 2 to be treated. Can be maintained. As a result, the oxygen atom generated in the contact portion 413 can be efficiently supplied to the water to be treated 2.

The constrictor 28 is a plate having a thickness of about 1 mm and having a large number of through holes having a diameter of about 0.1 to 1 mm. As the material of the constrictor 28, it is desirable to use a material having high corrosion resistance. For example, a metal material such as stainless steel (SUS316, SUS304, etc.), a fluororesin such as PTFE or PFA, or a material whose surface is coated with a fluororesin can be used.
In the fourth embodiment, the restrictor 28 for preventing water droplet adhesion has been described by adding it to the active particle supply device 4 of the first embodiment, but the active particle supply device 204 of the second embodiment and the embodiment have been described. The same effect can be obtained even if it is provided in the active particle supply device 304 of the third embodiment.

As described above, in the water treatment system and the active particle supply device of the fourth embodiment, a constraint for preventing water droplet adhesion is added directly under the dielectric of the ejector.
Therefore, the water treatment system and the active particle supply device of the fourth embodiment can efficiently purify the water to be treated. Further, the plasma can be stably maintained without being affected by the water content of the water to be treated, and oxygen atoms can be supplied to the water to be treated with high efficiency.

Embodiment 5.
The active particle supply device according to the fifth embodiment uses a plasma generation device having a feeding electrode on the upper surface of the ejector, a grounding electrode on the lower surface, and an AC voltage applied between the feeding electrode and the grounding electrode. be.

Regarding the configuration and operation of the active particle supply device according to the fifth embodiment, FIG. 8 is a configuration diagram of the active particle supply device, FIG. 9A is a perspective view of an ejector of the active particle supply device, and a cross-sectional view of the ejector. Based on 9B, the differences from the first embodiment will be mainly described.
In FIGS. 8 and 9 of the fifth embodiment, the same or corresponding parts as those of the first embodiment are designated by the same reference numerals.
In order to distinguish it from the first embodiment, the active particle supply device 504, the plasma generation device 511, and the ejector 510 are used.

In the fifth embodiment, the difference from the first embodiment is the plasma generator 511. Therefore, in FIG. 8, the treated water tank 3 for storing the water to be treated 2 (first fluid) of the water treatment system and the circulation pump 5 are used. Etc. are omitted.
First, the configuration of the active particle supply device 504 will be described.
The active particle supply device 504 includes an ejector 510 which is a mixing unit and a plasma generation device 511 which generates plasma 100 which is an active particle generation means.
The ejector 510 in FIG. 8 shows a vertical cross section including the central axis in the direction in which the water to be treated of the ejector 510 flows, except for a part.

Next, the configuration of the ejector 510 will be described with reference to FIGS. 9A and 9B.
9A is a perspective view of the ejector 510, and FIG. 9B is a sectional view.
In FIG. 9A, the direction in which the water to be treated 2 supplied to the ejector 510 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The distribution axis through which the water to be treated 2 flows coincides with the central axis of the ejector 510 in the Y-axis direction.
9B is a cross-sectional view taken along the line AA of FIG. 9A, which is a cross-sectional view taken along a vertical plane including the central axis of the ejector 510. In the cross-sectional view of FIG. 9B, the gas supply port 16 does not originally exist, but it is described as a virtual line (dotted line) so that the positional relationship can be easily understood.
In FIG. 9A, "OG" indicates oxygen gas O2.
In FIG. 9A, the plasma generator 511 is not a component of the ejector 510, but is described for the sake of easy understanding of the overall configuration.

In the fifth embodiment, the method of generating the plasma 100 in the contact portion 13 of the ejector 510 is different from that of the first embodiment.
The structure and function of the plasma generator 511, which is different from the first embodiment, will be described.
The plasma generation device 511 includes a feeding electrode 29 provided on the upper surface of the ejector 510, a grounding electrode 30 provided on the lower surface, and an AC power supply 31 for applying an AC voltage to the feeding electrode 29.

By applying an AC voltage (frequency: several kHz, voltage: about 10 kV) output from the AC power supply 31 to the feeding electrode 29, plasma 100 is generated in the contact portion 13.
As can be seen in FIG. 9B, the plasma 100 is also generated in the region between the lower surface of the dielectric 15 at the upper part of the contact portion 13 and the upper surface of the flow path of the water to be treated, and further in the region below the flow path of the water to be treated. is doing. That is, plasma 100 is generated in the entire contact portion 13 other than the flow passage of the water to be treated.

The configuration and operation other than the method of generating the plasma 100 are the same as those in the first embodiment.
The active particle supply device 504 of the fifth embodiment has a simpler configuration than the case where plasma is generated by using the microwave described in the first embodiment. Further, in the active particle supply device 504 according to the fifth embodiment, stable plasma 100 can be generated regardless of the type of gas supplied from the gas supply port.

When the plasma generator 511 of the fifth embodiment is used, the water treatment efficiency is lowered because the plasma density is lower than that of the plasma generator 11 of the first embodiment using the microwave generator, but the structure is Easy and easy to operate.
In the fifth embodiment, the plasma generation device 511 having a feeding electrode and a grounding electrode on the upper and lower surfaces of the ejector and applying an AC voltage between the electrodes is applied to the active particle supply device 4 of the first embodiment. The same effect can be obtained even when applied to the active particle supply devices 204, 304, 404 of the second to fourth embodiments.

As described above, the active particle supply device of the fifth embodiment is provided with a feeding electrode on the upper surface of the ejector and a grounding electrode on the lower surface as a plasma generating device, and an AC voltage is applied between the feeding electrode and the grounding electrode. It is equipped with an AC power supply to be applied.
Therefore, the active particle supply device of the fifth embodiment can efficiently purify the water to be treated. Further, the configuration of the device becomes simple and the operation becomes easy.

Although the present application describes various exemplary embodiments and examples, the various features, embodiments, and functions described in one or more embodiments are applications of a particular embodiment. It is not limited to the above, and can be applied to embodiments alone or in various combinations.
Therefore, innumerable variations not exemplified are envisioned within the scope of the techniques disclosed in the present application. For example, it is assumed that at least one component is modified, added or omitted, and further, at least one component is extracted and combined with the components of other embodiments. ..

1,301,401 Water treatment system, 2 Treated water, 3 Treated water tank, 4,204, 304, 404, 504 Active particle supply device, 5 Circulation pump, 6 Treated water piping, 7, 9 valves, 8 Flow control Instrument, 10,210,410,510 ejector, 11,511 plasma generator, 12 nozzles, 13,213,413 contacts, 14 diffuser, 15 dielectric, 16 gas supply port, 17 microwave oscillator, 18 rectangular waveguide Pipes, 19 isolators, 20 directional couplers, 21 matchers, 22 reactors, 23 short plungers, 24 slot antennas, 25 exhaust ports, 26 ozone decomposition treatment equipment, 27 swirling flow generators, 28 constraints, 29 feeding electrodes, 30 ground electrode, 31 AC power supply, 100 waveguide.

Claims (12)

A supply port is provided with a contact portion in a space where the pressure around the first fluid injected by the venturi effect is reduced, and the second fluid is supplied to the contact portion. With an ejector and
An active particle supply device comprising a plasma generating device for generating plasma that generates active particles in the second fluid in a region in contact with the first fluid . The activity according to claim 1, wherein a dielectric is arranged on the upper surface of the contact portion, and a high electric field is applied from the outside of the dielectric through the dielectric to generate plasma in the second fluid. Particle feeder. The active particle supply device according to claim 2, wherein dielectrics are arranged on the lower surface and both side surfaces of the contact portion. The active particle supply device according to claim 2 or 3, wherein the plasma generation device introduces microwaves through the dielectric and generates the plasma. The active particle supply according to claim 2 or 3, wherein the plasma generation device includes a feeding electrode and a grounding electrode so as to sandwich the contact portion, and generates the plasma by applying an AC voltage to the feeding electrode. Device. The active particle supply device according to claim 1, wherein the second fluid is a gas containing oxygen, and the plasma generates oxygen atoms in the second fluid. The active particle supply device according to any one of claims 2 to 5, wherein the second fluid is a gas containing oxygen, and the plasma generates oxygen atoms in the second fluid. The active particle supply device according to any one of claims 2 to 5, wherein the contact portion includes a stricter for preventing water droplet adhesion below the dielectric. The active particle supply device according to any one of claims 1 to 8, wherein in the contact portion, the second fluid is supplied from a direction intersecting the flow axis of the first fluid. The active particle supply device according to any one of claims 1 to 9, further comprising a swirling flow generator that forms a swirling flow in the first fluid in front of the nozzle. The active particle supply device according to any one of claims 1 to 10 is provided.
A water treatment system that supplies the active particles to the water to be treated, which is the first fluid. The water treatment system according to claim 11, further comprising a circulation pump for supplying the water to be treated to the active particle supply device and a treatment water tank for storing the treated water discharged from the active particle supply device.

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