JP6997444B2 - Platinum paste - Google Patents
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- JP6997444B2 JP6997444B2 JP2017245722A JP2017245722A JP6997444B2 JP 6997444 B2 JP6997444 B2 JP 6997444B2 JP 2017245722 A JP2017245722 A JP 2017245722A JP 2017245722 A JP2017245722 A JP 2017245722A JP 6997444 B2 JP6997444 B2 JP 6997444B2
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims description 67
- 229910052697 platinum Inorganic materials 0.000 title claims description 21
- 239000000843 powder Substances 0.000 claims description 64
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 56
- 239000000919 ceramic Substances 0.000 claims description 42
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 5
- 238000004898 kneading Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000003058 platinum compounds Chemical class 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 for example Polymers 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 description 1
- 239000012493 hydrazine sulfate Substances 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 1
- NFOHLBHARAZXFQ-UHFFFAOYSA-L platinum(2+);dihydroxide Chemical compound O[Pt]O NFOHLBHARAZXFQ-UHFFFAOYSA-L 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 1
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- Conductive Materials (AREA)
Description
本発明は、セラミックス上への導電回路、発熱体回路等の導体材料として利用することができる白金ペーストに関する。 The present invention relates to a platinum paste that can be used as a conductor material for a conductive circuit on ceramics, a heating element circuit, or the like.
セラミックス上への導電回路、発熱体回路等の形成には、通常、白金等の貴金属粉末を含有する焼付け用ペーストが使用される。 A baking paste containing a precious metal powder such as platinum is usually used for forming a conductive circuit, a heating element circuit, or the like on ceramics.
焼付け用ペーストは、一般に、白金等の貴金属粉末、セラミック粉末、樹脂、溶剤等からなり、セラミックスなどの絶縁基板や各種素子等にスクリーン印刷等の方法で塗布した後、焼成することにより導電膜または発熱体回路の形成が行なわれる。 The baking paste is generally composed of precious metal powder such as platinum, ceramic powder, resin, solvent, etc., and is applied to an insulating substrate such as ceramics or various elements by a method such as screen printing, and then fired to form a conductive film. The heating element circuit is formed.
特に、発熱体回路を形成する電子部品やセンサー部品分野では、より電気抵抗率の低い発熱体回路を形成せしめることができるペーストが望まれている。 In particular, in the field of electronic parts and sensor parts that form a heating element circuit, a paste that can form a heating element circuit having a lower electrical resistivity is desired.
特許文献１には、湿式還元法で得られる、密度が理論密度より低い白金粉末の密度をより高め、理論密度の少なくとも９２％の密度を有し且つ平均粒径が６μｍ以下である白金粉末を使用して作製された導電膜の電気抵抗が低減することが記載されている。 Patent Document 1 describes platinum powder obtained by the wet reduction method, which has a higher density of platinum powder having a density lower than the theoretical density, has a density of at least 92% of the theoretical density, and has an average particle size of 6 μm or less. It has been described that the electrical resistance of the conductive film produced using it is reduced.
低抵抗化の要請はますます強くなっており、白金粉末以外の要素により、作製された導電膜の電気抵抗率をさらに低くすることができるペーストを提供するという課題があった。 The demand for lower resistance is becoming stronger, and there is a problem of providing a paste capable of further lowering the electrical resistivity of the produced conductive film by using elements other than platinum powder.
本発明者らは、上記の目的を達成すべく鋭意検討した結果、セラミック粉末として、ジルコニアとチタニアを共に用いることでペースト膜により作製された導電膜の電気抵抗率を低くすることができることを見出し、本発明を完成するに至った。 As a result of diligent studies to achieve the above object, the present inventors have found that the electrical resistivity of a conductive film produced by a paste film can be lowered by using both zirconia and titania as a ceramic powder. , The present invention has been completed.
すなわち上記目的は、セラミック基材上に印刷される白金ペーストであって、
（１）白金粉末
（２）セラミック粉末
（３）樹脂
（４）溶剤
とから成り、
前記セラミック粉末がジルコニア粉末と、チタニア粉末と、からなり、
前記白金粉末と前記セラミック粉末とから成る固形分に対しセラミック粉末を１～３０重量％含む白金ペーストによって達成される。
また、上記白金ペーストにおいて、セラミック粉末中におけるジルコニア粉末の割合は５～９５重量％であり、チタニア粉末の割合は５～９５重量％である。
That is, the above object is a platinum paste printed on a ceramic substrate.
It consists of (1) platinum powder (2) ceramic powder (3) resin (4) solvent.
The ceramic powder is composed of zirconia powder and titania powder.
It is achieved by a platinum paste containing 1 to 30% by weight of the ceramic powder with respect to the solid content of the platinum powder and the ceramic powder.
Further, in the platinum paste, the ratio of the zirconia powder in the ceramic powder is 5 to 95% by weight, and the ratio of the titania powder is 5 to 95% by weight.
本発明に従うと、セラミック基材との接合性に優れ、かつ低抵抗の電極膜を形成できる。 According to the present invention, an electrode film having excellent bondability to a ceramic substrate and having low resistance can be formed.
以下、本発明の白金ペーストについて、さらに詳細に説明する。 Hereinafter, the platinum paste of the present invention will be described in more detail.
以下、本発明の白金ペーストについて、さらに詳細に説明する。 Hereinafter, the platinum paste of the present invention will be described in more detail.
本発明は、セラミック基材上に印刷される白金ペーストであって、白金粉末、セラミック粉末、樹脂、溶剤とから成り、セラミック粉末がジルコニア粉末と、チタニア粉末と、からなり、白金粉末と前記セラミック粉末とから成る固形分に対しセラミック粉末を１～３０重量％含む白金ペーストである。 The present invention is a platinum paste printed on a ceramic substrate, which is composed of platinum powder, ceramic powder, resin, and solvent, and the ceramic powder is composed of zirconia powder and titania powder, and the platinum powder and the ceramic. A platinum paste containing 1 to 30% by weight of ceramic powder with respect to a solid content composed of powder.
本発明のペーストにかかる白金粉末は、その形状には特に制限はないが、一般に球状であることが好ましい。粒径にも特に制限はないが、例えば、０．３～１０μｍの白金粉末を使用することができる。 The shape of the platinum powder of the paste of the present invention is not particularly limited, but it is generally preferable that the platinum powder is spherical. The particle size is not particularly limited, but for example, platinum powder having a size of 0.3 to 10 μm can be used.
このような白金粉末は、例えば、以下に述べる製法によって製造することができるが、その方法に限定されるものではない。例えば、以下に述べる湿式還元法によって製造することができる。白金化合物を、水性媒体中に溶解又縣濁させた状態で還元剤を加えて還元することにより白金粉末にすることができる。還元に使用しうる還元剤としては、例えば、ヒドラジン水和物、塩酸ヒドラジン、硫酸ヒドラジン等のヒドラジン化合物を挙げることができる。 Such platinum powder can be produced, for example, by the production method described below, but the method is not limited thereto. For example, it can be produced by the wet reduction method described below. The platinum compound can be made into platinum powder by adding a reducing agent in a state of being dissolved or turbid in an aqueous medium to reduce the platinum compound. Examples of the reducing agent that can be used for reduction include hydrazine compounds such as hydrazine hydrate, hydrazine hydrochloride, and hydrazine sulfate.
また、白金錯体及び金属錯体を水性媒体中で溶解して混合水溶液を調製し、混合水溶液に酸を添加して白金水酸化物と金属水酸化物を共晶出させることにより得られる晶出物を高温で焼成し、次いで得られる焼成物から金属酸化物を除去して、焼成後、焼成物から金属酸化物を選択的に除去することにより、白金粉末を得ることができる。金属酸化物の除去は、例えば、焼成物を酸で溶解処理することにより行なうことができる。この溶解処理に使用し得る酸としては、例えば、塩酸、硝酸、硫酸等が挙げられる。 Further, a crystallized product obtained by dissolving a platinum complex and a metal complex in an aqueous medium to prepare a mixed aqueous solution, and adding an acid to the mixed aqueous solution to co-crystallize the platinum hydroxide and the metal hydroxide. The platinum powder can be obtained by firing the metal oxide at a high temperature, then removing the metal oxide from the obtained fired product, and then selectively removing the metal oxide from the fired product after firing. The removal of the metal oxide can be performed, for example, by dissolving the fired product with an acid. Examples of the acid that can be used for this dissolution treatment include hydrochloric acid, nitric acid, sulfuric acid and the like.
セラミック粉末は、セラミックス基体への白金等の貴金属膜の密着性の付与や貴金属膜の抵抗調整材及びヒーター使用時の貴金属導電膜中の貴金属の結晶粒の粗大化を抑制するなどの目的で使用されるものであり、本発明では、ジルコニア（ＺｒＯ２）粉末、チタニア（ＴｉＯ２）粉末を使用する。ジルコニア粉末としては、純ジルコニア粉末、安定化ジルコニア粉末、部分安定化ジルコニアを使用することができる。セラミック粉末の粒径に特に制限はないが、例えば、粒径０．１～５．０μｍのセラミック粉末を使用することができる。 Ceramic powder is used for the purpose of imparting adhesion of a noble metal film such as platinum to a ceramic substrate, suppressing the coarsening of precious metal crystal grains in the noble metal conductive film when using a resistance adjusting material for the noble metal film and a heater. In the present invention, zirconia (ZrO 2 ) powder and titania (TiO 2 ) powder are used. As the zirconia powder, pure zirconia powder, stabilized zirconia powder, and partially stabilized zirconia can be used. The particle size of the ceramic powder is not particularly limited, but for example, a ceramic powder having a particle size of 0.1 to 5.0 μm can be used.
樹脂としては、例えば、エチルセルロース、アルキッド、ポリビニルブチラール、アクリル樹脂などを用いることができる。 As the resin, for example, ethyl cellulose, alkyd, polyvinyl butyral, acrylic resin and the like can be used.
溶剤としては、ターピネオール、ブチルカルビトール、ブチルカルビトールアセテート、セロソルブなどを使用することができる。 As the solvent, tarpineol, butyl carbitol, butyl carbitol acetate, cellosolve and the like can be used.
ペーストにおいて、白金粉末の粒径及び量、セラミック粉末の粒径及び量、樹脂および溶剤を含むビヒクルの組成及び量は、適宜変えることができる。白金粉末とセラミック粉末とから成る固形分に対するセラミック粉末は１～３０ｍａｓｓ％含むことが好ましい。 In the paste, the particle size and amount of the platinum powder, the particle size and amount of the ceramic powder, and the composition and amount of the vehicle containing the resin and the solvent can be appropriately changed. The ceramic powder is preferably contained in an amount of 1 to 30 mass% based on the solid content of the platinum powder and the ceramic powder.
白金ペーストが適用されるセラミック基体は、アルミナ基体、ジルコニア基体が挙げられるが、それらに限定されない。 Examples of the ceramic substrate to which the platinum paste is applied include, but are not limited to, an alumina substrate and a zirconia substrate.
白金ペーストにジルコニア粉末とチタニア粉末を共に使用すると作製された導電膜の電気抵抗率が顕著に低下する理由は以下と考えられる。すなわち、ジルコニア粉末とチタニア粉末を共に使用することにより、ジルコニアの拡散活性化エネルギーが低下し、ジルコニアがセラミック基板とペースト焼成膜界面（以下界面とする）付近に拡散移動する現象が顕著に発現する。ジルコニアが界面に移動することより、導電性を有する白金の接触割合が増加することで抵抗値が低減する。さらに，界面のジルコニア比率が高くなることで、基板と焼成膜の密着力が向上する効果もある。 The reason why the electrical resistivity of the produced conductive film is remarkably lowered when the zirconia powder and the titania powder are used together in the platinum paste is considered to be as follows. That is, by using both zirconia powder and titania powder, the diffusion activation energy of zirconia is reduced, and the phenomenon that zirconia diffuses and moves to the vicinity of the interface between the ceramic substrate and the paste firing film (hereinafter referred to as the interface) is remarkably exhibited. .. As the zirconia moves to the interface, the contact ratio of the conductive platinum increases, and the resistance value decreases. Further, by increasing the zirconia ratio at the interface, there is also an effect of improving the adhesion between the substrate and the fired film.
セラミック粉末中におけるジルコニア粉末の割合は５～９５重量％とすることができる。セラミック粉末中におけるジルコニア粉末の割合は１０～９０重量％であることが好ましい。セラミック粉末中におけるジルコニア粉末の割合は２０～８０重量％であることがより好ましい。セラミック粉末中におけるジルコニア粉末の割合は３０～７０重量％であることがさらに好ましい。 The proportion of zirconia powder in the ceramic powder can be 5 to 95% by weight. The proportion of the zirconia powder in the ceramic powder is preferably 10 to 90% by weight. The ratio of the zirconia powder in the ceramic powder is more preferably 20 to 80% by weight. The proportion of the zirconia powder in the ceramic powder is more preferably 30 to 70% by weight.
以下、本発明を実施例によりさらに具体的に説明する。 Hereinafter, the present invention will be described in more detail with reference to Examples.
（実施例１～５）
実施例１は、セラミック粉末中に占めるジルコニアとチタニアの比率を表１に示す比率にしてペーストを製作した実施例である。
(Examples 1 to 5)
Example 1 is an example in which a paste is produced by setting the ratio of zirconia and titania in the ceramic powder to the ratio shown in Table 1.
白金粉末、アルミナ粉末、及びエチルセルロース（樹脂）とターピネオール（溶剤）等とからなる有機ビヒクルを、白金粉末、ジルコニア粉末、チタニア粉末及び有機ビヒクルを表１に示す成分組成となるように計量し、一次混練した後、３本ロールミルにて仕上げ混練を行い、白金ペースト２０ｇを得た。 An organic vehicle composed of platinum powder, alumina powder, ethyl cellulose (resin), tarpineol (solvent), etc. is weighed so that the platinum powder, zirconia powder, titania powder, and organic vehicle have the composition shown in Table 1, and the primary composition is obtained. After kneading, finish kneading was performed with a 3-roll mill to obtain 20 g of platinum paste.
（比較例１）
比較例１は、セラミック粉末の比率を、ジルコニア１００％としてペーストを製作した例である。
(Comparative Example 1)
Comparative Example 1 is an example in which a paste is produced by setting the ratio of the ceramic powder to 100% zirconia.
白金粉末、ジルコニア粉末、及びエチルセルロース（樹脂）とターピネオール（溶剤）等とからなる有機ビヒクルを、白金粉末７６．６６ｍａｓｓ％、ジルコニア粉末１０．９４ｍａｓｓ％及び有機ビヒクル１２．４ｍａｓｓ％の成分組成となるように計量し、一次混練した後、３本ロールミルにて仕上げ混練を行い、白金ペースト２０ｇを得た。 An organic vehicle composed of platinum powder, zirconia powder, ethyl cellulose (resin), tarpineol (solvent), etc. has a composition of 76.66 mass% of platinum powder, 10.94 mass% of zirconia powder, and 12.4 mass% of organic vehicle. After primary kneading, finish kneading was performed with a 3-roll mill to obtain 20 g of platinum paste.
（参考例１）
参考例１は、セラミック粉末の比率を、チタニア１００％としてペーストを製作した例である。
(Reference example 1)
Reference Example 1 is an example in which a paste is produced by setting the ratio of the ceramic powder to 100% titania.
該白金粉末、ジルコニア粉末、及びエチルセルロース（樹脂）とターピネオール（溶剤）等とからなる有機ビヒクルを、白金粉末７９．５２ｍａｓｓ％、チタニア粉末８．０８ｍａｓｓ％及び有機ビヒクル１２．４ｍａｓｓ％の成分組成となるように計量し、一次混練した後、３本ロールミルにて仕上げ混練を行い、白金ペースト２０ｇを得た。 The organic vehicle composed of the platinum powder, zirconia powder, ethyl cellulose (resin), tarpineol (solvent) and the like has a component composition of 79.52 mass% of platinum powder, 8.08 mass% of titania powder and 12.4 mass% of organic vehicle. After the primary kneading, finish kneading was performed with a 3-roll mill to obtain 20 g of platinum paste.
実施例、参考例及び比較例で得られたペーストをアルミナ基体にスクリーン印刷した後、８０℃で３０分間乾燥後、１５００℃で１０分間保持焼成して導電膜を形成した。得られた導電膜について、マルチテスター及び表面粗さ計を用いて電気抵抗率を求めた。その結果を表１に示す。また、セラミック粉末中のチタニアの比率と電気抵抗率との関係を図１に示す。 The pastes obtained in Examples, Reference Examples and Comparative Examples were screen-printed on an alumina substrate, dried at 80 ° C. for 30 minutes, and then held and fired at 1500 ° C. for 10 minutes to form a conductive film. The electrical resistivity of the obtained conductive film was determined using a multitester and a surface roughness meter. The results are shown in Table 1. Further, FIG. 1 shows the relationship between the ratio of titania in the ceramic powder and the electrical resistivity.
実施例３で得られたペーストをジルコニア基体にスクリーン印刷した後、８０℃で３０分間乾燥後、１５００℃で１０分間保持焼成して導電膜を形成した。得られた導電膜について、マルチテスター及び表面粗さ計を用いて比抵抗値を求めた。その結果は１２．６（μΩ・ｃｍ）であった。 The paste obtained in Example 3 was screen-printed on a zirconia substrate, dried at 80 ° C. for 30 minutes, and then held and fired at 1500 ° C. for 10 minutes to form a conductive film. The specific resistance value of the obtained conductive film was determined using a multi-tester and a surface roughness meter. The result was 12.6 (μΩ · cm).
Claims (1)
（１）白金粉末
（２）セラミック粉末
（３）樹脂
（４）溶剤
とから成り、
前記セラミック粉末がジルコニア粉末と、チタニア粉末と、からなり、
前記セラミック粉末中におけるジルコニア粉末の割合は５～９５重量％であり、チタニア粉末の割合は５～９５重量％であり、
前記白金粉末と前記セラミック粉末とから成る固形分に対しセラミック粉末を１～３０重量％含み、
前記固形分全体に対する前記セラミック粉末の比率（mass％）が、10.1％～12.3％である、白金ペースト。 A platinum paste that is used to form a low electrical resistance electrode film with an electrical resistivity (μΩ · cm) of 14.5 to 19.5 and is printed on a ceramic substrate.
It consists of (1) platinum powder (2) ceramic powder (3) resin (4) solvent.
The ceramic powder is composed of zirconia powder and titania powder.
The proportion of the zirconia powder in the ceramic powder is 5 to 95% by weight, and the proportion of the titania powder is 5 to 95% by weight.
The ceramic powder is contained in an amount of 1 to 30% by weight based on the solid content of the platinum powder and the ceramic powder.
A platinum paste in which the ratio (mass%) of the ceramic powder to the total solid content is 10.1% to 12.3% .
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| JP2004259500A (en) | 2003-02-25 | 2004-09-16 | Daiken Kagaku Kogyo Kk | Electrode paste, intermediate solution for electrode paste, and manufacturing method of ceramic electronic component |
| JP2005150120A (en) | 2003-11-19 | 2005-06-09 | E I Du Pont De Nemours & Co | Thick film conductor paste composition for ltcc tape |
| JP2014086243A (en) | 2012-10-23 | 2014-05-12 | Agc Seimi Chemical Co Ltd | Paste for forming an electroconductive film, electroconductive film, method for manufacturing an electroconductive film, and article |
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| JP2004259500A (en) | 2003-02-25 | 2004-09-16 | Daiken Kagaku Kogyo Kk | Electrode paste, intermediate solution for electrode paste, and manufacturing method of ceramic electronic component |
| JP2005150120A (en) | 2003-11-19 | 2005-06-09 | E I Du Pont De Nemours & Co | Thick film conductor paste composition for ltcc tape |
| JP2014086243A (en) | 2012-10-23 | 2014-05-12 | Agc Seimi Chemical Co Ltd | Paste for forming an electroconductive film, electroconductive film, method for manufacturing an electroconductive film, and article |
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