JP6986447B2 - 可撓性有機−無機ラミネートの製造方法 - Google Patents
可撓性有機−無機ラミネートの製造方法 Download PDFInfo
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- JP6986447B2 JP6986447B2 JP2017550183A JP2017550183A JP6986447B2 JP 6986447 B2 JP6986447 B2 JP 6986447B2 JP 2017550183 A JP2017550183 A JP 2017550183A JP 2017550183 A JP2017550183 A JP 2017550183A JP 6986447 B2 JP6986447 B2 JP 6986447B2
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- 0 *Nc1cc(O)cc(N)c1 Chemical compound *Nc1cc(O)cc(N)c1 0.000 description 3
- BCYHVEFFDBDGOB-UHFFFAOYSA-N CNc1c(CN)ccc(O)c1 Chemical compound CNc1c(CN)ccc(O)c1 BCYHVEFFDBDGOB-UHFFFAOYSA-N 0.000 description 1
- OYVWFICRWXXAFX-UHFFFAOYSA-N CNc1cc(CO)ccc1N Chemical compound CNc1cc(CO)ccc1N OYVWFICRWXXAFX-UHFFFAOYSA-N 0.000 description 1
- OVOZYARDXPHRDL-UHFFFAOYSA-N Nc(c(N)c1)ccc1O Chemical compound Nc(c(N)c1)ccc1O OVOZYARDXPHRDL-UHFFFAOYSA-N 0.000 description 1
- HMVJXTUUQJUYJI-UHFFFAOYSA-N Nc(ccc(CO)c1)c1N Chemical compound Nc(ccc(CO)c1)c1N HMVJXTUUQJUYJI-UHFFFAOYSA-N 0.000 description 1
- OHLQBRYVKXJYHZ-UHFFFAOYSA-N Nc1cc(N)cc(CO)c1 Chemical compound Nc1cc(N)cc(CO)c1 OHLQBRYVKXJYHZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45529—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/30—Organic light-emitting transistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Physical Vapour Deposition (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
Description
(a)原子層堆積プロセスを3〜150サイクル行うことにより無機層を堆積する工程、及び
(b)分子層堆積プロセスを1〜3サイクル行うことにより窒素を含む有機層を堆積する工程、
を含む一連の工程を少なくとも2回行うことを特徴とするラミネートの製造方法により達成された。
(a)0.3〜15nmの厚さを有する無機層、及び
(b)0.1〜3nmの厚さを有する窒素含有の有機層、
を含むラミネートに関する。
PET基板を用いて、バリアフィルムを製造した。PET基板は、2.5x2.5cm2のサイズ、100μmの厚さ及び1.4g/cm3の密度を有していた。脱イオン水、アセトン及びエタノールですすぐことによってPET基板を洗浄し、次に100Wのプラズマ電源を用いて、O2プラズマで30分処理した。その後、真空チャンバー中で、圧力が5・10−5ミリバールに至るまで、PET基板を30分脱ガスした。PET基板を含む真空チャンバーを80℃まで加熱した。ガス状態のトリメチルアルミニウム(TMA)を、液体形態のTMAを含有する側部チャンバーにバルブを開くことによって真空チャンバーに2秒導入し、その後に真空チャンバーを再び5・10−5ミリバールに至るまで15秒排気した。
実施例1と同様にバリアフィルムを製造し、ここで、[[TMA−H2O]13−TMA−4AP]の一連の工程を180回行った。同様の有機−無機ラミネートをシリコンウェーハ上に作製した。このウェーハを破砕し、走査型電子顕微鏡に付した。こうして得た画像を図2に示す。この画像から、有機−無機ラミネートの厚さが295nmであると推定した。
実施例1と同様にバリアフィルムを製造し、ここで、[[TMA−H2O]25−TMA−4AP]の一連の工程を100回行った。同様の有機−無機ラミネートをシリコンウェーハ上に作製した。このウェーハを破砕し、走査型電子顕微鏡に付した。こうして得た画像を図3に示す。この画像から、有機−無機ラミネートの厚さが310nmであると推定した。
実施例1に記載の条件下で、代わりに、PET基板をTMA及びH2Oに500回曝すことにより、バリアフィルムを製造した。
実施例1に記載の条件下で、代わりに、PET基板をTMA及びH2Oに250回曝すことにより、バリアフィルムを製造した。
実施例1と同様にバリアフィルムを製造し、ここで、4APの代わりに、120℃に維持する4−アミノベンジルアルコール(4ABA)を使用する。
実施例2と同様にバリアフィルムを製造し、ここで、4APの代わりに、120℃に維持する4ABAを使用する。
実施例3と同様にバリアフィルムを製造し、ここで、4APの代わりに、120℃に維持する4−アミノベンジルアルコール(4ABA)を使用した。同様の有機−無機ラミネートをシリコンウェーハ上に作製した。このウェーハを破砕し、走査型電子顕微鏡に付した。こうして得た画像を図4に示す。この画像から、有機−無機ラミネートの厚さが307nmであると推定した。
1.3・10−7ミリバールで、350nmの厚さ及び10x10μm2のサイズを有するCaドット144個を蒸発させることにより、PET基板上に作製したバリアフィルムの水蒸気透過速度(WVTR)をテストした。Caドットの上に、それぞれの実施例に記載したように、もう1つのラミネートを製造した。その後、該フィルムを、70%の相対湿度を有する乾燥棚中に70℃で480時間放置した。上述したような貯蔵処理の後に透明になったCaドットの数により、WVTRを計算した。
Claims (6)
- (a)原子層堆積プロセスを3〜150サイクル行うことにより無機層を堆積させる工程、及び
(b)分子層堆積プロセスを1〜3サイクル行うことにより窒素を含む有機層を堆積させる工程、
を含む一連の工程を少なくとも2回行うことを特徴とする、ラミネートの製造方法。 - 前記分子層堆積プロセスに第1級アミンを使用して、前記有機層を堆積させる、請求項1に記載の方法。
- 前記分子層堆積プロセスに芳香族アミンを使用して、前記有機層を堆積させる、請求項1又は2に記載の方法。
- 前記分子層堆積プロセスに、ヒドロキシル基を含有する芳香族アミンを使用して、前記有機層を堆積する、請求項1から3のいずれか一項に記載の方法。
- 前記原子層堆積プロセスにAl含有化合物を使用して、前記無機層を堆積させる、請求項1から4のいずれか一項に記載の方法。
- (a)及び(b)を含む一連の工程を少なくとも30回行う、請求項1から5のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15160789 | 2015-03-25 | ||
EP15160789.2 | 2015-03-25 | ||
PCT/EP2016/055534 WO2016150759A1 (en) | 2015-03-25 | 2016-03-15 | Process for producing flexible organic-inorganic laminates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018513271A JP2018513271A (ja) | 2018-05-24 |
JP6986447B2 true JP6986447B2 (ja) | 2021-12-22 |
Family
ID=52779530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017550183A Active JP6986447B2 (ja) | 2015-03-25 | 2016-03-15 | 可撓性有機−無機ラミネートの製造方法 |
Country Status (12)
Country | Link |
---|---|
US (1) | US11286561B2 (ja) |
EP (1) | EP3274487A1 (ja) |
JP (1) | JP6986447B2 (ja) |
KR (1) | KR102596710B1 (ja) |
CN (1) | CN107429390A (ja) |
BR (1) | BR112017020245A2 (ja) |
CA (1) | CA2978031A1 (ja) |
MX (1) | MX2017012134A (ja) |
RU (1) | RU2721247C2 (ja) |
SG (1) | SG11201707265QA (ja) |
TW (1) | TWI782892B (ja) |
WO (1) | WO2016150759A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2736197C2 (ru) | 2015-01-20 | 2020-11-12 | БАСФ Коатингс ГмбХ | Способ изготовления гибких органических-неорганических слоистых материалов |
KR20210029186A (ko) * | 2018-07-05 | 2021-03-15 | 바스프 코팅스 게엠베하 | 투명 전도성 필름 |
WO2023018308A1 (ko) * | 2021-08-12 | 2023-02-16 | 한양대학교 산학협력단 | 분자선 구조를 갖는 다층 분자막 포토레지스트 및 이의 제조방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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ES2113366T3 (es) * | 1990-10-03 | 1998-05-01 | Dow Chemical Co | Polieteraminas con funciones hidroxilo como capas de barrera para materiales sensibles al oxigeno. |
US6690044B1 (en) * | 1993-03-19 | 2004-02-10 | Micron Technology, Inc. | Approach to avoid buckling BPSG by using an intermediate barrier layer |
DE4438359C2 (de) * | 1994-10-27 | 2001-10-04 | Schott Glas | Behälter aus Kunststoff mit einer Sperrbeschichtung |
US6926572B2 (en) * | 2002-01-25 | 2005-08-09 | Electronics And Telecommunications Research Institute | Flat panel display device and method of forming passivation film in the flat panel display device |
JP2007090803A (ja) * | 2005-09-30 | 2007-04-12 | Fujifilm Corp | ガスバリアフィルム、並びに、これを用いた画像表示素子および有機エレクトロルミネッセンス素子 |
WO2008069894A2 (en) | 2006-11-13 | 2008-06-12 | The Regents Of The University Of Colorado, A Body Corporate | Molecular layer deposition process for making organic or organic-inorganic polymers |
JP5220106B2 (ja) * | 2007-06-22 | 2013-06-26 | ザ・リージエンツ・オブ・ザ・ユニバーシティ・オブ・コロラド | 原子層堆積法及び分子層堆積法を用いて製造された有機電子デバイス用の保護被膜 |
US20090169904A1 (en) * | 2007-12-27 | 2009-07-02 | Makoto Yamada | Barrier laminate, gas-barrier film, device and optical component |
JP2009224190A (ja) * | 2008-03-17 | 2009-10-01 | Fujifilm Corp | バリア性積層体とその製造方法、デバイスおよび光学部材 |
EP2300225A1 (en) * | 2008-07-08 | 2011-03-30 | DSM IP Assets B.V. | A laminate and composite layer comprising a substrate and a coating, and a process and apparatus for preparation thereof |
EP2360293A1 (en) | 2010-02-11 | 2011-08-24 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
CN103826822A (zh) * | 2011-09-26 | 2014-05-28 | 日本轻金属株式会社 | 铝树脂接合体及其制造方法 |
AU2012329403B2 (en) * | 2011-10-24 | 2015-08-20 | Agency For Science, Technology And Research | Encapsulation barrier stack |
KR20140045716A (ko) * | 2012-10-09 | 2014-04-17 | 건국대학교 산학협력단 | 유무기 합금 필름의 제조방법 및 그로부터 제조된 유무기 합금 필름 |
WO2015030297A1 (ko) * | 2013-08-30 | 2015-03-05 | 한양대학교 산학협력단 | 유무기 혼성 박막 및 이의 제조 방법 |
SG11201609703QA (en) | 2014-06-12 | 2016-12-29 | Basf Coatings Gmbh | Process for producing flexible organic-inorganic laminates |
SG11201609653SA (en) | 2014-06-13 | 2016-12-29 | Basf Coatings Gmbh | Process for producing organic-inorganic laminates |
RU2736197C2 (ru) | 2015-01-20 | 2020-11-12 | БАСФ Коатингс ГмбХ | Способ изготовления гибких органических-неорганических слоистых материалов |
-
2016
- 2016-03-15 CN CN201680017247.1A patent/CN107429390A/zh active Pending
- 2016-03-15 EP EP16713752.0A patent/EP3274487A1/en active Pending
- 2016-03-15 RU RU2017135503A patent/RU2721247C2/ru active
- 2016-03-15 BR BR112017020245-0A patent/BR112017020245A2/pt not_active Application Discontinuation
- 2016-03-15 MX MX2017012134A patent/MX2017012134A/es unknown
- 2016-03-15 JP JP2017550183A patent/JP6986447B2/ja active Active
- 2016-03-15 WO PCT/EP2016/055534 patent/WO2016150759A1/en active Application Filing
- 2016-03-15 KR KR1020177026460A patent/KR102596710B1/ko active IP Right Grant
- 2016-03-15 US US15/559,497 patent/US11286561B2/en active Active
- 2016-03-15 SG SG11201707265QA patent/SG11201707265QA/en unknown
- 2016-03-15 CA CA2978031A patent/CA2978031A1/en not_active Abandoned
- 2016-03-23 TW TW105108951A patent/TWI782892B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2018513271A (ja) | 2018-05-24 |
WO2016150759A1 (en) | 2016-09-29 |
CA2978031A1 (en) | 2016-09-29 |
US20180119279A1 (en) | 2018-05-03 |
RU2721247C2 (ru) | 2020-05-18 |
EP3274487A1 (en) | 2018-01-31 |
KR20170130415A (ko) | 2017-11-28 |
TW201700789A (zh) | 2017-01-01 |
BR112017020245A2 (pt) | 2018-06-05 |
MX2017012134A (es) | 2018-02-09 |
CN107429390A (zh) | 2017-12-01 |
KR102596710B1 (ko) | 2023-11-01 |
RU2017135503A (ru) | 2019-04-26 |
SG11201707265QA (en) | 2017-10-30 |
RU2017135503A3 (ja) | 2019-09-05 |
US11286561B2 (en) | 2022-03-29 |
TWI782892B (zh) | 2022-11-11 |
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