JP6980740B2 - X線デバイス - Google Patents
X線デバイス Download PDFInfo
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- JP6980740B2 JP6980740B2 JP2019203282A JP2019203282A JP6980740B2 JP 6980740 B2 JP6980740 B2 JP 6980740B2 JP 2019203282 A JP2019203282 A JP 2019203282A JP 2019203282 A JP2019203282 A JP 2019203282A JP 6980740 B2 JP6980740 B2 JP 6980740B2
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- electron
- ray
- generating device
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- 238000010438 heat treatment Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 239000002086 nanomaterial Substances 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000002103 nanocoating Substances 0.000 claims description 7
- 238000002591 computed tomography Methods 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000002019 doping agent Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000004846 x-ray emission Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 14
- 230000008901 benefit Effects 0.000 description 12
- 238000000576 coating method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 239000002041 carbon nanotube Substances 0.000 description 8
- 229910021393 carbon nanotube Inorganic materials 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000000701 chemical imaging Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
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- 238000000605 extraction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000009607 mammography Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
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- -1 nanotetrapods Substances 0.000 description 1
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- 239000002070 nanowire Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 235000011649 selenium Nutrition 0.000 description 1
- 125000003748 selenium group Chemical group *[Se]* 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
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- X-Ray Techniques (AREA)
- Solid Thermionic Cathode (AREA)
- Cold Cathode And The Manufacture (AREA)
Description
14 電子受け取り素子
20 窓
21 加熱素子
22 電子エミッタ
23 導電性基体
24 ナノ構造
25 電子ビーム
26 エックス線ビーム
28 電源
Claims (15)
- ナノ構造のコーティングを有する導電性基体を備える複数の電子エミッタと、
前記複数の電子エミッタの各導電性基体に取り付けられている加熱素子と、
前記複数の電子エミッタから放出された電子を受け取るように構成されている電子受け取り素子と、
前記複数の電子エミッタと、前記加熱素子と、前記電子受け取り素子とを収容するように構成されている真空筐体と、を備え、
前記複数の電子エミッタが、前記加熱素子がオン状態であり且つ前記複数の電子エミッタに負のバイアスがかけられる際のショットキー放出用に構成されていて、
前記複数の電子エミッタの各々と前記電子受け取り素子との間の電圧差がX線ビームのエネルギーを決定し、
前記複数の電子エミッタが、前記電子受け取り素子上の一つの集束スポットに向けて電子を放出するように配置され、逐次的にバイアスがかけられて経時的に一定の電流での時間一様性を有する電子放出を与える、X線発生デバイス。 - 前記複数の電子エミッタが、前記加熱素子がオフ状態であり且つ前記複数の電子エミッタに負のバイアスがかけられる際の電界放出用に更に構成されている、請求項1に記載のX線発生デバイス。
- 前記加熱素子の動作状態を制御するように構成されている電源を更に備える請求項1に記載のX線発生デバイス。
- 前記電源が、(−,0:陰極を負,陽極を接地)、(−,+:陰極を負,陽極を正)、及び、(0,+:陰極を接地、陽極を正)の三つのバイアスモードで前記複数の電子エミッタの各々と前記電子受け取り素子との間の電位差を与えるように更に構成されている、請求項3に記載のX線発生デバイス。
- 前記電源が、DCモード、パルスモード、又はACモードで動作するように構成されている、請求項3に記載のX線発生デバイス。
- 前記導電性基体が、ステンレス鋼、ニッケル、ニッケル系合金、鉄、又は鉄系合金製である、請求項1に記載のX線発生デバイス。
- 前記ナノ構造が、元素周期表のIA、IIA、IB、IIIA、VIA、又はVIIA族のドーパント元素でドーピング又は共添加されている、請求項1に記載のX線発生デバイス。
- 前記ナノ構造がZnO製である、請求項1に記載のX線発生デバイス。
- 前記電子受け取り素子が、金属、金属合金、金属化合物、又は金属セラミック複合材製である、請求項1に記載のX線発生デバイス。
- 前記複数の電子エミッタが、スペーサを介して100μmから1000μmまでの間の固定距離に位置するグリッドを更に備える、請求項1に記載のX線発生デバイス。
- 請求項1に記載のX線発生デバイスを備えるセキュリティX線走査装置。
- 請求項1に記載のX線発生デバイスを備えるコンピュータトモグラフィ走査装置。
- 請求項1に記載のX線発生デバイスを備えるCアーム型走査装置。
- 請求項1に記載のX線発生デバイスを備える地質調査装置。
- 請求項1に記載のX線発生デバイスを提供することを備えるX線蛍光分光法。
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JP2019203282A JP6980740B2 (ja) | 2015-02-10 | 2019-11-08 | X線デバイス |
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JP2016568131A JP2017510051A (ja) | 2014-02-10 | 2015-02-10 | X線デバイス |
JP2019203282A JP6980740B2 (ja) | 2015-02-10 | 2019-11-08 | X線デバイス |
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JP2016568131A Division JP2017510051A (ja) | 2014-02-10 | 2015-02-10 | X線デバイス |
Publications (2)
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JP2020024945A JP2020024945A (ja) | 2020-02-13 |
JP6980740B2 true JP6980740B2 (ja) | 2021-12-15 |
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JP2019203282A Active JP6980740B2 (ja) | 2015-02-10 | 2019-11-08 | X線デバイス |
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JP (1) | JP6980740B2 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7085351B2 (en) * | 2000-10-06 | 2006-08-01 | University Of North Carolina At Chapel Hill | Method and apparatus for controlling electron beam current |
US20040240616A1 (en) * | 2003-05-30 | 2004-12-02 | Applied Nanotechnologies, Inc. | Devices and methods for producing multiple X-ray beams from multiple locations |
JP3810656B2 (ja) * | 2001-07-23 | 2006-08-16 | 株式会社神戸製鋼所 | 微小x線源 |
US7447298B2 (en) * | 2003-04-01 | 2008-11-04 | Cabot Microelectronics Corporation | Decontamination and sterilization system using large area x-ray source |
US7428298B2 (en) * | 2005-03-31 | 2008-09-23 | Moxtek, Inc. | Magnetic head for X-ray source |
CN102422364B (zh) * | 2009-05-12 | 2015-08-05 | 皇家飞利浦电子股份有限公司 | 具有多个电子发射器的x射线源 |
US8576988B2 (en) * | 2009-09-15 | 2013-11-05 | Koninklijke Philips N.V. | Distributed X-ray source and X-ray imaging system comprising the same |
JP5641916B2 (ja) * | 2010-02-23 | 2014-12-17 | キヤノン株式会社 | 放射線発生装置および放射線撮像システム |
CN103959422A (zh) * | 2011-11-28 | 2014-07-30 | 皇家飞利浦有限公司 | 具有可加热场致发射电子发射器的x射线管和操作其的方法 |
CN103903941B (zh) * | 2012-12-31 | 2018-07-06 | 同方威视技术股份有限公司 | 阴控多阴极分布式x射线装置及具有该装置的ct设备 |
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