JP7017885B2 - 硬化前の複合構造体の内部に導電体を敷設する方法 - Google Patents
硬化前の複合構造体の内部に導電体を敷設する方法 Download PDFInfo
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- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
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Description
<概要>
<構造の説明>
<塗膜の説明>
<硬化の説明>
<作製プロセスの説明>
・ 例えば、避雷システム、EME管理システム及び接地システムなど、導電又は絶縁の電気的な目的で、複合構造体10の孔、ビア又はその他の構造的要素に、導電体16又は電気絶縁体18を付着させること。
・ 構造上の目的(電気的な目的と組み合わせることも可能)で、複合構造体10の孔、ビア、又はその他の構造的要素に、導電体16又は電気絶縁体18を付着させること。
<航空機及び作製方法の例>
<代替例>
樹脂を予め含侵させた1つ又は複数の複合層を積層することにより積層体を形成することと、
前記積層体を硬化させる前に、前記複合層のうちの少なくとも1つの上に、1つ又は複数の導電体を敷設することと、
前記複合層と前記導電体とを含む前記積層体を硬化させて、前記複合構造体を作製することと、を含み、
前記導電体は、導電性インク又は導電性塗料のうちの少なくとも1つを含む、方法。
(a) 積層体を含み、当該積層体は、
(1) 樹脂を予め含侵させた1つ又は複数の複合層と、
(2) 前記複合層のうちの少なくとも1つの上に敷設された1つ又は複数の導電体と、を含み、前記少なくとも1つ複合層は、未硬化の複合層であり、
(b) 前記複合層と前記導電体とを含む前記積層体は、硬化された積層体である、複合構造体。
複合構造体を含み、当該複合構造体は、
(a) 積層体を含み、当該積層体は、
(1) 樹脂を予め含侵させた1つ又は複数の複合層と、
(2) 前記複合層のうちの少なくとも1つの上に敷設された1つ又は複数の導電体と、を含み、前記1つ又は複数の導電体は、樹脂を予め含侵させた未硬化の複合層であり、
(b) 前記複合層と前記導電体とを含む前記積層体は、硬化された積層体である、航空機。
Claims (11)
- 導電性を向上させた複合構造体を作製するための方法であって、
樹脂を予め含侵させた1つ又は複数の複合層を積層することにより積層体を形成することと、
前記積層体を硬化させる前に、前記複合層のうちの少なくとも1つの上に、1つ又は複数の導電体を敷設することと、
前記複合層と前記導電体とを含む前記積層体を硬化させて、前記複合構造体を作製することと、を含み、
前記導電体は、導電性インク又は導電性塗料のうちの少なくとも1つを含み、
前記導電性インク又は導電性塗料は、低温焼結助剤を含有する組成物中にある、銅又は銀の少なくとも一方を含有する複数の粒子を含み、
前記粒子は、前記積層体の硬化に用いる温度での焼結が可能な粒径とすることにより、当該硬化によって焼結される、方法。 - 前記複合層は、前記積層体が形成された時点では未硬化の複合層である、請求項1に記載の方法。
- 前記積層体を硬化させる前に、前記導電体のうちの少なくとも1つの上に、1つ又は複数の追加の複合層を敷設することをさらに含む、請求項1又は2に記載の方法。
- 前記導電体は、前記複合構造体の内部にある、請求項3に記載の方法。
- 前記導電体のうちの少なくとも1つは、前記積層体の表面層の少なくとも一部分の上に敷設される、請求項1~4のいずれかに記載の方法。
- 前記導電体は、前記複合層の上に1つ又は複数の導電層を付着させることによって、前記複合層の上に敷設される、請求項1~5のいずれかに記載の方法。
- 前記導電体は、1)回路配線パターンを前記複合構造体の内部又は上に含む、2)前記複合層間に少なくとも1つの導電路を形成する、又は、3)それぞれ異なる厚みを有する、のうちの少なくとも1つを充足する、請求項1~6のいずれかに記載の方法。
- 前記導電体のうちの少なくとも1つは、前記積層体を硬化させる前に乾燥される、請求項1~7のいずれかに記載の方法。
- 前記複合層は、炭素繊維強化ポリマー(CFRP)で形成される複合材料を含み、
前記導電性インク又は導電性塗料は、チタン(Ti)をさらに含有することにより、前記複合材料に含まれる炭素繊維の表面層を炭化チタン(TiC)に変化させて、前記導電体と当該炭素繊維との接合を促進させる、請求項1~8のいずれかに記載の方法。 - 前記積層体を硬化させる前に、前記複合層のうちの少なくとも1つにおける前記導電体のうちの少なくとも1つの近傍に、1つ又は複数の電気絶縁体を敷設することをさらに含む、請求項1~9のいずれかに記載の方法。
- 前記積層体は、100℃から200℃の間の温度で硬化される、請求項1~10のいずれかに記載の方法。
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US15/268,357 US10293956B2 (en) | 2016-09-16 | 2016-09-16 | Method for placing electrical conductors interior to a composite structure prior to curing |
US15/268,357 | 2016-09-16 |
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JP2018089951A JP2018089951A (ja) | 2018-06-14 |
JP7017885B2 true JP7017885B2 (ja) | 2022-02-09 |
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EP (1) | EP3296092A1 (ja) |
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US20220270780A1 (en) * | 2018-06-01 | 2022-08-25 | Beijing Mega Material Innovation Work (M²Iw) Co., Ltd. | Thickness direction conductive laminated composite material and manufacturing method therefor |
ES2884900T3 (es) * | 2018-06-13 | 2021-12-13 | Airbus Operations Slu | Procedimiento para instalar cables impresos en sistemas colectores de cables para aeronaves, y elemento compuesto con un sistema colector de cables integrado |
CN111070722B (zh) * | 2018-10-19 | 2021-10-22 | 哈尔滨工业大学 | 一种基于隔热和绝缘机理的雷电防护复合材料的制备方法 |
US20200147902A1 (en) * | 2018-11-08 | 2020-05-14 | The Boeing Company | Establishing electronics in composite parts by locating electronics on lay-up mandrels |
JP7171660B2 (ja) | 2020-07-06 | 2022-11-15 | 矢崎総業株式会社 | 複合材構造及び複合材構造製造方法 |
US20240021337A1 (en) * | 2020-12-11 | 2024-01-18 | Liquid Wire Inc. | Structures with integrated conductors |
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2017
- 2017-07-25 CN CN201710613193.1A patent/CN107825780A/zh active Pending
- 2017-08-07 EP EP17185102.5A patent/EP3296092A1/en not_active Withdrawn
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US20180079526A1 (en) | 2018-03-22 |
US10293956B2 (en) | 2019-05-21 |
JP2018089951A (ja) | 2018-06-14 |
EP3296092A1 (en) | 2018-03-21 |
CN107825780A (zh) | 2018-03-23 |
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