JP7000044B2 - Power supply - Google Patents

Description

The present invention relates to a power supply device having a heat sink.

Conventionally, it has been known to mount an electronic element on a heat sink in order to efficiently dissipate heat from an electronic element such as a switching element having high heat generation. Generally, the heat sink has a flat surface, and an electronic element such as a switching element is provided on the flat surface (Patent Document 1).

In recent years, attention has been paid to the automatic driving of automobiles. In order to enable such automatic operation, higher reliability than before is required. In order to achieve high reliability, as an example, mechanisms that perform the same function are provided in duplicate, and if a problem occurs in one mechanism, the vehicle is tentatively driven by the other mechanism. Is possible.

However, when such overlapping mechanisms are provided, a volume twice as large as that of the conventional one is simply required, and therefore, it is strongly desired to reduce the size of the device.

Further, if a trouble occurs in one of the mechanisms, a considerable amount of heat may be generated. In this regard, when a common heat sink is used, the heat generated from one mechanism may affect the other mechanism.

Japanese Patent Application Laid-Open No. 2002-120739

In view of these points, the present invention provides a power supply device having a high cooling effect and capable of achieving high reliability.

The power supply device according to the present invention is
The first heat sink, the first power module arranged on one side of the first heat sink, the first heat radiating portion arranged on one side of the first power module, and the first heat radiating portion arranged on one side of the first heat radiating portion. A first assembly having a first control board that is electrically connected to the first power module.
A second heat sink, a second power module arranged on the other side of the second heat sink, a second heat radiating portion arranged on the other side of the second power module, and an arrangement on the other side of the second heat radiating portion. A second assembly having a second control board that is electrically connected to the second power module.
Equipped with
The other side of the first heat sink and one side of the second heat sink may be arranged so as to face each other.

In the power supply device according to the present invention
The first heat sink has a first protrusion that projects to the other side.
The second heat sink has a second protrusion that protrudes to one side.
A part of the first power module is provided in the area on one side of the first protrusion.
A part of the second power module may be provided in the area on the other side of the second protrusion.

In the power supply device according to the present invention
The first heat radiating portion has a first thick portion outside the region on one side of the first protruding portion.
The second heat radiating portion may have a second thick portion outside the region on the other side of the second protruding portion.

In the power supply device according to the present invention
The first heat sink is the first heat sink.
The second heat sink is a second heat sink.
The first power module has a first module terminal extending toward the first control board and electrically connected to the first control board.
The second power module may have a second module terminal extending toward the second control board and electrically connected to the second control board.

In the power supply device according to the present invention
The first power module has a plurality of first electronic elements and has a plurality of first electronic elements.
The second power module has a plurality of second electronic elements and has a plurality of second electronic elements.
The total calorific value of the first electronic element positioned at the corresponding position on one side corresponding to the first protrusion is larger than the total calorific value of the first electronic element not positioned at the corresponding position on the one side. big,
The total calorific value of the second electronic element positioned at the corresponding position on the other side corresponding to the second protrusion is larger than the total calorific value of the second electronic element not positioned at the corresponding position on the other side. It may grow larger.

In the power supply device according to the present invention
The first heat sink is the first heat sink.
The second heat sink is a second heat sink.
The first power module is provided on the first heat sink side substrate, the first heat sink side electronic element provided on the first heat sink side substrate, the first heat sink side substrate, and the first heat sink side substrate. It has an electronic element on the first heat sink side,
The second power module is provided on the second heat sink side substrate, the second heat sink side electronic element provided on the second heat sink side substrate, the second heat sink side substrate, and the second heat sink side substrate. It also has an electronic element on the second heat sink side.
The total calorific value of the electronic element on the first heat sink side is larger than the total calorific value of the electronic element on the first heat sink side.
The total heat generation amount by the second heat sink side electronic element may be larger than the total heat generation amount by the second heat sink side electronic element.

The power supply device according to the present invention is
The first current module electrically connected to the first control board,
Further, a second current module electrically connected to the second control board is provided.
The first heat sink has a first recess on the side opposite to the motor side of the first protrusion.
The second heat sink has a second recess on the side opposite to the motor side of the second protrusion.
At least a part of the first current module is provided in the first recess.
At least a part of the second current module may be provided in the second recess.

In the present invention, a first assembly and a second assembly capable of performing the same function are used. Therefore, high reliability can be realized. In addition, the power module can be cooled by both the heat sink and the heat dissipation part, and a high cooling effect can be expected.

In the present invention, since the first heat sink and the second heat sink are separate bodies, even if heat is generated in either the first assembly or the second assembly, the influence on the other is reduced. be able to.

FIG. 1 is a side view showing a power supply device according to an embodiment of the present invention. FIG. 2 is a view of the power supply device shown in FIG. 1 as viewed from the rotary drive unit side (right side of FIG. 1). FIG. 3A is a plan view of the first heat sink and the first current module, and FIG. 3B is a plan view of the second heat sink and the second current module. FIG. 4 is a side view showing a power supply device and a rotary drive unit according to an embodiment of the present invention. FIG. 5 is a view of a part of the power supply device shown in FIG. 1 as viewed from the side opposite to the rotary drive unit (left side of FIG. 1). FIG. 6 (a) is a cross-sectional view of a first power module, a first heat dissipation unit and a first heat sink that can be used in the present embodiment, and FIG. 6 (b) is a second view that can be used in the present embodiment. It is sectional drawing of the 2 power module, the 2nd heat dissipation part and the 2nd heat sink. FIG. 7A is a plan view showing the relationship between the first power module and the first protrusion that can be used in the present embodiment, and FIG. 7B can be used in the present embodiment. It is a top view which showed the relationship between the 2nd power module and the 2nd protrusion. FIG. 8 is a side view showing a power supply device according to a modified example of the embodiment of the present invention. FIG. 9 is a side view showing a power supply device according to another modification of the embodiment of the present invention. FIG. 10 (a) is a plan view showing the relationship between the first thick portion and the first notch that can be used in the present embodiment, and FIG. 10 (b) is used in the present embodiment. It is a top view which showed the relationship between the 2nd thick part and the 2nd notch.

Embodiment << Configuration >>
In the present embodiment, "one side" means the upper side of FIG. 1, and "the other side" means the lower side of FIG. 1. Further, the vertical direction of FIG. 1 (the direction from the other to one and the direction from one to the other) is defined as the "first direction", the left-right direction of FIG. 1 is defined as the "second direction", and the front and back directions of the paper in FIG. 1 are defined. "Third direction".

The power supply device of this embodiment may be used, for example, in an electric power steering device (EPS). The power supply device may have a power unit to which a drive current for driving a rotation drive unit 500 (see FIG. 4) such as a motor is energized, and a control unit for controlling the rotation drive unit 500 such as a motor. As shown in FIG. 1, the power unit may include a first current module 110 and a second current module 120, which will be described later, and a first power module 30 and a second power module 40. Further, the control unit may have a first control board 130 and a second control board 140, which will be described later.

As shown in FIG. 1, the power supply device of the present embodiment may have a first assembly and a second assembly. The first assembly is arranged on one side of the first heat sink 10, the first power module 30 arranged on one side of the first heat sink 10, and the first power module 30, and is electrically connected to the first power module 30. It may have a first control board 130 which is connected to and controls the first power module 30. The second assembly is arranged on the other side of the second heat sink 20, the second power module 40 arranged on the other side of the second heat sink 20, and the second power module 40, and is electrically connected to the second power module 40. A second control board 140, which is connected to and controls the second power module 40, may be provided.

The first heat dissipation unit 50 may be arranged between the first power module 30 and the first control board 130. More specifically, the first heat dissipation unit 50 may be provided on one side of the first power module 30 and on the other side of the first control board 130. Further, the second heat dissipation unit 60 may be arranged between the second power module 40 and the second control board 140. More specifically, the second heat dissipation unit 60 may be provided on the other side of the second power module 40 and on one side of the second control board 140. The first heat radiating unit 50 and the second heat radiating unit 60 may have a plate shape, the first heat radiating unit 50 may be composed of the first heat radiating plate, and the second heat radiating unit 60 may be composed of the second heat radiating plate. ..

As shown in FIG. 1, the other side of the first heat sink 10 and the one side of the second heat sink 20 may be arranged so as to face each other. On the right side of FIG. 1 of the first heat sink 10 and the second heat sink 20, a rotary drive unit 500 such as a motor used in a vehicle such as an automobile or a two-wheeled vehicle may be arranged (see FIG. 4). Then, a position detection board 150 for acquiring information regarding the rotation position of the rotation drive unit 500 may be provided on the rotation drive unit 500 side (right side in FIG. 1) of the first heat sink 10 and the second heat sink 20.

The first heat sink 10 may have a first protruding portion 11 protruding to the other side, and the second heat sink 20 may have a second protruding portion 21 protruding to one side. The other side surface of the first protrusion 11 may be a flat surface, and the one side surface of the second protrusion 21 may be a flat surface (see FIG. 3). The flat surface on the other side of the first protruding portion 11 and the flat surface on one side of the second protruding portion may come into contact with each other.

As shown in FIG. 1, a part of the first power module 30 is provided on one side of the first protrusion 11 (see FIG. 7A), and the second power is provided on the other side of the second protrusion 21. A part of the module 40 may be provided (see FIG. 7B).

As shown in FIG. 1, the first heat sink 10 may have a first recess 16 on the other side, and the second heat sink 20 may have a second recess 26 on one side. The first assembly may have a first current module 110 that is at least partially located in the first recess 16 and is electrically connected to the first power module 30. The second assembly may have a second current module 120 that is at least partially located in the second recess 26 and is electrically connected to the second power module 40.

The first power module 30 has a first module terminal 31 extending to the first control board 130 side and the first current module 110 side and electrically connected to the first control board 130 and the first current module 110. May be good. Even if the second power module 40 has a second module terminal 41 extending to the second control board 140 side and the second current module 120 side and electrically connected to the second control board 140 and the second current module 120. good.

As shown in FIG. 1, the first control board 130 and the position detection board 150 are arranged adjacent to each other at the end of the first control board 130 on the rotation drive unit 500 side, and the second control board 140 and the position detection board 150 are arranged adjacent to each other. May be arranged adjacent to each other at the end of the second control board 140 on the rotation drive unit 500 side. Here, "adjacent" means a mode in which the particles are arranged without a gap or a mode in which the particles are arranged with a gap of a certain distance or less (for example, 1 cm or less or several millimeters or less). In the embodiment shown in FIG. 1, the peripheral portion of the position detection board 150 in the radial direction is located adjacent to the end portion of the first control board 130 and the second control board 140 on the rotation drive unit 500 side. ..

As shown in FIG. 2, only one of the first heat sink 10 and the second heat sink 20 may be provided with a positioning unit for positioning the position of the position detection board 150. The positioning portion may have two or more positioning protrusions (positioning pins), and the position detection substrate 150 may have a positioning hole into which the positioning protrusion is inserted without a gap. In the embodiment shown in FIG. 2, the position detection main body 150 has a position detection main body plate 154, and the position detection main body plate 154 is provided with a pair of positioning holes 152 into which the positioning protrusion 29 is inserted. In the embodiment shown in FIGS. 2 and 3, a pair of positioning protrusions 29 are provided on the surface of the second heat sink 20 on the rotation drive unit 500 side, but the present invention is not limited to this, and the rotation of the first heat sink 10 is not limited to this. A pair of positioning protrusions or three or more positioning protrusions may be provided on the surface on the drive unit 500 side. It should be noted that the word "without gap" means that there is substantially no gap, and the aspect in which a minute gap exists is included in the aspect of "without gap".

The position detection substrate 150 may have the position detection element 151 at the center position in the surface direction (paper direction in FIG. 2). The position detection element 151 can detect the rotation position of the rotation drive unit 500 such as a motor.

The position detection substrate 150 may be fixed to each of the surface of the first heat sink 10 on the rotation drive unit 500 side and the surface of the second heat sink 20 on the rotation drive unit 500 side. In this aspect, as shown in FIG. 2, a fastening hole 153 for inserting a fastening member such as a screw may be provided in the position detection main body plate 154. It should be noted that such a fastening hole 153 and the fastening member are provided with a certain degree of "play", and accurate positioning cannot be performed.

On the side surface (third direction), the first heat sink 10 and the second heat sink 20 may be exposed. More specifically, an embodiment in which a control board, a position detection board 150, or the like is not provided on the front surface and the back surface side of the paper surface of FIG. 1 of the first heat sink 10 and the second heat sink 20 may be adopted. ..

As shown in FIG. 3, the first heat sink 10 has a first positioning member such as a first positioning protrusion (for example, a positioning pin) 18a protruding to the other side, and the second heat sink 20 has a second protruding portion to one side. (Ii) A second positioning member such as a positioning protrusion (for example, a positioning pin) 28a may be provided. The first heat sink 10 has a first positioning hole 18 into which the second positioning protrusion 28a is inserted without a gap, and the second heat sink 20 has a second positioning hole 28 into which the first positioning protrusion 18a is inserted without a gap. May have. More specifically, the first positioning protrusion 18a may protrude from the flat surface of the first heat sink 10 to the other side, and the second positioning protrusion 28a may protrude to one side from the flat surface of the second heat sink 20. The first positioning hole 18 may be provided on the flat surface of the second heat sink 20, and the second positioning hole 28 may be provided on the flat surface of the first heat sink 10.

The first control board 130 and the second control board 140 may be fixed to the position detection board 150 at the end portion (right end portion in FIG. 1) on the rotation drive unit 500 side. More specifically, the first control board 130 is inserted into the fixing hole 159 (see FIG. 2) provided in the position detection board 150 by inserting the first control fixing portion 139 of the first control board 130 into the position detection board. The second control board 140 is fixed to the 150, and the second control fixing portion 149 of the second control board 140 is inserted into the fixing hole 159 (see FIG. 2) provided in the position detection board 150 to detect the position of the second control board 140. It may be fixed to the substrate 150.

As shown in FIG. 3A, the first current module 110 has the first current board 111 and the other side of the first current board 111 (the front side of the paper surface of FIG. 3A, the lower side of FIG. 1). The second current module 120 has a first current device 115 provided on the side), and the second current module 120 has a second current board 121 and one side of the second current board 121 (the front surface of the paper surface of FIG. 3B). It may have a second current device 125 provided on the side (upper side in FIG. 1). As shown in FIG. 5, the first current device 115 provided on the other side (lower side in FIG. 5) of the first current board 111 and the first current device 121 provided on one side (upper side in FIG. 5) of the second current board 121. The second current device 125 may be nested and overlapped in the first direction from one side to the other. As shown in FIG. 5, the first current module 110 has a plurality of first current devices 115, one of which is provided on the other side of the first current board 111, and the rest of which is the first current board 111. It may be provided on one side. Further, the second current module 120 has a plurality of second current devices 125, a part of which is provided on one side of the second current board 121, and the rest thereof is provided on the other side of the second current board 121. You may.

As shown in FIG. 1, the first current module 110 may be fixed to the first control board 130 by a first current module fixing member 119 such as a claw member. Similarly, the second current module 120 may be fixed to the second control board 140 by a second current module fixing member 129 such as a claw member. In the embodiment shown in FIG. 1, another first current module fixing member 119 may be provided on the back surface side of the paper surface (see FIG. 5). In this case, the first current module fixing member 119 is fixed to the first control board 130 by sandwiching the first control board 130 by the pair of first current module fixing members 119. Similarly, in the embodiment shown in FIG. 1, another second current module fixing member 129 may be provided on the back surface side of the paper surface (see FIG. 5). In this case, the second control board 140 is sandwiched between the pair of second current module fixing members 129, so that the second current module fixing member 129 is fixed to the second control board 140.

The first current substrate 111 shown in FIG. 3 may be made of a low thermal conductive material. Similarly, the second current substrate 121 may be made of a low thermal conductive material. As the low thermal conductivity material, for example, polybutylene terephthalate resin (PBT resin), PA (polyamide), PPS (polyphenylene sulfide) and the like can be used.

As shown in FIG. 3, the other side end portion (for example, a flat surface) of the first protrusion 11 may have a first notch 11a on the side opposite to the rotation drive portion 500 side (left side in FIG. 3). .. One side end portion (for example, a flat surface) of the second protruding portion 21 may have a second notch 21a on the side opposite to the rotation driving portion 500 side. In this case, the first current device 115 may be provided in the first notch 11a, and the second current device 125 may be provided in the second notch 21a. In the embodiment shown in FIG. 3, the first protrusion 11 has a first notch 11a, and a first current device 115 such as a choke coil is provided in the first notch 11a, and the second protrusion 11a is provided. 21 has a second notch 21a, and a second current device 125 such as a choke coil is provided in the second notch 21a.

The first current device 115 and the second current device 125 may include a capacitor, a power connector, and the like in addition to the choke coil described above. Capacitors may be arranged, for example, to extend along a second direction (see FIGS. 3 and 5).

In FIG. 3A, the first heatsink 10 is inverted so that the upper side of the first heatsink 10 in FIG. 3A is aligned with the lower side of the second heatsink 20 in FIG. 3B. , The embodiment is as shown in FIG. The first protruding portion 11 and the second protruding portion 21 may be provided with fastening holes 17 and 27 for inserting fastening members 15 (see FIG. 1) such as screws. Such fastening holes 17 may be provided. , 27 and the fastening member are provided with a certain degree of "play", and accurate positioning cannot be performed.

The first heat sink 10 has a first extending portion 12 on the side opposite to the rotation driving portion 500 side (left side in FIG. 1) of the first protruding portion 11, and the second heat sink 20 is the rotation of the second protruding portion 21. The second extending portion 22 may be provided on the side opposite to the driving portion 500 side. The other side surface of the first extending portion 12 may be a flat surface, and the one side surface of the second extending portion 22 may be a flat surface. The flat surface on the other side of the first extending portion 12 may abut on the flat surface on one side of the second extending portion 22. A fastening hole for inserting a fastening member 15 such as a screw may be provided in the first extending portion 12 and the second extending portion 22, and by inserting the fastening member 15 into the fastening hole, a second One heat sink 10 may be fixed to the second heat sink 20. FIG. 1 shows the fastening member 15 inserted into the first extending portion 12, but on the back side of the paper in FIG. 1, the fastening member is inserted into the second extending portion 22.

As shown in FIG. 1, one or more first control elements 135 may be provided on the other side of the first control board 130. Then, the first control element 135 and the first heat radiating unit 50 may come into contact with each other, and the heat generated from the first control element 135 may be dissipated by the first heat radiating unit 50. One or more second control elements 145 may be provided on one side of the second control board 140. The second control element 145 and the second heat radiating unit 60 may come into contact with each other, and the heat generated from the second control element 145 may be dissipated by the second heat radiating unit 60.

The mode in which the heat sinks 10 and 20 and the power modules 30 and 40 come into contact with each other includes a mode in which a third member or a third material such as a heat radiating sheet, a heat radiating insulation sheet, a heat radiating grease, and a heat radiating insulating grease is interposed. There is. Similarly, in the mode in which the heat radiating portions 50, 60 and the power modules 30, 40 or the control elements 135, 145 come into contact with each other, a third member such as a heat radiating sheet, an insulating sheet, a heat radiating insulating sheet, a heat radiating grease, a heat radiating insulating grease, or a third member or the first. It also includes an embodiment in which three materials are interposed and contacted.

As shown in FIG. 1, the first current module 110 is electrically connected to the first power module 30 via the first module terminal 31, and is electrically connected to the first control board 130 via the first current terminal 116. It is connected to the. The second current module 120 is electrically connected to the second power module 40 via the second module terminal 41, and is electrically connected to the second control board 140 via the second current terminal 126.

As shown in FIG. 6A, the first power module 30 may have a stack structure having an electronic element composed of laminated semiconductor elements or the like. That is, the first power module 30 may have a first heat sink side electronic element 36 and a first heat sink side electronic element 37 arranged on one side of the first heat sink side electronic element 36. As shown in FIG. 6B, the second power module 40 may also have a stack structure having an electronic element composed of laminated semiconductor elements or the like. That is, the second power module 40 may have a second heat sink side electronic element 46 and a second heat sink side electronic element 47 arranged on the other side of the second heat sink side electronic element 46. When such an aspect is adopted, the total heat generation amount by the first heat sink side electronic element 36 may be larger than the total heat generation amount by the first heat dissipation unit side electronic element 37. Further, the total heat generation amount by the second heat sink side electronic element 46 may be larger than the total heat generation amount by the second heat sink side electronic element 47.

The first power module 30 shown in FIG. 6A includes a first heat sink side substrate 32a, a first heat sink side conductor layer 33a provided on the first heat sink side substrate 32a, and a first heat sink side substrate 32b. The first heat-dissipating portion-side conductor layer 33b provided on the first heat-dissipating portion-side substrate 32b and the first connecting body 39 provided between the first heat-sink side electronic element 36 and the first heat-dissipating portion-side electronic element 37 are provided. Have. The mode is not limited to that shown in FIG. 6 (a). For example, the first heat radiating portion side conductor layer 33b is provided on the upper side of FIG. 6 (a) of the first connecting body 39, and the first heat radiating portion side conductor layer is provided. An embodiment in which the electronic element 37 on the first heat dissipation portion side is provided on the upper side of FIG. 6A of 33b may be adopted. The second power module 40 shown in FIG. 6B includes a second heat sink side substrate 42a, a second heat sink side conductor layer 43a provided on the second heat sink side substrate 42a, and a second heat sink side substrate 42b. The second heat sink side conductor layer 43b provided on the second heat sink side substrate 42b and the second connector 49 provided between the second heat sink side electronic element 46 and the second heat sink side electronic element 47 are provided. Have. The mode is not limited to that shown in FIG. 6 (b). For example, the second heat radiating portion side conductor layer 43b is provided on the lower side of FIG. 6 (b) of the second connecting body 49, and the second heat radiating portion side conductor is provided. An embodiment in which the second heat radiation portion side electronic element 47 is provided on the lower side of FIG. 6B of the layer 43b may be adopted.

The embodiment shown in FIG. 1 is merely an example. For example, as shown in FIG. 8, the current modules 110 and 120 may not be provided, and the protrusions 11 and 21 and the recesses 16 and 26 may not be provided. Alternatively, the first control element 135 radiated by the first heat radiating unit 50 and the second control element 145 radiated by the second heat radiating unit 60 may not be provided.

《Action / Effect》
Next, an example of the action / effect according to the present embodiment having the above-described configuration will be described. In addition, all aspects described in "Action / Effect" can be adopted in the above configuration.

In the present embodiment, when the first assembly and the second assembly capable of performing the same function are used, even if one assembly is inconvenient, the other assembly is used. Since it can fulfill the complementary function, high reliability can be realized.

Further, when the embodiment in which the first heat sink 10 and the second heat sink 20 are separate bodies is adopted, even if heat is generated in either the first assembly or the second assembly, the other is generated. The influence of can be reduced.

As shown in FIG. 1, when the mode of cooling the first power module 30 by using both the first heat sink 10 and the first heat radiation unit 50 is adopted, a high cooling effect is obtained for the first power module 30. It is beneficial in that it can be achieved. Similarly, when the mode of cooling the second power module 40 by using both the second heat sink 20 and the second heat radiating unit 60 is adopted, a high cooling effect can be realized for the second power module 40. It is beneficial. The first control element 135 radiated by the first heat radiating unit 50 and the second control element 145 radiated by the second heat radiating unit 60 may not be provided, and these first control element 135 and the second control element When 145 is not used, a higher heat dissipation effect can be expected by the heat dissipation units 50 and 60.

As shown in FIG. 1, on one side of the first power module 30, a first control board 130 that is electrically connected to the first power module 30 and controls the first power module 30 is provided, and a second power is provided. When the aspect in which the second control board 140 which is electrically connected to the second power module 40 and controls the second power module 40 is provided on the other side of the module 40, the position close to the power module is adopted. It is advantageous in that the control board can be positioned and is less susceptible to noise and the like.

As shown in FIGS. 1 and 7 (a), a mode is adopted in which a part of the first power module 30 is provided on one side of the first protrusion 11 (the front side of the paper surface in FIG. 7 (a)). In this case, a high heat dissipation effect can be expected in the region corresponding to the first protruding portion 11 (the region on one side of the first protruding portion 11), and a high heat dissipation effect can be expected by adjusting the arrangement relationship in the first power module 30. Can be realized. As shown in FIGS. 1 and 7B, when a mode in which a part of the second power module 40 is provided on the other side of the second protruding portion 21, a region corresponding to the second protruding portion 21 is adopted. A high heat dissipation effect can be expected in (the region on the other side of the second protrusion 21), and a high heat dissipation effect can be realized by adjusting the arrangement relationship in the second power module 40. In FIG. 7 (b), the second heat sink 20 is inverted so that the upper side of the second heat sink 20 in FIG. 7 (b) is aligned with the lower side of the first heat sink 10 in FIG. 7 (a). , The embodiment is as shown in FIG.

When the first heat sink is adopted as the first heat sink 50, the first control board 130 can be positioned relatively close to the first power module 30, so that the generation of noise can be further suppressed. Furthermore, the size in the radial direction can be reduced. Similarly, when the second heat sink is adopted as the second heat sink 60, the second control board 140 can be positioned at a position relatively close to the second power module 40, so that noise is generated more. It can be suppressed, and the size in the radial direction can be reduced. As the thickness of the heat sink, for example, one having a thickness of 1 mm to 12 mm can be adopted.

In the case of adopting the embodiment in which the first power module 30 has the first module terminal 31 extending toward the first control board 130 and connected to the first control board 130, the first module terminal 31 is in the first direction. The thickness of the first heat sink is thinner than the length. Similarly, when the aspect in which the second power module 40 has the second module terminal 41 extending toward the second control board 140 and connected to the second control board 140 is adopted, the first of the second module terminals 41 is adopted. The thickness of the second heat sink becomes thinner than the length in the direction.

Further, as shown in FIG. 9, the first heat radiating portion 50 is not a heat radiating plate having a uniform thickness, and is thickened outside the high heat radiating region not located on one side of the first protruding portion 11. It may have one thick portion 51. Similarly, the second heat radiating portion 60 is not a heat radiating plate having a uniform thickness, and the second thickened portion 61 having a thick wall outside the high heat radiating region not located on the other side of the second protruding portion 21. You may have. When such an aspect is adopted, the heat dissipation effect can be enhanced by the thick portions 51 and 61 outside the high heat dissipation region, and the heat dissipation effect can be brought to the power modules 30 and 40 in a well-balanced manner. Is beneficial.

As shown in FIG. 3, the first protrusion 11 has a first notch 11a on the side opposite to the rotation drive unit 500 side, and the second protrusion 21 has a second notch on the side opposite to the rotation drive unit 500 side. When the aspect of having 21a, the first current device 115 is provided in the first notch 11a, and the second current device 125 is provided in the second notch 21a, the longitudinal direction (second direction) is adopted. ), It is advantageous in that the first current device 115 and the second current device 125 can be arranged while suppressing the increase in size. In particular, as shown in FIG. 3, a first notch 11a is provided on one side surface of the first protrusion 11 (the lower side surface of FIG. 3A and the upper side surface when inverted), and the second protrusion 11a is provided. When the aspect in which the second notch 21a is provided on the other side surface (lower side surface of FIG. 3B) of the portion 21 is adopted, the first current device 115 such as a choke coil having heat generation and the second current It is advantageous in that the device 125 can be provided at a position separated in the third direction to improve heat dissipation and prevent the size from becoming large in the second direction. Further, as shown in FIG. 10, the first thick portion 51 is provided in the corresponding region on one side of the first notch 11a, and the second thick portion 51 is provided in the corresponding region on the other side of the second notch 21a. 61 may be provided. At the locations where the notches 11a and 21a are provided, heat is generated from the current devices 115 and 125 provided in the notches 11a and 21a, and the thickness of the protrusions 11 and 21 is reduced due to the provision of the notches 11a and 21a. It is conceivable that the cooling efficiency due to the protruding portions 11 and 21 will decrease, but it is advantageous in that the reduced cooling efficiency can be compensated for by providing the wall thickness portions 51 and 61 corresponding to the notches 11a and 21a.

When both of the embodiments shown in FIGS. 9 and 10 are adopted, the thicknesses of the thick portions 51 and 61 located outside the high heat dissipation region and the thick portions 51 and 61 corresponding to the notches 11a and 21a are used. The thickness of the may be different. The thickness of the thick portion located outside the high heat dissipation region may be thicker than the thickness of the thick portions 51 and 61 corresponding to the notches 11a and 21a, or the thick portion 51 located outside the high heat dissipation region. The thickness of 61 may be thinner than the thickness of the thick portion corresponding to the notches 11a and 21a. However, as shown in FIG. 1, when the protrusions 11 and 21 are thick, the heat dissipation efficiency of the heat sinks 10 and 20 outside the high heat dissipation region is higher than that of the heat sinks 10 and 20 at the locations corresponding to the notches 11a and 21a. Since it is considered that the heat dissipation efficiency is smaller than that of the above, the thickness of the thick portions 51 and 61 located outside the high heat dissipation region is thicker than the thickness of the thick portions 51 and 61 corresponding to the notches 11a and 21a. It is conceivable to adopt it.

As shown in FIG. 1, the position detection board 150 is arranged on the rotation drive unit 500 side of the first assembly and the second assembly, and the first control board 130 is arranged on one side of the first power module 30. (Ii) When the mode in which the control board 140 is arranged on the other side of the power module is adopted, it is not necessary to provide a large control board in the longitudinal direction (second direction), so that the size in the longitudinal direction becomes larger. Can be prevented.

As shown in FIG. 1, the peripheral portion of the position detection board 150 is provided on the rotation drive unit 500 side of the first control board 130, and the peripheral portion of the position detection board 150 is provided on the rotation drive unit 500 side of the second control board 140. When the provided embodiment is adopted, it is advantageous in that the radial size (particularly the size in the first direction) can be reduced by the thickness of the first control board 130 and the second control board 140.

The first power module 30 has a plurality of first electronic elements 38, and the total heat generation amount of the first electronic element 38 positioned in the high heat dissipation region corresponding to the first protrusion 11 is the second outside the high heat dissipation region. When an embodiment larger than the total heat generation amount of the one electronic element 38 is adopted, it is possible to improve the heat dissipation efficiency in the place where the heat generation is large in the first power module 30, and it is advantageous in that heat can be dissipated in a well-balanced manner. be. The second power module 40 has a plurality of second electronic elements 48, and the total heat generation amount of the second electronic element 48 positioned in the high heat dissipation region corresponding to the second protrusion 21 is the second outside the high heat dissipation region. When an embodiment larger than the total heat generation amount of the two-electronic element 48 is adopted, it is possible to improve the heat dissipation efficiency in the place where the heat generation is large in the second power module 40, which is advantageous in that heat can be dissipated in a well-balanced manner. be. As an example, since the heat generation of the switching element is large, the number of switching elements positioned in the high heat dissipation region corresponding to the first protrusion 11 may be larger than the number of switching elements outside the high heat dissipation region. .. Further, the number of switching elements positioned in the high heat dissipation region corresponding to the second protrusion 21 may be larger than the number of switching elements outside the high heat dissipation region.

According to the embodiment using both the heat sinks 10 and 20 and the heat radiating portions 50 and 60, the heat radiating by the heat sinks 10 and 20 is more effective than the heat radiating by the heat radiating portions (particularly the heat radiating plates) 50 and 60. Therefore, when the first power module 30 has the first heat sink side electronic element 36 and the first heat sink side electronic element 37 as shown in FIG. 6A, the total number of the first heat sink side electronic elements 36 is used. It is conceivable to adopt an embodiment in which the amount of heat generated is larger than the total amount of heat generated by the electronic element 37 on the first heat dissipation portion side. In this case, it is advantageous in that the heat generated in the first power module 30 can be efficiently dissipated. Similarly, when the second power module 40 has the second heat sink side electronic element 46 and the second heat sink side electronic element 47 as shown in FIG. 6B, the total of the second heat sink side electronic element 46 is used. It is conceivable to adopt an embodiment in which the amount of heat generated is larger than the total amount of heat generated by the electronic element 47 on the second heat dissipation unit side. In this case, it is advantageous in that the heat generated in the second power module 40 can be efficiently dissipated. As an example, since the heat generation of the switching element is large, the number of switching elements included in the first heat sink side electronic element 36 may be larger than the number of switching elements included in the first heat sink side electronic element 37. .. Further, the number of switching elements included in the second heat sink side electronic element 46 may be larger than the number of switching elements included in the second heat sink side electronic element 47.

The first power module 30 does not have to have a stack structure as shown in FIG. 6, and similarly, the second power module 40 does not have to have a stack structure. On the other hand, when the first power module 30 has a stack structure, each of the first electronic elements 38 becomes the first heat sink side electronic element 36 or the first heat sink side electronic element 37, and the second power module 40 has a stack structure. In this case, each of the second electronic elements 48 may be the second heat sink side electronic element 46 or the second heat sink side electronic element 47.

A position detection board 150 for acquiring information on the rotation position of the rotation drive unit 500 is provided on the rotation drive unit 500 side (right side of FIG. 1) of the first heat sink 10 and the second heat sink 20, and is shown in FIGS. 2 and 3. As described above, when the embodiment in which the positioning protrusion 29 for positioning the position of the position detection substrate 150 is provided on only one of the first heat sink 10 and the second heat sink 20, the first heat sink 10 and the second heat sink 20 are provided. The position of the position detection substrate 150 can be positioned with reference to only one of the heat sinks 20. If the position of the position detection board 150 is displaced, it may not be possible to accurately measure the rotation position of the rotation drive unit 500 such as a motor. Therefore, it is very useful to be able to accurately position the position of the position detection board 150. be.

As shown in FIG. 2, when two positioning protrusions 29 are provided and the position detection element 151 is provided on the center line between the two positioning protrusions 29, the two positioning protrusions 29 are provided. The position detection element 151 can be positioned on the center line between the two. When this aspect is adopted, the possibility that the position of the position detection element 151 is displaced due to various factors such as expansion and contraction of the positioning hole 152 provided in the position detection main body plate 154 of the position detection board 150 can be reduced. Is beneficial.

As shown in FIG. 1, when the aspect in which the first heat sink 10 and the second heat sink 20 are exposed on the side surface (third direction) is adopted, the size in the radial direction (particularly the size in the third direction) is adopted. ) Can be made smaller, which is beneficial. Further, by exposing the side surface in this way, it is also advantageous in that the heat dissipation efficiency of the heat sinks 10 and 20 and the heat radiating portions 50 and 60 can be improved.

As shown in FIG. 1, a member such as the first current module 110 is arranged in the first recess 16 of the first heat sink 10, and a member such as the second current module 120 is arranged in the second recess 26 of the second heat sink 20. When the embodiment is adopted, it is possible to prevent the size in the radial direction (the plane direction including the first direction and the third direction) orthogonal to the longitudinal direction from becoming large. In the embodiment shown in FIG. 1, the first current module 110 is arranged in the first recess 16, and the second current module 120 is arranged in the second recess 26, but the present invention is not limited to this. Alternatively, another member may be arranged in the recesses 16 and 26.

As shown in FIG. 5, the first current device 115 provided on the other side of the first current board 111 and the second current device 125 provided on one side of the second current board 121 are arranged in a nested manner. When the aspect of overlapping in the first direction from one side to the other side is adopted, it is advantageous in that the size in the radial direction can be reduced. When the first current device 115 and the second current device 125 are arranged in a nested manner in this way, heat can be easily transferred to the first heat sink 10 and the second heat sink 20, and the first heat sink 10 and the second heat sink 10 and the second heat sink 20 can be easily transferred. Although the heat dissipation effect of the heat sink 20 may be reduced, heat dissipation from the first power module 30 and the second power module 40 can be promoted by adopting the first heat dissipation unit 50 and the second heat dissipation unit 60 as shown in FIG. It is beneficial in terms of points.

When the first current substrate 111 is made of a low thermal conductive material and / or the second current substrate 121 is made of a low thermal conductive material, the second current substrate 111 is provided on the other side of the first current substrate 111. The heat generated by the second current device 125 provided on one side of the one current device 115 and / or the second current board 121 is cut off by the first current board 111 and / or the second current board 121, and the first heat sink 10 and the second current board 121 are cut off. (Ii) It is advantageous in that it can prevent transmission to the heat sink 20.

In particular, a part of the first current module 110 is provided in the first recess 16, and a part of the second current module 120 is provided in the second recess 26, so that heat is relatively easily trapped. In the case where the first current substrate 111 is made of a low thermal conductive material and / or the second current substrate 121 is made of a low thermal conductive material, it is provided on the other side of the first current substrate 111. It is possible to reduce the heat generated by the first current device 115 and / or the second current device 125 provided on one side of the second current board 121 from being transmitted to the first heat sink 10 and the second heat sink 20, and thus the second heat sink 20. It is advantageous in that the one power module 30 and the second power module 40 can be efficiently cooled.

The description of the embodiments described above and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and are described in the claims by the description of the above-described embodiments or disclosure of the drawings. The invention is not limited. Further, the description of the claims at the time of filing is only an example, and the description of the claims may be changed as appropriate based on the description of the description, drawings and the like.

10 First heat sink 11 First protrusion 16 First recess 20 Second heat sink 21 Second protrusion 26 Second recess 30 First power module 31 First module terminal 32a First heat sink side board 32b First heat sink side board 36 1st heat sink side electronic element 37 1st heat sink side electronic element 38 1st electronic element 40 2nd power module 41 2nd module terminal 42a 2nd heat sink side substrate 42b 2nd heat sink side substrate 46 2nd heat sink side electronic element 47 Second heat sink side electronic element 48 Second electronic element 50 First heat sink 51 First thick part 60 Second heat sink 61 Second thick part 110 First current module 120 Second current module 130 First control board 140 Second control board

Claims (6)

The first heat sink, the first power module arranged on one side of the first heat sink, the first heat radiating portion arranged on one side of the first power module, and the first heat radiating portion arranged on one side of the first heat radiating portion. A first assembly having a first control board that is electrically connected to the first power module.
A second heat sink, a second power module arranged on the other side of the second heat sink, a second heat radiating portion arranged on the other side of the second power module, and an arrangement on the other side of the second heat radiating portion. A second assembly having a second control board that is electrically connected to the second power module.
Equipped with
The other side of the first heat sink and one side of the second heat sink are arranged so as to face each other.
The first heat sink has a first protrusion that projects to the other side.
The second heat sink has a second protrusion that protrudes to one side.
A part of the first power module is provided in the area on one side of the first protrusion.
A power supply device characterized in that a part of the second power module is provided in a region on the other side of the second protrusion . The first heat radiating portion has a first thick portion outside the region on one side of the first protruding portion.
The power supply device according to claim 1 , wherein the second heat radiating portion has a second thick portion outside the region on the other side of the second protruding portion. The first heat sink is the first heat sink.
The second heat sink is a second heat sink.
The first power module has a first module terminal extending toward the first control board and electrically connected to the first control board.
The power supply device according to claim 1 or 2, wherein the second power module has a second module terminal extending toward the second control board and electrically connected to the second control board. The first heat sink, the first power module arranged on one side of the first heat sink, the first heat radiating portion arranged on one side of the first power module, and the first heat radiating portion arranged on one side of the first heat radiating portion. A first assembly having a first control board that is electrically connected to the first power module.
A second heat sink, a second power module arranged on the other side of the second heat sink, a second heat radiating portion arranged on the other side of the second power module, and an arrangement on the other side of the second heat radiating portion. A second assembly having a second control board that is electrically connected to the second power module.
Equipped with
The other side of the first heat sink and one side of the second heat sink are arranged so as to face each other.
The first heat sink has a first protrusion that projects to the other side.
The second heat sink has a second protrusion that protrudes to one side.
The first power module has a plurality of first electronic elements and has a plurality of first electronic elements.
The second power module has a plurality of second electronic elements and has a plurality of second electronic elements.
The total calorific value of the first electronic element positioned at the corresponding position on one side corresponding to the first protrusion is larger than the total calorific value of the first electronic element not positioned at the corresponding position on the one side. big,
The total calorific value of the second electronic element positioned at the corresponding position on the other side corresponding to the second protrusion is larger than the total calorific value of the second electronic element not positioned at the corresponding position on the other side. A power supply that is characterized by its large size. The first heat sink, the first power module arranged on one side of the first heat sink, the first heat radiating portion arranged on one side of the first power module, and the first heat radiating portion arranged on one side of the first heat radiating portion. A first assembly having a first control board that is electrically connected to the first power module.
A second heat sink, a second power module arranged on the other side of the second heat sink, a second heat radiating portion arranged on the other side of the second power module, and an arrangement on the other side of the second heat radiating portion. A second assembly having a second control board that is electrically connected to the second power module.
Equipped with
The other side of the first heat sink and one side of the second heat sink are arranged so as to face each other.
The first heat sink is the first heat sink.
The second heat sink is a second heat sink.
The first power module is provided on the first heat sink side substrate, the first heat sink side electronic element provided on the first heat sink side substrate, the first heat sink side substrate, and the first heat sink side substrate. It has an electronic element on the first heat sink side,
The second power module is provided on the second heat sink side substrate, the second heat sink side electronic element provided on the second heat sink side substrate, the second heat sink side substrate, and the second heat sink side substrate. It also has an electronic element on the second heat sink side.
The total calorific value of the electronic element on the first heat sink side is larger than the total calorific value of the electronic element on the first heat sink side.
A power supply device characterized in that the total heat generation amount by the second heat sink side electronic element is larger than the total heat generation amount by the second heat sink side electronic element. The first heat sink, the first power module arranged on one side of the first heat sink, the first heat radiating portion arranged on one side of the first power module, and the first heat radiating portion arranged on one side of the first heat radiating portion. A first assembly having a first control board that is electrically connected to the first power module.
A second heat sink, a second power module arranged on the other side of the second heat sink, a second heat radiating portion arranged on the other side of the second power module, and an arrangement on the other side of the second heat radiating portion. A second assembly having a second control board that is electrically connected to the second power module.
The first current module electrically connected to the first control board,
A second current module electrically connected to the second control board,
Equipped with
The other side of the first heat sink and one side of the second heat sink are arranged so as to face each other.
The first heat sink has a first protrusion that projects to the other side.
The second heat sink has a second protrusion that protrudes to one side.
The first heat sink has a first recess on the side opposite to the motor side of the first protrusion.
The second heat sink has a second recess on the side opposite to the motor side of the second protrusion.
At least a part of the first current module is provided in the first recess.
A power supply device characterized in that at least a part of the second current module is provided in the second recess.

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