JP6963373B2 - Heat dissipation device - Google Patents

Description

The present invention relates to a heat radiating device.

Conventionally, an electronic device in which a light source is composed of a plurality of light emitting diodes (hereinafter referred to as LED light sources) has been disclosed (see, for example, Patent Document 1). In such electronic devices, thermal imbalances may occur in each LED light source. Then, when a thermal imbalance occurs in each LED light source, there is a possibility that the light flux and the life of each LED light source are partially different.

In conventional electronic devices, for example, a heat sink may be used as a heat radiating component in order to prevent thermal imbalance. The heat sink is a resin molded product molded by a mold having substantially the same shape, and a plurality of heat sinks having substantially the same shape are used in conventional electronic devices.

JP 2016-162632

Here, in a conventional electronic device, for example, when a heat sink having the same shape is used for both a high temperature portion and a low temperature portion, excessive heat is dissipated by the heat sink installed in the low temperature portion. It will be. That is, over-design causes an increase in manufacturing cost.

An object of the present invention is to provide a heat radiating device capable of reducing manufacturing costs while suppressing the occurrence of thermal imbalance in heat generating parts.

In order to solve the above object, the present invention has the following configuration.
That is, the present invention includes a plurality of substrates, heat-generating components mounted on the respective surfaces of the plurality of substrates, and heat-dissipating members provided on the back surface side of the substrates to dissipate heat generated by the heat-generating components. A heat conductive plate provided between the plurality of substrates and the heat radiating member for conducting heat generated by the heat generating component, and the heat conductive plate includes a plurality of divided plates and the heat conductive plate. The heat insulating portion is provided between a plurality of divided plates and between the plurality of substrates, and includes a heat insulating portion for blocking heat generated by the heat generating component from being conducted to the other heat generating component. The heat radiating device is characterized by having a hinge for connecting a plurality of divided plates to each other and air for blocking heat conduction between the plurality of divided plates.

According to the present invention as described above, by providing the heat insulating portion at an appropriate position between a plurality of substrates, even if the number of heat generating parts or the mounting position thereof is changed, a heat radiating member corresponding to the heat radiating member is manufactured. It is no longer necessary, and it is possible to reduce the manufacturing cost while suppressing the occurrence of thermal imbalance in the heat generating parts.

Further, in the heat radiating device of the present invention, a plurality of substrates, heat generating components mounted on the respective surfaces of the plurality of substrates, and heat generating components provided on the back surface side of the substrates are provided to dissipate heat generated by the heat generating components. The heat-dissipating member and a heat-conducting plate provided between the plurality of substrates and the heat-dissipating member for conducting heat generated by the heat-generating component are provided, and the heat-conducting plate includes the plurality of heat-dissipating members. A heat insulating portion is provided between the substrates to block the heat generated by the heat-generating component from being conducted to other heat-generating components, and the heat-conducting plate guides the heat generated by the heat-generating component to the heat-dissipating member. The first layer is provided on the heat generating component side of the first layer, and a second layer is provided to guide the heat generated by the heat generating component in the plane direction thereof, and the heat insulating portion is the first layer. It is provided in the first layer and the second layer. According to this, the heat generated by one of the heat generating parts is blocked from being conducted to the other heat generating parts by the heat insulating portion, and the heat in the vicinity of the heat insulating portion is transferred to the surface direction by the second layer. Is conducted to. As a result, a flow path for guiding heat to the heat radiating member is established, so that heat is radiated efficiently.

According to the heat radiating device of the present invention, it is possible to reduce the manufacturing cost while suppressing the occurrence of thermal imbalance in the heat generating parts.

It is a top view which shows the heat dissipation device which concerns on one Embodiment of this invention. It is an exploded perspective view of the heat dissipation device shown in FIG. It is a figure which shows the heat radiating apparatus shown in FIG. 1, (A) is a front view, (B) is a bottom view, (C) is a side view. It is a conceptual diagram of the heat dissipation device along the line I-I in FIG. It is a conceptual diagram which shows the modification of the heat dissipation device shown in FIG.

Hereinafter, the lighting device (radiating device) according to the embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a plan view showing a lighting device 1 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the lighting device 1 shown in FIG.

As shown in FIG. 1, the lighting device 1 of the present embodiment is installed diagonally downward so as to illuminate the road below on both sides of the ceiling inside the tunnel as a tunnel light installed in the tunnel. .. As shown in FIGS. 1 and 2, the lighting device 1 has a housing 2 having an outer shape of the lighting device 1 and formed in a flat box shape, and a substantially rectangular LED substrate 3 (shown in FIG. 2). A plurality of LED components 4 (heating components) (shown in FIG. 2) mounted on the LED substrate 3, a lens unit 5 for controlling the light distribution of the light emitted by the LED components 4, and a heat conductive plate 6 (shown in FIG. 2). (Shown in FIG. 2) and a glass globe 7 (shown in FIG. 2). The lighting device 1 is formed in a substantially rectangular parallelepiped shape having a flat overall shape.

Here, in the installed state, as shown in FIG. 2, the lighting device 1 has the front surface side on which the LED component 4 is mounted is "front", the back surface side of the LED component 4 is "rear", and the long side direction of the LED substrate 3 is. It is provided so that the "left-right direction" and the short side direction of the LED substrate 3 are the "vertical direction".

As shown in FIGS. 2 and 3, the housing 2 has a box-shaped housing body 21 for accommodating a power supply device D (shown in FIG. 2) and the like, and on both left and right sides of the housing body 21. A pair of flat plate portions 22 and 22 provided, an opening edge portion 23 standing on the front side of the housing body 21 and the pair of flat plate portions 22 and 22 to which the glass globe 7 is attached, and a pair of flat plate portions 22. , 22 is integrally provided with a pair of heat radiating fins 24, 24 (heat radiating members) provided on the rear side. The housing body 21, the pair of flat plate portions 22, 22, the opening edge portion 23, and the pair of heat radiation fins 24, 24 are integrally molded by aluminum die casting.

Various electronic components such as the power supply device D and a substrate (not shown) on which these are mounted are fixed to the housing main body 21.

The pair of flat plate portions 22, 22 are provided in a substantially rectangular shape, respectively, and the opening edge 21A of the housing body 21 (FIG. 2) so that the long side extends in the vertical direction and the short side extends in the horizontal direction. (Shown in)).

The pair of heat radiation fins 24, 24 are formed in substantially the same shape and are provided on both the left and right sides of the housing body 21. Each heat radiation fin 24 is composed of a plurality of fins 24A. The plurality of fins 24A are vertically formed in a plate shape from the back surface of each flat plate portion 22, and are provided side by side at equal intervals in the left-right direction. Each fin 24A is formed in a substantially rectangular plate shape, and the long side is formed so as to have a dimension substantially equal to the vertical dimension of each flat plate portion 22. The pair of heat radiation fins 24, 24 are arranged symmetrically with respect to the left and right intermediate portions in the opening edge portion 23 of the housing 2.

The LED substrate 3 is composed of a plurality of (7 in the illustrated example) LED divided substrate 3A (board). Further, the LED substrate 3 is configured by arranging seven LED divided substrates 3A on a plane and connecting them by a connecting member (not shown). These seven LED split substrates 3A are connected by a connecting member and are provided side by side so as to be housed in the opening edge portion 23 of the housing 2 when viewed from the front. Further, a plurality of (30 in the illustrated example) LED components 4 are mounted on each LED divided substrate 3A so as to be arranged in a matrix. Each LED component 4 is composed of, for example, an LED chip composed of only a light emitting element provided on a lead wire. In the following, each LED divided board 3A and the 30 LED components 4 mounted on the LED divided board 3A are collectively referred to as "LED module 30".

The lens unit 5 is a plurality of (7 in the illustrated example) support plates 51, and each support plate 51 is located in front of the LED component 4 to control the light distribution of the light emitted by the LED component 4 (FIG. 5). In the illustrated example, it is configured to have (30) lenses 52 and. The support plate 51 and the 30 lenses 52 are made of a translucent material such as an acrylic resin or a polycarbonate resin, and are integrally formed. Each support plate 51 is formed to have substantially the same shape as the LED division substrate 3A. The seven support plates 51 are connected by a connecting member (not shown). These seven support plates 51 are connected by a connecting member and are provided side by side so as to be housed in the opening edge portion 23 of the housing 2.

The heat conductive plate 6 is a member for conducting the heat generated by the LED component 4 to each heat radiating fin 24, and as shown in FIG. 4, the first heat conductive plate 6 is used to guide the heat generated by the LED component 4 in the plate thickness direction. A heat insulating portion for blocking the heat generated by the layer 61, the second layer 62 for guiding the heat generated by the LED component 4 in the plane direction thereof, and the heat generated by one LED component 4 to the other LED component 4. 8 and. The heat conductive plate 6 is formed in a rectangular shape substantially the same as the opening edge 23 of the housing 2. Further, in the present embodiment, as shown in FIG. 4, the heat conductive plate 6 includes the LED component 4, the LED divided substrate 3A (LED substrate 3), the reflective layer (not shown), the second layer 62, and the second layer 62 from the front, as shown in FIG. The first layer 61, the flat plate portion 22, and the heat radiating fins 24 are provided in this order. FIG. 4 is a conceptual diagram of the lighting device 1 shown in FIG. 1, in which the housing body 21, the aperture edge 23, the lens unit 5, and the glass globe 7 are omitted. Further, the reference numerals "30A, 30B, 30C" shown in FIG. 4 are LED modules, and the reference numerals "4" shown in FIG. 4 are a group of 30 LED parts constituting the LED modules 30A, 30B, 30C. be.

The first layer 61 is made of aluminum or the like.

The second layer 62 is made of graphite or the like. A reflective layer (not shown) is formed on the surface (front surface) of the second layer 62 to reflect the light emitted by the LED component 4 toward the front.

Such a heat conductive plate 6 is configured to include a pair of divided plates 6A and 6A and a heat insulating portion 8 located between the two divided plates 6A and 6A. As shown in FIG. 2, the pair of dividing plates 6A, 6A are provided with three LED modules 30 (hereinafter, referred to as 30A, 30B, 30C in order from the left). Of these LED modules 30A, 30B and 30C, the LED modules 30A and 30B are provided so as to be located on one dividing plate 6A and the LED module 30C to be located on the other dividing plate 6A.

The formation position and configuration of the heat insulating portion 8 will be described with reference to FIGS. 2 and 4. The heat insulating portion 8 of the present embodiment is provided so as to extend vertically in the intermediate portion in the left-right direction of the heat conductive plate 6. That is, each divided plate 6A is obtained by forming a slit 8A notched from the upper end to the lower end in the middle portion in the left-right direction of the heat conductive plate 6, and is formed into substantially the same shape. ing.

Further, as the heat insulating portion 8, in the present embodiment, a pair of air 8A (the air located in the slit 8A is designated by the symbol "8A") and a stainless steel member for blocking heat conduction between the divided plates 6A and 6A. Hinge 8B is used. The air 8A referred to here is air existing between the pair of dividing plates 6A, and has a role of blocking heat conduction from one dividing plate 6A to the other dividing plate 6A among the pair of dividing plates 6A and 6A. Is responsible for. The pair of hinges 8B also play a role of supporting the divided plates 6A and 6A, and are provided apart from each other in the vertical direction.

The glass glove 7 is made of, for example, colorless and transparent tempered glass having excellent transparency. The glass globe 7 is formed so as to have a shape substantially equal to that of the opening edge portion 23 of the housing 2, and is attached to the opening edge portion 23 so as to seal the housing 2 via a packing (not shown) or the like. There is.

Next, the action and effect of this embodiment will be described.

When a pair of heat radiation fins 24, 24 having substantially the same shape are arranged symmetrically in the opening edge portion 23 of the housing 2, the LED component 4 is arranged so as to be asymmetrical. In that case, a thermal imbalance may occur in each LED component 4. That is, the amount of heat radiated by one heat radiating fin 24 and the amount of heat radiated by the other heat radiating fin 24 are difficult to be equal because the LED components 4 are arranged so as to be asymmetrical. Therefore, a thermal imbalance may occur in each LED component 4.

In order to suppress the occurrence of such a thermal imbalance, a heat insulating portion 8 is provided at an appropriate position on the heat conductive plate 6. According to this, the heat generated by the LED component group 4 (heating component) constituting one LED module 30 is conducted by the heat insulating portion 8 to the LED component group 4 (heating component) constituting the other LED module 30. The heat in the vicinity of the heat insulating portion 8 is guided to the heat radiating fins 24 by the first layer 61, and is conducted in the plane direction by the second layer 62. As a result, a flow path for guiding the heat generated by the LED component group 4 to the heat radiating fin 24 (heat radiating member) is established, so that the heat is efficiently radiated.

Further, by providing the heat insulating portion 8 at an appropriate position between the LED divided substrates 3A on the heat conductive plate 6, even if the number of LED parts 4 (heating parts) or the mounting position thereof is changed, heat is dissipated accordingly. It is no longer necessary to manufacture the fins 24 (heat radiating member), and it is possible to reduce the manufacturing cost while suppressing the occurrence of thermal imbalance in the LED component 4 (heating component).

It should be noted that the examples described above merely show typical embodiments of the present invention, and the present invention is not limited to these examples. That is, it can be modified in various ways without departing from the gist of the present invention. Even with such deformation, as long as the configuration of the heat radiating device of the present invention is still provided, it is, of course, included in the category of the present invention.

In the present embodiment, the air 8A and the hinge 8B are used as the heat insulating portion 8, but the present invention is not limited thereto. The heat insulating portion 8 may be made of any material as long as it is made of a material having a thermal conductivity lower than that of the heat conductive plate 6. Further , the heat insulating portion 8 may be made of one material or may be made of a plurality of materials.

Further, in the present embodiment, only one heat insulating portion 8 is provided, but the present invention is not limited to this. The heat insulating portions 8 may be provided at a plurality of locations on the heat conductive plate 6. Further, in the present embodiment, the heat insulating portion 8 is provided from the upper end to the lower end in the middle portion in the left-right direction so as to form a pair of divided plates 6A, 6A. It is not limited. It does not have to be located in the middle part in the left-right direction. Further, the slit may be cut to an intermediate position between the upper end and the lower end, and may not be provided from the upper end to the lower end. Further, the heat insulating portion does not have to have a slit shape, and may have a circular shape, an elliptical shape, or a polygonal shape. That is, the heat insulating portion 8 may be formed in any position and in any shape as long as it is possible to suppress the occurrence of thermal imbalance in the LED component 4 (heat generating component).

Further, in the present embodiment, the heat conductive plate 6 is configured to include the first layer 61, the second layer 62, and the reflective layer, but the present invention is not limited thereto. As shown in the lighting device 10 (heat radiating device) of FIG. 5, the heat conductive plate 16 may be composed of only the first layer 161 for guiding the heat generated by the LED component 4 to the heat radiating fins 24. In FIG. 5, members having substantially the same function or substantially the same configuration as those of the above-described embodiment are designated by the same reference numerals, and the description thereof is omitted. Alternatively, the heat conductive plate may be composed of only the second layer 62, and may be made of any material as long as it conducts the heat generated by the LED component 4 (heating component), and any layer. It may be configured to have.

Further, in the present embodiment, an example in which 30 LED components 4 are mounted on the LED division substrate 3A has been described, but the present invention is not limited to this. At least one LED component 4 may be mounted on the LED division substrate 3A.

Further, in the present embodiment, the LED component 4 is used as the heat generating component, but the present invention is not limited to this. For example, an organic EL may be used as the heat generating component, and any electronic component may be used, not just an LED component or an organic EL, as long as it is an electronic component mounted on a substrate and generating a joint temperature. good. In that case, an appropriate substrate may be used according to the electronic components used.

Each of the above-described embodiments merely shows a preferred embodiment of the present invention, and the present invention is not limited to these embodiments. That is, those skilled in the art can carry out various modifications according to conventionally known knowledge within a range that does not deviate from the gist of the present invention. As long as the heat dissipation device of the present invention is still provided by such modification, it is, of course, included in the category of the present invention.

1, 10 Lighting device (heat dissipation device)
3A LED split board (board)
4 LED parts (heat generating parts)
6, 16 Heat conduction plate 8 Insulation part 24 Heat dissipation fins (heat dissipation member)
61, 161 1st layer 62 2nd layer

Claims (2)

With multiple boards
Heat-generating components mounted on each surface of each of the plurality of substrates,
A heat radiating member provided on the back surface side of the substrate for radiating heat generated by the heat generating component, and a heat radiating member.
A heat conductive plate provided between the plurality of substrates and the heat radiating member for conducting heat generated by the heat generating component is provided.
The heat conductive plate is provided between the plurality of divided plates and between the plurality of divided plates and between the plurality of substrates for blocking heat generated by the heat generating component from being conducted to other heat generating components . With a heat insulating part,
The heat insulating portion is configured to have a hinge for connecting the plurality of divided plates to each other and air for blocking heat conduction between the plurality of divided plates. Device. With multiple boards
Heat-generating components mounted on each surface of each of the plurality of substrates,
A heat radiating member provided on the back surface side of the substrate for radiating heat generated by the heat generating component, and a heat radiating member.
A heat conductive plate provided between the plurality of substrates and the heat radiating member for conducting heat generated by the heat generating component is provided.
The heat conductive plate is provided with a heat insulating portion for blocking heat generated by the heat generating component from being conducted to other heat generating components between the plurality of substrates.
The heat conductive plate is provided with a first layer for guiding the heat generated by the heat generating component to the heat radiating member and on the heat generating component side of the first layer, and the heat generated by the heat generating component is transferred in the plane direction thereof. With a second layer to lead to
The heat radiating device is characterized in that the heat insulating portion is provided in the first layer and the second layer.

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