JP7016065B2 - Terminal - Google Patents

Description

The present disclosure relates to terminals.

Conventionally, Patent Document 1 discloses a terminal connected to a coil terminal by winding the coil terminal. At this terminal, the coil terminal is sandwiched by the holding portion in order to secure the strength of the coil terminal.

Japanese Unexamined Patent Publication No. 11-186023

However, in the conventional terminal, the coil terminal may be separated from the sandwiching portion, and in this case, it is difficult to sufficiently secure the joint strength between the coil terminal and the terminal. For this reason, there is a demand for ensuring the joint strength between the coil terminal and the terminal.

Therefore, an object of the present disclosure is to provide a terminal capable of ensuring the bonding strength between the columnar metal terminal and the metal wire.

In order to achieve the above object, the terminal according to one embodiment of the present disclosure includes a columnar metal terminal having a plated layer on the surface and a metal wire wound around the columnar metal terminal a plurality of times, and the plated layer is provided. , A part of the metal wire is exposed and is not mixed with the metal wire, and the thickness of the inter-pitch portion arranged between the pitches of the metal wire wound multiple times in the plating layer is the thickness of the metal wire. It is more than a quarter of the thickness of the metal wire and is smaller than the thickness of the metal wire.

According to the present disclosure, it is possible to secure the bonding strength between the columnar metal terminal and the metal wire.

FIG. 1 is a schematic view showing terminals according to an embodiment. FIG. 2 is a cross-sectional view showing a terminal according to an embodiment. FIG. 3 is an explanatory diagram showing a state in which a metal wire is entwined with a columnar metal terminal according to an embodiment. FIG. 4 is a flow chart showing a process of entwining a metal wire around a columnar metal terminal according to an embodiment. FIG. 5 is a diagram showing a process of creating an assembly and thermocompression bonding according to an embodiment. FIG. 6 is a flow chart showing a process of joining a metal wire to a columnar metal terminal of an assembly according to an embodiment. FIG. 7 is a cross-sectional view showing the terminal according to the embodiment and expressing a shape closer to the actual one. FIG. 8 is a front view showing a schematic configuration of the terminal according to the first modification. FIG. 9 is a cross-sectional view showing a terminal according to the first modification, in which a plurality of metals having different wire diameters are joined. FIG. 10 is a cross-sectional view showing the terminal according to the modified example 2. FIG. 11 is a cross-sectional view showing the terminal according to the modified example 3.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Each of the embodiments described below is a comprehensive or specific example. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, the order of steps, etc. shown in the following embodiments are examples, and are not intended to limit the present disclosure. Further, among the components in the following embodiments, the components not described in the independent claim indicating the highest level concept are described as arbitrary components.

It should be noted that each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, the same reference numerals are given to substantially the same configurations, and duplicate explanations will be omitted or simplified.

Hereinafter, the terminal and the method of joining the terminal according to the embodiment of the present disclosure will be described.

[Constitution]
FIG. 1 is a schematic view showing a terminal 1 according to an embodiment. As shown in FIG. 1, the terminal 1 is provided with respect to the stator 100 which is a part of the motor. Specifically, the terminal 1 is provided on a plurality of coils 101 constituting the stator 100. The terminal 1 supplies electric power to the coil 101 from a circuit board mounted on a power supply unit that supplies electric power to the motor. The terminal 1 includes a columnar metal terminal 10 and a metal wire 20.

FIG. 2 is a cross-sectional view showing the terminal 1 according to the embodiment. Specifically, FIG. 2 is a cross-sectional view of the cut surface including the line II-II in FIG.

As shown in FIG. 2, the columnar metal terminal 10 is a columnar metal member electrically connected to the coil 101. The columnar metal terminal 10 is electrically connected to the metal wire 21 which is a part of the metal wire 20. Specifically, the columnar metal terminal 10 is joined to the metal wire 21 in a state in which the metal wire 21 is wound. In the columnar metal terminal 10, for example, the periphery of the base metal layer 11 containing iron (Fe) as a main component is mainly composed of a plating layer 12 made of a second metal containing copper (Cu) as a main component and tin (Sn). It is a member coated with a plating layer 13 made of a third metal as a component. Specifically, the plating layer 12 is coated on the entire peripheral surface of the base metal layer 11, and the plating layer 13 is coated on the plating layer 12.

In the present embodiment, the metal wire 21 and the columnar metal terminal 10 are joined in a state where the metal wire 21 is entwined with the columnar metal terminal 10. Here, "entangled" means that the wire is tied around the object in a wound state, and the portion where the metal wires 21 overlap each other due to the tied (intersection 23: FIG. 3). See) means that it exists. The metal wire 21 is single-wound around the columnar metal terminal 10. The metal wire 21 may be wound multiple times around the columnar metal terminal 10. In the present embodiment, the metal wire 21 is bonded to the columnar metal terminal 10 by melting and re-curing only the plating layer 13 by thermocompression bonding.

The base metal layer 11 is, for example, a rectangle having a short side of about 0.4 mm and a long side of 0.6 mm in the axial direction, and the thickness of the plating layer 12 is about 25 μm. Further, in the metal wire 20, the wire diameter of the metal wire 21 is about 0.15 mm.

The columnar metal terminal 10 is a quadrangle in the axial direction. The columnar metal terminal 10 is not limited to a quadrangle in the axial direction, and may be, for example, a polygonal shape other than the quadrangle, a circular shape, an elliptical shape, an oval shape, or the like.

The columnar metal terminal 10 has a rectangular cross section in a direction orthogonal to the axial direction of the columnar metal terminal 10, and has a pair of long side surfaces and a pair of short side surfaces. The long side surface is a surface whose cross section constitutes the long side of a rectangle, and the short side surface is a surface whose cross section constitutes the short side of a rectangle. The long side surface of the columnar metal terminal 10 is a joint terminal surface 110 to which the metal wire 21 is bonded. The cross section of the columnar metal terminal 10 in the direction orthogonal to the axial direction may have a shape in which there is no distinction between a long side and a short side, that is, a square. In this case, the pair of facing side surfaces of the columnar metal terminal can be the joint terminal surface.

The metal wire 21 constitutes a part of the metal wire 20 and is a metal wire. Specifically, the metal wire 21 is formed of a first metal containing aluminum (Al) as a main component. The metal wire 21 forms an intersection 23 in which the metal wires 21 overlap each other in the circumferential direction of the columnar metal terminal 10. The intersection 23 is formed so as to be in contact with either short side surface.

In the joint terminal surface 110 of the columnar metal terminal 10, the thickness of the plating layer 13 is larger than that of the other portions between the pitches of the metal wires 21 wound a plurality of times. The portion of the plating layer 13 is referred to as an inter-pitch portion 131. Specifically, the thickness t1 of the inter-pitch portion 131 is one-fourth or more of the thickness T1 of the metal wire 21 of the metal wire 20, and is smaller than the thickness T1. Here, the thickness direction is a direction orthogonal to the axial direction of the columnar metal terminal 10. Since the thickness t1 of the pitch-to-pitch portion 131 of the plating layer 13 is smaller than the thickness T1 of the metal wire 21, a part of the metal wire 21 is exposed at the portion. Further, since the thickness t1 of the pitch-to-pitch portion 131 of the plating layer 13 is one-fourth or more of the thickness T1 of the metal wire 21, the pitch-to-pitch portion 131 overlaps with the metal wire 21 in the axial direction. As a result, the columnar metal terminal 10 and the metal wire 21 are firmly coupled to each other, and the pull-out strength is enhanced.

[Terminal joining method]
A method of joining the metal wire 20 to the columnar metal terminal 10 will be described.

First, the columnar metal terminal 10 and the metal wire 20 before joining will be described.

The columnar metal terminal 10 is a rectangular columnar shape having a rectangular shape in the axial direction, and a pair of long side surfaces thereof are joint terminal surfaces 110. Further, the intersecting portion 23 of the metal wire 21 is not arranged on the joint terminal surface 110, and the intersecting portion 23 is arranged only on the pair of short side surfaces of the columnar metal terminal 10. The columnar metal terminal 10 is, for example, a member in which the periphery of the base metal layer 11 is coated with the plating layer 12, and the plating layer 12 is further coated with the plating layer 13. In the state before joining, the plating layer 12 and the plating layer 13 each have a uniform layer thickness as a whole. As described above, since the plating layer 12 is formed of a second metal containing copper as a main component, it has a melting point according to the melting point of copper (1083 ° C.). Since the plating layer 13 is formed of a third metal containing tin as a main component, it has a melting point according to the melting point of tin (232 ° C.).

Further, in the metal wire 20, the metal wire 21 is coated with a resin layer 22 made of an insulating resin. The metal wire 20 is, for example, an enamel wire, a lead wire, or the like. The metal wire 21 is made of, for example, a first metal containing aluminum as a main component. Therefore, the metal wire 21 has a melting point according to the melting point of aluminum (660 ° C.).

The resin layer 22 is made of a resin material such as urethane, polyester, polyesterimide, or polyamideimide. The resin layer 22 has a melting point lower than the melting point of tin.

FIG. 3 is an explanatory diagram showing a state in which the metal wire 20 is entwined with the columnar metal terminal 10 according to the embodiment. FIG. 3A shows a state in which the metal wire 20 is entwined with the columnar metal terminal 10 as viewed from a direction orthogonal to the axial direction of the columnar metal terminal 10. FIG. 3B shows a state in which the metal wire 20 is entwined with the columnar metal terminal 10 as viewed from the axial direction of the columnar metal terminal 10. Further, FIG. 4 is a flow chart showing a process of entwining the metal wire 20 with the columnar metal terminal 10 according to the embodiment.

As shown in FIGS. 3 and 4, first, the columnar metal terminal 10 is fixed to a jig (not shown). As a result, the columnar metal terminal 10 is in a state where the metal wire 20 can be wound (S111). After that, the metal wire 20 is wound around the columnar metal terminal 10 while receiving a constant tension. Further, when the metal wire 20 is wound around the first turn and the second turn, the metal wire 20 is wound around the columnar metal terminal 10 so as to overlap the winding start portion of the metal wire 20. As a result, an intersection 23 in which the metal wires 20 intersect with each other is formed (S112). The intersection 23 is arranged so as to avoid the joint terminal surface 110 of the columnar metal terminal 10 and come into contact with any of the short side surfaces.

Further, the metal wire 20 is wound around the columnar metal terminal 10 for several turns (S113). The metal wire 20 is wound around the columnar metal terminal 10 so as to be substantially coiled except for the intersection 23. After that, unnecessary parts of the metal wire 20 are cut with nippers or the like, and the metal wire 20 is arranged to obtain the assembly 200 shown in FIG. FIG. 5 is a diagram showing a process of creating an assembly 200 and thermocompression bonding according to an embodiment.

Next, the metal wire 20 is joined to the columnar metal terminal 10. In this embodiment, the metal wire 20 is thermocompression bonded to the columnar metal terminal 10.

FIG. 6 is a flow chart showing a step of joining the metal wire 20 to the columnar metal terminal 10 of the assembly 200 according to the embodiment. As shown in FIGS. 5 and 6, first, the above-mentioned assembly 200 is arranged between a pair of electrodes 30 provided in the thermocompression bonding device (S121). Specifically, the assembly 200 is arranged between the pair of electrodes 30 so that the pair of bonded terminal surfaces 110a of the columnar metal terminals 10 and the pair of electrodes 30 face each other on a one-to-one basis.

Next, the assembly 200 is thermocompression bonded by the pair of electrodes 30 (S122). At this time, the thermocompression bonding device applies a current as shown by an arrow Y1 in FIG. 5 to the pair of electrodes 30. At the same time, the thermocompression bonding device sandwiches the metal wire 21 with a pair of electrodes 30 and applies a load so that the metal wire 21 is crushed. As a result, the pair of electrodes 30 generate heat to heat the metal wire 20, so that the resin layer 22 of the metal wire 20 is melted and peeled off from the metal wire 21 of the metal wire 20 to be removed. The pair of electrodes 30 pushes the metal wire 21 by a predetermined pushing amount. Further, since the metal wire 21 and the columnar metal terminal 10 are crimped by the pair of electrodes 30, the metal wire 21 and the columnar metal terminal 10 come into contact with each other.

Specifically, at the time of thermocompression bonding, the thermocompression bonding device pushes the metal wire 21 in the direction in which the pair of electrodes 30 approach each other. The thermocompression bonding device applies a load to the metal wire 20 by a pair of electrodes 30 with a predetermined load calculated by using the diameter, the number of turns, and the withstand force of the metal wire 20, and pushes the metal wire 20 into shape. The position obtained by subtracting the pushing amount of the metal wire 20 from the diameter of the metal wire 20 is the height of the metal wire 20 from the columnar metal terminal 10.

Further, in order to appropriately thermocompression-bond the metal wire 20 by the pair of electrodes 30, a load cell is used to detect that the metal wire 21 and the pair of electrodes 30 are in contact with each other. As a result, the thermocompression bonding device can push the metal wire 21 with the pushing amount from the point of contact with the metal wire 21.

Further, the heating temperature at the time of thermocompression bonding is set higher than the melting point of the third metal forming the plating layer 13 and lower than the melting point of the first metal forming the metal wire 21. Therefore, during thermocompression bonding, the plating layer 13 melts, but the metal wire 21 does not. When the metal wire 21 is pushed by the electrode 30 by a predetermined pushing amount, the metal wire 21 is deformed according to the pushing amount. At this time, since the plating layer 13 is melted, it is extruded outward from the interface between the metal wire 21 and the plating layer 12. The metal wire 21 is embedded in the molten plating layer 13 so as to be in close contact with the plating layer 12. At the same time, an inter-pitch portion 131 is formed between the pitches of the metal wires 21. As a result, as shown in FIG. 2, the thickness t1 of the pitch-to-pitch portion 131 in the plating layer 13 becomes one-fourth or more of the thickness T1 of the metal wire 21.

In this way, the surface of the metal wire 21 on the outer peripheral side of the terminal 1 is flattened, the metal wire 21 wound for several turns and the contact surface of the plating layer 12 come into contact with each other, and electrical conduction is established through all the contact surfaces. It will be possible to secure it. Further, since the pair of electrodes 30 are in contact with the metal wire 21, the molten plating layer 13 stays between the pitches of the metal wire 21 and does not cover the metal wire 21. Further, since the pair of electrodes 30 covers the pitch of the metal wire 21, the thickness t1 of the pitch-to-pitch portion 131 of the plating layer 13 does not exceed the thickness T1 of the metal wire 21.

Then, the thermocompression bonding device releases the load applied to the assembly 200 by the pair of electrodes 30. As a result, the heating of the plating layer 13 is also released, the molten plating layer 13 is cured, and the metal wire 21 and the columnar metal terminal 10 are joined. In this way, the terminal 1 in which the metal wire 21 is electrically connected to the columnar metal terminal 10 can be obtained.

[Effects, etc.]
As described above, the terminal 1 according to the present embodiment includes a columnar metal terminal 10 having a plating layer 13 on its surface, and a metal wire 20 wound around the columnar metal terminal 10 a plurality of times, and has a plating layer. 13 exposes a part of the metal wire 20 and is not mixed with the metal wire 20, and the thickness of the inter-pitch portion 131 arranged between the pitches of the metal wires wound a plurality of times in the plating layer 13. t1 is one-fourth or more of the thickness T1 of the metal wire 20 and smaller than the thickness T1 of the metal wire 20.

According to this, since the thickness t1 of the pitch-to-pitch portion 131 in the plating layer 13 is one-fourth or more of the thickness T1 of the metal wire 20 and smaller than the thickness T1 of the metal wire 20, the shaft of the columnar metal terminal 10 In the direction view, the metal wire 20 and the pitch-to-pitch portion 131 of the columnar metal terminal 10 overlap each other. As a result, even if the columnar metal terminal 10 is to be pulled out from the metal wire 20, the overlapping portions are engaged with each other, and the pulling strength can be increased. Therefore, it is possible to secure the electrical conduction between the columnar metal terminal 10 and the metal wire 20 and to secure the bonding strength.

Further, the metal wire 20 has a metal wire 21 and a resin layer 22 in which the metal wire 21 is coated with a resin.

According to this, even the metal wire 20 having the resin layer 22 can be firmly bonded to the columnar metal terminal 10 while ensuring electrical continuity.

Further, the columnar metal terminal 10 is a polygonal columnar shape, the metal wire 20 has at least one intersection 23 connected to the columnar metal terminal, and the intersection 23 has a pitch-to-pitch portion 131 in the columnar metal terminal 10. It is placed on the side that is not formed.

When the intersecting portion 23 of the metal wire 20 is provided with respect to the joint terminal surface 110 of the columnar metal terminal 10, the intersecting portion 23 is sandwiched between the pair of electrodes 30 during thermocompression bonding. Since the intersecting portion 23 is thicker than the other portion of the metal wire 20, there may be a portion that does not come into contact with the pair of electrodes 30 in the other portion. As a result, thermocompression bonding may not be reliably performed at the portion of the metal wire 20 other than the intersection 23.

On the other hand, when the intersecting portion 23 of the metal wire 20 is provided on the side surface of the columnar metal terminal 10 other than the joint terminal surface 110, the intersecting portion 23 is arranged at a position not sandwiched by the pair of electrodes 30. Therefore, since only the single-wound portions of the metal wire 20 are arranged on the joint terminal surface 110 of the columnar metal terminal 10, the pair of electrodes 30 can be reliably brought into contact with these portions. Therefore, the certainty of thermocompression bonding can be improved.

Further, the metal wire 20 is formed of a metal containing aluminum as a main component, and the plating layer 13 is formed of a metal containing tin as a main component.

According to this, the molten tin has a property of being difficult to wet and spread with respect to solid aluminum. Therefore, even if tin melts during thermocompression bonding, the surface of the metal wire 20 made of a metal containing aluminum as a main component does not spread.

FIG. 7 is a cross-sectional view of the terminal 1 according to the embodiment, which represents a shape closer to the actual shape. Specifically, FIG. 7 is a diagram corresponding to FIG. 2. As shown in FIG. 7, the molten tin gathers between the pitches of the metal wires 21 containing aluminum as a main component due to its surface tension, and does not spread on the surface of the metal wires 21. Therefore, it is possible to increase the thickness t1 of the pitch-to-pitch portion 131 in the plating layer 13. As a result, even if the columnar metal terminal 10 is to be pulled out from the metal wire 20, the pitch-to-pitch portion 131 is engaged, and the pull-out strength can be increased. Therefore, the bonding strength between the columnar metal terminal 10 and the metal wire 20 can be ensured.

[Modification 1]
In the above embodiment, a case where one metal wire 20 is wound around a columnar metal terminal 10 and joined is exemplified. However, a plurality of metal wires may be wound around the columnar metal terminals. In this modification 1, as an example, a case where two metal wires 20a1 and 20a2 are wound around a columnar metal terminal 10a will be illustrated. In the following description, the same parts as those in the above embodiment may be designated by the same reference numerals and the description thereof may be omitted.

FIG. 8 is a front view showing a schematic configuration of the terminal 1A according to the modified example 1. As shown in FIG. 8, two metal wires 20a1 and 20a2 are wound around the columnar metal terminal 10a of the terminal 1A. Specifically, the two metal wires 20a1 and 20a2 have intersections 23a1 and 23a2, respectively, and these intersections 23a1 and 23a2 are arranged at positions where they do not overlap each other. Further, the two metal wires 20a1 and 20a2 are wound around the columnar metal terminal 10a in a double spiral shape so as not to overlap each other, and are joined to the columnar metal terminal 10a.

As described above, a plurality of metal wires 20a1 and 20a2 are provided, and each of them is wound around the columnar metal terminal 10a.

Thereby, by winding the plurality of metal wires 20a1 and 20a2 around one columnar metal terminal 10a, the columnar metal terminal 10a can be made common.

Here, the wire diameters of the plurality of metal wires 20a1 and 20a2 may be the same or different. Specifically, the wire diameters of the metal wires provided in each of the plurality of metal wires 20a1 and 20a2 may be the same or different.

FIG. 9 is a cross-sectional view of the terminal 1A according to the first modification, showing a state in which a plurality of metal wires 20a1 and 20a2 having different wire diameters are joined. In FIG. 9, only the metal wires 21a1 and 21a2 from which the resin layer has been removed are shown.

As shown in FIG. 9, in a plurality of metal wires 20a1 and 20a2 having different wire diameters, the metal wires 21a1 and 21a2 are thermocompression bonded to the plating layer 13a on the joint terminal surface 110a of the columnar metal terminal 10a. Therefore, an inter-pitch portion 131a of the plating layer 13a is formed between the pitches of the metal wires 21a1 and 21a2. Here, the wire widths of the metal wires 21a1 and 21a2 in the thermocompression-bonded state are lengths z1 and z2 along the axial direction of the columnar metal terminals 10a in the metal wires 21a1 and 21a2. Here, the case where the wire diameter of the metal wire 21a1 is larger than that of the metal wire 21a2 is illustrated. Further, the thicknesses h1 and h2 of the metal wires 21a1 and 21a2 along the direction orthogonal to the axial direction of the columnar metal terminals 10a are the same.

Before thermocompression bonding, the metal wires 21a1 and 21a2 had circular cross-sectional shapes (virtual wires L11 and L12 in FIG. 9) having different wire diameters from each other. When the terminal 1A is manufactured, the metal wires 21a1 and 21a2 are thermocompression-bonded so as to be pressed against the columnar metal terminal 10a. As a result, the thicknesses h1 and h2 of the metal wires 21a1 and 21a2 having different wire diameters are made uniform. Further, at this time, since the plating layer 13a is melted, it is extruded outward from the interface between the metal wires 21a1 and 21a2 and the plating layer 12. The metal wires 21a1 and 21a2 are embedded in the molten plating layer 13a so as to be in close contact with the plating layer 12. An inter-pitch portion 131a is formed between the pitches of the metal wires 21a1 and 21a2.

That is, by being pressed by thermocompression bonding, even metal wires 21a1 and 21a2 having different wire diameters can be reliably brought into close contact with the columnar metal terminal 10a and joined.

In this way, even if the wire diameters of the plurality of metal wires 20a1 and 20a2 are different, it is possible to reliably join the columnar metal terminals 10a while forming the pitch-to-pitch portion 131a and ensure electrical conduction. be.

[Modification 2]
In the above embodiment, the terminal 1 in which the metal wire 20 is wound and joined to the columnar metal terminal 10 having the double plating layers 12 and 13 is exemplified. In the second modification, the terminal 1B to which the metal wire 20 is wound and joined to the columnar metal terminal 10b having only the plating layer 13b will be described.

FIG. 10 is a cross-sectional view showing the terminal 1B according to the modified example 2. Specifically, FIG. 10 is a diagram corresponding to FIG. 2. As shown in FIG. 10, the base metal layer 11b of the columnar metal terminal 10b provided in the terminal 1B is entirely formed of a second metal containing copper as a main component, and the surface thereof is coated with a plating layer 13b. ing. That is, before the metal wire 20 is wound, the surface of the columnar metal terminal 10b is in a state where the plating layer 13b is exposed as a whole.

By winding the metal wire 20 around the joint terminal surface 110b of the columnar metal terminal 10b and performing thermocompression bonding, the metal wire 21b is pressed against the columnar metal terminal 10b. At this time, since the plating layer 13b is melted, the metal wire 21b is embedded in the melted plating layer 13b so as to be in close contact with the base metal layer 11b. Further, an inter-pitch portion 131b is formed between the pitches of the metal wires 21b.

[Modification 3]
In the above embodiment, the case where the metal wire 20 is retained by the plating layer 13 is exemplified. In this modification 3, the case where the metal wire is pulled out by the plating layer and the resin layer is illustrated.

FIG. 11 is a cross-sectional view showing the terminal 1C according to the modified example 3. Specifically, FIG. 11 is a diagram corresponding to FIG. 2. As shown in FIG. 11, in the terminal 1C, of the pair of bonded terminal surfaces 110c of the columnar metal terminal 10c, the plating layer 13c is concentrated on the first surface 1111 and the resin layer 22c is concentrated on the second surface 1112. There is. Further, the plurality of first portions 211 in contact with the first surface 1111 of the metal wire 21c are crushed and have a flatter shape than the plurality of second portions 212 in contact with the second surface 1112.

Further, on the first surface 1111, a pitch-to-pitch portion 131c of the plating layer 13c is provided between the plurality of first portions 211. The thickness of the inter-pitch portion 131c of the first surface 1111 is one-fourth or more of the thickness of the first portion 211 in the metal wire 21c, and is smaller than the thickness of the first portion 211.

On the second surface 1112, a re-cured resin portion 221 due to the resin layer 22c is formed between the plurality of second portions 212. The re-cured resin portion 221 is a resin portion formed by melting and re-curing the resin layer 22c.

Further, on the second surface 1112, the inter-pitch portion of the plating layer 13c is not provided between the plurality of second portions 212. That is, the thickness of the inter-pitch portion 131c on the first surface 1111 is larger than the thickness of the inter-pitch portion on the second surface 1112. In the third modification, the case where the inter-pitch portion is not provided on the second surface 1112 is illustrated, but the inter-pitch portion may be provided on the second surface 1112. In this case, the thickness of the inter-pitch portion of the second surface 1112 may be extremely smaller than the thickness of the inter-pitch portion 131c of the first surface 1111. Specifically, the thickness of the inter-pitch portion of the second surface 1112 may be 1/10 or less of the thickness of the inter-pitch portion 131c of the first surface 1111.

As described above, the metal wire 21c is fixed at the pitch-to-pitch portion 131 on the first surface 1111 and fixed at the re-cured resin portion 221 on the second surface 1112.

Next, a method of manufacturing the terminal 1C according to the modified example 3 will be described.

In the above embodiment, as shown in FIG. 5, the columnar metal terminal 10 and the metal wire 21 are thermocompression bonded to each of the pair of electrodes 30 by applying an electric current to each of the pair of electrodes 30.

In the third modification, a current is applied only to the electrode 30 located above the pair of electrodes 30, and the columnar metal terminal 10c and the metal wire 21c are thermocompression bonded only by the electrode 30. Here, at the time of thermocompression bonding, it is assumed that the first surface 1111 of the columnar metal terminal 10c faces upward and the second surface 1112 faces downward.

At the time of thermocompression bonding, the plating layer 13 in the region sandwiched by the pair of electrodes 30 melts, but the melted plating layer 13c gathers on the upper part of the columnar metal terminal 10, that is, on the first surface 1111 due to surface tension. On the other hand, the resin layer 22 in the region sandwiched by the pair of electrodes 30 also melts, but the melted resin layer 22c gathers at the lower part of the columnar metal terminal 10, that is, on the second surface 1112. Further, in the metal wire 21c, since the influence of heat from the upper electrode 30 is strong, the deformation amount of the first portion 211 of the metal wire 21 is larger than that of the second portion 212, resulting in a flat shape. ..

After that, when the heating from the electrode 30 located above was stopped, the plating layer 13c gathered on the first surface 1111 was re-cured to form the inter-pitch portion 131c and gathered on the second surface 1112. The resin layer 22c is re-cured to form the re-cured resin portion 221.

As described above, the columnar metal terminal 10 has a substantially polygonal outer shape in the axial direction of the columnar metal terminal 10, and the metal wire 21 in contact with the first surface 1111 forming one side of the substantially polygonal shape of the columnar metal terminal 10. The first portion 211 is flatter than the second portion 212 of the metal wire 21 in contact with the second surface 1112 facing the first surface 1111 of the metal wire 21, and the thickness of the inter-pitch portion 131c on the first surface 1111 is The second portion 212 is fixed to the second surface 1112 by the re-cured resin portion 221 formed by melting and re-curing the resin layer 22c, which is larger than the thickness of the inter-pitch portion on the second surface 1112. There is.

According to this, the metal wire 21c is fixed at the pitch-to-pitch portion 131 on the first surface 1111 and fixed at the re-cured resin portion 221 on the second surface 1112. That is, the metal wire 21c can be fixed to the columnar metal terminal 10c with both the plating layer 13c and the resin layer 22c, and the pull-out strength can be further increased. Therefore, the bonding strength between the columnar metal terminal 10 and the metal wire 20 can be further secured.

[others]
Although the present invention has been described above based on the embodiments, the present invention is not limited to the above embodiments.

For example, a columnar metal terminal and a metal wire in a state where the metal wire is not entwined with the columnar metal terminal, that is, in a state where the metal wire does not have an intersection and is simply wound around the columnar metal terminal in a single layer. And may be joined.

In addition, there are also forms obtained by subjecting various modifications to the embodiments that can be conceived by those skilled in the art, and embodiments realized by arbitrarily combining the components and functions of the embodiments without departing from the spirit of the present invention. Included in the present invention.

1,1A, 1B, 1C terminals 10, 10a, 10b, 10c Columnar metal terminals 13, 13a, 13b, 13c Plating layers 20, 20a1, 20a2 Metal wires 21, 21a1, 21a2, 21b, 21c Metal wires 22, 22c Resin layers 23, 23a1, 23a2 Intersections 131, 131a, 131b, 131c Inter-pitch part 211 First part 212 Second part 221 Re-curing resin part 1111 First surface 1112 Second surface

Claims (5)

Columnar metal terminals with a plating layer on the surface,
A metal wire wound a plurality of times around the columnar metal terminal is provided.
The plating layer exposes a part of the metal wire and is not mixed with the metal wire.
The thickness of the inter-pitch portion arranged between the pitches of the metal wires wound a plurality of times in the plating layer is one-fourth or more of the thickness of the metal wires, and is smaller than the thickness of the metal wires. ,
The metal wire has a metal wire and a resin layer in which the metal wire is coated with a resin.
The columnar metal terminal has a substantially polygonal outer shape in the axial direction of the columnar metal terminal.
The first portion of the metal wire in contact with the first surface forming one side of the substantially polygonal shape of the columnar metal terminal is from the second portion of the metal wire in contact with the second surface of the metal wire facing the first surface. Is also flat,
The thickness of the inter-pitch portion on the first surface is larger than the thickness of the inter-pitch portion on the second surface.
The second portion is fixed to the second surface by a re-cured resin portion formed by melting and re-curing the resin layer.
Terminal. The columnar metal terminal is a polygonal columnar shape and has a polygonal columnar shape.
The metal wire has at least one intersection tied to the columnar metal terminal.
The terminal according to claim 1, wherein the at least one intersection is arranged on a side surface of the columnar metal terminal where the inter-pitch portion is not provided. The terminal according to claim 1 or 2 , wherein a plurality of the metal wires are provided, and each of them is wound around the columnar metal terminal. The terminal according to claim 3 , wherein the plurality of metal wires have different wire diameters. The metal wire is made of a metal containing aluminum as a main component.
The terminal according to any one of claims 1 to 4 , wherein the plating layer is made of a metal containing tin as a main component.

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