WO2022185429A1

WO2022185429A1 - Active particle supply device, and water treatment system using same

Info

Publication number: WO2022185429A1
Application number: PCT/JP2021/008070
Authority: WO
Inventors: 有波塩田; 昌樹葛本; 学生沼
Original assignee: 三菱電機株式会社
Priority date: 2021-03-03
Filing date: 2021-03-03
Publication date: 2022-09-09
Also published as: JPWO2022185429A1; JP7034388B1; CN116964007A

Abstract

An active particle supply device (4) including: an ejector (10) that includes a contact part (13) in a space where water (2) to be treated is injected from a nozzle (12) and the pressure around the injected water (2) to be treated is reduced by the Venturi effect, that has a dielectric (15) disposed on the top surface of the contact part (13), and that includes a supply port (16) through which oxygen gas is supplied to the contact part (13); and a plasma generation device (11) that generates, in the contact part (13), plasma (100) for generating active particles in the oxygen gas.

Description

ACTIVE PARTICLE SUPPLY DEVICE AND WATER TREATMENT SYSTEM USING THE SAME

This application relates to an active particle supply device and a water treatment system using it.

A water treatment system that decomposes and removes pollutants is equipped with an ozone generator, and gas containing highly oxidizing ozone is injected into the water to be treated using an ejector for purification. There are two basic problems with this system. (1) When high-concentration ozone is generated, the efficiency of ozone generation is lowered and the efficiency of water treatment is lowered. (2) As an ozone generator, a complicated and expensive dielectric barrier discharge generator is required.

To solve this problem, the water pipe to be treated (inner pipe) and the oxygen gas pipe (outer pipe) are arranged coaxially, the water pipe to be treated is used as a ground electrode, and the oxygen gas pipe is used as a power supply electrode. A system has been disclosed in which a dielectric barrier discharge is generated by applying a high AC voltage between ground electrodes to generate oxygen plasma (for example, Patent Document 1).

JP-A-4-222693

In the configuration of Patent Document 1, since the water pipe to be treated is used as a ground electrode, the discharge space for generating oxygen atoms is restricted only to the outer peripheral portion of the water pipe to be treated (inner pipe). Therefore, the discharge space for generating oxygen atoms and the contact portion for supplying the oxygen atoms to the water to be treated are separated from each other. Since the rate of oxygen atoms returning to oxygen molecules due to recombination reaction increases while oxygen atoms are being transported, oxygen atoms are not effectively supplied to the water to be treated, resulting in a problem of reduced water treatment efficiency.

The present application discloses a technique for solving the above-mentioned problems, and an active particle supply device capable of efficiently supplying active particles to the water to be treated and efficiently purifying the water to be treated, and the same. The object is to obtain a water treatment system using

The active particle supply device disclosed in the present application includes a contact portion in a space where a first fluid is ejected from a nozzle and the pressure around the ejected first fluid is reduced by the venturi effect, and the contact portion is provided with a second It comprises an ejector having a supply port to which two fluids are supplied, and a plasma generating device for generating plasma at a contact portion for generating active particles in the second fluid.
The water treatment system disclosed in the present application includes the active particle supply device, and supplies active particles to the water to be treated, which is the first fluid.

According to the active particle supply device and water treatment system disclosed in the present application, water to be treated can be efficiently purified.

1 is a configuration diagram of a water treatment system provided with an active particle supply device according to Embodiment 1. FIG. 4 is a perspective view of an ejector of the active particle supply device according to Embodiment 1. FIG. 4 is a cross-sectional view of an ejector of the active particle supply device according to Embodiment 1. FIG. FIG. 7 is a configuration diagram of an active particle supply device according to Embodiment 2; FIG. 8 is a perspective view of an ejector of the active particle supply device according to Embodiment 2; FIG. 8 is a cross-sectional view of an ejector of the active particle supply device according to Embodiment 2; FIG. 10 is a configuration diagram of a water treatment system provided with an active particle supply device according to Embodiment 3; FIG. 10 is a configuration diagram of a water treatment system provided with an active particle supply device according to Embodiment 4; FIG. 11 is a perspective view of an ejector of an active particle supply device according to Embodiment 4; FIG. 11 is a cross-sectional view of an ejector of an active particle supply device according to Embodiment 4; FIG. 11 is a configuration diagram of an active particle supply device according to Embodiment 5; FIG. 11 is a perspective view of an ejector of an active particle supply device according to Embodiment 5; FIG. 11 is a cross-sectional view of an ejector of an active particle supply device according to Embodiment 5;

Embodiment 1.
Embodiment 1 is provided with a plasma generator and an ejector that ejects water to be treated from a nozzle and reduces the pressure around the ejected water to be treated by the venturi effect. A contact portion is provided in the space where the contact portion is formed, a dielectric is arranged on the upper surface of the contact portion, a supply port for supplying oxygen gas is provided to the contact portion, and a high electric field is applied through the dielectric using a plasma generation device. The present invention relates to an active particle supply device that generates plasma in a contact portion to generate active particles in oxygen gas, and a water treatment system that purifies water to be treated using this active particle supply device.

The configuration and operation of the active particle supply device and the water treatment system according to Embodiment 1 will be described below with reference to FIG. 2A, and FIG. 2B, which is a sectional view of the ejector.

The configuration of the water treatment system 1 and the active particle supply device 4 of Embodiment 1 will be described based on the configuration diagram of FIG.
First, the configuration of the water treatment system 1 will be described.
The water treatment system 1 includes a treatment tank 3 for storing water 2 (first fluid) to be treated, an active particle supply device 4 for purifying the water 2 to be treated, and a circulation pump 5 . A circulation pump 5 circulates the water to be treated 2 between the treated water tank 3 and the active particle supply device 4 .
The treated water tank 3 , the active particle supply device 4 , and the circulation pump 5 are connected by a water to be treated pipe 6 . In FIG. 1, an arrow (Y) indicates the direction in which the water 2 to be treated flows.
A valve 7 and a flow rate regulator 8 are connected to the water-to-be-treated pipe 6 on the downstream side of the circulation pump 5, that is, on the upstream side of the active particle supply device 4. As shown in FIG. A valve 9 is connected to the water-to-be-treated pipe 6 on the downstream side of the active particle supply device 4 .

Next, the configuration of the active particle supply device 4 will be described.
The active particle supply device 4 is composed of an ejector 10 as a mixing section and a plasma generation device 11 that generates plasma 100 as an active particle generation means.
In order to make the configuration of the water treatment system 1 easier to understand, the ejector 10 in FIG. 1 shows a vertical cross section including the central axis of the ejector 10 in the direction in which the water 2 to be treated flows, except for a part.

First, the configuration of the ejector 10 will be described with reference to FIGS. 2A and 2B as well.
2A is a perspective view of the ejector 10, and FIG. 2B is a sectional view. 2A and 2B are conceptual diagrams for making the configuration of the ejector 10 easier to understand.
In FIG. 2A, the direction in which the water to be treated 2 supplied to the ejector 10 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The flow axis through which the water to be treated 2 flows coincides with the central axis of the ejector 10 in the Y-axis direction.
2B is a cross-sectional view taken along line AA in FIG. 2A, taken along a vertical plane including the central axis of the ejector 10. FIG. Although the gas supply port 16 does not exist in the cross-sectional view of FIG. 2B, it is shown as a virtual line (dotted line) in order to make the positional relationship easier to understand.
In FIGS. 2A and 2B, "MW" indicates microwaves, and "OG" indicates oxygen gas O2.
Hereinafter, when FIG. 2A and FIG. 2B are collectively described, they will be referred to as FIG. 2 as appropriate. The same applies to the description of the second and subsequent embodiments.

Ejector 10 is composed of nozzle 12 , contact portion 13 , diffuser 14 and dielectric 15 . The nozzle 12 has a configuration in which the pipe cross-sectional area is gradually narrowed toward the downstream side at a reduction angle of approximately 45 degrees. The diffuser 14 has a configuration in which the cross-sectional area of the pipeline is gradually expanded toward the downstream side at an expansion angle of 5 to 10 degrees.
The contact portion 13 refers to the entire rectangular parallelepiped area under the dielectric 15 in FIG. 2A.

In the ejector 10 , the water to be treated 2 pressurized by the circulation pump 5 is supplied from the upstream of the nozzle 12 . The water to be treated 2 whose flow velocity has increased passes through the contact portion 13 and pressure recovery is performed by the diffuser 14 . The water to be treated 2 whose pressure has been restored is discharged downstream of the diffuser 14 .
The contact portion 13 is in a negative pressure state of several kPa to 50 kPa (absolute pressure) due to the venturi effect of the water 2 to be treated injected from the nozzle 12 .
The contact portion 13 has a gas supply port 16 for supplying oxygen gas (second fluid) from a direction intersecting the flow axis of the water 2 to be treated. Here, the intersecting direction is, for example, desirably arranged at an angle of about 90°±30°, preferably about 90°±5° with respect to the flow axis of the water 2 to be treated.

1 and 2, the position of the gas supply port 16 in the ejector 10 is arranged at a position eccentrically upward from the flow axis of the water 2 to be treated. However, the position of the gas supply port 16 may be arranged on the flow axis.
The contact portion 13 has a negative pressure due to the venturi effect, the oxygen gas supplied from the gas supply port 16 is sucked into the water 2 to be treated, and the water 2 to be treated and the oxygen gas are mixed.
In FIG. 1, a dielectric 15 is arranged on the upper surface of the contact portion 13 . This dielectric 15 has the property of transmitting part of the microwave and reflecting the rest.
Quartz and alumina are preferably used for the dielectric 15, but other materials may be used. A plasma generator 11 is connected to the upper portion of the dielectric 15 , that is, to the upper surface side of the contact portion 13 of the ejector 10 .

Next, the configuration of the plasma generation device 11 will be described.
Plasma generator 11 comprises microwave oscillator 17 , rectangular waveguide 18 , isolator 19 , directional coupler 20 , matching device 21 , reactor 22 , short plunger 23 and slot antenna 24 .
The plasma generator 11 generates plasma 100 in oxygen gas supplied to the contact portion 13 of the ejector 10 from the gas supply port 16 .
A microwave oscillator 17 , an isolator 19 , a directional coupler 20 and a matching device 21 are connected by a rectangular waveguide 18 .
The configuration of the plasma generator 11 is an example, and may be different from the above.

The microwave oscillator 17 is a device for generating microwaves, and is assumed to generate microwaves using a magnetron. However, a semiconductor scheme or other schemes may be used.
The microwave frequency used by microwave oscillator 17 is approximately 2.45 GHz, although other frequencies may be used.

The isolator 19 is connected after the microwave oscillator 17 . The isolator 19 propagates the microwave (incident wave) generated by the microwave oscillator 17 with low loss, but sufficiently attenuates the microwave (reflected wave) reflected from the short plunger 23 . That is, the isolator 19 is installed for the purpose of protecting the microwave oscillator 17 from reflected waves.

The directional coupler 20 is connected after the isolator 19 , separates the incident wave and the reflected wave, detects them, and measures the power consumed in the plasma 100 (incident wave−reflected wave). The power consumption measurement of the plasma 100 is used to adjust the power of the microwave oscillator 17 .
The matching device 21 is connected after the directional coupler 20 and matches the circuit impedance of the entire plasma generating device 11 .
A reactor 22 connected to the rear stage of the matcher 21 has a rectangular parallelepiped shape and is made of aluminum, copper, steel or other metal. Also, the inner surface or the outer surface of the reactor 22 may be plated.

A slot antenna 24 with a slot is arranged on the lower surface of the reactor 22 . Microwaves are radiated from the slot antenna 24 toward the dielectric 15 of the ejector 10 .
The width of the slot antenna 24 is desirably 1 mm or less. A high electric field is generated in the slot portion by blocking the current flowing through the lower surface of the reactor 22 by the slot antenna 24 , and the plasma 100 is excited in the contact portion 13 of the ejector 10 .

The short plunger 23 is connected to the rear stage of the reactor 22 and reflects microwaves. A reflector (not shown) is attached inside the short plunger 23 . A standing wave is generated in the space from the reactor 22 to the short plunger 23 by adjusting the distance from the reactor 22 to the reflector. By using this standing wave, the plasma 100 is easily generated in the contact portion 13 of the ejector 10 .

Next, generation of the plasma 100, generation of oxygen atoms, and purification of the water to be treated at the contact portion 13 of the ejector 10 will be described.
The plasma generator 11 introduces microwaves from the microwave oscillator 17 and generates a high electric field with the slot antenna 24 in the reactor 22 to generate the plasma 100 at the contact portion 13 of the ejector 10 .
In this plasma 100, electron collisions generate oxygen atoms (O), which are active particles, from oxygen gas (O2+e→O+O+e, where e indicates an electron).
As can be seen from FIG. 2B, in Embodiment 1, the plasma 100 is generated in the upper portion of the contact portion 13, that is, the region between the lower surface of the dielectric 15 and the upper surface of the flow path for the water 2 to be treated.

The active particle supply device 4 supplies the active gas containing oxygen atoms generated by the plasma 100 to the water to be treated 2 flowing through the contact portion 13 in the ejector 10 . In this way, the water treatment system 1 purifies the water 2 to be treated by oxidatively decomposing the organic substances in the water 2 to be treated.

The plasma generation device 11 generates plasma 100 using microwaves. For this reason, compared to conventionally used plasma using high frequencies of several hundred kHz or higher (for example, inductive coupling plasma, capacitive coupling plasma, etc.), it is possible to generate higher density plasma 100 with the same input power. can be done. As a result, when oxygen gas is used, oxygen atoms can be produced at a high density.

Oxygen atoms generated in plasma 100 are rapidly deactivated (O+O→O2) upon leaving plasma 100 . Therefore, it is necessary to supply an active gas containing oxygen atoms to the water 2 to be treated before the oxygen atoms are deactivated. Therefore, it is necessary to set the time from when the oxygen atoms leave the plasma 100 until they reach the water 2 to be treated to 1 msec or less.
In the active particle supply device 4 of Embodiment 1, since the plasma 100 is generated at the contact portion 13 of the ejector 10, deactivation of oxygen atoms is suppressed and the water to be treated 2 can be supplied immediately. As a result, the water treatment performance of the active particle supply device 4 can be dramatically improved.

In Embodiment 1, the water to be treated 2 is shown as the first fluid, but the first fluid may be oxygen gas or an oxygen-containing gas such as air. At this time, the oxygen atoms generated at the contact portion 13 inside the ejector 10 are mixed with the oxygen-containing gas and converted into ozone, and the plasma generator 11 functions as a highly efficient ozone generator.

Moreover, in Embodiment 1, it is assumed that oxygen gas is used as the second fluid. However, an inert gas (eg, helium gas, argon gas, etc.) may be used, or an inert gas may be added to the oxygen gas.
In this case, helium gas and argon gas can generate plasma relatively easily compared to oxygen gas, which is electron-adhesive.
Note that when the plasma 100 is generated with an inert gas, hydroxyl radicals are generated at the contact portion 13 .

In Embodiment 1, the plasma 100 is easily generated by controlling the flow rate of the inert gas. That is, after the inert gas is supplied to the gas supply port 16 to generate the plasma 100, the flow rate of the inert gas is gradually decreased and the flow rate of the oxygen gas is increased. By finally controlling the plasma 100 to be maintained only by the oxygen gas, the generation of the plasma 100 is facilitated.

The plasma 100 can also be easily generated by controlling the flow rate of the oxygen gas before and after plasma generation without using an inert gas.
The flow rate of the oxygen gas supplied from the gas supply port 16 to the contact portion 13 is restricted, and in this state, introduction of microwaves from the microwave oscillator 17 is started. As a result, since the gas pressure in the contact portion 13 is low, the plasma 100 is easily generated. After the plasma 100 is generated, the flow rate of the oxygen gas is gradually increased to raise the gas pressure of the contact portion 13, thereby maintaining the plasma 100 stably.

The ejector 10 is exposed to active gases such as oxygen atoms (O), ozone (O3), hydrogen peroxide (H2O2), and hydroxyl radicals (OH). Therefore, it is desirable that the ejector 10 is made of a material having high corrosion resistance.
Examples of the material of the ejector 10 include metal materials such as stainless steel (SUS (stainless steel) 316, SUS304, etc.), fluorine such as PTFE (polytetrafluoroethylene), and PFA (p-fluorophenylalanine) (perfluoroalkoxyalkane). A resin, a material whose surface is coated with a fluororesin, or the like can be used.

Further, in the water treatment system 1 of Embodiment 1, the water to be treated 2 returning to the treated water tank 3 after passing through the active particle supply device 4 may contain ozone generated from oxygen atoms. be. Therefore, as shown in FIG. 1, the treated water tank 3 preferably has an exhaust port 25 and an ozone decomposition treatment device 26 using activated carbon or the like.

The water treatment system 1 of FIG. 1 includes a treated water tank 3 for storing the treated water 2, an active particle supply device 4 for purifying the treated water 2, and a circulation pump 5. are purifying.
The active particle supply device 4 can also be applied to a so-called open loop system in which the water to be purified is supplied to the active particle supply device 4, and the water to be treated is discharged after being purified.

As described above, the active particle supply device of Embodiment 1 includes an ejector that ejects the first fluid from the nozzle and reduces the pressure around the ejected first fluid by the venturi effect. Equipped with a contact portion in a space where the pressure of the first fluid drops, a supply port for supplying the second fluid to the contact portion, and generating plasma at the contact portion to generate active particles in the second fluid is. A water treatment system purifies water to be treated using this active particle supply device.
Therefore, the water treatment system and the active particle supply device of Embodiment 1 can efficiently purify the water to be treated.

Embodiment 2.
In the active particle supply device of Embodiment 2, dielectrics are arranged on the lower surface and both side surfaces in addition to the upper surface of the contact portion.

Regarding the configuration and operation of the active particle supply device according to Embodiment 2, FIG. 3 is a configuration diagram of the active particle supply device, FIG. 4A is a perspective view of the ejector of the active particle supply device, and FIG. 4A is a cross-sectional view of the ejector. 4B, the description will focus on the differences from the first embodiment.
In FIGS. 3 and 4 of the second embodiment, the same reference numerals are given to the same or corresponding parts as those of the first embodiment.
In addition, in order to distinguish from the first embodiment, the active particle supply device 204, the ejector 210, and the contact portion 213 are used.

In the second embodiment, the difference from the first embodiment is the structure of the contact portion 213 of the ejector 210. Therefore, in FIG. and the circulation pump 5 are omitted.
First, the configuration of the active particle supply device 204 will be described.
The active particle supply device 204 is composed of an ejector 210 which is a mixing section, and a plasma generation device 11 which generates plasma 100 which is an active particle generation means.
Note that the ejector 210 in FIG. 3 shows a vertical cross section including the central axis of the ejector 210 in the direction in which the water to be treated flows, except for a part.

Next, the configuration of the ejector 210 will be described with reference to FIGS. 4A and 4B as well.
4A is a perspective view of the ejector 210, and FIG. 4B is a cross-sectional view.
In FIG. 4A, the direction in which the water to be treated 2 supplied to the ejector 210 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The flow axis through which the water to be treated 2 flows coincides with the central axis of the ejector 210 in the Y-axis direction.
4B is a cross-sectional view taken along line AA in FIG. 4A, taken along a vertical plane including the central axis of the ejector 210. FIG. Although the gas supply port 16 does not exist in the cross-sectional view of FIG. 4B, it is shown as a virtual line (dotted line) so as to make the positional relationship easier to understand.
In FIGS. 4A and 4B, "MW" indicates microwaves, and "OG" indicates oxygen gas O2.

In the second embodiment, the method of generating plasma 100 in the plasma generator 11 and the contact portion 213 of the ejector 210 is the same as in the first embodiment.
Differences from the first embodiment, that is, differences in the structure of the contact portion 213 and differences in the generation region of the plasma 100 will be described.
As can be seen in FIG. 4A , the dielectric 15 is arranged on all four surfaces of the contact portion 213 of the ejector 210 , including the lower surface, the right side surface, and the left side surface, in addition to the upper surface.
As a result, as can be seen in FIG. 4B, the plasma 100 is generated in the region between the lower surface of the dielectric 15 above the contact portion 213 and the upper surface of the flow path of the water to be treated, and further in the dielectric 15 below the contact portion 213. It also occurs in the area between the upper surface and the bottom of the flow passage of the water to be treated.

In the active particle supply device 204 of Embodiment 2, by arranging the dielectric 15 on the upper surface, the lower surface and both side surfaces of the contact portion 213, the plasma 100 is generated over the entire circumference of the water to be treated 2 flowing through the contact portion 213. It is possible to supply high-density oxygen atoms to the water 2 to be treated.

As described above, the active particle supply device of Embodiment 2 has dielectrics arranged on the lower surface and both side surfaces in addition to the upper surface of the contact portion.
Therefore, the active particle supply device of Embodiment 2 can efficiently purify the water to be treated. Furthermore, the water to be treated can be purified with high-density oxygen atoms.

Embodiment 3.
The active particle supply device and the water treatment system of Embodiment 3 are provided with a swirling flow generator in the front stage of the ejector of the active particle supply device.

Regarding the configuration and operation of the water treatment system and the active particle supply device according to Embodiment 3, differences from Embodiment 1 will be described based on FIG. Mainly explained.
In FIG. 5 of Embodiment 3, the same or corresponding parts as those of Embodiment 1 are denoted by the same reference numerals.
In addition, in order to distinguish from Embodiment 1, the water treatment system 301 and the active particle supply device 304 are used.

First, the configuration of the water treatment system 301 will be described.
The water treatment system 301 includes a treated water tank 3 for storing the treated water 2 (first fluid), an active particle supply device 304 for purifying the treated water 2, a circulation pump 5, and a swirling flow generator 27. . The swirling flow generator 27 is connected to the downstream side of the circulation pump 5 and the upstream side of the active particle supply device 304 . The circulation pump 5 circulates the water to be treated 2 between the treated water tank 3 , the swirling flow generator 27 and the active particle supply device 304 .
The treated water tank 3 , the active particle supply device 304 , the circulation pump 5 , and the swirling flow generator 27 are connected by a water pipe 6 to be treated. In FIG. 5, an arrow (Y) indicates the direction in which the water 2 to be treated flows.
A valve 7 and a flow rate regulator 8 are connected to the water-to-be-treated pipe 6 on the downstream side of the circulation pump 5 , that is, on the upstream side of the active particle supply device 304 . A valve 9 is connected to the water-to-be-treated pipe 6 on the downstream side of the active particle supply device 304 .
The water treatment system 301 also includes an exhaust port 25 and an ozone decomposition treatment device 26 .

Next, the configuration of the active particle supply device 304 will be described.
The active particle supply device 304 is composed of an ejector 10 as a mixing section and a plasma generation device 11 that generates plasma 100 as an active particle generation means.
In order to make the configuration of the water treatment system 301 easier to understand, the ejector 10 in FIG. 5 shows a vertical cross section including the central axis of the ejector 10 in the direction in which the water 2 to be treated flows, except for a part.
Also, since the configuration of the ejector 10 is the same as that of the first embodiment, the perspective view and cross-sectional view of the ejector 10 are omitted.

Next, the functions and effects of the swirling flow generator 27 will be described.
The swirling flow generator 27 has a mechanism for swirling the water 2 to be treated. By providing the swirling flow generator 27 in front of the nozzle 12 of the ejector 10 of the active particle supply device 304, the water 2 to be treated is supplied to the nozzle 12 of the ejector 10 in a spirally swirling state. As a result, the flow velocity of the water 2 to be treated increases, and the inside of the contact portion 13 can be brought into a negative pressure state more strongly due to the venturi effect. Therefore, the plasma 100 can be easily generated, and the oxygen atoms generated at the contact portion 13 can be supplied to the water 2 to be treated with high efficiency.
In the third embodiment, the swirling flow generating device 27 is described as a device inside the active particle supply device 304, but it may be a device outside the active particle supply device 304.
Further, in the third embodiment, the swirling flow generator 27 is provided in the active particle supply device 4 of the first embodiment, but the same effect can be obtained by providing it in the active particle supply device 204 of the second embodiment. Play.

As described above, the active particle supply device and the water treatment system of Embodiment 3 are provided with the swirling flow generator in the front stage of the ejector of the active particle supply device.
Therefore, the water treatment system and the active particle supply device of Embodiment 3 can efficiently purify the water to be treated. Furthermore, plasma generation is facilitated, and oxygen atoms can be supplied to the water to be treated with high efficiency.

Embodiment 4.
The active particle supply device and the water treatment system of Embodiment 4 are obtained by adding a constrictor for preventing adhesion of water droplets directly below the dielectric of the ejector.

Regarding the configuration and operation of the water treatment system and the active particle supply device according to Embodiment 4, FIG. 6 is a configuration diagram of the water treatment system provided with the active particle supply device, and the perspective view of the ejector of the active particle supply device. 7A and FIG. 7B, which is a cross-sectional view of the ejector, the differences from the first embodiment will be mainly described.
In FIGS. 6 and 7 of Embodiment 4, portions identical or corresponding to those of Embodiment 1 are given the same reference numerals.
In addition, in order to distinguish from Embodiment 1, the water treatment system 401, the active particle supply device 404, the ejector 410, and the contact portion 413 are used.

First, the configuration of the water treatment system 401 will be described.
The water treatment system 401 includes a treatment tank 3 for storing the water 2 (first fluid) to be treated, an active particle supply device 404 for purifying the water 2 to be treated, and a circulation pump 5 . The circulation pump 5 circulates the water to be treated 2 between the treated water tank 3 and the active particle supply device 404 .
The treated water tank 3 , the active particle supply device 404 , and the circulation pump 5 are connected to each other by the to-be-treated water pipe 6 . In FIG. 6, an arrow (Y) indicates the direction in which the water 2 to be treated flows.
A valve 7 and a flow rate regulator 8 are connected to the water-to-be-treated pipe 6 on the downstream side of the circulation pump 5 , that is, on the upstream side of the active particle supply device 404 . A valve 9 is connected to the water-to-be-treated pipe 6 on the downstream side of the active particle supply device 404 .
The water treatment system 401 also includes an exhaust port 25 and an ozone decomposition treatment device 26 .

Next, the configuration of the active particle supply device 404 will be described.
The active particle supply device 404 is composed of an ejector 410 which is a mixing section, and a plasma generation device 11 which generates plasma 100 which is an active particle generation means.
In order to make the configuration of the water treatment system 401 easier to understand, the ejector 410 in FIG. 6 shows a vertical cross section including the central axis of the ejector 410 in the direction in which the water 2 to be treated flows, except for a part.

Next, the configuration of the ejector 410 will be described with reference to FIGS. 7A and 7B as well.
7A is a perspective view of the ejector 410, and FIG. 7B is a cross-sectional view.
In FIG. 7A, the direction in which the water to be treated 2 supplied to the ejector 410 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The flow axis through which the water to be treated 2 flows coincides with the center axis of the ejector 410 in the Y-axis direction.
7B is a cross-sectional view taken along line AA in FIG. 7A, taken along a vertical plane including the central axis of the ejector 410. FIG. Although the gas supply port 16 does not exist in the cross-sectional view of FIG. 7B, it is shown as an imaginary line (dotted line) so as to make the positional relationship easier to understand.
In FIGS. 7A and 7B, "MW" indicates microwaves, and "OG" indicates oxygen gas O2.

In the fourth embodiment, the method of generating plasma 100 in plasma generator 11 and contact portion 413 of ejector 410 is the same as in the first embodiment.
Embodiment 4 differs from Embodiment 1 in the structure of contact portion 413 of ejector 410 .
The difference from the first embodiment, that is, the constrictor 28 added to the contact portion 413 for preventing adhesion of water droplets and its effect will be described.

As can be seen from FIGS. 6 and 7, the contact portion 413 has a constrictor 28 for preventing adhesion of water droplets directly below the dielectric 15 .
When the plasma 100 is generated by microwaves through the dielectric 15 , it becomes difficult to stably maintain the plasma 100 if moisture adheres to the dielectric 15 .
In the water treatment system 401 of Embodiment 4, the constrictor 28 is arranged directly below the dielectric 15 at the contact portion 413 of the ejector 410 of the active particle supply device 404 . By adding the constrictor 28 to the contact portion 413 , it is possible to suppress the adhesion of water splashed from the water to be treated 2 flowing through the contact portion 413 of the ejector 410 to the dielectric 15 .

As can be seen in FIG. 7B, the plasma 100 is generated in the region between the lower surface of the dielectric 15 above the contact portion 413 and the upper surface of the constrictor 28 installed on the upper surface of the flow passage of the water to be treated. there is

As a result of adding the constrictor 28 for preventing adhesion of water droplets to the contact portion 413 of the ejector 410, the active particle supply device 404 of the fourth embodiment stably generates the plasma 100 without being affected by the water content of the water 2 to be treated. can be maintained. As a result, the oxygen atoms generated at the contact portion 413 can be supplied to the water 2 to be treated with high efficiency.

The constrictor 28 is a plate having a thickness of about 1 mm and having a large number of through holes having a diameter of about 0.1 to 1 mm. As the material of the constrictor 28, it is desirable to use a material with high corrosion resistance. For example, it is possible to use a metal material such as stainless steel (SUS316, SUS304, etc.), a fluororesin such as PTFE or PFA, or a material whose surface is coated with a fluororesin.
In the fourth embodiment, the constrictor 28 for preventing adhesion of water droplets is added to the active particle supply device 4 of the first embodiment, but the active particle supply device 204 of the second embodiment and the Even if it is provided in the active particle supply device 304 of Mode 3, the same effect can be obtained.

As described above, the water treatment system and the active particle supply device of Embodiment 4 are such that a constrictor for preventing adhesion of water droplets is added directly below the dielectric of the ejector.
Therefore, the water treatment system and the active particle supply device of Embodiment 4 can efficiently purify water to be treated. Furthermore, plasma can be stably maintained and oxygen atoms can be supplied to the water to be treated with high efficiency without being affected by moisture in the water to be treated.

Embodiment 5.
The active particle supplying apparatus of Embodiment 5 uses a plasma generating apparatus having a configuration in which a feed electrode is provided on the upper surface of the ejector, a ground electrode is provided on the lower surface, and an AC voltage is applied between the feed electrode and the ground electrode. be.

Regarding the configuration and operation of the active particle supply device according to Embodiment 5, FIG. 8 is a configuration diagram of the active particle supply device, FIG. 9A is a perspective view of the ejector of the active particle supply device, and FIG. 9A is a cross-sectional view of the ejector. 9B, the difference from the first embodiment will be mainly described.
In FIGS. 8 and 9 of Embodiment 5, portions identical or corresponding to those of Embodiment 1 are given the same reference numerals.
In addition, in order to distinguish from the first embodiment, an active particle supply device 504, a plasma generation device 511, and an ejector 510 are used.

In Embodiment 5, the difference from Embodiment 1 is the plasma generator 511, so in FIG. etc. are omitted.
First, the configuration of the active particle supply device 504 will be described.
The active particle supply device 504 is composed of an ejector 510 which is a mixing section and a plasma generation device 511 which generates the plasma 100 which is active particle generation means.
Note that the ejector 510 in FIG. 8 shows a vertical cross section including the central axis of the ejector 510 in the direction in which the water to be treated flows, except for a part.

Next, the configuration of the ejector 510 will be described with reference to FIGS. 9A and 9B as well.
9A is a perspective view of the ejector 510, and FIG. 9B is a cross-sectional view.
In FIG. 9A, the direction in which the water to be treated 2 supplied to the ejector 510 flows is the Y-axis direction, the horizontal right direction is the X-axis direction, and the vertical direction is the Z-axis direction. The flow axis through which the water to be treated 2 flows coincides with the central axis of the ejector 510 in the Y-axis direction.
9B is a cross-sectional view taken along line AA in FIG. 9A, taken along a vertical plane including the central axis of the ejector 510. FIG. In addition, in the sectional view of FIG. 9B, the gas supply port 16 does not originally exist, but is described as a virtual line (dotted line) so as to make the positional relationship easier to understand.
In FIG. 9A, "OG" indicates oxygen gas O2.
In addition, in FIG. 9A, the plasma generator 511 is not a component of the ejector 510, but it is described to make the overall configuration easier to understand.

Embodiment 5 differs from Embodiment 1 in the method of generating plasma 100 in contact portion 13 of ejector 510 .
The structure and function of the plasma generator 511, which are different from the first embodiment, will be described.
The plasma generator 511 includes a feed electrode 29 provided on the upper surface of the ejector 510 , a ground electrode 30 provided on the lower surface, and an AC power supply 31 that applies an AC voltage to the feed electrode 29 .

Plasma 100 is generated at the contact portion 13 by applying an AC voltage (frequency: several kHz, voltage: about 10 kV) output from the AC power supply 31 to the power supply electrode 29 .
As can be seen in FIG. 9B, the plasma 100 is generated in the area between the lower surface of the dielectric 15 above the contact portion 13 and the upper surface of the flow path of the water to be treated, and also in the area below the flow path of the water to be treated. is doing. That is, plasma 100 is generated in the entire contact portion 13 other than the flow passage for the water to be treated.

The configuration and operation other than the method of generating plasma 100 are the same as those of the first embodiment.
The active particle supply device 504 of the fifth embodiment has a simpler configuration than the case of generating plasma using microwaves described in the first embodiment. Moreover, in the active particle supply device 504 according to Embodiment 5, stable plasma 100 can be generated regardless of the type of gas supplied from the gas supply port.

When the plasma generating apparatus 511 of Embodiment 5 is used, the plasma density is lower than that of the plasma generating apparatus 11 of Embodiment 1 using a microwave generator. Simple and easy to operate.
In the fifth embodiment, the plasma generating device 511 having a configuration in which the feeder electrode and the ground electrode are provided on the upper and lower surfaces of the ejector and an AC voltage is applied between the electrodes is applied to the active particle supply device 4 of the first embodiment. The same effect can be obtained by applying to the active

particle supply devices

204, 304, and 404 of the second to fourth embodiments.

As described above, the active particle supply apparatus according to the fifth embodiment, as a plasma generating apparatus, has a feed electrode on the upper surface of the ejector, a ground electrode on the bottom surface, and applies an AC voltage between the feed electrode and the ground electrode. It is equipped with an AC power supply to apply.
Therefore, the active particle supply device of Embodiment 5 can efficiently purify the water to be treated. Furthermore, the configuration of the device is simplified and the operation is facilitated.

While this application describes various exemplary embodiments and examples, various features, aspects, and functions described in one or more embodiments may not apply to particular embodiments. are not limited to, and can be applied to the embodiments singly or in various combinations.
Therefore, countless modifications not illustrated are envisioned within the scope of the technology disclosed in the present application. For example, when at least one component is modified, added or omitted, and at least one component is extracted and combined with the components of other embodiments. .

1, 301, 401 water treatment system, 2 treated water, 3 treated water tank, 4, 204, 304, 404, 504 active particle supply device, 5 circulation pump, 6 treated water piping, 7, 9 valves, 8 flow rate adjustment vessel, 10, 210, 410, 510 ejector, 11, 511 plasma generator, 12 nozzle, 13, 213, 413 contact part, 14 diffuser, 15 dielectric, 16 gas supply port, 17 microwave oscillator, 18 rectangular waveguide Pipe, 19 isolator, 20 directional coupler, 21 matching box, 22 reactor, 23 short plunger, 24 slot antenna, 25 exhaust port, 26 ozonolysis treatment device, 27 swirl flow generator, 28 constrictor, 29 feeding electrode, 30 ground electrode, 31 AC power supply, 100 plasma.

Claims

A supply port in which a first fluid is injected from a nozzle, a contact portion is provided in a space where the pressure around the injected first fluid is reduced by a venturi effect, and a second fluid is supplied to the contact portion. an ejector comprising
and a plasma generating device for generating plasma at the contact portion to generate active particles in the second fluid.
2. The activity according to claim 1, wherein a dielectric is arranged on the upper surface of the contact portion, and the plasma is generated in the second fluid by applying a high electric field from the outside of the dielectric through the dielectric. Particle feeder.
3. The active particle supply device according to claim 2, further comprising a dielectric on the lower surface and both side surfaces of said contact portion.
4. The active particle supply apparatus according to claim 2, wherein said plasma generator introduces microwaves through said dielectric to generate said plasma.
4. The active particle supply according to claim 2 or 3, wherein the plasma generation device includes a power supply electrode and a ground electrode so as to sandwich the contact portion, and the plasma is generated by applying an AC voltage to the power supply electrode. Device.
2. The active particle supply device according to claim 1, wherein said second fluid is gas containing oxygen, and said plasma generates oxygen atoms in said second fluid.
6. The active particle supply device according to any one of claims 2 to 5, wherein said second fluid is a gas containing oxygen, and said plasma generates oxygen atoms in said second fluid.
8. The active particle supply device according to any one of claims 2 to 5 and 7, further comprising a constrictor for preventing adhesion of water droplets below the dielectric in the contact portion.
9. The active particle supply device according to any one of claims 1 to 8, wherein the contact portion supplies the second fluid in a direction that intersects the circulation axis of the first fluid.
10. The active particle supply device according to any one of claims 1 to 9, further comprising a swirling flow generating device that forms a swirling flow in the first fluid in a stage preceding the nozzle.
comprising the active particle supply device according to any one of claims 1 to 10,
A water treatment system that supplies the active particles to the water to be treated, which is the first fluid.
12. The water treatment system according to claim 11, further comprising a circulation pump for supplying the water to be treated to the active particle supply device, and a treated water tank for storing treated water discharged from the active particle supply device.