JP6979964B2 - 光学的計測における精度改良 - Google Patents

光学的計測における精度改良 Download PDF

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JP6979964B2
JP6979964B2 JP2018544505A JP2018544505A JP6979964B2 JP 6979964 B2 JP6979964 B2 JP 6979964B2 JP 2018544505 A JP2018544505 A JP 2018544505A JP 2018544505 A JP2018544505 A JP 2018544505A JP 6979964 B2 JP6979964 B2 JP 6979964B2
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measurement
measurements
pupil
settings
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JP2019512166A5 (zh
JP2019512166A (ja
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バラク ブリンゴルツ
エフゲニー グレヴィッチ
イド アダム
ヨエル フェレル
ドロール アルモト
ユヴァール ラムホト
ノガ セラ
ヤロン デリュー
タル ヤジブ
エルザフォン アシュバル
リラク サルトン
トム レヴィアント
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KLA Corp
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KLA Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/10—Goniometers for measuring angles between surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C11/00—Photogrammetry or videogrammetry, e.g. stereogrammetry; Photographic surveying
    • G01C11/04—Interpretation of pictures
    • G01C11/06—Interpretation of pictures by comparison of two or more pictures of the same area
    • G01C11/12—Interpretation of pictures by comparison of two or more pictures of the same area the pictures being supported in the same relative position as when they were taken
    • G01C11/26—Interpretation of pictures by comparison of two or more pictures of the same area the pictures being supported in the same relative position as when they were taken using computers to control the position of the pictures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
    • G06F16/28—Databases characterised by their database models, e.g. relational or object models
    • G06F16/284—Relational databases
    • G06F16/285—Clustering or classification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Databases & Information Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2018544505A 2016-02-24 2017-02-23 光学的計測における精度改良 Active JP6979964B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021186155A JP7319342B2 (ja) 2016-02-24 2021-11-16 装置、方法及びプログラム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662299535P 2016-02-24 2016-02-24
US62/299,535 2016-02-24
PCT/US2017/019077 WO2017147261A1 (en) 2016-02-24 2017-02-23 Accuracy improvements in optical metrology

Related Child Applications (1)

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JP2021186155A Division JP7319342B2 (ja) 2016-02-24 2021-11-16 装置、方法及びプログラム

Publications (3)

Publication Number Publication Date
JP2019512166A JP2019512166A (ja) 2019-05-09
JP2019512166A5 JP2019512166A5 (zh) 2020-04-02
JP6979964B2 true JP6979964B2 (ja) 2021-12-15

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JP2021186155A Active JP7319342B2 (ja) 2016-02-24 2021-11-16 装置、方法及びプログラム

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US (2) US20180047646A1 (zh)
EP (1) EP3420581B1 (zh)
JP (2) JP6979964B2 (zh)
KR (1) KR20180110169A (zh)
CN (2) CN116936393A (zh)
IL (1) IL287799B2 (zh)
TW (3) TW202303095A (zh)
WO (1) WO2017147261A1 (zh)

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EP3575874A1 (en) * 2018-05-29 2019-12-04 ASML Netherlands B.V. Metrology method, apparatus and computer program
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Also Published As

Publication number Publication date
TWI731038B (zh) 2021-06-21
TWI780741B (zh) 2022-10-11
TW202134601A (zh) 2021-09-16
CN108701625A (zh) 2018-10-23
TW201740483A (zh) 2017-11-16
EP3420581B1 (en) 2021-12-08
CN108701625B (zh) 2023-07-14
JP2019512166A (ja) 2019-05-09
TW202303095A (zh) 2023-01-16
CN116936393A (zh) 2023-10-24
US20180047646A1 (en) 2018-02-15
IL287799A (en) 2022-01-01
JP7319342B2 (ja) 2023-08-01
JP2022019770A (ja) 2022-01-27
EP3420581A4 (en) 2020-01-15
WO2017147261A1 (en) 2017-08-31
IL287799B (en) 2022-10-01
US20210175132A1 (en) 2021-06-10
US11862522B2 (en) 2024-01-02
IL287799B2 (en) 2023-02-01
KR20180110169A (ko) 2018-10-08
EP3420581A1 (en) 2019-01-02

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