JP7031963B2 - チップの製造方法 - Google Patents

チップの製造方法 Download PDF

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Publication number
JP7031963B2
JP7031963B2 JP2017159519A JP2017159519A JP7031963B2 JP 7031963 B2 JP7031963 B2 JP 7031963B2 JP 2017159519 A JP2017159519 A JP 2017159519A JP 2017159519 A JP2017159519 A JP 2017159519A JP 7031963 B2 JP7031963 B2 JP 7031963B2
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Prior art keywords
workpiece
modified layer
holding
laser
chip
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JP2017159519A
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Japanese (ja)
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JP2019040910A5 (enExample
JP2019040910A (ja
Inventor
良彰 淀
金艶 趙
成規 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Priority to JP2017159519A priority Critical patent/JP7031963B2/ja
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Publication of JP2019040910A5 publication Critical patent/JP2019040910A5/ja
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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2017159519A 2017-08-22 2017-08-22 チップの製造方法 Active JP7031963B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017159519A JP7031963B2 (ja) 2017-08-22 2017-08-22 チップの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017159519A JP7031963B2 (ja) 2017-08-22 2017-08-22 チップの製造方法

Publications (3)

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JP2019040910A JP2019040910A (ja) 2019-03-14
JP2019040910A5 JP2019040910A5 (enExample) 2020-03-05
JP7031963B2 true JP7031963B2 (ja) 2022-03-08

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JP2017159519A Active JP7031963B2 (ja) 2017-08-22 2017-08-22 チップの製造方法

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JP (1) JP7031963B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11030738B2 (en) * 2019-07-05 2021-06-08 International Business Machines Corporation Image defect identification

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003088974A (ja) 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP2003088973A (ja) 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP2006263754A (ja) 2005-03-22 2006-10-05 Hamamatsu Photonics Kk レーザ加工方法
JP2008283025A (ja) 2007-05-11 2008-11-20 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2010003817A (ja) 2008-06-19 2010-01-07 Tokyo Seimitsu Co Ltd レーザーダイシング方法及びレーザーダイシング装置
JP2011041966A (ja) 2009-08-21 2011-03-03 Hamamatsu Photonics Kk レーザ加工方法及びチップ
JP2013236001A (ja) 2012-05-10 2013-11-21 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014199834A (ja) 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003088974A (ja) 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP2003088973A (ja) 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP2006263754A (ja) 2005-03-22 2006-10-05 Hamamatsu Photonics Kk レーザ加工方法
JP2008283025A (ja) 2007-05-11 2008-11-20 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2010003817A (ja) 2008-06-19 2010-01-07 Tokyo Seimitsu Co Ltd レーザーダイシング方法及びレーザーダイシング装置
JP2011041966A (ja) 2009-08-21 2011-03-03 Hamamatsu Photonics Kk レーザ加工方法及びチップ
JP2013236001A (ja) 2012-05-10 2013-11-21 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014199834A (ja) 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法

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JP2019040910A (ja) 2019-03-14

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