JP7018111B2 - アライメント装置、アライメント方法、成膜装置、成膜方法および電子デバイスの製造方法 - Google Patents
アライメント装置、アライメント方法、成膜装置、成膜方法および電子デバイスの製造方法 Download PDFInfo
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- JP7018111B2 JP7018111B2 JP2020188762A JP2020188762A JP7018111B2 JP 7018111 B2 JP7018111 B2 JP 7018111B2 JP 2020188762 A JP2020188762 A JP 2020188762A JP 2020188762 A JP2020188762 A JP 2020188762A JP 7018111 B2 JP7018111 B2 JP 7018111B2
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- General Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019206306 | 2019-11-14 | ||
| JP2019206306 | 2019-11-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021080563A JP2021080563A (ja) | 2021-05-27 |
| JP7018111B2 true JP7018111B2 (ja) | 2022-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020188762A Active JP7018111B2 (ja) | 2019-11-14 | 2020-11-12 | アライメント装置、アライメント方法、成膜装置、成膜方法および電子デバイスの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7018111B2 (ko) |
| KR (1) | KR102445850B1 (ko) |
| CN (1) | CN112795868B (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7428684B2 (ja) * | 2021-09-02 | 2024-02-06 | キヤノントッキ株式会社 | アライメント装置 |
| JP2023042908A (ja) | 2021-09-15 | 2023-03-28 | キヤノントッキ株式会社 | アライメント装置、アライメント方法、成膜装置、成膜方法及び電子デバイスの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005005402A (ja) | 2003-06-10 | 2005-01-06 | Nsk Ltd | 位置合わせ装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004303559A (ja) * | 2003-03-31 | 2004-10-28 | Tohoku Pioneer Corp | アライメント装置及び方法、並びにこれを用いて製造される有機ｅｌ素子 |
| JP4510609B2 (ja) * | 2004-12-21 | 2010-07-28 | 株式会社アルバック | 基板とマスクのアライメント方法および有機薄膜蒸着方法ならびにアライメント装置 |
| JP4592021B2 (ja) * | 2006-06-29 | 2010-12-01 | トッキ株式会社 | アライメント装置及び方法 |
| JP2010067705A (ja) | 2008-09-09 | 2010-03-25 | Adwelds:Kk | アライメント方法およびアライメント装置 |
| WO2011136075A1 (ja) * | 2010-04-28 | 2011-11-03 | 株式会社アルバック | 真空処理装置並びに基板とアラインメントマスクの移動方法及び位置合わせ方法並びに成膜方法 |
| JP6250999B2 (ja) * | 2013-09-27 | 2017-12-20 | キヤノントッキ株式会社 | アライメント方法並びにアライメント装置 |
| KR101993532B1 (ko) * | 2017-11-29 | 2019-06-26 | 캐논 톡키 가부시키가이샤 | 성막장치, 성막방법, 및 전자 디바이스 제조방법 |
-
2020
- 2020-11-10 KR KR1020200149308A patent/KR102445850B1/ko active IP Right Grant
- 2020-11-12 JP JP2020188762A patent/JP7018111B2/ja active Active
- 2020-11-13 CN CN202011264887.7A patent/CN112795868B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005005402A (ja) | 2003-06-10 | 2005-01-06 | Nsk Ltd | 位置合わせ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112795868A (zh) | 2021-05-14 |
| JP2021080563A (ja) | 2021-05-27 |
| CN112795868B (zh) | 2023-07-18 |
| KR20210058697A (ko) | 2021-05-24 |
| KR102445850B1 (ko) | 2022-09-20 |
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